Optoelectronic component

Abstract

An assembly of electronic components that provides means for receiving data using an optical fiber, where the assembly comprises: a photodiode; an amplifier coupled to the amplifier of the photodiode; a printed circuit board on a first side of which the photodiode and the amplifier are physically mounted; and a reinforcement attached to the printed circuit board, in which the reinforcement is attached in a region substantially concentric with a region on the printed circuit board where the photodiode and the amplifier are mounted, and a conductive bonding wire, a conductive trace configured to directly couple the amplifier and the photodiode to a second opposite side of the printed circuit board relative to the amplifier and the photodiode; and a fiber alignment ferrule and lens cap assembly, where the fiber alignment ferrule and lens cap assembly includes: a ferrule configured to provide a receptacle with defined physical alignment for the fiber; a lens configured to concentrate light from the optical fiber onto the photodiode; a cover region configured to provide a hermetic seal to the amplifier and photodiode wherein the fiber alignment ferrule and lens cap assembly are configured to physically attach to the printed circuit board to provide a hermetic seal to the photodiode and amplifier and to further align lenses within the fiber alignment ferrule and lens cap assembly, in this way, light from the optical fiber is concentrated onto the photodiode.

Description

Technical Field

[0001] The present application relates to an opto-electronic assembly and a receive optical sub-assembly configuration having a fiber alignment ferrule and a lens cap attachment for a chip-on-flex assembly. Background Art

[0002] High-speed optical communication links contain many optical, electronic and optoelectronic components and assemblies, where electrical signals are converted into optical signals for transmission over optical fibers; and where optical signals transmitted through optical fibers are converted into electrical signals and subjected to amplification and further processing. A common requirement for the components and assemblies used in such links is to minimize cost while maximizing performance.

[0003] The present invention relates to the following part of an optical communication system, in which an optical signal is received and converted into an electrical signal, and is subjected to amplification and possibly other signal processing functions before being transmitted to other components of the complete signal chain. In some cases, the receiving function in one subassembly can be combined with the transmitting function contained in another subassembly into a larger component. The features of the present invention to be described are applicable to components intended for use in the receiving path of an optical communication system or for a combination of both the receiving path and the transmitting path, and where the description relates to the receiving function, it should be understood that these features can also be used in the combined component.

[0004] Such receiving path components are often referred to as receiving photon subassemblies (Receive Optical Sub-Assembly) or ROSA, and may include a photodiode and an associated amplifier, typically a transimpedance amplifier, which may have an associated internal limiting amplifier. The associated amplifier is typically mounted near the photodiode in order to maximize the bandwidth of the entire system. Traditionally, the photodiode and amplifier are mounted in a metal can, where external electrical connections are provided by wire leads that pass through an insulating region of the can base, and where the leads further provide posts within the can to which the wires can be bonded. These wires can also be bonded to pads on the amplifier integrated circuit, and can also be bonded to pads on the photodiode. In these ways, power, monitoring, control, and signal paths are established. The wire leads from the can are then connected to a flexible printed circuit board (PCB), and this flexible board is further connected to the BCPI-240237 Page 2 / 11

[0005] Connect to the main electrical functions of the receiver module.

[0006] This metal can represents a significant portion of the total cost of a ROSA. In addition, there are inherent obstacles to achieving the highest possible operating bandwidth, as the high data rate output signal from the amplifier must pass through bond wires, header posts, lead wires, and then conductive traces in the flexible PCB before being delivered to the next electronic function in the signal chain.

[0007] It is possible to reduce manufacturing and assembly costs while improving high frequency performance by mounting the electronics in the ROSA directly on the flexible PCB, thereby reducing the overall length of the signal path for the received signal.

[0008] However, in the actual implementation of such an assembly, it is necessary to provide a cover for the electronic components and the photodiode, wherein the cover also provides an optical aperture, which includes a lens for focusing light from the optical fiber onto the photodiode. In addition, it is necessary to provide mechanical support for the electronic and optoelectronic components on the flexible PCB. Without such support, failures may occur at the connection or bonding of the components to the PCB. It is also necessary to provide a device for aligning the lens with the sensitive area of ​​the photodiode and fixing it in place during operational deployment. Any device for attaching the cover and lens assembly to the PCB to meet these requirements should preferably meet the further requirements of low cost and reliability, and be implemented by an assembly method that is compatible with traditional PCB manufacturing processes. Summary of the invention

[0009] It is an object of the present invention to provide a construction and arrangement of a receiving function for a high-speed optical communication system, wherein the manufacturing costs are reduced compared to the background art. It is a further object of the present invention to provide a construction and arrangement of a receiving function for a high-speed optical communication system, wherein improved performance can be achieved compared to the background art.

[0010] An advantage of the present invention is that by mounting the main electronic components directly on the flexible PCB, the requirement for a fully enclosed cover for mounting the photodiode and associated amplifier is avoided.

[0011] A further advantage of the present invention is that the flexible PCB is mechanically supported beneath the area where the photodiode and amplifier and related components are mounted therein by low cost stiffeners which provide local mechanical rigidity to reduce the risk of PCB deformation which could cause misalignment or breakage, thereby reducing the mechanical requirements on any cover and lens assembly.

[0012] Yet another advantage of the present invention is that the apparatus for housing photodiodes, amplifiers and other electronic components also provides mounting for lenses and further provides a receptacle for optical fibers, thereby eliminating the need for a separate fiber alignment ferrule assembly.

[0013] According to a first aspect of the present invention, there is provided an assembly of electronic components providing an apparatus for receiving data using an optical fiber, wherein an auxiliary assembly comprises: a photodiode; an amplifier coupled to the photodiode; a printed circuit board, the photodiode and the amplifier being physically mounted on a first side of the printed circuit board; and a stiffener attached to the printed circuit board, wherein the stiffener is attached to an area that is substantially concentric with an area on the printed circuit board where the photodiode and the amplifier are mounted, and an electrically conductive bonding wire configured to directly couple the amplifier and the photodiode to a second side of the printed circuit board relative to the amplifier and the photodiode. conductive traces on opposite sides; and a fiber optic alignment ferrule and lens cap assembly, wherein the fiber optic alignment ferrule and lens cap assembly includes: a ferrule configured to provide a receptacle with a defined physical alignment for an optical fiber; a lens configured to focus light from the optical fiber onto the photodiode; and a cover region configured to provide an airtight seal to the amplifier and the photodiode, wherein the fiber optic alignment ferrule and lens cap assembly is configured to be physically attached to the printed circuit board to provide an airtight seal to the photodiode and amplifier and to further align the lens within the fiber optic alignment ferrule and lens cap assembly to focus light from the optical fiber onto the photodiode.

[0014] The stiffener may be attached to a second side of the printed circuit board opposite the photodiode and amplifier.

[0015] The assembly may further include auxiliary electronic components mounted on the printed circuit board and covered by the fiber alignment ferrule and lens cap assembly.

[0016] The area of ​​the first side of the printed circuit board may have a first area that substantially matches the contour of the contact area of ​​the base of the fiber alignment ring and lens cap assembly, and the first area of ​​the printed circuit board has a layer of adhesive applied thereto, wherein the adhesive allows adjustment of the attached components until a curing process is performed.

[0017] The areas on which the adhesive is applied are arranged concentrically around the location of the photodiode.

[0018] The fiber alignment ferrule and lens cap assembly may be attached to the first region of the first side of the printed circuit board by the adhesive.

[0019] A hole may be formed through the first area of ​​the printed circuit board, the hole having a diameter sufficient to allow the adhesive to flow through the hole when the adhesive is applied to the first area.

[0020] The first area of ​​the printed circuit board may have the adhesive layer applied thereto, wherein the adhesive has sufficient fluidity to flow through the holes in the first area, and wherein the adhesive allows for adjustment of the attached components until a curing process is performed.

[0021] The fiber alignment ferrule and lens cap assembly and the strength member may be attached to the printed circuit board by the adhesive applied to the first region and wherein the adhesive has flowed through the aperture in the first region.

[0022] The final position of the fiber alignment ferrule and lens cap assembly can be adjusted to provide satisfactory optical signal coupling to the photodiode; and after the adjustment is completed, the adhesive is subjected to a curing process to fix the position of the fiber alignment ferrule and lens cap assembly.

[0023] A vent may be provided to allow for release of air pressure differentials between the interior of the fiber alignment ferrule and lens cap assembly and the external atmosphere.

[0024] According to a second aspect of the present invention, there is provided a method of assembling electronic components to provide a device for receiving data using optical fiber, the method comprising: providing a printed circuit board, wherein the printed circuit board is configured to have conductive traces in a defined area; physically mounting a photodiode and an amplifier on a first side of the printed circuit board; providing a stiffener, wherein the stiffener is attached to an area that is substantially concentric with an area on the printed circuit board where the photodiode and the amplifier are mounted; providing a hole through the board on the flexible printed circuit board, the hole being configured to provide an electrical connection between opposite sides of the printed circuit board; providing a fiber optic alignment device; A ferrule and lens cap assembly, wherein the fiber alignment ferrule and lens cap assembly includes: a ferrule configured to provide a receptacle with a defined physical alignment for the optical fiber; a lens configured to focus light from the optical fiber onto the photodiode; a cover region configured to provide an airtight seal to the amplifier and the photodiode; physically attaching the fiber alignment ferrule and lens cap assembly to the printed circuit board to provide an airtight seal to the photodiode and amplifier; aligning the position of the fiber alignment ferrule and lens cap assembly so that the lens within the fiber alignment ferrule and lens cap assembly can focus light from the optical fiber onto the photodiode.

[0025] The stiffener may be attached to a second side of the printed circuit board opposite the photodiode and amplifier.

[0026] The fiber alignment ferrule and lens cap assembly may be configured to cover the photodiode and the amplifier on the printed circuit board.

[0027] The printed circuit board may be a flexible printed circuit board.

[0028] The fiber alignment ferrule and lens cap assembly may be attached to the printed circuit board using an adhesive, wherein the adhesive is configured to allow adjustment of the position of the fiber alignment ferrule and lens cap assembly prior to curing of the adhesive.

[0029] At least one of the holes may be disposed within an area of ​​the printed circuit board covered by the fiber alignment ferrule and lens cap assembly.

[0030] A connection between the conductive trace on the printed circuit board and the photodiode may be established via the at least one hole provided in the region of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will now be described by way of example only and with reference to the accompanying drawings, in which:

[0032] Figure 1 A fiber optic communication system according to the background art is shown.

[0033] Figure 2 A view showing a ROSA mounted on a flexible PCB for a fiber optic communication receiver according to the background art.

[0034] Figure 3 Another view showing a ROSA and related optical fiber connections for use in a fiber optic communication receiver module according to the background art.

[0035] Figure 4 An assembly of components for a portion of a fiber optic receiver configured in accordance with an embodiment of the present invention is shown.

[0036] Figure 5 Another assembly of components for a portion of a fiber optic receiver configured in accordance with an embodiment of the present invention is shown.

[0037] Figure 6 Provided according to an embodiment of the present invention Figure 5 Another view of the example arrangement shown in FIG.

[0038] Figure 7 A process for an assembly method of components according to some aspects of the present invention is shown.

[0039] Note that this description is not made in a limiting sense but is made merely for the purpose of describing the general principles of embodiments of the invention. DETAILED DESCRIPTION

[0040] Figure 1 A basic system-level configuration of a general optical communication physical link according to the background art is shown, in which an electrical data signal 100 containing information is converted into an optical signal in a transmit optical sub-assembly (TOSA) 101, wherein the TOSA may include a driver electronic device 102 and typically includes a laser diode 103 or other electro-optical conversion device. The driver electronics provides the laser diode (or alternative device) with the appropriate current waveform required to produce the desired optical signal, which represents the electrical data signal. Some restrictions may be imposed in order to comply with further requirements of agreed performance standards and specifications. The driver electronics can be a combination of components, or have almost all necessary functions integrated in a single integrated circuit (IC). The TOSA will also have an additional connection 104 to provide power, and may also have control and monitoring inputs and outputs.

[0041] After traveling along the optical fiber 105, the optical signal is converted back into an electrical signal representing the data in a receive photonic subassembly (ROSA) 106. The ROSA may include a photodiode 107 for performing the basic conversion of the optical signal to an electrical signal, wherein the photodiode is coupled to an amplifier 108, typically but not exclusively coupled to a transimpedance amplifier (TIA), in order to deliver a useful large raw data signal 110, which can be transmitted to electronic components and systems for further processing. The amplifier 108 is typically mounted very close to the photodiode 107 to minimize stray capacitance and inductance effects that may adversely affect the speed of operation. The ROSA will also have additional connections 109 to provide power, and may also have control and monitoring inputs and outputs. The output 110 of the amplifier is typically passed to a limiting amplifier, where the amplitude of the signal is increased and compensated for variations in the strength of the optical signal, in order to make it suitable for further processing, typically by digital circuits.

[0042] Figure 2A schematic representation of a ROSA 106 mounted on a flexible printed circuit board (PCB) 201 according to the background art is shown, wherein in this view represented in the figure, the aperture of the optical fiber 205 used to provide the optical input to the ROSA is facing away. In order to allow the ROSA to be aligned with the incident optical fiber 105, so as to effectively couple the optical signal to the sensitive face of the photodiode 107, the ROSA is usually mounted on a flexible printed circuit board (PCB), wherein the wire leads from the ROSA are soldered into holes 202 in the PCB 201. The PCB 201 typically carries no components other than the ROSA, and is usually only used to couple the signal 110 and power connection 109 from the ROSA to the main electronic system, and an array of edge connectors 203 are typically provided at one end of the PCB 201. The ROSA itself typically has a covering tube structure (sometimes described as a ferrule) 204 attached thereto, which forms part of the means for connecting and aligning the optical fiber 105 with the photodiode 107 contained in the ROSA.

[0043] Figure 3 A cross-sectional view of a typical ROSA 106 construction according to the background art is shown, along with the associated components for connecting and aligning an optical fiber 105 with a photodiode 107 contained in the ROSA. The ROSA itself is typically housed in a metal can 301, similar to those used to house discrete transistors, commonly referred to as a "TO" can. Typically, the can is about 5 mm in diameter and about 3 mm in height, excluding electrical leads. The base 302 of the can 301 can be an insulating material or have an insulating area, allowing conductive leads 303 to pass through to the internal cavity of the can. The photodiode 107 and (transimpedance) amplifier 108 are mounted within the can (in this figure, these components are one behind the other and are therefore not shown separately) and are electrically connected to the leads 303 via bonding wires 304. The bonding wires are typically gold wires of about one or two millimeters in length. There is typically an opening at the top of the can into which is mounted a lens 305, which is used to focus light from the optical fiber onto the photodiode. Note that in Figure 3 In the figure, spaces are shown between the fiber alignment ferrule 204 and the ROSA can 301 and between the fiber alignment ferrule and the incoming optical fiber 105, but these spaces are only for more clear illustration of the various components. In actual implementations, it is obvious to those skilled in the art that in order to ensure proper alignment of the optical fiber with the optical aperture and lens 305 of the ROSA, the fiber alignment ferrule 204 will be made to fit tightly on the ROSA can 301 and similarly fit tightly on the optical fiber 105.

[0044] It will be apparent to those skilled in the art that there is considerable cost associated with the construction of the ROSA in terms of the parts for the can, lens mounting and fiber alignment ferrule, as well as the effort involved in assembling the entire ROSA onto the flexible PCB. Another problem is that the signal path from the (transimpedance) amplifier 108 to the edge connector 203 of the flexible PCB includes passing through several media, including the bonding wires 304, the ROSA leads 303, and thence through the conductive traces of the PCB. At each change in the signal path medium, the characteristic impedance experienced by the signal will inevitably undergo some change, with a significant variety of different reflection and attenuation characteristics. At the operating data rates expected for such optical communications, typically up to tens of Gbits / s, such effects can have a significant adverse effect on signal transmission.

[0045] Figure 4 An exemplary arrangement of an alternative form of ROSA according to some embodiments of the present invention is shown, which attempts to improve some of the disadvantages of the previously described background art. The photodiode 107 and amplifier 108 and any associated components are mounted directly on the flexible PCB 201. This arrangement no longer requires the ROSA can base 302 and metal leads 303 (such as Figure 2 and Figure 3 As shown), the photodiode 107 and the (transimpedance) amplifier 108 have been mounted directly on the flexible PCB 201.

[0046] exist Figure 3 In the illustrated background art, the ROSA 106 is attached to the flexible PCB 201 via ROSA leads 303, which also provide power and signal paths. Figure 4In the new arrangement shown, these leads do not exist, and the electrical connection from the amplifier 108 and other components in the ROSA to the conductive traces 403 of the flexible PCB is more direct. A hole 402 is cut in the insulating layer (typically a polyimide material) of the PCB 201, so that a properly positioned area for the conductive traces (typically copper) on the back side of the PCB is now available. With a sufficiently large hole, the bonding wire 304 can now be connected directly from the amplifier 108 or other components within the ROSA to the corresponding conductive traces 403. In this way, the characteristic impedance discontinuity and parasitic impedance present in the signal path will be further reduced, allowing improved high frequency performance to be achieved. The hole 402 in the PCB 201 obviously needs to have a large enough diameter to allow the bonding wires from the amplifier and other components to be placed and fixed on the conductive traces 403 on the back side of the PCB. In practice, the diameter of the hole does not need to be excessively large, and it is possible in practice to place enough of the hole within the diameter of a conventional ROSA and still have ample space on the PCB surface within any ROSA assembly to properly position the photodiode 107 and to place the amplifier 108 and any necessary ancillary components. In order for the conductive trace 403 to remain securely fixed to the back of the PCB during and after the wire bonding process, it is convenient to make the diameter of the end of the trace larger than the diameter of the hole 402 cut for bonding the wire 304, so that this area of ​​the conductive trace has support around the entire perimeter of the hole 402. The layout of the trace from the hole to the edge of the flexible PCB can then be arranged in a way to ensure that the characteristic impedance remains as close as possible to the ideal desired value.

[0047] Figure 4 Also shown is a combined fiber alignment ferrule and lens cap component 401 that combines the functionality of the cover can 301 and the fiber alignment ferrule 204 and completely replaces those components, thereby significantly reducing material costs. The fiber alignment ferrule and lens cap 401 are configured so that the lens 305 is held in the opening between the position provided for the end of the optical fiber 105 and the photodiode 107 mounted on the PCB 201. The fiber alignment ferrule and lens cap 401 is mounted directly on the flexible PCB using an adhesive layer 407 to provide a cover for the photodiode 107 and the amplifier 108.

[0048] In some embodiments, a stiffening element 405 may be conveniently secured to the side of the PCB 201 opposite the side on which the photodiode 107 and amplifier 108 are to be mounted, the stiffening element having sufficient mechanical rigidity to ensure that no significant deformation of the PCB is likely to occur during any assembly and testing process or during the life of the PCB that could result in mechanically induced failures in the ROSA. The stiffening element may be made of stainless steel, fiberglass, or any other convenient material, and may be attached to the PCB using an adhesive layer 406 or other suitable means. In other embodiments, the attachment of the fiber alignment ferrule and lens cap 401 may provide sufficient rigidity to the flexible PCB in the area where the photodiode and amplifier and any associated components are mounted so that the PCB is rigid and secure.

[0049] The risk of machinery-related failure is negligible.

[0050] Those skilled in the art will appreciate that some alignment of the positions of the fiber alignment ferrule and lens cap 401 may be necessary to ensure that the optical signal from the optical fiber 105 is optimally coupled to the photodiode 107. This alignment process can be conveniently performed when the fiber alignment ferrule and lens cap 401 are already placed on the PCB and the required adhesive is placed between the fiber alignment ferrule and lens cap and the PCB, but has not yet been cured.

[0051] The ROSA assembly can be mounted in a test fixture with a temporary connection from the edge connector 203 of the PCB 201 to a suitable analytical device, and then an optical signal is applied via an optical fiber inserted into a receptacle in the fiber alignment and lens cap 401. The position of the fiber alignment ferrule and lens cap 401 can then be adjusted to achieve the best electrical output from the ROSA to the analytical device, and the adhesive 407 placed to secure the fiber alignment ferrule and lens cap to the PCB 201 can then be cured or partially cured, for example using ultraviolet light.

[0052] It may be convenient to carry out this alignment process in an inert gas atmosphere so that the photodiode, amplifier and any other electronic components are sealed in said atmosphere when the adhesive cures to form a seal. Alternatively, it may be convenient to carry out the alignment process in normal ambient air and further cure or partially cure the adhesive that secures the fiber alignment ferrule and lens cap to the PCB. Following this alignment process, the cavity within the fiber alignment ferrule and lens cap may be evacuated and may be filled with an inert gas, and the vent holes provided may then be sealed using a suitable adhesive or sealant material. If desired, the bonded area may then be further cured.

[0053] Figure 5 Another exemplary arrangement for an alternative form of ROSA according to some embodiments of the present invention is shown, wherein further time and cost savings may be achieved in the assembly process. An additional hole 501 is formed in an area of ​​the PCB 201 that follows the contour of the base of the fiber alignment ferrule and lens cap 401 that is intended to be attached to the PCB 201, the hole being configured to pass through any area of ​​the conductive trace 403 that may be located on the side of the PCB opposite the photodiode 107 and amplifier 108. When adhesive 502 is applied in the area of ​​the intended joint, the adhesive has properties that allow it to flow through the hole 501 before any curing process, and the adhesive can then be used to secure the strength member 405 to the opposite side of the PCB 201, with a bond between the fiber alignment ferrule and lens cap 401 and the PCB 201 and the strength member 405. In this way, a step in the assembly process is eliminated along with the associated costs.

[0054] Figure 6 The above-described alternative forms of ROSA according to some embodiments of the present invention are provided Figure 5 , showing the arrangement on the side of the PCB 201 with the photodiode 107 and amplifier 108 mounted without the fiber alignment ferrule and lens cap 401. The fiber alignment ferrule and lens cap 401 will be attached so that the base of the fiber alignment ferrule and lens cap is aligned with the area 602 surrounding the location of the photodiode and the amplifier. A hole 501 is provided within the boundary of the area 602 through which an adhesive can flow to provide a bond between the fiber alignment ferrule and lens cap 401 and the PCB 201 and the strength member 405.

[0055] In this exemplary arrangement, a hole 601 is also provided in the PCB 201, the hole 601 being located within the area to be enclosed by the fiber alignment ferrule and lens cap 401, the purpose of which is to provide a vent for gas that may be trapped therein after the fiber alignment ferrule and lens cap are secured by the adhesive. In the case of assembly in a normal air environment, the cavity within the fiber alignment ferrule and lens cap needs to be evacuated and / or purged. It may also be necessary to replace any gas within the cavity within the fiber alignment ferrule and lens cap with an inert gas.

[0056] When any evacuation or purge and gas replacement procedures are complete, the vent hole 601 may be sealed with an adhesive and the adhesive cured to form a permanent seal.

[0057] Figure 7An exemplary method of assembling components according to some embodiments of the present invention is shown. It is understood that many variations of the method and other different methods are possible to achieve the purpose of the present invention.

[0058] Therefore, if Figure 7 As shown, through step 701, the first operation is to manufacture a ROSA PCB with assembly alignment marks.

[0059] Then, if Figure 7 As shown, through step 702, a stiffener is attached to the ROSA PCB on the opposite side from the amplifier and the photodiode using an adhesive, and is located below the area where the photodiode, amplifier and other components are located.

[0060] Then as Figure 7 As shown, through step 703, the position of each ROSA PCB 201 is aligned in turn under the laser table.

[0061] Then as Figure 7 As shown, through step 704, the center of the ROSA PCB is marked with a laser to indicate the mounting position of the photodiode.

[0062] Then as Figure 7 As shown, through step 705, the PCB insulating material is removed by laser to form holes for through-hole wire bonding.

[0063] Then as Figure 7 As shown, through step 706, the photodiode 107, the (transimpedance) amplifier 108 and any other components are placed and fixed to the PCB at their designated positions using adhesive or other suitable means.

[0064] Next, if Figure 7 As shown, the photodiode, (transimpedance) amplifier, and any other components are electrically connected together and to the PCB traces and ground plane via wire bonding, via step 708 .

[0065] Next, if Figure 7 As shown, via step 709, an area of ​​adhesive is applied to the top side of the PCB in an annular pattern or other suitable pattern that matches the base of the fiber alignment ferrule and lens cap assembly.

[0066] Next, if Figure 7 As shown, a fiber alignment ferrule and lens cap assembly is placed on the PCB at a location close to the desired final location to cover the photodiode and amplifier and any other components, preferably in an inert atmosphere, via step 710 .

[0067] Next, if Figure 7As shown, via step 711, while maintaining an inert atmosphere, the output of the amplifier is connected to a suitable test device capable of determining when the signal from the photodiode is optimal and the optical signal is provided through the fiber alignment ferrule and lens cap assembly.

[0068] Next, if Figure 7 As shown, the fiber alignment ferrule and lens cap assembly are aligned while maintaining an inert atmosphere, via step 712, to provide an optimal output from the photodiode as indicated by a signal sensed by a test device connected to the amplifier.

[0069] Next, if Figure 7 As shown, through step 713, the adhesive layer between the optical fiber alignment ring and lens cap assembly and the PCB is cured using ultraviolet light or by other suitable means to permanently fix the optical fiber alignment sleeve and lens cap assembly to the PCB.

[0070] Finally, if Figure 7 As shown, via step 714, the cavity inside the fiber alignment ferrule and lens cap assembly is evacuated and purged with an inert gas, and the vent hole is sealed with an adhesive, and the adhesive is cured.

[0071] Although the present invention has been described with reference to specific examples and possible embodiments thereof, these should not be construed as limiting the scope of the present invention in any way. It is to be understood that many other possible embodiments, modifications and improvements may be incorporated into or combined with the present invention without departing from the scope and spirit of the present invention as set forth in the claims.

Claims

1. An assembly of electronic components providing means for receiving data using optical fiber, wherein the assembly comprises: Photodiode; an amplifier coupled to the photodiode; a flexible printed circuit board, the photodiode and amplifier being physically mounted directly on a first side of the flexible printed circuit board; as well as a stiffener attached to the flexible printed circuit board, wherein the stiffener is attached to a second side of the flexible printed circuit board opposite the photodiode and the amplifier, and wherein the stiffener is attached to an area that is substantially concentric with an area on the flexible printed circuit board where the photodiode and the amplifier are mounted, and an electrically conductive bonding wire configured to directly couple the amplifier and the photodiode to an electrically conductive trace on a second opposing side of the flexible printed circuit board relative to the amplifier and the photodiode; as well as A fiber optic alignment cover and lens cap assembly, wherein the fiber optic alignment cover and lens cap assembly comprises: a combined fiber alignment ferrule and lens cap assembly configured to provide a receptacle for an optical fiber with a defined physical alignment and further configured to provide a cover region configured to provide an airtight seal to the amplifier and the photodiode, and the combined fiber alignment ferrule and lens cap assembly further configured to retain a lens in an opening between an end of the optical fiber and the photodiode: a lens configured to focus light from the optical fiber onto the photodiode; wherein the combined fiber alignment ferrule and lens cap assembly is configured to be physically attached to the flexible printed circuit board so as to provide an airtight seal for the photodiode and amplifier and to further align the lens within the fiber alignment ferrule and lens cap assembly so as to focus light from the optical fiber onto the photodiode.

2. The assembly of claim 1, wherein said assembly further comprises auxiliary electronic components mounted on said flexible printed circuit board and covered by said combined fiber alignment ferrule and lens cap component.

3. The assembly according to claim 2, wherein: The area of ​​the first side of the flexible printed circuit board has a first area that substantially matches the contour of the contact area of ​​the base of the combined fiber alignment ring and lens cap component, and the first area of ​​the flexible printed circuit board has a layer of adhesive applied thereto, wherein the adhesive allows adjustment of the attached components until a curing process is performed.

4. The assembly of claim 3, wherein the areas to which the adhesive is applied are arranged concentrically around the location of the photodiode.

5. The assembly of claim 4, wherein the combined fiber alignment ferrule and lens cap assembly is attached to the first region of the first side of the flexible printed circuit board by the adhesive.

6. The assembly of claim 3, wherein a hole is formed through the first region of the flexible printed circuit board, the hole having a diameter sufficient to allow the adhesive to flow through the hole when the adhesive is applied to the first region.

7. The assembly of claim 6, wherein the first area of ​​the flexible printed circuit board has the adhesive layer applied thereto, wherein: The adhesive has sufficient fluidity to flow through the apertures in the first region, and wherein the adhesive allows for adjustment of the attached components until a curing process is performed.

8. The assembly of claim 7, wherein the combined fiber alignment ferrule and lens cap assembly and the strength member are attached to the flexible printed circuit board by the adhesive applied to the first region, and wherein the adhesive has flowed through the hole in the first region.

9. The assembly of claim 5, wherein the final position of the combined fiber alignment ferrule and lens cap assembly is adjusted to provide satisfactory optical signal coupling to the photodiode; and after the adjustment is completed, the adhesive is subjected to a curing process to fix the position of the combined fiber alignment ferrule and lens cap assembly.

10. The assembly of claim 1, wherein a vent is provided to allow release of air pressure differentials between the interior of the combined fiber alignment ferrule and lens cap assembly and the external atmosphere.

11. A method of assembling electronic components to provide a device for receiving data using optical fiber, the method comprising: providing a flexible printed circuit board, wherein the flexible printed circuit board is configured to have conductive traces in defined areas; physically mounting a photodiode and an amplifier directly on a first side of the flexible printed circuit board; providing a stiffener attached to the flexible printed circuit board, wherein the stiffener is attached to a second side of the flexible printed circuit board opposite the photodiode and the amplifier, and wherein the stiffener is attached to an area that is substantially concentric with an area on the flexible printed circuit board where the photodiode and the amplifier are mounted; providing a hole through the board on the flexible printed circuit board, the hole being configured as a means for providing an electrical connection between opposite sides of the flexible printed circuit board; A combined fiber alignment ferrule and lens cap assembly is provided, wherein the combined fiber alignment ferrule and lens cap assembly comprises: a combined fiber alignment ferrule and lens cap assembly configured to provide a receptacle for an optical fiber with a defined physical alignment and further configured to provide a cover region configured to provide an airtight seal to said amplifier and said photodiode, and said combined fiber alignment ferrule and lens cap assembly further configured to retain a lens in an opening between an end of said optical fiber and said photodiode; a lens configured to focus light from said optical fiber onto said photodiode; physically attaching the combined fiber alignment ferrule and lens cap assembly to the flexible printed circuit board to provide a hermetic seal for the photodiode and amplifier; The combined fiber alignment ferrule and lens cap assembly is aligned so that the lens within the combined fiber alignment ferrule and lens cap assembly can focus light from the optical fiber onto the photodiode.

12. The method of assembling an electronic component according to claim 11, wherein the combined fiber alignment ferrule and lens cap component is configured to cover the photodiode and the amplifier on the flexible printed circuit board.

13. The method for assembling an electronic component according to claim 12, wherein: The combined fiber alignment ferrule and lens cap component is attached to the flexible printed circuit board using an adhesive, wherein the adhesive is configured to allow adjustment of the position of the fiber alignment ferrule and lens cap assembly prior to curing of the adhesive.

14. The method of assembling an electronic component according to claim 11, wherein at least one hole is provided in a region of the flexible printed circuit board that is covered by the combined fiber alignment ferrule and lens cap component. 15 . The method of assembling an electronic component according to claim 14 , wherein the connection between the conductive trace on the flexible printed circuit board and the photodiode is established through the at least one hole provided in the region of the flexible printed circuit board.

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