Packaging structure for electronic tag and packaging method thereof

Abstract

The invention belongs to the technical field of electronic tags, and particularly relates to a packaging structure for an electronic tag and a packaging method of the packaging structure. The packaging structure for the electronic tag comprises a packaging bottom plate, a mounting groove is formed in the top of the packaging bottom plate, a rectangular supporting ring is fixedly connected to the groove wall of the bottom of the mounting groove, and an annular protrusion matched with the supporting ring in shape is fixedly connected to the edge of the outer side of the top of the supporting ring. An electronic tag body is arranged on the inner side of the annular protrusion. Through the arrangement of the reinforcing assembly, the outer side of the supporting ring can be filled with glue during packaging, so that when the packaging bottom plate and the packaging cover are pressed together, the glue can enter the through hole of the connecting block and the reinforcing groove under the extrusion of the extrusion bulge, and therefore, the glue is solidified along with the solidification of the glue; and the bonding firmness between the packaging bottom plate and the packaging cover is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic tags, and in particular relates to a packaging structure for electronic tags and a packaging method thereof. Background Art

[0002] Electronic tags are also called radio frequency tags, transponders, and data carriers; readers are also called readout devices, scanners, readers, communicators, and reader-writers (depending on whether the electronic tags can rewrite data wirelessly). The electronic tags and readers use coupling elements to achieve spatial (contactless) coupling of radio frequency signals; in the coupling channel, energy transfer and data exchange are achieved based on the timing relationship.

[0003] In order to ensure the stable working state of the existing electronic tags when in use, it is generally necessary to package the electronic tags, and the packaging operation varies depending on the electronic tags. For some thinner electronic tags, the electronic tags are generally pasted in the packaging shell with glue, and then a hot press is used for compression packaging. However, during the compression, the glue is also squeezed, and the glue in different positions may be unevenly distributed due to different pressures, which in turn affects the sealing of the electronic tag after packaging. In addition, in the process of gluing the packaging shell with glue, since the direct gluing method with glue cannot achieve the effect of screw fixing, the packaging shell is prone to loosening in some use environments with large vibrations, which will also affect the sealing of the electronic tag.

[0004] Therefore, it is necessary to invent a packaging structure and a packaging method for an electronic tag to solve the above problems. Summary of the invention

[0005] In view of the above problems, the present invention provides a packaging structure for an electronic tag and a packaging method thereof to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: A packaging structure for an electronic tag comprises a packaging base plate, a mounting groove is provided at the top of the packaging base plate, a rectangular support ring is fixedly connected to the groove wall at the bottom of the mounting groove, an annular protrusion matching the shape of the support ring is fixedly connected to the top outer edge of the support ring, an electronic tag body is arranged inside the annular protrusion, the electronic tag body comprises a substrate, a coil and a chip, and the area of ​​the substrate matches the inner area of ​​the annular protrusion, an isolation ring with the same shape as the support ring is arranged at the periphery of the support ring, the isolation ring is fixedly connected to the groove wall at the bottom of the mounting groove, a packaging cover matching the size of the support ring is arranged at the top of the packaging base plate, a packaging groove matching the size of the mounting groove is provided at the bottom of the packaging cover, a rectangular packaging ring is fixedly connected in the packaging groove, and the packaging ring is inserted in the gap between the isolation ring and the support ring, a rectangular annular extrusion protrusion is arranged outside the packaging ring, the extrusion protrusion is fixedly connected to the inner wall at the top of the packaging groove, and the extrusion protrusion never contacts the inside of the bottom of the mounting groove, and reinforcement components are arranged at the four corners of the bottom of the packaging cover.

[0007] Furthermore, the reinforcement component includes an L-shaped connecting block, which is fixedly connected to the corner position of the top groove wall of the packaging groove, and the two right-angled sides of the connecting block are respectively fitted with the inner walls on both sides adjacent to the installation groove, and through holes are opened on the two right-angled sides of the connecting block. A reinforcement groove is opened at the position of the side wall of the installation groove opposite to the through hole, and the opening size of the reinforcement groove matches the size of the through hole.

[0008] Furthermore, a rectangular heat-insulating groove is provided on the inner wall at the top of the packaging cover, and the heat-insulating groove is located in the inner area of ​​the packaging ring. Two concentric support rings are fixedly connected to the inner wall at the top of the heat-insulating groove and the inner wall at the bottom of the mounting groove, and the chip is opposite to the central area of ​​the support ring. A number of notches are evenly provided on the support ring, and the support rings located at the top and bottom of the substrate can respectively keep in contact with the top and bottom of the substrate.

[0009] Furthermore, a plurality of connection holes are evenly opened at the top edge of the substrate, a rectangular pressure ring is provided at the top edge of the substrate, the pressure ring is fixedly connected to the top inner wall of the packaging groove, the pressure ring is tightly pressed against the top of the substrate, and the connection holes are located in the outer area of ​​the pressure ring.

[0010] Furthermore, the outer side of the extrusion protrusion is designed as a slope, and the thickness of the extrusion protrusion gradually decreases from top to bottom. The bottom edge of the packaging cover and the top edge of the packaging base plate are provided with a plurality of glue overflow grooves, and the groove walls on both sides of the overflow glue groove facing the substrate are both open designs. The multiple glue overflow grooves at the bottom of the packaging cover match the multiple glue overflow grooves at the top of the packaging base plate.

[0011] Furthermore, the width of the packaging ring matches the gap width between the isolation ring and the support ring, and a plurality of connection grooves are evenly arranged on the bottom edge of the packaging ring, and the groove walls on both sides of the connection groove facing the substrate are both open.

[0012] Furthermore, the four corners of the bottom of the packaging base plate are fixedly connected with support blocks, and the bottom of the support ring is fixedly connected with a shock-absorbing pad, and the distance between the opposite sides of two adjacent support blocks gradually decreases towards the center of the packaging base plate.

[0013] Furthermore, a flexible protective pad is fixedly connected to the bottom of the pressure ring, and the size of the flexible protective pad is larger than the size of the bottom surface of the pressure ring.

[0014] The present invention also provides a packaging method for a packaging structure of an electronic tag, the method comprising the following steps: Step 1: Apply glue evenly on the top of the support ring, then place the electronic tag body on the inner side of the annular protrusion, and support its bottom with the support ring, so as to bond the electronic tag body to the packaging bottom plate through the glue; Step 2: Apply glue evenly on the outer area of ​​the support ring, and then buckle the package cover on the top of the package base plate; Step 3: Use a hot press to heat-press the package cover and the package base plate; Step 4: Scrape and clean the glue that overflows onto the outside of the package base plate and the package cover after the pressing is completed.

[0015] Technical effects and advantages of the present invention: 1. The present invention is provided with a reinforcement component, and glue can be filled on the outer side of the support ring during packaging, so that when the packaging bottom plate and the packaging cover are pressed together, the glue can enter the through hole of the connection block and the reinforcement groove under the extrusion of the extrusion protrusion, and as the glue solidifies, the glue entering the through hole of the connection block and the reinforcement groove can form a whole, thereby locking the connection block and the packaging bottom plate together, thereby improving the firmness of the bonding between the packaging bottom plate and the packaging cover; 2. When the packaging bottom plate and the packaging cover are pressed together, as the glue solidifies, the packaging ring can cooperate with the isolation ring, the support ring and the annular protrusion to form an inner isolation ring on the periphery of the electronic tag body, and the extrusion protrusion can cooperate with the solidified glue to form an outer isolation ring on the periphery of the electronic tag body, and then cooperate with the inner isolation ring formed by the packaging ring to further improve the sealing of the electronic tag body, preventing the external water vapor from affecting the normal use of the electronic tag body; 3. The present invention provides a support ring in the heat-insulating groove. When the electronic tag is packaged inside the packaging bottom plate and the packaging cover, the chip of the electronic tag body can be kept suspended under the support of the support ring, thereby effectively reducing the heat transfer from the device to the chip, thereby avoiding the heat from affecting the use of the chip. In addition, when the device vibrates, the suspended chip can be less affected by the vibration of the device. In addition, the support ring can also produce a mobile support effect on the substrate, avoiding the suspended chip from resonating with the device due to lack of support; 4. The present invention is provided with a support block. When the present invention is applied to some equipment that generates heat, such as steel smelting, power equipment, glass manufacturing, etc., the presence of the support block can separate the packaging base plate from the equipment, thereby preventing heat from being transferred to the electronic tag body through direct contact, thereby reducing the impact of temperature on the electronic tag body, and at the same time, it can also allow the outside wind to better enter the bottom of the packaging base plate through the gap between the equipment and the packaging base plate, thereby facilitating heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a first overall structural schematic diagram of the present invention; Figure 2 is a second overall structural schematic diagram of the present invention; Figure 3 It is a three-dimensional schematic diagram of the packaging base plate and the electronic tag body in the present invention; Figure 4 The present invention Figure 3 A magnified view of part A; Figure 5 is a three-dimensional schematic diagram of the packaging base plate in the present invention; Figure 6 is a three-dimensional schematic diagram of the packaging cover in the present invention; Figure 7 The present invention Figure 6 A magnified view of part B; Figure 8 is a three-dimensional cross-sectional view of the present invention; Fig. 9 The present invention Figure 8 Enlarged view of part C.

[0017] In the figure: 1. packaging base plate; 2. support ring; 3. annular protrusion; 4. electronic tag body; 41. substrate; 42. coil; 43. chip; 5. isolation ring; 6. packaging cover; 7. packaging ring; 8. extrusion protrusion; 9. reinforcement component; 91. connecting block; 92. through hole; 93. reinforcement groove; 10. support ring; 11. connecting hole; 12. pressure ring; 13. glue overflow groove; 14. connecting groove; 15. support block; 16. shock-absorbing pad; 17. flexible protective pad. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0019] The present invention provides Figures 1 to 9 The packaging structure for an electronic tag shown in the figure comprises a packaging bottom plate 1, a mounting groove is provided on the top of the packaging bottom plate 1, a rectangular support ring 2 is fixedly connected to the groove wall at the bottom of the mounting groove, an annular protrusion 3 matching its shape is fixedly connected to the top outer edge of the support ring 2, an electronic tag body 4 is arranged on the inner side of the annular protrusion 3, the electronic tag body 4 comprises a substrate 41, a coil 42 and a chip 43, and the area of ​​the substrate 41 matches the inner area of ​​the annular protrusion 3, and an isolation ring 5 having the same shape as the support ring 2 is arranged on the periphery of the support ring 2, and the isolation ring 5 having the same shape as the support ring 2 is arranged on the outer side of the support ring 2. The isolation ring 5 is fixedly connected to the groove wall at the bottom of the mounting groove, and a packaging cover 6 matching its size is provided on the top of the packaging bottom plate 1. A packaging groove matching the size of the mounting groove is provided at the bottom of the packaging cover 6. A rectangular packaging ring 7 is fixedly connected in the packaging groove, and the packaging ring 7 is inserted in the gap between the isolation ring 5 and the support ring 2. A rectangular annular extrusion protrusion 8 is provided on the outer side of the packaging ring 7. The extrusion protrusion 8 is fixedly connected to the inner wall of the top of the packaging groove, and the extrusion protrusion 8 is never in contact with the bottom of the mounting groove. The four corners of the bottom of the packaging cover 6 are provided with reinforcement components 9; The reinforcement component 9 includes an L-shaped connection block 91, which is fixedly connected to the corner position of the groove wall at the top of the packaging groove, and the two right-angled sides of the connection block 91 are respectively fitted with the inner walls of the two adjacent sides of the installation groove, and the two right-angled sides of the connection block 91 are penetrated by a through hole 92, and a reinforcement groove 93 is opened at the position of the side wall of the installation groove directly opposite to the through hole 92, and the opening size of the reinforcement groove 93 matches the size of the through hole 92; When packaging the electronic tag body 4, first evenly apply glue on the top of the support ring 2, then place the electronic tag body 4 on the inner side of the annular protrusion 3, and make the bottom edge of the substrate 41 supported by the support ring 2, then fill the outside of the support ring 2 with glue, and make the height of the glue between the isolation ring 5 and the top of the packaging base plate 1, then buckle the packaging cover 6 on the top of the packaging base plate 1, and make the packaging ring 7 at the bottom of the packaging cover 6 inserted into the gap between the isolation ring 5 and the support ring 2, and the extrusion protrusion 8 is inserted into the outer area of ​​the support ring 2, and finally use a hot press to perform hot pressing operation on the packaging cover 6, and as the packaging cover 6 is extruded, the packaging cover 6 can move downward and gradually press together with the packaging base plate 1, and as the packaging cover 6 moves downward The connection block 91 can move downward under the drive of the packaging cover 6 and make the through hole 92 on the connection block 91 gradually align with the reinforcement groove 93 at the corresponding position. At the same time, as the packaging cover 6 moves downward, the extrusion protrusion 8 can move downward together and squeeze the glue on the outside of the support ring 2, so that the glue can be squeezed into the through hole 92 of the connection block 91, the reinforcement groove 93, the gap between the packaging ring 7 and the isolation ring 5, and the gap between the packaging cover 6 and the packaging base plate 1. After the pressing is completed, as the glue solidifies, the glue entering the through hole 92 of the connection block 91 and the reinforcement groove 93 can form a whole, thereby locking the connection block 91 and the packaging base plate 1 together, thereby improving the firmness of the bonding between the packaging base plate 1 and the packaging cover 6; In addition, after the glue solidifies, the packaging ring 7 can cooperate with the isolation ring 5, the support ring 2 and the annular protrusion 3 to form an inner isolation ring on the periphery of the electronic tag body 4, thereby ensuring the sealing of the area where the electronic tag body 4 is located. In addition, since the extrusion protrusion 8 does not contact the bottom inner wall of the installation groove, when the glue is squeezed, the glue can be fully wrapped at the bottom position of the extrusion protrusion 8, so that when the glue solidifies, the extrusion protrusion 8 can cooperate with the solidified glue to form an outer isolation ring on the periphery of the electronic tag body 4, and then cooperate with the inner isolation ring formed by the packaging ring 7 to further improve the sealing of the electronic tag body 4, and prevent external water vapor from affecting the normal use of the electronic tag body 4.

[0020] like Figures 5 to 8 As shown, a rectangular heat-insulating groove is provided on the inner wall at the top of the packaging cover 6, and the heat-insulating groove is located in the inner area of ​​the packaging ring 7, two concentric support rings 10 are fixedly connected to the inner wall at the top of the heat-insulating groove and the inner wall at the bottom of the mounting groove, and the chip 43 is opposite to the central area of ​​the support ring 10, a plurality of notches are evenly provided on the support ring 10, and the support rings 10 located at the top and bottom of the substrate 41 can respectively keep in contact with the top and bottom of the substrate 41; By providing the heat-insulating groove, when the electronic tag body 4 is encapsulated inside the encapsulating bottom plate 1 and the encapsulating cover 6, the chip 43 of the electronic tag body 4 can be kept suspended under the support of the support ring 10. Therefore, when the present invention is applied to some equipment that generates heat, such as steel smelting, power equipment, glass manufacturing, etc., due to the presence of the heat-insulating groove, the heat of the equipment will not be directly transferred to the chip 43 through the encapsulating bottom plate 1, thereby avoiding the heat from affecting the use of the chip 43. In addition, when the device vibrates, the suspended chip 43 can be less affected by the vibration of the device. In addition, the support ring 10 can also produce a mobile support effect on the substrate 41, preventing the suspended chip 43 from resonating with the device due to lack of support, and the gap on the support ring 10 can also prevent heat from accumulating in the inner area of ​​the support ring 10, thereby ensuring the relative consistency of the temperature of the entire insulation tank.

[0021] like Figure 3 and Figure 4 As shown, a plurality of connection holes 11 are evenly opened at the top edge of the substrate 41, and a rectangular pressing ring 12 is provided at the top edge of the substrate 41. The pressing ring 12 is fixedly connected to the inner wall of the top of the packaging groove, and the pressing ring 12 is tightly pressed against the top of the substrate 41, and the connection holes 11 are located in the outer area of ​​the pressing ring 12; By providing the connecting hole 11, when the substrate 41 is placed on the top of the support ring 2 coated with glue, as the packaging cover 6 is buckled on the top of the packaging base plate 1, the pressure ring 12 can keep in contact with the top of the substrate 41, and then as the hot press squeezes the packaging cover 6, the pressure ring 12 can press the substrate 41 downward. At this time, the glue at the bottom of the substrate 41 can move to the space at the top of the substrate 41 through the connecting hole 11, thereby avoiding excessive glue from gathering at the bottom of the substrate 41, ensuring that the substrate 41 and the support ring 2 can be better bonded together. In addition, when the glue in the connecting hole 11 dries and solidifies, the solidified glue can also enhance the connection force between the substrate 41 and the support ring 2, thereby improving the stability of the adhesion between the two.

[0022] like Figures 1 to 9 As shown, the outer side of the extrusion protrusion 8 is designed as a slope, and the thickness of the extrusion protrusion 8 gradually decreases from top to bottom. The bottom edge of the packaging cover 6 and the top edge of the packaging base plate 1 are both provided with a plurality of overflow glue grooves 13, and the groove walls on both sides of the overflow glue grooves 13 facing the substrate 41 are both open. The multiple overflow glue grooves 13 at the bottom of the packaging cover 6 match the multiple overflow glue grooves 13 at the top of the packaging base plate 1. By providing the glue overflow groove 13, during the pressing process of the packaging base plate 1 and the packaging cover 6, as the extrusion protrusion 8 squeezes the glue in the outer area of ​​the support ring 2, the glue can be well moved out to the outside of the packaging base plate 1 and the packaging cover 6 through the glue overflow groove 13, thereby avoiding excessive glue from being squeezed into the contact position between the edges of the packaging base plate 1 and the packaging cover 6, thereby ensuring that the packaging base plate 1 and the packaging cover 6 can be well fitted together, thereby ensuring the airtightness of the packaging of the electronic tag body 4.

[0023] like Figure 1 and Figure 2 As shown, the four corners of the bottom of the packaging base plate 1 are fixedly connected with support blocks 15, and the bottom of the support ring 2 is fixedly connected with a shock-absorbing pad 16, and the distance between the opposite sides of two adjacent support blocks 15 gradually decreases toward the center of the packaging base plate 1; By providing the support block 15, when the present invention is applied to some equipment that generates heat, such as steel smelting, power equipment, glass manufacturing, etc., the presence of the support block 15 can separate the packaging bottom plate 1 from the equipment, thereby preventing heat from being transferred to the electronic tag body 4 by direct contact, thereby reducing the impact of temperature on the electronic tag body 4, and during use, since the distance between the opposite sides of two adjacent support blocks 15 gradually decreases toward the center of the packaging bottom plate 1, the external wind can better enter the bottom of the packaging bottom plate 1 through the gap between the equipment and the packaging bottom plate 1, thereby facilitating the dissipation of heat; In addition, due to the presence of the shock-absorbing pad 16 , the shock-absorbing pad 16 can also absorb the vibration generated during the use of the device, thereby reducing the impact of the vibration on the electronic tag body 4 and ensuring the stability of the use of the electronic tag body 4 .

[0024] like Figures 6 to 9 As shown, a flexible protective pad 17 is fixedly connected to the bottom of the pressure ring 12, and the size of the flexible protective pad 17 is larger than the size of the bottom surface of the pressure ring 12; By providing the flexible protective pad 17 , when the electronic tag body 4 is pressed by the pressing ring 12 , the flexible protective pad 17 can protect the contact position between the pressing ring 12 and the electronic tag body 4 , thereby preventing the electronic tag body 4 from being crushed.

[0025] like Figure 6 and Figure 7 As shown, the width of the packaging ring 7 matches the gap width between the isolation ring 5 and the support ring 2, and a plurality of connecting grooves 14 are evenly arranged on the bottom edge of the packaging ring 7, and the groove walls on both sides of the connecting grooves 14 facing the substrate 41 are both open; By providing the connecting groove 14, when the packaging ring 7 contacts with the glue, the connecting groove 14 can increase the contact area between the glue and the packaging ring 7, thereby cooperating with the reinforcing effect of the connecting block 91 on the packaging base plate 1 and the packaging cover 6, further improving the firmness of the bonding between the packaging base plate 1 and the packaging cover 6.

[0026] The present invention also provides a packaging method for a packaging structure of an electronic tag, the method comprising the following steps: Step 1: Apply glue evenly on the top of the support ring 2, then place the electronic tag body 4 on the inner side of the annular protrusion 3, and support its bottom with the support ring 2, so as to bond the electronic tag body 4 to the packaging base plate 1 through the glue; Step 2: Apply glue evenly on the outer area of ​​the support ring 2, and then buckle the packaging cover 6 on the top of the packaging base plate 1; Step 3: Using a hot press machine to heat-press the packaging cover 6 and the packaging base plate 1; Step 4: Scrape and clean the glue that overflows onto the outer sides of the packaging base plate 1 and the packaging cover 6 after the pressing is completed.

[0027] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. A packaging structure for an electronic tag, comprising a packaging base plate (1), characterized in that: The top of the packaging base plate (1) is provided with a mounting groove, a rectangular support ring (2) is fixedly connected to the groove wall at the bottom of the mounting groove, an annular protrusion (3) matching its shape is fixedly connected to the top outer edge of the support ring (2), an electronic tag body (4) is arranged on the inner side of the annular protrusion (3), the electronic tag body (4) comprises a substrate (41), a coil (42) and a chip (43), and the area of ​​the substrate (41) matches the inner area of ​​the annular protrusion (3), an isolation ring (5) having the same shape as the support ring (2) is arranged on the periphery of the support ring (2), and the isolation ring (5) is connected to the groove at the bottom of the mounting groove. The packaging base plate (1) is fixedly connected to the inner wall of the packaging base plate (1), a packaging cover (6) whose size matches the packaging base plate (1) is arranged on the top, a packaging groove whose size matches the mounting groove is opened on the bottom of the packaging cover (6), a rectangular packaging ring (7) is fixedly connected in the packaging groove, and the packaging ring (7) is inserted in the gap between the isolation ring (5) and the support ring (2), a rectangular ring-shaped extrusion protrusion (8) is arranged on the outside of the packaging ring (7), the extrusion protrusion (8) is fixedly connected to the inner wall of the top of the packaging groove, and the extrusion protrusion (8) never contacts the inside of the bottom of the mounting groove, and reinforcement components (9) are arranged at the four corners of the bottom of the packaging cover (6).

2. The packaging structure for an electronic tag according to claim 1, characterized in that: The reinforcement component (9) comprises an L-shaped connection block (91), the connection block (91) being fixedly connected to the corner position of the groove wall at the top of the packaging groove, and the two right-angled sides of the connection block (91) are respectively fitted with the inner walls of the adjacent two sides of the installation groove, and the two right-angled sides of the connection block (91) are penetrated by through holes (92), and the side wall of the installation groove is provided with a reinforcement groove (93) at a position directly opposite to the through hole (92), and the opening size of the reinforcement groove (93) matches the size of the through hole (92).

3. The packaging structure for electronic tags according to claim 2, characterized in that: A rectangular heat-insulating groove is provided on the inner wall at the top of the packaging cover (6), and the heat-insulating groove is located in the inner area of ​​the packaging ring (7). Two concentric support rings (10) are fixedly connected to the inner wall at the top of the heat-insulating groove and the inner wall at the bottom of the mounting groove, and the chip (43) is opposite to the central area of ​​the support ring (10). A plurality of notches are evenly provided on the support ring (10), and the support rings (10) located at the top and bottom of the substrate (41) can respectively keep in contact with the top and bottom of the substrate (41).

4. The packaging structure for electronic tags according to claim 3, characterized in that: A plurality of connection holes (11) are evenly penetrated at the top edge of the substrate (41), and a rectangular pressing ring (12) is provided at the top edge of the substrate (41). The pressing ring (12) is fixedly connected to the inner wall of the top of the packaging groove. The pressing ring (12) is tightly pressed against the top of the substrate (41), and the connection holes (11) are located in the outer area of ​​the pressing ring (12).

5. The packaging structure for electronic tags according to claim 4, characterized in that: The outer side of the extrusion protrusion (8) is designed as an inclined surface, and the thickness of the extrusion protrusion (8) gradually decreases from top to bottom. The bottom edge of the packaging cover (6) and the top edge of the packaging base plate (1) are both provided with a plurality of glue overflow grooves (13), and the groove walls on both sides of the glue overflow grooves (13) facing the substrate (41) are both designed as openings. The plurality of glue overflow grooves (13) at the bottom of the packaging cover (6) match the plurality of glue overflow grooves (13) at the top of the packaging base plate (1).

6. The packaging structure for electronic tags according to claim 5, characterized in that: The width of the packaging ring (7) matches the width of the gap between the isolation ring (5) and the support ring (2), and a plurality of connection grooves (14) are evenly arranged on the bottom edge of the packaging ring (7), and the groove walls on both sides of the connection grooves (14) facing the substrate (41) are both of an open design.

7. The packaging structure for an electronic tag according to claim 6, characterized in that: The four corner positions at the bottom of the packaging base plate (1) are all fixedly connected to support blocks (15), and the bottom of the support ring (2) is fixedly connected to a shock-absorbing pad (16), and the distance between the opposite sides of two adjacent support blocks (15) gradually decreases towards the center of the packaging base plate (1).

8. The packaging structure for electronic tags according to claim 7, characterized in that: A flexible protective pad (17) is fixedly connected to the bottom of the pressure ring (12), and the size of the flexible protective pad (17) is larger than the size of the bottom surface of the pressure ring (12).

9. A packaging method using the packaging structure for electronic tags according to claim 8, characterized in that: The following steps are involved: Step 1: Glue is evenly applied on the top of the support ring (2), and then the electronic tag body (4) is placed on the inner side of the annular protrusion (3), and its bottom is supported by the support ring (2), so that the electronic tag body (4) and the packaging base plate (1) are bonded together by glue; Step 2: Evenly apply glue on the outer area of ​​the support ring (2), and then buckle the packaging cover (6) on the top of the packaging base plate (1); Step 3: Using a heat press machine to heat-press the packaging cover (6) and the packaging base plate (1); Step 4: Scrape and clean the glue that overflows onto the outside of the packaging base plate (1) and the packaging cover (6) after the pressing is completed.

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