Semiconductor, electronic circuit system, and electronic device
By setting connection holes on semiconductor pins, the problems of inaccurate alignment between fly wire and chip pins and solder failure are solved, and more reliable and efficient electrical connection is achieved, improving production efficiency and yield.
Patent Information
- Application Number
- CN202411499794.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-01-14
AI Technical Summary
In simple electronic circuit systems, when the fly wire is directly close to the chip pin, it is easy to cause inaccurate alignment or solder failure, resulting in low efficiency and yield of the production process.
A connection hole is provided on the pins of the semiconductor for electrical connection to the external line, ensuring that the external line can pass directly through and electrically connect to the connection hole, avoiding alignment misalignment problems, and improving welding yield and efficiency.
Through the existence of connecting holes, the reliability and production efficiency of semiconductor and electronic circuit systems are significantly improved, the welding failure efficiency is reduced, and the overall yield is improved.
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Figure CN119314964A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor, an electronic circuit system and an electronic device. Background Art
[0002] In modern electronic systems, chips are widely used, and most chips need to use PCB boards as the carrier of the chips. The packaging of most chips must be suitable for PCB requirements. In some simple electronic circuit systems, in order to reduce costs, flying wires are used to connect electronic components. When the external wires are directly close to the chip pins, problems such as misalignment or welding failure will occur, which leads to low efficiency and yield of the production process.
[0003] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Summary of the invention
[0004] The embodiments of the present application provide a semiconductor, an electronic circuit system, and an electronic device to solve or alleviate one or more of the technical problems mentioned above.
[0005] According to a first aspect of an embodiment of the present application, a semiconductor is provided, comprising: a chip; a pin, wherein the pin is connected to the chip, and wherein the pin is provided with a connection hole, and wherein the connection hole is used for electrical connection with an external circuit.
[0006] The semiconductor of the embodiment of the present application has a connection hole on the pin, and the connection hole is used to electrically connect with an external circuit, so that the connection between the external circuit and the connection hole is more reliable and convenient, thereby improving the reliability of the semiconductor, and improving the production efficiency and yield.
[0007] This is because the external circuit can directly pass through the connection hole and then achieve electrical connection with the connection hole. During the connection process, due to the existence of the connection hole, there will be almost no problems such as alignment misalignment, which greatly improves production efficiency. For example, when welding is used to connect the external circuit to the connection hole, the external circuit can be passed through the connection hole before welding, which can improve the welding yield and efficiency.
[0008] According to an embodiment of the present application, the connection hole is located at an end of the pin away from the chip.
[0009] According to an embodiment of the present application, the connection hole is located at a non-end position of the pin.
[0010] According to an embodiment of the present application, the connection hole includes a closed connection hole or a non-closed connection hole.
[0011] According to an embodiment of the present application, the shape of the closed connecting hole includes a circle, a triangle, a polygon or an irregular shape.
[0012] According to an embodiment of the present application, the shape of the non-closed connecting hole includes an arc shape, a broken line shape or a polygonal shape.
[0013] According to an embodiment of the present application, the pin includes a folding type pin, and the folding type pin includes a gull-wing folding type or a vertical folding type.
[0014] The second aspect of the embodiment of the present application provides an electronic circuit system, which includes the semiconductor of the first aspect, and a flying wire, wherein the flying wire is electrically connected to the connection hole. In the electronic circuit system, the flying wire can be connected to the end pin in the semiconductor, so that the flying wire can directly pass through the connection hole and then be electrically connected to the connection hole. During the connection process, due to the presence of the connection hole, there will be almost no problems such as misalignment, which greatly improves the production efficiency and yield of the electronic circuit system.
[0015] According to an embodiment of the present application, the electrical connection method includes welding or extrusion connection.
[0016] In a third aspect of the embodiment of the present application, an electronic device is provided. The electronic device comprises the semiconductor of the first aspect or the electronic circuit system of the second aspect. The electronic device has all the advantages mentioned above, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.
[0018] Figure 1 is a schematic structural diagram of a semiconductor having a connection hole as a closed connection in some embodiments; Figure 2 is a schematic structural diagram of a semiconductor having a connection hole as a closed connection in some other embodiments; Figure 3 is a schematic diagram of the structure of a semiconductor in which the connection hole is a non-closed connection in some embodiments; Figure 4 is a schematic diagram of the structure of a semiconductor in which the connection holes are sealed and non-closed in some other embodiments; Figure 5 is a schematic diagram of the structure of the connection holes of some embodiments; Figure 6 is a schematic diagram of the structure of a semiconductor in which the connection hole is a sealed non-closed connection in some embodiments; Figure 7 Schematic diagram of the structure of a semiconductor in which the connection holes are sealed and non-closed in some other embodiments.
[0019] Description of reference numerals: 1: chip; 2: pin; 3: connection hole; 4: external line. DETAILED DESCRIPTION
[0020] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings. In the accompanying drawings, for clarity, the sizes of layers, regions, elements and their relative sizes may be exaggerated. Wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limitations on the present application. It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0021] It should be understood that when an element or layer is referred to as "on ...", "adjacent to ...", "connected to" or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to or coupled to other elements or layers, or there can be intervening elements or layers. On the contrary, when an element is referred to as "directly on ...", "directly adjacent to ...", "directly connected to" or "directly coupled to" other elements or layers, there is no intervening element or layer. It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as the second element, component, region, layer or part. When the second element, component, region, layer or part is discussed, it does not indicate that the present application necessarily has the first element, component, region, layer or part.
[0022] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0024] In the present application, when it comes to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values in the numerical interval is considered to be continuous, and includes the two numerical endpoints (i.e., the minimum and maximum values) of the numerical interval, and each numerical value between the two numerical endpoints. Unless otherwise specified, when the numerical interval only refers to an integer in the numerical interval, it includes the two endpoint integers of the numerical range, and each integer between the two endpoints, which is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical range disclosed in the present application should be understood to include any and all sub-ranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. "Numerical interval" allows for broadly including quantitative intervals such as percentage intervals, ratio intervals, and ratio intervals.
[0025] Traditional chip packaging is usually optimized for PCB substrate connection. When using wires directly close to the chip pins, due to jitter, the elasticity of soft wires, the instability of soldering irons, etc., it will take a lot of time to align the solder joints during welding, which will lead to extremely low production efficiency and problems such as cold solder joints.
[0026] According to the first aspect of the embodiments of the present application, a semiconductor is provided, wherein the semiconductor comprises a chip and a pin, wherein the pin is connected to the chip and is provided with a connection hole, wherein the connection hole is used for electrical connection with an external circuit.
[0027] The semiconductor of the embodiment of the present application has a connection hole on the pin, and the connection hole is used to electrically connect with an external circuit, so that the connection between the external circuit and the connection hole is more reliable and convenient, thereby improving the reliability of the semiconductor, and improving the production efficiency and yield.
[0028] This is because the external circuit can directly pass through the connection hole and then achieve electrical connection with the connection hole. During the connection process, due to the existence of the connection hole, there will be almost no problems such as alignment misalignment, which greatly improves production efficiency. For example, when welding is used to connect the external circuit to the connection hole, the external circuit can be passed through the connection hole before welding, which can improve the welding yield and efficiency.
[0029] In some embodiments, the connection hole is located at an end of the pin away from the chip, that is, the connection hole is located at the end of the pin.
[0030] In some embodiments, the connection hole is located at a non-end position of the pin.
[0031] In some embodiments, the connection hole includes a closed connection hole or a non-closed connection hole. When the closed connection hole is connected to the external circuit, the wire can easily pass through the closed structure, and the worker / machine can easily apply a certain stress on the wire, so that a stable and reliable connection can be achieved, thereby improving efficiency and yield. When it is inconvenient for the external line to pass through the fully closed structure, a semi-closed structure is used to connect to the external line, so that the connection line can be directly connected through the notch card.
[0032] In some embodiments, the closed connection hole has a shape including a circle, a triangle, a polygon or an irregular shape.
[0033] In some embodiments, the shape of the non-closed connecting hole includes an arc, a broken line or a polygon.
[0034] In some embodiments, reference Figure 1 The semiconductor comprises a chip 1; a pin 2, wherein the pin 2 is connected to the chip 1, and wherein the pin 2 is provided with a connection hole 3, and the connection hole 3 is used for electrical connection with an external circuit 4.
[0035] As an example, refer to Figure 1 , the connecting hole 3 is located at the end of the pin 2.
[0036] In some embodiments, reference Figure 2 The semiconductor comprises a chip 1; a pin 2, wherein the pin 2 is connected to the chip 1, and wherein the pin 2 is provided with a connection hole 3, and the connection hole 3 is used for electrical connection with an external circuit 4.
[0037] As an example, refer to Figure 2 , the connecting hole 3 is located at a non-end position of the pin 2.
[0038] In some embodiments, reference Figure 1 and Figure 2 , the connecting hole 3 is a closed connecting hole.
[0039] As an example, refer to Figure 1 and Figure 2 , the closed connecting hole is circular.
[0040] In some embodiments, reference Figure 3 The semiconductor includes a chip 1; a pin 2, the pin 2 is connected to the chip 1, and the pin 2 is provided with a connection hole 3, the connection hole 3 is used to electrically connect with an external circuit. The connection hole is a non-enclosed connection hole. In this way, when it is inconvenient for the external circuit to pass through the fully enclosed structure, a semi-enclosed connection hole is used to connect with the external circuit, so that the connection line can be directly connected through the notch card.
[0041] Further, refer to Figure 3 , the connecting hole 3 is located at the end of the pin.
[0042] In some embodiments, reference Figure 4 The semiconductor includes a chip 1; a pin 2, the pin 2 is connected to the chip 1, and the pin 2 is provided with a connection hole 3, the connection hole 3 is used for electrical connection with an external circuit. The connection hole 3 is a non-enclosed connection hole. The connection hole is located at a non-end position of the pin.
[0043] In some embodiments, reference Figure 5 The non-enclosed connection hole is an arc, and the angle a of the arc satisfies: 180° <a<360°。
[0044] In some embodiments, reference Figure 6 The semiconductor includes a chip 1; a pin 2, the pin 2 is connected to the chip 1, and the pin 2 is provided with a connection hole 3, the connection hole 3 is used to electrically connect with an external circuit 4. The connection hole 3 is a non-closed connection hole. The connection hole is located at the end of the pin. The connection hole is a non-closed connection hole composed of a broken line.
[0045] In other embodiments, reference Figure 7 The semiconductor comprises a chip 1; a pin 2, the pin 2 is connected to the chip 1, the pin 2 is provided with a connection hole 3, the connection hole 3 is used for electrical connection with an external circuit 4. The connection hole is a non-enclosed connection hole. The connection hole is located at the end of the pin.
[0046] In some embodiments, the pins include folding pins, and the folding pins include gull-wing folding pins or vertical folding pins.
[0047] It can be understood that the semiconductor structure of the embodiment of the present application is only used as an example and adopts a dual-row package. In the specific implementation case, it is not limited to a dual-row package, and can be a single-sided, three-sided, or even four-sided package; the number of pins is greater than or equal to 2, and the pin arrangement includes an asymmetric structure.
[0048] The second aspect of the embodiment of the present application provides an electronic circuit system, which includes the semiconductor of the first aspect, and a flying wire, wherein the flying wire is electrically connected to the connection hole. In the electronic circuit system, the flying wire can be connected to the end pin in the semiconductor, so that the flying wire can directly pass through the connection hole and then be electrically connected to the connection hole. During the connection process, due to the presence of the connection hole, there will be almost no problems such as misalignment, which greatly improves the production efficiency and yield of the electronic circuit system.
[0049] In some embodiments, the electrical connection comprises welding.
[0050] In other embodiments, the electrical connection method includes extrusion connection. When the electrical connection is performed by extrusion, a press machine is used to squeeze the bifurcated pins and wires together, thereby reducing the welding process and reducing the production cost.
[0051] In some embodiments, the external circuit is a flying lead.
[0052] In a third aspect of the embodiment of the present application, an electronic device is provided. The electronic device comprises the semiconductor of the first aspect or the electronic circuit system of the second aspect. The electronic device has all the advantages mentioned above, which will not be described in detail here.
[0053] It should also be noted that the "some embodiments", "other embodiments", "embodiments", etc. mentioned in this application refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure or characteristic is described in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of this application.
[0054] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0055] It should also be noted that the above are only preferred embodiments of the present application, and the patent protection scope of the present application is not limited thereto. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A semiconductor, characterized in that: include: chip; A pin is connected to the chip, and the pin is provided with a connection hole, and the connection hole is used for electrical connection with an external circuit.
2. The semiconductor according to claim 1, characterized in that The connection hole is located at an end of the pin away from the chip.
3. The semiconductor according to claim 1, characterized in that The connection hole is located at a non-end position of the pin.
4. The semiconductor according to any one of claims 1 to 3, characterized in that: The connecting hole includes a closed connecting hole or a non-closed connecting hole.
5. The semiconductor according to claim 4, characterized in that The closed connection hole may have a shape of a circle, a triangle, a polygon or an irregular shape.
6. The semiconductor according to claim 4, characterized in that The shape of the non-closed connecting hole includes arc, broken line or polygon.
7. The semiconductor according to any one of claims 1 to 6, characterized in that: The pins include foldable pins, The folding pins include a gull-wing folding type or a vertical folding type.
8. An electronic circuit system, characterized in that: The invention comprises the semiconductor as claimed in claims 1 to 7, and a flying lead, wherein the flying lead is electrically connected to a connecting hole.
9. The electronic circuit system according to claim 8, characterized in that: The electrical connection method includes welding or extrusion connection.
10. An electronic device, characterized in that: A semiconductor comprising any one of claims 1 to 7 or an electronic circuit system comprising claim 8 or 9.