Heat dissipation method of electronic equipment, electronic equipment and computer readable storage medium

Abstract

The invention discloses a heat dissipation method of electronic equipment, the electronic equipment and a computer readable storage medium, and the heat dissipation method comprises the steps: responding to a received heat dissipation starting instruction, and confirming a first region where a current user is in contact with the electronic equipment; wherein the first area is located in the frame area, and a heat dissipation component is arranged in the first area; and heat dissipation is carried out through the heat dissipation component in the first area. According to the mobile phone, heat can be released through the frame area in contact with the current user, so that the fingers of the current user are warmed through the released heat, and the hand warming requirement of the user when the user uses the mobile phone in winter is met.

Description

Technical Field

[0001] The present application relates to the field of optical technology, and in particular to a heat dissipation method for an electronic device, an electronic device, and a computer-readable storage medium. Background Art

[0002] With the rapid development of science and technology, electronic devices are becoming more and more intelligent and have more and more functions. The requirements for CPU (Central Processing Unit) are also getting higher and higher. The heating phenomenon of internal components in electronic devices is becoming more and more obvious, and the heat generation is also getting higher and higher.

[0003] In the prior art, electronic devices mainly use heat dissipation components for heat dissipation, and the heat dissipation components are usually arranged in the middle area of ​​the back of the electronic device (the side away from the display screen) to dissipate heat directly into the air through the middle area.

[0004] When using an electronic device, a user usually holds the electronic device in his hand or holds the electronic device with both hands. At this time, only the fingers are in contact with the left and right sides or the upper and lower sides of the electronic device, and the palm does not directly contact the rear surface of the electronic device. Since the existing technology mainly dissipates heat in the middle area, when using an electronic device in cold winter, it is easy for the user's fingers to become stiff due to the excessive cold weather. Summary of the invention

[0005] The main technical problem solved by the present application is to provide a heat dissipation method for an electronic device, an electronic device and a computer-readable storage medium, which can solve the problem that the prior art cannot keep fingers warm when using electronic devices in winter.

[0006] To solve the above technical problems, the first technical solution adopted in the present application is to provide a heat dissipation method for an electronic device, comprising: in response to receiving a heat dissipation start instruction, confirming a first area where the current user is in contact with the electronic device; wherein the first area is located in a border area, and a heat dissipation component is provided in the first area; and heat is dissipated through the heat dissipation component in the first area.

[0007] The step of dissipating heat through the heat dissipation component of the first area includes: continuously transmitting the heat generated by the internal components of the electronic device to the heat dissipation component of the first area through the heat dissipation system of the electronic device, so as to release the heat through the heat dissipation component.

[0008] Wherein, the heat dissipation component includes a phase change thermal conductive sheet and / or graphene; the step of dissipating heat through the heat dissipation component in the first area includes: dissipating heat through the phase change thermal conductive sheet and / or graphene in the first area.

[0009] After the step of dissipating heat through the heat dissipation component of the first area, the method includes: in response to detecting that the temperature of the first area is higher than a preset temperature, reducing the heat dissipation of the first area.

[0010] Wherein, in response to detecting that the temperature of the first area is higher than the preset temperature, the step of reducing the heat dissipation of the first area includes: reducing the operating frequency and / or load of the corresponding heat dissipation component in the first area; or closing the heat pipe connected to the corresponding heat dissipation component in the first area. Wherein, the electronic device includes a second area connected to the first area; wherein the second area is located on a side surface of the electronic device away from the display area; the step of dissipating heat through the heat dissipation component of the first area includes: transmitting the heat dissipation of the second area to the first area through the heat dissipation system of the electronic device to increase the heat dissipation of the first area.

[0011] Among them, after the step of heat dissipation through the heat dissipation component of the first area, it includes: in response to detecting that the temperature of the first area is higher than the preset temperature, the heat dissipation of the first area is conducted to the second area through the heat dissipation system of the electronic device, and the operating frequency and / or load of the corresponding heat dissipation component in the second area is increased.

[0012] Wherein, after the step of dissipating heat through the heat dissipation component in the first area, the method further comprises: in response to receiving a heat dissipation shut-off instruction, shutting off the heat pipe connected to the corresponding heat dissipation component in the first area.

[0013] In order to solve the above technical problems, the second technical solution adopted in the present application is to provide an electronic device, including: a heat-generating component, arranged in a border area; a processor, which is used to confirm the first area where the current user is in contact with the electronic device based on the heat-dissipating start-up instruction after receiving the heat-dissipating start-up instruction, and dissipate heat through the heat-dissipating component in the first area; wherein the first area is located in the border area.

[0014] In order to solve the above technical problems, the third technical solution adopted in the present application is to provide a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps in the heat dissipation method of an electronic device as described in any one of the above items are implemented.

[0015] The beneficial effects of the present application are as follows: the present application provides a heat dissipation method for an electronic device, an electronic device and a computer-readable storage medium, which confirms the first area in contact with the electronic device by the current user after receiving a heat dissipation start instruction, and dissipates heat through the heat dissipation component of the first area, and can release heat through the border area in contact with the current user, and then keep the current user's fingers warm through the released heat, thereby meeting the user's hand warming needs when using a mobile phone in winter. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a structural block diagram of an embodiment of the electronic device of the present application;

[0018] Figure 2 It is a flow chart of a first embodiment of a heat dissipation method for an electronic device of the present application;

[0019] Figure 3 It is a flow chart of a second embodiment of the heat dissipation method of an electronic device of the present application;

[0020] Figure 4 It is a workflow diagram of an application scenario of the heat dissipation method of the electronic device of the present application;

[0021] Figure 5 It is a schematic diagram of the structure of an embodiment of a computer-readable storage medium of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0023] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless otherwise clearly indicated above, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0024] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0025] It should be understood that the terms "include", "comprises" or any other variations used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0026] In the related art, electronic devices mainly use heat dissipation components for heat dissipation, and the heat dissipation components are usually arranged in the middle area of ​​the back of the electronic device (the side away from the display screen) to dissipate heat directly into the air through the middle area. When users use electronic devices, they usually hold the electronic devices or clamp the electronic devices with both hands. At this time, only the fingers are in contact with the left and right sides or the upper and lower sides of the electronic device, and the palms are not in direct contact with the back surface of the electronic device. Since the existing technology mainly dissipates heat in the middle area, when using electronic devices in cold winter, it is easy for the weather to be too cold and cause the user's fingers to become stiff.

[0027] Based on the above situation, the present application provides a heat dissipation method for an electronic device, an electronic device and a computer-readable storage medium, which can solve the problem that the prior art cannot keep fingers warm when using electronic devices in winter.

[0028] The heat dissipation method of the electronic device provided in the present application includes: in response to receiving a heat dissipation start instruction, confirming the first area in contact with the electronic device by the current user; wherein the first area is located in the frame area, and a heat dissipation component is arranged in the first area; and heat dissipation is performed through the heat dissipation component of the first area. By confirming the first area in contact with the electronic device by the current user after receiving the heat dissipation start instruction, and dissipating heat through the heat dissipation component of the first area, heat can be released through the frame area in contact with the current user, and then the fingers of the current user are kept warm by the released heat, thereby meeting the user's hand warming needs when using the mobile phone in winter.

[0029] The present application first provides an electronic device.

[0030] Specifically, see Figure 1 , Figure 1 In this embodiment, the electronic device 100 includes a display area (Active area, AA) 40 , a frame area 10 , a heat dissipation component 20 and a processor 30 .

[0031] In this embodiment, the electronic device 100 includes a mobile phone or a tablet.

[0032] In this embodiment, the frame area 10 is disposed around the display area 40, and the heat dissipation component 20 is disposed in the frame area 10. In some embodiments, the heat dissipation component 20 is disposed around the display area 40.

[0033] In some specific embodiments, a plurality of continuous grooves connected end to end are provided in the frame area 10 , and a pattern formed by the plurality of continuous grooves is parallel to four boundary lines of the electronic device 100 , and the heat dissipation component 20 is provided in the plurality of grooves.

[0034] In some other specific embodiments, a plurality of spaced grooves are provided in the border area 10, and a pattern formed by connecting lines of the plurality of spaced grooves is parallel to four boundary lines of the electronic device 100, and the heat dissipation components 20 are respectively provided in the plurality of spaced grooves, which is not limited in the present application.

[0035] In some implementations, the heat dissipation component 20 includes a phase change thermal conductive sheet and / or graphene.

[0036] Among them, the material of the phase change thermal conductive sheet is high thermal conductivity phase change silicone grease. When heated, the high thermal conductivity phase change silicone grease undergoes a solid-liquid phase change, changing from a solid state to a molten state, with stronger fluidity and lower thermal resistance. It has excellent thermal conductivity, extremely low thermal resistance and excellent thermal stability.

[0037] Among them, graphene has excellent thermal conductivity. The thermal conductivity of pure, defect-free single-layer graphene is as high as 5300W / mK, which is higher than single-walled carbon nanotubes (3500W / mK) and multi-walled carbon nanotubes (3000W / mK). When graphene is used as a carrier, the thermal conductivity can reach 600W / mK. In addition, the ballistic thermal conductivity of graphene can lower the lower limit of the ballistic thermal conductivity of carbon nanotubes per unit circumference and length, which is more conducive to its application in the heat dissipation components of electronic devices.

[0038] In some specific embodiments, the heat dissipation component 20 only includes a phase-change heat conductive sheet. In other specific embodiments, the heat dissipation component 20 only includes graphene. In still other specific embodiments, the heat dissipation component 20 includes a phase-change heat conductive sheet and graphene, which is not limited in the present application.

[0039] In this embodiment, the processor 30 is used to determine the first area where the current user is in contact with the electronic device 100 based on the heat dissipation start instruction after receiving the heat dissipation start instruction, and dissipate heat through the heat dissipation component 20 of the first area. The first area is located in the frame area 10.

[0040] In some embodiments, a drop-down shortcut key is provided in the display area 40, and the drop-down shortcut key includes a "hand warming" switch, and the "hand warming" switch includes an "on" button and an "off" button. When the display area 40 detects the user's touch action in the area corresponding to the "on" button, it is determined that the heat dissipation start instruction is received, and the heat dissipation start instruction is transmitted to the processor 30 through the communication circuit, so that after receiving the heat dissipation start instruction, the processor 30 confirms the first area where the current user is in contact with the electronic device 100 based on the heat dissipation start instruction, and dissipates heat through the heat dissipation component 20 in the first area.

[0041] In some implementations, the first area may be a left area and a right area of ​​the frame area 10 , or a top area and a bottom area of ​​the frame area.

[0042] In some specific implementations, if the current user holds the electronic device 100 with one hand, for example, holds a mobile phone with one hand to browse a page, the first area is the left area and the right area of ​​the frame area 10. In other specific implementations, if the current user holds the electronic device with both hands, for example, places the mobile phone horizontally and holds the top area and the bottom area of ​​the mobile phone with both hands respectively, the first area is the top area and the bottom area of ​​the frame area 10.

[0043] In a specific implementation scenario, the current user uses the electronic device 100 to play games in the cold winter. The user places the electronic device 100 horizontally and holds the top area and the bottom area of ​​the electronic device 100 with both hands to perform game operations on the display area 40. In order to avoid stiffness caused by long-term exposure of fingers, the current user selects and turns on the "warm hand" switch from the drop-down shortcut key of the display area 40. When the display area 40 detects the user's touch action in the area corresponding to the "on" button, it is determined that the heat dissipation start instruction is received, and the heat dissipation start instruction is transmitted to the processor 30 through the communication circuit. After receiving the heat dissipation start instruction, the processor 30 confirms that the first area where the current user contacts the electronic device 100 is the top area and the bottom area of ​​the frame area 10 based on the heat dissipation start instruction, and dissipates heat through the heat dissipation components 20 corresponding to the top area and the bottom area of ​​the frame area 10, so as to release the heat generated by the high load during the game through the frame area 10 in contact with the current user, thereby keeping the fingers of the current user warm by the released heat.

[0044] It can be understood that by setting a heat dissipation component 20 in the border area 10 of the electronic device 100, and enabling the processor 30 of the electronic device 100 to confirm the first area in contact with the electronic device 100 by the current user after receiving the heat dissipation start instruction, and dissipating heat through the heat dissipation component 20 in the first area, heat can be released through the border area 10 in contact with the current user, and then the fingers of the current user can be kept warm by the released heat, thereby meeting the user's hand warming needs when using the mobile phone in winter.

[0045] See also Figure 2 , Figure 2 1 is a flow chart of a first embodiment of a heat dissipation method for an electronic device of the present application. In this embodiment, the method includes:

[0046] S11: In response to receiving a heat dissipation start instruction, confirming a first area where the current user is in contact with the electronic device; wherein the first area is located in a frame area, and a heat dissipation component is disposed in the first area.

[0047] In this embodiment, the electronic device includes a mobile phone or a tablet.

[0048] In this embodiment, a drop-down shortcut key is provided in the display area, and the drop-down shortcut key includes a "hand warmer" switch. The "hand warmer" switch includes an "on" button and an "off" button. In response to detecting a user's touch action in the area corresponding to the "on" button, it is determined that a heat dissipation on instruction has been received.

[0049] Further, a specific position of the frame area where the current user touches the electronic device is confirmed, and the specific position is determined as the first area.

[0050] In a specific implementation scenario, if the current user holds the electronic device with one hand, the corresponding sensors (such as pressure sensors, capacitive sensors, etc.) can detect that the user is in contact with the left and right areas of the border area. At this time, the left and right areas of the border area are determined as the first area.

[0051] In another specific implementation scenario, if the current user holds the electronic device with both hands, for example, places the mobile phone horizontally and holds the top area and the bottom area of ​​the mobile phone with both hands respectively, then the corresponding sensors can detect that the user is in contact with the top area and the bottom area of ​​the border area. At this time, the top area and the bottom area of ​​the border area are determined as the first area.

[0052] In this embodiment, the heat dissipation component includes a phase change thermal conductive sheet and / or graphene.

[0053] In some specific embodiments, the heat dissipation component only includes a phase-change heat conductive sheet. In other specific embodiments, the heat dissipation component only includes graphene. In still other specific embodiments, the heat dissipation component includes a phase-change heat conductive sheet and graphene, which is not limited in the present application.

[0054] S12: dissipating heat through the heat dissipation component in the first region.

[0055] In this embodiment, the heat generated by the operation of the internal components of the electronic device is continuously transmitted to the heat dissipation component of the first area through the heat dissipation system of the electronic device, so that the heat is released through the heat dissipation component.

[0056] In some implementations, heat is dissipated through the phase change thermal conductive sheet and / or graphene in the first region.

[0057] In some specific embodiments, the heat dissipation component of the first region only includes a phase-change thermal conductive sheet, and the heat is released through the phase-change thermal conductive sheet. In other specific embodiments, the heat dissipation component of the first region only includes graphene, and the heat is released through the graphene. In some other specific embodiments, the heat dissipation component of the first region includes a phase-change thermal conductive sheet and graphene, and the heat is released through the phase-change thermal conductive sheet and graphene, which is not limited in this application.

[0058] In a specific implementation scenario, the current user uses an electronic device to play games in the cold winter. The user places the electronic device horizontally and holds the top area and the bottom area of ​​the electronic device with both hands to perform game operations on the display area. In order to avoid stiffness caused by long-term exposure of fingers, the current user selects and turns on the "hand warming" switch from the drop-down shortcut key of the display area. In response to detecting the user's touch action in the area corresponding to the "turn on" button, it is determined that a heat dissipation turn-on instruction is received, and then based on the heat dissipation turn-on instruction, it is confirmed that the first area in contact with the electronic device by the current user is the top area and the bottom area of ​​the frame area, and the heat is dissipated through the phase change thermal conductive sheet and / or graphene corresponding to the top area and the bottom area of ​​the frame area, so as to release the heat generated by the high load of the CPU during the game through the frame area in contact with the current user, thereby keeping the current user's fingers warm by the released heat.

[0059] In this embodiment, the heat dissipation method further includes: in response to receiving a heat dissipation shutdown instruction, stopping heat dissipation through the corresponding heat dissipation component in the first area.

[0060] Specifically, in response to detecting a touch action of the user in the area corresponding to the “off” button, it is determined that a heat dissipation on instruction is received.

[0061] Different from the prior art, this embodiment confirms the first area in contact with the electronic device by the current user after receiving the heat dissipation start command, and dissipates heat through the heat dissipation components in the first area. It can release heat through the border area in contact with the current user, and then keep the current user's fingers warm through the released heat, thereby meeting the user's hand warming needs when using the mobile phone in winter.

[0062] See also Figure 3 , Figure 3 1 is a flow chart of a second embodiment of the heat dissipation method for an electronic device of the present application. In this embodiment, the method includes:

[0063] S21: In response to receiving a heat dissipation start instruction, confirming a first area where the current user is in contact with the electronic device; wherein the first area is located in a frame area, and a heat dissipation component is disposed in the first area.

[0064] For the specific process, please refer to the description in S11 and will not be repeated here.

[0065] S22: dissipating heat through the heat dissipation component in the first region.

[0066] In some embodiments, the electronic device further includes a second area connected to the first area, and the second area is located on a surface of the electronic device facing away from the display area, wherein the second area is the rear surface of the electronic device, that is, a conventional heat dissipation area of ​​the electronic device.

[0067] In some embodiments, after receiving the heat dissipation start instruction, the heat dissipation of the second area is transferred to the first area through the heat dissipation system of the electronic device to increase the heat dissipation of the first area. In some specific embodiments, the heat dissipation of the second area can be transferred to the first area through a heat pipe connecting the second area and the first area.

[0068] In this embodiment, after the "hand warming" function is turned on, the power of the CPU and the heat conduction function of other components are not limited.

[0069] It can be understood that by providing a heat dissipation component in the frame area, heat can be dissipated through the heat dissipation component in the frame area without affecting the heat dissipation of the second area, thereby enhancing the heat dissipation efficiency of the electronic device and simultaneously realizing the hand warming function.

[0070] S23: In response to detecting that the temperature of the first area is higher than a preset temperature, reducing the heat dissipation of the first area.

[0071] In this embodiment, the temperature of the first area is detected in real time by a temperature sensor.

[0072] In this embodiment, the preset temperature is set based on the human body temperature. For example, if the human body temperature feels warm at 45 degrees and feels hot when it exceeds 45 degrees, the preset temperature can be set to 45 degrees.

[0073] In some embodiments, in response to detecting that the temperature of the first region is higher than a preset temperature, the heat dissipation of the first region is reduced by reducing the operating frequency and / or load of the corresponding heat dissipation component in the first region.

[0074] In some other embodiments, in response to detecting that the temperature of the first area is higher than a preset temperature, the heat dissipation of the first area is reduced by closing the heat pipe connected to the corresponding heat dissipation component in the first area.

[0075] In some other embodiments, in response to detecting that the temperature of the first area is higher than a preset temperature, the heat dissipation of the first area is conducted to the second area through the heat dissipation system of the electronic device, and the operating frequency and / or load of the corresponding heat dissipation component in the second area is increased, thereby reducing the heat dissipation of the first area.

[0076] In some other embodiments, in response to detecting that the temperature of the first area is higher than a preset temperature, heat dissipation through the corresponding heat dissipation component in the first area is stopped, thereby reducing the heat dissipation amount of the first area.

[0077] It can be understood that by reducing the heat dissipation of the first area through the above method, the electronic device can be protected from overheating, thereby improving the safety of heat dissipation.

[0078] See also Figure 4 , Figure 4It is a workflow diagram of an application scenario of a heat dissipation method of an electronic device of the present application. In this embodiment, the current user uses an electronic device to play games in a cold winter. The user places the electronic device horizontally and clamps the top area and the bottom area of ​​the electronic device with both hands to perform game operations on the display area. In order to avoid stiffness caused by long-term exposure of fingers, the current user selects and turns on the "warm hands" switch from the drop-down shortcut key of the display area. In response to detecting the touch action of the user in the area corresponding to the "turn on" button, it is determined that the heat dissipation turn-on instruction is received, and then based on the heat dissipation turn-on instruction, it is confirmed that the first area in contact with the current user and the electronic device is the top area and the bottom area of ​​the frame area, and the heat is dissipated through the phase change thermal conductive sheet and / or graphene corresponding to the top area and the bottom area of ​​the frame area, so as to release the heat generated by the high load of the CPU during the game through the frame area in contact with the current user, thereby keeping the fingers of the current user warm through the released heat. Further, the temperature of the first area is detected in real time by a temperature sensor. In response to detecting that the temperature of the first area is higher than the preset temperature, the heat dissipation of the first area is reduced. Among them, the way to reduce the heat dissipation of the first area includes stopping the heat dissipation through the corresponding heat dissipation component in the first area. Alternatively, in response to detecting a user's touch action in the area corresponding to the "off" button, it is determined that a heat dissipation start instruction has been received, and heat dissipation through the corresponding heat dissipation component in the first area is stopped.

[0079] Different from the prior art, this embodiment confirms the first area that the current user is in contact with the electronic device after receiving the heat dissipation start instruction, and dissipates heat through the heat dissipation component of the first area, so that the heat can be released through the frame area that is in contact with the current user, and then the released heat can be used to warm the fingers of the current user, thereby meeting the user's need to warm his hands when using the mobile phone in winter. Furthermore, since the frame area is added for heat dissipation, the overall heat dissipation efficiency of the electronic device can also be enhanced.

[0080] Correspondingly, the present application provides a computer-readable storage medium.

[0081] See also Figure 5 , Figure 5 It is a schematic diagram of the structure of an embodiment of a computer-readable storage medium of the present invention.

[0082] The computer-readable storage medium 50 includes a computer program 501 stored on the computer-readable storage medium 50, and the computer program 501 implements the steps in the heat dissipation method of the electronic device as described above when executed by the above-mentioned processor. Specifically, if the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium 50. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a computer-readable storage medium 50, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (processor) to perform all or part of the steps of each embodiment of the present application. The aforementioned computer-readable storage medium 50 includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0083] In the several embodiments provided in the present application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0084] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0085] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0086] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program code.

[0087] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation method for an electronic device, characterized in that: include: In response to receiving a heat dissipation start instruction, confirming a first area where the current user is in contact with the electronic device; wherein the first area is located in a frame area, and a heat dissipation component is disposed in the first area; Heat is dissipated through the heat dissipation component in the first area.

2. The heat dissipation method according to claim 1, characterized in that: The step of dissipating heat through the heat dissipation component in the first area includes: The heat generated by the operation of the internal components of the electronic device is continuously transmitted to the heat dissipation component of the first area through the heat dissipation system of the electronic device, so that the heat is released through the heat dissipation component.

3. The heat dissipation method according to claim 1, characterized in that: The heat dissipation component includes a phase change heat conductive sheet and / or graphene; The step of dissipating heat through the heat dissipation component in the first area includes: Heat is dissipated through the phase-change thermal conductive sheet and / or the graphene in the first region.

4. The heat dissipation method according to claim 1, characterized in that: After the step of dissipating heat through the heat dissipation component in the first area, the method further comprises: In response to detecting that the temperature of the first area is higher than a preset temperature, the heat dissipation of the first area is reduced.

5. The heat dissipation method according to claim 4, characterized in that: In response to detecting that the temperature of the first area is higher than a preset temperature, the step of reducing the heat dissipation of the first area comprises: reducing the operating frequency and / or load of the corresponding heat dissipation component in the first area; Or, the heat pipe connected to the corresponding heat dissipation component in the first area is closed.

6. The heat dissipation method according to claim 1, characterized in that: The electronic device comprises a second area connected to the first area; wherein the second area is located on a side surface of the electronic device away from the display area; The step of dissipating heat through the heat dissipation component in the first area includes: The heat dissipation of the second area is transmitted to the first area through the heat dissipation system of the electronic device, so as to increase the heat dissipation of the first area.

7. The heat dissipation method according to claim 6, characterized in that: After the step of dissipating heat through the heat dissipation component in the first area, the method further comprises: In response to detecting that the temperature of the first area is higher than a preset temperature, the heat dissipation of the first area is conducted to the second area through the heat dissipation system of the electronic device, and the operating frequency and / or load of the corresponding heat dissipation component in the second area is increased.

8. The heat dissipation method according to claim 1, characterized in that: After the step of dissipating heat through the heat dissipation component in the first area, the method further comprises: In response to receiving the heat dissipation shut-off instruction, the heat pipe connected to the corresponding heat dissipation component in the first area is shut off.

9. An electronic device, characterized in that: include: A heat generating component is arranged in the frame area; The processor is used to, after receiving a heat dissipation start instruction, confirm a first area where the current user is in contact with the electronic device based on the heat dissipation start instruction, and dissipate heat through the heat dissipation component in the first area; wherein the first area is located in the border area.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the heat dissipation method for an electronic device according to any one of claims 1 to 8 are implemented.

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