Electronic device

Abstract

The application discloses an electronic device, which comprises a screen module and a circuit board assembly. The circuit board assembly comprises a circuit board, an electronic device and a cover layer. The electronic device is arranged on the circuit board. The cover layer comprises an insulating layer attached to the electronic device and a shielding layer attached to the insulating layer. The insulating layer is used for insulating and separating the shielding layer from the electronic device. The screen module has a first grounding area. The part of the insulating layer opposite to the first grounding area comprises a plurality of convex hulls. The shielding layer comprises a plurality of convex hull covering parts. The plurality of convex hull covering parts cover the plurality of convex hulls and form a plurality of grounding electrical connection protrusions with the plurality of convex hulls respectively. The plurality of grounding electrical connection protrusions have equal heights. The circuit board has a second grounding area. The plurality of convex hull covering parts are in electrical contact with the first grounding area. The shielding layer is in electrical connection with the second grounding area. The above scheme can solve the problem that the shielding layer in the related electronic device is difficult to stably realize shielding grounding.

Description

Technical Field

[0001] This application belongs to the field of electronic device design technology, and specifically relates to an electronic device. Background Technology

[0002] With the continuous development of the information society and the increasing demands of users, electronic devices (such as mobile phones and tablets) are becoming increasingly functional. To provide these functions, electronic devices are integrating more and more electronic components. At the same time, electronic devices are integrating functions such as high-frequency wireless communication and high-speed signal processing; therefore, the requirements for electromagnetic shielding of electronic components will always exist and will become increasingly stringent.

[0003] To prevent electronic devices from being subjected to electromagnetic interference, the related technologies involve electronic devices equipped with shielding covers to achieve electromagnetic shielding. Specifically, the shielding cover covers the corresponding electronic devices. However, the shielding cover is relatively tall and, because it is made of metal, cannot make contact with the electronic devices, which leads to a relatively large thickness of the electronic devices, ultimately hindering the design of thinner electronic devices.

[0004] To alleviate this problem, related technologies have further designed an electronic device in which a shielding layer is wrapped around the electronic components. Compared to a shielding cover, the shielding layer can fit tightly against the electronic components, thus not occupying too much space in the thickness direction of the electronic device, which is conducive to the design of the electronic device to be thinner.

[0005] The shielding enclosure mentioned above not only serves a shielding function but also grounds the screen module of the electronic device. Specifically, conductive components, such as conductive foam, are placed in the gap between the screen module and the shielding enclosure. The screen module is electrically connected to the grounding area inside the electronic device through the conductive foam and the shielding enclosure in sequence. However, in the electronic devices involved in this technology, the electronic components cannot adequately support the conductive components, leading to unstable grounding of the screen module. Moreover, the conductive foam has poor elasticity and cannot effectively alleviate the pressure applied by the screen module, resulting in the electronic components being subjected to excessive pressure and easily damaged. Summary of the Invention

[0006] This invention discloses an electronic device to solve the problem that the shielding layer in related electronic devices is difficult to stably achieve shielding grounding.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: This application discloses an electronic device, which includes a screen module and a circuit board assembly. The circuit board assembly includes a circuit board, electronic devices, and a cover layer. The electronic devices are disposed on the circuit board. The cover layer includes an insulating layer attached to the electronic devices and a shielding layer attached to the insulating layer. The insulating layer is used to insulate and isolate the shielding layer from the electronic devices. The screen module has a first grounding area. The portion of the insulating layer opposite to the first grounding area includes multiple protrusions. The shielding layer includes multiple protrusion-covered portions. The multiple protrusion-covered portions cover the multiple protrusions and respectively form multiple grounding electrical connection protrusions with the multiple protrusions. The multiple grounding electrical connection protrusions are of equal height. The circuit board has a second grounding area. The multiple protrusion-covered portions are all electrically in contact with the first grounding area. The shielding layer is electrically connected to the second grounding area.

[0008] The technical solution adopted in this invention can achieve the following technical effects: The electronic device disclosed in this invention improves the structure of the cover layer, enabling it to form multiple grounding connection protrusions of equal height. The protrusions of these protrusions directly contact and connect with the first grounding area, thus forming multiple grounding connections. In this structure, the equal height of the protrusions and their direct contact with the first grounding area improves the stability of the grounding connections. This structure eliminates the need for intermediate components such as conductive foam, avoiding grounding instability caused by the cover layer's inability to form a flat support surface, which could lead to insufficient support for conductive components. Furthermore, the multiple grounding connection protrusions are spaced apart, with gaps between adjacent protrusions. This makes the overall structure resemble a porous electrical connection structure, providing better elastic cushioning compared to denser conductive foam. This helps absorb pressure from the screen module, reducing the adverse effects of this pressure on electronic devices and minimizing damage. Attached Figure Description

[0009] Figure 1 This is a cross-sectional view of a partial structure of an electronic device disclosed in an embodiment of the present invention; Figure 2 This is a cross-sectional view of a partial structure of another electronic device disclosed in an embodiment of the present invention.

[0010] Explanation of reference numerals in the attached figures: 10-Screen module, 11-Screen, 12-Flexible circuit board, 121-First contact area 20-Circuit board assembly, 21-Circuit board, 22-Electronic component, 23-Covering layer, 231-Insulating layer, 2311-Bump, 2312-Void, 2313-Planing layer, 232-Shielding layer, 2321-Bump-covered area 30-Electrical connector, 40 - Housing, 50 - Equipment cavity. Detailed Implementation

[0011] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0012] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0013] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0014] Please refer to Figures 1 to 2 This application discloses an electronic device, which includes a screen module 10 and a circuit board assembly 20.

[0015] The screen module 10 is a display module of an electronic device, and the screen module 10 has a first contact area 121. The electronic device usually also includes a housing 40, the screen module 10 is connected to the housing 40, and the screen module 10 and the housing 40 form a device cavity 50, and the circuit board assembly 20 is disposed in the device cavity 50.

[0016] The circuit board assembly 20 includes a circuit board 21, electronic components 22, and a cover layer 23. The circuit board 21 can be the motherboard of an electronic device, a sub-board of an electronic device, or any other circuit board within the electronic device besides the sub-board or motherboard; this embodiment of the invention does not impose any limitations. The electronic components 22 are disposed on the circuit board 21, thereby enabling their installation on the circuit board 21 and achieving electrical connection between the electronic components 22 and the circuit board 21. Specifically, the electronic components 22 can be mounted on the circuit board 21 using methods such as soldering or surface mount technology.

[0017] The cover layer 23 is used to cover the electronic device 22 in an adhesive manner. Specifically, the cover layer 23 can cover one electronic device 22 or multiple electronic devices 22, which is not limited in this embodiment of the invention. Of course, the cover layer 23 also covers the corresponding area of ​​the circuit board 21. The cover layer 23 includes an insulating layer 231 and a shielding layer 232. The insulating layer 231 is formed of an insulating material (e.g., insulating adhesive) and performs an insulating function. The shielding layer 232 is formed of a metallic material (e.g., copper, aluminum, silver, etc.) and not only performs a shielding function but also a conductive function to achieve the grounding connection described later. The insulating layer 231 is adhered to and covers the electronic device 22, and the shielding layer 232 is adhered to and covers the insulating layer 231. The insulating layer 231 is located between the shielding layer 232 and the electronic device 22 and serves to insulate and isolate the shielding layer 232 from the electronic device 22.

[0018] The portion of the insulating layer 231 opposite to the first grounding area 121 includes multiple protrusions 2311. The shielding layer 232 includes multiple protrusion-covering portions 2321, which are local structures on the shielding layer 232 used to cover the protrusions 2311. The multiple protrusion-covering portions 2321 covering the multiple protrusions 2311 on the shielding layer 232 form multiple grounding connection protrusions with the multiple protrusions 2311. The multiple grounding connection protrusions are of equal height, spaced apart, and do not contact each other, thus allowing a gap to be formed between adjacent grounding connection protrusions. For example, one protrusion-covering portion 2321 covers a corresponding protrusion 2311, thereby forming one grounding connection protrusion.

[0019] The circuit board 21 has a second grounding area. This second grounding area can be a copper-exposed area on the circuit board 21. The raised portions 2321 of the multiple grounding connection protrusions are all in electrical contact with the first grounding area 121, and the shielding layer 232 is electrically connected to the second grounding area. Since the raised portions 2321 are part of the shielding layer 232, they are conductive. In this case, the first grounding area 121 of the screen module 10 is electrically connected to the second grounding area through the multiple grounding connection protrusions, ultimately achieving grounding of the screen module 10.

[0020] The electronic device disclosed in this invention improves the structure of the cover layer 23, enabling it to form multiple grounding connection protrusions of equal height. The protrusions 2321 of these protrusions directly contact and connect with the first grounding area 121, thus forming multiple grounding connections. In this structure, the equal height of the multiple grounding connection protrusions and their direct contact with the first grounding area 121 improves the stability of the grounding connections. This structure eliminates the need for intermediate components such as conductive foam, thus avoiding grounding instability caused by the cover layer 23's inability to form a flat support surface, which would otherwise result in inadequate support for conductive components. Meanwhile, multiple grounding electrical connection protrusions are spaced apart, with gaps between adjacent grounding electrical connection protrusions. This makes the overall structure formed by the multiple grounding electrical connection protrusions resemble an electrical connection structure with larger pores. Therefore, compared to denser conductive foam, this electrical connection structure has better elastic buffering function, which can alleviate and absorb the pressure applied by the screen module 10, thereby reducing the adverse effects of this pressure on the electronic device 22 and making the electronic device 22 less prone to damage.

[0021] As described above, there can be multiple electronic devices 22. In embodiments where there are multiple electronic devices 22, the device area of ​​the electronic device 22 opposite to the multiple ground connection protrusions can be larger than the device area of ​​electronic devices 22 at other locations on the circuit board 21. It should be noted that the device area refers to the area of ​​the surface of the electronic device facing away from the circuit board 21. Other locations on the circuit board 21 refer to the areas on the circuit board 21 excluding the area opposite to the first grounding area 121. In this embodiment, the area on the cover layer 23 where multiple ground connection protrusions are formed covers the electronic device with a larger device area, which helps to better distribute the pressure applied by the screen module 10, making the electronic device 22 less prone to damage. Moreover, when the cover layer 23 is provided on such a large-area electronic device 22, it is easier to design and form multiple ground connection protrusions of equal height in the corresponding area of ​​the cover layer 23.

[0022] In other embodiments, there are multiple electronic devices 22, and the height difference between electronic devices 22 opposite to the multiple ground connection protrusions can be smaller than the height difference between electronic devices 22 at other locations on the circuit board 21. This structure allows the corresponding area of ​​the cover layer 23 to be flatter, making it easier to design and form multiple ground connection protrusions of equal height.

[0023] In this embodiment of the invention, the insulating layer 231 can be an insulating film, and similarly, the shielding layer 232 can also be a shielding film. To make it easier to design the insulating layer 231 to have different thicknesses in different locations, in other embodiments, the insulating layer 231 can be a coated insulating layer, and similarly, the shielding layer 232 can be a coated shielding layer. The coated insulating layer can be formed by applying, spraying, or other methods to achieve the layering of insulating material. The shielding layer 232 can be formed by applying, spraying, or other methods to achieve the layering of shielding material (e.g., metal powder).

[0024] In this embodiment of the invention, the multiple grounding connection protrusions may be unevenly distributed. To achieve balanced force distribution, the multiple grounding connection protrusions may be evenly distributed.

[0025] To further improve the elasticity of the electrical connection structure formed by multiple grounding electrical connection protrusions, in a further embodiment, a cavity 2312 may be provided in the protrusion 2311. And / or, a cavity 2312 may be provided on the portion of the insulating layer 231 opposite to the protrusion 2311. That is, at least one of the protrusion 2311 and the portion of the insulating layer 231 opposite to the protrusion 2311 has a cavity 2312. The opening of the cavity 2312 allows the area on the cover layer 23 opposite to the first grounding area 121 to have a larger porosity, thereby further improving the elastic buffering performance of the electrical connection structure and achieving better absorption of the pressure applied by the screen module 10.

[0026] In this embodiment of the invention, the portion of the insulating layer 231 opposite to the first grounding area 121 may further include a planarization layer 2313. The surface of the planarization layer 2313 facing the first grounding area 121 is relatively flat, and multiple protrusions 2311 may be provided on the planarization layer 2313. Specifically, the multiple protrusions 2311 and the planarization layer 2313 are an integral structure. The portion of the planarization layer 2313 opposite to the multiple protrusions 2311 may be provided with the aforementioned openings 2312. In one embodiment, the surface of the planarization layer 2313 facing the first grounding area 121 is flat, thereby making it easier to achieve equal heights for the multiple grounding connection protrusions.

[0027] This invention does not limit the number of cavities 2312 corresponding to each convex bulge 2311, nor does it limit the size of the cavities 2312. In the actual production process, the thickness of the planarization layer 2313 at different locations may not be entirely equal. Therefore, in one embodiment, the size of the cavity 2312 can be proportional to the thickness of the corresponding portion of the planarization layer 2313. That is, areas with a larger thickness of the planarization layer 2313 can have larger cavities 2312, thereby improving the elastic buffering performance of the thicker areas.

[0028] In other embodiments, the number of voids 2312 can be proportional to the thickness of the opposite portion of the planarization layer 2313. That is, more voids 2312 can be provided in areas with a larger thickness of the planarization layer 2313, thereby improving the elastic buffering performance of the areas with a larger thickness.

[0029] In this embodiment of the invention, the screen module 10 may include a screen 11 and a flexible circuit board 12. The screen 11 is the display body of the screen module 10. The screen 11 can be an LCD (Liquid Crystal Display) screen or an OLED (Organic Light-Emitting Diode) screen. This embodiment of the invention does not limit the specific type of screen 11. The first end of the flexible circuit board 23 can be attached to the back of the screen 11. The second end of the flexible circuit board 12 is electrically connected to the circuit board 21 via an electrical connector 30. The electrical connector 30 can be a board-to-board electrical connector. The flexible circuit board 12 enables the circuit board 21 to provide power and electrical control to the screen module 10. The flexible circuit board 12 may include a first contact area 121, located at the first end of the flexible circuit board 12. Of course, in other embodiments, the first contact area 121 can be formed on the back of the screen 11 by coating. This embodiment of the invention does not limit the specific formation method of the first contact area 121.

[0030] The electronic devices disclosed in this application can be smartphones, tablets, e-book readers, wearable devices (such as smartwatches), video game consoles, VR (Virtual Reality) glasses, etc. This application does not limit the specific types of electronic devices.

[0031] To facilitate understanding of the structure described above, this embodiment of the invention discloses a method for manufacturing a circuit board assembly 20. The forming process of the circuit board assembly 20 is illustrated below by way of example. The manufacturing method includes: Larger electronic devices 22 or multiple electronic devices 22 of equal height are arranged close together on the circuit board 21 at the location opposite the first contact area 121.

[0032] An insulating layer 231 is provided on the area where the electronic device 22 is located on the circuit board 21, so that the insulating layer 231 is attached to and covers the electronic device 22. The thickness of the portion of the insulating layer 231 opposite to the first contact area 121 is increased to a preset thickness by local dispensing of adhesive (adhesive forming the insulating layer 231) or the amount of adhesive. The preset thickness is larger than the thickness of other areas of the insulating layer 231, so that the insulating layer 231 of the preset thickness can form the planarization layer 2313 mentioned above.

[0033] Apply adhesive locally to the portion of the insulating layer 231 opposite to the first contact area 121 to form multiple bumps 2311.

[0034] Clean the areas on the circuit board 21 that do not need to be covered by the insulating layer 231 to remove the corresponding portions of the insulating layer 231.

[0035] A shielding layer 232 is coated on the insulating layer 231, and the shielding layer 232 is electrically connected to the second grounding area on the circuit board 21. The shielding layer 232 is attached to and covers the insulating layer 231. Specifically, the electrical connection between the shielding layer 232 and the second grounding area can be achieved by means of welding, conductive adhesive bonding, etc.

[0036] During the assembly of the electronic device, the grounding connection protrusion formed by covering multiple protrusions 2311 with the shielding layer 232 makes electrical contact with the first grounding area 121, thereby achieving electrical connection between the shielding layer 232 and the first grounding area 121. Since the shielding layer 232 is electrically connected to the second grounding area, and at the same time, the shielding layer 232 is in electrical contact with the first grounding area 121, the first grounding area 121 achieves electrical connection with the second grounding area through the shielding layer 232, ultimately realizing the grounding connection between the screen module 10 and the circuit board 21.

[0037] In other embodiments, during the formation of multiple protrusions 2311 or the formation of the portion on the insulating layer 231 opposite to the first contact area 121, the amount of adhesive applied or the amount of adhesive dispensed can be controlled, thereby forming the aforementioned cavity 2312. It should be noted that in this embodiment of the invention, the cavity 2312 can be an open structure, meaning the cavity 2312 is connected to the external environment. In this case, the cavity 2312 can be considered a through-hole or a blind hole. In other embodiments, the cavity 2312 can also be a sealed cavity structure. This structure not only improves the elastic buffering performance of the electrical connection structure, thereby alleviating the pressure exerted on the electronic device 22 by the screen module 10, but also makes the electrical connection structure less susceptible to crushing by the screen module 10, ensuring both elastic buffering and stable electrical contact.

[0038] In this embodiment of the invention, the insulating layer 231 and the shielding layer 232 can be formed by 3D coating technology, board-level packaging technology, or film layer bonding process. This embodiment of the invention does not impose any limitations.

[0039] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0040] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. An electronic device, characterized in that, The device includes a screen module (10) and a circuit board assembly (20), wherein the circuit board assembly (20) includes a circuit board (21), an electronic device (22) and a cover layer (23), the electronic device (22) is disposed on the circuit board (21), and the cover layer (23) includes an insulating layer (231) attached to the electronic device (22) and a shielding layer (232) attached to the insulating layer (231), the insulating layer (231) is used to insulate and isolate the shielding layer (232) from the electronic device (22); The screen module (10) has a first grounding area (121). The portion of the insulating layer (231) opposite to the first grounding area (121) includes multiple protrusions (2311). The shielding layer (232) includes multiple protrusion-covered portions (2321). The multiple protrusion-covered portions (2321) cover the multiple protrusions (2311) and form multiple grounding electrical connection protrusions with the multiple protrusions (2311). The multiple grounding electrical connection protrusions are of equal height. The circuit board (21) has a second grounding area. The multiple protrusion-covered portions (2321) are all in electrical contact with the first grounding area (121). The shielding layer (232) is electrically connected to the second grounding area. The plurality of grounding electrical connection protrusions are spaced apart, and a gap is formed between two adjacent grounding electrical connection protrusions, so that the whole formed by the plurality of grounding electrical connection protrusions is an electrical connection structure with pores; The convex bulge (2311) has a cavity (2312); or, the insulating layer (231) has a cavity (2312) at the part opposite to the convex bulge (2311).

2. The electronic device according to claim 1, characterized in that, The portion of the insulating layer (231) opposite to the first contact area (121) also includes a flat layer (2313), the plurality of protrusions (2311) are disposed on the flat layer (2313), and the portion of the flat layer (2313) opposite to the plurality of protrusions (2311) is provided with the cavity (2312).

3. The electronic device according to claim 2, characterized in that, The size of the cavity (2312) is proportional to the thickness of the opposite portion of the flat layer (2313).

4. The electronic device according to claim 2, characterized in that, The number of voids (2312) is proportional to the thickness of the opposite portion of the flat layer (2313).

5. The electronic device according to claim 1, characterized in that, There are multiple electronic devices (22), and the device area of ​​the electronic device (22) opposite to the multiple grounding electrical connection protrusions is larger than the device area of ​​the electronic device (22) at other locations on the circuit board (21).

6. The electronic device according to claim 1, characterized in that, There are multiple electronic devices (22), and the height difference between the electronic devices (22) opposite to the multiple grounding electrical connection protrusions is smaller than the height difference between the electronic devices (22) at other locations on the circuit board (21).

7. The electronic device according to claim 1, characterized in that, The insulating layer (231) is a coated insulating layer, and the shielding layer (232) is a coated shielding layer.

8. The electronic device according to claim 1, characterized in that, The multiple grounding electrical connection protrusions are evenly distributed.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The screen module (10) includes a screen (11) and a flexible circuit board (12). The first end of the flexible circuit board (12) is attached to the back of the screen (11), and the second end of the flexible circuit board (12) is electrically connected to the circuit board (21) through an electrical connector (30). The flexible circuit board (12) includes the first contact area (121).

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