Array substrate and broken line repairing method thereof, display panel and display device
By setting a cutout area and repair lines in the common electrode layer of the array substrate, broken data lines can be repaired directly in the display area, solving the problems of limited number of rescue lines and large area occupied by operational amplifiers in the prior art, and realizing efficient repair of data lines and integration and miniaturization of the panel.
Patent Information
- Application Number
- CN202411369766.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2044-09-27
AI Technical Summary
In existing technologies, when a data cable breaks, the number of rescue lines is limited, the rescue line loop is long, and additional operational amplifiers are needed, which occupy a large area and are costly. This makes it impossible to effectively repair multiple data cables, affecting the integration and miniaturization of the display panel.
A cutout area is set in the common electrode layer of the array substrate, and multiple repair lines are set on the side away from the substrate. The broken data line is directly repaired by forming a conductive path on both sides of the break point, avoiding the need to set up a large loop rescue line outside the display area and reducing the use of operational amplifiers.
It enables direct repair of broken data lines within the display area without increasing loop length or impedance differences, avoiding occupying circuit board layout area, improving the integration and miniaturization of the array substrate, and preventing vertical black screens on the display panel.
Smart Images

Figure CN119317180A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to an array substrate and a method for repairing broken wires thereof, a display panel and a display device. Background Art
[0002] In LCD display screens, as the resolution of the display screen becomes higher and higher, the number of data lines also increases. Any data line breakage will cause the display screen to produce a vertical black screen abnormality, and the yield rate is low. The current method for repairing data lines usually adopts a method of using the wiring located at the periphery of the display area connected to the source driver chip as a rescue line, and the end of the broken data line without signal input is secondary connected to the source driver chip through the rescue line. Since the rescue line has a long path and a large impedance, it is usually necessary to set an operational amplifier integrated circuit on the circuit board for signal amplification. However, in this repair method, there is usually only one rescue line for repairing the data line, and it is impossible to repair multiple data lines; the operational amplifier integrated circuit occupies a large layout area of the circuit board, and the cost is high, which is not conducive to the integration and miniaturization of the display panel. Summary of the invention
[0003] In view of the shortcomings of the related art, the present application proposes an array substrate and a disconnection repair method thereof, a display panel and a display device, so as to solve the problems in the related art that when repairing disconnection of data lines, the number of rescue lines is limited, the rescue line loop is long, and an operational amplifier needs to be added, which occupies a large area or is costly.
[0004] An embodiment of the present application provides an array substrate, including a display area, wherein the array substrate includes:
[0005] substrate;
[0006] A plurality of data lines are located at one side of the substrate, the data lines include a broken data line; the broken data line has a breakpoint and a first repair point and a second repair point located at both sides of the breakpoint, and the broken data line is disconnected at the breakpoint;
[0007] A first insulating layer, located on a side of the plurality of data lines away from the substrate;
[0008] a common electrode layer, located on a side of the first insulating layer away from the plurality of data lines, the common electrode layer being provided with a plurality of hollow areas located in the display area; an orthographic projection of each of the data lines on the substrate and an orthographic projection of one of the hollow areas on the substrate having an overlapping area;
[0009] A plurality of repair lines are located on a side of the first insulating layer away from the substrate, and at least a portion of an orthographic projection of each of the repair lines on the substrate is located in one of the overlapped regions; the repair lines include a breakpoint repair line; the orthographic projection of the first repair point on the substrate and the orthographic projection of the second repair point on the substrate both fall within the orthographic projection of the breakpoint repair line on the substrate;
[0010] The first conductive part and the second conductive part both penetrate the first insulating layer, and their orthographic projections on the substrate are both located within the corresponding hollow area and the corresponding orthographic projection of the breakpoint repair line on the substrate; the two ends of the first conductive part are respectively connected to the first repair point and the breakpoint repair line, and the two ends of the second conductive part are respectively connected to the second repair point and the breakpoint repair line.
[0011] In some embodiments, the array substrate also includes a non-display area located on one side of the display area, the common electrode layer includes a plurality of common electrodes located in the display area and arranged in parallel and a common voltage line located in the non-display area, each of the hollow areas is located between two adjacent common electrodes; each of the common electrodes is connected to the common voltage line.
[0012] In some embodiments, the breakpoint repair line includes a repair segment and a segment spaced apart from the repair segment, and the first conductive portion and the second conductive portion are respectively connected to the repair segment; the portions of the multiple repair lines other than the repair segment are all electrically connected to the common voltage line.
[0013] In some embodiments, the orthographic projection of each of the repair lines on the substrate is located within the orthographic projection of one of the data lines on the substrate; and / or,
[0014] The orthographic projection of each of the data lines on the substrate falls within the orthographic projection of one of the hollow areas on the substrate.
[0015] In some embodiments, the array substrate also includes a pixel electrode layer located on a side of the common electrode layer away from the substrate, and the pixel electrode layer is provided with a plurality of spaced pixel electrodes; the orthographic projection of the pixel electrode on the substrate does not overlap with the orthographic projection of the first conductive portion on the substrate and the orthographic projection of the second conductive portion on the substrate.
[0016] In some embodiments, the array substrate also includes an auxiliary layer, which is arranged on a side of the common electrode layer away from the substrate, the orthographic projection of the auxiliary layer on the substrate and the orthographic projection of the hollow area on the substrate do not overlap, and the auxiliary layer is electrically connected to the common electrode layer.
[0017] In some embodiments, the auxiliary layer and the plurality of repair lines are disposed in the same layer.
[0018] In some embodiments, the array substrate also includes a second insulating layer located on the side of the first insulating layer away from the substrate; each of the repair lines is located in one of the hollow areas and in contact with the first insulating layer, and at least a portion of the second insulating layer is located in the gap between the common electrode layer and the repair line.
[0019] In some embodiments, the array substrate further includes a second insulating layer located on a side of the first insulating layer away from the substrate; each of the repair lines is disposed on a side of the second insulating layer away from the first insulating layer, and at least a portion of the second insulating layer is located within each of the hollow areas.
[0020] In some embodiments, the material of the first conductive portion includes a carbonized material;
[0021] And / or, the material of the second conductive part includes carbonized material.
[0022] The present application also provides a method for repairing a broken line of an array substrate, wherein the array substrate comprises a display area; the array substrate comprises a substrate and a plurality of data lines, a first insulating layer, a common electrode layer and a plurality of repair lines sequentially stacked on the substrate; the data line comprises a broken data line, the broken data line has a breakpoint, the broken data line is disconnected at the breakpoint, a portion of the common electrode layer located in the display area is provided with a plurality of hollow areas, an orthographic projection of each of the data lines on the substrate overlaps with an orthographic projection of one of the hollow areas on the substrate; at least a portion of the orthographic projection of each of the repair lines on the substrate is located in one of the overlapping areas; the method for repairing a broken line comprises:
[0023] Determine the location of the breakpoint of the broken data line;
[0024] Determine the positions of two processing areas corresponding to the broken data line according to the position of the breakpoint of the broken data line; the orthographic projections of the two processing areas on the substrate are located on opposite sides of the orthographic projection of the breakpoint of the broken data line on the substrate, and are respectively located within the orthographic projections of the broken data line, the hollow area corresponding to the broken data line, and the breakpoint repair line corresponding to the broken data line on the substrate;
[0025] The two processing areas are laser processed to form a first conductive part and a second conductive part that penetrate the first insulating layer; the two ends of the first conductive part are respectively connected to the first repair point of the broken data line and the breakpoint repair line, and the two ends of the second conductive part are respectively connected to the second repair point of the broken data line and the breakpoint repair line.
[0026] In some embodiments, the array substrate further includes a pixel electrode layer located on a side of the common electrode layer away from the substrate, the pixel electrode layer being provided with a plurality of spaced-apart pixel electrodes; the orthographic projection of the pixel electrode on the substrate has no overlap with the orthographic projection of each of the processing areas on the substrate.
[0027] The present application also provides a display panel, comprising the aforementioned array substrate.
[0028] The present application also provides a display device, comprising the aforementioned display panel.
[0029] The beneficial effects of this application include:
[0030] In this embodiment, by providing a plurality of hollow areas corresponding to a plurality of data lines respectively in the common electrode layer and providing a plurality of repair lines corresponding to each hollow area on the side of the common electrode layer away from the substrate, when a broken data line is detected in the data line, a conductive path of the first repair point-first conductive part-break point repair line-second conductive part-second repair point can be formed on both sides of the break point of the broken data line, thereby directly repairing the break point of the broken data line in the display area without the need to set up a rescue line with a larger loop outside the display area. In addition, since the orthographic projections of the broken data line and the break point repair line on the substrate correspond to each other, the length of the conductive path after repair is relatively small compared to the original length of the conductive path of the broken data line, and thus, there is no need to set up an operational amplifier integrated circuit (OP IC) on the circuit board to reduce the problem of large impedance differences caused by a large loop, and further avoid occupying the layout area of the circuit board. Furthermore, the multiple data lines and the multiple repair lines in the present application are arranged correspondingly. When some of the multiple data lines are broken, the corresponding repair lines can be selected for repair. Therefore, even if multiple data lines are broken, corresponding repairs can be performed in the display area without laying multiple rescue lines outside the display area. The number of repairable data lines will not be limited by the wiring area outside the display area, and occupying the wiring area outside the display area can be avoided, so as to improve the overall integration and miniaturization of the array substrate. After the broken data lines are repaired, the display panel can be formed on the array substrate to avoid vertical black screen.
[0031] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0033] Figure 1Shown is a schematic layout diagram of an array substrate in a display panel in the related art;
[0034] Figure 2 Shown along Figure 1 Sectional view cut along the middle section line M'M';
[0035] Figure 3 FIG. 1 is a schematic diagram of a layout of an array substrate provided by an exemplary embodiment of the present application;
[0036] Figure 4 Shown Figure 3 Enlarged view of point A in the middle;
[0037] Figure 5 Shown Figure 3 A sectional view taken along section line MM;
[0038] Figure 6 Shown Figure 3 A sectional view taken along section line NN;
[0039] Figure 7 FIG. 1 is a cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;
[0040] Figure 8 FIG. 1 is a cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;
[0041] Fig. 9 FIG. 1 is a cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;
[0042] Fig.10 FIG. 1 is a cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;
[0043] Fig.11 FIG. 1 is a cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;
[0044] Fig.12 Shown is a schematic layout diagram of an array substrate with broken data lines;
[0045] Fig.13 Shown Fig.12 Enlarged view of point A in the middle;
[0046] Fig.14 Shown Fig.12 A sectional view taken along section line MM;
[0047] Fig.15 Shown Fig.12 A sectional view taken along section line NN;
[0048] Fig.16FIG. 1 is a schematic layout diagram of an array substrate in a step of a broken line repairing method provided in this embodiment;
[0049] Fig.17 Shown Fig.16 Enlarged view of point A in the middle;
[0050] Fig.18 Shown Fig.16 A sectional view taken along section line MM;
[0051] Fig.19 Shown Fig.16 A sectional view taken along section line NN;
[0052] Fig. 20 FIG. 1 is a schematic layout diagram of an array substrate in a step of a broken line repairing method provided in this embodiment;
[0053] Fig.21 Shown Fig. 20 Enlarged view of point A in the middle;
[0054] Fig. 22 Shown Fig. 20 A sectional view taken along section line NN;
[0055] Fig.23 FIG. 1 is a schematic layout diagram of an array substrate in a step of a broken line repairing method provided in this embodiment;
[0056] Fig.24 Shown Fig.23 Enlarged view of point A in the middle;
[0057] Fig.25 Shown Fig.23 A sectional view taken along section line MM;
[0058] Fig.26 Shown Fig.23 A sectional view taken along section line NN;
[0059] Fig. 27 Shown is a cross-sectional view of a display panel provided by an exemplary embodiment of the present application.
[0060] In the figure: 1-substrate; 21-thin film transistor; 211-gate; 212-active layer; 213-source; 214-drain; 22-gate insulating layer; 3-data line; 31-broken data line; 31a-breakpoint; 311-first repair point; 312-second repair point; 4-first insulating layer; 5-common electrode layer; 5a-hollow area; 51-common electrode; 52-common voltage line; 6-repair line; 61-breakpoint repair line; 611-repair section; 7-interlayer insulating layer; 8-pixel electrode layer; 81-pixel electrode; 91-first conductive part; 92-second conductive part; 93-second insulating layer; 94-auxiliary layer; 200-color film substrate; 300-liquid crystal; 400-spacer; AA-display area; NA-non-display area; DA1, DA2-processing area. DETAILED DESCRIPTION
[0061] like Figure 1 FIG. 1 is a schematic diagram of a layout of an array substrate in a display panel in the related art. Figure 2 Shown along Figure 1 Section view cut along the middle section line M'M'. Figure 1 As shown, the display panel includes a display area AA' and a non-display area NA' located on one side of the display area AA'. Figure 2 As shown, the array substrate includes a substrate 1', a data line 3', a first insulating layer 4', a common electrode layer 5', a metal layer 6', an interlayer insulating layer 7' and a pixel electrode layer 8' which are stacked in sequence. The array substrate also includes a thin film transistor 21' and a gate insulating layer 22' arranged on the substrate 1'. Figure 1 As shown, when a broken data line 31' with a breakpoint 31a' is detected on the array substrate, the conventional repair method is to use the wiring connected to the source driver chip (source IC) at the periphery of the display area AA' as a rescue line 32', fuse the breakpoint 31a' by laser processing, and connect the two ends of the broken line without signal input to the rescue line 32' around the periphery of the display area AA' and connect it to the source driver chip for a second time, for example, by Figure 1Points a, b, c and d are connected in sequence to form a rescue line. Since the rescue line 32' outside the display area AA' has a larger loop and its impedance is several times greater than that of the normal line, it will cause signal distortion. Therefore, it is usually adopted to add an OP IC (Operational Amplifier IC) on the PCB circuit board and connect it to the rescue line 32' to amplify the signal, so as to ensure that the repaired part can work normally and have the same display performance as other unrepaired parts, so as to achieve the purpose of broken line repair. However, this repair method has certain limitations, which are specifically manifested as follows: the area where the rescue line can be set outside the display area AA' is limited, and multiple broken data lines cannot be repaired; adding an OP IC on the PCB circuit board will increase the cost and the wiring area of the PCB circuit board.
[0062] The array substrate and its broken line repair method, display panel and display device provided in the present application are intended to solve the above technical problems of the related art.
[0063] The array substrate and the wire breakage repair method thereof, the display panel and the display device in the embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features in the following embodiments can complement or be combined with each other.
[0064] The present application embodiment provides an array substrate, such as Figures 3 to 6 As shown, Figure 3 FIG. 1 is a schematic diagram of the layout of the array substrate provided in this embodiment. Figure 4 Shown Figure 3 The enlarged picture of A in the middle. Figure 5 Shown Figure 3 The sectional view taken along the section line MM, Figure 6 for Figure 3The cross-sectional view is taken along the section line NN in FIG. The array substrate includes a display area AA, and the array substrate includes a substrate 1, a plurality of data lines 3, a first insulating layer 4, a common electrode layer 5, a plurality of repair lines 6, a first conductive portion 91, and a second conductive portion 92. The plurality of data lines 3 are located on one side of the substrate 1, and the data lines 3 include a broken data line 31; the broken data line 31 has a breakpoint 31a and a first repair point 311 and a second repair point 312 located on both sides of the breakpoint 31a, and the broken data line 31 is disconnected at the breakpoint 31a. The first insulating layer 4 is located on the side of the plurality of data lines 3 away from the substrate 1; the common electrode layer 5 is located on the side of the first insulating layer 4 away from the plurality of data lines 3, and the common electrode layer 5 is provided with a plurality of hollow areas 5a located in the display area AA; the orthographic projection of each data line 3 on the substrate 1 and the orthographic projection of a hollow area 5a on the substrate 1 have an overlapping area. Multiple repair lines 6 are located on the side of the first insulating layer 4 away from the substrate 1, and at least part of the orthographic projection of each repair line 6 on the substrate 1 is located in an overlapping area; the repair line 6 includes a breakpoint repair line 61; the orthographic projection of the first repair point 311 on the substrate 1 and the orthographic projection of the second repair point 312 on the substrate 1 both fall within the orthographic projection of the breakpoint repair line 61 on the substrate 1; the first conductive part 91 and the second conductive part 92 both penetrate the first insulating layer 4, and their orthographic projections on the substrate 1 are both located in the corresponding hollow area 5a and the corresponding orthographic projection of the breakpoint repair line 61 on the substrate 1; the two ends of the first conductive part 91 are respectively connected to the first repair point 311 and the breakpoint repair line 61, and the two ends of the second conductive part 92 are respectively connected to the second repair point 312 and the breakpoint repair line 61.
[0065] In this embodiment, by providing a plurality of hollow areas 5a corresponding to a plurality of data lines 3 on the common electrode layer 5 and providing a plurality of repair lines 6 corresponding to each hollow area 5a on the side of the common electrode layer 5 away from the substrate 1, when a broken data line 31 is detected in the data line 3, a conductive path of the first repair point 311-first conductive portion 91-breakpoint repair line 61-second conductive portion 92-second repair point 312 can be formed on both sides of the breakpoint 31a of the broken data line 31, so that the breakpoint 31a of the broken data line 31 can be directly repaired in the display area AA, without the need to set up a rescue line with a larger loop around the display area AA. In addition, since the orthographic projections of the broken data line 31 and the breakpoint repair line 61 on the substrate 1 correspond to each other, the length of the conductive path after repair is relatively small compared to the length of the original conductive path of the broken data line 31, and thus, there is no need to set up an operational amplifier integrated circuit (OPIC) on the circuit board to reduce the problem of large impedance difference caused by a large loop, and further avoid occupying the layout area of the circuit board. Furthermore, the multiple data lines 3 and the multiple repair lines 6 in the present application are arranged correspondingly. When some of the multiple data lines 3 are broken, the corresponding repair lines 6 can be selected for repair. Therefore, even if multiple data lines 3 are broken, corresponding repairs can be performed in the display area AA, and there is no need to lay multiple rescue lines outside the display area AA. The number of repairable data lines 3 will not be limited by the wiring area outside the display area AA, and occupying the wiring area outside the display area AA can be avoided, so as to improve the overall integration and miniaturization of the array substrate. After the broken data line 31 is repaired, the display panel can be formed on the array substrate to avoid a vertical black screen.
[0066] In some embodiments, the substrate 1 may be a rigid substrate or a flexible substrate. The rigid substrate may be made of glass or quartz, and the flexible substrate may be made of a polymer material, such as polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or graphite.
[0067] In some embodiments, the material of the data line 3 includes one of the metals of silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd) or scandium (Sc), their alloys, their nitrides, etc., or any combination thereof.
[0068] In some embodiments, the material of the first insulating layer 4 includes an organic dielectric material, and the material of the first insulating layer 4 may include one of polyimide, acrylic resin, epoxy resin, benzocyclobutene, siloxane, polyester and polycarbonate or any combination thereof. In some embodiments, the material of the first insulating layer 4 also includes silicon-containing oxides, nitrides or oxynitrides. The material of the first insulating layer 4 may include silicon dioxide (SiO 2 ) or silicon nitride (SiN x ).
[0069] In some embodiments, the material of the common electrode layer 5 includes indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), and gallium-doped zinc oxide (GZO).
[0070] In some embodiments, the material of the repair line 6 includes one of the metals of silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd) or scandium (Sc), their alloys, their nitrides, etc., or any combination thereof.
[0071] In some embodiments, the material of the first conductive portion 91 includes a carbonized material. The first conductive portion 91 can be formed by carbonizing a portion of the first insulating layer 4 after being heated by a laser beam.
[0072] In some embodiments, the material of the first conductive portion 91 includes a carbonized material and a material that is the same as the material of the repair line 6. The first conductive portion 91 can also be made of a mixture of a metal material melted by a portion of the breakpoint repair line 61 corresponding to the first repair point 311 after being acted upon by a laser beam and a material carbonized by a portion of the first insulating layer 4 corresponding to the first repair point 311 after being acted upon by a laser beam.
[0073] In some embodiments, the material of the second conductive portion 92 includes a carbonized material. The second conductive portion 92 can be formed by carbonizing a portion of the first insulating layer 4 after being heated by a laser beam.
[0074] In some embodiments, the material of the second conductive portion 92 includes a carbonized material and a material that is the same as the material of the repair line 6. The second conductive portion 92 can also be made of a mixture of a metal material melted by the laser beam at the portion of the breakpoint repair line 61 corresponding to the second repair point 312 and a material carbonized by the laser beam at the portion of the first insulating layer 4 corresponding to the second repair point 312.
[0075] In some embodiments, Figure 3As shown, the array substrate also includes a non-display area NA located on one side of the display area AA, the common electrode layer 5 includes a plurality of common electrodes 51 located in the display area AA and arranged in parallel and a common voltage line 52 located in the non-display area NA, each hollow area 5a is located between two adjacent common electrodes 51; each common electrode 51 is connected to the common voltage line 52.
[0076] In this embodiment, each common electrode 51 located in the display area AA is connected to the common voltage line 52 in the non-display area NA. Therefore, even if a hollow area 5a is provided in the common electrode layer 5, it will not affect the electrical connection between each common electrode 51 and the circuit board, and will not affect the reception of signals by each common electrode 51.
[0077] In some embodiments, Figure 3 As shown, the extension direction of each common electrode 51 is parallel to the extension direction of each data line 3, and the arrangement direction of each common electrode 51 is perpendicular to the extension direction of the data line 3. The extension direction of each hollow area 5a is also parallel to the extension direction of each data line 3, and the position of the hollow area 5a can be designed according to the wiring position of the data line 3. Therefore, the broken data line 31 has a corresponding hollow area 5a and a corresponding breakpoint repair line 61, and the positions of the first repair point 311 and the second repair point 312 can be arbitrarily selected on both sides of the breakpoint 31a for repair, and the design is more flexible.
[0078] In some embodiments, Figure 3 As shown, the common voltage line 52 is located in the non-display area NA, is disposed around the display area AA, and extends and is connected to a power signal on the circuit board.
[0079] In some embodiments, Figure 3 and Figure 6 As shown, the breakpoint repair line 61 includes a repair segment 611 and a segment spaced apart from the repair segment 611 , and the first conductive portion 91 and the second conductive portion 92 are respectively connected to the repair segment 611 ; the portions of the plurality of repair lines 6 other than the repair segment 611 are all electrically connected to the common voltage line 52 .
[0080] The repair section 611 in the breakpoint repair line 61 in this embodiment is electrically connected to the data line 3, and the repair section 611 serves as a part of the signal transmission path in the data line 3 to achieve normal signal transmission in the data line 3 after the broken data line 31 is repaired. In addition, after the portion outside the repair section 611 is connected to the common voltage line 52, it can be further electrically connected to multiple common electrodes 51 through the common voltage line 52, and can serve as an auxiliary conductive path to reduce the total resistance in the signal transmission path of the common electrode 51, and can significantly reduce the impedance of the entire path.
[0081] In some embodiments, Figure 3As shown, the orthographic projection of each repair line 6 on the substrate 1 is located within the orthographic projection of a data line 3 on the substrate 1. This embodiment can prevent the area where the repair line 6 is located from being too large, which may cause the components of the breakpoint repair line 61 to diffuse to other areas and cause signal interference to other film layers except the data line 3 when the repair segment 611 of the breakpoint repair line 61 is electrically connected to the first repair point 311 and the second repair point 312 on both sides of the breakpoint 31a of the broken data line 31, such as during laser processing, when the broken data line 31 is repaired. In addition, the repair line 6 can also prevent signal interference between the data line 3 and the signal line on the side of the repair line 6 away from the substrate 1.
[0082] In some embodiments, Figure 3 As shown, the extending direction of the repair line 6 is the same as the extending direction of the data line 3. In the extending direction perpendicular to the repair line 6, the width d of the repair line 6 is 1 Smaller than the width d of data line 3 2 .
[0083] In some embodiments, Figure 3 As shown, the orthographic projection of each data line 3 on the substrate 1 falls within the orthographic projection of a hollow area 5a on the substrate 1. In this embodiment, when a broken data line 31 appears among the multiple data lines 3, when the breakpoint 31a of the broken data line 31 is located at any position, the breakpoint repair line 61 can pass through the hollow area 5a and penetrate the first insulating layer 4 to achieve the first repair point 311 and the second repair point 312 on both sides of the breakpoint 31a of the broken data line 31, so as to avoid the repair section 611 of the breakpoint repair line 61 being in contact with the common electrode layer 5 when connected to the broken data line 31 to form an electrical connection, thereby causing interference to the signal of the common electrode layer 5.
[0084] In some embodiments, Figure 3 As shown, the extension direction of the data line 3 is the same as the extension direction of the hollow area 5a. In the direction perpendicular to the extension direction of the data line 3, the width d of the data line 3 is 2 Smaller than the width d of the hollow area 5a 3 .
[0085] In some embodiments, Figure 5 and Figure 6 As shown, the array substrate also includes a pixel electrode layer 8 located on the side of the common electrode layer 5 away from the substrate 1, and the pixel electrode layer 8 is provided with a plurality of pixel electrodes 81 arranged at intervals; the orthographic projection of the pixel electrode 81 on the substrate 1 has no overlap with the orthographic projection of the first conductive portion 91 on the substrate 1 and the orthographic projection of the second conductive portion 92 on the substrate 1.
[0086] In this embodiment, after the array substrate is manufactured, when a broken data line 31 is detected, the breakpoint repair line 61 can be repaired (for example, laser treated) on the side of the pixel electrode layer 8 away from the substrate 1 while avoiding the repair treatment from affecting the pixel electrode layer 8, thereby avoiding the pixel electrode 81 of the pixel electrode layer 8 and the repair line 6 from contacting to form an electrical connection and generating signal crosstalk during the repair process.
[0087] In some embodiments, Figure 5 and Figure 6 As shown, the array substrate further includes an interlayer insulating layer 7 disposed between the common electrode layer 5 and the pixel electrode layer 8 to avoid signal crosstalk between the common electrode layer 5 and the pixel electrode layer 8 .
[0088] In some embodiments, Figure 5 As shown, in a direction perpendicular to the extension direction of the data line 3, the array substrate is further provided with a thin film transistor 21, and the thin film transistor 21 includes a source electrode 213, a drain electrode 214, an active layer 212 and a gate electrode 211. In this embodiment, the thin film transistor 21 is a bottom-gate thin film transistor. In this embodiment, the source and drain electrode 214 layer and the data line 3 are arranged in the same layer. In other embodiments, the thin film transistor 21 may also be a top-gate thin film transistor or a dual-gate thin film transistor.
[0089] In some embodiments, the material of the gate 211, the source 213, and the drain 214 includes one or any combination of metals such as silver (Ag), magnesium (Mg), aluminum (Al), tungsten (W), copper (Cu), nickel (Ni), chromium (Cr), molybdenum (Mo), titanium (Ti), platinum (Pt), tantalum (Ta), neodymium (Nd) or scandium (Sc), their alloys, their nitrides, etc.
[0090] In some embodiments, the material of the active layer 212 may be indium gallium zinc oxide, indium zinc tin oxide, or indium gallium zinc tin oxide, or any combination thereof.
[0091] In some embodiments, the array substrate is also provided with a gate insulating layer 22 located between the active layer 212 and the gate 211. The material of the gate insulating layer 22 can be one or more combinations of silicon oxide, silicon nitride, high dielectric constant dielectric materials (such as aluminum oxide, hafnium oxide, zirconium oxide, etc.) and organic dielectric materials.
[0092] In some embodiments, Figure 5As shown, the array substrate further includes a second insulating layer 93 located on the side of the first insulating layer 4 away from the substrate 1; each repair line 6 is located in a hollow area 5a and in contact with the first insulating layer 4, and at least a portion of the second insulating layer 93 is located in the gap between the common electrode layer 5 and the repair line 6. In this embodiment, the second insulating layer 93 is located in the gap, which does not increase the thickness of the entire film layer, and can avoid electrical connection between the multiple common electrodes 51 in the common electrode layer 5 and the repair line 6, thereby avoiding signal crosstalk.
[0093] In some embodiments, Figure 7 or Figure 8 As shown, the array substrate further includes a second insulating layer 93 located on the side of the first insulating layer 4 away from the substrate 1; each repair line 6 is arranged on the side of the second insulating layer 93 away from the first insulating layer 4, and at least part of the second insulating layer 93 is located in each hollow area 5a.
[0094] In this embodiment, considering that the width of multiple hollow areas 5a of the common electrode layer 5 is relatively small, the width of the second insulating layer 93 needs to be set smaller. In the actual preparation process, it may be difficult to set the second insulating layer 93 between the repair line 6 and the common electrode 51 to achieve insulation between the common electrode 51 and the repair line 6. Therefore, the second insulating layer 93 is filled in the hollow area 5a to avoid contact between the common electrode 51 and the repair line 6 to form an electrical connection, which is easier to achieve in the preparation process and simpler to operate.
[0095] In some embodiments, Figure 7 As shown, in the direction perpendicular to the substrate 1, the thickness of the second insulating layer 93 is less than or equal to the thickness of the common electrode layer 5. In this embodiment, the second insulating layer 93 is directly disposed in the hollow area 5a, which can be achieved without adding another film layer, thereby avoiding increasing the overall thickness of the array substrate.
[0096] In some embodiments, Figure 8 As shown, in the direction perpendicular to the substrate 1, the thickness of the second insulating layer 93 is greater than the thickness of the common electrode layer 5, and the side of the second insulating layer 93 away from the common electrode layer 5 at least partially covers the surface of the side of the common electrode layer 5 away from the substrate 1. In this embodiment, since the second insulating layer 93 covers the common electrode layer 5, the orthographic projection of the repair line 6 on the substrate 1 does not need to be limited to the orthographic projection of the hollow area 5a on the substrate 1. Therefore, the area setting of the repair line 6 is more flexible and has higher operability.
[0097] In some embodiments, Fig. 9 or Fig.10 or Fig.11As shown, the array substrate also includes an auxiliary layer 94, which is arranged on the side of the common electrode layer 5 away from the substrate 1. The orthographic projection of the auxiliary layer 94 on the substrate 1 does not overlap with the orthographic projection of the hollow area 5a on the substrate 1, and the auxiliary layer 94 is electrically connected to the common electrode layer 5.
[0098] In this embodiment, by adding an electrical connection between the auxiliary layer 94 and the common electrode layer 5, it can further serve as an auxiliary conductive path for the common electrode layer 5, reduce the total resistance in the signal transmission path, and significantly reduce the impedance of the entire path.
[0099] In some embodiments, there is a space between the auxiliary layer 94 and the repair line 6 to avoid signal crosstalk.
[0100] In some embodiments, Fig.10 or Fig.11 As shown, the auxiliary layer 94 is disposed in the same layer as the plurality of repair lines 6. In this embodiment, no additional film layer is provided to accommodate the auxiliary layer 94, thereby reducing the overall thickness of the array substrate and improving the integration and miniaturization of the device.
[0101] In some embodiments, the auxiliary layer 94 and the repair line 6 are made of the same material. Therefore, in the process of manufacturing the array substrate, the pattern of the repair line 6 and the pattern of the auxiliary layer 94 can be formed on the same mask, and the repair line 6 and the auxiliary layer 94 can be deposited on the array substrate at the same time, which can simplify the manufacturing process.
[0102] Based on the same inventive concept, the present application also provides a method for repairing a broken line of an array substrate, such as Figures 12 to 15 As shown, Fig.12 FIG. 1 is a schematic diagram of a layout of an array substrate with a broken data line 31. Fig.13 Shown Fig.12 The enlarged picture of A in the middle. Fig.14 Shown Fig.12 The sectional view taken along the section line MM, Fig.15 Shown Fig.12 The cross-sectional view taken along the section line NN in FIG. 2 ; the array substrate comprises a display area AA; the array substrate comprises a substrate 1 and a plurality of data lines 3, a first insulating layer 4, a common electrode layer 5 and a plurality of repair lines 6 sequentially stacked on the substrate 1; the data line 3 comprises a broken data line 31, the broken data line 31 has a breakpoint 31a, the broken data line 31 is disconnected at the breakpoint 31a, a portion of the common electrode layer 5 located in the display area AA is provided with a plurality of hollow areas 5a, and an orthographic projection of each data line 3 on the substrate 1 overlaps with an orthographic projection of a hollow area 5a on the substrate 1; at least a portion of the orthographic projection of each repair line 6 on the substrate 1 is located in an overlapping area; the broken line repairing method comprises the following steps:
[0103] Step 100: Figures 12 to 15As shown, the position of the break point 31a of the broken data line 31 is determined;
[0104] Step 200: Figures 16 to 19 As shown, Fig.16 FIG. 1 is a schematic diagram of a layout of an array substrate in a step of a broken line repairing method provided in this embodiment. Fig.17 Shown Fig.16 The enlarged picture of A in the middle. Fig.18 Shown Fig.16 The sectional view taken along the section line MM, Fig.19 Shown Fig.16 The cross-sectional view is taken along the section line NN in FIG. 2 ; the positions of the two processing areas DA1 and DA2 corresponding to the broken data line 31 are determined according to the position of the breakpoint 31a of the broken data line 31; the orthographic projections of the two processing areas DA1 and DA2 on the substrate 1 are located on opposite sides of the orthographic projection of the breakpoint 31a of the broken data line 31 on the substrate 1, and are respectively located within the orthographic projections of the broken data line 31, the hollow area 5a corresponding to the broken data line 31, and the breakpoint repair line 61 corresponding to the broken data line 31 on the substrate 1;
[0105] Step 300: Figure 20 to Figure 26 As shown, Fig. 20 FIG. 1 is a schematic diagram of a layout of an array substrate in a step of a broken line repairing method provided in this embodiment. Fig.21 Shown Fig. 20 The enlarged picture of A in the middle. Fig. 22 Shown Fig. 20 A sectional view taken along section line NN; Fig.23 FIG. 1 is a schematic diagram of a layout of an array substrate in a step of a broken line repairing method provided in this embodiment. Fig.24 Shown Fig.23 The enlarged picture of A in the middle. Fig.25 Shown Fig.23 A sectional view taken along section line MM; Fig.26 Shown Fig.23 A cross-sectional view taken along the section line NN in the figure; the two processing areas DA1 and DA2 are laser processed to form a first conductive portion 91 and a second conductive portion 92 that penetrate the first insulating layer 4; the two ends of the first conductive portion 91 are respectively connected to the first repair point 311 of the broken data line 31 and the breakpoint repair line 61, and the two ends of the second conductive portion 92 are respectively connected to the second repair point 312 of the broken data line 31 and the breakpoint repair line 61.
[0106] In this embodiment, a hollow area 5a corresponding to the data line 3 is set in the common electrode layer 5, and corresponding multiple repair lines 6 are set at positions corresponding to the multiple data lines 3. After the position of the breakpoint 31a of the broken data line 31 in the data line 3 is determined, laser processing can be used to repair the broken data line 31 through the breakpoint repair line 61, thereby ensuring the normal transmission of the signal on the array substrate.
[0107] In some embodiments, two ends of the first conductive portion 91 are respectively connected to the first repair point 311 and the repair segment 611 of the breakpoint repair line 61, and two ends of the second conductive portion 92 are respectively connected to the second repair point 312 and the repair segment 611 of the breakpoint repair line 61. The portion of the breakpoint repair line 61 other than the repair segment 611 is connected to the common voltage line 52.
[0108] In some embodiments, step 300 specifically includes the following steps:
[0109] Step 310: Figure 20 to Figure 22 As shown, Fig. 20 FIG. 1 is a schematic diagram of a layout of an array substrate in a step of a broken line repairing method provided in this embodiment. Fig.21 Shown Fig. 20 The enlarged picture of A in the middle. Fig. 22 Shown Fig. 20 A cross-sectional view taken along the section line NN; laser cutting is performed on the position of the first repair point 311 of the breakpoint repair line 61 corresponding to the broken data line 31 away from the breakpoint 31a and the position of the second repair point 312 away from the breakpoint 31a to form a repair segment 611;
[0110] Step 320: Figure 23 to Figure 26 As shown, Fig.23 FIG. 1 is a schematic diagram of a layout of an array substrate in a step of a broken line repairing method provided in this embodiment. Fig.24 Shown Fig.23 The enlarged picture of A in the middle. Fig.25 Shown Fig.23 A sectional view taken along section line MM; Fig.26 Shown Fig.23 The repair section 611 is laser welded at the position of the first repair point 311 of the data line 3 and the position of the second repair point 312 of the data line 3 to form a first conductive portion 91 and a second conductive portion 92 that penetrate the first insulating layer 4, respectively.
[0111] In this embodiment, the connection between the repairing section 611 of the breakpoint repairing line 61 and the broken data line 31 is achieved by laser cutting and laser welding, which is relatively simple to operate and is feasible.
[0112] In some embodiments, the following steps are further included before step 100:
[0113] It is detected whether there is a broken data line 31 among the plurality of data lines 3 .
[0114] In some embodiments, the array substrate may be scanned by automated optical inspection (AOI) to detect whether there is a broken data line 31 in the data line 3. When a broken data line 31 is detected, the broken line repairing method of steps 100 to 300 in the above embodiment is implemented.
[0115] In some embodiments, the two processing areas DA1 and DA2 are located in the same hollow area 5a.
[0116] In other embodiments, the two processing areas DA1 and DA2 may be located in different hollow areas 5 a to accommodate the locations of the first repair point 311 and the second repair point 312 .
[0117] The present application also provides a display panel, such as Fig. 27 As shown, it includes the aforementioned array substrate, a color filter substrate 200 arranged in a box with the array substrate, and liquid crystal 300 and spacers 400 arranged between the array substrate and the color filter substrate 200. The technical features and beneficial effects of this embodiment are the same as those of the aforementioned embodiment, and will not be repeated here.
[0118] The present application also provides a display device, comprising the display panel and the housing as described above. The technical features and beneficial effects of this embodiment are the same as those of the above embodiment, and will not be described in detail here.
[0119] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.
Claims
1. An array substrate, characterized in that: Comprising a display area, the array substrate comprises: substrate; A plurality of data lines are located at one side of the substrate, the data lines include a broken data line; the broken data line has a breakpoint and a first repair point and a second repair point located at both sides of the breakpoint, and the broken data line is disconnected at the breakpoint; A first insulating layer, located on a side of the plurality of data lines away from the substrate; a common electrode layer, located on a side of the first insulating layer away from the plurality of data lines, the common electrode layer being provided with a plurality of hollow areas located in the display area; an orthographic projection of each of the data lines on the substrate and an orthographic projection of one of the hollow areas on the substrate having an overlapping area; A plurality of repair lines are located on a side of the first insulating layer away from the substrate, and at least a portion of an orthographic projection of each of the repair lines on the substrate is located in one of the overlapped regions; the repair lines include a breakpoint repair line; the orthographic projection of the first repair point on the substrate and the orthographic projection of the second repair point on the substrate both fall within the orthographic projection of the breakpoint repair line on the substrate; The first conductive part and the second conductive part both penetrate the first insulating layer, and their orthographic projections on the substrate are both located within the corresponding hollow area and the corresponding orthographic projection of the breakpoint repair line on the substrate; the two ends of the first conductive part are respectively connected to the first repair point and the breakpoint repair line, and the two ends of the second conductive part are respectively connected to the second repair point and the breakpoint repair line.
2. The array substrate according to claim 1, characterized in that: The array substrate also includes a non-display area located on one side of the display area, the common electrode layer includes a plurality of common electrodes located in the display area and arranged in parallel and a common voltage line located in the non-display area, each of the hollow areas is located between two adjacent common electrodes; each of the common electrodes is connected to the common voltage line.
3. The array substrate according to claim 2, characterized in that: The breakpoint repair line includes a repair segment and a segment spaced apart from the repair segment, the first conductive portion and the second conductive portion are respectively connected to the repair segment; and portions of the multiple repair lines other than the repair segment are electrically connected to the common voltage line.
4. The array substrate according to claim 1, characterized in that: The orthographic projection of each of the repair lines on the substrate is located within the orthographic projection of one of the data lines on the substrate; and / or, The orthographic projection of each of the data lines on the substrate falls within the orthographic projection of one of the hollow areas on the substrate.
5. The array substrate according to claim 1, characterized in that: The array substrate also includes a pixel electrode layer located on a side of the common electrode layer away from the substrate, and the pixel electrode layer is provided with a plurality of pixel electrodes arranged at intervals; the orthographic projection of the pixel electrode on the substrate has no overlap with the orthographic projection of the first conductive portion on the substrate and the orthographic projection of the second conductive portion on the substrate.
6. The array substrate according to claim 1, characterized in that: The array substrate further includes an auxiliary layer, which is disposed on a side of the common electrode layer away from the substrate. The orthographic projection of the auxiliary layer on the substrate does not overlap with the orthographic projection of the hollow area on the substrate, and the auxiliary layer is electrically connected to the common electrode layer.
7. The array substrate according to claim 6, characterized in that: The auxiliary layer is arranged in the same layer as the plurality of repair lines.
8. The array substrate according to claim 1, characterized in that: The array substrate also includes a second insulating layer located on a side of the first insulating layer away from the substrate; each of the repair lines is located in one of the hollow areas and in contact with the first insulating layer, and at least a portion of the second insulating layer is located in the gap between the common electrode layer and the repair line.
9. The array substrate according to claim 1, characterized in that: The array substrate further includes a second insulating layer located on a side of the first insulating layer away from the substrate; each of the repair lines is arranged on a side of the second insulating layer away from the first insulating layer, and at least a portion of the second insulating layer is located in each of the hollow areas.
10. The array substrate according to claim 1, characterized in that: The material of the first conductive part includes a carbonized material; And / or, the material of the second conductive part includes carbonized material.
11. A method for repairing a broken line of an array substrate, characterized in that: The array substrate comprises a display area; the array substrate comprises a substrate and a plurality of data lines, a first insulating layer, a common electrode layer and a plurality of repair lines sequentially stacked on the substrate; the data lines comprise broken data lines, the broken data lines have breakpoints, the broken data lines are disconnected at the breakpoints, a portion of the common electrode layer located in the display area is provided with a plurality of hollow areas, and an orthographic projection of each of the data lines on the substrate overlaps with an orthographic projection of one of the hollow areas on the substrate; At least a portion of the orthographic projection of each of the repair lines on the substrate is located in one of the overlapped regions; The disconnection repair method comprises: Determine the location of the breakpoint of the broken data line; Determine the positions of two processing areas corresponding to the broken data line according to the position of the breakpoint of the broken data line; the orthographic projections of the two processing areas on the substrate are located on opposite sides of the orthographic projection of the breakpoint of the broken data line on the substrate, and are respectively located within the orthographic projections of the broken data line, the hollow area corresponding to the broken data line, and the breakpoint repair line corresponding to the broken data line on the substrate; The two processing areas are laser processed to form a first conductive part and a second conductive part that penetrate the first insulating layer; the two ends of the first conductive part are respectively connected to the first repair point of the broken data line and the breakpoint repair line, and the two ends of the second conductive part are respectively connected to the second repair point of the broken data line and the breakpoint repair line.
12. The method for repairing a broken line according to claim 11, characterized in that: The array substrate further comprises a pixel electrode layer located on a side of the common electrode layer away from the substrate, wherein the pixel electrode layer is provided with a plurality of pixel electrodes arranged at intervals; the orthographic projection of the pixel electrode on the substrate has no overlap with the orthographic projection of each processing area on the substrate.
13. A display panel, comprising the array substrate according to any one of claims 1 to 10.
14. A display device comprising the display panel according to claim 13.
Citation Information
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