Local electroplating process and electroplating system

Abstract

The invention relates to the technical field of electroplating processes and equipment, in particular to a local electroplating process and an electroplating system. In the local electroplating process of the electroplated part, after the electroplated part is pretreated, pollutants on the surface of the electroplated part are removed, and the electroplated part reaches a good activated state. After an electroplated part is pretreated, a to-be-electroplated area of the electroplated part is covered with a mask, the electroplated part is immersed in wax liquid, and the surface of the electroplated part is covered with a wax film. And after the wax film is formed on the surface of the electroplated part, removing the mask in the to-be-plated region, further exposing the to-be-plated region out of the wax film, immersing the electroplated part into the electroplating liquid, and further electroplating the to-be-plated region. After electroplating is completed, no metal ions are deposited because the non-electroplating area is covered by the wax film. And after the electroplating is completed, removing the wax film adhered to the electroplating part, so as to obtain the electroplating part subjected to local electroplating. In this way, local electroplating of the electroplated part is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating processes and equipment, and in particular to a local electroplating process and an electroplating system. Background Art

[0002] Electroplating is a process that uses the principle of electrolysis to attach a layer of metal film to the surface of metal or other material parts. This process can not only enhance the aesthetics of electroplated parts, but also significantly improve the corrosion resistance of metal parts, prevent metal oxidation, and thus extend the service life. In addition, electroplating can also improve the working performance of parts, such as hardness, wear resistance, conductivity, electromagnetic properties, heat resistance, etc. The improvement of these properties helps to improve the performance of parts in practical applications.

[0003] During the electroplating process, the electroplated part is immersed in an electrolyte solution containing metal ions to be plated, and direct current is passed through the electroplated part as the cathode. When the current passes through the electrolyte solution, the metal ions in the solution will precipitate and deposit on the surface of the workpiece to form a layer of metal deposits, thereby forming an electroplating layer on the surface of the electroplated part. Since the entire electroplated part is immersed in the electrolyte solution during the electroplating process, the electroplating process usually electroplates the entire electroplated part. In some cases, it is necessary to electroplate a local part of the electroplated part to meet the demand for local electroplating of the electroplated part. The current local electroplating method is usually to immerse a local part of the electroplated part in the electrolyte solution to achieve electroplating of only a part of the electroplated part. Such an electroplating method cannot meet the electroplating needs of patterns of different shapes.

[0004] It can be seen that how to achieve local electroplating of electroplated parts is a technical problem that needs to be solved urgently. Summary of the invention

[0005] The present application provides a local electroplating process and an electroplating system, which are intended to solve the technical problem of how to achieve local electroplating of electroplated parts in the prior art.

[0006] The present application provides a local electroplating process, comprising: Pretreatment, removing pollutants on the surface of the electroplated parts to make the electroplated parts reach a good activation state; Covering with a mask, using the mask to cover the area to be plated of the pre-treated electroplating part; Wax dipping, immersing the electroplated part covered with the mask into wax liquid to form a wax film on the surface of the electroplated part; Removing the mask, after taking the electroplated part out of the wax liquid, peeling off the mask covering the area to be plated, so that the area to be plated is exposed to the wax film; Electroplating, immersing the electroplated part with the area to be plated exposed from the wax film into an electroplating solution to electroplate the electroplated part; Wax removal is to clean the wax film covering the electroplated part.

[0007] Optionally, the mask includes at least one of masking paper or masking film.

[0008] Optionally, the mask removal comprises the following steps: taking the electroplated part out of the wax liquid; Cutting the wax film along the contour of the area to be plated so that the edge of the mask is exposed from the wax film; The mask is peeled off to separate the wax film of the area to be plated together with the mask from the electroplating part, thereby exposing the area to be plated from the wax film.

[0009] Optionally, the wax removal comprises the following steps: The wax film is divided so that the wax film can fall off from the surface of the electroplated part; Immersing the electroplated part in high-temperature water to cause the wax film to fall off the surface of the electroplated part; Wherein, the temperature of the high temperature water is configured to be 60°C-100°C.

[0010] Optionally, the wax removal comprises the following steps: The wax film is divided so that the wax film can fall off from the surface of the electroplated part; Passing a heat source through the electroplated part to increase the surface temperature of the electroplated part; Wherein, the temperature of the heat source is configured to be 100°C-150°C.

[0011] Optionally, the heat source includes a resistive heating module.

[0012] On the other hand, the present application also provides an electroplating system, comprising: A pretreatment module, wherein the pretreatment module is used to pretreat the surface of the electroplated part; A cutting module, the cutting module is used to cut the mask according to the shape of the area to be plated of the electroplated part; A coating module, wherein the coating module is used to cover the cut mask on the area to be plated; A wax dipping tank, the wax dipping tank is used to load wax liquid; A mask removal module, the mask removal module is used to remove the mask from the area to be plated; An electroplating module, wherein the electroplating module is used to electroplate the electroplated parts; A wax removal module is used to remove wax from the electroplated parts after electroplating.

[0013] Optionally, the cutting module includes: A mask jig, the mask jig being used to fix the mask; A cutting mold is used to cut the mask.

[0014] Optionally, the mask removal module includes: A cutting mold, wherein the cutting contour of the cutting mold is adapted to the contour of the area to be plated, and the cutting mold is used to cut the wax film; A film peeling device is used to peel off the mask from the electroplating part.

[0015] Optionally, the film peeling device includes a vacuum adsorption system, and the vacuum adsorption system peels the mask off the electroplating part by vacuum adsorption.

[0016] The beneficial effects achieved by the present application are: in the process of local electroplating of the electroplated parts, after the electroplated parts are pretreated, the pollutants on the surface of the electroplated parts are removed, and the electroplated parts are brought into a good activation state, so that the electroplated parts can achieve a good effect after being electroplated, and on the other hand, the bonding force between the wax film and the electroplated parts is reduced, so that the subsequent wax removal process can smoothly separate the wax film from the electroplated parts. After the electroplated parts are pretreated, the mask is covered on the area to be plated of the electroplated parts to prevent the wax film from covering the area to be plated. After the area to be plated is covered with the mask, the electroplated parts are immersed in the wax liquid, so that the surface of the electroplated parts is covered with the wax film, and then the electroplated parts are isolated from the electroplating liquid by the wax film, so as to prevent the metal ions to be plated from being deposited in the non-electroplating area of ​​the electroplated parts. After the wax film is formed on the surface of the electroplated parts, the mask of the area to be plated is removed, so that the area to be plated is exposed to the wax film, thereby ensuring that the metal ions to be plated can be deposited in the area to be plated during the electroplating process. After the area to be plated is exposed, the electroplated part is immersed in the electroplating solution, and then the area to be plated is electroplated. After the electroplating is completed, since the non-electroplated area is covered by the wax film, no metal ions will be deposited. After the electroplating is completed, the wax film adhering to the electroplated part is removed, thereby obtaining the electroplated part after partial electroplating. In this way, partial electroplating of the electroplated part is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is one of the flow charts of the local electroplating process in an embodiment of the present invention; Figure 2 This is the second flow chart of the local electroplating process in an embodiment of the present invention; Figure 3 Flowchart 3 of the local electroplating process in an embodiment of the present invention; Figure 4 is a schematic diagram of the layout of an electroplating system in an embodiment of the present invention; Figure 5 is a schematic diagram of the layout of a cutting module and a laminating module in an embodiment of the present invention; Figure 6Schematic diagram of the layout of the mask removal module in an embodiment of the present invention.

[0018] Main unit symbol description: 10. Electroplating system; 20. Pretreatment module; 30. Cutting module; 31. Mask fixture; 32. Cutting mold; 40. Laminating module; 41. Alignment camera; 42. Vacuum suction cup device; 50. Wax immersion tank; 60. Mask removal module; 61. Cutting mold; 62. Film peeling device; 63. Vacuum adsorption system; 70. Electroplating module; 80. Wax removal module; 81. Hot water tank; 90. Electroplated parts; 91. Area to be plated; 92. Non-electroplating area. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar units or units with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] In the description of the present invention, it is necessary to understand that the orientation or positional relationship indicated by terms such as "length", "width", "up", "down", "left", "right", "horizontal", "top" and "bottom" are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two units or the interaction relationship between two units. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0024] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the examples of various specific processes and materials provided by the present invention, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0025] See also Figure 1 In some embodiments of the present application, the present application provides a local electroplating process, comprising: Pretreatment, removing pollutants on the surface of the electroplated part 90, so that the electroplated part 90 reaches a good activation state; Covering with a mask, using the mask to cover the area to be plated 91 of the pre-treated electroplating part 90; Wax dipping, immersing the electroplated part 90 covered with the mask into wax liquid, so that a wax film is formed on the surface of the electroplated part 90; After removing the mask, the electroplated part 90 is taken out of the wax liquid, and the mask covering the area to be plated 91 is peeled off to expose the area to be plated 91 to the wax film; Electroplating, immersing the electroplated part 90 with the area to be plated 91 exposed from the wax film into an electroplating solution to electroplate the electroplated part 90; Wax removal is to clean the wax film covering the electroplated part 90 .

[0026] It is understandable that in the process of partial electroplating of the electroplated part 90, after the electroplated part 90 is pretreated, the pollutants on the surface of the electroplated part 90 are removed, and the electroplated part 90 is brought into a good activation state, so that the electroplated part 90 can achieve a good effect after being electroplated, and on the other hand, the bonding force between the wax film and the electroplated part 90 is reduced, so that the subsequent wax removal process can smoothly separate the wax film from the electroplated part 90. After the electroplated part 90 is pretreated, a mask is covered on the area to be plated 91 of the electroplated part 90 to prevent the wax film from covering the area to be plated 91. After the area to be plated 91 is covered with a mask, the electroplated part 90 is immersed in the wax liquid, so that the surface of the electroplated part 90 is covered with the wax film, and then the electroplated part 90 is isolated from the electroplating liquid by the wax film, so as to prevent the metal ions to be plated from being deposited in the non-electroplating area 92 of the electroplated part 90. After the wax film is formed on the surface of the electroplated part 90, the mask of the area to be plated 91 is removed, and the area to be plated 91 is exposed to the wax film, thereby ensuring that the metal ions to be plated can be deposited in the area to be plated 91 during the electroplating process. After the area to be plated 91 is exposed, the electroplated part 90 is immersed in the electroplating solution, and then the area to be plated 91 is electroplated. After the electroplating is completed, since the non-electroplating area 92 is covered by the wax film, no metal ions will be deposited. After the electroplating is completed, the wax film adhered to the electroplated part 90 is removed, thereby obtaining the electroplated part 90 after partial electroplating. In this way, partial electroplating of the electroplated part 90 is achieved.

[0027] In the process of pre-treating the electroplated part 90, pollutants such as grease, dust and oxides on the surface of the electroplated part 90 are removed by solvent cleaning, alkaline cleaning and electrolytic degreasing to ensure the adhesion and uniformity of the coating; an acid solution is used to remove the surface oxide layer, and a stable oxide protective layer is formed on the surface of the electroplated part 90 to prevent the substrate from being oxidized again before electroplating; residual oxides and tiny pollutants are removed by dilute acid treatment to ensure that the surface of the electroplated part 90 is completely clean and active, and the surface activity and wettability of the electroplating solution are increased. After removing the pollutants on the surface of the electroplated part 90 and forming an oxide protective layer on the surface of the electroplated part 90, a uniform wax film can be formed on the surface of the electroplated part 90 during the wax dipping process, and the wax film is closely attached to the surface of the electroplated part 90, thereby ensuring the coverage effect of the wax film on the non-electroplated area 92 of the electroplated part 90. Since a layer of oxide protective layer is formed on the surface of the electroplated part 90, the bonding force between the wax film and the electroplated part 90 can be effectively reduced, so that the subsequent wax removal process can smoothly separate the wax film from the electroplated part 90.

[0028] In some embodiments of the present application, the mask includes at least one of masking paper or masking film.

[0029] The area 91 to be plated of the electroplated part 90 is covered by masking paper or masking film to prevent the wax liquid from covering the area 91 to be plated during the wax dipping process, so that the area 91 to be plated is exposed to the coverage of the wax film. Since the masking film or masking paper has a certain degree of adhesion, the masking film or masking paper can be effectively pasted on the area 91 to be plated of the electroplated part 90. The adhesive film used for pasting the masking film and masking paper has a large bonding force with the masking film and masking paper, so when the masking film and masking paper are removed, the adhesive film used for bonding will not remain on the surface of the electroplated part 90. Therefore, the use of masking film and masking paper to cover and protect the area 91 to be plated of the electroplated part 90 can achieve a good protection effect without causing pollution to the electroplated part 90, thereby ensuring that the electroplating effect of the local electroplating of the electroplated part 90 meets the expected requirements.

[0030] It is understandable that the materials of the masking film and the masking paper usually have good waterproof and anti-penetration properties, so they can effectively protect the area to be plated 91 from being contaminated by the wax liquid, thereby ensuring a good electroplating effect.

[0031] Since the area 91 to be plated of the electroplated part 90 usually has a corresponding shape and accounts for a relatively small area relative to the surface of the electroplated part 90, it is more convenient to cover the area 91 to be plated with a masking film or masking paper so that the masking film or masking paper can be cut into a shape corresponding to the area 91 to be plated. After the area 91 to be plated is covered with a masking film or masking paper, a layer of wax film can be formed on the non-electroplated area 92 of the electroplated part 90 by immersing the electroplated part 90 in wax liquid, so that the wax film quickly and comprehensively covers the non-electroplated area 92 of the electroplated part 90, thereby making the covering process of the non-electroplated area 92 more comprehensive and efficient. If the non-electroplated area 92 of the electroplated part 90 is covered with a masking paper or a masking film, it will not only increase the labor intensity of the staff, but also make it difficult to comprehensively and effectively cover the non-electroplated area 92.

[0032] It should be noted that if the area of ​​the non-electroplating region 92 of the electroplated component 90 is relatively small, the non-electroplating region 92 of the electroplated component 90 can be covered by coating with glue, film, wax, etc.

[0033] See also Figures 1 to 3 In some embodiments of the present application, removing the mask comprises the following steps: Taking out the electroplated part 90 from the wax liquid; Cutting the wax film along the contour of the area to be plated 91 so that the edge of the mask is exposed from the wax film; The mask is peeled off to separate the wax film of the area to be plated 91 together with the mask from the electroplating component 90 , thereby exposing the area to be plated 91 from the wax film.

[0034] It is understandable that after the electroplated part 90 is taken out from the wax liquid, the wax liquid adhering to the surface of the electroplated part 90 solidifies to form a wax film on the surface of the electroplated part 90 that is close to the surface of the electroplated part 90, and the wax film is connected to the mask to cover together. The wax film is cut along the edge of the mask by a cutting mold 61 or a special cutter, so that the wax film covering the mask is separated from the wax film covering the non-electroplating area 92, so that the wax film in the non-electroplating area 92 will not be damaged in the process of removing the mask, thereby ensuring the effectiveness of the wax film covering the non-electroplating area 92 of the electroplated part 90.

[0035] In some embodiments of the present application, removing the mask further comprises the following steps: Edge melting: melting the wax film contour at the edge of the area to be plated 91 by means of an edge melting device; Cooling, cooling the melted wax film profile to condense the wax film profile.

[0036] It is understandable that in the process of cutting the wax film, wax debris and burrs will be generated on the cut edge of the wax film. After removing the mask, the wax film contour at the edge of the to-be-plated area 91 is melted by the edge melting device, and then the wax film contour is condensed by the cooling device, so that the wax debris and burrs are melted and then condensed into a smooth boundary line, thereby ensuring the continuity and smoothness of the edge of the electroplated layer and improving the electroplating effect.

[0037] In some embodiments of the present application, the temperature during edge melting is configured to be 45°C-85°C.

[0038] The temperature during edge melting is configured to be 45°C-85°C to avoid excessive melting range of the wax film contour, thereby ensuring that the linearity of the wax film contour meets the expected requirements and avoiding deviation of the wax film contour.

[0039] In some embodiments of the present application, the wax film is transparent or semi-transparent at least in the to-be-plated area 91. There is a color difference between the mask and the surface of the electroplated part 90.

[0040] By making the wax film of the area to be plated 91 transparent or semi-transparent and making the mask and the surface of the electroplated part 90 have a color difference, the outline of the mask is made clearer, thereby making it easier to cut the wax film.

[0041] See also Figure 2 In some embodiments of the present application, wax removal includes the following steps: The wax film is divided so that the wax film can fall off from the surface of the electroplated part 90; Immersing the electroplated component 90 in high-temperature water to cause the wax film to fall off the surface of the electroplated component 90; Among them, the temperature of high temperature water is configured to be 60℃-100℃.

[0042] It is understandable that after the partial electroplating of the electroplated part 90 is completed, the electroplated part 90 is immersed in hot water, thereby increasing the temperature of the electroplated part 90, so that the junction between the wax film and the electroplated part 90 is melted, and the wax film is then dropped from the surface of the electroplated part 90. Before the electroplated part 90 is immersed in hot water, the wax film is cut with a plastic cutter so that the wax film can be dropped from the electroplated part 90 more smoothly. The water temperature is configured to be 60°C-100°C, so that the wax film is quickly melted and dropped from the surface of the electroplated part 90 without damaging the electroplated part 90. Since wax is insoluble in water, it is conducive to the recycling of wax. After the hot water bath, the electroplated part 90 can also be preliminarily cleaned to remove the electroplating solution remaining on the electroplated part 90.

[0043] After the electroplated part 90 is immersed in hot water, the disturbance of the hot water can be increased so that the hot water impacts the electroplated part 90, thereby improving the effect of the wax film falling off the electroplated part 90. The electroplated part 90 can also be vibrated to improve the effect of the wax film falling off the electroplated part 90 by vibration.

[0044] See also Figure 3 In some embodiments of the present application, wax removal includes the following steps: The wax film is divided so that the wax film can fall off from the surface of the electroplated part 90; Passing a heat source into the electroplating part 90 to increase the surface temperature of the electroplating part 90; Among them, the temperature of the heat source is configured to be 100℃-150℃.

[0045] It is understandable that after the wax film is divided, the wax film on the surface of the electroplated part 90 forms independent small areas, so that the wax film can fall off from the surface of the electroplated part 90. A heat source is introduced into the electroplated part 90, thereby increasing the surface temperature of the electroplated part 90, so that the junction between the wax film and the electroplated part 90 melts, and then the wax film falls off from the surface of the electroplated part 90. The fallen wax film can be reused after washing and dehydration, thereby achieving energy saving and environmental protection. The temperature of the heat source is configured to be 100°C-150°C, so that while the wax film falls off, the electroplated part 90 is prevented from being damaged by excessive temperature.

[0046] When the electroplated part 90 is exposed to the heat source, the heat source contacts the electroplated part 90 , and then the heat of the heat source is transferred to the surface of the electroplated part 90 through heat conduction, so that the temperature of the surface of the electroplated part 90 increases.

[0047] In some embodiments of the present application, the heat source includes a resistive heating module.

[0048] After the temperature of the resistive heating module is increased, the resistive heating module is brought into contact with the electroplating part 90, so that the heat of the resistive heating module is transferred to the electroplating part 90, the temperature of the electroplating part 90 is increased, and the junction between the wax film and the electroplating part 90 is melted, and the wax film is then removed from the surface of the electroplating part 90.

[0049] After the wax removal of the electroplated part 90 is completed, the electroplated part 90 is then subjected to post-plating treatments such as cleaning and drying.

[0050] On the other hand, see Figure 4 In some embodiments of the present application, the present application also provides an electroplating system 10, including: a pretreatment module 20, a cutting module 30, a coating module 40, a wax immersion tank 50, a mask removal module 60, an electroplating module 70 and a wax removal module 80.

[0051] The pretreatment module 20 is used to pretreat the surface of the electroplated part 90. The cutting module 30 is used to cut the mask according to the shape of the area to be plated 91 of the electroplated part 90. The coating module 40 is used to cover the cut mask on the area to be plated 91. The wax immersion tank 50 is used to load the wax liquid. The mask removal module 60 is used to peel off the mask from the area to be plated 91. The electroplating module 70 is used to electroplate the electroplated part 90. The wax removal module 80 is used to remove wax from the electroplated part 90.

[0052] The electroplated part 90 is pretreated by the pretreatment module 20. In the process of pretreatment of the electroplated part 90, pollutants such as grease, dust and oxides on the surface of the electroplated part 90 are removed by solvent cleaning, alkaline cleaning and electrolytic degreasing to ensure the adhesion and uniformity of the coating; an acid solution is used to remove the surface oxide layer, and a stable oxide protective layer is formed on the surface of the electroplated part 90 to prevent the substrate from being oxidized again before electroplating; residual oxides and tiny pollutants are removed by dilute acid treatment to ensure that the surface of the electroplated part 90 is completely clean and active, and the surface activity and wettability of the electroplating solution are increased. After removing the pollutants on the surface of the electroplated part 90 and forming an oxide protective layer on the surface of the electroplated part 90, a uniform wax film can be formed on the surface of the electroplated part 90 during the wax dipping process, and the wax film is closely attached to the surface of the electroplated part 90, thereby ensuring the coverage effect of the wax film on the non-electroplating area 92 of the electroplated part 90. Since an oxide protective layer is formed on the surface of the electroplated component 90 , the bonding force between the wax film and the electroplated component 90 can be effectively reduced, so that the subsequent wax removal process can smoothly separate the wax film from the electroplated component 90 .

[0053] The mask is cut according to the shape of the area to be plated 91 by the cutting module 30 , so that the shape of the mask matches the shape of the area to be plated 91 .

[0054] After the mask is cut, the mask can be attached to the area to be plated 91 manually or by equipment.

[0055] See also Figure 5 In some embodiments of the present application, the coating module 40 includes an alignment camera 41 and a vacuum suction cup device 42 .

[0056] After the mask is cut, the cut mask is sucked by the vacuum suction cup device 42 , and then the alignment camera 41 captures the feature points of the area to be plated 91 , so that the mask can be accurately attached to the area to be plated 91 .

[0057] See also Figure 5 In some embodiments of the present application, the cutting module 30 includes: a mask fixture 31 and a cutting mold 32. The mask fixture 31 is used to fix the mask. The cutting mold 32 is used to cut the mask.

[0058] The mask to be cut is fixed by the mask fixture 31, and then the mask is cut by the cutting mold 32, so that the shape of the mask matches the shape of the area to be plated 91. The mask is cut by the cutting mold 32, so that the consistency of the shape of the mask after cutting can be effectively guaranteed and the cutting efficiency can be improved.

[0059] See also Figure 6 In some embodiments of the present application, the mask removal module 60 includes: a cutting mold 61 and a film stripping device 62. The cutting contour shape of the cutting mold 61 is adapted to the contour shape of the area to be plated 91, and the cutting mold 61 is used to cut the wax film. The film stripping device 62 is used to strip the mask from the electroplating part 90.

[0060] After the electroplated component 90 is dipped in wax, the electroplated component 90 is fixed, and the mask covering the area to be plated 91 is directed toward the cutting mold 61, and then the cutting mold 61 is aligned with the area to be plated 91 of the electroplated component 90, so that the cutting mold 61 approaches and squeezes the wax film covering the surface of the electroplated component 90, so that the wax film of the area to be plated 91 is separated from the wax film of the non-electroplated area 92.

[0061] In the process of aligning the cutting mold 61 with the area 91 to be plated of the electroplated part 90, the characteristic points of the area 91 to be plated can be identified by camera alignment, and the cutting mold 61 can be moved according to the alignment result, thereby aligning the cutting mold 61 with the area 91 to be plated of the electroplated part 90.

[0062] In some embodiments of the present application, the film peeling device 62 includes a vacuum adsorption system 63, and the vacuum adsorption system 63 peels off the mask from the electroplating part 90 by vacuum adsorption.

[0063] The mask together with the wax film covering the mask is peeled off from the electroplated part 90 by vacuum adsorption through the vacuum adsorption system 63, so that the area to be plated 91 is exposed to the wax film, thereby ensuring that the metal ions to be plated can be deposited in the area to be plated 91 during the electroplating process. After the area to be plated 91 is exposed, the electroplated part 90 is immersed in the electroplating solution, and then the area to be plated 91 is electroplated. After the electroplating is completed, since the non-electroplating area 92 is covered by the wax film, no metal ions will be deposited. After the electroplating is completed, the wax film adhering to the electroplated part 90 is removed, thereby obtaining the electroplated part 90 after partial electroplating. In this way, partial electroplating of the electroplated part 90 is achieved.

[0064] In some embodiments of the present application, the electroplating system 10 provided by the present application further includes: an edge melting device and a cooling device. The edge melting device is used to melt the edge of the wax film after the mask is removed. The cooling device is used to cool and condense the edge of the melted wax film.

[0065] After removing the mask, the wax film contour at the edge of the area to be plated 91 is melted by the edge melting device, and then the wax film contour is condensed by the cooling device, so that the wax debris and burrs are melted and then condensed into a smooth boundary line, thereby ensuring the continuity and smoothness of the edge of the electroplated layer and improving the electroplating effect.

[0066] In some embodiments of the present application, the edge melting device includes an edge melting mold, the edge of which is provided with a resistance heating component, and the shape of the edge contour of the edge melting mold is adapted to the edge contour of the area to be plated 91 .

[0067] During the edge melting process, the contour of the edge melting mold is aligned with the edge contour of the area to be plated 91, and the heat emitted by the resistance heating component is used to melt the wax debris and burrs on the wax film contour to form a smooth wax film contour.

[0068] In some embodiments of the present application, the edge melting device includes a driving mechanism and a heating rod. The driving mechanism is used to drive the heating rod to move within a spatial range.

[0069] During the edge melting process, the driving mechanism drives the heating rod to move along the wax film contour, and then the heat emitted by the heating rod melts the wax debris and burrs on the wax film contour to form a smooth wax film contour.

[0070] In some embodiments of the present application, the cooling device includes a refrigeration component and an air blowing component. The air blowing direction of the air blowing component is toward the refrigeration component.

[0071] After the wax film contour is melted, the wax film contour is cooled by the cooling device to cool down and condense the wax film contour to form a smooth wax film contour. During the cooling process, the temperature of the refrigeration component is lowered, and the air blowing component is blown toward the refrigeration component to form a low-temperature airflow. The cooling device is moved and the angle of the cooling device is adjusted so that the low-temperature airflow blows toward the wax film contour, thereby quickly cooling the wax film contour, increasing the condensation speed of the wax film contour, and improving the condensation effect of the wax film contour.

[0072] In some embodiments of the present application, the wax removal module 80 includes a hot water tank 81, which is used to contain hot water and keep the temperature of the hot water at 60°C-100°C.

[0073] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0074] In addition, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A local electroplating process, characterized in that: include: Pretreatment, removing pollutants on the surface of the electroplated parts to make the electroplated parts reach a good activation state; Covering with a mask, using the mask to cover the area to be plated of the pre-treated electroplating part; Wax dipping, immersing the electroplated part covered with the mask into wax liquid to form a wax film on the surface of the electroplated part; Mask removal, after taking the electroplated part out of the wax liquid, peel off the mask covering the area to be plated to expose the area to be plated to the wax film; electroplating, immerse the electroplated part with the area to be plated exposed to the wax film into the electroplating liquid to electroplate the electroplated part; dewaxing, clean the wax film covering the electroplated part.

2. The local electroplating process according to claim 1, characterized in that: The mask includes at least one of masking paper or masking film.

3. The local electroplating process according to claim 1, characterized in that: The mask removal includes the following steps: taking the electroplated part out of the wax liquid; cutting the wax film along the contour of the area to be plated so that the edge of the mask is exposed from the wax film; peeling off the mask so that the wax film of the area to be plated together with the mask is separated from the electroplated part, thereby exposing the area to be plated from the wax film.

4. The local electroplating process according to claim 1, characterized in that: The wax removal includes the following steps: dividing the wax film so that the wax film can fall off from the surface of the electroplated part; immersing the electroplated part in high-temperature water so that the wax film can fall off from the surface of the electroplated part; wherein the temperature of the high-temperature water is configured to be 60°C-100°C.

5. The local electroplating process according to claim 1, characterized in that: The wax removal includes the following steps: dividing the wax film so that the wax film can fall off from the surface of the electroplated part; passing a heat source through the electroplated part to increase the surface temperature of the electroplated part; wherein the temperature of the heat source is configured to be 100°C-150°C.

6. The local electroplating process according to claim 5, characterized in that: The heat source includes a resistive heating module.

7. An electroplating system, characterized in that: include: A pretreatment module, wherein the pretreatment module is used to pretreat the surface of the electroplated part; A cutting module, the cutting module is used to cut the mask according to the shape of the area to be plated of the electroplated part; A coating module, the coating module is used to cover the cut mask on the area to be plated; a wax dipping tank, the wax dipping tank is used to load wax liquid; a mask removal module, the mask removal module is used to remove the mask from the area to be plated; an electroplating module, the electroplating module is used to electroplate the electroplated part; A wax removal module is used to remove wax from the electroplated parts after electroplating.

8. The electroplating system according to claim 7, characterized in that: The cutting module comprises: a mask jig, which is used to fix the mask; and a cutting mold, which is used to cut the mask.

9. The electroplating system according to claim 7, characterized in that: The mask removal module includes: a cutting mold, the cutting contour shape of the cutting mold is adapted to the contour shape of the area to be plated, and the cutting mold is used to cut the wax film; and a film peeling device, which is used to peel off the mask from the electroplating part.

10. The electroplating system according to claim 9, characterized in that: The film peeling device comprises a vacuum adsorption system, and the vacuum adsorption system peels off the mask from the electroplating part by vacuum adsorption.

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