Ball grid array chip type receiving and transmitting assembly

Abstract

The invention discloses a ball grid array chip-type transmit-receive assembly, which comprises a transmit-receive channel circuit, a 1: N power division coupling circuit and an N-channel power phase shift unit, N is a positive integer, when the assembly is in a transmitting state, an excitation signal is input from a ball grid array and output to the 1: N power division coupling circuit through the transmit-receive channel circuit, the 1: N power division coupling circuit divides the received signal into N paths and respectively distributes the N paths to each channel of the N-channel power phase shift unit, and the N-channel power phase shift unit transmits the signal; when the assembly is in a receiving state, signals received by the N-channel power phase shift unit are coupled into one path through the 1: N power division coupling circuit and are input into the transceiving channel circuit, and the transceiving channel circuit inputs the signals into a receiver through the ball grid array; the assembly has the advantages that the assembly cost is low, and the consistency between the channels is good.

Description

Technical Field

[0001] The invention relates to the technical field of phased array radars, and in particular to a ball grid array chip-type transceiver assembly. Background Art

[0002] In recent years, with the improvement of the technology level of spaceborne synthetic aperture radar (SAR), spaceborne SAR has the advantages of all-weather, all-day, strong penetration, large-area imaging, etc., and has been widely used in military and civilian fields. T / R components are key components of spaceborne SAR, which determine the performance of spaceborne SAR, affect the sensitivity, resolution, ambiguity, imaging bandwidth and other indicators of spaceborne SAR, as well as the multi-angle rapid maneuvering adjustment and scanning capabilities of radar beams. As the array scale becomes larger and larger, the array mass will be larger. The use of conventional sparse array to reduce the array scale will bring about problems such as the height of the two-dimensional scanning grating lobe. In addition, it is limited by the energy supply, maintenance and fault detection of the working state of spaceborne SAR. Therefore, the requirements for high integration, lightweight and low cost of T / R components are becoming more and more urgent.

[0003] China Patent Authorization Announcement No. CN208999557U discloses a four-channel microwave T / R component, a four-power division network connecting four independent T / R channels in parallel, all components are monolithic microwave integrated circuits MMIC, integrated and manufactured on the same multi-layer circuit substrate, and multi-chip module MCM technology is used to realize MMIC multi-chip interconnection. The four independent T / R channels provide independent amplitude and phase control respectively, and respectively include microwave devices shared by transmission and reception, characterized in that: the microwave device is a multifunctional MMIC bare chip integrated with a six-bit amplifier compensation phase shifter shared by transmission and reception, a six-bit attenuator, a working state switch, a limiting low noise amplifier, and a driver for controlling phase shift, attenuation and switching; the multi-layer circuit substrate is a high temperature co-fired ceramic HTCC multi-layer circuit substrate. Compared with the existing microwave T / R components under the same function and index conditions, the weight and volume are reduced by more than 30%. It can be widely used in airborne, shipborne, satellite-borne phased array radar and communication fields. However, the patent application has four T / R component channels, and correspondingly, there are four other circuits, which increases the component cost and makes it difficult to ensure consistency between channels, resulting in unsatisfactory practical application results. Summary of the invention

[0004] The technical problem to be solved by the present invention is that the component cost of the T / R component in the prior art is high, and the consistency between channels is difficult to ensure, so the actual application effect is not ideal.

[0005] The present invention solves the above technical problems through the following technical means: a ball grid array chip transceiver component, including a transceiver channel circuit, a 1:N power division coupling circuit and an N-channel power phase shift unit, N is a positive integer, when the component is in a transmitting state, an excitation signal is input from the ball grid array and output to the 1:N power division coupling circuit through the transceiver channel circuit, the 1:N power division coupling circuit divides the received signal into N paths and distributes them to each channel of the N-channel power phase shift unit respectively, and the N-channel power phase shift unit transmits the signal; when the component is in a receiving state, the signal received by the N-channel power phase shift unit is coupled into one path through the 1:N power division coupling circuit and input to the transceiver channel circuit, and the transceiver channel circuit inputs the signal to the receiver through the ball grid array.

[0006] Furthermore, the transceiver channel circuit includes a multifunctional chip, a power amplifier, a limiting low noise amplifier and a ring isolator. The transmitting port of the multifunctional chip is connected to the power amplifier, the receiving port of the multifunctional chip is connected to the limiting low noise amplifier, and the power amplifier and the limiting low noise amplifier are both connected to the ring isolator.

[0007] Furthermore, the 1:N power division coupling circuit includes a directional coupler and a 1:N power divider, the directional coupler is used to couple the output power of the power amplifier in the transmitting state for channel power calibration; the 1:N power divider includes 1 input port and N power division ports, the input port is connected to the ring isolator, and the N power division ports are respectively connected to each channel of the N-channel power phase shift unit.

[0008] Furthermore, the N is 4, and the 1:N power division coupling circuit is a 1:4 power division coupling circuit.

[0009] Furthermore, the N-channel power phase shifter unit includes N-way power phase shifters and N-way power phase shift drivers, one end of the N-way power phase shifter is respectively connected to the N power division ports of the 1:N power divider, the other end of the N-way power phase shifter is respectively connected to the N-way power phase shifter driver, and the other end of the N-way power phase shifter is also respectively connected to the ball grid array; the N-way power phase shifter driver provides power drive for the N-way power phase shifter, and the N-way power phase shifter performs two-bit phase compensation on each channel.

[0010] Furthermore, the N is 4, and the N-channel power phase shift unit is a four-channel power phase shift unit.

[0011] Furthermore, the ball grid array chip transceiver assembly also includes a substrate, a frame and a cover plate, the frame is welded on the top of the substrate, the cover plate is welded to the frame in parallel, the frame and the cover plate together with the substrate form a chamber, the transceiver channel circuit, the 1:N power division coupling circuit and the N-channel power phase shifter unit are all installed in the chamber; the ball grid array is welded to the bottom of the substrate as a transmission interface for RF signals, power supply and control signals.

[0012] Furthermore, the substrate is made of Al2O3 high temperature ceramic material and is designed using HTCC multi-layer board layout technology, and high-density routing of radio frequency, power supply, and control signals is integrated internally.

[0013] Furthermore, the surrounding frame is made of titanium alloy material, and a sealing ring is welded on the top of the surrounding frame for airtight sealing.

[0014] Furthermore, the cover plate is made of Kovar alloy material, and the back of the cover plate adopts a honeycomb weight-reducing structure.

[0015] The advantages of the present invention are:

[0016] (1) Conventional N-channel TR components have multiple transceiver channel functional circuits, while the ball grid array chip transceiver component designed in the present invention has only one transceiver channel circuit, which is output to the antenna end through a 1:N power division coupling circuit and an N-channel power phase shifter. This design suppresses the scanning grating lobe through phase compensation of the N-channel power phase shifter to achieve the same function as the conventional N-channel TR component, but the number of chips on the internal transceiver channel functional circuit is only 1 / N of that of the conventional N-channel TR component, thereby reducing the component cost. In addition, since the designed transceiver channel circuit has only one channel, the channel RF indicators of the N channel are mainly achieved by this transceiver channel circuit, and the consistency between the N channels is also better than that of the conventional N-channel TR component.

[0017] (2) The ball grid array chip transceiver assembly provided by the present invention adopts an integrated packaging architecture of an HTCC substrate and a surrounding frame, and integrates the transceiver channel circuit, 1:N power division coupling circuit and N-channel power phase shift unit into a new circuit architecture. On the basis of meeting the performance requirements, it has the characteristics of light weight, high efficiency and high reliability, thereby greatly saving the cost of the system and laying an important foundation for the comprehensive integration research of the whole system. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a ball grid array chip-type transceiver assembly disclosed in an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the physical layout of a ball grid array chip-type transceiver assembly disclosed in an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of the spatial structure of a ball grid array chip-type transceiver assembly disclosed in an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of interface definition and distribution in a ball grid array chip transceiver assembly disclosed in an embodiment of the present invention;

[0022] Figure 5 The present invention is a schematic diagram of the composition principle of a functional circuit in a ball grid array chip-type transceiver assembly disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in combination with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] See also Figure 1 and Figure 2 The present invention provides a ball grid array chip transceiver component, including a transceiver channel circuit, a 1:4 power division coupling circuit and a four-channel power phase shifter. When the component is in a transmitting state, an excitation signal is input from the ball grid array 5 and output to the 1:4 power division coupling circuit through the transceiver channel circuit. The 1:4 power division coupling circuit divides the received signal into 4 paths and distributes them to each channel of the four-channel power phase shifter. The four-channel power phase shifter transmits the signal. When the component is in a receiving state, the signal received by the four-channel power phase shifter is coupled into one path through the 1:4 power division coupling circuit and input to the transceiver channel circuit. The transceiver channel circuit inputs the signal to the receiver through the ball grid array 5.

[0025] The transceiver channel circuit includes a multifunctional chip, a power amplifier (PA), a limiting low noise amplifier and a ring isolator. The transmitting port of the multifunctional chip is connected to the power amplifier, the receiving port of the multifunctional chip is connected to the limiting low noise amplifier, and the power amplifier and the limiting low noise amplifier are both connected to the ring isolator. Figure 2 In order to simplify the spatial layout of the circuit, 2.1, 2.2, 2.3 and 2.4 are used to represent the multifunctional chip, power amplifier, limiting low noise amplifier and ring isolator respectively, 2.5 represents the transceiver channel wave control and power management module, 2.6 represents the 1:4 power division coupling circuit, 2.7, 2.8, 2.9, 2.10 are 4-way power phase shift units respectively, and 2.11 and 2.12 represent power phase shift drivers.

[0026] The limited low noise amplifier mainly limits the amplitude of the received microwave signal and amplifies the low noise power to avoid the damage of the received signal to the subsequent active devices and the deterioration of the signal-to-noise ratio, and uses the transceiver wave control and power management module to provide the receiving modulation voltage. The power amplifier mainly amplifies the amplitude of the transmission signal output by the multifunctional chip, and uses the transceiver wave control and power management module to provide the drain voltage, gate voltage and control signal.

[0027] The multifunctional chip mainly integrates the digitally controlled phase shifter, digitally controlled attenuator, gain compensation amplifier, driver amplifier and radio frequency switch, and uses the transceiver wave control and power management module to generate modulated power supply and control signal to complete the mutual switching of corresponding transceiver states, gain amplification, phase and amplitude control and other functions.

[0028] The ring isolator is to minimize the amount of received signals entering the transmitting channel when the component is in the receiving state, and to minimize the amount of antenna echo signals returning to the transmitting channel and the receiving channel when the component is in the transmitting state. Therefore, the ring isolator is mainly to physically isolate the receiving channel and the transmitting channel to avoid self-excitation of the component.

[0029] The transceiver wave control and power management module integrates functions such as serial-to-parallel conversion, power modulation, gate voltage generation and adjustment, and multiple sets of data latching. According to the power supply and serial logic control signal from the ball grid array 5, it generates the switch logic control, radial phase control, and power supply signal required for the functional circuit in the corresponding channel.

[0030] Continue reading Figure 1 The 1:4 power division coupling circuit includes a directional coupler and a 1:4 power divider. The directional coupler is used to couple the output power of the power amplifier in the transmitting state for channel power calibration. The 1:4 power divider includes an input port and 4 power divider ports. The input port is connected to the ring isolator, and the 4 power divider ports are respectively connected to each channel of the four-channel power phase shift unit. The 1:4 power divider realizes the synthesis of four signals into one signal input for the synthesizer in the receiving state; and realizes the power divider realizes the power division of one signal into four signal outputs in the transmitting state.

[0031] Continue reading Figure 1 The four-channel power phase shift unit includes 4-way power phase shift units and 4-way power phase shift drivers. One end of the 4-way power phase shift units is respectively connected to the 4 power splitter ports of the 1:4 power splitter, and the other end of the 4-way power phase shift units is respectively connected to the 4-way power phase shift drivers. The other end of the 4-way power phase shift units is also respectively connected to the ball grid array 5; the output signal of the 1:4 power splitter coupling circuit reaches the power phase shift unit and is output through the ball grid array 5. The 4-way power phase shift driver provides power drive for the 4-way power phase shift unit, and the 4-way power phase shift unit performs two-bit phase compensation on each channel, which is beneficial to grating lobe suppression.

[0032] like Figure 3As shown, the ball grid array chip transceiver assembly also includes a substrate 1, a frame 3 and a cover plate 4. The frame 3 is welded on the top of the substrate 1, and the cover plate 4 is welded on the frame 3 in parallel with the sealing welding. The frame 3 and the cover plate 4 together with the substrate 1 constitute a chamber. The functional circuit 2, that is, the transceiver channel circuit, the 1:4 power division coupling circuit and the four-channel power phase shift unit are all installed in the chamber; the ball grid array 5 is welded to the bottom of the substrate 1 as a transmission interface for radio frequency signals, power supply and control signals.

[0033] The substrate 1 is made of Al2O3 high temperature ceramic material, and integrates the transceiver channel circuit, 1:N power division coupling circuit and N-channel power phase shift unit into an integrated design. It consists of 10 layers of circuits and integrates high-density routing of RF, power supply and control signals.

[0034] The frame 3 is made of titanium alloy with a lighter density as the main material, and a 0.3 mm Kovar sealing ring is welded on the top of the frame 3 for airtight sealing. The frame 3 is welded on the substrate 1 and forms a chamber together with the substrate 1. Figure 3 A schematic diagram of the functional circuit and internal chamber physical layout of a ball grid array chip transceiver assembly is shown in the figure, in which the chamber is used for the layout and installation of the functional circuit unit. The cover plate 4 is welded to the surrounding frame 3 in parallel with the sealing welding. The back of the cover plate 4 adopts a honeycomb weight-reducing structure, which not only reduces the weight of the cover plate 4 but also ensures the overall structural strength of the cover plate 4.

[0035] The ball grid array 5 is used as a transmission interface for radio frequency signals, power supply and control signals. It uses solder balls with a diameter of 0.45 mm and a spacing of 1 mm. It is distributed in an array of 15*25 and is soldered on the back of the substrate 1. The BGA solder ball function pins are defined as follows: Figure 4 As shown, 4.1, 4.2, 4.5, and 4.6 are four antenna interfaces respectively, 4.3 and 4.4 are logic control signal interfaces, 4.7 and 4.8 are power signal interfaces, 4.9 is a receive / transmit coupling correction port, and 4.10 is an input main port.

[0036] The following is combined with Figure 5 A schematic diagram of the circuit composition and principle of a ball grid array chip transceiver component, taking 1 channel as an example, explains the electrical connection relationship between each module and circuit.

[0037] The lumped port BGA solder ball is welded on the back of the substrate 1, and the transmission between the front signal of the substrate 1 and the solder ball is realized through the vertical interconnection structure. It is connected to the common port of the multifunctional chip (the transmit output end / receive input port of the module is multiplexed), the transmit port of the multifunctional chip is connected to the input end of the power amplifier, the output end of the power amplifier is connected to the transmit input end of the ring isolator, the transmit output end of the ring isolator is connected to a 1:4 power division coupling circuit with 4 transmit output ends, and the output end of each 1:4 power division coupling circuit is connected to a power phase shifter unit, and the power phase shifter unit is connected to the surface transmission pad of the transmit input port through the vertical interconnection structure and the antenna port BGA solder ball on the back of the substrate 1. Similarly, in the receiving state, the lumped port BGA solder ball is welded on the back of the substrate 1, and the transmission between the front signal of the substrate 1 and the solder ball is realized through the vertical interconnection structure. It is connected to the common port of the multifunctional chip (the transmit output end / receive input port of the module is multiplexed), and the receiving end of the multifunctional chip is connected to a limiting low noise amplifier. The output end of the limiting low noise amplifier is connected to the transmitting input end of the ring isolator, the transmitting output end of the ring isolator is connected to a 1:4 power division coupling circuit with 4 transmitting output ends, the output end of each 1:4 power division coupling circuit is connected to a power phase shifting unit, and the power phase shifting unit is connected to the surface transmission pad of the transmitting input port and the antenna port BGA solder ball on the back of the substrate 1 through a vertical interconnection structure.

[0038] The power signal and serial control signal required by the receiving and transmitting wave control and power management module of each channel are respectively derived from the solder balls in the 4.3, 4.4, 4.7, 4.8 areas on the back of the substrate 1, and the outputs are respectively connected to all functional circuits in the channel to provide the power and control signals required by the functional devices when the channel is working. Taking channel 1 as an example, it is connected to the limiting low noise amplifier to provide it with the corresponding receiving power modulation signal; it is connected to the power amplifier to provide it with the drain voltage, gate voltage and switch control signal of the corresponding mode operation; it is connected to the multifunctional chip to provide it with the corresponding receiving and transmitting modulation power, switch control and radiation phase control signal, etc. The power signal and serial control signal required by the amplifying wave control and power management module in the chamber are respectively derived from the solder balls in the 4.3, 4.4, 4.7, 4.8 areas on the back of the substrate 1, and the outputs are respectively connected to the multifunctional chip in the chamber to provide it with the control and corresponding power modulation signals required for the module operation.

[0039] Continue reading Figure 4 and Figure 5 The working principle of the ball grid array chip transceiver assembly is described as follows:

[0040] Based on the received external control command signal, the corresponding channel generates the transmission and reception switching, transmission and reception phase shift, reception amplitude and power control signals. During the transmission period, the channel completes the power amplification and transmission phase shift of the corresponding transmission signal; during the reception period, it completes the functions of limited low noise amplification, reception phase shift, reception gain control, etc.

[0041] When the transmitting working state is turned on, the transmitting signal is fed in through the lumped port BGA solder ball on the back, driven and amplified by the multi-functional chip, and the power amplifier amplifies the power to the target power. Then, it passes through the ring isolator to reach the 1:4 power division coupling circuit, and then 1:4 power division is sent to the power phase shift unit, and output through the antenna port BGA solder ball.

[0042] When the receiving working state is turned on, the receiving signal through the antenna port BGA solder ball will reach the 1:4 synthetic coupling circuit after passing through the power phase shift unit, and then pass through the ring isolator and the limiting low noise amplifier to the receiving end of the multi-function chip, and finally output through the centralized port BGA ball.

[0043] Through the above technical solution, the transceiver channel circuit of the present invention is different from the conventional four-channel TR component in that the conventional four-channel TR component has four transceiver channel function circuits, while the present invention Figure 1 The designed ball grid array chip transceiver component has only one transceiver channel functional circuit, and forms four outputs to the antenna end through a 1:4 power division coupling circuit and a four-way power phase shifter. This design suppresses the scanning grating lobe through phase compensation of the four-way power phase shifter to achieve the same function as a conventional four-channel TR component, but the number of chips on the internal transceiver channel functional circuit is only 1 / 4 of that of a conventional four-channel TR component, reducing the component cost. In addition, since the designed transceiver channel functional circuit has only one channel, the channel RF indicators of the four channels are mainly achieved by this transceiver channel functional circuit, and the consistency between the four channels is also better than that of a conventional four-channel TR component.

[0044] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A ball grid array chip transceiver assembly, characterized in that: It includes a transceiver channel circuit, a 1:N power division coupling circuit and an N-channel power phase shift unit, where N is a positive integer. When the component is in a transmitting state, an excitation signal is input from the ball grid array and output to the 1:N power division coupling circuit through the transceiver channel circuit. The 1:N power division coupling circuit divides the received signal into N paths and distributes them to each channel of the N-channel power phase shift unit respectively, and the N-channel power phase shift unit transmits the signal. When the component is in the receiving state, the signal received by the N-channel power phase shift unit is coupled into one channel through the 1:N power division coupling circuit and input to the transceiver channel circuit, and the transceiver channel circuit inputs the signal to the receiver through the ball grid array.

2. A ball grid array chip transceiver assembly according to claim 1, characterized in that: The transceiver channel circuit includes a multifunctional chip, a power amplifier, a limiting low noise amplifier and a ring isolator. The transmitting port of the multifunctional chip is connected to the power amplifier, the receiving port of the multifunctional chip is connected to the limiting low noise amplifier, and the power amplifier and the limiting low noise amplifier are both connected to the ring isolator.

3. A ball grid array chip transceiver assembly according to claim 2, characterized in that: The 1:N power division coupling circuit includes a directional coupler and a 1:N power divider, wherein the directional coupler is used to couple the output power of the power amplifier in the transmitting state for channel power calibration; the 1:N power divider includes an input port and N power division ports, wherein the input port is connected to the ring isolator, and the N power division ports are respectively connected to each channel of the N-channel power phase shifting unit.

4. A ball grid array chip transceiver assembly according to claim 3, characterized in that: The N is 4, and the 1:N power division coupling circuit is a 1:4 power division coupling circuit.

5. The ball grid array chip transceiver assembly according to claim 3, characterized in that: The N-channel power phase shift unit comprises N-way power phase shift units and N-way power phase shift drivers, one end of the N-way power phase shift unit is respectively connected to the N power splitter ports of the 1:N power splitter, the other end of the N-way power phase shift unit is respectively connected to the N-way power phase shift driver, and the other end of the N-way power phase shift unit is also respectively connected to the ball grid array; The N-way power phase shift driver provides power drive for the N-way power phase shift units, and the N-way power phase shift units perform two-bit phase compensation on each way.

6. A ball grid array chip transceiver assembly according to claim 5, characterized in that: The N is 4, and the N-channel power phase shift unit is a four-channel power phase shift unit.

7. The ball grid array chip transceiver assembly according to claim 5, characterized in that: It also includes a substrate, a frame and a cover plate, wherein the frame is welded on top of the substrate, and the cover plate is welded to the frame in parallel with the frame, and the frame, the cover plate and the substrate together form a chamber, and the transceiver channel circuit, the 1:N power division coupling circuit and the N-channel power phase shifting unit are all installed in the chamber; the ball grid array is welded to the bottom of the substrate as a transmission interface for radio frequency signals, power supply and control signals.

8. The ball grid array chip transceiver assembly according to claim 7, characterized in that: The substrate is made of Al2O3 high temperature ceramic material and is designed using HTCC multi-layer board layout technology, with high-density routing of radio frequency, power supply, and control signals integrated inside.

9. The ball grid array chip transceiver assembly according to claim 7, characterized in that: The surrounding frame is made of titanium alloy material, and a sealing ring is welded on the top of the surrounding frame for airtight sealing.

10. The ball grid array chip transceiver assembly according to claim 7, characterized in that: The cover plate is made of Kovar alloy material, and the back of the cover plate adopts a honeycomb weight-reducing structure.

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