Device for analyzing heat transfer process of 3D printed wall

Abstract

The invention provides a 3D printed wall heat transfer process analysis device, which is characterized by comprising a first correction coefficient calculation module used for calculating a first correction coefficient according to a wall volume, a circumscribed rectangle volume, a wall surface area, a convex-free wall surface area and material geometric parameters; the second correction coefficient calculation module is used for calculating a second correction coefficient according to the wall body volume, the wall body surface area, the non-convex wall body volume and the non-convex wall body surface area; and the heat transfer calculation module is used for calculating the surface average heat flow and the surface average temperature as heat transfer process analysis results according to the heat transfer environment parameters, the convex-free material geometric parameters, the thermophysical property parameters, the first correction coefficient and the second correction coefficient in combination with a heat transfer equation. In short, the method can efficiently, conveniently and accurately obtain the analysis result of the heat transfer process.

Description

Technical Field

[0001] The invention belongs to the field of material analysis, and in particular relates to a 3D printing wall heat transfer process analysis device. Background Art

[0002] 3D printed buildings are a new type of building, and their energy performance and sustainable development potential have always attracted much attention. There are still many unknowns about the thermal performance of 3D printed buildings, which affects the accurate assessment of their building energy efficiency. Among them, 3D printed walls have layer-by-layer surface characteristics. This surface shape is formed by the layer-by-layer printing process, which will affect the thermal performance and heat transfer process of the wall structure, and its impact needs to be analyzed.

[0003] However, although existing research has paid extensive attention to the thermal performance of 3D printed materials and 3D printed structures, it mainly focuses on improving the thermal conductivity of the printed materials themselves, and developing high-performance 3D printed materials by changing the material composition and ratio, without considering the influence of the geometric characteristics of the 3D printed structure itself. Therefore, existing research will be biased in evaluating the thermal performance of 3D printed walls and the energy efficiency of 3D printed buildings.

[0004] However, the size of the printed layer is small compared to the overall size of the wall. If the modeling and analysis of the surface shape are considered, it will increase the overall workload and increase the difficulty of research in complex problems.

[0005] In short, the existing technology cannot accurately and conveniently analyze the heat transfer process of 3D printed structures. Summary of the invention

[0006] The present invention is made to solve the above-mentioned problem, and its purpose is to provide a 3D printed wall heat transfer process analysis device.

[0007] The present invention provides a 3D printed wall heat transfer process analysis device, which is used to obtain the heat transfer process analysis result of the wall composed of 3D printed materials in the heat transfer environment according to the material geometric parameters and thermophysical parameters of the 3D printed materials, the heat transfer environment parameters of the heat transfer environment and the wall geometric parameters of the wall, and has the following characteristics, including: a non-convex geometric parameter calculation module, which is used to obtain the non-convex material geometric parameters according to the material geometric parameters; a first body surface area calculation module, which is used to calculate the wall volume, the circumscribed rectangle volume and the wall surface area under the unit thickness of the wall geometric model according to the material geometric parameters and the wall geometric parameters; a second body surface area calculation module, which is used to calculate the wall volume, the circumscribed rectangle volume and the wall surface area under the unit thickness of the wall geometric model according to the non-convex material geometric parameters and the wall geometric parameters; The wall geometry parameters are used to calculate the non-convex wall volume and non-convex wall surface area under unit thickness of the wall geometry model; the first correction coefficient calculation module is used to calculate the first correction coefficient according to the wall volume, the circumscribed rectangle volume, the wall surface area, the non-convex wall surface area and the material geometry parameters; the second correction coefficient calculation module is used to calculate the second correction coefficient according to the wall volume, the wall surface area, the non-convex wall volume and the non-convex wall surface area; the heat transfer calculation module is used to calculate the surface average heat flux and the surface average temperature as the heat transfer process analysis results according to the heat transfer environment parameters, the non-convex material geometry parameters, the thermophysical properties parameters, the first correction coefficient and the second correction coefficient.

[0008] The 3D printing wall heat transfer process analysis device provided by the present invention may also have the following features: wherein the 3D printing material is a printing filament, and the material geometric parameters include the middle width w of the cross section of the printing filament. b , protrusion width w c , height h, arc radius r c and the convexity coefficient a.

[0009] The 3D printed wall heat transfer process analysis device provided by the present invention may also have the following features: wherein the calculation expression of the first correction coefficient is: w=2w c +w b , where α s is the first correction coefficient, V a＝i is the wall volume, V ext,rect is the volume of the circumscribed rectangle, A a＝0 is the surface area of ​​the non-convex wall, A a＝i is the surface area of ​​the wall.

[0010] In the 3D printed wall heat transfer process analysis device provided by the present invention, it can also have the following characteristics: wherein the calculation expression of the second correction coefficient is: Where V a＝i is the wall volume, A a＝i is the wall surface area, Va＝0 is the volume of the non-convex wall, A a＝0 It is the surface area of ​​non-convex wall.

[0011] The 3D printed wall heat transfer process analysis device provided by the present invention may also have the following features: wherein the middle width w b , protrusion width w c , height h, arc radius r c There is a quantitative relationship between the convexity coefficient a and the expression is: w = 2w c +w b , Where w is the total length of the printed filament cross section.

[0012] The 3D printed wall heat transfer process analysis device provided by the present invention may also have the following features: wherein the value range of the convexity coefficient a is [0,1], and in the non-convex geometric parameter calculation module, the convexity coefficient a and the convexity width w in the material geometric parameters are calculated. c The values ​​of are set to 0 and the arc radius r is removed c , then the non-convex material geometric parameters are obtained.

[0013] In the 3D printed wall heat transfer process analysis device provided by the present invention, it can also have the following characteristics: wherein, the heat transfer calculation module includes: a heat flow calculation unit, which is used to calculate the surface average heat flow according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermophysical parameters and the first correction coefficient, combined with the one-dimensional heat transfer equation; a temperature calculation unit, which is used to construct and solve the temperature change calculation formula according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermophysical parameters, the first correction coefficient and the second correction coefficient to obtain the surface average temperature.

[0014] The 3D printed wall heat transfer process analysis device provided by the present invention may also have the following features: wherein the calculation expression of the surface average heat flux is: Where λ m is the thermal conductivity coefficient in the thermophysical parameters, w b is the middle width in the material geometric parameters, is the temperature difference between the two sides of the wall, α s is the first correction coefficient, is the average surface heat flux.

[0015] The 3D printed wall heat transfer process analysis device provided by the present invention may also have the following features: wherein, in the temperature calculation unit, the temperature change per unit time step is calculated according to the temperature change calculation formula, and the surface average temperature is obtained according to the temperature change, and the temperature change calculation formula is: Where αs is the first correction coefficient, a t is the second correction coefficient, Δq a＝0 is the average heat flux on the non-convex surface, ΔT is the surface temperature change, Δq a＝i is the average surface heat flux.

[0016] In the 3D printed wall heat transfer process analysis device provided by the present invention, it can also have the following characteristics: wherein the heat transfer environment parameters include outdoor temperature, indoor temperature, initial wall temperature, outdoor convective heat transfer coefficient and indoor convective heat transfer coefficient, and the thermal physical property parameters include thermal conductivity, density and specific heat.

[0017] Functions and Effects of the Invention

[0018] According to the 3D printing wall heat transfer process analysis device involved in the present invention, the first correction coefficient and the second correction coefficient are calculated by material geometric parameters and wall geometric parameters, and then the heat transfer process analysis result corresponding to the wall of any convexity is obtained according to the first correction coefficient and the second correction coefficient, combined with the heat transfer process calculation method when the wall is a plane. Therefore, the 3D printing wall heat transfer process analysis device of the present invention can efficiently, conveniently and accurately obtain the heat transfer process analysis result. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of a cross section of a printed filament in an embodiment of the present invention;

[0020] Figure 2 is a block diagram of a 3D printed wall heat transfer process analysis device in an embodiment of the present invention;

[0021] Figure 3 Schematic diagram of the wall volume, circumscribed rectangle volume and wall surface area in an embodiment of the present invention. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the following embodiments and accompanying drawings specifically illustrate the 3D printed wall heat transfer process analysis device of the present invention.

[0023] In this embodiment, a 3D printed wall heat transfer process analysis device is provided, which is used to obtain a heat transfer process analysis result of a wall made of 3D printed material in a heat transfer environment according to material geometric parameters and thermophysical property parameters of the 3D printed material, heat transfer environment parameters of the heat transfer environment, and wall geometric parameters of the wall.

[0024] The heat transfer environment parameters include outdoor temperature, indoor temperature, initial wall temperature, outdoor convection heat transfer coefficient and indoor convection heat transfer coefficient. Thermophysical parameters include thermal conductivity, density and specific heat.

[0025] In this embodiment, the 3D printing material is printing filaments, and the wall is formed by stacking multiple printing filaments along the height direction. In this embodiment, the wall geometric parameter is the wall height, that is, the sum of the heights of all the printing filaments constituting the wall.

[0026] Figure 1 Schematic diagram of the cross section of the printed filament in an embodiment of the present invention.

[0027] like Figure 1 As shown, the cross section of the printed filament consists of a rectangle and arcs distributed on both sides of the rectangle. The length of the rectangle is the middle width w b The width of the rectangle is the height of the printed filament, which is the height h, and the width of the arc is the convex width w. c , the radius of the circle corresponding to the arc is the arc radius r c Since the printing filament can have different cross-sectional shapes, in this embodiment, the shape of the arc is adjusted by the convexity coefficient a, combined with the shape change of the rectangle, so that the printing filament of any shape can be obtained according to all the above parameters. The set of these parameters is the material geometry parameter, that is, the material geometry parameter includes the middle width w of the cross section of the printing filament b , protrusion width w c , height h, arc radius r c and the convexity coefficient a. These parameters have the following quantitative relationship:

[0028] w=2w c +w b ,

[0029]

[0030]

[0031] Where w is the total length of the printed filament cross section. In this embodiment, the range of the convexity coefficient a is [0,1]. When a=0, there is no arc radius r c , and there is no arc shape, that is, the printed filament is a rectangle.

[0032] Figure 2 3D printing wall heat transfer process analysis device in an embodiment of the present invention.

[0033] like Figure 2 As shown, the 3D printed wall heat transfer process analysis device 100 includes a non-convex geometric parameter calculation module 10, a first body surface area calculation module 20, a second body surface area calculation module 30, a first correction coefficient calculation module 40, a second correction coefficient calculation module 50, a heat transfer calculation module 60 and a control module 70 for controlling the operation of the above modules.

[0034] The non-convex geometric parameter calculation module 10 is used to obtain non-convex material geometric parameters according to the material geometric parameters.

[0035] Among them, in the non-convex geometric parameter calculation module 10, the convex coefficient a and the convex width w in the material geometric parameters are c The values ​​of are set to 0, and the arc radius r c The value of is set to half of the value of the height h, and the non-convex material geometric parameters are obtained. That is, the non-convex material geometric parameters include the convex coefficient a with a value of 0 and the convex width w c , and the intermediate width w is the same as the material geometric parameters b and height h.

[0036] The first volume surface area calculation module 20 is used to calculate the wall volume, the circumscribed rectangle volume and the wall surface area under unit thickness of the wall geometric model according to the material geometric parameters and the wall geometric parameters.

[0037] Figure 3 Schematic diagram of the wall volume, circumscribed rectangle volume and wall surface area in an embodiment of the present invention.

[0038] like Figure 3 As shown in the figure, for a wall formed by stacking 5 printing filaments, the rectangular frame around the outer edge of the wall is the circumscribed rectangle. Then the wall volume is the volume per unit thickness corresponding to the wall cross section, the circumscribed rectangle volume is the volume per unit thickness corresponding to the circumscribed rectangle, and the wall surface area is the surface area per unit thickness corresponding to the arcs of the 5 printing filaments on both sides of the wall.

[0039] The second volume surface area calculation module 30 is used to calculate the non-convex wall volume and the non-convex wall surface area under unit thickness of the wall geometric model according to the non-convex material geometric parameters and the wall geometric parameters.

[0040] The first correction coefficient calculation module 40 is used to calculate the first correction coefficient according to the wall volume, the circumscribed rectangle volume, the wall surface area, the non-convex wall surface area and the material geometric parameters.

[0041] Among them, the calculation expression of the first correction coefficient is:

[0042]

[0043] w=2w c +w b ,

[0044] Where α s is the first correction coefficient, V a =i is the volume of the wall, V ext，rect is the volume of the circumscribed rectangle, A a＝0 is the surface area of ​​the non-convex wall, A a＝iis the surface area of ​​the wall.

[0045] The derivation process of the first correction coefficient is described below:

[0046] The plane is the width of the convexity w c = 0, compared to the convexity, that is, the convexity width w c When ≠ 0, thermal performance calculation can be performed more conveniently and quickly. Therefore, on the basis of simplifying the surface shape into a plane, the equivalent heat transfer correction coefficient, namely the first correction coefficient, is introduced to quantify the influence of surface geometry on thermal conductivity.

[0047] In steady state, the heat flux through each part of a homogeneous material is equal to the heat flux through the entire structure, as shown in the following equation:

[0048]

[0049] For a 3D printed structure with a convex surface, when it is approximated as a plane surface, its approximate one-dimensional heat transfer equation satisfies the following equation:

[0050]

[0051] For structures with planar surfaces, the one-dimensional heat transfer equation satisfies the following equation:

[0052]

[0053] The goals of this simplification are: and That is, the heat flux on a simplified structure with a flat surface After correction, the same surface average temperature difference as the unsimplified surface raised 3D printed structure can be calculated and the average surface heat flux Therefore, the heat flow calculation correction factor is obtained:

[0054]

[0055] According to the thermal resistance calculation formula, the calculation expression of the structural thermal resistance when the surface is a plane is:

[0056]

[0057] At the same time, according to the above calculation formula, the calculation expression of the overall thermal resistance of the 3D printed structure with protrusions is:

[0058]

[0059] According to the above formula, the equivalent thermal resistance of the structure has changed due to the existence of surface protrusions.

[0060] For 3D printed structures, the one-dimensional heat transfer heat flow can be approximated as:

[0061]

[0062] Where α R is the correction value, is the equivalent thermal resistance per unit height of the 3D printed raised structure.

[0063] For the above one-dimensional heat transfer heat flow expression, the following formula can be obtained:

[0064]

[0065] Then, the correction value α R The calculation expression is:

[0066]

[0067] Then, the first correction coefficient α is derived according to the above expressions: s The final expression to be evaluated.

[0068] The second correction coefficient calculation module 50 is used to calculate the second correction coefficient according to the wall volume, the wall surface area, the non-convex wall volume and the non-convex wall surface area.

[0069] Among them, the calculation expression of the second correction coefficient is:

[0070]

[0071] Where V a＝i is the wall volume, A a＝i is the wall surface area, V a＝0 is the volume of the non-convex wall, A a＝0 It is the surface area of ​​non-convex wall.

[0072] The derivation process of the second correction coefficient is described below:

[0073] For transient heat transfer processes, the temperature change of the structure per unit time step is also involved, which also needs to be corrected. According to the law of energy conservation:

[0074] ρc p VΔT=A·Δq.

[0075] For 3D printed structures:

[0076] ρc p V a＝i ΔT=A a＝i ·Δq a＝i ,

[0077]

[0078] For structures with planar surfaces:

[0079] ρc p V a＝0 ΔT=A a＝i α s Δq a＝0 ,

[0080]

[0081] Need order but:

[0082]

[0083] Then, the final expression of the second correction coefficient is obtained according to the above formula.

[0084] The heat transfer calculation module 60 is used to calculate the surface average heat flux and surface average temperature as the heat transfer process analysis result based on the heat transfer environment parameters, the non-convex material geometric parameters, the thermophysical property parameters, the first correction coefficient and the second correction coefficient in combination with the heat transfer equation.

[0085] The heat transfer calculation module 60 includes a heat flow calculation unit 601 and a temperature calculation unit 602 .

[0086] The heat flow calculation unit 601 is used to calculate the surface average heat flow according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermophysical property parameters and the first correction coefficient in combination with the one-dimensional heat transfer equation.

[0087] The calculation expression of the average surface heat flux is:

[0088]

[0089]

[0090]

[0091] Where λ m is the thermal conductivity coefficient in the thermophysical parameters, w b is the middle width in the material geometric parameters, is the temperature difference between the two sides of the wall, that is, the difference between the surface temperature of the outdoor wall and the surface temperature of the indoor wall, α s is the first correction coefficient, is the average surface heat flux.

[0092] The temperature calculation unit 602 is used to construct and solve the temperature change calculation formula according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermal physical property parameters, the first correction coefficient and the second correction coefficient to obtain the surface average temperature.

[0093] In the temperature calculation unit 602, the temperature change per unit time step is calculated according to the temperature change calculation formula, and the surface average temperature is obtained according to the temperature change. The temperature change calculation formula is:

[0094]

[0095] Where α s is the first correction coefficient, α t is the second correction coefficient, Δq a＝0 is the average heat flux on the non-convex surface, ΔT is the surface temperature change, Δq a＝i is the average surface heat flux.

[0096] The control module 70 stores a control program for controlling the operation of each module.

[0097] In this embodiment, the heat transfer process of the wall is simulated for 24 hours. During the simulation, the ambient temperature difference on both sides of the 3D printed structure, i.e., the wall, is kept constant to reduce the complex impact of environmental changes on the results. The specific parameters are set as follows: the temperature convergence standard is set to less than 10 -8 , the outdoor temperature is 0℃, the indoor temperature is 20℃, the temperature difference is 20℃, and the outdoor convection heat transfer coefficient is 23.0W / (m 2 *K), the indoor side convection heat transfer coefficient is set to 8.7W / (m 2 *K), thermal conductivity is 1W / (m*K), density is 2400kg / m 3 The specific heat is 880 J / (kg*K). Adiabatic boundary conditions are applied to the top and bottom surfaces of the structure, and the initial wall temperature is the same as the low temperature side ambient temperature, i.e., the outdoor temperature.

[0098] In the above heat transfer simulation process, complex simulation is performed based on the heat conduction formula taking into account the surface shape. The calculated equivalent thermal resistance and the first correction coefficient are shown in the following table:

[0099] Convexity coefficient Equivalent thermal resistance First correction factor a＝1.0 0.1738 0.5755 a＝0.8 0.1508 0.6632 a＝0.6 0.1313 0.7618 a＝0.4 0.1159 0.8629 a＝0.2 0.1053 0.9495 a＝0.0 0.1000 1.000

[0100] The first column in the above table is the various protrusion coefficients, and the second and third columns are the equivalent thermal resistance and the first correction coefficient corresponding to the printing filaments corresponding to the various protrusion coefficients.

[0101] In the above-mentioned simulated heat transfer process, the equivalent thermal resistance and the first correction coefficient calculated by the 3D printed wall heat transfer process analysis device 100 of this embodiment are shown in the following table:

[0102] Convexity coefficient Equivalent thermal resistance First correction factor a＝1.0 0.1748 0.5836 a＝0.8 0.1514 0.6731 a＝0.6 0.1316 0.7726 a＝0.4 0.1160 0.8727 a＝0.2 0.1053 0.9563 a＝0.0 0.1000 1.000

[0103] The first column in the above table is the various protrusion coefficients, and the second and third columns are the equivalent thermal resistance and the first correction coefficient corresponding to the printing filaments corresponding to the various protrusion coefficients.

[0104] It can be seen from the above two tables that the equivalent thermal resistance and the first correction coefficient simplified and generated by the 3D printing wall heat transfer process analysis device 100 of this embodiment are well consistent with the equivalent thermal resistance and the first correction coefficient obtained by complex simulation by considering the surface shape through the heat conduction formula. That is, the heat transfer process analysis results can be obtained efficiently, conveniently and accurately through the 3D printing wall heat transfer process analysis device 100.

[0105] Functions and Effects of the Embodiments

[0106] According to the 3D printed wall heat transfer process analysis device involved in this embodiment, the first correction coefficient and the second correction coefficient are calculated by material geometric parameters and wall geometric parameters, and then the heat transfer process analysis results corresponding to the wall of any convexity are obtained according to the first correction coefficient and the second correction coefficient, combined with the heat transfer process calculation method when the wall is a plane. In short, this method can efficiently, conveniently and accurately obtain the heat transfer process analysis results.

[0107] Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A 3D printed wall heat transfer process analysis device, used to obtain a heat transfer process analysis result of a wall composed of 3D printed materials in a heat transfer environment according to material geometric parameters and thermophysical parameters of the 3D printed materials, heat transfer environment parameters of the heat transfer environment, and wall geometric parameters of the wall, characterized in that: include: A non-convex geometric parameter calculation module, used for obtaining non-convex material geometric parameters according to the material geometric parameters; A first volume surface area calculation module, used for calculating the wall volume, circumscribed rectangle volume and wall surface area under unit thickness of the wall geometric model according to the material geometric parameters and the wall geometric parameters; A second volume surface area calculation module is used to calculate the non-convex wall volume and the non-convex wall surface area under unit thickness of the wall geometric model according to the non-convex material geometric parameters and the wall geometric parameters; A first correction coefficient calculation module, used for calculating a first correction coefficient according to the wall volume, the circumscribed rectangle volume, the wall surface area, the non-convex wall surface area and the material geometric parameters; A second correction coefficient calculation module, used for calculating a second correction coefficient according to the wall volume, the wall surface area, the non-convex wall volume and the non-convex wall surface area; The heat transfer calculation module is used to calculate the surface average heat flux and the surface average temperature as the analysis result of the heat transfer process according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermophysical property parameters, the first correction coefficient and the second correction coefficient in combination with the heat transfer equation.

2. The 3D printed wall heat transfer process analysis device according to claim 1, characterized in that: in, The 3D printing material is printing filaments, The material geometry parameters include the middle width w of the cross section of the printed filament b , protrusion width w c , height h, arc radius r c and the convexity coefficient a.

3. The 3D printed wall heat transfer process analysis device according to claim 2, characterized in that: in, The calculation expression of the first correction coefficient is: w=2w c +w b , Where α s is the first correction coefficient, V a＝i is the wall volume, V ext,rect is the volume of the circumscribed rectangle, A a＝0 is the surface area of ​​the non-convex wall, A a＝i is the surface area of ​​the wall.

4. The 3D printed wall heat transfer process analysis device according to claim 2, characterized in that: in, The calculation expression of the second correction coefficient is: Where V a＝i is the wall volume, A a＝i is the wall surface area, V a＝0 is the volume of the non-convex wall, A a＝0 is the surface area of ​​the non-convex wall.

5. The 3D printed wall heat transfer process analysis device according to claim 2, characterized in that: in, The middle width w b , the protrusion width w c , the height h, the arc radius r c There is a quantitative relationship between and the convexity coefficient a, and its expression is: w=2w c +w b , Wherein w is the total length of the cross section of the printing filament.

6. The 3D printed wall heat transfer process analysis device according to claim 2, characterized in that: in, The value range of the convexity coefficient a is [0,1], In the non-convex geometric parameter calculation module, the convex coefficient a and the convex width w in the material geometric parameters are c The values ​​are set to 0 and the arc radius r is removed c , then the geometric parameters of the non-convex material are obtained.

7. The 3D printed wall heat transfer process analysis device according to claim 1, Features: Wherein, the heat transfer calculation module includes: A heat flow calculation unit, configured to calculate the surface average heat flow according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermophysical property parameters and the first correction coefficient in combination with a one-dimensional heat transfer equation; The temperature calculation unit is used to construct and solve the temperature change calculation formula according to the heat transfer environment parameters, the non-convex material geometric parameters, the thermal physical property parameters, the first correction coefficient and the second correction coefficient to obtain the surface average temperature.

8. The 3D printed wall heat transfer process analysis device according to claim 7, characterized in that: in, The calculation expression of the surface average heat flux is: Where λ m is the thermal conductivity in the thermal physical parameters, w b is the middle width in the material geometric parameters, is the temperature difference between the two sides of the wall, α s is the first correction coefficient, is the average heat flux on the surface.

9. The 3D printed wall heat transfer process analysis device according to claim 7, characterized in that: in, In the temperature calculation unit, the temperature change per unit time step is calculated according to the temperature change calculation formula, and the surface average temperature is obtained according to the temperature change. The temperature change calculation formula is: Where α s is the first correction coefficient, α t is the second correction coefficient, Δq a＝0 is the average heat flux on the non-convex surface, ΔT is the surface temperature change, Δq a＝i is the average surface heat flux.

10. The 3D printed wall heat transfer process analysis device according to claim 1, characterized in that: in, The heat transfer environment parameters include outdoor temperature, indoor temperature, initial wall temperature, outdoor convective heat transfer coefficient and indoor convective heat transfer coefficient. The thermophysical parameters include thermal conductivity, density and specific heat.

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