Parasitic parameter-based SPICE model establishment method, system and device for three-phase motor power driving module, and storage medium

Abstract

The invention relates to the field of device modeling and simulation, in particular to an SPICE model establishment method, system and device of a three-phase motor power driving module based on parasitic parameters and a storage medium. Comprising the following steps: S1, constructing a grid driver model and a power MOSFET model, and combining to obtain a three-phase motor power driving module model; s2, establishing a packaging structure based on the three-phase motor power driving module, and extracting parasitic parameters based on the packaging structure; according to the method, behavior-level modeling is carried out by taking the electrical characteristics of the device as the core, the contradiction of complex power module modeling in the aspects of convergence, accuracy and simulation efficiency is effectively avoided, the simulation efficiency is improved by more than one order of magnitude, and conditions are provided for rapid iterative optimization of product design; compared with an actual test result, the simulation result of the established model is relatively high in electrical parameter precision, and the simulation error is less than 10%, which indicates that the established simulation model can accurately describe the actual characteristics of the module.

Description

Technical Field

[0001] The present invention relates to the field of device modeling and simulation, and in particular to a SPICE model establishment method, system, device and storage medium for a three-phase motor power drive module based on parasitic parameters. Background Art

[0002] At present, full-process digital design and simulation verification have become a common implementation method for product development. Using digital models for simulation verification can further enrich the means of testing and verifying the functional performance of complex aerospace products. Compared with experimental methods, it has many advantages such as strong reproducibility, small resource occupation, convenient modification, fast and safe. It can carry out functional performance and reliability analysis and verification in the product principle design stage, providing a basis for the successful finalization of the product. The device-level and module-level digital models are an important foundation for supporting the digital development of products.

[0003] The existing device digital modeling methods are mainly for simple discrete devices, such as diodes, triodes, MOSFETs, IGBTs, memories, etc. There are fewer digital models of power modules, and the focus is on the modeling methods of power modules composed of multiple MOSFETs or IGBTs; the existing power module digital modeling is mainly for the modeling of electrical characteristics, without considering the impact of package parasitic parameters on module output performance. Under the influence of parasitic parameters, the dynamic switching process of the power module will be accompanied by higher current and voltage overshoots. The combination of thermal simulation and electrical simulation is not considered, and there is a lack of SPICE modeling methods for module junction temperature prediction. For the three-phase motor power drive module with multiple chips (gate drivers, power tubes) integrated internally, it is impossible to fully and accurately establish a SPICE model, which restricts the design simulation and reliability prediction of the power module. Summary of the invention

[0004] In response to the problems mentioned in the prior art, the present invention proposes a SPICE model establishment method, system, device and storage medium for a three-phase motor power drive module based on parasitic parameters, which can meet the modeling requirements of a three-phase motor power drive module integrating multiple chips, study the SPICE modeling method of the core chip of the power module, and simultaneously perform package parasitic parameter extraction and junction temperature monitoring.

[0005] In order to achieve the above object, the present invention adopts the following technical solution: The present invention provides a method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters, comprising the following steps: S1. Construct a gate driver model and a power MOSFET model, and combine them to obtain a three-phase motor power drive module model; S2. Establish a packaging structure based on the three-phase motor power drive module, and extract parasitic parameters based on the packaging structure; S3. Construct a junction temperature monitoring model based on the three-phase motor power drive module model; S4. Adding the parasitic parameters of the packaging structure and the junction temperature monitoring to the three-phase motor power drive module model in step S1, completes the establishment of a SPICE model of the three-phase motor power drive module based on the parasitic parameters.

[0006] As a further improvement of the present invention, the specific process of step S1 is: according to the principle block diagram and output characteristic curve of the gate driver, the behavior level modeling is performed using SPICE language, and the model is packaged through the model editor Model Editor in PSpice to complete the gate driver model; Import multiple characteristic curves from the MOSFET device manual into the Cadence PSpice Model Editor, obtain various MOSFET parameters by fitting the characteristic curves, and complete the power MOSFET model; According to the circuit schematic, the gate driver model is connected to the power MOSFET model to obtain a three-phase motor power drive module model.

[0007] As a further improvement of the present invention, the characteristic curve includes a transconductance characteristic, a transmission curve, an on-resistance, a leakage current, an output capacitance characteristic and a switch characteristic curve.

[0008] As a further improvement of the present invention, the specific process of step S2 is: A three-dimensional refined model of the packaging structure is established based on CREO; the three-dimensional refined model is imported into the Ansys Q3D extractor platform to configure the model and set boundary conditions; Set the solution parameters, run the solution, and obtain the parasitic resistance and parasitic inductance values.

[0009] As a further improvement of the present invention, the specific process of step S3 is: An n-layer Cauer thermal network model is constructed based on the three-phase motor power drive module model, and the thermal resistance and thermal capacity of each layer of material are calculated based on the material parameters of the model; Calculate the power loss generated when the MOSFET is working; A junction temperature monitoring model is established based on the obtained thermal resistance, thermal capacitance and power loss.

[0010] As a further improvement of the present invention, the specific process of step S4 is: according to the schematic diagram of the three-phase motor power drive module, the junction temperature monitoring model is connected to the three-phase motor power drive module model in Capture Orcad, the parasitic resistance and parasitic inductance values ​​are filled in, and the Model Editor is used for packaging.

[0011] As a further improvement of the present invention, after performing step S4, it is necessary to perform simulation verification on the SPICE model of the three-phase motor power drive module based on parasitic parameters. A SPICE model building system for a three-phase motor power drive module based on parasitic parameters, comprising: The first building module builds a gate driver model and a power MOSFET model, and combines them to obtain a three-phase motor power drive module model; An extraction module, which establishes a packaging structure based on a three-phase motor power drive module and extracts parasitic parameters based on the packaging structure; The second building module builds a junction temperature monitoring model based on the three-phase motor power drive module model; Combined with the module, the parasitic parameters of the packaging structure and the junction temperature monitoring are added to the three-phase motor power drive module model in step S1, and the SPICE model of the three-phase motor power drive module based on the parasitic parameters is established.

[0012] A device for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters comprises a processor and a memory, wherein the processor implements the above-mentioned method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters when executing a computer program stored in the memory.

[0013] A computer-readable storage medium is used to store a computer program, wherein when the computer program is executed by a processor, the SPICE model establishment method of a three-phase motor power drive module based on parasitic parameters as described above is implemented.

[0014] Compared with the prior art, the present invention has achieved the following technical effects: Compared with the existing technology, the existing module digital modeling is mainly for the modeling of electrical characteristics. The dynamic switching process of the actual power module under the influence of parasitic parameters will be accompanied by higher current and voltage overshoot, resulting in the established model is not accurate enough. However, this method makes the obtained model more accurate by adding package parasitic parameters, which can more truly reflect the switching characteristics of the module.

[0015] The modeling method of the present invention adds a junction temperature monitoring SPICE model, and the junction temperature simulation can be directly performed in the electrical principle simulation software. The electrical principle simulation and the thermal simulation are combined to greatly reduce the simulation time and realize the rapid solution of the junction temperature. Compared with the existing technology, the existing junction temperature simulation generally uses the finite element method for thermal simulation, which solves the problem of being time-consuming.

[0016] The modeling method proposed in the present invention performs behavioral-level modeling with the electrical characteristics of the device as the core, effectively avoiding the contradictions in convergence, accuracy and simulation efficiency in the modeling of complex power modules with integrated gate drivers, providing conditions for rapid iterative optimization of product design, and solving the problem that the existing power module modeling cannot meet the modeling requirements of three-phase motor power drive modules that integrate multiple chips (gate drivers, power tubes). BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a flow chart of the method of the present invention; Figure 2 This is a schematic diagram of the Q3D model of the three-phase motor power drive module of the present invention; Figure 3 This is a pin package diagram of the three-phase motor power drive module of the present invention; Figure 4 This is a simulation test diagram of the three-phase motor power drive module of the present invention; Figure 5 The three-phase motor power drive module of the present invention outputs a simulation waveform under PWM filling; Figure 6 The three-phase motor power drive module of the present invention outputs the measured waveform under PWM filling; Figure 7 The three-way output simulation waveform of the three-phase motor power drive module without filling in the present invention; Figure 8 The measured waveform of the three-phase motor power drive module without filling output in the present invention; Fig. 9 This is the unfilled junction temperature simulation waveform of the three-phase motor power drive module of the present invention; Fig.10 Schematic diagram of the SPICE model of the gate driver of the present invention. DETAILED DESCRIPTION

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0019] like Figure 1 As shown, the present invention provides a method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters, comprising the following steps: S1. Construct a gate driver model and a power MOSFET model, and combine them to obtain a three-phase motor power drive module model; S2. Establish a packaging structure based on the three-phase motor power drive module, and extract parasitic parameters based on the packaging structure; S3. Construct a junction temperature monitoring model based on the three-phase motor power drive module model; S4. Adding the parasitic parameters of the packaging structure and the junction temperature monitoring to the three-phase motor power drive module model in step S1, completes the establishment of a SPICE model of the three-phase motor power drive module based on the parasitic parameters.

[0020] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments: The parameter selection in the circuit of this embodiment is not unique. As an embodiment, in order to illustrate the parameter selection and working process of the present invention, a certain model of three-phase motor power drive module is used as an example for explanation. According to the product manual of the gate driver, the functional block diagram is as follows: Fig.10 As shown, Fig.10 This is the functional block diagram of the gate driver.

[0021] The SPICE language is used for behavioral modeling, and the model editor Model Editor in PSpice is used to encapsulate the model. The parameter settings in the optimized model are verified by simulation to complete the establishment of the gate driver SPICE model. Some .lib files are shown below:

[0022] MOSFET SPICE model establishment: Import the characteristic curves in the MOSFET device manual into the Cadence PSpiceModel Editor software, specifically the transconductance characteristics, transfer curves, on-resistance, leakage current, output capacitance characteristics and switching characteristic curves. By sampling and fitting various characteristic curves, the settings of various MOSFET parameters are obtained, and a certain type of MOSFET SPICE model is established. Some .lib files are as follows:

[0023] In the embodiment, Ansys Q3DExtractor software is used to extract parasitic parameters, and a three-dimensional refined model of the packaging structure is established in CREO software according to the design assembly drawings of the three-phase motor power drive module. The structure mainly includes a tube shell, solder, DBC substrate, chip, lead, bonding wire, silver-copper bracket, etc.

[0024] Import the model into the Ansys Q3DExtractor platform, as shown in the attached Figure 2As shown in the figure, the material properties of the model are defined: the materials of the bonding wire and the silver-copper bracket are set to aluminum, the copper material of the TOP layer of the DBC substrate is set to copper, the lead material is set to Kovar, and the solder material is set to Solder (Sn63 / Pb37); after setting the materials, the model needs to be meshed. Meshing is to discretize the model and divide the unit into small units for solving during simulation; set the excitation: analyze the current path and current flow direction of the module, determine the input and output ends, and set them as source and sink respectively. The setting of the excitation source is in line with the current flow direction and the circuit passed in actual work.

[0025] Set the solution frequency to the rated operating frequency of the power module, 20kHz, and run the solution to obtain the parasitic parameters generated by the current from the input end through the silver-copper bracket, as well as the parasitic parameters generated by the circuit through the bonding wire to the output end. The following table shows the parasitic inductance and resistance parameter values ​​of each chip when it is turned on.

[0026] Table 1 Parasitic inductance and resistance parameter values ​​of each chip when it is turned on

[0027] According to the process structure diagram of the three-phase motor power drive module, a thermal network model is constructed for the chip, the upper copper layer of direct copper plating, the alumina ceramic layer, the lower copper layer, the liner solder layer and the tube shell bottom plate. The material parameters of the model are as follows: Table 2 Material parameters

[0028] The thermal resistance and heat capacity of each layer are obtained by calculation.

[0029] Table 3 Thermal capacitance and thermal resistance corresponding to each layer

[0030] A voltage-controlled current source is used to collect the voltage and current signals passing through the MOSFET, and a junction temperature monitoring SPICE model is established. Some .lib files are as follows:

[0031] According to the schematic diagram of the three-phase motor power drive module, the gate driver, power MOSFET, resistors, capacitors and other common devices are connected accordingly in Capture Orcad to generate a netlist file as shown below:

[0032] Use the Model Editor in PSpice to encapsulate the model and generate symbols consistent with the module pin definition, such as Figure 3Shown is the pin package diagram of the three-phase motor power drive module.

[0033] In Capture Orcad, a simulation circuit with the same test conditions as the actual test is built to simulate and verify the macro circuit. The simulation test diagram is shown in Figure 4 As shown, the domain simulation is run and the experimental results are compared with the simulation results. Figures 5 to 8 show, Figure 5 Output simulation waveform for the module under PWM filling, Figure 6 The module outputs the measured waveform under PWM filling. It can be seen that the simulation result is consistent with the actual test waveform. When the shell temperature is constrained to be 125℃, the module junction temperature detection T J See attached for simulation waveform Fig. 9 ,The model can simply estimate the module’s chip temperature change.

[0034] Table 4 Comparison of simulation data and measured data of three-phase motor power drive module

[0035] From the comparison results in the above table, it can be seen that the errors of the three static parameters of static current, leakage current and on-resistance are all less than 5%, with high accuracy; the simulation errors of rise time, fall time and dead time in dynamic parameters are less than 10%, which meets the requirements for macro model establishment; the established spice simulation model can accurately describe the actual characteristics of the module.

[0036] Based on the same inventive concept, an embodiment of the present invention also provides a SPICE model establishment system for a three-phase motor power drive module based on parasitic parameters. Since the principle of solving the problem by the SPICE model establishment system for a three-phase motor power drive module based on parasitic parameters is similar to the aforementioned SPICE model establishment method for a three-phase motor power drive module based on parasitic parameters, the implementation of the SPICE model establishment system for a three-phase motor power drive module based on parasitic parameters can refer to the implementation of the SPICE model establishment method for a three-phase motor power drive module based on parasitic parameters, and the repeated parts will not be repeated.

[0037] In a specific implementation, an embodiment of the present invention provides a SPICE model establishment system for a three-phase motor power drive module based on parasitic parameters, which specifically includes: The first building module builds a gate driver model and a power MOSFET model, and combines them to obtain a three-phase motor power drive module model; An extraction module, which establishes a packaging structure based on a three-phase motor power drive module and extracts parasitic parameters based on the packaging structure; The second building module builds a junction temperature monitoring model based on the three-phase motor power drive module model; Combined with the module, the parasitic parameters of the packaging structure and the junction temperature monitoring are added to the three-phase motor power drive module model in step S1, and the SPICE model of the three-phase motor power drive module based on the parasitic parameters is established.

[0038] Accordingly, an embodiment of the present invention further provides an electronic device for a method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters, including a processor and a memory, wherein the processor and the memory can be connected via a bus or other means, and when the processor executes a computer program stored in the memory, a method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters as provided in an embodiment of the present invention is implemented. In this embodiment, the processor can be a central processing unit. The processor can also be other general-purpose processors, digital signal processor application-specific integrated circuits, field programmable gate arrays or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components and other chips, or a combination of the above-mentioned types of chips.

[0039] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs, non-transient computer executable programs and modules, such as the program instructions / modules corresponding to the methods in the above method embodiments. The processor executes the processor by running the non-transient software programs, instructions and modules stored in the memory. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network and a combination thereof.

[0040] One or more modules are stored in the memory, and when executed by the processor, the method in the above method embodiment is executed. For more specific processes of the above method, reference can be made to the corresponding contents disclosed in the above embodiments, which will not be repeated here.

[0041] Accordingly, an embodiment of the present invention further provides a computer-readable storage medium for storing a computer program, wherein when the computer program is executed by a processor, it implements the above-mentioned method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters as provided in an embodiment of the present invention.

[0042] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the systems, devices, and storage media disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the method part.

[0043] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0044] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein can be implemented directly with hardware, software modules executed by a processor, or a combination of the two. The software module can be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish an entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "includes", "includes" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters, characterized in that: The following steps are involved: S1. Construct a gate driver model and a power MOSFET model, and combine them to obtain a three-phase motor power drive module model; S2. Establish a packaging structure based on the three-phase motor power drive module, and extract parasitic parameters based on the packaging structure; S3. Construct a junction temperature monitoring model based on the three-phase motor power drive module model; S4. Adding the parasitic parameters of the packaging structure and the junction temperature monitoring to the three-phase motor power drive module model in step S1, completes the establishment of a SPICE model of the three-phase motor power drive module based on the parasitic parameters.

2. The method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters according to claim 1, characterized in that: The specific process of step S1 is: Based on the principle block diagram and output characteristic curve of the gate driver, the behavior level modeling is performed using SPICE language, and the model is packaged through the Model Editor in PSpice to complete the gate driver model. Import multiple characteristic curves from the MOSFET device manual into the Cadence PSpice Model Editor, obtain various MOSFET parameters by fitting the characteristic curves, and complete the power MOSFET model; According to the circuit schematic, the gate driver model is connected to the power MOSFET model to obtain the three-phase motor power drive module model.

3. The method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters according to claim 1, characterized in that: The characteristic curves include transconductance characteristics, transfer curves, on-resistance, leakage current, output capacitance characteristics and switching characteristic curves.

4. The method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters according to claim 1, characterized in that: The specific process of step S2 is: Establish a three-dimensional refined model of the packaging structure based on CREO; Import the 3D refined model into the Ansys Q3Dextractor platform to configure the model and set boundary conditions; Set the solution parameters, run the solution, and obtain the parasitic resistance and parasitic inductance values.

5. The method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters according to claim 1, characterized in that: The specific process of step S3 is: An n-layer Cauer thermal network model is constructed based on the three-phase motor power drive module model, and the thermal resistance and thermal capacity of each layer of material are calculated based on the material parameters of the model; Calculate the power loss generated when the MOSFET is working; A junction temperature monitoring model is established based on the obtained thermal resistance, thermal capacitance and power loss.

6. The method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters according to claim 1, characterized in that: The specific process of step S4 is: According to the schematic diagram of the three-phase motor power drive module, the junction temperature monitoring model is connected to the three-phase motor power drive module model in Capture Orcad, the parasitic resistance and parasitic inductance values ​​are filled in, and the Model Editor is used for packaging.

7. The method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters according to claim 1, characterized in that: After performing step S4, it is necessary to perform simulation verification on the SPICE model of the three-phase motor power drive module based on parasitic parameters.

8. A SPICE model building system for a three-phase motor power drive module based on parasitic parameters, characterized in that: include: The first building module builds a gate driver model and a power MOSFET model, and combines them to obtain a three-phase motor power drive module model; An extraction module, which establishes a packaging structure based on a three-phase motor power drive module and extracts parasitic parameters based on the packaging structure; The second building module builds a junction temperature monitoring model based on the three-phase motor power drive module model; Combined with the module, the parasitic parameters of the packaging structure and the junction temperature monitoring are added to the three-phase motor power drive module model in step S1, and the SPICE model of the three-phase motor power drive module based on the parasitic parameters is established.

9. A SPICE model building device for a three-phase motor power drive module based on parasitic parameters, characterized in that: It comprises a processor and a memory, wherein when the processor executes the computer program stored in the memory, it implements the SPICE model establishment method of the three-phase motor power drive module based on parasitic parameters as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: Used to store a computer program, wherein when the computer program is executed by a processor, the method for establishing a SPICE model of a three-phase motor power drive module based on parasitic parameters as described in any one of claims 1 to 7 is implemented.

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