A ring cutting method for a packaging structure
By acquiring the image data of the packaging structure, calculating the equivalent circle center and performing cutting path compensation, the problems of ring cutting accuracy and warping of the packaging structure are solved, an efficient and accurate ring cutting process is achieved, and production costs are reduced.
Patent Information
- Application Number
- CN202411452091.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2044-10-16
AI Technical Summary
The accuracy of the packaging structure ring cutting process in the prior art is poor, and the warping problem leads to increased production costs and reduced efficiency.
By acquiring the first and second side images of the packaging structure, the edge points and center points of the plastic layer and the packaging body are calculated, the equivalent center point is generated, the cutting path compensation is performed, and the circular cutting is performed using laser cutting equipment.
The reliability and processing accuracy of the circular cutting process are improved, the production cost is reduced, the additional film laminating process is avoided, and the production efficiency is improved.
Smart Images
Figure CN119324156B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a ring cutting method for a packaging structure. Background Art
[0002] With the development of society and advancements in semiconductor technology, the market has placed increasingly higher demands on the size and performance of semiconductor devices. To enhance product competitiveness, new semiconductor processes need to be developed on thin substrates to improve product performance and reduce product size. In these new semiconductor processes, an injection molding process is designed to encapsulate wafers. After the injection molding process is completed, the resulting package structure needs to undergo a ring cutting process to remove the excess plastic layer around the wafer periphery.
[0003] At present, when the packaging structure after plastic sealing is subjected to the ring cutting process, since there are no graphic marks on the surface of the packaging structure formed after plastic sealing, the traditional positioning method cannot achieve accurate positioning of the wafer, resulting in poor accuracy of the ring cutting process, and seriously causing the ring cutting effect to fail to meet the design requirements. In addition, the packaging structure after plastic sealing may have a warping phenomenon. When the ring cutting process is performed using the blade of a cutting machine, the problem of incoming material warping will be faced. In order to solve the problem of incoming material warping, the cutting machine needs to introduce a specific working mode, which is equivalent to adding a film-laminating process to the wafer during the wafer processing process, resulting in an increase in the production cost of the product and a reduction in the production efficiency of the product. Therefore, there is an urgent need for a new ring cutting method for the packaging structure to solve the technical problems existing in the prior art. Summary of the Invention
[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of this application is to provide a method for ring cutting of a packaging structure to solve the problem of poor accuracy of the ring cutting process of the packaging structure in the prior art, and to effectively improve the reliability and processing accuracy of the ring cutting process.
[0005] To achieve the above-mentioned and other related purposes, a ring cutting process is performed on a plastic-sealed packaging structure, wherein the packaging structure includes a packaging body and a plastic sealing layer covering the front and side surfaces of the packaging body, comprising the following steps:
[0006] Acquire a first side image and a second side image of the packaging structure;
[0007] Acquire a plurality of first edge points of the plastic sealing layer from the first surface image;
[0008] Acquire a plurality of second edge points of the package body from the second surface image;
[0009] Based on the first edge point and the second edge point, coordinates of multiple first circle centers of the plastic packaging layer and coordinates of multiple second circle centers of the package body are calculated;
[0010] Based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the package body are calculated;
[0011] Compensating a pre-generated first cutting path according to the first equivalent circle center and the second equivalent circle center to generate a second cutting path;
[0012] Performing a circular cutting operation on the packaging structure according to the second cutting path.
[0013] Optionally, obtaining a plurality of first edge points of the plastic sealing layer from the first surface image includes the following steps:
[0014] Performing edge detection and positioning on the plastic sealing layer in the first surface image to obtain an edge contour of the plastic sealing layer;
[0015] Acquire a plurality of first edge points from the edge contour of the plastic packaging layer;
[0016] Wherein, a plurality of the first edge points are spaced apart from each other, and the number of the first edge points is at least 4.
[0017] Optionally, acquiring a plurality of second edge points of the package body from the second surface image comprises the following steps:
[0018] Performing edge detection and positioning on the package body in the second surface image to obtain an edge contour of the package body;
[0019] Acquire a plurality of second edge points from the edge contour of the package body;
[0020] Wherein, a plurality of the second edge points are spaced apart from each other, and the number of the second edge points is at least 4.
[0021] Optionally, calculating the coordinates of multiple first circle centers of the plastic encapsulation layer and multiple second circle centers of the package body based on the first edge point and the second edge point includes the following steps:
[0022] Using the first edge points and the second edge points, respectively, to form a plurality of first point sets and a plurality of second point sets; wherein each of the first point sets includes three first edge points, and each of the second point sets includes three second edge points;
[0023] The coordinates of the first circle center and the coordinates of the second circle center are calculated based on the first point set and the second point set, respectively.
[0024] Optionally, based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic package layer and the coordinates of the second equivalent circle center of the package body are calculated, including the following steps:
[0025] The coordinate average value of a plurality of the first circle centers is calculated to obtain the coordinates of the first equivalent circle center;
[0026] The coordinate average value of a plurality of the second circle centers is calculated to obtain the coordinates of the second equivalent circle center.
[0027] Optionally, the first cutting path is compensated to generate a second cutting path, including the following steps:
[0028] The coordinate difference value between the second equivalent circle center and the first equivalent circle center is calculated;
[0029] According to the coordinate difference value, the first cutting path is compensated in coordinates to generate the second cutting path.
[0030] Optionally, according to the second cutting path, a ring cutting operation is performed on the package structure, including the following steps:
[0031] The second cutting path is segmented along the circumferential direction of the package structure to divide the second cutting path into a plurality of cutting segments;
[0032] According to the segmented second cutting path, a segmented ring cutting operation is performed on the package structure.
[0033] Optionally, according to the second cutting path, a ring cutting operation is performed on the package structure, including the following steps:
[0034] The package structure is divided into N cutting layers along the axial direction of the package structure, and sequentially recorded as the first to the Nth cutting layers, N being a positive integer greater than 2;
[0035] According to the second cutting path, a cutting path of each of the cutting layers is generated;
[0036] The cutting path of each of the cutting layers is segmented along the circumferential direction of the package structure to divide the cutting path of each of the cutting layers into a plurality of sub-cutting segments;
[0037] According to the segmented cutting path of each of the cutting layers, a segmented ring cutting operation is respectively performed on the N cutting layers.
[0038] Optionally, according to the second cutting path, a cutting path of each of the cutting layers is generated, including the following steps:
[0039] the second cutting path is taken as a cutting path of the first cutting layer;
[0040] the cutting path of the i-th cutting layer is deflected around the axis of the packaging body to obtain a cutting path of an (i+1)-th cutting layer, i is a positive integer and 1≤i≤N-1.
[0041] Optionally, according to the second cutting path, a laser cutting device is used to perform a ring cutting operation on the packaging structure, and a cleaning device is used to clean the packaging structure after the ring cutting operation.
[0042] As described above, the ring cutting method of the packaging structure provided by the present application has at least the following beneficial effects:
[0043] The ring cutting method of the packaging structure provided by the present application obtains a plurality of first edge points and second edge points from the first face image and the second face image, calculates a first center and a second center, further calculates a first equivalent center and a second equivalent center, realizes accurate positioning of the packaging structure, the packaging body and the plastic packaging layer, improves the reliability of the ring cutting process, and compensates the first cutting path to obtain the second cutting path according to the first equivalent center and the second equivalent center, effectively improves the processing accuracy of the ring cutting process. BRIEF DESCRIPTION OF DRAWINGS
[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0045] Figure 1 A flowchart of the ring cutting method of the packaging structure provided by the first embodiment of the present application is shown.
[0046] Figure 2 A structural schematic diagram of the packaging structure provided by the first embodiment of the present application is shown.
[0047] Figure 3 A cross-sectional structural schematic diagram of the packaging structure provided by the first embodiment of the present application is shown.
[0048] Figure 4 A structural schematic diagram of obtaining the first edge point provided by the first embodiment of the present application is shown.
[0049] Figure 5 A structural schematic diagram of obtaining the second edge point provided by the first embodiment of the present application is shown.
[0050] Figure 6A structure diagram for forming a second cutting path is shown.
[0051] Figure 7 A structure diagram for segmenting the second cutting path is shown.
[0052] Figure 8 A structure diagram for warping of a packaging structure in the prior art is shown.
[0053] Figure 9 A structure diagram for layering of a packaging structure is shown.
[0054] Reference signs are shown:
[0055] 10, packaging structure; 11, plastic sealing layer; 12, packaging body; 131, first cutting path; 132, second cutting path; 133, first equivalent circle center; 134, second equivalent circle center. DETAILED DESCRIPTION
[0056] In order to make the technical purposes, technical solutions and technical effects of the present application clearer, the technical solutions in the present application will be described clearly and completely in combination with embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0057] Therefore, the detailed description of the embodiments of the present application below is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0058] In the description of the present application, it should be noted that the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiments or examples are contained in at least one embodiment or example of the present application. In the description, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples with appropriate solutions.
[0059] Embodiment one
[0060] The present embodiment provides a ring cutting method for a package structure, which is used to perform a ring cutting process on a package structure 10 after plastic sealing. The package structure 10 includes a package body 12 and a plastic sealing layer 11. The package body 12 can be, for example, a semiconductor device such as a wafer. The plastic sealing layer 11 is coated on the front and side surfaces of the package body 12. Figure 1 The ring cutting method of the package structure provided in this embodiment includes steps S1 to S7, specifically including:
[0061] Step S1: Acquire a first surface image and a second surface image of the package structure;
[0062] Step S2: Acquire a plurality of first edge points of the plastic sealing layer from the first surface image;
[0063] Step S3: Acquire a plurality of second edge points of the plastic-sealed body from the second surface image;
[0064] Step S4: Based on the first edge point and the second edge point, the coordinates of the first circle centers of the plastic packaging layer and the coordinates of the second circle centers of the package body are calculated;
[0065] Step S5: Based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the package body are calculated;
[0066] Step S6: compensating the pre-generated first cutting path according to the first equivalent circle center and the second equivalent circle center to generate a second cutting path;
[0067] Step S7: performing a circular cutting operation on the package structure according to the second cutting path.
[0068] The following will describe in detail the ring cutting method of the packaging structure of this embodiment with reference to the accompanying drawings. It should be noted that the above sequence does not strictly represent the process sequence of the ring cutting method of the packaging structure protected by this application, and those skilled in the art can change it according to the actual processing steps.
[0069] First, step S1 is performed to obtain a first surface image and a second surface image of the package structure 10 .
[0070] In this embodiment, refer to Figure 2 and Figure 3The package structure 10 has a first surface and a second surface that are oppositely disposed. The first surface of the package structure 10 is the surface on which the plastic encapsulation layer 11 covers the front surface of the package body 12, and the second surface of the package structure 10 is the surface on which the package body 12 is exposed. Optionally, the image of the first surface and the second surface of the package structure 10 can be acquired using an image acquisition device provided by the cutting equipment, or using an industrial camera, or using other suitable methods.
[0071] In an optional embodiment, the first side image includes an edge region image of the plastic encapsulation layer 11 and is recorded as the first edge region image. The first edge region image can be a single image or a combination of multiple images. The second side image includes an edge region image of the package body 12 and is recorded as the second edge region image. The second edge region image can be a single image or a combination of multiple images. Optionally, the first side image can also include an image of the front side of the package structure 10, and the second side image can also include an image of the back side of the package structure 10.
[0072] Then, step S2 is performed to obtain a plurality of first edge points of the plastic packaging layer 11 from the first surface image. The first edge points can be understood as points constituting the edge contour of the plastic packaging layer 11 in the first surface image.
[0073] Specifically, refer to Figure 4 , edge-finding and positioning are performed on the first-side image, and then the edge contour of the plastic sealing layer 11 is obtained from the first-side image; after obtaining the edge contour of the plastic sealing layer 11, multiple edge points are selected from the edge contour of the plastic sealing layer 11 as first edge points; optionally, the multiple selected first edge points are spaced apart from each other, and the number of the first edge points is at least 4, for example, 4, 6, 8 or other suitable numbers.
[0074] In an optional embodiment, multiple first edge points are evenly spaced along the circumference of the edge contour of the plastic packaging layer 11, so that there is a relatively large spacing distance between the multiple first edge points, thereby improving the accuracy of the calculation results and further improving the processing accuracy of the circumferential cutting process.
[0075] Next, step S3 is performed to obtain a plurality of second edge points of the plastic-encapsulated body from the second surface image; wherein the second edge points can be understood as points constituting the edge contour of the plastic-encapsulated body in the second surface image.
[0076] Specifically, refer to Figure 5, edge locating is performed on the second surface image, and the edge contour of the package body 12 is obtained from the second surface image; after obtaining the edge contour of the plastic-encapsulated body, multiple edge points are selected from the edge contour of the package body 12 as second edge points; optionally, the multiple selected second edge points are spaced apart from each other, and the number of second edge points is at least 4, for example, 4, 6, 8, or another suitable number. In addition, in this embodiment, step S2 and step S3 can be performed simultaneously or separately, for example, step S2 and step S3 can be performed separately, or step S3 and step S2 can be performed separately.
[0077] In an optional embodiment, multiple second edge points are evenly spaced along the circumference of the edge contour of the package body 12, so that there is a relatively large spacing distance between the multiple second edge points, thereby improving the accuracy of the calculation results and further improving the processing accuracy of the circumferential cutting process.
[0078] Next, step S4 is performed to calculate the coordinates of multiple first circle centers of the plastic packaging layer 11 and multiple second circle centers of the package body 12 based on the first edge point and the second edge point.
[0079] In this embodiment, the first surface image can be processed using image processing software or other suitable tools to obtain multiple first edge points, and the second surface image can be processed to obtain multiple second edge points. A rectangular coordinate system is set in the image processing software. According to the coordinates of the first edge point and the second edge point in the rectangular coordinate system, the coordinates of multiple first circle centers and the coordinates of multiple second circle centers can be calculated.
[0080] In an optional embodiment, the first edge points and the second edge points are used to form a plurality of first point sets and a plurality of second point sets, respectively. The coordinates of the first circle center and the coordinates of the second circle center are calculated based on the first point set and the second point solution. Specifically, the first edge points are used to form a plurality of first point sets, wherein each first point set includes 3 first edge points. The coordinates of a first circle center can be calculated based on the 3 first edge points in each point set. By calculating the plurality of first point sets, the coordinates of the plurality of first circle centers can be calculated. Optionally, each two first point sets each have at least one first edge point with different coordinates. The second edge points are used to form a plurality of second point sets, wherein each second point set includes 3 second edge points. The coordinates of a second circle center are then determined. By calculating the plurality of second point sets, the coordinates of the plurality of second circle centers can be calculated. Optionally, each two second point sets each have at least one second edge point with different coordinates.
[0081] Next, step S5 is performed to calculate the coordinates of the first equivalent circle center 133 of the plastic layer 11 and the coordinates of the second equivalent circle center 134 of the package body 12 based on the first circle center and the second circle center.
[0082] Specifically, refer to Figure 6 Based on the calculated multiple first circle centers, a compensation algorithm is used to form a circle center as the equivalent circle center of plastic encapsulation layer 11, recorded as first equivalent circle center 133. Similarly, based on the multiple second circle centers, a compensation algorithm is used to form a circle center as the equivalent circle center of package body 12, recorded as second equivalent circle center 134. The coordinates of first equivalent circle center 133 and second equivalent circle center 134 are used to accurately position plastic encapsulation layer 11 and package body 12.
[0083] In an alternative embodiment, the coordinates of a circle center can be obtained using an averaging algorithm. Specifically, the coordinates of multiple first circle centers are averaged to obtain the coordinates of the first equivalent circle center 133; the coordinates of multiple second circle centers are averaged to obtain the coordinates of the second equivalent circle center 134. Other suitable compensation algorithms can also be used to calculate the coordinates of the first equivalent circle center 133 and the second equivalent circle center 134, such as a weighted average algorithm. This embodiment is not limited to this.
[0084] Next, step S6 is performed to compensate the pre-generated first cutting path 131 according to the first equivalent circle center 133 and the second equivalent circle center 134 to generate the second cutting path 132 .
[0085] In this embodiment, refer to Figure 6 There will be a certain position offset between the calculated first equivalent circle center 133 and the second equivalent circle center 134. According to the above position offset, the pre-generated first cutting path 131 is compensated to obtain the second cutting path 132, so that the distance between the edge of the package structure 10 after cutting and the package body 12 is a preset fixed value.
[0086] In an optional embodiment, compensating the pre-generated first cutting path 131 to generate the second cutting path 132 includes the following steps: calculating the coordinate difference between the second equivalent circle center 134 and the first equivalent circle center 133; and performing coordinate compensation on the first cutting path 131 based on the coordinate difference to generate the second cutting path 132. Specifically, the coordinate difference is subtracted from the coordinate value of the first equivalent circle center 133 from the coordinate value of the second equivalent circle center 134 to obtain the coordinate difference, and the coordinate difference is added to the coordinates of each cutting point on the first cutting path 131 to obtain the new coordinates of each cutting point, thereby forming the second cutting path 132.
[0087] Finally, step S7 is performed to perform a circular cutting operation on the package structure 10 according to the second cutting path 132. Specifically, the package structure 10 is cut along the second cutting path 132 using a cutting device to complete the circular cutting operation on the package structure 10.
[0088] In an alternative embodiment, reference Figure 7 , the second cutting path 132 is segmented along the circumference of the package structure 10 to divide the second cutting path 132 into multiple cutting segments, and the package structure 10 is subjected to segmented circular cutting according to the segmented second cutting path 132. Optionally, the second cutting path 132 is divided into at least 2 or more cutting segments along its circumference; further, the second cutting path 132 is divided into at least 4 or more cutting segments along its circumference. For example, the second cutting path 132 can be divided into 6, 8, or other numbers of cutting segments along its circumference. The specific number of divided cutting segments can be adaptively set according to the actual size of the package structure 10 and the package body 12.
[0089] In the prior art, when using cutting equipment to perform a circumcision process on the packaging structure 10, in order to ensure high processing accuracy, it is often necessary to rely on high-precision positioning of the packaging structure 10. However, there is no marking pattern on the surface of the packaging structure 10, which makes it impossible for the cutting equipment to accurately position the packaging structure 10 in a traditional way, resulting in poor accuracy in the circumcision process on the packaging structure 10, so that the circumcision effect cannot meet the design requirements. The circumcision method of this embodiment obtains multiple first edge points and second edge points from the first surface image and the second surface image, and calculates multiple first circle centers of the plastic layer 11 and multiple second circle centers of the packaging body 12, and then calculates the first equivalent circle center 133 and the second equivalent circle center 134, thereby achieving precise positioning of the packaging structure 10 and the packaging body 12, i.e., the plastic layer 11, and improving the reliability and processing accuracy of the circumcision process.
[0090] In an optional embodiment, after step S7, the following step is further included: using a cleaning device to clean the package structure 10. Specifically, after the package structure 10 is circularly cut according to the second cutting path 132, the cutting of the plastic encapsulation material may cause residue to accumulate on the surface of the package structure 10. The surface of the package structure 10 is cleaned using a cleaning device by adjusting parameters such as the flow rate and pressure of the cleaning device to keep the surface of the package structure 10 clean.
[0091] In an optional embodiment, a laser cutting device is used to perform a ring cutting operation on the package structure 10 .
[0092] In the prior art, referring to Figure 8When performing the circular cutting process on the package structure 10 that has completed the plastic encapsulation process, a cutting machine with a blade is used for cutting. This cutting method faces the problem of incoming material warping during loading. To solve this problem, a specific operating mode is required, which is equivalent to adding a film laminating process, increasing production costs and reducing production efficiency. The circular cutting method of this embodiment uses laser cutting equipment to cut the package structure 10, overcoming the technical problem of incoming material warping in the prior art. It does not require an additional film laminating process, reducing production costs and improving production efficiency.
[0093] In summary, the circumferential cutting method of this embodiment ensures the accuracy and reliability of the calculation results by finding and positioning the edges of the plastic layer 11 and the packaging body 12 in the first side image and the second side image to obtain the first edge point and the second edge point; the first edge point and the second edge point are calculated to obtain the first equivalent circle center 133 and the second equivalent circle center 134, thereby achieving precise positioning of the packaging structure 10 and improving the reliability and processing accuracy of the circumferential cutting process; using laser cutting equipment for circumferential cutting overcomes the problem of warping of incoming materials, eliminates the need for an additional film-sticking process, reduces production costs, and improves production efficiency.
[0094] Example 2
[0095] This embodiment provides another method for ring cutting of a packaging structure, which also includes steps S1 to S7 in the first embodiment. The similarities with the first embodiment are not repeated here. The difference lies in the specific features of the ring cutting operation of the packaging structure 10 according to the second cutting path 132 in step S7.
[0096] In this embodiment, after completing step S6 to obtain the second cutting path 132 , step S7 is performed to perform a circular cutting operation on the package structure 10 according to the second cutting path 132 .
[0097] Specifically, refer to Figure 9 , dividing the packaging structure 10 into N cutting layers along the axial direction of the packaging structure 10, and recording them as the first to Nth cutting layers in sequence, where N is a positive integer greater than 2; generating a cutting path for each cutting layer according to the second cutting path 132; segmenting the cutting path of each cutting layer along the circumference of the packaging structure 10 to divide the cutting path of each cutting layer into multiple sub-cutting segments; and performing segmented circular cutting operations on the multiple sub-cutting segments of the N cutting layers according to the cutting path of each cutting layer.
[0098] In an optional embodiment, the cutting path of each cutting layer is divided into M sub-cutting segments, where M is a positive integer greater than 2. Optionally, M can also be set to a positive integer greater than 4, for example, the cutting path of each cutting layer is divided into 4 sub-cutting segments, or 6 sub-cutting segments, or 8 sub-cutting segments; wherein the specific number of sub-cutting segments into which the cutting path of each cutting layer is divided can be adaptively set according to the actual size of the packaging structure 10 and the packaging body 12.
[0099] In an optional embodiment, the package structure 10 is divided into N cutting layers along its axial direction, where N can be set to, for example, 2, 4, 6, 8, or other suitable values. Optionally, the thickness of each cutting layer is 10 mm to 100 mm, and the number of cutting layers can be set based on the thickness of each cutting layer. Furthermore, if the cutting device is a laser cutting device, the thickness of each cutting layer can be set based on the focal length parameter of the laser cutting device, thereby improving the efficiency and accuracy of the cutting device in performing circular cutting on the package structure 10.
[0100] In an optional embodiment, the second cutting path 132 is used as the cutting path of each cutting layer to obtain cutting paths of N cutting layers.
[0101] In an optional embodiment, generating a cutting path for each cutting layer includes the following steps: using the second cutting path 132 as the cutting path for the first cutting layer; and deflecting the cutting path for the i-th cutting layer around the axis of the package body 12 to obtain a cutting path for the i+1-th cutting layer, where i is a positive integer and 1≤i≤N-1. Optionally, the cutting path for the i-th cutting layer is deflected around the axis of the package body 12 according to a preset deflection angle to obtain a cutting path for the i+1-th cutting layer; further, the deflection angle is less than or equal to 5°.
[0102] In existing technology, when using laser cutting equipment to perform multi-segment cutting, overlapping cuts often occur, which can lead to problems such as reduced circular cutting accuracy. To address this issue, this embodiment sets a deflection angle and controls the cutting path of each cutting layer to deflect relative to the cutting path of the previous cutting layer. This ensures that the joints in segmented cutting are fully processed, effectively solves the problem of overlapping cuts, and improves the processing effect and operational reliability of the circular cutting process.
[0103] In summary, the ring cutting method of the packaging structure of this embodiment also includes steps S1 to S7 in embodiment one, and therefore also has the beneficial effects of embodiment one. In addition, in this embodiment, the packaging structure 10 is divided into multiple cutting layers, and the cutting path of each cutting layer is deflected, which further improves the reliability and processing effect of the ring cutting process.
[0104] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify, alter, or combine the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or variations accomplished by a person of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.
Claims
1. A method for ring cutting a package structure, for performing a ring cutting process on a package structure after plastic sealing, wherein the package structure comprises a package body and a plastic sealing layer covering the front and side surfaces of the package body, characterized in that: The following steps are involved: Acquire a first side image and a second side image of the packaging structure; Acquire a plurality of first edge points of the plastic sealing layer from the first surface image; Acquire a plurality of second edge points of the package body from the second surface image; Based on the first edge point and the second edge point, coordinates of multiple first circle centers of the plastic packaging layer and coordinates of multiple second circle centers of the package body are calculated; Based on the first circle center and the second circle center, the coordinates of the first equivalent circle center of the plastic packaging layer and the coordinates of the second equivalent circle center of the package body are calculated; Compensating a pre-generated first cutting path according to the first equivalent circle center and the second equivalent circle center to generate a second cutting path; performing a circular cutting operation on the packaging structure according to the second cutting path; The step of compensating the pre-generated first cutting path to generate the second cutting path includes: Subtract the coordinate value of the first equivalent circle center from the coordinate value of the second equivalent circle center to obtain a coordinate difference, add the coordinate difference to the coordinates of each cutting point on the first cutting path to obtain new coordinates of each cutting point to form the second cutting path.
2. The ring cutting method of the packaging structure according to claim 1, characterized in that: Acquiring a plurality of first edge points of the plastic sealing layer from the first surface image includes the following steps: Performing edge detection and positioning on the plastic sealing layer in the first surface image to obtain an edge contour of the plastic sealing layer; Acquire a plurality of first edge points from the edge contour of the plastic packaging layer; Wherein, a plurality of the first edge points are spaced apart from each other, and the number of the first edge points is at least 4.
3. The ring cutting method of the package structure according to claim 1, characterized in that: Acquiring a plurality of second edge points of the package body from the second surface image includes the following steps: Performing edge detection and positioning on the package body in the second surface image to obtain an edge contour of the package body; Acquire a plurality of second edge points from the edge contour of the package body; Wherein, a plurality of the second edge points are spaced apart from each other, and the number of the second edge points is at least 4.
4. The ring cutting method of the package structure according to claim 1, characterized in that: Calculating the coordinates of a plurality of first circle centers of the plastic encapsulation layer and a plurality of second circle centers of the package body based on the first edge point and the second edge point includes the following steps: Using the first edge points and the second edge points, respectively, to form a plurality of first point sets and a plurality of second point sets; wherein each of the first point sets includes three first edge points, and each of the second point sets includes three second edge points; The coordinates of the first circle center and the coordinates of the second circle center are calculated based on the first point set and the second point set, respectively.
5. The ring cutting method of the package structure according to claim 1, characterized in that: Calculating the coordinates of the first equivalent circle center of the plastic packaging layer and the second equivalent circle center of the package body based on the first circle center and the second circle center includes the following steps: Calculating an average value of coordinates of a plurality of first circle centers to obtain the coordinates of the first equivalent circle center; Calculate the average value of the coordinates of multiple second circle centers to obtain the coordinates of the second equivalent circle center.
6. The ring cutting method of the package structure according to claim 1, characterized in that: Performing a circular cutting operation on the packaging structure according to the second cutting path includes the following steps: Segmenting the second cutting path along the circumference of the packaging structure to divide the second cutting path into a plurality of cutting segments; According to the segmented second cutting path, the packaging structure is subjected to segmented circular cutting.
7. The ring cutting method of the package structure according to claim 1, characterized in that: Performing a circular cutting operation on the packaging structure according to the second cutting path includes the following steps: Dividing the packaging structure into N cutting layers along the axial direction of the packaging structure, and recording them as the first to Nth cutting layers in sequence, where N is a positive integer greater than 2; generating a cutting path for each cutting layer according to the second cutting path; Segmenting the cutting path of each cutting layer along the circumference of the packaging structure to divide the cutting path of each cutting layer into a plurality of sub-cutting segments; According to the cutting path of each segmented cutting layer, segmented circular cutting operations are performed on the N cutting layers respectively.
8. The ring cutting method of the package structure according to claim 7, characterized in that: Generating a cutting path for each cutting layer according to the second cutting path includes the following steps: Using the second cutting path as the cutting path of the first cutting layer; The cutting path of the i-th cutting pattern is deflected around the axis of the package body to obtain the cutting path of the i+1-th cutting layer, where i is a positive integer and 1≤i≤N-1.
9. The ring cutting method of the package structure according to claim 1, characterized in that: According to the second cutting path, a laser cutting device is used to perform a circular cutting operation on the packaging structure, and a cleaning device is used to clean the packaging structure after the circular cutting operation.
Citation Information
Patent Citations
Silicon wafer position deviation detection method and system
CN114993178A
Wafer center correction method
CN117637567A