Field effect tube packaging device and packaging method

Abstract

The present invention discloses a field effect tube packaging device and a packaging method, which are applied to the technical field of field effect tube packaging, and include a workbench, a conveying part 1, and a material taking mechanism, a detection part 1, a fixing mechanism, a welding mechanism, a cooling mechanism, a detection part 2, and a material unloading mechanism which are sequentially arranged on the top of the workbench from right to left. The material taking mechanism is used to take out a circuit board and place it on the conveying part 1 for transmission. The fixing mechanism and the welding mechanism are used to package a field effect tube on a circuit board that has passed the inspection. The cooling mechanism is used to cool the circuit board that has been welded. The material unloading mechanism is used to unload and store the circuit board that has passed the inspection after packaging. The detection part 1 is used to detect the deformation of the circuit board. The detection part 2 is used to detect the soldering condition of the pins of the circuit board packaged with the field effect tube. The packaging device also includes a packaging system. The present invention can improve the packaging efficiency of the field effect tube.

Description

Technical Field

[0001] The present invention relates to the technical field of field effect tube packaging, and in particular to a field effect tube packaging device and a packaging method. Background Art

[0002] Field effect tube is the abbreviation of field effect transistor. There are two main types: junction field effect tube and metal oxide semiconductor field effect tube; the majority of carriers participate in the conduction, also known as unipolar transistor; it belongs to the voltage-controlled semiconductor device. The packaging of field effect tubes is divided into two categories: plug-in type and surface mount type; the plug-in type is that the pins of the field effect tube pass through the mounting holes of the circuit board and are welded on the circuit board; the surface mount type is that the pins of the field effect tube and the heat dissipation flange are directly welded to the pads on the surface of the circuit board.

[0003] Although surface mount packaging has many advantages, when using this packaging form, the lead space of the circuit board is small. When the packaging is abnormal, it is almost impossible to repair the circuit board again. Therefore, the requirements for the welding process are relatively strict. If the welding fails to cool down in time, it will not only damage the connection of the circuit board, but also affect the use of subsequent products. Secondly, the existing surface mount packaging device can only perform the packaging operation of a single field effect tube, which greatly affects the production efficiency and product qualification rate.

[0004] Therefore, it is necessary to provide a field effect transistor packaging device and packaging method to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a field effect tube packaging device and packaging method, which can improve the packaging quality and efficiency of the field effect tube and solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a field effect tube packaging device and packaging method, comprising a workbench, a conveying part 1, and a material taking mechanism, a detection part 1, a fixing mechanism, a welding mechanism, a cooling mechanism, a detection part 2, and a material unloading mechanism arranged on the top of the workbench from right to left, the material taking mechanism is used to take the circuit board and place it on the conveying part 1 for transmission, the fixing mechanism and the welding mechanism are used to package the field effect tube on the circuit board that has passed the inspection, the cooling mechanism is used to cool the circuit board that has been welded, the material unloading mechanism is used to unload and store the circuit board that has passed the inspection after packaging, the detection part 1 is used to detect the deformation of the circuit board, and the detection part 2 is used to detect the soldering condition of the pins of the circuit board encapsulated with the field effect tube;

[0007] The detection part 1 includes a column 1, two groups of cylinders 1 and two groups of cameras 1;

[0008] The fixing mechanism is provided with two groups, and a second conveying part is provided on the left side of the fixing mechanism, and the fixing mechanism includes a picking part, a dispensing component and a mounting part;

[0009] The welding mechanism includes three and four sets of welding heads of the driving part, and the four sets of welding heads are fixed at equal distances at the bottom of the driving part three;

[0010] Two groups of cooling mechanisms are provided, and the cooling mechanisms include two columns, two groups of cylinders and two groups of cooling heads. The cooling heads are hollow structures, and an air outlet channel toward the conveying part 1 is provided inside.

[0011] The detection part 2 includes a column 3, two sets of cylinders 3, two sets of cameras 2 and two sets of temperature sensors;

[0012] The packaging device also includes a packaging system, which is used to collect information before and after packaging and determine the overall packaging result;

[0013] The packaging system includes an acquisition module, a judgment module, a counting module, a control module and an alarm module. The acquisition module is used to collect and record the deformation of circuit board materials and the welding quality and temperature of field effect tube pins. The judgment module is used to make judgments and analyses based on the collected data. The counting module is used to perform intermittent counting when the circuit board materials and the circuit boards encapsulated with field effect tubes are abnormal. The control module is used to control the operation of each link. The alarm module is used to give an alarm prompt when the packaging device is producing abnormalities.

[0014] According to the above technical solution, the conveying part 1 is fixed at the top center of the workbench, the conveying part 1 is arranged on the right side of the fixing mechanism, the welding mechanism and the cooling mechanism, and a defective product recovery area is arranged at the right end of the conveying part 1.

[0015] According to the above technical solution, the material taking mechanism includes a material unloading component, a material moving component 1 and a limiting part 1;

[0016] The unloading assembly includes a driving part 1, a rotating table 1, two groups of storage frames and two groups of suction parts. The top of the workbench is fixedly connected with a protective shell. The driving part 1 and the suction part are fixed on the top of the workbench and inside the protective shell. The rotating table 1 is connected to the bearing on the top of the workbench. Two groups of material taking ports and two groups of limiting notches are opened on the top of the rotating table 1. There are two storage frames in each group. The storage frames are arranged on the top of the rotating table 1. The storage frames, the suction part and the material taking ports are located in a corresponding position.

[0017] The material moving component is arranged on the left side of the rotating table, and the conveying part passes through the top of the material moving component. The material moving component includes a base, an electric telescopic rod, a limit guide column and a material moving block. The electric telescopic rod is fixed to the side of the base, the limit guide column is fixed to the base, the material moving block is sleeved on the limit guide column and slidably connected to the limit guide column, the output end of the electric telescopic rod is fixedly connected to the material moving block, and the top of the material moving block is fixedly connected with the material moving rod;

[0018] The output end of the limiting part is fixedly connected to a card block, which matches the size of the notch on the rotating table. When the suction part absorbs the circuit board to be packaged and the material transfer component moves the circuit board to the conveying part, the rotating table can be limited to improve the temperature resistance during unloading.

[0019] According to the above technical solution, column one is fixed on the top of the workbench, cylinder one is fixed on one side of the column, and camera one is fixed on the output end of cylinder one. It can detect the deformation of the packaged circuit board raw material and process the packaged field effect tube on the deformed circuit board.

[0020] According to the above technical solution, column two is fixed to the top of the workbench, cylinder two is fixed to the side of column two, and the cooling head is fixed to the output end of cylinder two. The cooling head is connected to an air pump, which can cool the solder joints of the field effect tube pins and use the airflow to blow up the unsoldered and unglued field effect tubes, causing the field effect tubes to be offset in position.

[0021] According to the above technical scheme, the glue dispensing assembly includes a second driving part, a second rotating table, a glue dispensing seat, a limit plate and a glue gun. The glue dispensing seat is provided with four groups. The glue dispensing seats are evenly distributed in a circle on the top of the second rotating table. A through groove and a detection groove are provided on the top of the glue dispensing seat. The through groove runs through the top of the second rotating table. Two groups of sliders are adjustably fixed on the glue dispensing seat. The limit plate is fixed on the second rotating table. Four groups of mounting grooves are provided on the limit plate. The mounting grooves correspond to the positions of the glue dispensing seat. The glue gun is provided in the mounting groove. The glue outlet of the glue gun is located in the through groove. A photosensitive sensor is provided in the detection groove. The photosensitive sensor is fixedly connected to the glue dispensing seat and can apply glue on the field effect tube on the glue dispensing seat to improve the stability of the installation.

[0022] According to the above technical solution, column three is fixed to the top of the workbench, cylinder three is fixed to the side of column three, camera two and temperature sensor are fixed to the output end of cylinder three, which can detect the position of the field effect tube and the condition of the pin solder joints after packaging is completed.

[0023] According to the above technical scheme, the unloading mechanism includes a material receiving component, a material moving component 2 and a limiting part 2. The structure of the material receiving component is the same as that of the unloading component. The limiting part 2 has the same structure and function as the limiting part 1. The material moving component 2 includes two groups of cylinders 4 and two groups of push plates. Cylinder 4 is fixed to one side of the conveying part, and the push plate is fixed to the output end of cylinder 4, so that the field effect tubes that have passed the packaging can be stored and placed.

[0024] According to the above technical solution, the acquisition module is electrically connected to the detection part 1 and the detection part 2, and the control module is electrically connected to the transmission part 1, the fixing mechanism, the welding mechanism, the cooling mechanism, the detection part 2, the unloading mechanism and the transmission part 2.

[0025] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: the present invention can complete the fixing, welding and cooling of the field effect tube by providing a fixing mechanism, a welding mechanism and a cooling mechanism, and can also use airflow to blow up the unwelded field effect tube while cooling the solder joints of the field effect tube pins to generate position shift, thereby facilitating the improvement of the packaging effect and production efficiency of the field effect tube;

[0026] By providing the detection part one and the detection part two, the circuit board before and after packaging the field effect transistor can be inspected to ensure that the packaged circuit board is not deformed, which is beneficial to improving the accuracy of packaging, while reducing the inspection time of the products before and after packaging, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic structural diagram of the material taking mechanism of the present invention;

[0030] Figure 3 It is a schematic diagram of the structure of the material taking mechanism of the present invention when viewed from above;

[0031] Figure 4 It is a partial structural rear view schematic diagram of the present invention;

[0032] Figure 5 The present invention Figure 4 A schematic diagram of the enlarged structure of the middle A area;

[0033] Figure 6 It is a schematic diagram of the installation mechanism structure of the present invention;

[0034] Figure 7 The present invention Figure 6 Schematic diagram of the enlarged structure of the middle B area;

[0035] Figure 8 The present invention Figure 4 Schematic diagram of the enlarged structure of the middle C area;

[0036] Fig. 9 It is a schematic diagram of the cross-sectional structure of the cooling head of the present invention;

[0037] In the figure: 1. workbench; 2. conveying part 1;

[0038] 3. Material taking mechanism; 31. Material unloading assembly; 311. Driving unit 1; 312. Rotating table 1; 313. Storage frame; 314. Material suction unit; 32. Material moving assembly 1; 321. Base; 322. Electric telescopic rod; 323. Limiting guide column; 324. Material moving block; 33. Limiting unit 1;

[0039] 4. Detection unit 1; 41. Cylinder 1; 42. Camera 1;

[0040] 5. Fixing mechanism; 51. Pick-up unit; 52. Glue dispensing assembly; 521. Driving unit 2; 522. Rotating table 2; 523. Glue dispensing seat; 524. Limiting plate; 525. Glue gun; 526. Photosensitive sensor; 53. Installation unit;

[0041] 6. Welding mechanism; 61. Driving unit three; 62. Welding head;

[0042] 7. Cooling mechanism; 71. Cylinder 2; 72. Cooling head;

[0043] 8. Detection unit 2; 81. Cylinder 3; 82. Camera 2; 83. Temperature sensor;

[0044] 9. Material unloading mechanism; 91. Material receiving assembly; 92. Material shifting assembly 2; 921. Cylinder 4; 922. Push plate; 93. Limiting part 2;

[0045] 10. Transmission unit 2. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] See also Figure 1-9 The present invention provides a technical solution: a field effect tube packaging device, including a workbench 1, a conveying part 2, and a material taking mechanism 3, a detection part 4, a fixing mechanism 5, a welding mechanism 6, a cooling mechanism 7, a detection part 8, and a material unloading mechanism 9 which are sequentially arranged on the top of the workbench 1 from right to left. The material taking mechanism 3 is used to take down the circuit board and place it on the conveying part 2 for transmission, the fixing mechanism 5 and the welding mechanism 6 are used to package the field effect tube on the circuit board that has passed the inspection, the cooling mechanism 7 is used to cool the circuit board that has been welded, the material unloading mechanism 9 is used to unload and store the circuit board that has passed the inspection after packaging, the detection part 4 is used to detect the deformation of the circuit board, and the detection part 8 is used to detect the welding condition of the field effect tube pins.

[0048] See also Figure 1The conveying part 2 is fixed at the top center of the workbench 1, and is arranged on the right side of the fixing mechanism 5, the welding mechanism 6 and the cooling mechanism 7. A defective product recovery area is arranged at the right end of the conveying part 2. The conveying part 2 is preferably driven by a motor to transmit.

[0049] See also Figure 1~Figure 3 The material taking mechanism 3 includes a material unloading component 31, a material moving component 32 and a limiting part 33. The material unloading component 31 is used for unloading and unloading materials. The material moving component 32 is used to move the circuit board taken from the material unloading component 31 to the conveying part 2. The limiting part 33 is used to limit the position of the material unloading component 31.

[0050] The unloading assembly 31 includes a driving part 311, a rotating table 312, two groups of storage frames 313 and two groups of suction parts 314. The top of the workbench 1 is fixedly connected with a protective shell. The driving part 311 and the suction part 314 are fixed on the top of the workbench 1 and inside the protective shell. The rotating table 312 is connected to the top bearing of the workbench 1. The output end of the driving part 311 is connected to the rotating table 312 by a gear rack transmission. The driving part 311 is used to drive the rotating table 312 to rotate. Two groups of material taking ports and two groups of limiting notches are opened on the top of the rotating table 312. The storage frames 313 have two in each group. The storage frames 313 are arranged on the top of the rotating table 312. The storage frames 313 and the suction part 314 correspond to the positions of the material taking ports. The suction part 314 is used to suck the circuit board.

[0051] The material moving component 32 is arranged on the left side of the rotating table 312, and the conveying part 2 passes through the top of the material moving component 32. The material moving component 32 includes a base 321, an electric telescopic rod 322, a limiting guide column 323 and a material moving block 324. The electric telescopic rod 322 is fixed to the side of the base 321, the limiting guide column 323 is fixed on the base 321, the material moving block 324 is sleeved on the limiting guide column 323 and is slidably connected to the limiting guide column 323, the output end of the electric telescopic rod 322 is fixedly connected to the material moving block 324, and the top of the material moving block 324 is fixedly connected with the material moving rod;

[0052] The output end of the limiting part 33 is fixedly connected to a card block, and the size of the card block matches the notch on the rotating table 312. The limiting part 33 is driven to extend and retract by a cylinder. When the limiting part 33 is extended, the card block is inserted into the limiting notch to limit the rotating table 312 to prevent the rotating table 312 from rotating. When the limiting part 33 is contracted, the card block releases the limit on the rotating table 312.

[0053] It should be noted that the suction part 314 is driven to rise and fall by a cylinder, and the output end of the suction part 314 is connected to a suction cup for sucking and releasing materials; the storage frame 313 is a frame that can take in and release materials from both the upper and lower parts, and a limiting structure is provided at the bottom of the storage frame 313 to prevent materials from falling. The storage frame 313 is an existing structure and will not be described in detail here.

[0054] In actual operation, the electric telescopic rod 322 is extended, so that the material moving block 324 drives the material moving rod to be located under the rotating table 312, and the suction part 314 is extended to suck the circuit board in the storage frame 313 and then descends, so that the circuit board is located on the base 321. After that, the electric telescopic rod 322 is retracted to move the circuit board from the top of the base 321 to the conveying part 2 for transmission. When the transmission of a group of circuit boards on the storage frame 313 is completed, the limiting part 33 is retracted first, and after the driving part 311 drives the rotating table 312 to rotate, the limiting part 33 is extended again to clamp the card block into the notch to limit the rotating table 312.

[0055] See also Figure 4 and Figure 5 The detection part 4 includes a column 1, two groups of cylinders 41 and two groups of cameras 42. The column 1 is fixed on the top of the workbench 1, the cylinder 41 is fixed on one side of the column, and the camera 42 is fixed on the output end of the cylinder 41. When in use, the cylinder 41 starts production, drives the camera 42 to descend, and shoots the deformation of the circuit board of the field effect tube to be packaged.

[0056] See also Figure 1 , Figure 6 and Figure 7 The fixing mechanism 5 is provided with two groups. A second conveying part 10 is provided on the left side of the fixing mechanism 5. The second conveying part 10 is used to convey and arrange the field effect tubes so that the directions of the field effect tubes are consistent. The fixing mechanism 5 includes a picking part 51, a dispensing assembly 52 and a mounting part 53. The picking part 51 is used to place the neatly arranged field effect tubes on the second conveying part 10 on the dispensing assembly 52 for dispensing. The mounting part 53 is used to install the field effect tubes after dispensing on the circuit board.

[0057] It should be noted that both the picking-up portion 51 and the mounting portion 53 can move up and down, left and right, and forward and backward; both the picking-up portion 51 and the mounting portion 53 are provided with suction cups for picking up and mounting the field effect tube.

[0058] The glue dispensing assembly 52 includes a second driving unit 521, a second rotating platform 522, a glue dispensing seat 523, a limiting plate 524 and a glue gun 525. The second driving unit 521 is preferably driven by a motor and a bevel gear transmission. The second driving unit 521 is used to drive the second rotating platform 522 to rotate. The glue dispensing seat 523 is provided with four groups. The glue dispensing seats 523 are evenly distributed on the top of the second rotating platform 522. The top of the glue dispensing seat 523 is provided with a through groove and a detection groove. The through groove runs through the top of the second rotating platform 522. Two sets of sliders are adjustably fixed on the glue dispensing seat 523, which are convenient for placing field effect tubes of different sizes after adjustment. The limiting plate 524 is fixed on the rotating table 522. Four sets of mounting grooves are arranged on the limiting plate 524. The mounting grooves correspond to the positions of the glue dispensing seat 523. The glue gun 525 is arranged in the mounting groove. The glue outlet of the glue gun 525 is located in the through groove. A photosensitive sensor 526 is arranged in the detection groove. The photosensitive sensor 526 is fixedly connected to the glue dispensing seat 523.

[0059] In actual operation, when the picking unit 51 places the field effect tube on the glue dispensing seat 523, the field effect tube covers the detection slot, and the photosensor 526 detects that the light becomes dim, indicating a dark state. Then, the driving unit 521 starts to drive the rotating table 522 to rotate a quarter of a turn, and then the glue gun 525 starts to apply glue on the field effect tube. Then, the driving unit 521 starts to drive the rotating table 522 to continue to rotate a quarter of a turn, and the installation unit 53 picks up the field effect tube with glue and installs it on the circuit board.

[0060] See also Figure 1 and Figure 4 The welding mechanism 6 includes a driving part 3 61 and four groups of welding heads 62. The four groups of welding heads 62 are equidistantly fixed at the bottom of the driving part 3 61. The driving part 3 61 is preferably driven by a cylinder, which can drive the four groups of welding heads 62 to move forward and backward synchronously along the conveying part 2 and move up and down individually or simultaneously. When in use, the driving part 3 61 drives the welding heads 62 to adjust the front and back and up and down positions, so that the welding heads 62 weld the pins of the field effect tube to the circuit board.

[0061] See also Figure 4 , Figure 8 and Fig. 9The cooling mechanism 7 is provided with two groups, and the cooling mechanism 7 includes two columns, two groups of cylinders 71 and two groups of cooling heads 72. The column 2 is fixed on the top of the workbench 1, the cylinder 71 is fixed on the side of the column 2, and the cooling head 72 is fixed on the output end of the cylinder 71. The cooling head 72 is a hollow structure, and an air outlet channel toward the transmission part 2 is provided inside. The cooling head 72 is connected to an air pump. When in use, the cylinder 71 is extended to drive the cooling head 72 to descend, so that the cooling head 72 covers the welded field effect tube pins. The air pump is started, and the airflow is quickly blown from the air outlet channel to the pins to cool the pin welding. At the same time, the fast cold air flow can blow up the unwelded field effect tubes, so that the position of the field effect tubes changes.

[0062] See also Figure 8 The detection part 2 8 includes a column 3, two groups of cylinders 3 81, two groups of cameras 2 82 and two groups of temperature sensors 83. The column 3 is fixed to the top of the workbench 1, the cylinder 3 81 is fixed to the side of the column 3, the camera 2 82 and the temperature sensor 83 are fixed to the output end of the cylinder 3 81, the camera 2 82 is used to shoot the welding condition of the field effect tube pins, and the temperature sensor 83 is used to detect the welding temperature of the field effect tube pins.

[0063] See also Figure 1 , Figure 4 and Figure 8 The unloading mechanism 9 includes a material receiving component 91, a material moving component 92 and a limiting part 93. The structure of the material receiving component 91 is the same as that of the unloading component 31. The limiting part 93 is the same as that of the limiting part 33. The material moving component 92 is used to move the qualified circuit board on the conveying part 2 to the bottom of the unloading component 31. The material moving component 92 includes two groups of cylinders 921 and two groups of push plates 922. The cylinder 921 is fixed to the side of the conveying part 2, and the push plate 922 is fixed to the output end of the cylinder 921. When in use, the cylinder 921 starts to extend, so that the push plate 922 pushes the circuit board on the conveying part 2 onto the material receiving component 91, and the material receiving component 91 stores the circuit board and places it in the storage frame 313.

[0064] It should be noted that a placement platform is provided at the position of the fixing mechanism 5, the welding mechanism 6, the cooling mechanism 7, the detection part 8 and the unloading mechanism 9 corresponding to the conveying part 2, and a pneumatic clamp is provided on the side close to the conveying part 2. The pneumatic clamp clamps the circuit board during installation, welding, cooling and detection, which is more conducive to improving the packaging accuracy.

[0065] The packaging device also includes a packaging system, which is used to collect conditions before and after packaging and judge the overall packaging results. The packaging system includes a collection module, a judgment module, a counting module, a control module and an alarm module. The collection module is electrically connected to the detection part 1 4 and the detection part 2 8. The collection module is used to collect and record the deformation of the circuit board raw materials and the welding quality and temperature of the field effect tube pins. The judgment module is used to make judgments and analyses based on the collected data. The counting module is used to perform intermittent counting when the circuit board raw materials and the circuit board encapsulated with the field effect tube are abnormal. The control module is electrically connected to the conveying part 1 2, the fixing mechanism 5, the welding mechanism 6, the cooling mechanism 7, the detection part 2 8, the unloading mechanism 9 and the conveying part 2 10. The control module is used to control the operation of each link. The alarm module is used to give an alarm prompt when the packaging device is produced abnormally.

[0066] Packaging method of field effect tube packaging device:

[0067] Step 1: The control module controls the material taking mechanism 3 to take the material and starts the conveying part 1 2 to feed the material, and at the same time controls the conveying part 2 10 to start the conveying field effect tube.

[0068] Step 2: The detection unit 4 detects the deformation of the circuit board of the field effect tube to be packaged, and the judgment module analyzes and judges to perform subsequent packaging operations.

[0069] Specifically, the acquisition module acquires and records the shooting picture of the camera 42, and the judgment module is provided with a contour matching the shape of the circuit board of the field effect tube to be packaged. When the shape of the circuit board of the field effect tube to be packaged matches the contour, the circuit board is qualified and can be used for subsequent packaging operations; when the shape of the circuit board of the field effect tube to be packaged does not match the contour, the circuit board is deformed, resulting in an abnormal contour, the circuit board is unqualified, and subsequent packaging operations cannot be performed, and feedback is given to the control module and the counting module at the same time. The control module controls the subsequent fixing mechanism 5, welding mechanism 6, cooling mechanism 7, detection unit 8 and unloading mechanism 9 corresponding to the deformed circuit board not to operate, and the conveying unit 2 conveys it to the defective product recovery area, and the counting module counts the number of deformations, and the count value is recorded as a.

[0070] Step 3: The control module controls the fixing mechanism 5 to pick up and install the field effect tube, controls the welding mechanism 6 to weld the pins of the field effect tube to the circuit board, and controls the cooling mechanism 7 to cool the welded circuit board.

[0071] Step 4: The detection unit 2 8 detects the welding quality and temperature of the field effect tube pins on the circuit board, and the judgment module analyzes and determines the abnormal cause.

[0072] Specifically, the acquisition module collects and records the shooting image of camera 2 82 and the actual maximum welding temperature detected by the temperature sensor 83. The actual maximum temperature is recorded as t. The judgment module is provided with a standard solder joint contour corresponding to the field effect tube pin, a standard position contour of the field effect tube on the circuit board, a solder joint temperature threshold and a counting threshold that meet the storage requirements. The temperature threshold is recorded as T, and the counting threshold is N.

[0073] When t≤T, the cooling is normal, the cooling mechanism 7 operates normally, and the temperature requirement for storage is met;

[0074] When the actual position contour of the field effect tube on the circuit board is consistent with the standard position contour and the actual field effect tube pin solder joint is consistent with the standard solder joint contour, the field effect tube packaging is qualified and can be stored; in other cases, the field effect tube packaging is unqualified, the judgment module determines it as a defective product, and the control module controls the material transfer component 2 92 in the unloading mechanism 9 corresponding to the circuit board to stop running, and the conveying part 1 2 is conveyed to the defective product recovery area;

[0075] When the actual position contour of the field effect tube on the circuit board is consistent with the standard position contour, and the solder joint of the field effect tube pin is inconsistent with the standard solder joint contour, it is caused by the abnormality of the welding mechanism 6. The counting module intermittently counts the abnormality of the welding mechanism 6, and the count value is b;

[0076] When the actual position contour of the field effect tube on the circuit board is inconsistent with the standard position contour, and the solder joint of the field effect tube pin is consistent with the standard solder joint contour, it is caused by the abnormality of the fixing mechanism 5 during the dispensing installation. If the actual position contour of the field effect tube can be detected at this time, it is caused by the abnormal installation of the fixing mechanism 5, and the counting module performs intermittent counting, and the counting value is c1; if the actual position contour of the field effect tube cannot be detected, it is caused by the abnormal dispensing of the fixing mechanism 5, and the counting value is c2;

[0077] The actual position contour of the field effect tube on the circuit board is inconsistent with the standard position contour, and the solder joint of the field effect tube pin is inconsistent with the standard solder joint contour, but when the solder joint is complete, it is caused by the field effect tube being accidentally touched during cooling by the cooling mechanism 7, resulting in the displacement of the field effect tube position. The counting module performs intermittent counting of the abnormality of the cooling mechanism 7, and the count value is d; if there is no solder joint or the solder joint is missing at this time, it is caused by the abnormality of the welding mechanism 6, and the counting module still performs intermittent counting of the abnormality of the welding mechanism 6, and the count value is still b;

[0078] When t>T, it is cooling abnormality, and the corresponding cooling mechanism 7 operates abnormally. The judgment module determines it as a defective product and feeds back to the counting module. The counting module intermittently counts the abnormality of the cooling mechanism 7, and the count value is still d, to avoid deformation of the pin solder joints during storage and affect the packaged circuit boards that have been stored.

[0079] When a≥N in the same batch, the counting module will feed back the alarm module to give an alarm prompt, and the staff will check the circuit boards in this batch to avoid abnormal circuit boards affecting the production progress and reducing production efficiency;

[0080] When b, c1, c2, d≥N, the counting module feeds back to the alarm module to issue an alarm prompt, and the staff will inspect the corresponding fixing mechanism 5, welding mechanism 6 and cooling mechanism 7 to avoid passively increasing the defective rate of the field effect tube package due to abnormal processing mechanism. After the staff has processed the corresponding mechanism, the count value of the mechanism will be reset to zero, and the remaining mechanisms will continue to count; if all mechanisms have been inspected by the staff and the count value reaches N again, the alarm module will issue an alarm prompt and control all mechanisms on the packaging device to stop running at the same time to avoid continuous production of defective products that do not meet production requirements and affect production quality and production progress.

[0081] It should be noted that the packaging device can also be used for testing a single circuit board without encapsulating a field effect transistor and testing a circuit board with encapsulated field effect transistors.

[0082] Through the above steps, it is possible to detect the circuit board before and after packaging the field effect tube, ensure that the packaged circuit board is not deformed, and improve the accuracy of packaging. At the same time, the fixing mechanism 5, the welding mechanism 6 and the cooling mechanism 7 are set to complete the fixing, welding and cooling of the field effect tube, reduce the production process and cooling time, and help improve the packaging efficiency.

[0083] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0084] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A field effect tube packaging device, comprising a workbench (1), a conveying part (2), and a material taking mechanism (3), a detection part (4), a fixing mechanism (5), a welding mechanism (6), a cooling mechanism (7), a detection part (8), and a material unloading mechanism (9) arranged on the top of the workbench (1) from right to left, characterized in that: The material taking mechanism (3) is used to take off the circuit board and place it on the conveying part 1 (2) for conveying; the fixing mechanism (5) and the welding mechanism (6) are used to package the field effect tube on the circuit board that has passed the inspection; the cooling mechanism (7) is used to cool the circuit board that has been welded; the material unloading mechanism (9) is used to unload and store the circuit board that has passed the inspection after packaging; the detection part 1 (4) is used to detect the deformation of the circuit board; and the detection part 2 (8) is used to detect the soldering condition of the pins of the circuit board that is packaged with the field effect tube; The detection part 1 (4) comprises a column 1, two sets of cylinders 1 (41) and two sets of cameras 1 (42); The fixing mechanism (5) is provided with two groups, a second conveying part (10) is provided on the left side of the fixing mechanism (5), and the fixing mechanism (5) comprises a picking part (51), a dispensing component (52) and a mounting part (53); The glue dispensing assembly (52) comprises a second driving unit (521), a second rotating platform (522), a glue dispensing seat (523), a limiting plate (524) and a glue gun (525); a through slot and a detection slot are arranged on the top of the glue dispensing seat (523); the through slot passes through the top of the second rotating platform (522); two sets of sliders are adjustably fixed on the glue dispensing seat (523); a photosensitive sensor (526) is arranged in the detection slot; and the photosensitive sensor (526) is fixedly connected to the glue dispensing seat (523); The picking-up portion (51) and the mounting portion (53) are capable of moving up and down, left and right, and forward and backward; the picking-up portion (51) and the mounting portion (53) are provided with suction cups; The welding mechanism (6) comprises a third driving part (61) and four groups of welding heads (62), wherein the four groups of welding heads (62) are fixed at equal distances to the bottom of the third driving part (61); The cooling mechanism (7) is provided with two groups, and the cooling mechanism (7) comprises two columns, two groups of two cylinders (71) and two groups of cooling heads (72). The two columns are fixed to the top of the workbench (1), the two cylinders (71) are fixed to the side of the two columns, the cooling heads (72) are fixed to the output end of the two cylinders (71), the cooling heads (72) are connected to an air pump, the cooling heads (72) are hollow structures, and an air outlet channel facing the one conveying part (2) is provided inside. The two cylinders (71) extend to drive the cooling heads (72) to descend, and the cooling heads (72) cover the pins of the field effect tubes that have been welded. The airflow is quickly blown from the air outlet channel to the pins to cool the pin welding. At the same time, the fast cold air flow can blow up the field effect tubes that have not been welded, so that the position of the field effect tubes changes. The detection part 2 (8) comprises a column 3, two sets of cylinder 3 (81), two sets of camera 2 (82) and two sets of temperature sensors (83); The packaging device also includes a packaging system, which is used to collect information before and after packaging and determine the overall packaging result; The packaging system includes an acquisition module, a judgment module, a counting module, a control module and an alarm module. The acquisition module is used to acquire and record the deformation of circuit board materials and the welding quality and temperature of field effect tube pins. The judgment module is used to perform judgment and analysis based on the acquired data. The counting module is used to perform intermittent counting when the circuit board materials and the circuit board encapsulated with the field effect tube are abnormal. The control module is used to control the operation of each link. The alarm module is used to issue an alarm prompt when the packaging device is producing abnormally.

2. A field effect transistor packaging device according to claim 1, characterized in that: The conveying part 1 (2) is fixed at the top center of the workbench (1), and the conveying part 1 (2) is arranged on the right side of the fixing mechanism (5), the welding mechanism (6) and the cooling mechanism (7). A defective product recovery area is arranged at the right end of the conveying part 1 (2).

3. A field effect tube packaging device according to claim 2, characterized in that: The material taking mechanism (3) comprises a material unloading component (31), a material moving component 1 (32) and a limiting part 1 (33); The material unloading assembly (31) comprises a driving part (311), a rotating table (312), two groups of storage frames (313) and two groups of material suction parts (314); a protective shell is fixedly connected to the top of the workbench (1); the driving part (311) and the material suction part (314) are fixed to the top of the workbench (1) and inside the protective shell; the rotating table (312) is connected to the top bearing of the workbench (1); two groups of material taking ports and two groups of limiting notches are provided on the top of the rotating table (312); each group of the storage frames (313) has two storage frames (313); the storage frames (313) and the material suction parts (314) correspond to the positions of the material taking ports; The material moving component (32) is arranged on the left side of the rotating table (312), the conveying part (2) passes through the top of the material moving component (32), the material moving component (32) comprises a base (321), an electric telescopic rod (322), a limiting guide column (323) and a material moving block (324), the electric telescopic rod (322) is fixed to the side of the base (321), the limiting guide column (323) is fixed on the base (321), the material moving block (324) is sleeved on the limiting guide column (323) and is slidably connected to the limiting guide column (323), the output end of the electric telescopic rod (322) is fixedly connected to the material moving block (324), and the top of the material moving block (324) is fixedly connected with the material moving rod; The output end of the limiting portion 1 (33) is fixedly connected to a clamping block, and the clamping block matches the size of the notch on the rotating platform 1 (312).

4. The field effect tube packaging device according to claim 1, characterized in that: The column one is fixed to the top of the workbench (1), the cylinder one (41) is fixed to one side of the column, and the camera one (42) is fixed to the output end of the cylinder one (41).

5. The field effect tube packaging device according to claim 1, characterized in that: The dispensing seats (523) are provided with four groups, and the dispensing seats (523) are evenly distributed in a circle on the top of the second rotating platform (522). The limiting plate (524) is fixed on the second rotating platform (522), and the limiting plate (524) is provided with four groups of mounting grooves, and the mounting grooves correspond to the positions of the dispensing seats (523). The glue gun (525) is arranged in the mounting groove, and the glue outlet of the glue gun (525) is located in the through groove.

6. The field effect tube packaging device according to claim 1, characterized in that: The third column is fixed to the top of the workbench (1), the third cylinder (81) is fixed to the side of the third column, and the second camera (82) and the temperature sensor (83) are fixed to the output end of the third cylinder (81).

7. The field effect tube packaging device according to claim 3, characterized in that: The material unloading mechanism (9) comprises a material receiving component (91), a material moving component 2 (92) and a limiting part 2 (93). The structure of the material receiving component (91) is the same as that of the material unloading component (31). The limiting part 2 (93) is the same as that of the limiting part 1 (33). The material moving component 2 (92) comprises two groups of cylinders 4 (921) and two groups of push plates (922). The cylinders 4 (921) are fixed to the side of the conveying part 1 (2), and the push plates (922) are fixed to the output end of the cylinders 4 (921).

8. The field effect tube packaging device according to claim 6, characterized in that: The acquisition module is electrically connected to the detection part 1 (4) and the detection part 2 (8), and the control module is electrically connected to the conveying part 1 (2), the fixing mechanism (5), the welding mechanism (6), the cooling mechanism (7), the detection part 2 (8), the unloading mechanism (9) and the conveying part 2 (10).

9. A packaging method for a field effect tube packaging device, referring to the field effect tube packaging device according to any one of claims 1 to 8, characterized in that: The packaging method of the packaging device comprises: step 1: the control module controls the material taking mechanism (3) to take the material and starts the conveying part 1 (2) to feed the material, and at the same time controls the conveying part 2 (10) to start the conveying field effect transistor; Step 2: The detection unit 1 (4) detects the deformation of the circuit board of the field effect transistor to be packaged, and the judgment module analyzes and determines whether to perform subsequent packaging operations; Step 3: The control module controls the fixing mechanism (5) to pick up and install the field effect tube, controls the welding mechanism (6) to weld the pins of the field effect tube to the circuit board, and controls the cooling mechanism (7) to cool the circuit board after welding; Step 4: The detection unit 2 (8) detects the soldering quality and temperature of the field effect tube pins on the circuit board, and the judgment module analyzes and determines the cause of the abnormality.

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