Edge covering and glue discharging method for electronic ceramic green body

Abstract

The invention discloses an edge covering and glue discharging method for an electronic ceramic green body, and relates to the technical field of electronic ceramic processing. According to the glue discharging method for the aluminum foil covered edge, electronic ceramic green bodies are stacked in a glue discharging jig according to the specified layer number; cutting an aluminum foil with a certain thickness into a specified size, and performing heat treatment for a period of time; the jig and the four edges of the whole green body are wrapped with aluminum foil subjected to heat treatment, and the wrapping area accounts for a certain proportion of the area of the jig; after edge covering is completed, the green body and the jig which are subjected to edge covering are loaded into a rubber discharging furnace, and rubber discharging is conducted in the atmosphere of air or nitrogen; and removing the covered edge after the rubber is discharged from the furnace, and finally obtaining the electronic ceramic rubber discharging sheet which is flat and free of warping, fragmentation and blackening.

Description

Technical Field

[0001] The invention relates to the technical field of electronic ceramic processing, in particular to an edge-wrapping and binder-removing method for electronic ceramic green bodies. Background Art

[0002] The preparation of electronic ceramics such as alumina, aluminum nitride, silicon nitride, and silicon carbide ceramics is generally divided into green body forming and green body sintering. Currently, the commonly used green body forming methods include dry pressing, injection molding, tape casting, and film rolling. Among them, tape casting is widely used because its process is easier to control and the product quality is stable. The tape casting process mainly includes the preparation of the early slurry and the adjustment of the later process parameters. The preparation of the tape casting slurry plays a decisive role in the entire tape casting process. The main components of the tape casting slurry are inorganic powder and organic carrier. Among them, the inorganic powder acts as a functional phase and the organic carrier acts as a mobile phase.

[0003] The organic carriers of tape casting slurry mainly include solvents, dispersants, binders, plasticizers and other modifiers. As the only continuous phase in the green body, the type and content of the binder determine the strength and density of the final green body. At present, the most commonly used binders in tape casting slurry are PVB (polyvinyl butyral) and PMMA (polymethyl methacrylate). PVB has the advantages of good compatibility, high plasticity, and easy debonding, and is the most commonly used tape casting binder.

[0004] Silicon nitride, aluminum nitride, and silicon carbide green bodies must be debinded before sintering. The current debinding method for ceramic green bodies is basically to stack them in a debinding jig for debinding. The edges of the green bodies are completely exposed to the outside world, which will cause two problems. One is that the debinding rate at the edge of the green body is faster than in the middle, and the other is that the heat loss at the edge of the green body is more than in the middle, resulting in uneven heating of the green body as a whole. Both of these problems will cause the debinding sheet to warp, and the debinding sheet is easy to break, which will cause the product to be scrapped and the yield to decrease. The solution of the prior art has two directions. One is to reduce the number of stacked layers of green bodies, and the other is to adjust the debinding process or debinding time. Both directions will cause a decrease in production capacity, and the difficulty and investment in adjusting the debinding process are very large.

[0005] Therefore, developing a debinding method for electronic ceramic green bodies such as silicon nitride, aluminum nitride, and silicon carbide is an issue that needs to be urgently addressed in the field of electronic ceramic preparation. Summary of the invention

[0006] The object of the present invention is to provide a method for edge binding and binder removal of electronic ceramic green bodies to solve the problems raised in the prior art.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A method for debinding an edge of an electronic ceramic green body comprises the following steps:

[0009] Step 1: Take the electronic ceramic green body and stack it inside the debinding fixture;

[0010] Step 2: Cut the aluminum foil, heat treat it and set aside;

[0011] Step 3: Take the aluminum foil after heat treatment in step 2 and perform edge wrapping on the debinding fixture and the electronic ceramic green body in step 1;

[0012] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0013] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0014] Furthermore, in step 1, 8-15 electronic ceramic green sheets can be stacked inside the debinding fixture, and each green sheet is separated by spraying boron nitride sintering powder.

[0015] Furthermore, the electronic ceramic green body is one of silicon nitride, aluminum nitride, aluminum oxide, silicon carbide, and silicon powder ceramic green bodies.

[0016] Furthermore, in step 2, the aluminum foil has a thickness of 15-30 μm, a length of 900-1100 mm, and a width of 55-65 mm.

[0017] Furthermore, the heat treatment in step 2 is performed at 300° C. for 1-3 hours.

[0018] Furthermore, the edge wrapping process in step 3 is specifically as follows: the side edges are wrapped with aluminum foil, and the area of ​​the upper and lower bottoms wrapped with aluminum foil accounts for 1 / 4-1 / 3.

[0019] Furthermore, the atmosphere debinding in step 4 includes the following five debinding stages:

[0020] Stage 1: Introduce air or nitrogen atmosphere into the debinding furnace. Set the atmosphere flow rate to 200-800L / min for every 500L furnace volume. Raise the temperature to 200-240℃ at 0.4℃ / min and keep warm for 50-100min.

[0021] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 20-100L / min, continue to heat at 0.4-0.6℃ / min, and keep warm for 20-30min every 50-60℃ rise;

[0022] Stage 3: When the temperature in stage 2 rises to 350-370℃, adjust the atmosphere flow rate to 20-100L / min, continue to heat at 0.4-0.6℃ / min, and keep warm for 60-80min every 50-60℃ rise;

[0023] Stage 4: After the temperature in stage 3 rises to 500-550°C, adjust the atmosphere flow rate to 20-100L / min and cool down at a rate of 0.6-2°C / min;

[0024] Stage 5: When the temperature in stage 4 drops to 400-450°C, adjust the atmosphere flow rate to 60-300L / min, keep warm for 2-5h, and then cool down to 20-25°C at 0.5-5°C / min.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The innovative use of aluminum foil wrapping for debinding of electronic ceramic green bodies; aluminum foil as a metal has good thermal conductivity. The choice of aluminum foil wrapping can make the temperature of the edges and the middle of the green body and the fixture uniform, so that the debinding rate of the edges and the middle of the green body tends to be consistent, effectively reducing the probability of warping and cracking of the debinding sheet; in addition, aluminum foil is recyclable and can be reused in the debinding production process; it is loaded into the debinding furnace together with the ceramic green body and the debinding fixture to optimize the debinding process and effectively reduce energy loss while ensuring thorough debinding;

[0027] 2. The heat treatment of aluminum foil can effectively prevent the aluminum foil from being corroded by debinding products during the debinding process of the green billet; in addition, heat treatment can soften the aluminum foil, making it more suitable for the debinding jig, which is convenient for the hemming operation;

[0028] 3. The present invention can effectively improve the warping, cracking and blackening of debinding sheets in the prior art ceramic debinding without affecting the production capacity, and increases the number of stacking layers of debinding green bodies compared with the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the side structure of the aluminum foil edge wrapping of the electronic ceramic green body in the present invention;

[0030] Figure 2 It is a schematic diagram of the front / bottom structure of the electronic ceramic green body aluminum foil edge wrapping in the present invention. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the experiment, silicon nitride ceramic green body was prepared by the following steps, including: dissolving 1 part of triethyl phosphate in 50 parts of solvent, placing in a ball mill, after ball milling for 4 hours, adding 50 parts of silicon nitride powder, 4 parts of yttrium oxide, 3 parts of magnesium oxide and 3 parts of titanium oxide, continuing ball milling for 12 hours, adding 4 parts of polyvinyl butyral and 4 parts of plasticizer, continuing ball milling for 12 hours, vacuum stirring and degassing for 1 hour, aging after degassing for 8 hours, controlling the viscosity at 10000-50000 CPS, and sieving. The product is pumped to the head of the casting machine, formed by a scraper, and then dried by hot air + bottom plate heating, and the PET base tape is peeled off to obtain a green body; wherein the solvent is composed of 40% isopropyl alcohol, 4% ethyl lactate, 1% dioxydimethyl ether acetate, 20% ethyl acetate and 30% butyl acetate; the plasticizer is composed of dibutyl phthalate and polyethylene glycol in a mass ratio of 1:1; the silicon nitride powder is composed of 90% α silicon nitride powder and 10% β silicon nitride powder, and the particle size D50 is 0.5-0.9um.

[0033] The silicon wafer ceramic green body is prepared by the following steps, including: dissolving 1 part of triethyl phosphate in 50 parts of solvent, placing in a ball mill, after ball milling for 4 hours, adding 50 parts of silicon wafer powder, 4 parts of yttrium oxide, 3 parts of magnesium oxide, 2.75 parts of zirconium oxide and 0.25 parts of titanium oxide, continuing ball milling for 12 hours, adding 4 parts of polyvinyl butyral and 4 parts of plasticizer, continuing ball milling for 12 hours, performing vacuum stirring degassing for 1 hour, aging after degassing for 8 hours, and controlling the viscosity at 10000-50000 CPS. After screening, it is pumped to the head of the casting machine, and after being scraped and formed, it is dried by hot air + bottom plate heating, and the PET base tape is peeled off to obtain a blank; wherein the solvent is composed of 40% isopropanol, 4% ethyl lactate, 1% dioxydimethyl ether acetate, 20% ethyl acetate and 30% butyl acetate; the plasticizer is composed of dibutyl phthalate and polyethylene glycol in a mass ratio of 1:1; the silicon wafer powder is composed of 90% silicon powder, 8% α silicon nitride powder, and 2% β silicon nitride powder, and the silicon powder particle size D50 is 2-10um.

[0034] Embodiment 1: The method for debinding an edge of an electronic ceramic green body described in this embodiment specifically comprises the following steps:

[0035] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0036] Step 2: Cut the aluminum foil to obtain a thickness of 20 μm, a length of 1100 mm, and a width of 65 mm, place it in a muffle furnace, and heat treat it at 300° C. for 3 hours for use;

[0037] Step 3: Take the aluminum foil after heat treatment in step 2, and perform edge wrapping on the debonding fixture and the electronic ceramic green body in step 1. Figure 1 , 2As shown, the aluminum foil wraps the side, and the aluminum foil wraps 1 / 4 of the upper and lower bottom areas;

[0038] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0039] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0040] The atmosphere debinding process includes the following five debinding stages:

[0041] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0042] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0043] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0044] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0045] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0046] Embodiment 2: The method for debinding an edge of an electronic ceramic green body described in this embodiment specifically comprises the following steps:

[0047] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0048] Step 2: Cut the aluminum foil to obtain a thickness of 20 μm, a length of 1100 mm, and a width of 65 mm, place it in a muffle furnace, and heat treat it at 300° C. for 1 hour for use;

[0049] Step 3: Take the aluminum foil after the heat treatment in step 2, and perform edge wrapping on the debonding fixture and the electronic ceramic green body in step 1, wrapping the side with aluminum foil, and the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 4;

[0050] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0051] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0052] The atmosphere debinding process includes the following five debinding stages:

[0053] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0054] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0055] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0056] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0057] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0058] Embodiment 3: The method for debinding an edge of an electronic ceramic green body described in this embodiment specifically comprises the following steps:

[0059] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0060] Step 2: Cut the aluminum foil to obtain a thickness of 20 μm, a length of 1100 mm, and a width of 65 mm, place it in a muffle furnace, and heat treat it at 300° C. for 1 hour for use;

[0061] Step 3: Take the aluminum foil after the heat treatment in step 2, and perform edge wrapping on the debonding fixture and the electronic ceramic green body in step 1, wrapping the side with aluminum foil, and the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 3;

[0062] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0063] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0064] The atmosphere debinding process includes the following five debinding stages:

[0065] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0066] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0067] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0068] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0069] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0070] Embodiment 4: The method for debinding an edge of an electronic ceramic green body described in this embodiment specifically comprises the following steps:

[0071] Step 1: Take 10 silicon wafer ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0072] Step 2: Cut the aluminum foil to obtain a thickness of 20 μm, a length of 1100 mm, and a width of 65 mm, place it in a muffle furnace, and heat treat it at 300° C. for 3 hours for use;

[0073] Step 3: Take the aluminum foil after the heat treatment in step 2, and perform edge wrapping on the debonding fixture and the electronic ceramic green body in step 1, wrapping the side with aluminum foil, and the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 4;

[0074] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0075] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0076] The atmosphere debinding process includes the following five debinding stages:

[0077] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0078] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0079] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0080] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0081] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0082] Comparative Example 1: Comparative Example 1 is based on Example 1. The difference between Comparative Example 1 and Example 1 is that the step of hemming in S2 and S3 is removed, and specifically includes the following steps:

[0083] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0084] Step 2: Load the debinding jig and green body of step 1 into the debinding furnace for atmosphere debinding;

[0085] Step 3: After the atmosphere debinding is completed, the debinding sheet is obtained.

[0086] The atmosphere debinding process includes the following five debinding stages:

[0087] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0088] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0089] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0090] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0091] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0092] Comparative Example 2: Comparative Example 2 is based on Example 1. The difference between Comparative Example 2 and Example 1 is that the aluminum foil heat treatment step in S2 is removed, and specifically includes the following steps:

[0093] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0094] Step 2: Cut the aluminum foil to obtain a thickness of 20 μm, a length of 1100 mm, and a width of 65 mm for later use;

[0095] Step 3: Take the aluminum foil cut in step 2 and wrap the debonding fixture and the electronic ceramic green body in step 1 as a whole, wrap the side with aluminum foil, and the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 4;

[0096] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0097] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0098] The atmosphere debinding process includes the following five debinding stages:

[0099] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0100] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0101] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0102] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0103] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0104] Comparative Example 3: Comparative Example 3 is based on Example 1. The difference between Comparative Example 3 and Example 1 is that an aluminum foil with a thickness of 40 μm is used, and specifically includes the following steps:

[0105] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0106] Step 2: Cut the aluminum foil to obtain a thickness of 40 μm, a length of 1100 mm, and a width of 65 mm, place it in a muffle furnace, and heat treat it at 300° C. for 3 hours for use;

[0107] Step 3: Take the aluminum foil after the heat treatment in step 2, and perform edge wrapping on the debonding fixture and the electronic ceramic green body in step 1, wrapping the side with aluminum foil, and the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 4;

[0108] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0109] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0110] The atmosphere debinding process includes the following five debinding stages:

[0111] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0112] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0113] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0114] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0115] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0116] Comparative Example 4: Comparative Example 4 is based on Example 1. The difference between Comparative Example 4 and Example 1 is that the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 2; specifically, the following steps are included:

[0117] Step 1: Take 10 pieces of silicon nitride ceramic green bodies and stack them inside the debinding fixture, and spray boron nitride sintering powder on each green body to separate them;

[0118] Step 2: Cut the aluminum foil to obtain a thickness of 20 μm, a length of 1100 mm, and a width of 65 mm, place it in a muffle furnace, and heat treat it at 300° C. for 3 hours for use;

[0119] Step 3: Take the aluminum foil after the heat treatment in step 2, and perform edge wrapping on the debonding fixture and the electronic ceramic green body in step 1, wrapping the side with aluminum foil, and the area of ​​the upper and lower bottoms wrapped by the aluminum foil accounts for 1 / 2;

[0120] Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding;

[0121] Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

[0122] The atmosphere debinding process includes the following five debinding stages:

[0123] Stage 1: Air atmosphere is introduced into the debinding furnace. The atmosphere flow rate is set to 800L / min for every 500L furnace volume. The temperature is raised to 200℃ at a rate of 0.4℃ / min and kept at this temperature for 100min.

[0124] Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 50L / min, continue to increase the temperature at 0.5℃ / min, and keep the temperature for 30min every 50℃ rise;

[0125] Stage 3: When the temperature in stage 2 reaches 350°C, adjust the atmosphere flow rate to 80L / min, continue to heat at 0.5°C / min, and keep warm for 60 minutes every time the temperature rises by 50°C;

[0126] Stage 4: After the temperature in stage 3 is raised to 550°C, the atmosphere flow rate is adjusted to 100 L / min, and the temperature is lowered at a rate of 2°C / min;

[0127] Stage 5: When the temperature in stage 4 drops to 400°C, adjust the atmosphere flow rate to 300 L / min, keep warm for 2 hours, and then cool down to 25°C at a rate of 0.5°C / min.

[0128] Detection test

[0129] Take the debonding sheets after edge binding and debonding of Example 1-4 and Comparative Example 1-4, the size of the debonding sheet is 258*188*0.45, use a warpage tester to perform a debonding sheet warpage test, uniformly measure the heights of 18 points of the whole debonding sheet, subtract the minimum height from the maximum height to obtain the height difference, and divide the height difference by the length of the debonding sheet. The test results are as follows:

[0130] Maximum height / mm Minimum height / mm Height difference / mm Warpage‰ Example 1 0.784 0.452 0.332 1.29 Example 2 0.760 0.446 0.314 1.22 Example 3 0.791 0.466 0.325 1.26 Example 4 0.785 0.457 0.328 1.27 Comparative Example 1 2.068 0.446 1.622 6.29 Comparative Example 2 1.864 0.438 1.426 5.53 Comparative Example 3 1.291 0.461 0.830 3.22 Comparative Example 4 2.133 0.435 1.698 6.58

[0131] Conclusion: The present invention provides a method for edge wrapping and debinding of electronic ceramic green sheets. According to the method, the green sheets and a debinding jig are edge wrapped with aluminum foil, and then placed in a debinding furnace for debinding, so that electronic ceramic debinding sheets with lower warpage can be obtained.

[0132] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A method for debinding the edge of an electronic ceramic green body, characterized in that: The following steps are involved: Step 1: Take the electronic ceramic green body and stack it inside the debinding fixture; Step 2: Cut the aluminum foil, heat treat it and set aside; Step 3: Take the aluminum foil after heat treatment in step 2 and perform edge wrapping on the debinding fixture and the electronic ceramic green body in step 1; Step 4: Load the debinding jig and green body completed with hemming in step 3 into the debinding furnace for atmosphere debinding; Step 5: After the atmosphere debonding is completed, remove the edge wrapping to obtain the debonding sheet.

2. The method for debinding the edge of an electronic ceramic green body according to claim 1, characterized in that: In step 1, 8 to 15 electronic ceramic green sheets are stacked inside the debinding fixture, and each green sheet is separated by spraying boron nitride sintering powder.

3. The method for debinding the edge of an electronic ceramic green body according to claim 1, characterized in that: The electronic ceramic green body in step 1 is one of silicon nitride, aluminum nitride, aluminum oxide, silicon carbide, and silicon powder ceramic green bodies.

4. The method for debinding the edge of an electronic ceramic green body according to claim 1, characterized in that: In step 2, the thickness of the aluminum foil is 15-30 μm, the length is 900-1100 mm, and the width is 55-65 mm.

5. The method for debinding the edge of an electronic ceramic green body according to claim 1, characterized in that: The heat treatment in step 2 is performed at 300° C. for 1-3 hours.

6. The method for debinding the edge of an electronic ceramic green body according to claim 1, characterized in that: The edge wrapping process in step 3 is specifically as follows: the side edges are wrapped with aluminum foil, and the area of ​​the upper and lower bottoms wrapped with aluminum foil accounts for 1 / 4-1 / 3.

7. The method for debinding the edge of an electronic ceramic green body according to claim 1, characterized in that: The atmosphere debinding in step 4 includes the following 5 debinding stages: Stage 1: Introduce air or nitrogen atmosphere into the debinding furnace, set the atmosphere flow rate to 200-800L / min, increase the temperature to 200-240℃ at 0.4℃ / min, and keep warm for 50-100min; Stage 2: After the end of stage 1, adjust the atmosphere flow rate to 20-100L / min, continue to heat at 0.4-0.6℃ / min, and keep warm for 20-30min every 50-60℃ rise; Stage 3: When the temperature in stage 2 rises to 350-370℃, adjust the atmosphere flow rate to 20-100L / min, continue to heat at 0.4-0.6℃ / min, and keep warm for 60-80min every 50-60℃ rise; Stage 4: After the temperature in stage 3 rises to 500-550°C, adjust the atmosphere flow rate to 20-100L / min and cool down at a rate of 0.6-2°C / min; Stage 5: When the temperature in stage 4 drops to 400-450°C, adjust the atmosphere flow rate to 60-300L / min, keep warm for 2-5h, and then cool down to 20-25°C at 0.5-5°C / min.

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