Integrated carrier copper foil production equipment and production method

Abstract

The invention provides integrated carrier copper foil production equipment and a production method, and relates to the technical field of copper foil preparation. The integrated carrier copper foil production equipment comprises an electrolysis device, a stripping layer generation device, a copper foil layer generation device and a conveying roller set, and the electrolysis device is used for generating a carrier layer; the stripping layer generating device is used for preparing a stripping layer on the preset surface of the carrier layer; the copper foil layer generation device is arranged on the rear side of the stripping layer generation device and used for preparing a copper foil layer on the side, away from the carrier layer, of the stripping layer; the conveying roller set is connected between the electrolyzing device and the stripping layer generating device and used for transferring the carrier layer to the stripping layer generating device within preset time. The technical scheme provided by the invention can be used for preparing a carrier copper foil product with extremely low surface profile tolerance.

Description

[0001] This application is a divisional application of the Chinese invention patent application with application number 202411161974.8, the subject matter of which is an integrated carrier copper foil production equipment and preparation method, and the application date is August 23, 2024. Technical Field

[0002] The present disclosure relates to the technical field of copper foil preparation, and in particular to an integrated carrier copper foil production device and a production method. Background Art

[0003] Carrier copper foil, also known as peelable copper foil, is an important electronic material mainly used in the manufacture of printed circuit boards and lithium-ion batteries. It is characterized by having one or more layers of carrier material to support an ultra-thin copper foil layer.

[0004] In the related art, since there is a large difference between the generation speed of the carrier layer and the processing speed of the post-processing equipment, when producing a low-profile carrier copper foil, the carrier layer is first generated at a first speed on a carrier layer generating device and rolled up, and then the rolled-up carrier layer is moved to the post-processing equipment for subsequent processing at a second speed to obtain the carrier copper foil.

[0005] However, since the carrier layer needs to wait for the winding to be completed before anti-oxidation or passivation treatment can be carried out, the surface of the carrier layer often changes its crystal profile due to oxidation during this period. Even if it is optimized later, it is difficult to restore the surface crystal state to the optimal state. As a result, the copper foil has a high profile and irregular grain profile, which cannot meet the application requirements of high-end carrier copper foil.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0007] The purpose of the embodiments of the present disclosure is to provide an integrated carrier copper foil production device and production method, which can be used to prepare a carrier copper foil product with extremely low surface profile, which can perform surface treatment on the carrier layer in the shortest time. Furthermore, the surface profile and grain particle profile uniformity of the carrier copper foil can be reduced at least to a certain extent.

[0008] Additional aspects and advantages of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure.

[0009] According to a first aspect of the present disclosure, an integrated carrier copper foil production device is provided, which includes: an electrolytic device, a peeling layer generating device, a copper foil layer generating device, and a conveying roller group. The electrolytic device is used to generate a carrier layer; the peeling layer generating device is used to prepare a peeling layer on a preset surface of the carrier layer; the copper foil layer generating device is arranged at the rear side of the peeling layer generating device, and is used to prepare a copper foil layer on a side of the peeling layer away from the carrier layer; the conveying roller group is connected between the electrolytic device and the peeling layer generating device, and is used to transfer the carrier layer to the peeling layer generating device within a predetermined time.

[0010] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the conveying roller group includes a connecting roller, and the connecting roller is a feeding roller of the surface treatment device; or, the connecting roller is a stripping roller of the electrolysis device.

[0011] In an exemplary embodiment of the present disclosure, based on the above scheme, the stripping layer generating device includes a first brush plating component and a second brush plating component. The first brush plating component is used to perform a first brush plating on a preset surface of the carrier layer using a phosphating salt to generate a phosphating film; the second brush plating component is used to perform a second brush plating on the phosphating film using a phosphating metal to obtain the stripping layer, and the second brush plating component is located after the first brush plating component.

[0012] In an exemplary embodiment of the present disclosure, based on the aforementioned solution, the brush plating method of the brush plating assembly is pulse brush plating, and the pulse of the pulse brush plating is any one or a combination of positive pulses or negative pulses.

[0013] In an exemplary embodiment of the present disclosure, based on the above scheme, the copper foil layer generating device includes a roller group, a tension control component and an electrodeposition processing component. The roller group is used to transfer the foil material transferred from the stripping layer generating device, and the transfer speed of the roller group to the foil material is consistent with the carrier layer generating speed of the electrolytic device; the tension control component is electrically connected to the roller group and is used to control the tension of the roller group on the foil material; the electrodeposition processing component is used to generate the copper foil layer on the surface of the stripping layer by electrodeposition.

[0014] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the roller group includes an active roller and a tension roller, wherein the active roller is used to control the transfer speed of the foil material; and the tension roller is used to maintain the tension of the foil material during the transfer process.

[0015] In an exemplary embodiment of the present disclosure, based on the above scheme, the tension control assembly includes a pressure sensor and a drive unit. The pressure sensor is arranged on the tension roller to detect the pressure of the foil material to obtain pressure data; the drive unit is used to adjust the rotation speed of the active roller according to the pressure data to dynamically compensate for the tension of the foil material during the transmission process.

[0016] In an exemplary embodiment of the present disclosure, based on the above scheme, the above-mentioned electrodeposition treatment assembly includes two conductive rollers and a copper electrodeposition tank. The two conductive rollers are respectively arranged on both sides of the foil material to provide a symmetrical cathode circuit connection distance for the foil material to improve the current uniformity and current controllability of different regions during the electrochemical treatment of the foil material; the copper electrodeposition tank includes an electrodeposition medium for uniformly depositing copper ions in the electrodeposition medium onto the surface of the peeling layer of the foil material.

[0017] In an exemplary embodiment of the present disclosure, based on the aforementioned solution, the above-mentioned integrated carrier copper foil production equipment further includes an anti-oxidation component, which is connected to the conveying roller group and is used to perform anti-oxidation treatment on the carrier layer transferred by the conveying roller group.

[0018] In an exemplary embodiment of the present disclosure, based on the aforementioned scheme, the copper foil layer generating device includes an electro-deposited copper grain size processing component, which uses the copper foil layer as a cathode, and forms crystal nuclei on the surface of the copper foil layer by adjusting the current density in different areas of the anode, and the generation rate of the crystal nuclei is greater than the growth rate of the crystal nuclei.

[0019] In an exemplary embodiment of the present disclosure, based on the above scheme, the electrolysis device includes an electrodeposition tank, a titanium cathode roller and a stripping roller. The electrodeposition tank is used to place the electrolyte; the titanium cathode roller is used to deposit the metal ions in the electrolysis process of the electrolyte to generate the carrier layer; and the stripping roller is used to strip the carrier layer from the titanium cathode roller.

[0020] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the copper foil layer generating device includes at least one exhaust hood for extracting and discharging harmful volatiles during the surface treatment and copper foil generating process.

[0021] In an exemplary embodiment of the present disclosure, based on the aforementioned solution, the operating width of the above-mentioned peeling layer generating device and the copper foil layer generating device is greater than 1.4 meters.

[0022] According to a second aspect of the present disclosure, a method for preparing an integrated carrier copper foil is provided, and the method for preparing an integrated carrier copper foil comprises: performing surface treatment on a raw foil surface of an electrolytic device to obtain a raw foil surface with preset copper foil metallographic structure parameters; preparing a carrier layer based on the raw foil surface of the electrolytic device; after the carrier layer is generated, performing surface anti-oxidation treatment within a preset time; performing brush plating treatment on the carrier layer after the surface anti-oxidation treatment to prepare a stripping layer on a preset surface of the carrier layer; performing electrodeposition treatment on the foil after the brush plating treatment to prepare a copper foil layer on a side of the stripping layer away from the carrier layer to obtain a carrier copper foil.

[0023] In an exemplary embodiment of the present disclosure, based on the aforementioned solution, the preparation speed of the electrolysis device is between 0.6 meters per minute and 5 meters per minute.

[0024] In an exemplary embodiment of the present disclosure, based on the above-mentioned solution, the release layer is a phosphide layer.

[0025] In an exemplary embodiment of the present disclosure, based on the aforementioned scheme, the preparation process of the stripping layer includes: performing a first brush plating on a preset surface of the carrier layer using a phosphating salt to generate a phosphating film; and performing a second brush plating on the phosphating film using a phosphating metal to obtain the stripping layer.

[0026] It can be seen from the above technical solution that the present disclosure has at least one of the following advantages and positive effects:

[0027] The integrated carrier copper foil production equipment disclosed in the present invention includes an electrolysis device, a peeling layer generating device, a copper foil layer generating device and a conveying roller group, wherein the conveying roller group is connected between the electrolysis device and the surface treatment device, and is used to transfer the carrier layer to the surface treatment device within a predetermined time. On the one hand, the carrier layer can be quickly surface treated after generation through the conveying roller group, which reduces the time the carrier layer is exposed to the air, thereby reducing the risk of oxidation, ensuring the stability of the crystal state of the carrier copper foil surface, and making it easier to meet the requirements of extremely low profile. On the other hand, the carrier layer generation step, the peeling layer generation step and the copper foil layer generation step are integrated into one production equipment, which simplifies the production process, reduces the investment of manpower and material resources, and reduces production costs. On the other hand, the carrier layer does not need to be rolled up and transferred after generation, avoiding the risk of foreign matter inclusions in the copper foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other features and advantages of the present disclosure will become more apparent by describing in detail example embodiments thereof with reference to the attached drawings.

[0029] Figure 1 It is a structural schematic diagram of an integrated carrier copper foil production device in an embodiment of the present disclosure.

[0030] Figure 2 It is a structural schematic diagram of another integrated carrier copper foil production equipment in an embodiment of the present disclosure.

[0031] Figure 3 It is a schematic diagram of the structure of a fifth processing tank in an embodiment of the present disclosure.

[0032] Figure 4 It is a schematic structural diagram of a carrier copper foil in an embodiment of the present disclosure.

[0033] Figure 5 It is a schematic structural diagram of a first brush plating assembly in an embodiment of the present disclosure.

[0034] Figure 6 It is a cross-sectional schematic diagram of a second brush plating assembly in an embodiment of the present disclosure.

[0035] Figure 7 It is a structural schematic diagram of a second brush plating assembly in an embodiment of the present disclosure.

[0036] Figure 8 It is a cross-sectional schematic diagram of another second brush plating assembly in an embodiment of the present disclosure.

[0037] Fig. 9 It is a schematic diagram of a process for preparing an integrated carrier copper foil in an embodiment of the present disclosure.

[0038] The main components in the figure are described as follows:

[0039] 1. Electrolytic device; 11. Electrodeposition tank; 12. Titanium cathode roller; 13. Carrier layer; 14. Polishing machine;

[0040] 2. Peeling layer generating device; 3. Copper foil layer generating device; 4. Conveying roller group; 5. Terminal processing device;

[0041] 211, first active roller; 2111, second sponge roller; 212, second active roller; 213, third active roller; 214, fourth active roller; 215, fifth active roller; 216, sixth active roller; 217, seventh active roller; 218, eighth active roller; 219, ninth active roller;

[0042] 221, a first tension roller; 222, a second tension roller; 223, a third tension roller; 224, a fourth tension roller; 225, a fifth tension roller; 226, a sixth tension roller; 227, a seventh tension roller; 228, an eighth tension roller;

[0043] 2301, a first conductive roller; 2302, a second conductive roller; 2303, a third conductive roller; 2304, a fourth conductive roller; 2305, a fifth conductive roller; 2306, a sixth conductive roller; 2307, a seventh conductive roller; 2308, an eighth conductive roller; 2309, a ninth conductive roller; 2310, a tenth conductive roller; 2311, an eleventh conductive roller; 2312, a twelfth conductive roller; 2313, a thirteenth conductive roller; 2314, a fourteenth conductive roller;

[0044] 2401, the first pressure roller; 2402, the second pressure roller; 2403, the third pressure roller; 2404, the fourth pressure roller; 2405, the fifth pressure roller; 2406, the sixth pressure roller; 2407, the seventh pressure roller; 2408, the eighth pressure roller; 2409, the ninth pressure roller; 2410, the tenth pressure roller; 2411, the eleventh pressure roller; 2412, the twelfth pressure roller; 2413, the thirteenth pressure roller; 2414, the fourteenth pressure roller; 2415, the fifteenth pressure roller; 251, the first tension control assembly; 252, the second tension control assembly; 253, the third tension control assembly; 254, the fourth tension control assembly; 255, the fifth tension control assembly; 256, the sixth tension control assembly; 257, the seventh tension control assembly;

[0045] 2601, the first processing tank; 2602, the second processing tank; 2603, the third processing tank; 2604, the fourth processing tank; 2605, the fifth processing tank; 2606, the sixth processing tank; 2607, the seventh processing tank; 2608, the eighth processing tank; 2609, the ninth processing tank; 2610, the tenth processing tank; 2611, the eleventh processing tank; 2612, the twelfth processing tank; 2613, the thirteenth processing tank; 2614, the fourteenth processing tank; 2615, the fifteenth processing tank; 2616, the sixteenth processing tank; 2617, the seventeenth processing tank; 2618, the eighteenth processing tank;

[0046] 271, first guide roller; 2711, first sponge roller; 272, second guide roller; 273, third guide roller; 274, fourth guide roller; 275, fifth guide roller;

[0047] 28. Drying box;

[0048] 291, first exhaust hood; 292, second exhaust hood;

[0049] 2121, a first positive electrode plate; 2122, a second positive electrode plate; 2123, a third positive electrode plate; 2124, a fourth positive electrode plate;

[0050] 15. peeling layer; 16. copper foil layer;

[0051] 2712, first brush plating solution; 2713, brush plating electrode; 2714, overflow brush plating area; 2715, second brush plating solution. DETAILED DESCRIPTION

[0052] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0053] In the relevant carrier copper foil production process, due to the mismatch between the generation speed of the carrier layer and the speed of the post-processing equipment, when producing the carrier copper foil, the carrier layer generation device continuously generates the carrier layer at a first speed and reels it, while the subsequent processing equipment performs surface treatment on the carrier layer at a second speed. However, before the carrier layer is rolled up, its surface may be oxidized due to exposure to air, thereby affecting the crystalline structure of the copper foil. Even if the optimization treatment is performed after oxidation, the crystalline state of the surface of the copper foil generated subsequently is difficult to restore to the ideal state, which results in a high profile of the copper foil, which cannot meet the strict requirements of certain application fields.

[0054] In addition, since the production and post-processing of the carrier layer are divided into different work sections, a large amount of manpower and material resources are required in the transfer process of the carrier layer, and the operation of winding and unwinding increases the risk of surface oxidation of the carrier layer, and may also cause foreign matter inclusion, affecting the overall quality and performance of the copper foil.

[0055] In order to solve all or part of the technical problems in the above-mentioned related technologies, the embodiments of the present disclosure provide an integrated carrier copper foil production device. Figure 1 As shown, the integrated carrier copper foil production equipment comprises an electrolytic device 1, a peeling layer generating device 2, a copper foil layer generating device 3 and a conveying roller group 4. The electrolytic device is used to generate the carrier layer; the peeling layer generating device is used to prepare the peeling layer on the preset surface of the carrier layer; the copper foil layer generating device is arranged at the rear side of the peeling layer generating device, and is used to prepare the copper foil layer on the side of the peeling layer away from the carrier layer; the conveying roller group is connected between the electrolytic device and the peeling layer generating device, and is used to transfer the carrier layer to the peeling layer generating device within a predetermined time.

[0056] Specifically, the electrolytic device may refer to a device for depositing a carrier layer on the cathode surface through an electrochemical deposition process. The stripping layer generating device may be used to form an easily strippable intermediate layer on the preset surface of the carrier layer. The stripping layer serves as an intermediate medium between the copper foil layer and the carrier layer, so that the copper foil layer can be relatively easily stripped from the carrier layer. The copper foil layer generating device may refer to a device for forming a layer of copper foil on the stripping layer by electroplating or electrodeposition. The conveying roller group may refer to a component connecting the electrolytic device and the stripping layer generating device, which is used to transfer the carrier layer from the electrolytic device to the stripping layer generating device within a predetermined time, thereby reducing the pause and waiting time in the production process.

[0057] In addition, the conveying roller group transfers the carrier layer to the peeling layer generating device within a predetermined time, wherein the predetermined time does not exceed 20 minutes. Exemplarily, the predetermined time may be between 1 minute and 5 minutes, and the production line distance between the discharge port of the electrolysis device and the feed port of the peeling layer generating device does not exceed 3 meters. Exemplarily, the production line distance between the discharge port of the electrolysis device and the feed port of the peeling layer generating device may be between 1 meter and 2 meters.

[0058] The material of the carrier layer in the embodiment of the present disclosure can be copper, aluminum, zinc, nickel or other materials that can be generated by electrolysis. Exemplarily, the integrated carrier copper foil production equipment also includes an end processing device 5. The end processing device is located at the end of the foil production line. Exemplarily, the end processing can be a winding mechanism for neatly winding the continuously produced carrier copper foil into a roll for storage, transportation and subsequent use. Exemplarily, the end processing can be a transition roller for transferring the foil delivered by the copper foil layer generating device to a subsequent processing device for processing.

[0059] Carrier copper foil is a type of copper foil generated by electrodeposition and other surface treatments. Its characteristic is that after the surface treatment is completed, the copper foil can be peeled off from the carrier layer to form an ultra-thin copper foil. In the actual production process, the electrolytic device generates a carrier layer at a preset current density and speed, and then transfers the generated carrier layer to a conveyor roller group, which transfers the carrier layer from the electrolytic device to a stripping layer generating device. In the stripping layer generating device, a phosphating salt is firstly used to brush plate the preset surface of the carrier layer to generate a phosphating film, and then a phosphating metal is brush plated on the phosphating film to generate a stripping layer on the carrier layer. Then, after subsequent water washing, copper deposition, passivation and other operations, an ultra-thin copper foil layer is generated on the side of the stripping layer away from the carrier layer.

[0060] The integrated carrier copper foil production equipment disclosed in the present invention, on the one hand, enables the carrier layer to be quickly surface treated after being generated through the conveying roller group, thereby reducing the time the carrier layer is exposed to the air, thereby reducing the risk of oxidation, ensuring the stability of the crystal state of the carrier copper foil surface, and making it easier to meet the requirements of extremely low profile. On the other hand, the carrier layer generation step, the peeling layer generation step and the copper foil layer generation step are integrated into one production equipment, which simplifies the production process, reduces the investment of manpower and material resources, and reduces production costs. On the other hand, the carrier layer does not need to be rolled up and transferred after generation, avoiding the risk of foreign matter inclusions in the copper foil.

[0061] The various parts of the above-mentioned integrated carrier copper foil production equipment are described in detail below.

[0062] In some embodiments, the conveying roller group includes a connecting roller, which can be a feed roller of a surface treatment device or a stripping roller of an electrolytic device. Among them, the feed roller can represent a component located between the electrolytic device and the stripping layer generating device, which is used to receive the carrier layer generated by the electrolytic device and convey it to the stripping layer generating device. The stripping roller can represent a component located at the end of the electrolytic device and used to strip the carrier layer from the electrolytic device. Using the feed roller of the stripping layer generating device or the stripping roller of the electrolytic device as the connecting roller of the conveying roller group can reduce the number of components of the equipment, simplify the equipment structure, reduce production costs, and reduce the time and distance of material transfer, thereby improving the continuity and efficiency of the production line. In addition, since the connecting roller directly connects the electrolytic device and the stripping layer generating device, the exposure time of the carrier layer during the transfer process is reduced, thereby reducing the risk of oxidation and contamination of the surface of the carrier layer. Further, the design and operation of the connecting roller can ensure the stability and integrity of the carrier layer during the transfer process, reduce the damage of the carrier layer during the transfer process, thereby improving the product quality and performance of the carrier copper foil.

[0063] In some embodiments, the stripping layer generating device includes a first brush plating component and a second brush plating component, wherein the first brush plating component is used to perform a first brush plating on a preset surface of a carrier layer using a phosphating salt to generate a phosphating film; the second brush plating component is used to perform a second brush plating on the phosphating film using a phosphating metal to obtain a stripping layer, and the second brush plating component is after the first brush plating component. Among them, the first brush plating component can be used to brush plate one or more layers of a specific material, such as a phosphating film, on the surface of the carrier layer, and the brush plating process of the first brush plating component is not charged, and the formed phosphating film helps to reduce the adhesion between the copper foil layer and the carrier layer in the subsequent stripping process, thereby achieving smooth stripping of the copper foil layer, and improving the corrosion resistance and surface properties of the stripping layer, and enhancing its bonding with subsequent coatings or plating layers. The second brush plating component can be used to perform brush plating on the phosphating film formed by the first brush plating component to form a phosphide layer, and the brush plating process of the second brush plating component is charged. The phosphide layer further enhances the corrosion resistance and conductivity of the stripping layer, and at the same time improves the mechanical strength and adhesion of the stripping layer.

[0064] In some embodiments, the brush plating method of the brush plating component is pulse brush plating, and the pulse of the pulse brush plating is any one or a combination of positive pulses or negative pulses. Among them, pulse brush plating can refer to an electroplating technology that superimposes a specific waveform pulse on a fixed direct current so that the electroplating process varies within a wide range. Positive pulse brush plating can mean that during the electroplating process, the positive direction of the current is periodically connected and disconnected. Negative pulse brush plating can mean that during the electroplating process, the negative direction of the current is periodically connected and disconnected. Pulse brush plating can improve the quality of the coating, such as the flatness and adhesion of the coating.

[0065] In some embodiments, the copper foil layer generating device includes a roller group, a tension control component and an electrodeposition processing component. The roller group can be used to transfer the foil delivered by the stripping layer generating device, and the transfer speed of the roller group to the foil is consistent with the carrier layer generating speed of the electrolytic device; the tension control component is electrically connected to the roller group and is used to control the tension of the roller group on the foil; the electrodeposition processing component is used to generate a copper foil layer on the surface of the stripping layer by electrodeposition.

[0066] Among them, the foil can represent the intermediate material form of the carrier copper foil during the preparation process. The roller group is a part of the integrated carrier copper foil production equipment, which includes a series of rollers for transferring the foil during the production process, ensuring the stability of the foil during the transfer process, and reducing the damage to the foil caused by vibration or impact. The transfer speed of the roller group to the foil is consistent with the carrier layer generation speed of the electrolytic device, which can ensure the continuity and consistency of the carrier layer generation, the peeling layer generation and the copper foil layer generation. The tension control component is a component in the integrated carrier copper foil production equipment for controlling the tension of the roller group on the foil. The tension control component can ensure uniform tension of the foil during the transfer process, prevent the foil from being relaxed or over-tightened during the processing process, which helps to maintain the flatness of the foil and reduce the change of the profile, thereby improving the quality and performance of the foil. The electroplating treatment component is used in the integrated carrier copper foil production equipment to generate a copper foil layer on the surface of the foil transferred by the roller group by electroplating.

[0067] In some embodiments, the roller group includes an active roller and a tension roller, wherein the active roller can be used to control the transfer speed of the foil; and the tension roller can be used to maintain the tension of the foil during the transfer process. The active roller can ensure that the foil is transferred at a constant speed during the production process by adjusting its rotation speed, which helps to maintain the continuity and efficiency of the production line, and reduce the damage of the foil during the transfer process, thereby ensuring the quality and integrity of the foil. The tension roller can ensure that the foil maintains appropriate tension during the transfer process by adjusting its contact force on the foil. Appropriate tension helps to maintain the flatness of the foil and reduce the change of the profile, thereby improving the quality and performance of the copper foil.

[0068] In some embodiments, the tension control assembly includes a pressure sensor and a drive unit. The pressure sensor can be set on the tension roller to detect the pressure of the foil to obtain pressure data; the drive unit can be used to adjust the rotation speed of the active roller according to the pressure data to dynamically compensate for the tension of the foil during the transmission process.

[0069] Specifically, the pressure sensor can monitor the tension state of the foil in the transmission process in real time. By detecting the pressure data, the tension of the foil can be understood in time to ensure that the tension remains stable during the production process. The drive unit can automatically adjust the rotation speed of the active roller according to the pressure data to dynamically compensate for the tension of the foil during the transmission process. This dynamic compensation mechanism helps to maintain the stability of the foil tension, reduce the damage to the foil caused by tension changes, and ensure the quality and integrity of the foil.

[0070] In some embodiments, the electrodeposition processing assembly includes two conductive rollers and a copper electrodeposition tank, wherein the two conductive rollers are respectively arranged on both sides of the foil to provide a symmetrical cathode circuit connection distance for the foil to improve the current uniformity and current controllability in different areas during the electrochemical treatment of the foil; the copper electrodeposition tank includes an electrodeposition medium for uniformly depositing copper ions in the electrodeposition medium onto the surface of the stripping layer of the foil.

[0071] Specifically, the two conductive rollers provide a symmetrical cathode connection distance for the foil, which can ensure that the foil is subjected to uniform current distribution during the electrodeposition process, thereby improving the uniformity and quality of the electrodeposited layer, and also help reduce the uneven distribution of current density on the surface of the foil, thereby reducing possible electrodeposition defects, such as uneven deposition layer, holes, etc. The copper electrodeposition tank can be used to ensure that copper ions are uniformly deposited on the surface of the stripping layer of the foil during the electrodeposition process, forming a uniform copper foil layer with controllable thickness. By accurately controlling parameters such as current density, temperature, pH value, etc. in the copper electrodeposition tank, carrier foil products that meet different application requirements can be produced.

[0072] In some embodiments, the integrated carrier copper foil production equipment also includes an anti-oxidation component, which is connected to the conveying roller group and is used to perform anti-oxidation treatment on the carrier layer transferred by the conveying roller group. Among them, anti-oxidation treatment is a treatment method that prevents metal materials from reacting with oxygen in the air during the production process, thereby preventing oxidation and pollution. Through anti-oxidation treatment, the oxidation risk of the foil during transportation can be reduced, and the surface quality and performance of the foil can be ensured. This helps to improve the corrosion resistance of the foil, extend its service life, and maintain the stability of the performance of the foil in subsequent processing and applications. Exemplarily, the anti-oxidation component can also brush-plate an anti-oxidation coating on the top and bottom of the carrier layer, or provide anti-oxidation gas protection during transportation, or form an anti-oxidation oil film on the surface of the carrier layer.

[0073] In some embodiments, the surface treatment device includes an electrodeposited copper grain size treatment component, which uses the copper foil layer as a cathode, and adjusts the current density of different regions of the anode to form crystal nuclei on the surface of the copper foil layer, and the generation speed of the crystal nuclei is greater than the growth speed of the crystal nuclei. The roughness treatment component can achieve precise control of the surface roughness of the copper foil layer. By adjusting the current density of different regions of the anode, a large number of fine crystal nuclei can be formed on the surface of the copper foil layer. Since the generation speed of the crystal nuclei is greater than the growth speed of the crystal nuclei, the roughness of the foil surface can be reduced, thereby obtaining a foil with low profile.

[0074] In some embodiments, the electrolysis device includes an electrodeposition tank, a titanium cathode roller, and a stripping roller. The electrodeposition tank can be used to place an electrolyte; the titanium cathode roller can be used to deposit metal ions in the electrolysis process of the electrolyte to generate a carrier layer; and the stripping roller can be used to strip the carrier layer from the titanium cathode roller. Exemplarily, when the carrier layer is copper, the electrolyte can be a copper sulfate solution. Exemplarily, when the carrier layer is aluminum, the electrolyte can be an aluminum sulfate solution.

[0075] In some embodiments, the integrated carrier copper foil production equipment includes at least one exhaust hood, which can be used to extract and treat the emission of harmful volatiles during the surface treatment and copper foil production process. By controlling the emission of harmful volatiles, the impact of harmful volatiles on the surface quality of the copper foil can be reduced, thereby improving the quality and performance of the copper foil, and reducing the health impact of harmful volatiles on operators, and protecting the equipment from corrosion and pollution by harmful volatiles, thereby extending the service life of the equipment.

[0076] In some embodiments, the working width of the peeling layer generating device and the copper foil generating device is greater than 1.4 meters. By setting the working width of the peeling layer generating device and the copper foil generating device to be greater than 1.4 meters, a wide carrier copper foil can be obtained, and the production efficiency is also improved.

[0077] In some practical examples, the peeling layer generating device can be grounded to electrically isolate the electrolytic device from the peeling layer generating device, so that there is no electrical connection between the electrolytic device and the peeling layer generating device, thereby reducing the surface defects of the foil body caused by electrical interference, thereby improving the quality of the product. It can also prevent operators from getting electric shocks due to equipment failures, thereby improving production safety.

[0078] The integrated carrier copper foil production equipment disclosed in the present invention, on the one hand, enables the carrier layer to be quickly surface treated after being generated through the conveying roller group, thereby reducing the time the carrier layer is exposed to the air, thereby reducing the risk of oxidation, ensuring the stability of the crystal state of the carrier copper foil surface, and making it easier to meet the requirements of extremely low profile. On the other hand, the carrier layer generation step, the peeling layer generation step and the copper foil layer generation step are integrated into one production equipment, which simplifies the production process, reduces the investment of manpower and material resources, and reduces production costs. On the other hand, the carrier layer does not need to be rolled up and transferred after generation, avoiding the risk of foreign matter inclusions in the copper foil.

[0079] Furthermore, by integrating the electrolysis device, the stripping layer generating device, the copper foil layer generating device and the conveying roller group, the continuous production of the carrier copper foil is realized, and the production efficiency is significantly improved; the use of the conveying roller group and the tension control component ensures the stability of the foil during the transmission process, reduces wrinkles and stretching, and thus improves the flatness and quality of the copper foil; by arranging two conductive rollers on both sides of the foil, a symmetrical cathode circuit connection distance is provided for the foil, the current uniformity is improved, the uniform deposition of the copper foil layer is achieved, and the consistency of the thickness and conductivity of the copper foil is ensured; the use of the anti-oxidation component effectively prevents the oxidation of the carrier layer in a high temperature environment, and ensures the quality and performance of the copper foil; the electrodeposited copper grain size processing component adjusts the current density to form a uniform crystal nucleus on the surface of the copper foil layer, improves the metallographic structure of the copper foil, and enhances its mechanical properties.

[0080] Figure 2 The schematic diagram of the structure of an integrated carrier copper foil production device in the embodiment of the present disclosure is shown schematically. Specifically, the integrated carrier copper foil production device is mainly used to produce carrier copper foil, which mainly includes: an electrolysis device, a peeling layer generating device, a copper foil layer generating device, a conveying roller group and a terminal processing device.

[0081] The electrolytic device 1 may be composed of an electrodeposition tank 11, a titanium cathode roller 12, a carrier layer 13 and a polisher 14. The polisher may be used to polish the titanium cathode roller to reduce the surface roughness of the titanium cathode roller and make the surface of the carrier layer more uniform and smooth.

[0082] The peeling layer generating device and the copper foil layer generating device can be composed of a plurality of active rollers, a plurality of tension rollers, a plurality of conductive rollers, a plurality of pressure rollers, a plurality of tension control components, a plurality of processing tanks, a plurality of guide rollers, a drying box and a plurality of exhaust hoods.

[0083] Specifically, the active rollers may include a first active roller 211, a second active roller 212, a third active roller 213, a fourth active roller 214, a fifth active roller 215, a sixth active roller 216, a seventh active roller 217, an eighth active roller 218 and a ninth active roller 219. The active rollers may be used to control the transfer speed of the foil.

[0084] The tension rollers may include a first tension roller 221, a second tension roller 222, a third tension roller 223, a fourth tension roller 224, a fifth tension roller 225, a sixth tension roller 226, a seventh tension roller 227 and an eighth tension roller 228. The tension rollers can ensure that the foil maintains appropriate tension during the transfer process by adjusting their contact force on the foil, and appropriate tension helps to maintain the flatness of the foil and reduce changes in profile.

[0085] The conductive rollers may include a first conductive roller 2301, a second conductive roller 2302, a third conductive roller 2303, a fourth conductive roller 2304, a fifth conductive roller 2305, a sixth conductive roller 2306, a seventh conductive roller 2307, an eighth conductive roller 2308, a ninth conductive roller 2309, a tenth conductive roller 2310, an eleventh conductive roller 2311, a twelfth conductive roller 2312, a thirteenth conductive roller 2313 and a fourteenth conductive roller 2314. The conductive rollers are arranged on both sides of the foil to supply power to the conductive medium and provide a symmetrical cathode circuit connection distance for the foil, so as to improve the current uniformity and current controllability of different regions during the electrochemical treatment of the foil.

[0086] The pressing rollers may include a first pressing roller 2401, a second pressing roller 2402, a third pressing roller 2403, a fourth pressing roller 2404, a fifth pressing roller 2405, a sixth pressing roller 2406, a seventh pressing roller 2407, an eighth pressing roller 2408, a ninth pressing roller 2409, a tenth pressing roller 2410, an eleventh pressing roller 2411, a twelfth pressing roller 2412, a thirteenth pressing roller 2413, a fourteenth pressing roller 2414 and a fifteenth pressing roller 2415. The pressing rollers ensure that the foil maintains a certain degree of compactness and stability during the transfer process by applying uniform pressure, and can also control the uniformity of stretching to prevent the material from being overstretched or torn.

[0087] The tension control assembly may include a first tension control assembly 251, a second tension control assembly 252, a third tension control assembly 253, a fourth tension control assembly 254, a fifth tension control assembly 255, a sixth tension control assembly 256, and a seventh tension control assembly 257. Each group of tension control assemblies includes a pressure sensor and a drive unit. The pressure sensor may be disposed on a corresponding tension roller to detect the pressure of the foil material to obtain pressure data. The drive unit may be used to adjust the rotation speed of the corresponding active roller according to the pressure data to dynamically compensate for the tension of the foil material during the transmission process.

[0088] The processing tanks may include a first processing tank 2601, a second processing tank 2602, a third processing tank 2603, a fourth processing tank 2604, a fifth processing tank 2605, a sixth processing tank 2606, a seventh processing tank 2607, an eighth processing tank 2608, a ninth processing tank 2609, a tenth processing tank 2610, an eleventh processing tank 2611, a twelfth processing tank 2612, a thirteenth processing tank 2613, a fourteenth processing tank 2614, a fifteenth processing tank 2615, a sixteenth processing tank 2616, a seventeenth processing tank 2617 and an eighteenth processing tank 2618.

[0089] Exemplarily, the first treatment tank 2601 can be used for the first brush plating treatment, that is, coating the carrier layer generated by the electrolytic device, and using the first sponge roller 2711, the phosphide salt is brush plated on the surface of the carrier layer to generate a phosphating film. The second treatment tank 2602 can be used for water washing treatment, for cleaning the electrolyte and the phosphide, or for anti-oxidation treatment of the carrier layer. The third treatment tank 2603 can be used for the second brush plating treatment, using the second sponge roller 2111, the phosphating metal is brush plated on the phosphating film to obtain a stripping layer. The fourth treatment tank 2604 can be used for water washing treatment, for cleaning the electrolyte and the phosphide. The fifth treatment tank 2605 and the sixth treatment tank 2606 are used for electrodeposition treatment, and copper foil is formed on the surface of the stripping layer by electrodeposition. The seventh treatment tank 2607 can be used for water washing treatment, for filtering out the electrolyte. The eighth treatment tank 2608 and the ninth treatment tank 2609 are used for electroplating treatment. Through the electroplating treatment, a copper foil layer can be formed on the surface of the stripping layer. The tenth treatment tank 2610 can be used for water washing treatment to filter out the electrolyte. The eleventh treatment tank 2611 can be used for electroplating treatment. The twelfth treatment tank 2612 can be used for electroplating copper grain size treatment. Specifically, the copper foil layer is used as the cathode. By adjusting the current density in different areas of the anode, a crystal nucleus is formed on the surface of the copper foil layer, and the generation rate of the crystal nucleus is greater than the growth rate of the crystal nucleus. The thirteenth treatment tank 2613 can be used for water washing treatment to filter out the electrolyte. The fourteenth treatment tank 2614 can be used for electroplating treatment. The fifteenth treatment tank 2615 can be used for water washing treatment. The sixteenth treatment tank 2616 can be used for passivation treatment to form a protective film to enhance the corrosion resistance and durability of the foil. The seventeenth treatment tank 2617 can be used for water washing treatment. The eighteenth processing tank 2618 can be used to perform a slitting process on the foil material to cut the foil material based on a preset size. Finally, a carrier copper foil consisting of a carrier layer, a peeling layer and a copper foil layer is obtained.

[0090] The guide rollers may include a first guide roller 271, a second guide roller 272, a third guide roller 273, a fourth guide roller 274, and a fifth guide roller 275. The guide rollers may be used to guide the foil to move along a specific path, ensuring that the foil does not deviate from a predetermined track during processing, while helping to maintain the straightness and alignment of the foil during transportation, reducing skew and wrinkles.

[0091] The air drying box 28 can be used to air dry the foil material to eliminate the liquid on its surface.

[0092] The exhaust hood may include a first exhaust hood 291 and a second exhaust hood 292, which are used to extract and discharge harmful volatiles in the process of surface treatment and copper foil production.

[0093] Figure 3The schematic diagram of the structure of a fifth processing tank in the embodiment of the present disclosure is schematically shown. The fifth processing tank 2605 includes a second active roller 212, a first positive plate 2121, a second positive plate 2122, a third positive plate 2123 and a fourth positive plate 2124. When both sides of the foil need to be surface treated, the above four plates can be powered on at the same time. However, when one side of the foil needs to be surface treated, the first positive plate 2121 and the second positive plate 2122 can be powered on, or the third positive plate 2123 and the fourth positive plate 2124 can be powered on.

[0094] Figure 4 The schematic diagram of the structure of a carrier copper foil in the embodiment of the present disclosure is shown, which specifically includes a carrier layer 13, a peeling layer 15 and a copper foil layer 16. The thickness of the copper foil layer can be 0.5 μm, 1.5 μm, 3 μm, 5 μm or other suitable values. When the thickness of the copper foil layer is 1.5 μm, the unit area weight of the carrier copper foil can be 18 g / m 2 Up to 22g / m 2 When the thickness of the copper foil layer is 3 μm, the unit area weight of the carrier copper foil can be 31 g / m 2 Up to 35g / m 2 When the thickness of the copper foil layer is 5 μm, the unit area weight of the carrier copper foil can be 48 g / m 2 Up to 54g / m 2 range; of course, in other embodiments of the present disclosure, the unit area weight of the carrier copper foil can also be other suitable values. Exemplarily, the roughness of the copper foil layer on the side close to the carrier layer is less than 2μm, and the roughness of the copper foil layer on the side away from the carrier layer is also less than 2μm, the thickness of the carrier layer is 18μm, and the peel strength of the peeling layer at room temperature is not less than 3g / cm, and not more than 30g / cm. The carrier copper foil has the characteristics of ultra-thinness, low roughness, high peel strength and good etching properties, and is suitable for other suitable application scenarios such as high-frequency and high-speed copper clad laminates, flexible printed circuit boards, and high-density interconnect technology boards.

[0095] Figure 5 The schematic diagram of the structure of a first brush plating assembly in the embodiment of the present disclosure is schematically shown, and the first brush plating assembly may include a carrier layer 13, a first guide roller 271, a first sponge roller 2711, a first brush plating solution 2712 and a first treatment tank 2601. The first sponge roller is partially disposed in the first brush plating solution and partially located above the liquid level of the first brush plating solution. The first sponge roller located above the liquid level of the first brush plating solution contacts the carrier layer. When the carrier layer is transferred along with the first guide roller, the carrier layer contacts the first sponge roller, and the first sponge roller applies the first brush plating solution to the carrier layer. The first brush plating solution may be a phosphating salt solution.

[0096] Figure 6 The cross-sectional schematic diagram of a second brush plating assembly in an embodiment of the present disclosure is schematically shown. The first brush plating assembly may include a carrier layer 13, a brush plating electrode 2713, a second brush plating solution 2715, and a third treatment tank 2603. The brush plating electrode is located on a side of the third treatment tank close to the carrier layer. The second brush plating solution continuously overflows from one side of the brush plating electrode. During the transfer process of the carrier layer, the brush plating electrode is positively charged to brush plate the metal ions in the second brush plating solution onto the surface of the carrier layer. The second brush plating solution may be a phosphating metal solution. Figure 7 The schematic diagram of the structure of the second brush plating assembly is shown schematically. The second brush plating assembly also includes an overflow brush plating area 2714, which can be used to accommodate the phosphating metal solution.

[0097] Figure 8 A cross-sectional schematic diagram of another second brush plating component in an embodiment of the present disclosure is schematically shown. The first brush plating component may include a carrier layer 13, a brush plating electrode 2713, a second brush plating solution 2715, a second sponge roller 2111 and a third treatment tank 2603. The brush plating electrode is located on the side of the third treatment tank close to the carrier layer, and the second brush plating solution continuously overflows from one side of the brush plating electrode. The second sponge roller is arranged on the side of the brush plating electrode close to the carrier layer, and one side of the second sponge roller is located in the second brush plating solution, and the other side is in contact with the carrier layer. During the transfer process of the carrier layer, the brush plating electrode is positively charged, and the metal ions in the second brush plating solution are brush plated onto the surface of the carrier layer through the second sponge roller to generate a peeling layer.

[0098] The present disclosure also provides a method for preparing an integrated carrier copper foil. Fig. 9 As shown, the integrated copper foil preparation method specifically includes the following steps:

[0099] Step S910, performing surface treatment on the raw foil surface of the electrolysis device to obtain the raw foil surface with preset copper foil metallographic structure parameters.

[0100] Step S920: preparing a carrier layer based on the raw foil surface of the electrolysis device.

[0101] Step S930: After the carrier layer is generated, a surface anti-oxidation treatment is performed within a preset time.

[0102] Step S940, brush plating the carrier layer after the surface anti-oxidation treatment to prepare a peeling layer on a preset surface of the carrier layer.

[0103] Step S950, performing an electroplating treatment on the foil after the brush plating treatment to prepare a copper foil layer on the side of the stripping layer away from the carrier layer to obtain a carrier copper foil.

[0104] Among them, the raw foil surface can represent the surface of the titanium cathode roller in the electrolysis device, which can be made of titanium material and is used to provide an adhesion surface for metal ions on the cathode by electrolysis or other chemical deposition methods. The preset parameters can be preset roughness, cleanliness, crystallinity, etc. The copper foil metallographic structure parameters can represent a series of parameters describing the internal microstructure and organizational characteristics of the copper foil, such as grain shape and size, dislocation density, porosity, etc. By obtaining the raw foil surface with preset copper foil metallographic structure parameters, the copper foil layer generated subsequently can meet the performance requirements thereof. In addition, after the carrier copper foil is generated, the carrier copper foil can also be rolled up.

[0105] For example, the surface of the raw foil of the electrolysis device is treated by cleaning the cathode roller surface with deionized water, diluted acid or alkaline solution to remove grease, dust and other contaminants. The cathode roller surface can also be ground and polished with abrasives (such as sandpaper, polishing paste), polishing machines, etc. to obtain a preset roughness.

[0106] In some embodiments, the preparation speed of the electrolytic device is between 0.6 meters per minute and 5 meters per minute. By controlling the preparation speed of the electrolytic device, the processing effect in the subsequent peeling layer generation and copper foil layer generation process can be guaranteed, and the quality of the foil can be improved.

[0107] In some embodiments, the peeling layer is a phosphide layer, which helps to reduce the adhesion between the copper foil layer and the carrier layer during the subsequent peeling process, thereby achieving smooth peeling of the copper foil layer, improving the corrosion resistance of the foil, and extending the service life of the foil.

[0108] In some embodiments, the preparation process of the above-mentioned peeling layer includes: performing a first brush plating on a preset surface of the carrier layer using a phosphating salt to generate a phosphating film; and performing a second brush plating on the phosphating film using a phosphating metal to obtain the peeling layer.

[0109] It should be understood that the present disclosure does not limit its application to the detailed structure and arrangement of the components proposed in the present disclosure. The present disclosure can have other embodiments and can be implemented and executed in a variety of ways. The aforementioned variations and modifications fall within the scope of the present disclosure. It should be understood that the present disclosure and the limited present disclosure extend to all alternative combinations of two or more individual features mentioned or evident in the text and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present disclosure. The embodiments described in the present disclosure illustrate the best modes known for implementing the present disclosure and will enable those skilled in the art to utilize the present disclosure.

Claims

1. A carrier copper foil production device, characterized in that: include: A peeling layer generating device, used for preparing a peeling layer on a preset surface of a carrier layer generated by an electrolysis device; The stripping layer generating device includes a first brush plating component and a second brush plating component. The first brush plating component coats the carrier layer generated by the electrolytic device to perform a first brush plating treatment. The second brush plating component is located on the rear side of the first brush plating component. The second brush plating component is used for a second brush plating treatment to brush-plate the metal ions in the second brush plating solution onto the surface of the carrier layer to generate a stripping layer.

2. The carrier copper foil production equipment according to claim 1, characterized in that: The first brush plating component is used to perform a first brush plating on a preset surface of the carrier layer using a phosphating salt to form a phosphating film.

3. The carrier copper foil production equipment according to claim 1, characterized in that: The second brush plating assembly is used to perform a second brush plating on the phosphating film using a phosphating metal to obtain the stripping layer.

4. The carrier copper foil production equipment according to claim 1, characterized in that: The brush plating method of the first brush plating component and the second brush plating component is pulse brush plating, and the pulse of the pulse brush plating is any one or a combination of positive pulses or negative pulses.

5. The carrier copper foil production equipment according to claim 1, characterized in that: The first brush plating assembly includes a first brush plating solution and a first processing tank. The first brush plating solution is located in the first processing tank. The first brush plating solution is coated on the carrier layer to form a phosphating film.

6. The carrier copper foil production equipment according to claim 1, characterized in that: The second brush plating assembly includes a brush plating electrode, a second brush plating solution and a third treatment tank. The brush plating electrode is located in the third treatment tank on one side close to the carrier layer to brush plate the metal ions in the second brush plating solution onto the surface of the carrier layer.

7. The carrier copper foil production equipment according to any one of claims 1 to 6, characterized in that: In the peeling layer generating device, Apply the brush plating solution to the carrier layer with a sponge roller, or, The brush plating solution is applied to the carrier layer in an overflow manner.

8. A method for preparing an integrated carrier copper foil, characterized in that: Includes steps: preparing a carrier layer using an electrolytic device; delivering the carrier layer to a peeling layer generating step within a predetermined time; performing a brush plating process on the carrier layer to prepare a release layer on a predetermined surface of the carrier layer; The foil material after the brush plating treatment is subjected to an electroplating treatment to prepare a copper foil layer on the side of the stripping layer away from the carrier layer, thereby obtaining a carrier copper foil.

9. The method for preparing a carrier copper foil according to claim 8, characterized in that: The conveying speed of the foil material by the roller group is consistent with the carrier layer generating speed of the electrolysis device.

10. The method for preparing a carrier copper foil according to claim 8, characterized in that: The predetermined time is less than or equal to 20 minutes; or, The production line distance between the discharge port of the electrolysis device and the feed port of the stripping layer generating device does not exceed 3 meters.

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