Electroplating hanger, electroplating equipment and electroplating method

Abstract

The invention discloses an electroplating hanger, electroplating equipment and an electroplating method. The electroplating hanger comprises a mounting platform and a plurality of electroplating carriers mounted on the mounting platform, the electroplating carriers are suspended on the mounting platform, the adjacent electroplating carriers are arranged at intervals, and the two adjacent electroplating carriers are parallel and aligned; the electroplating carrier comprises a bearing main body, a plated part fixing device and a plated part conductive device, and the bearing main body is provided with a containing groove used for containing a plated part in the thickness direction of the bearing main body; the plated part fixing device is used for fixing the plated part accommodated in the accommodating groove; the plated part conductive device is used for being electrically connected with the plated part contained in the containing groove. According to the electroplating carrier, the plated part is loaded from the side opening of the accommodating groove, the whole plated part is put into the accommodating groove, and almost no friction exists between the plated part and the accommodating groove, so that the problem of friction damage of the plated part caused by loading the plated part from the upper end opening of the electroplating carrier can be effectively avoided.

Description

Technical Field

[0001] The invention relates to the technical field of mask electroplating, and in particular to an electroplating rack, electroplating equipment and an electroplating method. Background Art

[0002] The following process method can be used to electroplate grid lines on photovoltaic cells. First, the photovoltaic cell is placed in a plating carrier, and then the plating carrier is placed in a plating solution. Then, the plating carrier and the anode in the plating solution are energized. Under the action of the electric field, the metal cations in the plating solution are deposited on the plated area on the photovoltaic cell to form grid lines.

[0003] The existing electroplating carrier is generally open at the top, and the photovoltaic cell is inserted into the receiving groove of the electroplating carrier from the top opening of the electroplating carrier by a robot or manually. In order to prevent the photovoltaic cell from shaking and causing fragments after being inserted into the electroplating carrier, the width of the top opening of the electroplating carrier and the receiving groove of the electroplating carrier for receiving the photovoltaic cell are relatively small. During the process of inserting the photovoltaic cell into the receiving groove of the electroplating carrier, it is easy for the photovoltaic cell to rub against the edge of the receiving groove, thereby damaging the photovoltaic cell. In addition, after aligning the photovoltaic cell with the top opening of the electroplating carrier and then inserting it into the receiving groove, it is easy to damage the photovoltaic cell due to inaccurate alignment. Furthermore, if a robot is used to insert the photovoltaic cell from the top opening of the electroplating carrier into the receiving groove of the electroplating carrier, the accuracy requirements of the robot are very high, which leads to high difficulty in debugging the movement and relative position of the carrier by the robot.

[0004] In order to improve the efficiency of electroplating, multiple electroplating carriers can be integrated on one electroplating rack, and the photovoltaic cells in multiple electroplating carriers on the same electroplating rack can be electroplated simultaneously, which can improve the efficiency of electroplating. However, new technical problems arise, such as how to efficiently load and unload multiple electroplating carriers on the same electroplating rack, how to uniformly electroplate the cells in multiple electroplating carriers on the same electroplating rack, and how to avoid or eliminate the parts connected to the plated parts from being electroplated. Summary of the invention

[0005] The purpose of the present invention is to provide an electroplating rack, an electroplating device and an electroplating method to solve one of the technical problems mentioned in the background technology.

[0006] In order to achieve the above-mentioned purpose, the technical solutions provided in the embodiments of the present invention are as follows.

[0007] In a first aspect, an embodiment of the present invention provides an electroplating rack, comprising a mounting platform and a plurality of electroplating carriers mounted on the mounting platform;

[0008] The electroplating carriers are suspended on the mounting platform, adjacent electroplating carriers are spaced apart, and two adjacent electroplating carriers are parallel and aligned;

[0009] The electroplating carrier comprises a bearing body, a plated piece fixing device and a plated piece conducting device, and the bearing body is provided with a receiving groove for receiving the plated piece along its thickness direction;

[0010] The plated object fixing device is used to fix the plated object contained in the containing tank;

[0011] The plated object conductive device is used for electrically connecting the plated object accommodated in the accommodating groove.

[0012] In some embodiments, an opening and closing component is provided on the supporting body, and when the opening and closing component is opened, the notch of the accommodating slot is exposed so that the plated object can enter and exit the accommodating slot, and when the opening and closing component is closed, the plated object can be fixed in the accommodating slot; the opening and closing component is formed as a device for fixing the plated object.

[0013] In some embodiments, a first support member is fixedly disposed in the receiving groove; the opening and closing assembly includes a first rotating shaft rotatably connected to the bearing body, and a second support member is fixedly disposed on the first rotating shaft; when the opening and closing assembly is opened, the second support member is located outside the receiving groove, and when the opening and closing assembly is closed, the protruding end of the second support member is located in the receiving groove; in the working state, when the opening and closing assembly is closed, the first support member and the second support member can respectively abut against two sides of the plated member to fix the plated member;

[0014] Alternatively, the opening and closing assembly includes a first rotating shaft rotatably connected to a carrying body, and a second support member is fixedly arranged on the first rotating shaft; when the opening and closing assembly is opened, the second support member is located outside the accommodating groove, and when the opening and closing assembly is closed, the protruding end of the second support member is located in the accommodating groove; in a working state, when the opening and closing assembly is closed, the second support member presses the plated member against the bottom wall of the accommodating groove to fix the plated member.

[0015] In some embodiments, a first mounting member extending away from the inner wall is provided on the inner wall of the accommodating groove, and the first support member is fixedly provided on the first mounting member; and / or a second mounting member is fixedly provided on the first rotating shaft, the second mounting member is provided along the radial direction of the first rotating shaft and extends in a direction away from the first rotating shaft, and a second support member is fixedly provided on the second mounting member.

[0016] In some embodiments, a first mounting member extending away from the inner wall is provided on the inner wall of the accommodating groove, and a plurality of the first support members are fixedly provided on the first mounting member; a second mounting member is fixedly provided on the first rotating shaft, and the second mounting member is provided along the radial direction of the first rotating shaft and extends in the direction away from the first rotating shaft, and a plurality of second support members are fixedly provided on the second mounting member; the number of the first support members and the second support members are equal and are arranged one-to-one; when the opening and closing assembly is closed, the support point or support surface of each second support member and the corresponding support point or support surface of the first support member are arranged to abut against each other or to be spaced apart by a preset gap, and the width of the preset gap is less than or equal to the thickness of the plated part.

[0017] In some embodiments, a supporting point or a supporting surface of the first supporting member is made of a flexible material; and / or a supporting point or a supporting surface of the second supporting member is made of a flexible material.

[0018] In some embodiments, a first shielding component is provided on the carrier body for shielding the edge of the first surface of the plated object during the electroplating process; and / or the opening and closing assembly includes a first rotating shaft rotatably connected to the carrier body, and a second shielding component is provided on the first rotating shaft for shielding the edge of the second surface of the plated object during the electroplating process.

[0019] In some embodiments, a first mounting member extending away from the inner wall is provided on the inner wall of the accommodating groove, the first support member is fixedly provided on the first mounting member, and the first mounting member is formed as a first shielding member; and / or a second mounting member is fixedly provided on the first rotating shaft, the second mounting member is provided along the radial direction of the first rotating shaft and extends in a direction away from the first rotating shaft, a second support member is fixedly provided on the second mounting member, and the second mounting member is formed as a second shielding member.

[0020] In some embodiments, the receiving groove is a through hole that penetrates the supporting body along the thickness direction of the supporting body, and a first shielding component is provided on at least a portion of the edge of the first opening of the receiving groove extending into the receiving groove to shield at least a portion of the edge of the first surface of the plated component during the electroplating process; and / or, the opening and closing assembly includes a first rotating shaft rotatably connected to the supporting body, and a second shielding component is provided on the first rotating shaft, and the second shielding component can shield at least a portion of the edge of the second opening of the receiving groove after rotation, so as to shield at least a portion of the edge of the second surface of the plated component during the electroplating process.

[0021] In some embodiments, when the electroplating carrier is moved along a direction or the electroplating liquid flows along a direction; the first shielding component is a shielding plate, and the shielding plate is at least arranged on two edges of the first opening distributed along the direction; the second shielding component is a second mounting member fixedly arranged on the first rotating shaft, and two first rotating shafts are arranged at intervals on two borders distributed along the direction of the supporting body, and the corresponding second mounting member can shield the two edges of the second opening distributed along the direction through the rotation of the two first rotating shafts.

[0022] In some embodiments, a first conductive block is provided on the side of the upper frame of the carrier body facing the entrance direction of the accommodating groove; a conductive clip is provided on the upper frame of the carrier body, and the conductive clip can connect the conductive lead on the plated object to the first conductive block; the conductive clip is formed as a conductive device of the plated object.

[0023] In some embodiments, the conductive clip includes a support, a second rotating shaft, an operating component and a clamping component, the support is fixedly disposed on the upper frame, the second rotating shaft is rotatably disposed on the support, and the operating component and the clamping component are both fixedly connected to the second rotating shaft, so that the operating component, the clamping component and the second rotating shaft can rotate synchronously; when in use, the operating component is rotated to drive the clamping component to abut the conductive lead against the first conductive block.

[0024] In some embodiments, the conductive clip further includes a torsion spring, which is sleeved on the second rotating shaft, one torque arm of the torsion spring is fixedly connected to the support, and the other torque arm of the torsion spring is fixedly connected to any one of the second rotating shaft, the operating part and the clamping part; the torsion spring can force the clamping part to approach or move away from the first conductive block.

[0025] In some embodiments, the clamping component includes a rotating connector rotatably connected to the second rotating shaft, an abutment connector connected to the rotating connector, the abutment connector is connected to the rotating connector via a connecting pin, and a second conductive block is symmetrically arranged on the abutment connector with the connecting pin as the symmetry axis.

[0026] In some embodiments, the electroplating rack includes any one of the following structures or a combination thereof:

[0027] (a) a guide surface is provided on the lower side wall of the receiving groove, and the guide surface is a chamfer on the lower side wall of the receiving groove;

[0028] (b) a guide hole is provided on the lower side wall of the receiving groove, and the guide hole passes through the lower frame of the bearing body in the up-down direction, or the lower frame of the bearing body is a hollow structure;

[0029] (c) a liquid-repellent coating is provided on the surface of the carrier body;

[0030] (d) A mounting protrusion is provided on the lower side wall of the accommodating groove, and a slot extending along the direction is provided on the mounting protrusion, and the mounting protrusion is formed as a fixing device for the plated part.

[0031] In some embodiments, a conductive clamping mechanism is disposed above the carrier body, the conductive clamping mechanism includes a first clamping portion and a second clamping portion, at least one of the first clamping portion and the second clamping portion is a conductive clamping portion, and a conductive contact and a first sealing member surrounding the conductive contact are disposed on the clamping end of the conductive clamping portion;

[0032] In the working state, the clamping end of the first clamping part and the clamping end of the second clamping part respectively abut against two sides of the plated workpiece to clamp the plated workpiece; the first sealing member arranged outside the conductive contact abuts against one side of the plated workpiece to form a sealed space, and the conductive contact abuts against the conductive point of the plated workpiece;

[0033] The conductive clamping mechanism is formed as a conductive device for the plated part.

[0034] In some embodiments, the conductive contact is a retractable structure.

[0035] In some embodiments, the conductive clamping portion includes a clamping seat, a first countersunk hole is provided on the top of the clamping seat, a first mounting hole is provided on a side wall of the clamping seat facing the plated workpiece, the conductive contact is provided in the first mounting hole and partially extends out of the first mounting hole, the first countersunk hole is connected to the first mounting hole, a conductive connecting member is provided in the first countersunk hole, and one end of the conductive connecting member is mechanically and electrically connected to the conductive contact.

[0036] In some embodiments, the conductive contact includes a mounting seat and a telescopic member, the mounting seat is provided with a second mounting hole, a compressible medium or an elastic member is provided in the second mounting hole, one end of the telescopic member is provided in the second mounting hole and abuts against the compressible medium or the elastic member, and the other end of the telescopic member extends out of the second mounting hole; the telescopic member is slidably connected to the second mounting hole, and the telescopic member is electrically connected to the mounting seat.

[0037] In some embodiments, when the first clamping portion or the second clamping portion is an insulating clamping portion, an elastic abutment member is protruding from the clamping end of the insulating clamping portion.

[0038] In some embodiments, the electroplating carrier includes an opening and closing assembly and a conductive clip;

[0039] The mounting platform is provided with a first switch mechanism and a second switch mechanism, wherein the first switch mechanism enables the opening and closing components on all electroplating carriers to switch synchronously between an open state and a closed state, and the second switch mechanism enables the conductive clips on all electroplating carriers to switch synchronously between an open state and a closed state.

[0040] In some embodiments, the opening and closing assembly includes a first rotating shaft rotatably connected to the carrying body, and the first switch mechanism can drive the first rotating shaft to rotate so that the opening and closing assembly switches between an open state and a closed state.

[0041] In some embodiments, the first switch mechanism includes a first driving device and a first slide plate, the driving end of the first driving device is connected to the first slide plate, the first slide plate is provided with a first slot, the upper end of the first rotating shaft is fixedly connected to the first end of the swing rod, and the first slot is engaged with the second end of the swing rod;

[0042] When the first driving device drives the first slide plate to reciprocate, the first clamping groove can drive the swing rod to rotate, so that the swing rod drives the first rotating shaft to rotate, thereby opening or closing the opening and closing assembly;

[0043] The first switch mechanism further includes a first elastic member, the middle portion of the swing rod is connected to one end of the first elastic member, and the other end of the first elastic member is fixedly connected to the mounting platform, so that during the reciprocating movement of the first slide plate, the second end of the swing rod always abuts against the notch of the first slot;

[0044] The first switch mechanism also includes two first guide pulley groups, each of which includes a plurality of first guide pulleys, and the first guide pulleys belonging to the two first guide pulley groups respectively abut against two side surfaces of the first slide, so that the first slide can slide in a sliding area formed between the two first guide pulley groups; or, the first switch mechanism also includes a first slide rail, and the first slide is slidably connected to the mounting platform via the first slide rail.

[0045] In some embodiments, the conductive clip includes an operating component that controls the conductive clip to open or close itself;

[0046] The second switch mechanism comprises a second driving device and a second slide plate, the driving end of the second driving device is connected to the second slide plate, the second slide plate is provided with a second slot, and the second slot is sleeved on the operating component;

[0047] When the second driving device drives the second slide plate to move back and forth, the second clamping groove can drive the operating component to rotate, so as to close or open the conductive clip;

[0048] The second switch mechanism also includes two second guide pulley groups, each of which includes multiple second guide pulleys, and the second guide pulleys belonging to the two second guide pulley groups respectively abut against two side surfaces of the second slide, so that the second slide can slide in the sliding area formed between the two second guide pulley groups.

[0049] In some embodiments, the conductive clip includes an operating component that controls the conductive clip to open or close itself;

[0050] The second switch mechanism comprises a second driving device and a second slide plate, the driving end of the second driving device is connected to the second slide plate, the second slide plate is provided with a second slot, and the second slot is sleeved on the operating component;

[0051] When the second driving device drives the second slide plate to move back and forth, the second clamping groove can drive the operating component to rotate, so as to close or open the conductive clip;

[0052] The second slide plate is stacked on the first slide plate, the first slide plate is provided with a first avoidance hole for the avoidance operating component, and the mounting platform is provided with a second avoidance hole for the avoidance operating component.

[0053] In a second aspect, an embodiment of the present invention further provides an electroplating device, comprising an electroplating tank and the aforementioned electroplating rack, wherein a plurality of anode members parallel to each other are vertically arranged at intervals in the electroplating tank, and an anode interval is formed between two adjacent anode members;

[0054] The electroplating rack is arranged on or above the electroplating tank, and the electroplating carriers are inserted into the anode intervals in a one-to-one correspondence.

[0055] In a third aspect, an embodiment of the present invention further provides an electroplating method, comprising the following steps:

[0056] Provide an electroplating rack, on which a plurality of electroplating carriers are arranged in parallel and at intervals, and a receiving slot for receiving a plated object is arranged on the electroplating carrier, and an inlet and outlet of the receiving slot are opened on a side of the electroplating carrier so that the inlet and outlet of the receiving slot face an adjacent electroplating carrier;

[0057] Put the plated object into the receiving tank from the inlet and outlet of the receiving tank and fix it in the receiving tank;

[0058] Providing an electroplating tank, in which a plurality of anode members are arranged at intervals so that an anode interval is formed between two adjacent anode members;

[0059] Placing the electroplating carrier carrying the workpiece to be plated into the anode compartment to electroplate the workpiece;

[0060] After the electroplating is completed, the electroplating carrier carrying the plated parts is taken out from the anode interval, and the plated parts are taken out from the inlet and outlet of the containing tank.

[0061] In some embodiments, an opening and closing assembly is disposed near the inlet and outlet of the receiving slot, so that when the opening and closing assembly is closed, the inlet and outlet of the receiving slot are partially blocked, and when the opening and closing assembly is opened, the inlet and outlet of the receiving slot are exposed;

[0062] After the opening and closing assembly is opened, the plated object is placed into the receiving tank from the inlet and outlet of the receiving tank and fixed in the receiving tank, and then the opening and closing assembly is closed.

[0063] In some embodiments, a first rotating shaft is rotatably arranged at the edge of the receiving groove, and a second supporting member is fixedly arranged on the first rotating shaft, and the second supporting member is rotated into the receiving groove to abut against the plated member in the receiving groove, so as to fix the plated member in the receiving groove;

[0064] A conductive clip is provided on each electroplating carrier, and a conductive lead on a plated object is conductively clamped by the conductive clip; wherein the conductive clip includes an operating component for controlling its own opening or closing;

[0065] Providing a first switch mechanism, connecting the first switch mechanism to all the first rotating shafts, and driving all the first rotating shafts to rotate through the first switch mechanism, so that the opening and closing assembly switches between an open state and a closed state;

[0066] A second switch mechanism is provided, and the second switch mechanism is connected to all the conductive clips. All the operating components are driven to rotate by the second switch mechanism, so that the conductive clips are switched between an open state and a closed state.

[0067] In some embodiments, a conductive clamping mechanism is provided, which includes a first clamping portion and a second clamping portion, at least one of the first clamping portion and the second clamping portion is a conductive clamping portion, and a conductive contact and a first sealing member surrounding the conductive contact are provided on the clamping end of the conductive clamping portion; the clamping end of the first clamping portion and the clamping end of the second clamping portion respectively abut against two sides of the workpiece to be plated to clamp the workpiece to be plated; the first sealing member surrounding the conductive contact abuts against one side of the workpiece to be plated to form a sealed space, and the conductive contact abuts against the conductive point of the workpiece to be plated.

[0068] In some embodiments, a loading and adsorption device is provided, which includes a plurality of suction cups arranged at intervals and parallel to each other; a plurality of workpieces to be plated are placed in a basket at intervals, so that a plurality of suction cups are inserted into the basket to adsorb the corresponding plurality of workpieces to be plated; the plurality of suction cups for adsorbing the workpieces to be plated are inserted one-to-one into the intervals of a plurality of electroplating carriers; and the plurality of suction cups respectively place the adsorbed workpieces to be plated into a plurality of receiving slots one-to-one.

[0069] In some embodiments, the anode gap is configured to extend along a preset direction; after placing a plating carrier carrying a plated object into the anode gap, the plating carrier is moved along the preset direction and / or the plating solution is made to flow along the preset direction.

[0070] In some embodiments, the conductive lead is connected to the plated object by bonding; after the electroplating is completed, the conductive lead on the plated object is torn off.

[0071] Due to the application of the above technical solution, some embodiments of the present invention have the following advantages compared with the prior art:

[0072] The electroplating hanger includes a plurality of electroplating carriers, which are suspended on a mounting platform and spaced apart from each other; through the spacing between adjacent electroplating carriers, multiple electroplating carriers can be loaded and unloaded simultaneously. The plated part contained in the containing tank is fixed by a plated part fixing device, so that the plated part can be fixed in the containing tank, thereby avoiding relative shaking between the plated part and the electroplating carrier during the electroplating process, which affects the uniformity of electroplating or even damages the plated part. The plated part contained in the containing tank is electrically connected by a plated part conductive device, so that the plated part can be conductively conducted, thereby improving the convenience of conductive conduction of the plated part.

[0073] The electroplating carrier includes a supporting body, and the supporting body has a receiving groove along the thickness direction thereof. In this scheme of loading the plated part from the side opening of the receiving groove, the plated part can be placed in the receiving groove as a whole, and there is almost no friction between the plated part and the receiving groove, which can effectively avoid the problem of friction damage to the plated part caused by loading the plated part from the upper end opening of the electroplating carrier. The plated part can be effectively fixed in the receiving groove through the slot on the opening and closing component and / or the mounting protrusion, avoiding relative shaking between the plated part and the electroplating carrier during the electroplating process, which affects the uniformity of the electroplating and even damages the plated part.

[0074] The first switch mechanism can synchronously open or close all the opening and closing components, so that multiple plated parts can quickly or synchronously enter and exit the receiving tank, improving the efficiency of loading and unloading multiple (batch) plated parts in and out of the receiving tank. The second switch mechanism can synchronously open or close all the conductive clamps, so that multiple conductive leads can be quickly or synchronously clamped, and then multiple conductive leads can be quickly or synchronously connected to the electroplating power supply, improving the wiring efficiency of multiple (batch) plated parts.

[0075] The conductive lead is connected to the plated workpiece by bonding. After the electroplating is completed, the plated conductive lead on the plated workpiece is torn off and recycled as a loss part. This avoids the problem of the electroplating carrier or the conductive clip being electroplated, and there is no need to regularly de-plate the electroplating carrier or the conductive clip.

[0076] A conductive clamping mechanism is provided, and the conductive clamping mechanism includes a first clamping part and a second clamping part, and at least one of the first clamping part and the second clamping part is a conductive clamping part, and a conductive contact and a first sealing member surrounding the conductive contact are provided on the clamping end of the conductive clamping part; the clamping end of the first clamping part and the clamping end of the second clamping part respectively abut against two sides of the plated part to clamp the plated part; so that the first sealing member surrounding the conductive contact abuts against one side of the plated part to form a sealed space, and the conductive contact abuts against the conductive point of the plated part. The conductive contact is sealed in the sealed space, and the sealed space can isolate the electroplating liquid, so as to prevent the electroplating liquid from entering the sealed space to electroplate the conductive contact and the conductive point of the plated part, so that the conductive contact can be prevented from being electroplated during the electroplating process of the plated part, and the conductive contact and the plated part will not be adhered due to electroplating, and thus the plated part will not be damaged. In addition, there is no need to de-plate the conductive contact, which saves the de-plating time and improves the electroplating efficiency of the electroplating equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Attached Figure 1 It is a schematic diagram of the structure of the electroplating carrier in Example 1 when no plated parts are loaded and the opening and closing components are opened;

[0078] Attached Figure 2 The structure of the electroplating carrier in Example 1 is shown in the state where the plating parts are loaded and the opening and closing components are opened. Figure 1 ;

[0079] Attached Figure 3 The structure of the electroplating carrier in Example 1 is shown in the state where the plating parts are loaded and the opening and closing components are opened. Figure 2 ;

[0080] Attached Figure 4 is a schematic diagram of the structure of the conductive clip in Example 1;

[0081] Attached Figure 5 Schematic diagrams of four matching structures of the first mounting member and the second mounting member in Example 1;

[0082] Attached Figure 6 Schematic diagram of the matching structure of the first shielding component and the second shielding component in Example 1;

[0083] Attached Figure 7 It is a schematic diagram of the structure of four conductive leads in Example 1;

[0084] Attached Figure 8 It is a schematic diagram of the planar structure of the electroplating carrier in Example 1 when the plated object has been loaded and the opening and closing components are opened;

[0085] Attached Fig. 9 It is a schematic diagram of the planar structure of the electroplating carrier in Example 1 when no plated parts are loaded and the opening and closing components are opened (including the shielding plate of the first structure);

[0086] Attached Fig.10 It is a schematic diagram of the planar structure of the electroplating carrier in Example 1 when no plated parts are loaded and the opening and closing components are opened (including the shielding plate of the second structure);

[0087] Attached Fig.11 It is a schematic diagram of the planar structure (including the bottom wall) of the electroplating carrier in Example 1 when no plated parts are loaded and the opening and closing components are opened;

[0088] Attached Fig.12 It is a schematic diagram of the structure of the electroplating carrier in Example 1 when no plated parts are loaded and the opening and closing components are in a closed state;

[0089] Attached Fig.13 It is a structural schematic diagram of the electroplating carrier loaded with the plated object located at the first preset position in Example 2;

[0090] Attached Fig.14 It is a structural schematic diagram of the electroplating carrier loaded with the plated object located at the second preset position in Example 2;

[0091] Attached Fig.15 It is a schematic structural diagram of the electroplating carrier with the avoidance gap in Example 2;

[0092] Attached Fig.16 is a schematic diagram of the first conductive clamping mechanism structure in Example 2;

[0093] Attached Fig.17 It is a structural schematic diagram of the clamping seat in Example 2;

[0094] Attached Fig.18 is a schematic structural diagram of a conductive contact in Example 2;

[0095] Attached Fig.19 is a schematic structural diagram of a second conductive clamping mechanism in Example 2;

[0096] Attached Fig. 20 It is a structural schematic diagram of multiple conductive clamping mechanisms installed on a mounting platform in Example 2;

[0097] Attached Fig.21 It is a schematic structural diagram of the electroplating carrier with a conductive clamping mechanism in Example 2;

[0098] Attached Fig. 22 It is a schematic structural diagram of the electroplating carrier with a conductive clamping mechanism in Example 3;

[0099] Attached Fig.23 This is a schematic diagram of the structure of the electroplating rack in Example 4 in an open state;

[0100] Attached Fig.24 This is a schematic diagram of the structure of the electroplating rack in Example 4 in a closed state;

[0101] Attached Fig.25 Schematic diagram of a top view of the electroplating equipment (partial structure) in Example 6;

[0102] Attached Fig.26 Schematic diagram of top view of the feeding adsorption device (without adsorption of the plated part) in Example 6;

[0103] Attached Fig. 27 Schematic diagram of a top view of the feeding adsorption device (the plated part has been adsorbed) in Example 6;

[0104] Attached Fig.28 It is a top view schematic diagram of the material feeding adsorption device and the electroplating rack in the coordinated state in Example 6;

[0105] The meanings of the reference numerals are as follows:

[0106] Plated object 1, conductive lead 2, conductor layer 21, conductive adhesive layer 22, first coating layer 23, second coating layer 24;

[0107] The electroplating carrier 100, the carrying body 110, the shielding plate 120, the containing groove 110a, the rotating shaft installation groove 110b, the supporting platform 111, the guide surface 112, the first supporting member 113, the first installing member 114, the bottom wall 115, the opening and closing assembly 130, the second installing member 131, the first rotating shaft 132, the second supporting member 133, the conductive clip 140, the support 141, the second rotating shaft 142, the operating member 143, the clamping member 144, the rotating connecting member 1441, the abutting connecting member 1442, the connecting pin 1443, the second conductive block 1444, the torsion spring 145, the first conductive block 150, and the swing rod 160;

[0108] The mounting platform 210, the first guide pulley 211, the first elastic member 212, the mounting block 213, the extension member 214, the rotating wheel 215, the hub slot 215a, the first slide plate 220, the first avoidance hole 220a, the first slot 220b, the second guide pulley 221, the second elastic member 222, the second slide plate 230, the second slot 230a, the third elastic member 232, the third driving device 241, the linkage rod 242, and the shifting rod 243;

[0109] Electroplating tank 300, tank edge 310, electroplating guide rail 320, anode member 330;

[0110] Conductive clamping mechanism 400, conductive connecting member 411, clamping seat 412, first countersunk hole 412a, first mounting hole 412b, fourth mounting hole 412c, conductive contact 413, first shaft section 41311, second shaft section 41312, third shaft section 41313, second mounting hole 4131a, third mounting hole 4131b, telescopic member 4132, first sealing member 414, second sealing member 415, insulating clamping portion 420, annular groove 420a, elastic abutting member 421, mounting platform 500;

[0111] Suction cup 610 , suction cup mounting platform 620 , support arm 630 . DETAILED DESCRIPTION

[0112] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. The following embodiments are not just one embodiment, but a collection of embodiments with similar schemes or features.

[0113] Example 1

[0114] A plating rack includes a mounting platform 210 and a plurality of plating carriers 100 mounted on the mounting platform 210; the plating carriers 100 are suspended on the mounting platform 210, adjacent plating carriers 100 are spaced apart, and two adjacent plating carriers 100 are parallel and aligned; the plating carrier 100 includes a bearing body 110, a plated piece fixing device and a plated piece conductive device, the bearing body 110 is provided with a receiving groove 110a for accommodating the plated piece 1 along its thickness direction; the plated piece fixing device is used to fix the plated piece 1 accommodated in the receiving groove 110a; the plated piece conductive device is used to electrically connect the plated piece 1 accommodated in the receiving groove 110a.

[0115] It should be noted that the electroplating carrier 100 is a flat plate structure, and two adjacent electroplating carriers 100 are parallel, which means that the plate surfaces of the two adjacent electroplating carriers 100 are parallel, not the sides are parallel. Two adjacent electroplating carriers 100 are aligned, which means that reference points are set on the electroplating carrier 100, and the line connecting the reference points on the two adjacent electroplating carriers 100 is collinear with the straight line extending in the preset direction, for example, the line connecting the reference points on the two adjacent electroplating carriers 100 is collinear with the straight line extending in the X direction, and there can be multiple reference points on each electroplating carrier 100, for example, the three corners of the electroplating carrier 100 are used as reference points. Parallel and aligned settings can also be explained according to the terminology of the mechanical field, and the purpose is to facilitate the synchronous loading of multiple plated parts 1, so two adjacent electroplating carriers 100 or all electroplating carriers 100 need to maintain similar positional relationships and postures.

[0116] like Figure 1-4 as well as Figure 8-12 As shown, the electroplating carrier 100 includes a carrier body 110 and an opening and closing component 130. The carrier body 110 is provided with a receiving groove 110a along its thickness direction, and a first support member 113 is fixedly arranged in the receiving groove 110a. The opening and closing component 130 includes a first rotating shaft 132 rotatably connected to the carrier body 110, and a second support member 133 is fixedly arranged on the first rotating shaft 132. When the opening and closing component 130 is opened, the second support member 133 is located outside the receiving groove 110a, and when the opening and closing component 130 is closed, the protruding end of the second support member 133 is located in the receiving groove 110a. In the working state, when the opening and closing component 130 is closed, the first support member 113 and the second support member 133 can respectively abut against the two sides of the plated workpiece 1. It can be understood that the opening and closing component 130 is formed as a fixing device for the plated workpiece. The thickness direction of the carrier body 110 is defined as Figure 1 The X direction in .

[0117] The carrier body 110 is provided with a receiving groove 110a along its thickness direction, and an opening and closing assembly 130 is provided on one side of the carrier body 110 in the thickness direction. When the opening and closing assembly is opened, the plated object 1 is placed in the receiving groove 110a, and then the opening and closing assembly is closed, so that the plated object 1 is loaded into the receiving groove 110a. In this scheme of loading the plated object 1 from the side opening of the receiving groove 110a, the plated object 1 is put into the receiving groove 110a as a whole, and there is almost no friction between the plated object 1 and the receiving groove 110a, which can effectively avoid the problem of friction damage of the plated object 1 caused by loading the plated object 1 from the upper end opening of the electroplating carrier 100. The side opening of the receiving groove 110a is relatively large, and the allowed alignment error is relatively large during the process of loading the plated object 1, which can effectively reduce the alignment accuracy requirements of the plated object 1 and the side opening of the electroplating carrier 100, and can also reduce the risk of damaging the plated object 1 due to misalignment between the plated object 1 and the side opening of the electroplating carrier 100. When the opening and closing assembly is closed, the first support member 113 and the second support member 133 can respectively abut against the two sides of the plated object 1 and thus fix the plated object 1 on the electroplating carrier 100, which can prevent the plated object 1 and the electroplating carrier 100 from shaking relative to each other during the electroplating process, thereby damaging the plated object 1.

[0118] Specifically, the receiving groove 110a may be a through hole that penetrates the carrying body 110 along the thickness direction of the carrying body 110. Figure 1-3 as well as Figure 8-10 The receiving groove 110a may also be a countersunk hole opened on the carrying body 110 along the thickness direction of the carrying body 110, such as Fig.11As shown, the receiving tank 110a includes a bottom wall 115. When the receiving tank 110a is a through hole, the plated object 1 is placed in the receiving tank 110a, and the electroplating solution can enter the receiving tank 110a from the openings at both ends of the receiving tank 110a, and contact the two sides of the plated object 1 respectively, so that the metal ions in the electroplating solution can move from multiple directions to the vicinity of the plated object 1, thereby maintaining a stable metal ion concentration near the plated object 1, which is beneficial to improving the electroplating efficiency and electroplating uniformity. When the receiving tank 110a is a countersunk hole, the opening at one end of the receiving tank 110a is blocked by the bottom wall 115.

[0119] If the workpiece 1 needs to be double-sided electroplated and the receiving groove 110a is a through hole, the plating solution can enter the receiving groove 110a from the openings at both ends of the receiving groove 110a, and contact the two sides of the workpiece 1 respectively, so that the metal ions in the plating solution can move from multiple directions to the vicinity of the workpiece 1, thereby maintaining a stable metal ion concentration near the workpiece 1, which can improve the consistency of double-sided electroplating of the workpiece 1.

[0120] The size of the receiving groove 110a is adapted to the size of the plated object 1. Preferably, the plated object 1 is a thin sheet structure, and the plated object 1 can be received in the receiving groove 110a in a state perpendicular to the thickness direction of the supporting body 110. For example, if the plated object 1 is a 182-type photovoltaic cell sheet, the receiving groove 110a can be a rectangular opening with a side length of 184-192mm.

[0121] In some embodiments, a first mounting member 114 extending away from the inner wall is provided on the inner wall of the receiving groove 110a, and the first support member 113 is fixedly provided on the first mounting member 114. A second mounting member 131 is fixedly provided on the first rotating shaft 132, and the second mounting member 131 is extended in a radial direction of the first rotating shaft 132 and in a direction away from the first rotating shaft 132, and a second support member 133 is fixedly provided on the second mounting member 131.

[0122] Preferably, the number of the first support members 113 and the second support members 133 are equal and arranged in one-to-one correspondence. When the opening and closing assembly 130 is closed, the supporting point or supporting surface of each second support member 133 and the supporting point or supporting surface of the corresponding first support member 113 are arranged to abut against each other or to be spaced apart by a preset gap, and the width of the preset gap is less than or equal to the thickness of the plated object 1.

[0123] Specifically, a first support member 113 is fixedly disposed in the receiving groove 110a. A first mounting member 114 extending away from the inner wall is disposed on the inner wall of the receiving groove 110a, and the first support member 113 is fixedly disposed on the first mounting member 114, for example, the first support member 113 is welded or threadedly connected to the first mounting member 114, and the first support member 113 is disposed toward the entrance direction of the receiving groove 110a, and the entrance of the receiving groove 110a refers to the entrance and exit of the plated object 1. The first support member 113 has a supporting point or a supporting surface for supporting the plated object 1. Preferably, there are multiple first support members 113, and the supporting points or supporting surfaces of the multiple first support members 113 are all disposed in the same plane.

[0124] The opening and closing assembly 130 includes a first rotating shaft 132 rotatably connected to the bearing body 110, a second mounting member 131 is fixedly arranged on the first rotating shaft 132, the second mounting member 131 is extended in the radial direction of the first rotating shaft 132 and in the direction away from the first rotating shaft 132, and a second supporting member 133 is fixedly arranged on the second mounting member 131. The first rotating shaft 132 rotates, driving the second supporting member 133 to move outside the receiving groove 110a or into the receiving groove 110a, so that the opening and closing assembly 130 is opened or closed.

[0125] The receiving groove 110a is a rectangular groove or a rounded rectangular groove, and first mounting members 114 are disposed on two opposite side walls of the receiving groove 110a, at least two first mounting members 114 are disposed on one side wall, or at least two first mounting members 114 are disposed on each side wall.

[0126] The side wall of the receiving groove 110a where the first mounting member 114 is disposed is defined as the first side wall, and the first rotating shaft 132 is disposed on the frame of the supporting body 110 corresponding to the first side wall. Specifically, a rotating shaft mounting groove 110b is disposed on the frame of the supporting body 110 corresponding to the first side wall, and the first rotating shaft 132 is rotatably disposed in the rotating shaft mounting groove 110b. For example, the extending direction of the rotating shaft mounting groove 110b is Figure 1 In the Z direction, the extension direction of the rotation axis of the first rotating shaft 132 is Figure 1 The Z direction in .

[0127] Specifically, there are two first side walls, which are two side walls opposite to the receiving groove 110a. The two first side walls are provided with a shaft mounting groove 110b. The first shaft 132 is rotatably mounted in the two shaft mounting grooves 110b. Each first shaft 132 is provided with a second mounting member 131. The second mounting member 131 is extended along the radial direction of the first shaft 132 and in a direction away from the first shaft 132. The second mounting member 131 also extends along the axial direction of the first shaft 132. For example, the second mounting member 131 is formed into a rectangular structure. Two second support members 133 are arranged at intervals on the second mounting member 131. Correspondingly, two first mounting members 114 are arranged at intervals on each first side wall, and each first mounting member 114 is provided with a first support member 113. When the opening and closing assembly 130 is closed, the supporting point or supporting surface of each second support member 133 and the corresponding supporting point or supporting surface of the first support member 113 are arranged to offset each other or be spaced apart by a preset gap, and the width of the preset gap is less than or equal to the thickness of the plated component 1.

[0128] In some embodiments, the first mounting member 114 may be an integral structure, that is, the first mounting member 114 and Figure 1 The second mounting member 131 shown in the figure has the same structure, a first mounting member 114 is arranged on each first side wall, and two first supporting members 113 are arranged on each first mounting member 114 at intervals. Similarly, the second mounting member 131 can be a split structure, two second mounting members 131 are arranged on each first rotating shaft 132 at intervals, and a second supporting member 133 is arranged on each second mounting member 131. For example, as Figure 5-1 , the first mounting member 114 is a split structure, and the second mounting member 131 is an integral structure; Figure 5-2 , the first mounting member 114 is a split structure, and the second mounting member 131 is a split structure; Figure 5-3 , the first mounting member 114 is an integral structure, and the second mounting member 131 is a split structure; Figure 5-4 The first mounting member 114 is an integral structure, and the second mounting member 131 is an integral structure.

[0129] In order to prevent the first support member 113 from damaging the surface of the object 1 when it abuts against the object 1, the support point or support surface of the first support member 113 is made of flexible material, such as rubber, silicone, resin, etc. Similarly, the support point or support surface of the second support member 133 is also made of flexible material.

[0130] In some embodiments, a first shielding component is provided on the carrier body 110, or a second shielding component is provided on the first rotating shaft 132, or a first shielding component is provided on the carrier body 110 and a second shielding component is provided on the first rotating shaft 132. The first shielding component is used to shield the edge of the first surface of the plated object 1 during the electroplating process, and the second shielding component is used to shield the edge of the second surface of the plated object 1 during the electroplating process. When the plated surface of the plated object 1 is one side, that is, the first side or the second side, it is only necessary to shield the edge of the one plated surface accordingly to reduce the electric field strength at the edge of the plated surface, that is, to reduce the edge effect during the electroplating process. When the plated surface of the plated object 1 is two sides, that is, the first side and the second side, it is necessary to shield the edges of both plated surfaces to reduce the electric field strength at the edges of the two plated surfaces, that is, to reduce the edge effect during the electroplating process.

[0131] In some embodiments, a first mounting member 114 extending away from the inner wall is provided on the inner wall of the receiving groove 110a, and the first supporting member 113 is fixedly provided on the first mounting member 114, and the first mounting member 114 is formed as a first shielding member. A second mounting member 131 is fixedly provided on the first rotating shaft 132, and the second mounting member 131 is extended in the radial direction of the first rotating shaft 132 and away from the first rotating shaft 132, and a second supporting member 133 is fixedly provided on the second mounting member 131, and the second mounting member 131 is formed as a second shielding member. The first mounting member 114 already in the electroplating carrier 100 is used to form a first shielding component, and the first mounting member 114 has the function of providing a mounting position for the first support member 113 and the function of shielding the edge of the first surface of the plated article 1; the second mounting member 131 already in the electroplating carrier 100 is used to form a second shielding component, and the second mounting member 131 has the function of providing a mounting position for the second support member 133 and the function of shielding the edge of the second surface of the plated article 1, so that the electroplating carrier 100 does not need to additionally set up the first shielding component and the second shielding component, and the structure of the electroplating carrier 100 is simplified and the cost is reduced.

[0132] In some embodiments, the receiving groove 110a is a through hole that penetrates the supporting body 110 along the thickness direction of the supporting body 110, and a first shielding member is provided on at least a portion of the edge of the first opening of the receiving groove 110a extending into the receiving groove 110a to shield at least a portion of the edge of the first surface of the plated object 1 during the electroplating process. A second shielding member is provided on the first rotating shaft 132, and the second shielding member can shield at least a portion of the edge of the second opening of the receiving groove 110a after rotation to shield at least a portion of the edge of the second surface of the plated object 1 during the electroplating process. This embodiment is particularly suitable for double-sided electroplating of the plated object 1, and the first shielding member and the second shielding member can shield the edges of the two plated surfaces of the plated object 1 to reduce the electric field strength of the edges of the two plated surfaces of the plated object 1. For example, the plated surface of the plated object 1 is two sides, and each side includes a left edge, a right edge, an upper edge, and a lower edge. In the first case, the first shielding component shields the left edge, right edge and bottom edge of the first opening of the receiving groove 110a, and can correspondingly shield the left edge, right edge and bottom edge of the first surface of the plated object 1; the second shielding component shields the left edge and right edge of the second opening of the receiving groove 110a, and can correspondingly shield the left edge and right edge of the second surface of the plated object 1. In the second case, the first shielding component shields the left edge, right edge and bottom edge of the first opening of the receiving groove 110a, and can correspondingly shield the left edge, right edge and bottom edge of the first surface of the plated object 1; the second shielding component shields the left edge, right edge and bottom edge of the second opening of the receiving groove 110a, and can correspondingly shield the left edge, right edge and bottom edge of the second surface of the plated object 1. In the third case, the first shielding component blocks the entire edge of the first opening of the accommodating groove 110a, and can correspondingly block the entire edge of the first surface of the plated object 1; the second shielding component blocks the entire edge of the second opening of the accommodating groove 110a, and can correspondingly block the entire edge of the second surface of the plated object 1.

[0133] Specifically, when the electroplating carrier 100 is moved along the Y direction or the electroplating solution flows along the Y direction; Figure 6 as well as Figure 8-10As shown, the first shielding component is a shielding plate 120, and the shielding plate 120 is at least arranged on two edges of the first opening distributed along the Y direction; the second shielding component is a second mounting member 131 fixedly arranged on a first rotating shaft 132, and two first rotating shafts 132 are arranged at intervals on two frames of the carrier body 110 distributed along the Y direction, and the corresponding second mounting member 131 can shield the two edges of the second opening distributed along the Y direction through the rotation of the two first rotating shafts 132. The relative movement of the electroplating carrier 100 and the electroplating solution includes that the electroplating carrier 100 moves along the Y direction or the electroplating solution flows along the Y direction, and the electroplating carrier 100 moves along the Y direction and the electroplating solution flows in the opposite direction of the Y direction. When the electroplating carrier 100 and the electroplating liquid move relative to each other, the electric field strength on the two edges distributed along the Y direction on each surface of the workpiece 1 will increase abnormally, which may easily lead to uneven electroplating of the workpiece 1. Therefore, the shielding plate 120 is at least provided on the two edges distributed along the Y direction of the first opening to shield the two edges distributed along the Y direction on the first surface of the workpiece 1. The second mounting member 131 can shield the two edges distributed along the Y direction of the second opening, and further shield the two edges distributed along the Y direction on the second surface of the workpiece 1, thereby reducing the electric field strength on the two edges distributed along the Y direction on each surface of the workpiece 1, and improving the electroplating uniformity of the workpiece 1.

[0134] In some embodiments, Figure 1 as well as Figure 8-12 As shown, a first conductive block 150 is disposed on one side of the upper frame of the carrier body 110 facing the entrance direction of the receiving groove 110a. Figure 1 The bearing body 110 is made of insulating material, the first conductive block 150 is made of conductive material, the first conductive block 150 is connected to the negative electrode of the electroplating power source through a wire, and the first conductive block 150 is connected to the plated area of ​​the plated object 1 through the conductive lead 2 to achieve electroplating of the plated object 1.

[0135] In some embodiments, Figure 1-4 as well as Figure 8-12 As shown, a conductive clip 140 is provided on the upper frame of the carrier body 110, and the conductive clip 140 can abut the conductive lead 2 on the plated object 1 against the first conductive block 150 to achieve electrical connection between the first conductive block 150 and the plated area of ​​the plated object 1. The conductive lead 2 can be a hard conductive part, or a conductive part with flexible ends, or a flexible conductive part as a whole. It can be understood that the conductive clip 140 is formed as a conductive device for the plated object.

[0136] Specifically, Figure 7-1 to Figure 7-4 Correspondingly, four structural schematic diagrams of conductive leads 2 are shown. Figure 7-1The first type of conductive lead 2 is a schematic diagram of the structure. The conductive lead 2 has a conductor layer 21 and a conductive adhesive layer 22 arranged on one side of the conductor layer 21 along the thickness direction. The conductor layer 21 and the conductive adhesive layer 22 are both conductors. The side of the conductive adhesive layer 22 facing away from the conductor layer 21 is sticky and can be fixedly bonded to the plated area of ​​the plated object 1. The conductive adhesive layer 22 is fixedly bonded to the plated area of ​​the plated object 1, thereby achieving electrical connection with the plated object 1. The conductor material of the conductor layer 21 is one of copper, aluminum, nickel and stainless steel, or an alloy material composed of any two or more, or a multilayer structure formed by stacking multiple of copper, aluminum, nickel and stainless steel along the thickness direction; the conductive adhesive layer 22 is a conductive pressure-sensitive adhesive layer or a conductive heat-sensitive adhesive layer or a non-woven conductive adhesive layer, and the conductive adhesive layer 22 is used to provide at least the conductive ability from the conductor layer 21 to the conductive adhesive layer 22. When the plated object 1 is electrically connected to the first conductive block 150 , the conductive adhesive layer 22 of the conductive lead 2 can be directly bonded to the plated object 1 and the first conductive block 150 , respectively, and the conductive clip 140 is used to simultaneously abut the conductive lead 2 against the first conductive block 150 .

[0137] Figure 7-2 : is a schematic diagram of the structure of the second conductive lead 2. Based on the first structure, the conductive lead 2 further has a first coating layer 23 arranged on the other side of the conductor layer 21. The first coating layer 23 is an insulating film layer or a hydrophobic film layer, which is used to insulate or isolate the electroplating solution that the side of the conductor layer 21 may contact, thereby reducing or avoiding electroplating of the side of the conductor layer 21. In the specific configuration, the size and shape of the surface of the first coating layer 23 and the conductor layer 21 that cooperate with each other are the same, so that the surface of the conductor layer 21 on the other side is completely covered by the first coating layer 23.

[0138] Figure 7-3 : is a schematic diagram of the structure of the conductive lead 2 of the third structure. Based on the second structure, the conductive lead 2 also has a second coating layer 24 arranged on the outer side of the conductive adhesive layer 22. The second coating layer 24 is also an insulating film layer or a hydrophobic film layer, which is used to insulate or isolate the outer side of the conductive adhesive layer 22 from the plating solution that may be in contact with it, thereby reducing the electroplating area on the outer side of the conductive adhesive layer 22. This also makes the surface of the entire conductive lead 2 corrosion-resistant, so that the inside of the conductive lead 2 can provide better conductivity. The outer side of the conductive adhesive layer 22 is not completely covered by the second coating layer 24, so that the conductive adhesive layer 22 located on the second end 2B of the conductive lead 2 is exposed and used to be bonded to the plated area of ​​the plated component 1, and the conductive adhesive layer 22 located on the first end 2A of the conductive lead 2 is exposed and used to be bonded to the first conductive block 150.

[0139] Figure 7-4This is a schematic diagram of the structure of the conductive lead 2 of the fourth structure. Based on the second structure, the conductive lead 2 also has a second coating layer 24 arranged on the outer side of the conductive adhesive layer 22. The second coating layer 24 is also an insulating film layer or a hydrophobic film layer, which is used to insulate or isolate the outer side of the conductive adhesive layer 22 from the plating solution that may be in contact with it, thereby reducing the plating area on the outer side of the conductive adhesive layer 22. This also makes the surface of the entire conductive lead 2 corrosion-resistant, and the conductive lead 2 can provide better conductivity. The difference is that the conductive adhesive layer 22 located on the first end 2A of the conductive lead 2 does not cover the conductor layer 21 on the end. The outer side surface of the conductive adhesive layer 22 is not completely covered by the second coating layer 24, so that the conductive adhesive layer 22 located on the second end 2B of the conductive lead 2 is exposed and used to be bonded to the plating area of ​​the plated component 1. The second coating layer 24 located on the first end 2A of the conductive lead 2 covers the conductive adhesive layer 22 on the end, and the first conductive block 150 is electrically connected through the conductor layer 21 exposed on the first end 2A of the conductive lead 2.

[0140] It should be noted that the side of the conductive adhesive layer 22 that is in contact with the conductor layer 21 is the inner side of the conductive adhesive layer 22 , and the side opposite to the inner side of the conductive adhesive layer 22 is the outer side.

[0141] In some embodiments, Figure 4 As shown, the conductive clamp 140 includes a support 141, a second rotating shaft 142, an operating component 143 and a clamping component 144. The support 141 is fixedly arranged on the upper frame, and the second rotating shaft 142 is rotatably arranged on the support 141. The operating component 143 and the clamping component 144 are both fixedly connected to the second rotating shaft 142, so that the operating component 143, the clamping component 144 and the second rotating shaft 142 can rotate synchronously; when in use, the operating component 143 is rotated to drive the clamping component 144 to abut the conductive lead 2 against the first conductive block 150.

[0142] In some embodiments, the conductive clamp 140 further includes a torsion spring 145, which is sleeved on the second rotating shaft 142, one torque arm of the torsion spring 145 is fixedly connected to the support 141, and the other torque arm of the torsion spring 145 is fixedly connected to any one of the second rotating shaft 142, the operating component 143, and the clamping component 144; the torsion spring 145 can force the clamping component 144 to approach or move away from the first conductive block 150. When the torsion spring 145 is used to force the clamping component 144 to approach the first conductive block 150, that is, the torsion spring 145 is used to provide a pre-tightening force for closing between the clamping component 144 and the first conductive block 150, the clamping component 144 and the first conductive block 150 remain normally closed, and at this time, an external force is required to open the clamping component 144. When the torsion spring 145 is used to force the clamping part 144 away from the first conductive block 150, that is, the torsion spring 145 is used to provide an opening force between the clamping part 144 and the first conductive block 150, the clamping part 144 and the first conductive block 150 remain normally open, and external force is needed to close the clamping part 144.

[0143] In some embodiments, the clamping member 144 includes a rotating connector 1441 rotatably connected to the second rotating shaft 142, an abutting connector 1442 connected to the rotating connector 1441, the abutting connector 1442 is connected to the rotating connector 1441 through a connecting pin 1443, and a second conductive block 1444 is symmetrically arranged on the abutting connector 1442 with the connecting pin 1443 as a symmetry axis, and the forces acting on the second conductive blocks 1444 on both sides thereof by the second conductive blocks 1444 and the connecting pin 1443 are equal, so that the second conductive blocks 1444 can uniformly apply pressure to the pressed conductive lead 2, reducing the risk of falling off due to uneven force on some conductive leads 2. That is, there are multiple conductive leads 2 connected to the plated component 1, and there are corresponding multiple second conductive blocks 1444, so that the conductive leads 2 can be pressed one by one accordingly.

[0144] Specifically, the rotation axis of the second rotating shaft 142 extends along the Y direction, the rotating connecting member 1441 and the abutting connecting member 1442 are both plate-shaped members extending along the Y direction, and the second conductive blocks 1444 are spaced apart along the Y direction and symmetrical about the connecting pin 1443 .

[0145] In some embodiments, a support platform 111 is provided on the lower side wall of the receiving tank 110a. When the plated object 1 is placed in the receiving tank 110a, the lower side of the plated object 1 abuts against the support platform 111. The plated object 1 is supported by the support platform 111, and a support force is provided for the plated object 1 in the process of being taken out of the electroplating solution, so as to avoid relative sliding between the first support member 113 and the second support member 133 abutting on the two sides of the plated object 1 and the plated object 1. A guide surface 112 is also provided on the lower side wall of the receiving tank 110a. The guide surface 112 is a chamfer on the lower side wall of the receiving tank 110a. When there are multiple support platforms 111, a guide surface 112 is formed between two adjacent support platforms 111. In the process of the electroplating carrier 100 being taken out of the electroplating solution, the electroplating solution fills the receiving tank 110a, and the electroplating solution in the receiving tank 110a needs to flow out quickly. By providing the guide surface 112, the plating liquid in the receiving tank 110a can be quickly led out from the guide surface 112, reducing the risk of the receiving tank 110a taking the plating liquid out of the plating tank, and reducing the time for draining the plating liquid after the electroplating carrier 100 is taken out of the plating liquid. In order to achieve the diversion effect, a guide hole can also be provided on the lower side wall of the receiving tank 110a, and the guide hole passes through the lower frame of the carrier body 110 along the Z direction (up and down direction); or the lower frame of the carrier body 110 is a hollow structure.

[0146] In some embodiments, in order to reduce the amount of liquid carried by the electroplating carrier 100 when it is taken out of the electroplating solution, a lyophobic coating is coated on the surface of the carrier body 110. By way of example, the lyophobic coating includes silicone resin, micro-nano particles, additives, and solvents; wherein the silicone resin may be fluorine-silicon copolymer resin or epoxy silicone resin, the material of the micro-nano particles may be silicon nitride, and the additives may include a modifier, a cross-linking agent, and the like.

[0147] Example 2

[0148] A plating rack includes a mounting platform 210 and a plurality of plating carriers 100 mounted on the mounting platform 210; the plating carriers 100 are suspended on the mounting platform 210, adjacent plating carriers 100 are spaced apart, and two adjacent plating carriers 100 are parallel and aligned; the plating carrier 100 includes a bearing body 110, a plated piece fixing device and a plated piece conductive device, the bearing body 110 is provided with a receiving groove 110a for accommodating the plated piece 1 along its thickness direction; the plated piece fixing device is used to fix the plated piece 1 accommodated in the receiving groove 110a; the plated piece conductive device is used to electrically connect the plated piece 1 accommodated in the receiving groove 110a.

[0149] like Figure 13-14As shown, the electroplating carrier 100 includes a carrier body 110, and the carrier body 110 is provided with a receiving groove 110a along its thickness direction. A mounting protrusion 116 is provided on the lower side wall of the receiving groove 110a, and a slot extending along the Y direction is provided on the mounting protrusion 116. When the plated object 1 is placed in the electroplating carrier 100, the plated object 1 is firstly sent into the receiving groove 110a in a state perpendicular to the X direction, so that the plated object 1 reaches the first preset position, which can be referred to Fig.13 Then move the plated part 1 downward along the Z direction so that the lower edge of the plated part 1 is inserted into the slot, and the plated part 1 is fixed by the slot. At this time, the plated part 1 reaches the second preset position, which can be referred to Fig.14 In order to avoid the plated object 1 in the first preset position, the conductive clip 140 may not be provided on the electroplating carrier 100. Further, an avoidance gap is provided on the upper frame of the carrier body 110, that is, the carrier body 110 does not constitute a complete frame structure, which can be referred to Fig.15 As shown. The conductive clip 140 can extend from the avoidance notch into the accommodating groove 110a to clamp the conductive lead 2, the conductive lead 2 can be shorter, and there are more options for the setting position of the conductive clip 140. In addition, by avoiding the avoidance notch, the conductive clamping mechanism 400 described below can more conveniently clamp the plated object 1. It can be understood that the mounting protrusion 116 is formed as a plated object fixing device.

[0150] Of course, in order to more stably fix the plated object 1, the opening and closing assembly 130 in embodiment 1 can also be used to fix the plated object 1 for a second time. It can be understood that the mounting protrusion 116 and the opening and closing assembly 130 are both formed as a plated object fixing device.

[0151] like Figure 16-Figure 19 As shown, the electroplating carrier 100 also includes a conductive clamping mechanism 400, which includes a first clamping portion and a second clamping portion, at least one of which is a conductive clamping portion, and a conductive contact 413 and a first sealing member 414 arranged outside the conductive contact 413 are arranged on the clamping end of the conductive clamping portion; in the working state, the clamping end of the first clamping portion and the clamping end of the second clamping portion respectively abut against two sides of the plated object 1 to clamp the plated object 1; the first sealing member 414 arranged outside the conductive contact 413 abuts against one side of the plated object 1 to form a sealed space, and the conductive contact 413 abuts against the conductive point of the plated object 1. The conductive contact 413 is sealed in the sealed space, and the sealed space can isolate the electroplating solution to prevent the electroplating solution from entering the sealed space to electroplate the conductive contact 413 and the conductive point of the plated object 1. It can be understood that the electric clamping mechanism 400 is formed as a conductive device for the plated object.

[0152] For example, the clamping end of the first clamping portion is called the first clamping end, and the clamping end of the second clamping portion is called the second clamping end. The first clamping end and the second clamping end can adopt at least one of the following clamping structures:

[0153] The first type of structural clamping: a conductive contact 413 and a first sealing member 414 surrounding the conductive contact 413 are provided on the first clamping end, and an insulating contact is provided on the second clamping end. The insulating contact cooperates with the conductive contact 413 to clamp the plated workpiece 1, the conductive contact 413 is electrically connected to the conductive point of the plated workpiece 1 it abuts against, and the insulating contact is insulated and connected to the plated surface of the plated workpiece 1 it abuts against. Preferably, the contact points of the conductive contact 413 and the plated workpiece 1 and the contact points of the insulating contact and the plated workpiece 1 are symmetrical about the first plane, and the first plane is a plane parallel to the plated surface of the plated workpiece 1.

[0154] The second clamping structure: a conductive contact 413 and a first sealing member 414 surrounding the conductive contact 413 are provided on the second clamping end, and an insulating contact is provided on the first clamping end. The insulating contact cooperates with the conductive contact 413 to clamp the plated workpiece 1, the conductive contact 413 is electrically connected to the conductive point of the plated workpiece 1 abutted therewith, and the insulating contact is insulated and connected to the plated surface of the plated workpiece 1 abutted therewith. Preferably, the abutting points of the conductive contact 413 and the plated workpiece 1 and the abutting points of the insulating contact and the plated workpiece 1 are symmetrical about the first plane, and the first plane is a plane parallel to the plated surface of the plated workpiece 1.

[0155] The third clamping structure: a conductive contact 413 and a first sealing member 414 surrounding the conductive contact 413 are provided on the first clamping end and the second clamping end. The conductive contacts 413 on the first clamping end and the second clamping end are respectively referred to as the first conductive contact 413 and the second conductive contact 413. The first conductive contact 413 and the second conductive contact 413 clamp the workpiece 1 to be plated, the first conductive contact 413 is electrically connected to the conductive point of the workpiece 1 to be plated abutted with it, and the second conductive contact 413 is electrically connected to the conductive point of the workpiece 1 to be plated abutted with it. Preferably, the abutting point of the first conductive contact 413 with the workpiece 1 to be plated and the abutting point of the second conductive contact 413 with the workpiece 1 to be plated are symmetrical about a first plane, and the first plane is a plane parallel to the plated surface of the workpiece 1 to be plated.

[0156] The first and second clamping structures are particularly suitable for single-sided electroplating of the object 1 and electroplating of different effects on both sides of the object 1. The third clamping structure is particularly suitable for double-sided electroplating of the object 1.

[0157] In some embodiments, Figure 16-Figure 17As shown, the conductive clamping part includes a clamping seat 412, a first countersunk hole 412a is provided on the top of the clamping seat 412, a first mounting hole 412b is provided on a side wall of the clamping seat 412 facing the plated object 1, a conductive contact 413 is provided in the first mounting hole 412b and partially extends out of the first mounting hole 412b, the first countersunk hole 412a is connected to the first mounting hole 412b, a conductive connector 411 is provided in the first countersunk hole 412a, and one end of the conductive connector 411 is mechanically and electrically connected to the conductive contact 413. The first mounting hole 412b is a countersunk hole, and the first mounting hole 412b is connected to the sealed space, so that the first mounting hole 412b and the conductive contact 413 are both isolated from the plating liquid.

[0158] Preferably, a first mounting hole 412b is provided on the side wall of the clamping seat 412, which passes through the clamping seat 412 transversely. The head of the conductive contact 413 extends out of the first mounting hole 412b, close to an opening of the plated object 1, and is in a sealed space. The tail of the conductive contact 413 extends out of the first mounting hole 412b, away from another opening of the plated object 1, or is in the first mounting hole 412b, and the tail of the conductive contact 413 is insulated, for example, coated with Teflon.

[0159] In some embodiments, the conductive contact 413 includes a mounting seat and a telescopic member 4132, the mounting seat is provided with a second mounting hole 4131a, a compressible medium or an elastic member is provided in the second mounting hole 4131a, one end of the telescopic member 4132 is provided in the second mounting hole 4131a and abuts the compressible medium or the elastic member, and the other end of the telescopic member 4132 extends out of the second mounting hole 4131a; the telescopic member 4132 is slidably connected to the second mounting hole 4131a, and the telescopic member 4132 is electrically connected to the mounting seat. In the working state, one end of the telescopic member 4132 extending out of the second mounting hole 4131a abuts against the conductive point of the plated member 1. By abutting the conductive point of the plated member 1 with the telescopic member 4132, it is possible to avoid rigid contact between the conductive contact 413 and the plated surface of the plated member 1, thereby damaging the plated member 1.

[0160] In some embodiments, the mounting seat includes a first shaft segment 41311, a second shaft segment 41312, and a third shaft segment 41313 connected in sequence. The shaft diameters of the first shaft segment 41311, the second shaft segment 41312, and the third shaft segment 41313 increase in sequence. A first mounting hole 412b is provided on the side wall of the clamping seat 412, which passes through the clamping seat 412 transversely. The hole diameter of the first mounting hole 412b is a variable diameter, which is adapted to the corresponding first shaft segment 41311, the second shaft segment 41312, and the second shaft segment 1313. The third shaft segment 41313 extends out of one opening of the first mounting hole 412b, and the first shaft segment 41311 extends out of the other opening of the first mounting hole 412b; the telescopic member 4132 is provided on the first shaft segment 41311. Through the third shaft segment 41313 extending out of one opening of the first mounting hole 412b, the conductive contact 413 can be quickly disassembled and replaced.

[0161] In some embodiments, a third mounting hole 4131b is arranged around the second shaft section 41312, and a second sealing member 415 is sleeved in the third mounting hole 4131b. The second sealing member 415 is an annular ring structure, and the inner ring of the second sealing member 415 abuts against the bottom of the third mounting hole 4131b, and the outer ring of the second sealing member 415 abuts against the inner wall of the first mounting hole 412b. The risk of the plating solution entering the sealed space from the first mounting hole 412b can be reduced by the sealing of the second sealing member 415. Preferably, one end of the conductive connector 411 is an annular structure, and one end of the conductive connector 411 is sleeved on the second shaft section 41312.

[0162] In some embodiments, a fourth mounting hole 412c is provided on the clamping end of the conductive clamping portion, and the fourth mounting hole 412c is arranged around the second mounting hole 4131a and extends out of the opening of the telescopic member 4132. The first sealing member 414 is an annular structure, and the first sealing member 414 is clamped in the fourth mounting hole 412c, and the surface of the first sealing member 414 extends out of the fourth mounting hole 412c.

[0163] In some embodiments, when the first clamping portion or the second clamping portion is an insulating clamping portion 420, an elastic abutment member 421 is protruding from the clamping end of the insulating clamping portion 420. By the elastic abutment member 421 contacting one side of the plated workpiece 1, the insulating clamping portion 420 can be prevented from rigidly contacting one side of the plated workpiece 1, thereby reducing the risk of damage to the plated workpiece 1.

[0164] Preferably, an annular groove 420 a is provided on the clamping end of the insulating clamping portion 420 , and the elastic abutment member 421 is clamped in the annular groove 420 a .

[0165] The present embodiment also provides an electroplating device, which uses the above-mentioned conductive clamping mechanism 400 to clamp the workpiece 1 to be plated, so that the workpiece 1 is electrically connected to the negative pole of the electroplating power supply through the conductive clamping mechanism 400. The electroplating device also includes a plating tank and an anode component, the anode component is electrically connected to the positive pole of the electroplating power supply, the electroplating tank is used to contain the electroplating solution, the anode component is arranged in the electroplating solution, and when electroplating, at least the plated surface of the workpiece 1 is located in the electroplating solution and the plated surface is facing the anode component.

[0166] In some embodiments, a plurality of conductive clamping mechanisms 400 are provided on the same workpiece 1 to form a plurality of power supply points on the workpiece 1. In the event of failure of a single power supply point, electroplating can still be achieved. In addition, different areas on the workpiece 1 can be connected to electricity and plated at the same time, which can improve electroplating efficiency and uniformity.

[0167] In some embodiments, each of the conductive clamping mechanisms 400 has only one conductive clamping part, wherein the conductive clamping parts of some of the conductive clamping mechanisms 400 are connected to the conductive points on the first surface of the object 1 to be plated, and the conductive clamping parts of other parts of the conductive clamping mechanisms 400 are connected to the conductive points on the second surface of the object 1 to be plated, and the first surface and the second surface are two opposite surfaces of the object 1 to be plated. Therefore, a first current can be passed through the conductive clamping part connected to the conductive points on the first surface of the object 1 to be plated, and a second current can be passed through the conductive clamping part connected to the conductive points on the second surface of the object 1 to be plated. The first current and the second current are different in magnitude, and electroplating with different electroplating effects on both sides of the object 1 to be plated can be achieved.

[0168] Specifically, there are two electroplating power supplies, the negative pole of one electroplating power supply is connected to the conductive point on the first side of the object to be plated 1 through the conductive clamping part of a partial conductive clamping mechanism 400, and the negative pole of the other electroplating power supply is connected to the conductive point on the second side of the object to be plated 1 through the conductive clamping part of another partial conductive clamping mechanism 400.

[0169] In some embodiments, there are multiple conductive clamping mechanisms 400 , and all of the conductive clamping mechanisms 400 are mounted on the mounting platform 500 . Figure 20-21 As shown, multiple conductive clamping mechanisms 400 clamping the same plated object 1 are called a conductive clamping mechanism group. The conductive clamping mechanism group includes multiple conductive clamping mechanisms 400 spaced apart along the front-to-back direction. Multiple conductive clamping mechanism groups are arranged on the mounting platform 500. The conductive clamping mechanism groups are spaced apart along the left-right direction. Here, left and right refer to Fig. 20 In the left and right directions, front refers to the direction perpendicular to the paper surface, and back refers to the direction perpendicular to the paper surface.

[0170] Furthermore, this embodiment also provides an electroplating method, comprising the following steps: clamping the conductive points on the workpiece 1 to fix the workpiece 1 and electrically connect the conductive points; sealing the conductive points and the conductive contacts 413 in contact with the conductive points in a sealed space; immersing the workpiece 1 in the electroplating solution for electroplating, and during the electroplating process, the conductive points and the conductive contacts 413 in contact with the conductive points remain sealed in the sealed space.

[0171] In this method, the conductive point and the conductive contact 413 in contact with the conductive point are sealed in a sealed space, and the sealed space can isolate the plating solution to prevent the plating solution from entering the sealed space to plate the conductive contact 413 and the conductive point.

[0172] Example 3

[0173] This embodiment provides an electroplating rack, such as Fig. 22 As shown, on the basis of Example 1, the conductive clamp 140 in Example 1 is replaced by the conductive clamping mechanism 400 in Example 2; there is no need to set the conductive lead 2 on the plated object 1, and there is no need to set the first conductive block 150 on the carrier body 110. The conductive clamping mechanism 400 is arranged above the carrier body 110, and the first clamping part and the second clamping part can extend to both sides of the carrier body 110 along its own thickness direction; during electroplating, at least one of the first clamping part and the second clamping part approaches the other, so that the clamping end of the first clamping part and the clamping end of the second clamping part respectively abut against the two sides of the plated object 1 to clamp the plated object 1. In order to better avoid the conductive clamping mechanism 400, the upper frame of the carrier body 110 can be removed.

[0174] Specifically, the carrier body 110 is suspended below the mounting platform 500 by a cantilever 510, and the conductive clamping mechanism 400 is suspended and installed on the mounting platform 500. The first clamping portion and the second clamping portion extend downward along the Z direction, and the first clamping portion and the second clamping portion can extend to both sides of the carrier body 110 along its own thickness direction. At least one of the first clamping portion and the second clamping portion is slidably connected to the mounting platform 500, so that at least one of the first clamping portion and the second clamping portion can approach the other.

[0175] Without violating the principle of this embodiment, other structures of the electroplating rack may refer to Embodiment 1 and Embodiment 2.

[0176] Example 4

[0177] like Figure 23-24As shown, an improvement is made on the basis of Example 1, and an electroplating rack includes an electroplating carrier 100 and a mounting platform 210, the electroplating carrier 100 is mounted on the mounting platform 210, and a first switch mechanism and a second switch mechanism are provided on the mounting platform 210, the first switch mechanism can switch the opening and closing component 130 between an open state and a closed state, so that the plated object 1 can enter and exit the receiving groove 110a, and the second switch mechanism can switch the conductive clip 140 between an open state and a closed state, so that the conductive clip 140 can clamp or release the conductive lead 2 on the plated object 1. It can be understood that the opening and closing component 130 is formed as a plated object fixing device, and the conductive clip 140 is formed as a plated object conductive device.

[0178] In some embodiments, multiple electroplating carriers 100 are arranged at intervals on the mounting platform 210, so that multiple plated parts 1 are respectively installed on the corresponding multiple electroplating carriers 100. Further, by adjusting the installation positions of the multiple electroplating carriers 100, the multiple plated parts 1 can be parallel to each other. The first switch mechanism can make the opening and closing components 130 on all electroplating carriers 100 switch between the open state and the closed state synchronously, that is, the first switch mechanism can synchronously open or close all the opening and closing components 130, so that the multiple plated parts 1 can quickly or synchronously enter and exit the receiving tank 110a, thereby improving the efficiency of loading and unloading multiple (batch) plated parts 1 in and out of the receiving tank 110a. The second switch mechanism can enable the conductive clips 140 on all the electroplating carriers 100 to switch synchronously between an open state and a closed state, that is, the second switch mechanism can synchronously open or close all the conductive clips 140, so that multiple conductive leads 2 can be clamped quickly or synchronously, and then multiple conductive leads 2 can be quickly or synchronously connected to the electroplating power supply, thereby improving the wiring efficiency of multiple (batch) plated parts 1.

[0179] It should be noted that the electroplating carrier 100 can also adopt the scheme or structure in Examples 2-3.

[0180] Specifically, Fig.23 and 24 As shown, the upper frame of the carrier body 110 is fixedly connected to the lower surface of the mounting platform 210. The mounting platform 210 extends along the X direction, and a plurality of electroplating carriers 100 are arranged on the lower surface of the mounting platform 210 at intervals along the X direction. The installation positions of the plurality of electroplating carriers 100 are adjusted so that the plated parts 1 in the plurality of electroplating carriers 100 are parallel to each other. The electroplating carrier 100 can be regarded as a sheet structure as a whole, and the electroplating carrier 100 is vertically connected to the mounting platform 210, and the electroplating carrier 100 is perpendicular to the X direction.

[0181] The first rotating shaft 132 passes through the mounting platform 210, and the upper end of the first rotating shaft 132 is rotatably connected to the mounting platform 210. The upper end of the first rotating shaft 132 is fixedly connected to the first end of the rocker 160. The first switching mechanism includes a first slide plate 220 extending along the X direction and two first guide pulley groups distributed along the Y direction. Each first guide pulley group includes a plurality of first guide pulleys 211 distributed along the X direction. The rotating axis of the first guide pulley 211 extends along the Z direction. The first guide pulleys 211 in the two first guide pulley groups respectively abut against two side surfaces of the first slide plate 220 distributed along the Y direction, so that the first slide plate 220 can slide in the sliding area formed between the two first guide pulley groups. A plurality of first slots 220b distributed along the X direction are provided on both sides of the first slide plate 220 distributed along the Y direction, and each first slot 220b is connected to the second end of the swing rod 160. When the first slide plate 220 reciprocates along the X direction, the first slot 220b can drive the swing rod 160 to rotate, and the swing rod 160 further drives the first rotating shaft 132 to rotate, so that the opening and closing assembly 130 is opened or closed. The middle part of the swing rod 160 is connected to one end of the first elastic member 212, and the other end of the first elastic member 212 is fixedly connected to the mounting platform 210, so that when the first slide plate 220 reciprocates along the X direction, the second end of the swing rod 160 always abuts against the notch of the first slot 220b, so as to prevent the swing rod 160 from coming out of the first slot 220b. A first driving device (not shown) is also provided on the mounting platform 210, and the driving direction of the first driving device is the X direction. The first driving device is driven and connected to the first slide plate 220, and can drive the first slide plate 220 to move along the X direction. At least one of the two ends of the first slide plate 220 distributed along the X direction is fixedly connected to the second elastic member 222. For example, one of the two ends of the first slide plate 220 distributed along the X direction is fixedly connected to the first end of the second elastic member 222, and the second end of the second elastic member 222 is fixedly connected to the mounting platform 210. When the first driving device is not working, the tension or pressure of the second elastic member 222 acts on the first slide plate 220, so that the first slide plate 220 is kept in a preset position, and then the swing rod 160 and the first rotating shaft 132 are kept in the preset position, so that the opening and closing assembly 130 is kept in an open or closed state. Wherein, the first elastic member 212 and the second elastic member 222 can both be springs, and the first driving device can be a cylinder or a linear motor.

[0182] Through the multiple first slots 220b on the first slide 220, the corresponding multiple rocker arms 160 can be engaged, thereby driving the multiple first rotating shafts 132 to rotate, so that the opening and closing components 130 on the multiple electroplating carriers 100 are opened or closed synchronously, thereby improving the opening and closing efficiency of the multiple opening and closing components 130, so that the plated parts 1 can be loaded and unloaded synchronously or simultaneously, thereby improving the loading and unloading efficiency of the plated parts 1.

[0183] When multiple electroplating carriers 100 are arranged at intervals along the X direction, and each electroplating carrier 100 includes two first rotating shafts 132 arranged on two frames distributed along the Y direction, each first rotating shaft 132 is connected to a swing rod 160. Through the multiple first clamping grooves 220b distributed along the X direction opened on the two side surfaces of the first slide plate 220 distributed along the Y direction, the two swing rods 160 distributed along the Y direction on each electroplating carrier 100 can be clamped, so that the two opening and closing components on each electroplating carrier 100 are opened or closed synchronously. The opening and closing efficiency of each opening and closing component 130 is improved, so that the plated parts 1 can be loaded and unloaded synchronously or simultaneously, and the loading and unloading efficiency of the plated parts 1 is improved.

[0184] Specifically, the initial state of the opening and closing component 130 is to remain in the open state, and the plated workpiece 1 can be directly loaded. After the loading is completed, the first slide plate 220 slides in the opposite direction of the X direction, and the first slot 220b slides synchronously. The first elastic member 212 in the stretched state pulls the rocker arm 160 to rotate, so that the second end of the rocker arm 160 follows the movement of the first slot 220b, and the second end of the rocker arm 160 is always close to the first slot 220b. At the same time, the rotating rocker arm 160 drives the first rotating shaft 132 to rotate, so that the opening and closing component 130 is closed. After the plated object 1 is electroplated, the first slide plate 220 slides along the X direction, and the first slot 220b on the first slide plate 220 drives the swing rod 160 to rotate, and the swing rod 160 drives the first rotating shaft 132 to rotate, so that the opening and closing component 130 is opened. During this process, the first elastic member 212 in a stretched state acts on the swing rod 160, so that the second end of the swing rod 160 is always tightly attached to the first slot 220b, preventing the swing rod 160 from slipping out of the first slot 220b, resulting in the inability of the opening and closing component 130 to open and close.

[0185] In other embodiments, the first switch mechanism includes a first slide plate 220 extending along the X direction and a first slide rail (not shown) extending along the X direction. The first slide rail is fixedly disposed on the mounting platform 210. The first slide plate 220 and the first slide rail are slidably matched. The first slide plate 220 can slide along the X direction on the first slide rail.

[0186] In other embodiments, the first switching mechanism includes a first connecting rod extending along the X direction and a motor driving the first connecting rod to rotate. The upper end of the first rotating shaft 132 is fixedly connected to the first bevel gear. A second bevel gear is fixedly sleeved on the first connecting rod. The second bevel gear is meshingly connected with the first bevel gear. The motor drives the first connecting rod and the second bevel gear to rotate, and the second bevel gear drives the first bevel gear to rotate, so that the first rotating shaft 132 rotates, thereby causing the opening and closing assembly 130 to open or close.

[0187] When multiple electroplating carriers 100 are arranged on the lower surface of the mounting platform 210 at intervals along the X direction, each electroplating carrier 100 includes two first rotating shafts 132 arranged on its two borders distributed along the Y direction, and the upper end of each first rotating shaft 132 is fixedly connected to the first bevel gear. There are two first connecting rods distributed along the Y direction, and each first connecting rod is provided with a corresponding plurality of second bevel gears. Each first connecting rod is driven by a motor.

[0188] The second switch mechanism includes a second slide plate 230 extending along the X direction and two second guide pulley groups distributed along the Y direction. The second slide plate 230 is arranged above the first slide plate 220. The first slide plate 220 and the second slide plate 230 are stacked. Each second guide pulley group includes a plurality of second guide pulleys 221 distributed along the X direction. The second guide pulley 221 is arranged on the first slide plate 220 and is rotatably connected to the first slide plate 220. The rotation axis of the second guide pulley 221 extends along the Z direction. The second guide pulleys 221 in the two second guide pulley groups respectively abut against two side surfaces of the second slide plate 230 distributed along the Y direction, so that the second slide plate 230 can slide in the sliding area formed between the two second guide pulley groups. A second slot 230a is provided in the middle of the second slide plate 230, a first avoidance hole 220a is provided on the first slide plate 220 below the second slot 230a, and a second avoidance hole (not shown) is provided on the mounting platform 210 below the first avoidance hole 220a. The projections of the second slot 230a, the first avoidance hole 220a, and the second avoidance hole on the horizontal plane (the plane formed by the X direction and the Y direction) at least partially overlap, so that the operating component 143 can extend into the second slot 230a through the first avoidance hole 220a and the second avoidance hole. A plurality of second slots 230a are provided in the middle of the second slide plate 230 along the X direction, and correspondingly, there are a plurality of first avoidance holes 220a and second avoidance holes.

[0189] When the second slide plate 230 reciprocates along the X direction, the second slot 230 a can drive the operating component 143 to rotate, and the operating component 143 drives the clamping component 144 to move closer to or away from the first conductive block 150 to close or open the conductive clamp 140 .

[0190] The mounting platform 210 is also provided with a second driving device (not shown), the driving direction of the second driving device is the X direction, and the second driving device drives and connects the second slide plate 230, and can drive the second slide plate 230 to move along the X direction. At least one of the two ends of the second slide plate 230 distributed along the X direction is fixedly connected to the third elastic member 232. For example, one of the two ends of the first slide plate 220 distributed along the X direction is fixedly connected to the first end of the third elastic member 232, and the second end of the third elastic member 232 is fixedly connected to the mounting platform 210. When the second driving device is not working, the tension or pressure of the third elastic member 232 acts on the second slide plate 230, so that the second slide plate 230 is kept in the preset position, and then the operating component 143 is kept in the preset position, so that the conductive clip 140 is kept in the open or closed state. Among them, the third elastic member 232 can be a spring, and the second driving device can be a cylinder or a linear motor.

[0191] Specifically, the initial state of the conductive clamp 140 is to maintain an open state, and the plated object 1 can be directly loaded. After loading is completed, the second slide plate 230 slides along the X direction, and the second slot 230a on the second slide plate 230 drives the operating component 143 to rotate, and the operating component 143 drives the clamping component 144 to approach the first conductive block 150, so as to abut the conductive lead 2 against the first conductive block 150, that is, the closing of the conductive clamp 140 is completed. After the plated object 1 is electroplated, the second slide plate 230 slides along the opposite direction of the X direction, and the second slot 230a on the second slide plate 230 drives the operating component 143 to rotate, and the operating component 143 drives the clamping component 144 away from the first conductive block 150 to release the conductive lead 2 abutting against the first conductive block 150, that is, the opening of the conductive clamp 140 is completed.

[0192] Specifically, mounting blocks 213 are fixedly provided on both ends of the mounting platform 210 distributed along the X direction, one end of the second elastic member 222 is fixedly connected to the first slide plate 220, and the other end of the second elastic member 222 is fixedly connected to the mounting block 213 on one end of the mounting platform 210; one end of the third elastic member 232 is fixedly connected to the second slide plate 230, and the other end of the third elastic member 232 is fixedly connected to the mounting block 213 on the other end of the mounting platform 210.

[0193] Example 5

[0194] Improvements and changes are made on the basis of Example 4, such as Fig.25As shown, the first switch mechanism includes a third driving device 241, a linkage rod 242 and a lever 243. The third driving device 241 drives the linkage rod 242 so that the linkage rod 242 can reciprocate along the X direction. A plurality of levers 243 are fixedly arranged on the linkage rod 242. During the movement of the linkage rod 242, the first elastic member 212 pulls the swing rod 160 so that the second end of the swing rod 160 always presses against the lever 243. During operation, the linkage rod 242 moves in the X direction, driving the lever 243 to rotate the swing rod 160 to open the opening and closing assembly; the linkage rod 242 moves in the opposite direction of the X direction, driving the lever 243 to rotate the swing rod 160 to close the opening and closing assembly.

[0195] Through the multiple levers 243 on the linkage rod 242, the corresponding multiple rocker rods 160 can be moved, thereby driving the multiple first rotating shafts 132 to rotate, so that the opening and closing components 130 on the multiple electroplating carriers 100 are opened or closed synchronously, thereby improving the opening and closing efficiency of the multiple opening and closing components 130, so that the plated parts 1 can be loaded and unloaded synchronously or simultaneously, thereby improving the loading and unloading efficiency of the plated parts 1.

[0196] Example 6

[0197] like Fig.25 As shown, an electroplating device includes an electroplating tank 300 and an electroplating rack, wherein an anode member 330 is disposed in the electroplating tank 300, the anode member 330 extends along the Y direction, and there are a plurality of anode members 330, which are arranged in the electroplating tank 300 at intervals along the X direction, and an anode interval is formed between two adjacent anode members 330. Preferably, a plurality of anode members 330 are vertically arranged at intervals in the electroplating tank 300 and are parallel to each other.

[0198] The electroplating tank 300 includes two tank edges 310 distributed along the X direction. Each tank edge 310 extends along the Y direction. Each tank edge 310 is provided with an electroplating guide rail 320 extending along the Y direction.

[0199] The electroplating rack is arranged on or above the electroplating tank 300. A plurality of electroplating carriers 100 are arranged at intervals along the X direction on the electroplating rack. During electroplating, the electroplating tank 300 is provided with electroplating liquid, and the two ends of the electroplating rack are respectively slidably connected to the two electroplating guide rails 320, and the electroplating carriers 100 are inserted into the anode intervals one by one, that is, each electroplating carrier 100 is inserted into an anode interval. The electroplating rack is driven to move by manpower or a driving device (such as a motor or a cylinder), so that the electroplating carrier 100 and the plated parts 1 loaded in the electroplating carrier 100 move together, and the plated parts 1 are electroplated during the movement, which can improve the electroplating uniformity of the plated parts 1. A plurality of electroplating carriers 100 are arranged on the electroplating rack, and the synchronous electroplating of a plurality of plated parts 1 can be achieved at the same time, thereby improving the electroplating efficiency.

[0200] In some embodiments, two ends of the mounting platform 210 distributed along the X direction are slidably connected to two tank edges 310 of the electroplating tank.

[0201] Specifically, the mounting platform 210 is fixedly provided with extension pieces 214 at both ends distributed along the X direction, and a rotatable wheel 215 is fixedly provided on each extension piece 214, the rotation axis of the wheel 215 extends along the Z direction, and the middle of the hub of the wheel 215 is recessed toward the rotation center to form a hub clamping groove 215a. The electroplating tank 300 includes two groove edges 310 distributed along the X direction, each groove edge 310 extends along the Y direction, and each groove edge 310 is provided with an electroplating guide rail 320 extending along the Y direction. The two ends of the mounting platform 210 are clamped into the two electroplating guide rails 320 corresponding to the electroplating tank 300 through the hub clamping groove 215a, so that the wheel 215 can rotate and / or slide relative to the electroplating guide rails 320. As an alternative solution, a plurality of rotating wheels 215 are arranged at intervals along the Y direction on each groove edge 310 of the electroplating tank 300, and a plating guide rail 320 extending along the Y direction is arranged at the end of each extension member 214. The electroplating guide rail 320 on each end of the mounting platform 210 is inserted into the rotating wheel 215 on the corresponding groove edge 310 of the electroplating tank 300, so that the electroplating guide rail 320 and the rotating wheel 215 are slidably connected.

[0202] In some embodiments, Figure 26-27 As shown, the electroplating equipment also includes a loading and adsorption device, which includes a plurality of suction cups 610 arranged at intervals and parallel to each other. The suction cups 610 are fixedly arranged on a suction cup mounting platform 620. A support arm 630 is also arranged on the suction cup mounting platform 620. The suction cup mounting platform 620 is connected to the robot through the support arm 630.

[0203] Specifically, the plated parts 1 are placed in the basket at intervals, and the suction cup 610 is inserted into the basket to absorb the plated parts 1. The suction cup 610 then transfers the absorbed plated parts 1 to the electroplating carrier 100. Fig.28 The spacing between the suction cups 610 should be adapted to the spacing between adjacent plated parts 1 in the basket, and the spacing between the suction cups 610 should also be adapted to the spacing between adjacent electroplating carriers 100. Preferably, the spacing between the suction cups 610 is equal to the spacing between adjacent plated parts 1 in the basket, and the spacing between the suction cups 610 is equal to the spacing between adjacent electroplating carriers 100.

[0204] The electroplating rack in this embodiment can refer to or quote the technical solutions or technical features in Examples 1-5. Without violating the principles of this embodiment, these embodiments can be combined with each other or appropriately improved.

[0205] Example 7

[0206] An electroplating method comprises the following steps: providing an electroplating rack, arranging a plurality of electroplating carriers 100 which are parallel to each other and spaced apart on the electroplating rack, arranging a receiving groove 110a for receiving a plated object 1 on the electroplating carrier 100, and opening an inlet and outlet of the receiving groove 110a on a side of the electroplating carrier 100 so that the inlet and outlet of the receiving groove 110a face an adjacent electroplating carrier 100;

[0207] The plated object 1 is placed into the receiving tank 110a from the inlet and outlet thereof and fixed in the receiving tank 110a;

[0208] Providing an electroplating tank 300, wherein a plurality of anode members 330 are arranged at intervals in the electroplating tank 300, so that an anode interval is formed between two adjacent anode members 330;

[0209] The electroplating carrier 100 carrying the object 1 to be plated is placed in the anode compartment to electroplate the object 1;

[0210] After the electroplating is completed, the electroplating carrier 100 carrying the object 1 to be plated is taken out from the anode compartment, and the object 1 to be plated is taken out from the inlet and outlet of the containing tank 110 a.

[0211] The inlet and outlet of the receiving tank 110a are opened on the side of the electroplating carrier 100, so that the plated object 1 can enter and exit the receiving tank 110a as a whole from the side of the electroplating carrier 100, rather than from the top or bottom of the electroplating carrier 100, thereby avoiding the process of inserting or withdrawing the plated object 1 from the receiving tank 110a, avoiding the friction between the plated object 1 and the electroplating carrier 100, and reducing the risk of fragments. In addition, when multiple electroplating carriers 100 are loaded synchronously, when multiple plated objects 1 enter and exit the receiving tank 110a synchronously from the top or bottom of the electroplating carrier 100, the inlet and outlet (socket) on the top or bottom of the electroplating carrier 100 is small, and it is difficult for multiple plated objects 1 to align with the corresponding inlet and outlet on the top or bottom of the multiple electroplating carriers 100 at the same time, while the inlet and outlet on the side of the electroplating carrier 100 is large, and it is easy for multiple plated objects 1 to align with the corresponding inlet and outlet on the side of the multiple electroplating carriers 100 at the same time.

[0212] In some embodiments, an opening and closing assembly 130 is disposed near the inlet and outlet of the receiving groove 110a, so that when the opening and closing assembly 130 is closed, the inlet and outlet of the receiving groove 110a are partially blocked, and when the opening and closing assembly 130 is opened, the inlet and outlet of the receiving groove 110a are exposed; after the opening and closing assembly 130 is opened, the plated object 1 is placed in the inlet and outlet of the receiving groove 110a and fixed in the receiving groove 110a, and then the opening and closing assembly 130 is closed. By partially blocking the inlet and outlet of the receiving groove 110a, the edge of the plated object 1 can be blocked, the strength of the edge electric field of the plated object 1 is reduced, and the uniformity of electroplating of the plated object 1 is improved.

[0213] In some embodiments, a first rotating shaft 132 is rotatably set at the edge of the accommodating groove 110a, and a second supporting member 133 is fixedly set on the first rotating shaft 132. The second supporting member 133 is rotated into the accommodating groove 110a to abut against the plated object 1 in the accommodating groove 110a, so as to fix the plated object 1 in the accommodating groove 110a; a conductive clip 140 is set on each electroplating carrier 100, and the conductive lead 2 on the plated object 1 is conductively clamped by the conductive clip 140; wherein the conductive clip 140 includes an operating component 143 for controlling itself to open or close; a first switching mechanism is provided, the first switching mechanism is connected to all the first rotating shafts 132, and all the first rotating shafts 132 are driven to rotate by the first switching mechanism, so that the opening and closing assembly 130 switches between the open state and the closed state; a second switching mechanism is provided, the second switching mechanism is connected to all the conductive clips 140, and all the operating components 143 are driven to rotate by the second switching mechanism, so that the conductive clip 140 switches between the open state and the closed state.

[0214] The second support member 133 is rotated into the receiving groove 110a to abut against the workpiece 1 in the receiving groove 110a to fix the workpiece 1 in the receiving groove 110a, so that the position of the workpiece 1 in the receiving groove 110a remains relatively fixed, which can reduce the risk of displacement of the workpiece 1 during the process of the electroplating carrier 100 entering and exiting the electroplating tank 200 and during the electroplating process, and can improve the accuracy of electroplating of the workpiece 1.

[0215] In some embodiments, a conductive clamping mechanism 400 is provided, which includes a first clamping portion and a second clamping portion, at least one of which is a conductive clamping portion, and a conductive contact 413 and a first sealing member 414 surrounding the conductive contact 413 are provided on the clamping end of the conductive clamping portion; the clamping end of the first clamping portion and the clamping end of the second clamping portion respectively abut against two sides of the workpiece 1 to be plated to clamp the workpiece 1; the first sealing member 414 surrounding the conductive contact 413 abuts against one side of the workpiece 1 to be plated to form a sealed space, and the conductive contact 413 abuts against the conductive point of the workpiece 1 to be plated. The conductive contact 413 is sealed in a sealed space, which can isolate the plating liquid to prevent the plating liquid from entering the sealed space to electroplate the conductive contact 413 and the conductive points of the plated workpiece 1. In this way, the conductive contact 413 can be prevented from being electroplated during the electroplating process of the plated workpiece 1. The conductive contact 413 and the plated workpiece 1 will not stick together due to the electroplating, thereby preventing the plated workpiece 1 from being damaged. In addition, there is no need to de-plate the conductive contact 413, which saves the de-plating time and improves the plating efficiency of the electroplating equipment.

[0216] In some embodiments, a material loading and adsorption device is provided, which includes a plurality of suction cups 610 arranged at intervals and parallel to each other; a plurality of plated parts 1 are placed in a flower basket at intervals, so that the plurality of suction cups 610 are inserted into the flower basket to adsorb the corresponding plurality of plated parts 1; the plurality of suction cups 610 adsorbing the plated parts 1 are inserted into the intervals of a plurality of electroplating carriers 100 one by one; and the plurality of suction cups 610 respectively place the plated parts 1 adsorbed therein into a plurality of receiving grooves 110a one by one. By cooperating with the flower basket and the electroplating carrier 100 in sequence, the plurality of plated parts 1 in the flower basket can be transferred to the electroplating carrier 100 at one time, thereby improving the efficiency of loading and unloading the plated parts 1.

[0217] In some embodiments, the anode interval is set to extend along a preset direction; after the electroplating carrier 100 carrying the plated object 1 is placed in the anode interval, the electroplating carrier 100 is moved along the preset direction and / or the electroplating solution is made to flow along the preset direction. The plated object 1 is located in the moving electroplating carrier 100 or the plated object 1 is located in the flowing electroplating solution, which can maintain the concentration of the electroplating solution near the plated object 1, thereby improving the uniformity of electroplating of the plated object 1.

[0218] The prior art directly contacts the workpiece 1 through the electroplating carrier 100 or the conductive clip 140, so that part of the area on the electroplating carrier 100 or the conductive clip 140 is electroplated, resulting in adhesion between the workpiece 1 and the electroplating carrier 100 or the conductive clip 140, which is easy to damage the workpiece 1 when the workpiece 1 is unloaded. In addition, the electroplating carrier 100 or the conductive clip 140 needs to be de-plated regularly to avoid affecting the magnitude of the electroplating current. Therefore, in some embodiments, the conductive lead 2 is connected to the workpiece 1 by bonding, and after the electroplating is completed, the electroplated conductive lead 2 on the workpiece 1 is torn off, and the torn conductive lead 2 is recycled as a loss part; this avoids the problem of the electroplating carrier 100 or the conductive clip 140 being electroplated, and there is no need to de-plating the electroplating carrier 100 or the conductive clip 140 regularly. The conductive lead 2 is a flexible structure, such as a conductive tape, and its contact area with the plated object 1 is small, so that the area where the conductive lead 2 and the plated object 1 are electroplated and adhered is small, and the conductive lead 2 is easy to be torn off.

[0219] The electroplating rack in this embodiment can refer to or quote the technical solutions or technical features in Examples 1-5, and the electroplating equipment and components involved in this embodiment can refer to or quote the technical solutions or technical features in Example 6. Without violating the principles of this embodiment, these embodiments can be combined with each other or appropriately improved.

[0220] It should be noted that the plated object 1 in the above embodiment can be a photovoltaic cell, a PCB or a chip, and the above-mentioned electroplating rack, electroplating equipment and electroplating method can be used for the electroplating of cells, PCBs or chips, and is particularly suitable for the electroplating of grid lines on photovoltaic cells.

[0221] It should be noted that when a component extends along the X direction, it means that the size of the component in the X direction is larger. For example, when the component is a rod, the X direction is the length direction of the rod; when the component is a thin sheet structure, the X direction is the length or width direction of the thin sheet structure, not the thickness direction.

[0222] It should be noted that the X direction, the Y direction and the Z direction may be approximately perpendicular to each other, for example, the angle between the X direction and the Y direction is 85 degrees to 95 degrees.

[0223] It should be noted that the X direction, the Y direction, and the Z direction are not fixed directions, and can be a series of directions within a certain deviation range. For example, the angle between the first rotating shaft 132 on the first electroplating carrier 100 and the Z direction is 1 degree, and the angle between the first rotating shaft 132 on the second electroplating carrier 100 and the Z direction is 0.3 degrees. It can be considered that the first rotating shaft 132 on the first electroplating carrier 100 and the first rotating shaft 132 on the second electroplating carrier 100 both extend along the Z direction.

[0224] It should be noted that the "vertical" and "parallel" involved in the above embodiments refer to the geometric relationship within the manufacturing deviation range. For example, all the electroplating carriers 100 on the same electroplating rack are parallel to each other, that is, the electroplating carrier 100 is viewed as a sheet structure, and assuming that the angle between the first electroplating carrier 100 and the second electroplating carrier 100 is 2 degrees, it is still considered that the first electroplating carrier 100 and the second electroplating carrier 100 are parallel.

[0225] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An electroplating rack, characterized in that: It includes a mounting platform and a plurality of electroplating carriers installed on the mounting platform; The electroplating carriers are suspended on the mounting platform, adjacent electroplating carriers are spaced apart, and two adjacent electroplating carriers are parallel and aligned; The electroplating carrier comprises a bearing body, a plated piece fixing device and a plated piece conducting device, and the bearing body is provided with a receiving groove for receiving the plated piece along its thickness direction; The plated object fixing device is used to fix the plated object contained in the containing tank; The plated object conductive device is used for electrically connecting the plated object accommodated in the accommodating groove.

2. The electroplating rack according to claim 1, characterized in that: The bearing body is provided with an opening and closing assembly, and when the opening and closing assembly is opened, the notch of the receiving groove is exposed so that the plated object can enter and exit the receiving groove, and when the opening and closing assembly is closed, the plated object can be fixed in the receiving groove; The opening and closing assembly is formed as a fixing device for the plated part.

3. The electroplating rack according to claim 2, characterized in that: A first support is fixedly arranged in the receiving groove; the opening and closing assembly comprises a first rotating shaft rotatably connected to the bearing body, and a second support is fixedly arranged on the first rotating shaft; when the opening and closing assembly is opened, the second support is located outside the receiving groove, and when the opening and closing assembly is closed, the protruding end of the second support is located in the receiving groove; in the working state, when the opening and closing assembly is closed, the first support and the second support can respectively abut against two sides of the plated object to fix the plated object; Alternatively, the opening and closing assembly includes a first rotating shaft rotatably connected to a carrying body, and a second support member is fixedly arranged on the first rotating shaft; when the opening and closing assembly is opened, the second support member is located outside the accommodating groove, and when the opening and closing assembly is closed, the protruding end of the second support member is located in the accommodating groove; in a working state, when the opening and closing assembly is closed, the second support member presses the plated member against the bottom wall of the accommodating groove to fix the plated member.

4. The electroplating rack according to claim 3, characterized in that: A first mounting member extending away from the inner wall is provided on the inner wall of the accommodating groove, and the first support member is fixedly provided on the first mounting member; and / or a second mounting member is fixedly provided on the first rotating shaft, and the second mounting member is provided along the radial direction of the first rotating shaft and extends in a direction away from the first rotating shaft, and a second support member is fixedly provided on the second mounting member.

5. The electroplating rack according to claim 3, characterized in that: A first mounting member extending away from the inner wall is provided on the inner wall of the accommodating groove, and a plurality of the first supporting members are fixedly provided on the first mounting member; a second mounting member is fixedly provided on the first rotating shaft, and the second mounting member is extended along the radial direction of the first rotating shaft and in the direction away from the first rotating shaft, and a plurality of second supporting members are fixedly provided on the second mounting member; the number of the first supporting members and the second supporting members are equal and are arranged one-to-one; when the opening and closing assembly is closed, the supporting point or supporting surface of each of the second supporting members and the corresponding supporting point or supporting surface of the first supporting member are arranged to abut against each other or to be spaced apart by a preset gap, and the width of the preset gap is less than or equal to the thickness of the plated part.

6. The electroplating rack according to claim 3, characterized in that: The supporting point or the supporting surface of the first supporting member is made of flexible material; and / or the supporting point or the supporting surface of the second supporting member is made of flexible material.

7. The electroplating rack according to claim 1, characterized in that: A first shielding component is provided on the carrier body for shielding the edge of the first surface of the plated workpiece during the electroplating process; and / or the opening and closing assembly includes a first rotating shaft rotatably connected to the carrier body, and a second shielding component is provided on the first rotating shaft for shielding the edge of the second surface of the plated workpiece during the electroplating process.

8. The electroplating rack according to claim 7, characterized in that: A first mounting member extending away from the inner wall is provided on the inner wall of the accommodating groove, the first supporting member is fixedly provided on the first mounting member, and the first mounting member is formed as a first shielding member; and / or a second mounting member is fixedly provided on the first rotating shaft, the second mounting member is provided along the radial direction of the first rotating shaft and extends in the direction away from the first rotating shaft, a second supporting member is fixedly provided on the second mounting member, and the second mounting member is formed as a second shielding member.

9. The electroplating rack according to any one of claims 1 to 8, characterized in that: A first conductive block is arranged on one side of the upper frame of the carrier body facing the entrance direction of the accommodating groove; a conductive clip is arranged on the upper frame of the carrier body, and the conductive clip can connect the conductive lead on the plated object to the first conductive block; the conductive clip forms a conductive device for the plated object.

10. The electroplating rack according to claim 9, characterized in that: The conductive clamp includes a support, a second rotating shaft, an operating component and a clamping component. The support is fixedly arranged on the upper frame, the second rotating shaft is rotatably arranged on the support, and the operating component and the clamping component are both fixedly connected to the second rotating shaft, so that the operating component, the clamping component and the second rotating shaft can rotate synchronously; when in use, the operating component is rotated to drive the clamping component to abut the conductive lead against the first conductive block.

11. The electroplating rack according to claim 10, characterized in that: The conductive clamp also includes a torsion spring, which is sleeved on the second rotating shaft, one torsion arm of the torsion spring is fixedly connected to the support, and the other torsion arm of the torsion spring is fixedly connected to any one of the second rotating shaft, the operating component and the clamping component; the torsion spring can force the clamping component to approach or move away from the first conductive block.

12. The electroplating rack according to claim 10, characterized in that: The clamping component includes a rotating connector rotatably connected to the second rotating shaft, and an abutting connector connected to the rotating connector. The abutting connector is connected to the rotating connector through a connecting pin, and a second conductive block is symmetrically arranged on the abutting connector with the connecting pin as a symmetry axis.

13. The electroplating rack according to claim 1, characterized in that: Includes any of the following structures or their combination: (a) a guide surface is provided on the lower side wall of the receiving groove, and the guide surface is a chamfer on the lower side wall of the receiving groove; (b) a guide hole is provided on the lower side wall of the receiving groove, and the guide hole passes through the lower frame of the bearing body in the up-down direction, or the lower frame of the bearing body is a hollow structure; (c) a liquid-repellent coating is provided on the surface of the carrier body; (d) A mounting protrusion is provided on the lower side wall of the accommodating groove, and a slot extending along the direction is provided on the mounting protrusion, and the mounting protrusion is formed as a fixing device for the plated part.

14. The electroplating rack according to any one of claims 1 to 8 and 13, characterized in that: A conductive clamping mechanism is arranged above the carrier body, the conductive clamping mechanism comprises a first clamping portion and a second clamping portion, at least one of the first clamping portion and the second clamping portion is a conductive clamping portion, and a conductive contact and a first sealing member arranged outside the conductive contact are arranged on the clamping end of the conductive clamping portion; In the working state, the clamping end of the first clamping part and the clamping end of the second clamping part respectively abut against two sides of the plated workpiece to clamp the plated workpiece; the first sealing member arranged outside the conductive contact abuts against one side of the plated workpiece to form a sealed space, and the conductive contact abuts against the conductive point of the plated workpiece; The conductive clamping mechanism is formed as a conductive device for the plated part.

15. The electroplating carrier according to claim 14, characterized in that: The conductive contact is a retractable structure.

16. The electroplating carrier according to claim 14, characterized in that: The conductive clamping portion includes a clamping seat, a first countersunk hole is provided on the top of the clamping seat, a first mounting hole is provided on a side wall of the clamping seat facing the plated workpiece, the conductive contact is provided in the first mounting hole and partially extends out of the first mounting hole, the first countersunk hole is connected to the first mounting hole, a conductive connecting member is provided in the first countersunk hole, and one end of the conductive connecting member is mechanically and electrically connected to the conductive contact.

17. The electroplating carrier according to claim 16, characterized in that: The conductive contact includes a mounting seat and a telescopic member, the mounting seat is provided with a second mounting hole, a compressible medium or an elastic member is provided in the second mounting hole, one end of the telescopic member is provided in the second mounting hole and abuts against the compressible medium or the elastic member, and the other end of the telescopic member extends out of the second mounting hole; the telescopic member is slidably connected to the second mounting hole, and the telescopic member is electrically connected to the mounting seat.

18. The electroplating carrier according to claim 14, characterized in that: When the first clamping portion or the second clamping portion is an insulating clamping portion, an elastic abutting piece is protrudingly provided on the clamping end of the insulating clamping portion.

19. The electroplating rack according to claim 1, characterized in that: The electroplating carrier includes an opening and closing component and a conductive clip; The mounting platform is provided with a first switch mechanism and a second switch mechanism, wherein the first switch mechanism enables the opening and closing components on all electroplating carriers to switch synchronously between an open state and a closed state, and the second switch mechanism enables the conductive clips on all electroplating carriers to switch synchronously between an open state and a closed state.

20. The electroplating rack according to claim 19, characterized in that: The opening and closing assembly includes a first rotating shaft rotatably connected to the bearing body, and the first switch mechanism can drive the first rotating shaft to rotate so that the opening and closing assembly switches between an open state and a closed state.

21. The electroplating rack according to claim 20, characterized in that: The first switch mechanism comprises a first driving device and a first slide plate, wherein the driving end of the first driving device is connected to the first slide plate, a first slot is provided on the first slide plate, an upper end of the first rotating shaft is fixedly connected to a first end of a swing rod, and the first slot is engaged with a second end of the swing rod; When the first driving device drives the first slide plate to reciprocate, the first clamping groove can drive the swing rod to rotate, so that the swing rod drives the first rotating shaft to rotate, thereby opening or closing the opening and closing assembly; The first switch mechanism further includes a first elastic member, the middle portion of the swing rod is connected to one end of the first elastic member, and the other end of the first elastic member is fixedly connected to the mounting platform, so that during the reciprocating movement of the first slide plate, the second end of the swing rod always abuts against the notch of the first slot; The first switch mechanism also includes two first guide pulley groups, each of which includes a plurality of first guide pulleys, and the first guide pulleys belonging to the two first guide pulley groups respectively abut against two side surfaces of the first slide, so that the first slide can slide in a sliding area formed between the two first guide pulley groups; or, the first switch mechanism also includes a first slide rail, and the first slide is slidably connected to the mounting platform via the first slide rail.

22. The electroplating rack according to claim 19, characterized in that: The conductive clip includes an operating component that controls the opening or closing of the conductive clip; The second switch mechanism comprises a second driving device and a second slide plate, the driving end of the second driving device is connected to the second slide plate, the second slide plate is provided with a second slot, and the second slot is sleeved on the operating component; When the second driving device drives the second slide plate to move back and forth, the second clamping groove can drive the operating component to rotate, so as to close or open the conductive clip; The second switch mechanism also includes two second guide pulley groups, each of which includes multiple second guide pulleys, and the second guide pulleys belonging to the two second guide pulley groups respectively abut against two side surfaces of the second slide, so that the second slide can slide in the sliding area formed between the two second guide pulley groups.

23. The electroplating rack according to claim 19, characterized in that: The conductive clip includes an operating component that controls the opening or closing of the conductive clip; The second switch mechanism comprises a second driving device and a second slide plate, the driving end of the second driving device is connected to the second slide plate, the second slide plate is provided with a second slot, and the second slot is sleeved on the operating component; When the second driving device drives the second slide plate to move back and forth, the second clamping groove can drive the operating component to rotate, so as to close or open the conductive clip; The second slide plate is stacked on the first slide plate, the first slide plate is provided with a first avoidance hole for the avoidance operating component, and the mounting platform is provided with a second avoidance hole for the avoidance operating component.

24. An electroplating device, characterized in that: A plating tank and a plating rack as claimed in any one of claims 1 to 4, wherein a plurality of anode members parallel to each other are vertically arranged at intervals in the plating tank, and an anode interval is formed between two adjacent anode members; The electroplating rack is arranged on or above the electroplating tank, and the electroplating carriers are inserted into the anode intervals in a one-to-one correspondence.

25. An electroplating method, characterized in that: The following steps are involved: An electroplating rack is provided, and a plurality of electroplating carriers are arranged on the electroplating rack in parallel and at intervals, and a receiving slot for receiving the plated object is provided on the electroplating carrier, and the inlet and outlet of the receiving slot are opened on the side of the electroplating carrier so that the inlet and outlet of the receiving slot face the adjacent electroplating carrier; Put the plated object into the receiving tank from the inlet and outlet of the receiving tank and fix it in the receiving tank; Providing an electroplating tank, in which a plurality of anode members are arranged at intervals so that an anode interval is formed between two adjacent anode members; Placing the electroplating carrier carrying the workpiece to be plated into the anode compartment to electroplate the workpiece; After the electroplating is completed, the electroplating carrier carrying the plated parts is taken out from the anode interval, and the plated parts are taken out from the inlet and outlet of the containing tank.

26. The electroplating method according to claim 25, characterized in that: An opening and closing assembly is arranged near the inlet and outlet of the receiving groove, so that when the opening and closing assembly is closed, the inlet and outlet of the receiving groove are partially blocked, and when the opening and closing assembly is opened, the inlet and outlet of the receiving groove are exposed; After the opening and closing assembly is opened, the plated object is placed into the receiving tank from the inlet and outlet of the receiving tank and fixed in the receiving tank, and then the opening and closing assembly is closed.

27. The electroplating method according to claim 26, characterized in that: A first rotating shaft is rotatably arranged at the edge of the receiving groove, and a second supporting member is fixedly arranged on the first rotating shaft, so that the second supporting member is rotated into the receiving groove and abuts against the plated member in the receiving groove, so as to fix the plated member in the receiving groove; A conductive clip is provided on each electroplating carrier, and a conductive lead on a plated object is conductively clamped by the conductive clip; wherein the conductive clip includes an operating component for controlling its own opening or closing; Providing a first switch mechanism, connecting the first switch mechanism to all the first rotating shafts, and driving all the first rotating shafts to rotate through the first switch mechanism, so that the opening and closing assembly switches between an open state and a closed state; A second switch mechanism is provided, and the second switch mechanism is connected to all the conductive clips. All the operating components are driven to rotate by the second switch mechanism, so that the conductive clips are switched between an open state and a closed state.

28. The electroplating method according to claim 25, characterized in that: A conductive clamping mechanism is provided, the conductive clamping mechanism comprising a first clamping portion and a second clamping portion, at least one of the first clamping portion and the second clamping portion is a conductive clamping portion, a conductive contact and a first sealing member surrounding the conductive contact are arranged on a clamping end of the conductive clamping portion; The clamping end of the first clamping part and the clamping end of the second clamping part respectively abut against two sides of the workpiece to be plated to clamp the workpiece to be plated; the first sealing part arranged outside the conductive contact abuts against one side of the workpiece to be plated to form a sealed space, and the conductive contact abuts against the conductive point of the workpiece to be plated.

29. The electroplating method according to claim 25, characterized in that: A material loading and adsorption device is provided, wherein the material loading and adsorption device comprises a plurality of suction cups which are arranged at intervals and parallel to each other; Placing a plurality of plated objects in a basket at intervals, so that a plurality of suction cups are inserted into the basket to absorb the corresponding plurality of plated objects; A plurality of suction cups for adsorbing the plated parts are inserted into the intervals of the plurality of electroplating carriers in a one-to-one correspondence; The plurality of suction cups respectively place the plated parts adsorbed thereon into the plurality of receiving grooves one by one.

30. The electroplating method according to claim 25, characterized in that: Setting the anode interval to extend along a preset direction; After the electroplating carrier carrying the object to be plated is placed in the anode compartment, the electroplating carrier is moved along a preset direction and / or the electroplating solution is made to flow along a preset direction.

31. The electroplating method according to claim 25, characterized in that: The conductive lead is connected to the plated object by bonding; after the electroplating is completed, the conductive lead on the plated object is torn off.

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