Air conditioning system, air conditioning method, and article manufacturing method

Abstract

The invention provides an air conditioning system, an air conditioning method and an article manufacturing method. An air conditioning system S is provided with: a heating element mounting chamber R in which a heating element N is mounted; a circulation air-conditioning unit (10) configured to adjust the temperature of exhaust heat air B2 collected from the heating element mounting chamber R to a predetermined temperature and to return the air to the heating element mounting chamber R; an air supply unit (30) configured to supply supply air B3 from the outside CR of the circulation air conditioning unit (10); an exhaust unit (40) configured to exhaust the exhaust hot air B to the outside CR of the circulation air conditioning unit (10); and an air supply or exhaust adjustment unit (50) configured to adjust an air volume of the supply air B3 and an air volume of the exhaust air B2b discharged from the exhaust unit (40) based on a temperature difference between the supply air B3 and the exhaust air B2.

Description

Technical Field

[0001] The present invention relates to an air conditioning system in a semiconductor manufacturing equipment installation room, etc. Background Art

[0002] Examples of lithography apparatus used in a lithography process for manufacturing an article such as a semiconductor device include, for example, an imprint apparatus.

[0003] Semiconductor device manufacturing equipment such as imprint equipment is housed in a semiconductor manufacturing equipment installation room provided in a clean room to precisely control temperature, humidity and air cleanliness. The semiconductor manufacturing equipment installation room is an almost sealed space whose temperature regulation management is performed independently of that of the clean room.

[0004] Japanese Unexamined Patent Application, First Publication No. H5-93542 describes an air conditioner capable of maintaining the cleanliness of indoor air without significantly changing the indoor temperature.

[0005] Semiconductor device manufacturing equipment continuously operates actuators as heating elements throughout the year. Therefore, it is necessary to effectively adjust the temperature of the semiconductor manufacturing equipment installation room to reduce the running cost.

[0006] However, in the air conditioner disclosed in Japanese Unexamined Patent Application, First Publication No. H5-93542, when the temperature in the semiconductor manufacturing equipment installation room changes significantly, the outputs of the cooler and the heater need to be increased, making it difficult to reduce the running cost. Summary of the invention

[0007] One embodiment of the present invention provides an air conditioning system, an air conditioning method, and the like that can effectively adjust the temperature of a semiconductor manufacturing equipment installation room.

[0008] An air conditioning system according to one aspect of the present invention includes: a heating element installation room in which a heating element is installed; a circulation air conditioning unit, which is configured to adjust the temperature of exhaust hot air collected from the heating element installation room to a predetermined temperature and return the air to the heating element installation room; an air supply unit, which is configured to supply supply air from outside the circulation air conditioning unit; an exhaust unit, which is configured to exhaust the exhaust hot air to the outside of the circulation air conditioning unit; and an air supply or exhaust adjustment unit, which is configured to adjust the air volume of the supply air and the air volume of the exhaust air discharged from the exhaust unit based on the temperature difference between the supply air and the exhaust hot air.

[0009] Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1is a schematic diagram of an air conditioning system according to an embodiment.

[0011] Figure 2 is a schematic diagram showing the overall configuration of an air conditioning system.

[0012] Figure 3 is a flowchart illustrating an air conditioning method according to an embodiment.

[0013] 4A to 4F A schematic diagram is used to describe a method for making an item. DETAILED DESCRIPTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. In the accompanying drawings, the same components or elements are denoted by the same reference numerals, and description thereof will be omitted.

[0015] [Air conditioning system]

[0016] Figure 1 is a schematic diagram showing an air conditioning system S according to an embodiment of the present invention.

[0017] Figure 2 is a schematic diagram showing the overall configuration of an air conditioning system.

[0018] The air conditioning system S is installed integrally with the semiconductor manufacturing equipment installation room (heating element installation room) R, and performs air conditioning (temperature adjustment) of the semiconductor manufacturing equipment installation room R.

[0019] A semiconductor manufacturing equipment installation room R and an air conditioning system S are installed in the clean room CR. The clean room (exterior) CR includes an air supply unit C1 and an exhaust system C2, and maintains the inside of the clean room CR at a constant temperature.

[0020] The air supply unit C1 includes a heating coil, a cooling coil, a HEPA filter, etc., adjusts the temperature of the external air A1 to a constant temperature, and then supplies the air to the clean room CR. The temperature-regulated air A2 is supplied to the clean room CR. The inside of the clean room CR is filled with air A2 at a temperature of 23°C. The error (accuracy) of air A2 is controlled within ±2°C.

[0021] The exhaust system C2 collects the air A2 from the clean room CR and discharges it to the outside.

[0022] In the semiconductor manufacturing equipment installation room R, a semiconductor manufacturing equipment N such as an imprinting equipment is installed. The semiconductor manufacturing equipment (heating element) N has a large number of actuators. The semiconductor manufacturing equipment N has a maximum heating value of about 2kW. As the semiconductor manufacturing equipment operates, the actuators generate heat, and the temperature inside the semiconductor manufacturing equipment installation room R rises.

[0023] The air conditioning system S supplies air of a constant temperature (temperature-regulated air B1) to the semiconductor manufacturing equipment installation room R. At the same time, the air conditioning system S collects exhaust heat (exhaust heat air B2) generated due to the operation of the semiconductor manufacturing equipment N from the semiconductor manufacturing equipment installation room R. As a result, the semiconductor manufacturing equipment installation room R maintains a constant temperature.

[0024] Note that the semiconductor manufacturing equipment installation room R is not a completely sealed space, and a part of the air inside the semiconductor manufacturing equipment installation room R (exhaust heat air B2) leaks into the clean room CR.

[0025] The air conditioning system S includes a circulation air conditioning unit 10 , an air supply unit 30 , an air exhaust unit 40 , and an air supply or exhaust adjustment unit 50 .

[0026] The circulation air conditioning unit 10 adjusts the temperature of the exhaust hot air B2 collected from the semiconductor manufacturing equipment installation room R to a predetermined temperature, and returns the temperature-adjusted air B1 to the semiconductor manufacturing equipment installation room R.

[0027] The circulation air conditioning unit 10 includes a circulation duct 11, a blower 12, a cooler 14, a heater 16, a chemical filter 17, an air supply port filter 18, and the like.

[0028] The circulation duct 11 is an air duct having one end connected to the floor of the semiconductor manufacturing equipment installation room R and the other end connected to the ceiling of the semiconductor manufacturing equipment installation room R. The cross-sectional area of ​​the circulation duct 11 is known.

[0029] The exhaust hot air B2 is sucked (collected) from the floor of the semiconductor manufacturing equipment installation room R into the circulation duct 11. The exhaust hot air B2 becomes the temperature-regulated air B1 inside the circulation duct 11. The temperature-regulated air B1 is blown (supplied) from the ceiling of the semiconductor manufacturing equipment installation room R via the circulation duct 11.

[0030] The blower 12 is arranged inside the circulation duct 11 and flows (blows) the air (temperature-regulated air B1, exhaust air B2, and mixed air B4) in the circulation duct 11. The blower 12 is arranged roughly in the middle of the path of the circulation duct 11. The blower has a heating value of, for example, about 850W.

[0031] The speed of the blower 12 is controlled by the blower inverter 13. During normal operation, the speed of the blower 12 is maintained constant and is 17 (m / s). 3 The mixed air B4 is blown out at a wind volume of / min).

[0032] The cooler 14 is arranged inside the circulation duct 11 and is located downstream of the blower 12. The cooler 14 is connected to the cooling water circulator 15 and cools the air (air B4) passing through the cooler 14.

[0033] The heater 16 is arranged inside the circulation duct 11 on the downstream side of the cooler 14. The heater 16 heats the air that has passed through the cooler 14 and has been cooled.

[0034] The air (temperature-regulated air B1) that has passed through the cooler 14 and the heater 16 is temperature-regulated to a predetermined temperature. In other words, the exhaust hot air B2 becomes the temperature-regulated air B1 through the cooler 14 and the heater 16. The temperature of the temperature-regulated air B1 is 23°C, which is regulated with an accuracy (error) of 1 / 100°C to 1 / 1000°C.

[0035] The chemical filter 17 is arranged on the downstream side of the heater 16. The chemical filter 17 removes (captures) poisonous gas and minute acidic and alkaline particles contained in the temperature-regulated air B1.

[0036] The air supply port filter 18 is arranged at a blow-off port of the temperature-regulated air provided in the ceiling of the semiconductor manufacturing equipment installation room R. The air supply port filter 18 is a ULPA filter that removes dust (contaminants) contained in the temperature-regulated air B1.

[0037] In the circulation duct 11, a supply side exhaust valve 19 is provided between the blower 12 and the cooler 14. The supply side exhaust valve (supply side exhaust unit) 19 serves as a regulating valve for regulating the air volume and air pressure of the mixed air B4 blown out from the blower 12 and flowing into the cooler 14.

[0038] The circulation air conditioning unit 10 has a plurality of sensors, specifically, three temperature gauges 21 to 23 , two pressure gauges 24 and 25 , and three flow rate gauges 26 to 28 .

[0039] The thermometer 21 is arranged near the temperature-regulated air blow-off port of the semiconductor manufacturing equipment installation room R. The thermometer 21 measures the temperature of the temperature-regulated air B1 supplied to the semiconductor manufacturing equipment installation room R.

[0040] A thermometer (first thermometer) 22 is arranged in the circulation duct 11 on the downstream side of the blower 12. The thermometer 22 measures the temperature of the mixed air B4 (exhaust hot air B2, supply air B3) blown out from the blower 12 before temperature adjustment.

[0041] Thermometer (second thermometer) 23 is arranged in circulation duct 11 upstream of blower 12. The air supply port of air supply unit 30 is arranged upstream of blower 12. Thermometer 23 measures the temperature of supply air B3 flowing from air supply unit 30 into circulation duct 11.

[0042] The pressure gauge 24 is arranged in the circulation duct 11 on the upstream side (suction side) of the blower 12. The pressure gauge 24 measures the pressure (static pressure) of the mixed air B4 sucked into the blower 12.

[0043] The pressure gauge 25 is arranged in the circulation duct 11 at the downstream side (discharge side) of the blower 12. The pressure gauge 25 measures the pressure (static pressure) of the mixed air B4 discharged from the blower 12.

[0044] The operating state of the blower 12 can be confirmed by the difference (pressure difference) in the measured values ​​of the pair of pressure gauges 24 and 25 .

[0045] The flow meter (second flow meter) 26 is arranged in the circulation duct 11, and is located on the upstream side of the blower 12. It measures the flow rate of the air (supply air B3) flowing from the air supply unit 30 into the circulation duct 11. The air volume of the supply air B3 is determined based on the flow rate of the supply air B3 and the cross-sectional area of ​​the circulation duct 11.

[0046] The flow meter (first flow meter) 27 is arranged on the most upstream side of the circulation duct 11. It measures the flow rate of the exhaust air B2 sucked into the circulation duct 11 from the floor of the semiconductor manufacturing equipment installation room R. The air volume of the exhaust air B2 is determined based on the flow rate of the exhaust air B2 and the cross-sectional area of ​​the circulation duct 11.

[0047] The flow meter (first flow meter) 28 is arranged between the flow meter 26 and the flow meter 27 in the circulation duct 11. The exhaust port 41 of the exhaust unit 40 is arranged between the flow meter 26 and the flow meter 27. The flow meter 28 measures the flow rate of the air (exhaust heat air B2) that is not discharged from the exhaust unit 40 (exhaust port 41) but continues to flow through the circulation duct 11. The air volume of the exhaust heat air B2 is determined according to the flow rate of the exhaust heat air B2 and the cross-sectional area of ​​the circulation duct 11.

[0048] Furthermore, the air volume of the exhaust hot air B2 b exhausted from the exhaust unit 40 is determined based on the difference between the measured values ​​of the flow meter 27 and the measured values ​​of the flow meter 28 (difference in flow velocity) and the cross-sectional area of ​​the circulation duct 11 .

[0049] The air supply unit 30 draws the air A2 in the clean room CR into the circulation duct 11. The air supply unit 30 is arranged slightly downstream of the blower 12.

[0050] The air supply unit 30 has an air supply port 31 whose opening degree can be adjusted. The air supply unit 30 adjusts the air volume of the air A2 (supply air B3) sucked into the circulation duct 11 according to the opening degree of the air supply port 31. A chemical filter 32 is arranged in the air supply port 31.

[0051] The air A2 passes through the chemical filter 32, becomes the supply air B3, and flows into the circulation duct 11. The supply air B3 is mixed with the air (exhaust heat air B2) that continues to flow through the circulation duct 11.

[0052] As described above, a portion of the air (exhaust air B2) in the semiconductor manufacturing equipment installation room R leaks into the clean room CR. Therefore, during normal operation, the air supply port 31 of the air supply unit 30 is always open to continuously draw the supply air B3 into the circulation duct 11.

[0053] During normal operation (in normal operation mode), the air volume of supply air B3 is 5.0 (m 3 / min).

[0054] In the energy-saving operation mode, the air supply unit 30 can further increase the opening of the air supply port 31 to inhale a large amount of supply air B3. In the energy-saving operation mode, the air volume of the supply air B3 is 7.5 (m 3 / min).

[0055] The exhaust unit 40 is arranged on the upstream side of the air supply unit 30. The exhaust unit 40 exhausts (discharges) a part of the exhaust air B2 (exhaust air B2b) collected from the floor of the semiconductor manufacturing equipment installation room R to the outside of the circulation duct 11.

[0056] The exhaust unit 40 has a blower 42 and an exhaust port 41 (exhaust valve) that can be opened and closed. The exhaust unit 40 opens the exhaust port 41 and drives the blower 42 to forcibly exhaust a portion of the exhaust hot air B2 (exhaust hot air B2b) into the clean room CR.

[0057] During normal operation, the exhaust port 41 of the exhaust unit 40 is always closed. When the air supply unit 30 sucks a large amount of supply air B3, the exhaust unit 40 operates. That is, the exhaust unit 40 operates in an energy-saving operation mode.

[0058] The exhaust unit 40 exhausts the exhaust hot air B2 (exhaust hot air B2b) to the outside in accordance with the increase in the amount of air (supply air B3) sucked from the air supply unit 30. The air volume of the exhaust hot air B2b is 2.5 (m 3 / min), which is the same amount as the increase in the amount of the supplied air B3.

[0059] The supply air or exhaust air conditioning unit 50 has an air conditioning control unit 51 and controls the air conditioning system S in an integrated manner.

[0060] The air conditioning control unit 51 controls the blower 12 (blower inverter 13), the cooler 14 (cooling water circulator 15), and the heater 16. The air conditioning control unit 51 also controls the air supply port 31 of the air supply unit 30, and the exhaust port 41 and the blower 42 of the exhaust unit 40.

[0061] The air conditioning control unit 51 controls the blower 12 and the like based on the measured values ​​of the thermometers 21 to 23 , the pressure gauges 24 and 25 , and the flow rate meters 26 to 28 .

[0062] For example, the air conditioning control unit 51 determines the temperature difference between the supply air B3 and the exhaust hot air B2 based on the measurement value of the thermometer 22 and the measurement value of the thermometer 23. Then, in the case where the temperature difference is large, the air conditioning control unit 51 increases the suction amount of the supply air B3. Specifically, the air conditioning control unit 51 increases the rotation speed of the blower 12. At the same time, the opening of the air supply port 31 is enlarged, and the exhaust port 41 and the blower 42 are operated.

[0063] Then, the air volume of the supply air B3 supplied from the air supply unit 30 and the air volume of the exhaust hot air B2 exhausted from the exhaust unit 40 are adjusted. The air conditioning control unit 51 reduces the running cost of the air conditioning system S by sucking the cool air (supply air B3) into the circulation duct 11.

[0064] [Air conditioning method]

[0065] Figure 3 is a flowchart illustrating an air conditioning method according to an embodiment.

[0066] In the air conditioning system S, the air conditioning control unit 51 controls the cooler 14 and the heater 16 based on the measured value of the thermometer 21. The temperature of the temperature-regulated air B1 supplied to the semiconductor manufacturing equipment installation room R is maintained constant with high accuracy. Specifically, the temperature of the temperature-regulated air B1 is maintained at 23°C, and the temperature is regulated (controlled) with an accuracy of 1 / 100°C to 1 / 1000°C.

[0067] This temperature adjustment control is always performed when the air conditioning system S is operating.

[0068] (Step S1: Circulation Air Conditioning Process (Step))

[0069] First, the air conditioning system S is operated in a normal operation mode (temperature adjustment).

[0070] In normal operation mode, the blower 12 maintains 17 (m 3 The mixed air B4 blown out from the blower 12 passes through the cooler 14 and the heater 16 and becomes the temperature-controlled air B1. The temperature-controlled air B1 is heated to 17 (m 3 / min) is supplied to the semiconductor manufacturing equipment installation room R.

[0071] 12.5(m 3 The exhaust air B2 is collected from the semiconductor manufacturing equipment installation room R at an air volume of 100 rpm. The exhaust port 41 of the exhaust unit 40 is closed, and all the exhaust air B2 is sent toward the blower 12.

[0072] The air supply unit 30 sucks the supply air B3 from the air supply port 31. The air volume of the supply air B3 is 5.0 (m 3 The mixed air B4 obtained by mixing and agitating the supply air B3 and the exhaust hot air B2 is sucked into the blower 12.

[0073] As described above, the semiconductor manufacturing equipment N in the semiconductor manufacturing equipment installation room R has a maximum heating value of about 2 kW. Therefore, if the semiconductor manufacturing equipment N continues to operate at an output of 50%, the temperature of the exhaust air B2 is calculated to be 26.3° C. If the semiconductor manufacturing equipment N continues to operate at an output of 100%, the temperature of the exhaust air B2 is calculated to be 29.6° C.

[0074] For example, when the temperature of the air A2 in the clean room CR is 21° C., the temperature of the supply air B3 becomes 23.5° C. due to the influence of heat adsorbed to the chemical filter 32 and the like. When the temperature of the air A2 is 25° C., the temperature of the supply air B3 is 27.5° C. The temperature of the supply air B3 is measured by the thermometer 23.

[0075] When the exhaust air B2 has a temperature of 29.6° C. and the supply air B3 having a temperature of 23.5° C. is sucked from the air supply unit 30 and mixed and agitated with the exhaust air B2 , the temperature of the mixed air B4 on the downstream side of the blower 12 is 30.2° C. The temperature of the mixed air B4 is measured by the thermometer 22 .

[0076] In order to cool the temperature of the mixed air B4 to 23° C., it is necessary to increase the output of the cooler 14 .

[0077] (Step S2)

[0078] The air-conditioning control unit 51 determines whether to shift to the energy-saving operation mode.

[0079] The thermometer 23 continuously measures the temperature of the air (supply air B3) flowing from the air supply unit 30 into the circulation duct 11. When the temperature of the supply air B3 is lower than the temperature of the exhaust hot air B2, the air conditioning control unit 51 determines to switch to the energy-saving operation mode. That is, the air conditioning control unit 51 determines to switch to the energy-saving operation mode based on the temperature difference between the supply air B3 and the exhaust hot air B2.

[0080] More specifically, when the air volume of the supply air B3 is 5.0 (m 3 / min) and the temperature is 25.5°C, and the air volume of the exhaust hot air B2 is 15 (m 3 / min) and the temperature is 29.6℃ as the basis to determine whether to switch to the energy-saving operation mode.

[0081] Specifically, a total value (determined value) of the product of the air volume and the temperature of each of the supply air B3 and the exhaust hot air B2 is determined.

[0082] (determined value) = 5x25.5 + 15x29.6 = 571.5

[0083] The value of the determined value is set as a threshold value.

[0084] For example, when the air volume of the supply air B3 is 7.5 (m 3 / min), the temperature is 23.7℃, and the air volume of exhaust hot air B2 is 12.5 (m 3 / min), and when the temperature is 31°C, the total value (determined value) of the air volume and temperature is as follows.

[0085] (determined value) = 7.5 x 23.7 + 12.5 x 31 = 556.2

[0086] The determination value at this time falls below the threshold value. Therefore, the air conditioning control unit 51 determines to shift to the energy-saving operation mode.

[0087] On the other hand, when the determination value exceeds the threshold value, the air-conditioning control unit 51 returns to step S1 and maintains the normal operation mode.

[0088] (Step S3)

[0089] When shifting to the energy-saving operation mode, the air-conditioning control unit 51 instructs the blower 12 to increase its output (change its output).

[0090] (Step S4)

[0091] Next, the air conditioning control unit 51 monitors the operating state of the blower 12 based on the difference (difference in air pressure) in the measured values ​​of the pressure gauge 24 and the pressure gauge 25. In other words, it confirms the output state of the blower 12. If the difference in the measured values ​​of the pressure gauge 24 and the pressure gauge 25 is large, it can be confirmed that the blower 12 is operating to increase its output.

[0092] On the other hand, if the difference between the measured values ​​of the pressure gauge 24 and the pressure gauge 25 is not large, the process returns to step S3 and instructs the blower 12 to increase the output again.

[0093] (Step S5: Gas Supply Processing, Exhaust Processing (Step))

[0094] Then, the air conditioning control unit 51 instructs the air supply unit 30 to increase the opening of the air supply port 31. This causes the air volume (supply air volume) of the supply air B3 to increase from 5 (m 3 / min) increased to 7.5 (m 3 / min).

[0095] At the same time, the air conditioning control unit 51 instructs the exhaust unit 40 to open the exhaust port 41 and operate the blower 42. The exhaust hot air B2 (exhaust hot air B2b) is exhausted to the outside by an amount equal to the increase in the air volume of the supply air B3. That is, the exhaust hot air B2b is discharged at 2.5 (m 3 The air volume of 1000 t / min) is forcibly discharged from the exhaust port 41.

[0096] (Step S6: Air Supply or Exhaust Adjustment Process (Step))

[0097] The supply or exhaust air conditioning unit 50 makes the volume of the exhaust air B2b equal to the increase in the volume of the supply air B3. That is, the supply or exhaust air conditioning unit 50 balances the increase in the volume of the supply air B3 with the volume of the exhaust air B2b (supply / exhaust conditioning).

[0098] The air conditioning control unit 51 controls the cooler 14 based on the measured value of the thermometer 21. When the temperature of the mixed air B4 is 28.6°C, the mixed air B4 is cooled by the cooler 14 and lowered to 23°C.

[0099] When the temperature of the temperature-regulated air B1 becomes 23°C or lower due to the overcooling by the cooler 14, the mixed air B4 is heated by the heater to raise the temperature-regulated air B1 to 23°C.

[0100] The temperature of the air A2 in the clean room CR and the heat generation of the semiconductor manufacturing equipment N continuously change. In other words, the temperature of the supply air B3 and the exhaust air B2 also change. For this reason, the air conditioning control unit 51 continuously controls the cooler 14 and the heater 16 so that the temperature of the temperature-regulated air B1 is constant at 23°C.

[0101] Then, the process returns to step S2, and the above-mentioned processing is performed again.

[0102] In the normal operation mode of the air conditioning system S, when the maximum heat generation of the semiconductor manufacturing equipment N is about 2 kW, the air volume of the exhaust hot air B2 is 12.5 (m 3 / min) and the temperature was 31.0°C.

[0103] In the energy-saving operation mode, when the temperature of the air A2 in the clean room CR is 22°C, the air is heated at 7.5 (m 3The air A2 is sucked from the air supply port 31 at an air volume of 1.25 W / min), and the temperature of the supply air B3 having passed through the chemical filter 32 becomes 23.7°C.

[0104] As a result, the temperature of the mixed air B4 on the upstream side of the blower 12 becomes 28.2° C. The temperature of the mixed air B4 on the upstream side of the blower 12 becomes 30.4° C.

[0105] Therefore, the amount of work done by the cooler 14 is the temperature difference of 7.4° C. between the temperature-regulated air B1 (23° C.) and the mixed air B4 (30.4° C.).

[0106] On the other hand, in the conventional air conditioning system (only in the normal operation mode), when the maximum heating value of the semiconductor manufacturing equipment N is about 2 kW, the air volume of the exhaust hot air B2 is 15.0 (m 3 / min) and the temperature was 29.6°C.

[0107] When the temperature of the air A2 in the clean room CR is 22°C, the 3 The temperature of the supply air B3 obtained by sucking the air A2 having a wind volume of 1 / min) from the air supply port 31 and having passed through the chemical filter 32 is 24.5°C.

[0108] As a result, the temperature of the mixed air B4 on the upstream side of the blower 12 becomes 28.3° C. The temperature of the mixed air B4 on the upstream side of the blower 12 is 30.52° C.

[0109] Therefore, the amount of work done by the cooler 14 is the temperature difference of 7.52° C. between the temperature-regulated air B1 (23° C.) and the mixed air B4 (30.52° C.).

[0110] In the air conditioning system S, the heat treated by the chiller 14 is 3109.1 (W / year) throughout the year. When the heat is converted into electrical energy, it is approximately 27235.7 kWH.

[0111] In a conventional air conditioning system (only in normal operation mode), the heat is 3161.7 (W / year). When the heat is converted into electrical energy, it is approximately 27696.5 kWH.

[0112] In this way, according to the air-conditioning system S, the energy saving effect per year is 460.7 kWH.

[0113] In this manner, the air conditioning system S adjusts the volume of the supply air B3 supplied from the air supply unit 30 and the volume of the exhaust air B2 b exhausted from the exhaust unit 40 based on the temperature difference between the supply air B3 and the exhaust air B2 .

[0114] By drawing cool air (supply air B3) into the circulation duct 11 and exhausting a portion of hot air (exhaust hot air B2b) from the circulation duct 11, the operating cost of the air conditioning system S can be reduced.

[0115] <Examples related to article manufacturing methods>

[0116] The article manufacturing method according to this embodiment is suitable for manufacturing articles, such as micro devices of semiconductor devices and elements with fine structures. The article manufacturing method of this example includes: a process of forming a pattern on a composition applied to a substrate using the above-mentioned imprinting equipment (semiconductor manufacturing equipment N) (a process of processing on a substrate), and a process of processing a substrate on which a pattern is formed by the process. In addition, this manufacturing method includes other well-known processes (oxidation, deposition, evaporation, doping, planarization, etching, composition stripping, cutting, bonding, packaging, etc.). Compared with traditional methods, the article manufacturing method of this example is advantageous in at least one of article performance, quality, productivity and production cost.

[0117] The pattern of the cured product molded using the imprinting equipment (semiconductor manufacturing equipment N) is permanently used on at least some of the various articles, or is temporarily used when manufacturing various articles. The articles are circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, or MRAM, and semiconductor elements such as LSI, CCD, image sensor, or FPGA. Examples of molds include molds for substrate processing such as imprinting.

[0118] The pattern of the cured product may be used as it is as a component of at least a portion of an article, or may be temporarily used as a composition mask. After etching, ion implantation, etc. are performed in a substrate processing process, the composition mask is removed.

[0119] Next, we will refer to 4A to 4F To describe the specific method used to make an item. Figure 4A As shown, a substrate 1z such as a silicon substrate on which a workpiece 2z such as an insulator is formed is prepared, and then a composition 3z is applied to the surface of the workpiece 2z by an inkjet method, etc. Here, a state in which a plurality of droplet-shaped compositions 3z are applied to the substrate 1z is shown.

[0120] like Figure 4B As shown, the mold 4z has a side with a concavo-convex pattern formed thereon, facing the composition 3z on the substrate 1z. Figure 4CAs shown, the substrate 1z coated with the composition 3z is brought into contact with the mold 4z, and pressure is applied (contact process). The composition 3z is filled into the gap between the mold 4z and the workpiece 2z. In this state, when light as energy for curing is emitted through the mold 4z, the composition 3z is cured (curing process). At this time, in this example, the composition can be irradiated with a certain amount of light based on the spectral sensitivity characteristics obtained in the device to provide the best photopolymerization degree.

[0121] like Figure 4D As shown, after the composition 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of the cured product of the composition 3z is formed on the substrate 1z (pattern forming process, molding process). In the pattern of the cured product, the concave portion of the mold 4z has a shape corresponding to the convex portion of the cured product, that is, the concave-convex pattern of the mold 4z has been transferred to the composition 3z.

[0122] like Figure 4E As shown, when etching is performed using the pattern of the cured material as an anti-etching mask, a portion of the surface of the workpiece 2z where no cured material or a thin residual cured material is present is removed to form a groove 5z. Figure 4F As shown, when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Although the pattern of the cured material is removed here, it can be used as an interlayer insulating film, that is, a constituent member of the article included in the semiconductor element, etc., without being removed even after the process. Although an example of using a circuit pattern transfer mold provided with a concavo-convex pattern as the mold 4z has been described, a flat template having a flat portion without a concavo-convex pattern can also be used.

[0123] <Other embodiments>

[0124] Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the embodiment, and various modifications and changes can be made within the scope of its gist. In addition, the various numerical values ​​used in the above description are only examples, and the present invention is not limited to the above numerical values.

[0125] The various numerical values ​​(heat amount, temperature, air volume, etc.) described in the above embodiments are merely examples, and various modifications and changes may be made.

[0126] The semiconductor manufacturing apparatus N is not limited to the imprint apparatus, but may be any of various semiconductor manufacturing apparatuses. Furthermore, the apparatus is not limited to the semiconductor manufacturing apparatus, and may be an apparatus having a heat source.

[0127] Furthermore, the present invention is not limited to the case where the semiconductor manufacturing equipment N is accommodated in the semiconductor manufacturing equipment installation room R.

[0128] (Other embodiments)

[0129] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

[0130] This application claims the benefit of Japanese Patent Application No. 2023-118900, filed on Jul. 21, 2023, which is hereby incorporated by reference herein in its entirety.

Claims

1. An air conditioning system, comprising: a heating element installation chamber in which a heating element is installed; a circulation air conditioning unit configured to adjust the temperature of exhaust hot air collected from the heating element installation room to a predetermined temperature and return the air to the heating element installation room; an air supply unit configured to supply supply air from outside the circulation air conditioning unit; an exhaust unit configured to exhaust the exhaust hot air to the outside of the circulation air conditioning unit; as well as A supply or exhaust air adjustment unit configured to adjust the air volume of the supply air and the air volume of the exhaust air exhausted from the exhaust unit based on the temperature difference between the supply air and the exhaust hot air.

2. The air conditioning system according to claim 1, in, Supply or exhaust air conditioning units balance the volume of supply air with the volume of exhaust air.

3. The air conditioning system according to claim 2, in, The supply or exhaust air adjustment unit increases the air volume of the supply air when the heat amounts of the supply air and the exhaust air are lower than a threshold value, and makes the air volume of the exhaust air the same as the increase amount of the air volume of the supply air.

4. The air conditioning system according to claim 1, in, The air supply or exhaust conditioning unit consists of: a first thermometer configured to measure the temperature of the air before temperature adjustment, a second thermometer configured to measure the temperature of the supply air, a first flow meter configured to measure a volume of exhaust air, and A second flow meter is configured to measure a volume of the supply air.

5. The air conditioning system according to claim 1, in, Supply or exhaust air conditioning unit: A pair of pressure gauges are provided, which are configured to measure the pressure difference of air between the upstream side and the downstream side of a blower provided in the circulation air conditioning unit, Instruct the blower to change output and monitor the blower output status based on the air pressure difference.

6. The air conditioning system according to claim 1, in, A recirculating air conditioning unit supplies air to the heating element installation room through a ULPA filter.

7. The air conditioning system according to claim 1, in, The circulation air conditioning unit includes a supply-side exhaust unit that adjusts the air volume or pressure of air supplied to the heating element installation room.

8. The air conditioning system according to claim 1, in, The heating element installation chamber is installed in a clean room, and Supply air is the temperature-conditioned air in the cleanroom.

9. An air conditioning method, comprising: a circulation air conditioning step of adjusting the temperature of exhaust hot air collected from a heating element installation room where a heating element is installed to a predetermined temperature and returning the air to the heating element installation room; an air supply step for supplying supply air from the outside; An exhaust step to discharge the exhaust hot air to the outside; as well as The supply or exhaust air adjustment step adjusts the air volume of the supply air and the air volume of the exhaust air exhausted to the outside based on the temperature difference between the supply air and the exhaust hot air.

10. A method for manufacturing an article, comprising the following steps: A pattern is formed on a substrate using an imprinting device, wherein the imprinting device is installed in an air conditioning system, and the air conditioning system comprises: a heating element installation chamber in which the imprinting device is installed as a heating element; a circulation air conditioning unit that adjusts the temperature of exhaust hot air collected from the heating element installation room to a predetermined temperature and returns the air to the heating element installation room; an air supply unit that supplies supply air from outside the circulation air conditioning unit; an exhaust unit that discharges exhaust hot air to the outside of the circulation air conditioning unit; a supply or exhaust air conditioning unit that adjusts the air volume of the supply air and the air volume of the exhaust air discharged from the exhaust unit based on the temperature difference between the supply air and the exhaust hot air; as well as The substrate patterned in the previous process is processed.

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