Temperature sensor with heat dissipation function

Abstract

The invention relates to the technical field of temperature sensors, in particular to a temperature sensor with a heat dissipation function, which comprises a sensor main body, the sensor main body comprises a sensor shell and a temperature sensing device arranged in the shell, and the sensor shell comprises an upper shell at the upper part, a deformable shell at the middle part and a lower shell at the lower part; the deformable shell comprises a first deformable shell and a second deformable shell, a plurality of groups of heat dissipation pieces are also uniformly arranged along the side surface of the first deformable shell, each group of heat dissipation pieces comprises at least two heat dissipation sheets of which the adjacent surfaces are overlapped, and the sensor main body also comprises a deformation bracket; through the arrangement of the deformation support and the deformable shell, the deformation support can drive the deformable shell to be bent, the heat dissipation piece arranged on the side face of the deformable shell is formed by overlapping the multiple sets of heat dissipation pieces, when the deformable shell is bent, the heat dissipation pieces can be separated and forked, and therefore the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of temperature sensors, in particular to a temperature sensor with a heat dissipation function. Background Art

[0002] A temperature sensor is a device that can sense temperature changes and convert temperature signals into output electrical signals (such as voltage, current) or other forms of signals. Its basic principle is based on a variety of physical effects. For example, a liquid thermometer based on the principle of thermal expansion and contraction uses the change in volume of a liquid (such as mercury) when the temperature changes to indicate the temperature; while a thermistor temperature sensor works based on the property that the resistance of the material changes with temperature. When the temperature rises, the resistance value of a negative temperature coefficient (NTC) thermistor will decrease, and the resistance value of a positive temperature coefficient (PTC) thermistor will increase. The temperature can be inferred by measuring the change in resistance.

[0003] The temperature sensor needs to sense the external temperature based on the temperature sensing head, and then convert the temperature signal into an electrical signal output for the user to observe. In order to ensure that the temperature sensing head can sense the temperature normally, the sensor also needs to dissipate heat to ensure that the temperature difference between the air entering the sensor and the outside of the sensor is not too large. If the heat dissipation effect is poor, it will not only affect the detection accuracy of the sensor, but also cause problems when the temperature sensing head is used in a high temperature environment. Excessive heat dissipation will also lead to a large temperature difference between the inside and the outside. The speed at which the temperature sensing head perceives temperature may not keep up with the speed at which the ambient temperature rises, resulting in a delayed response and an inability to give accurate temperature readings in time. This is particularly important for continuous temperature measurement. However, the temperature sensor in the prior art relies on a heat dissipation groove or a protruding heat sink outside the shell to dissipate heat. The fixed heat dissipation effect cannot quickly dissipate heat in a high temperature state, which will affect the insufficient sensing accuracy of the temperature sensing head and will affect the service life of the temperature sensing head in the long run.

[0004] In view of this, in order to overcome the above technical problems, the present invention proposes a temperature sensor with heat dissipation function to solve the above technical problems. Summary of the invention

[0005] In order to make up for the shortcomings of the prior art, the present invention proposes a temperature sensor with a heat dissipation function. The present invention can achieve good air convection and rapid heat dissipation by increasing the heat dissipation area and the spacing between the heat dissipation elements. In addition, the heat dissipation element is a stacked heat sink structure, which forms an angle when unfolded for turbulence, thereby solving the problem in the prior art that the heat dissipation structure of the temperature sensor cannot be changed.

[0006] The technical solution adopted by the present invention to solve the technical problem is: A temperature sensor with a heat dissipation function comprises a sensor body, the sensor body comprises a sensor housing and a temperature sensing device arranged in the housing, the sensor housing comprises an upper housing at an upper portion, a deformable housing at a middle portion and a lower housing at a lower portion; The deformable shell includes a first deformable shell and a second deformable shell, and a plurality of heat sinks are evenly arranged along the side of the first deformable shell, each heat sink includes at least two heat sinks with overlapping adjacent surfaces, and the sensor body also includes a deformable bracket; The deformable bracket includes a first bracket with two ends arranged on the inner walls of the upper shell and the lower shell, and a second bracket embedded in the inner wall of the first deformable shell. When the temperature inside the shell rises, the second bracket will drive the plate surface of the first deformable shell to bend and unfold along the overlapping surface of the heat sink on the first deformable shell to increase the heat dissipation area.

[0007] Preferably, the temperature sensing device comprises a temperature sensing head, the lower end of the temperature sensing head is coupled to a temperature sensing element, a wire is led along the end of the temperature sensing element, and the wire is used to connect a thermistor.

[0008] Preferably, the upper shell includes a front side of the upper shell and a side side of the upper shell, and a plurality of vents are provided along the front side of the upper shell, and the air outlet positions of the vents are directly opposite to the temperature sensing head.

[0009] Preferably, the distance between two adjacent groups of heat sinks at room temperature is D1, and the distance changes to D2 at high temperature, and D2 is greater than D1.

[0010] Preferably, the heat sink comprises a first heat sink and a second heat sink, the first heat sink and the second heat sink are arranged in parallel, and the first heat sink and the second heat sink will expand as the first deformable shell bends at high temperature.

[0011] Preferably, the heat sink is a third heat sink, a fourth heat sink and a fifth heat sink, and the three groups of heat sinks are arranged in parallel at normal temperature.

[0012] Preferably, two ends of the fifth heat sink are hinged to the side surfaces of the third heat sink and the fourth heat sink respectively.

[0013] Preferably, one end of the fifth heat sink is hinged to the end of the third heat sink, and the other end is hinged to the middle of the fourth heat sink.

[0014] Preferably, the deformable bracket is a memory alloy.

[0015] The beneficial effects of the present invention are as follows: 1. The present invention is provided with a deformable bracket and a deformable shell. The deformable bracket can drive the deformable shell to bend. The heat sink arranged on the side of the deformable shell is composed of multiple groups of heat sinks. When the deformable shell is bent, the heat sinks will separate and fork, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0016] 2. When the deformable shell is bent, the present invention increases the distance between the heat sinks arranged on the side of the shell, thereby increasing the convection heat transfer coefficient and the heat dissipation efficiency.

[0017] 3. The present invention forms an acute angle by separating and forking the heat sink, and the air flow rate in the channel will change, so that the heat sink has a certain turbulent effect, increasing the residence time of cold air and the heat sink surface, and improving the efficiency of convective heat exchange. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention; Figure 3 is a schematic diagram of the first deformable shell in a normal temperature state in the first embodiment of the present invention; Figure 4 is a schematic diagram of the three-dimensional structure of the first deformable shell in a high-temperature state in the first embodiment of the present invention; Figure 5 is a schematic diagram of a first deformable shell in a high temperature state in the first embodiment of the present invention; Figure 6 is a schematic diagram of the first deformable shell in a normal temperature state in the second embodiment of the present invention; Figure 7 is a schematic diagram of a first deformable shell in a high temperature state in the second embodiment of the present invention; Figure 8 This is a schematic diagram of the deformed bracket at room temperature; Fig. 9 It is a schematic diagram of the high temperature state of the deformed bracket; Fig.10 It is a schematic diagram of the installation structure of the deformation bracket and the inner wall of the sensor housing.

[0019] In the figure: 10, sensor housing; 101, front of upper housing; 101a, vent; 102, first deformable housing; 102a, heat sink; 102a1, first heat sink; 102a2, second heat sink; 102a3, third heat sink; 102a4, fourth heat sink; 102a5, fifth heat sink; 103, lower housing; 104, second deformable housing; 105, side of upper housing; 20, temperature sensing device; 201, temperature sensing head; 202, temperature sensing element; 203, wire; 30, deformable bracket; 301, first bracket; 302, second bracket. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0021] First embodiment: like Figure 1-Figure 2 As shown, a temperature sensor with heat dissipation function described in the present invention includes a sensor body, the sensor body includes an external sensor housing 10 and an internal temperature sensing device 20, the sensor housing 10 also includes an upper housing at the upper end, a deformable housing in the middle part and a lower housing 103 at the lower end, the deformable housing can be deformed, and the upper and lower ends of the deformable housing are respectively fixedly connected to the upper housing and the lower housing 103; wherein, the upper housing includes an upper housing front 101 and an upper housing side 105, and a vent 101a for air intake is also provided along the upper housing front 101, and external air can enter the temperature sensing device 20 in the housing through the vent 101a to perform temperature measurement operation; The temperature sensing device 20 includes a temperature sensing head 201, a temperature sensing element 202 disposed at the lower end of the temperature sensing head 201, and a wire 203 disposed at the end of the temperature sensing element 202, and the wire 203 is used to connect to the thermistor; there is a gap between the temperature sensing head 201 and the top of the upper shell to prevent the upper shell from pressing the temperature sensing head 201 when deforming; The deformable shell includes a first deformable shell 102 and a second deformable shell 104. The first deformable shell 102 and the second deformable shell 104 are adjacent to each other and fixedly connected to form a cube. A plurality of heat sinks 102a are evenly arranged along the side of the first deformable shell 102 for heat dissipation. like Figure 3 As shown, the end of the heat sink 102a is fixedly arranged on the first deformable shell 102, and the inner wall of the first deformable shell 102 is also provided with a deformable bracket 30, which is a memory alloy. The memory alloy can be trained to change from straight to bent at high temperature, such as bending the alloy into a desired shape at high temperature, and then cooling it while maintaining the bent state. This process can make the alloy remember the bent shape at high temperature, and when heated again, it will return to the bent state. If the crystal structure and internal stress of the alloy are adjusted during the cooling process, so that it can become straight at low temperature, this realizes the characteristics of bending at high temperature and straightening at low temperature. Since the memory alloy is a material in the prior art, it will not be described in detail in this article. When the deformable bracket 30 is in a low temperature state, its shape is as follows Fig. 9 As shown, when in a high temperature state, the deformed bracket 30 is affected by the high temperature and returns to its original shape. Figure 8 As shown; Among them, Fig.10 As shown, the deformable bracket 30 includes a first bracket 301 fixedly mounted on the inner wall of the upper shell, and a second bracket 302 fixedly arranged on the inner wall of the first deformable shell 102. When the temperature inside the shell is too high, the second bracket 302 part will be deformed to Figure 8 In this case, the first deformable shell 102 is subjected to the action of the second bracket 302. Figure 4 or Figure 5 The bend shown; Among them, Figure 3 As shown, at normal temperature, since the second bracket 302 is not deformed, the first deformable shell 102 is in a straight plate shape, and the distance between the heat sinks 102a is D1. Figure 5 As shown, when the temperature is high, the second bracket 302 will drive the first deformable shell 102 to bend, and the spacing between the heat sinks 102a at this time is selected as D2. Due to the bending of the plate surface, D2 is greater than D1. From the perspective of convective heat transfer, when the number of heat sinks 102a remains unchanged, the distance between the heat sinks can be appropriately increased, so that the air can flow more freely between the heat sinks, thereby improving the convective heat transfer coefficient. The convective heat transfer is proportional to the convective heat transfer coefficient, so the heat dissipation efficiency is increased; when the temperature inside the shell is too high, the heat of the shell can be exported and dissipated through this structure; In addition, if Figure 5 As shown, the heat sink 102a includes two overlapping first heat sinks 102a1 and second heat sinks 102a2. When the first deformable shell 102 is bent, the overlapping surfaces of the first heat sink 102a1 and the second heat sink 102a2 are opened, so that the heat exchange area is increased. Figure 3 and Figure 5 In comparison, Figure 3 In the heat dissipation area, heat dissipation surface 1 is defined as heat dissipation surface 1, and Figure 5 Since the overlapping surfaces of the first heat sink 102a1 and the second heat sink 102a2 are separated, a new heat dissipation area will be generated, and the heat dissipation area is defined as heat dissipation surface 2. At this time, the heat dissipation area is increased, that is, the heat dissipation efficiency is improved; In addition, if Figure 5 As shown, an angle a is formed between the first heat sink 102a1 and the second heat sink 102a2, and the angle a is an acute angle. When there is a smaller angle a between the heat sinks 102a, the air will be gradually guided to change direction when flowing through the channel between the heat sinks 102a. As the air flows along the channel, the width of the channel gradually changes (due to the existence of the angle a), and the flow rate of the air will also change. This change will cause a certain amount of turbulence in the air, thereby enhancing the mixing of the air and the surface of the heat sink 102a. The air will continuously collide and mix with the surface of the heat sink 102a during the flow process, thereby also improving the efficiency of convective heat exchange; Therefore, through the deformation of the plate surface of the first heat exchange shell 102, the function of turbulence can be achieved from the heat dissipation area, air convection and the angle generated between the heat dissipation element 102a, which can greatly improve the heat dissipation efficiency and reduce the temperature inside the shell. When the temperature returns to normal, the first heat exchange shell 102 is driven by the second bracket 302 to become a straight plate surface to achieve normal heat dissipation, which can ensure that the air temperature inside and outside the shell will not be unbalanced, which is beneficial to the temperature sensing head 201 to sense the temperature of the air; Second embodiment: The difference from the first embodiment is that Figure 6-Figure 7 As shown, in order to increase the heat dissipation effect, the heat sink 102a can also be configured as a third heat sink 102a3, a fourth heat sink 102a4 and a fifth heat sink 102a5; like Figure 7 As shown, one end of the third heat sink 102a3 can be hinged to one end of the fifth heat sink 102a5, and the end of the fifth heat sink 102a5 away from the third heat sink 102a3 is hinged to the side of the fourth heat sink 102a4. When the third heat sink 102a3 and the fourth heat sink 102a4 are unfolded, the fifth heat sink 102a5 is as shown in FIG. Figure 7 As shown, the heat dissipation surface is larger and the turbulence effect is better, which is more conducive to heat dissipation; The number of groups included in the heat sink 102a of the present invention may not be limited to two or three groups as described in the embodiment. If conditions permit, the number of groups included in the heat sink 102a may be greater.

[0022] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as limiting the scope of protection of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0023] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A temperature sensor with a heat dissipation function, comprising a sensor body, the sensor body comprising a sensor housing (10) and a temperature sensing device (20) arranged in the housing, characterized in that: The sensor housing (10) comprises an upper shell at the top, a deformable shell at the middle, and a lower shell (103) at the bottom; The deformable shell comprises a first deformable shell (102) and a second deformable shell (104); a plurality of groups of heat sinks (102a) are evenly arranged along the side of the first deformable shell (102); each group of heat sinks (102a) comprises at least two heat sinks with adjacent surfaces overlapping; and the sensor body further comprises a deformable bracket (30); The deformable bracket (30) comprises a first bracket (301) with two ends arranged on the inner walls of the upper shell and the lower shell (103), and a second bracket (302) embedded in the inner wall of the first deformable shell (102); when the temperature inside the shell rises, the second bracket (302) drives the plate surface of the first deformable shell (102) to bend and expand along the overlapping surface of the heat sink on the first deformable shell (102), so as to increase the heat dissipation area.

2. The temperature sensor with heat dissipation function according to claim 1, characterized in that: The temperature sensing device (20) comprises a temperature sensing head (201), the lower end of the temperature sensing head (201) is coupled to a temperature sensing element (202), a wire (203) is led along the end of the temperature sensing element (202), and the wire (203) is used to connect a thermistor.

3. The temperature sensor with heat dissipation function according to claim 2, characterized in that: The upper shell comprises an upper shell front face (101) and an upper shell side face (105), and a plurality of ventilation openings (101a) are provided along the upper shell front face (101), wherein the air outlet positions of the ventilation openings (101a) face the temperature sensing head (201).

4. The temperature sensor with heat dissipation function according to claim 1, characterized in that: The distance between two adjacent groups of heat sinks (102a) in a normal temperature state is D1, and in a high temperature state the distance changes to D2, where D2 is greater than D1.

5. The temperature sensor with heat dissipation function according to claim 4, characterized in that: The heat sink (102a) comprises a first heat sink (102a1) and a second heat sink (102a2); the first heat sink (102a1) and the second heat sink (102a2) are arranged in parallel; the first heat sink (102a1) and the second heat sink (102a2) will expand as the first deformable shell (102) bends at high temperatures.

6. The temperature sensor with heat dissipation function according to claim 4, characterized in that: The heat sink (102a) comprises a third heat sink (102a3), a fourth heat sink (102a4) and a fifth heat sink (102a5), and the three groups of heat sinks are arranged in parallel at normal temperature.

7. The temperature sensor with heat dissipation function according to claim 6, characterized in that: Two ends of the fifth heat sink (102a5) are respectively hinged to the side surfaces of the third heat sink (102a3) and the fourth heat sink (102a4).

8. The temperature sensor with heat dissipation function according to claim 7, characterized in that: One end of the fifth heat sink (102a5) is hinged to the end of the third heat sink (102a3), and the other end is hinged to the middle of the fourth heat sink (102a4).

9. The temperature sensor with heat dissipation function according to claim 1, characterized in that: The deformable bracket (30) is a memory alloy.

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