Method, device and system for monitoring the polymerization curve of the gas composition of an enclosed switchgear

Abstract

This invention provides a method, apparatus, and system for monitoring gas component polymerization curves in enclosed switchgear, belonging to the field of monitoring technology. It includes: collecting SF6 gas decomposition product samples and feeding them into the monitoring device; the samples are mixed gases collected after simulating a fault event in a fault-generating device filled with SF6 gas and conventional internal insulating media; analyzing the decomposition components of each sample from a single fault event to determine the concentration values ​​of SO2, H2S, and CO, obtaining a time-series sequence of decomposition component data; performing curve polymerization to obtain SO2 polymerization curves, H2S polymerization curves, and CO polymerization curves; establishing the correspondence between the slope k of the curves changing over time and fault characteristics, storing it as a diagnostic reference model; collecting gas samples from the equipment under test and feeding them into the monitoring device, analyzing the decomposition components and performing curve polymerization, comparing the obtained polymerization curves with the stored diagnostic reference models to determine the fault type of the equipment under test.

Description

Technical Field

[0001] This invention relates to the field of gas insulation equipment monitoring technology, and in particular to a method, device and system for monitoring the polymerization curve of gas components in enclosed switchgear. Background Technology

[0002] SF6 gas possesses excellent chemical stability, superior insulation properties, and arc-quenching capabilities, making it suitable as an insulating gas for filling enclosed switchgear GIS (Gas Insulated Switchgear). However, uncertainties in the design, materials, manufacturing processes, and maintenance of such equipment can lead to internal defects. Under the influence of heat and electricity, these defects can expand, causing a continuous decline in insulation and ultimately resulting in a fault that compromises power production safety. Inside SF6 gas-insulated equipment, partial discharge, overheating, and poor contact can cause the SF6 to decompose and recombine, producing various types of gases. The types and rates of these decomposition products are often closely related to the type of internal fault. Furthermore, due to the significant differences in diffusion coefficients among the different gases, SF6 component analysis results can often characterize the state and fault condition of the enclosed switchgear.

[0003] Real-time detection of SF6 components can be achieved using chemical analysis methods. However, accurate chemical detection requires on-site sampling and laboratory testing. Sampling and analysis typically take some time even after the fault is confirmed. The temporal and spatial differences between the time of the fault and the time of sample testing cause changes in the composition of SF6 gas, affecting the accuracy of the detection results. Due to the excessively long analysis time, the real-time nature of the data is also significantly reduced. Furthermore, the testing process is extremely inconvenient. Summary of the Invention

[0004] In view of this, the present invention provides a method, device and system for monitoring the polymerization curve of gas components in enclosed switchgear, which supports on-site inspection, quickly detects the content of SF6 gas decomposition product components in the equipment, and can further quickly diagnose latent faults in the equipment based on a diagnostic model, thereby effectively improving the accuracy and efficiency of diagnosing latent faults in SF6 electrical equipment.

[0005] The technical solution adopted by the embodiments of the present invention to solve its technical problem is as follows:

[0006] A closed-type switchgear gas component polymerization curve monitoring device includes a top cover (2), an equipment box (1), and a base (3) connected in sequence. The equipment box (1) is composed of a U-shaped sheet metal frame (11), an inner box (12), a heat dissipation device (15), a monitoring module (124), a detection module (125), and a gas path module (126). The U-shaped sheet metal frame (11), the heat dissipation device (15), and the inner box (12) are arranged in sequence from the outside to the inside and are all fixedly installed on the base (3). The gas path module (126), the detection module (125), and the monitoring module (124) are connected in sequence and are all installed in the inner box (12).

[0007] One end of the gas circuit module (126) is connected to the charging and discharging port of the device under test via an adapter, and the other end is connected to the detection module. It is used to collect gas samples from the device under test and pump them into the detection module (125).

[0008] The detection module (125) provides a gas sensor for detecting the decomposition component data of the gas sample and sending the detection data to the monitoring module (124); the decomposition component data includes SO2, H2S and CO concentration values;

[0009] The monitoring module (124) is used to record the time sequence of the decomposition component data of the tested equipment, and further aggregate the curves with the number of cycles n as the horizontal axis and the concentration values ​​of the three components as the vertical axis to obtain the SO2 polymerization curve, H2S polymerization curve and CO polymerization curve; the obtained polymerization curves are compared with the stored diagnostic reference models to determine the fault type of the tested equipment.

[0010] During operation, the monitoring module (124), detection module (125), and gas path module (126) generate a large amount of heat. The auxiliary heat dissipation device (15) is used to dissipate heat for the monitoring module (124), detection module (125), and gas path module (126), so as to prevent the gas sensor from becoming less sensitive due to heat and improve the accuracy of the sensor data acquisition.

[0011] The monitoring module (124) is used for:

[0012] The decomposition components of each sample from a single fault event were analyzed to determine the concentrations of SO2, H2S, and CO, resulting in a time-series sequence of decomposition component data. The samples were mixed gases collected after simulating a fault event in a fault generation device filled with SF6 gas and conventional internal insulating medium, based on preset fault characteristics. The fault events included different types of discharge faults at different voltage levels and overheating faults at different temperatures. Samples from single fault events were collected periodically, with the number of collection periods n > 300 and the period interval 1h ≤ t ≤ 2h.

[0013] Furthermore, with the cycle number n as the horizontal axis and the concentration values ​​of the three components as the vertical axis, curve polymerization was performed to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve.

[0014] Obtain the time series of decomposed component data; establish the correspondence between the slope k of the curve and the fault characteristics over time, and store it as a diagnostic reference model.

[0015] Preferably, the U-shaped sheet metal frame (11) includes a left limiting plate, a rear heat dissipation plate (16) and a right limiting plate connected in sequence, and the rear heat dissipation plate (16) has a heat dissipation hole structure.

[0016] The auxiliary heat dissipation device (15) includes a left inner frame plate fixedly installed on the inner surface of the left limiting plate, a right inner frame plate installed on the inner surface of the right limiting plate, a heat dissipation component support frame, and a heat dissipation component (154).

[0017] The heat dissipation assembly (154) includes a fixed plate (1541), a rotating shaft (1543) fixedly connected to the upper part of the left and right sides of the fixed plate (1541), a connecting block (1544) rotatably connected to the lower part of the left and right sides of the fixed plate (1541), and an adjusting hole rod (1545) connected to the end of the connecting block (1544). The adjusting hole rod (1545) has a set of limiting holes, and a guide slider (1549) is fixedly installed on the adjusting hole rod (1545). N2 air guide slots (1546) are opened on the fixed plate (1541). A dust cover (1542) is installed at the opening of the air guide slot (1546) facing the rear heat dissipation plate (16), and a fixing bracket (1547) is installed at the opening of the air guide slot (1546) facing the inner box (12). An electric fan (1548) is installed on each fixing bracket (1547).

[0018] The heat dissipation component support frame is fixedly installed between the left inner frame plate and the right inner frame plate; the heat dissipation component support frame is a hollow structure, with N1 heat dissipation component mounting slots opened from top to bottom in the middle for installing N1 heat dissipation components (154); a pair of rotating shaft holes are opened on the upper part of the inner surface of the left and right sides of the heat dissipation component mounting slots, and the two rotating shafts (1543) of the heat dissipation component (154) are located on the same axis, and their ends are respectively rotatably connected to the rotating shaft holes of the heat dissipation component mounting slots; N1 through slots (153) are opened on each of the two hollow columns (155) of the heat dissipation component support frame. Located on the left and right sides of the heat dissipation component mounting slot; the through slot (153) is opened in the front-back direction; the upper inner side wall of the through slot (153) is opened with a pin through hole; a guide slide groove is opened on each of the left and right inner side walls of the through slot (153), the shape of the guide slide groove is set according to the movement trajectory of the guide slider (1549), the two adjusting hole rods (1545) are respectively placed in the through slots (153) on the left and right sides of the heat dissipation component mounting slot, and the two ends of the guide slider (1549) are respectively slidably connected to the two guide slide grooves of the through slot (153); a limit pull rod (152) is installed in each of the two hollow cylinders (155);

[0019] The limiting rod (152) comprises a pull ring (1521), a continuous right-angle loop-shaped bent rod (1522), and a pin assembly (1523). The pull ring (1521) is connected to the top of the bent rod (1522) and is located outside the hollow column (155). The bent rod (1522) comprises a vertical structure and a horizontal structure that are connected in a loop shape. The vertical structure is located on the side of the through groove (153), and the horizontal structure is located below the through groove (153). The through groove (153) is used to limit and prevent the limiting rod (152) from dislodging from the hollow column (155). The pin fixing member in the pin assembly (1523) is fixedly installed on the vertical structure of the bent rod (1522). The pin fixing member fixes the pin direction to be vertically downward and facing the pin through hole. The pin (1523) is used to insert into the limiting insertion hole of the adjusting hole rod (1545) to play a limiting role.

[0020] Lift the limit lever (152) upwards to disengage each pin (1523) from the adjustment hole rod (1545), adjust each fixing plate (1541) to the required angle, and then lower the limit lever (152) to re-engage each pin (1523) with the adjustment hole rod (1545), thereby achieving the alignment output of the fan (1548); each fan (1548) is connected to a sub-controller and is individually controlled by the sub-controller, which is installed on the fixing plate (1541); each sub-controller is connected to the monitoring module (124) and is centrally controlled by the monitoring module (124).

[0021] Preferably, the number of heat dissipation components (154) is N1≥5, one side corresponds to the heat dissipation hole opened on the casing (121), and the other side corresponds to the rear heat dissipation plate (16), forming a pumping exhaust to achieve the effect of rapid heat dissipation; the number of electric control fans (1548) on the fixing plate (1541) is N2≥3.

[0022] Preferably, N3 slide rails (13) are horizontally installed on the inner surface of the left support plate and the inner surface of the right support plate of the auxiliary heat dissipation device (15), and sliding parts (14) are slidably connected on the slide rails (13);

[0023] The embedded box (12) consists of a box body (121) and a recessed frame (123) for placing each module; the embedded box (12) has an opening on the front and ventilation holes on the rear panel; wherein:

[0024] N3-1 wire harness pre-reserved partitions (127) are installed from top to bottom inside the housing (121) to form N3 placement slots for placing the sinking load frame (123). Each placement slot has a side sliding groove (1211) on its left and right inner sidewalls. A slide rail (122) is installed on the inner sidewalls of the two placement slots at the position corresponding to the side sliding groove (1211). The anti-detachment slider (1212) passes through and slides in the side sliding groove (1211), slide rail (122), and auxiliary transfer rail (1232) in sequence.

[0025] The sinking frame (123) includes a U-shaped trough frame (1231) with an outer edge platform structure. The auxiliary transfer rail (1232) is horizontally installed on the left and right sides of the U-shaped trough frame (1231) and located below the outer edge platform structure. The two outer walls of the U-shaped trough frame (1231) are each fixedly connected to a connecting rod (1234). The connecting rod (1234) passes through the slide rail (122) and is fixedly connected to the surface of the sliding component (14). A wire slot (1233) is provided on the U-shaped trough frame (1231).

[0026] The structure is arranged from top to bottom: a monitoring module (124) is installed in the first sinking frame, a detection module (125) is installed in the second sinking frame, and a pneumatic module (127) is installed in the third sinking frame. The pneumatic module (127) and the detection module (125) are connected by a wiring harness and a pneumatic connection, and the detection module (125) and the monitoring module (124) are connected by a wiring harness.

[0027] A groove (1271) is provided on the wire harness pre-reserved partition (127), and a set of wire holes (1272) is provided on the surface of the groove (1271). A set of wire clamps (1273) is provided next to each wire hole (1272). A set of reset springs (1274) is fixedly installed on the side wall of the groove (1271). A set of wire clamps (1273) consists of a fixed wire clamp and a movable wire clamp. The wire harness or air pipe is wound in the wire harness pre-reserved partition (127) in the following manner, passing through sequentially from the bottom. The wire hole (1272), the anti-detachment clamp, the movable end of the reset spring (1274), and the movable wire clamp form a U-shape, and then connect to the equipment or enter the upper wire harness reserved partition (127) through the wire slot (1233). The anti-detachment clamp is used to fix the wire harness or air pipe to keep it from falling off, and the movable wire clamp is used to fix the wire harness or air pipe but allows the wire harness or air pipe to fall off under the action of external force; the air pipe for air connection passes through the wire hole (1272) and out.

[0028] When the sinking frame (123) is pushed or pulled by external forces, the connecting rod (1234), under the support of the auxiliary sliding rail (1232), the slide rail (122), and the anti-detachment slider (1212), drives the sliding component (14) to move horizontally, causing the sinking frame (123) to extend out of the placement slot or return to its original position; when the sinking frame (123) extends out of the placement slot, the wire harness or air pipe falls off the movable wire clamp, and the return spring (1274) extends; when the sinking frame (123) returns to the placement slot, the return spring (1274) returns to its original position, and the wire harness or air pipe enters and engages with the movable wire clamp by external force; this facilitates the observation, inspection, and maintenance of the monitoring module (124), the detection module (125), and the air circuit module (126).

[0029] Preferably, the adapter has two interconnected quick interfaces, one of which is connected to the gas inlet of the gas circuit module (126), and the other quick interface is connected to the charging and discharging port of the device under test via an adapter. The adapter is equipped with a filter for filtering impurity particles.

[0030] The gas path module (126) has an air pump and an electric control switch; the electric control switch is connected to the detection module (125), controlled by the detection module (125), and located at the connection of the detection module (125). It is used to control the gas path between the gas path module (126) and the detection module (125). The air pump is used to pump the gas in the gas path into the detection module (125).

[0031] Preferably, a braked roller is installed on the lower surface of the base (3), and the roller is either a one-way roller or a universal roller; the electronic control switch is a solenoid valve.

[0032] This invention provides a method for monitoring the polymerization curve of gas components in a closed-loop switchgear. The main implementer is the aforementioned closed-loop switchgear gas decomposition product polymerization curve monitoring device, and the steps include:

[0033] Step S1: The gas path module collects the gas inside the device under test and sends the collected sample to the detection module; wherein, the number of collection cycles n>300, and the cycle interval time is 1h≤t≤2h;

[0034] In step S2, the detection module analyzes the decomposition components of each sample, determines the concentration values ​​of SO2, H2S, and CO, and inputs the time sequence of decomposition component data into the monitoring module.

[0035] Step S3: The monitoring module performs curve polymerization with the number of cycles n as the horizontal axis and the concentration values ​​of the three components as the vertical axis to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve.

[0036] In step S4, the monitoring module compares the obtained aggregation curve with each of the stored diagnostic reference models to determine the fault type of the tested equipment.

[0037] Preferably, before step S1, the method further includes:

[0038] Step S5: Collect SF6 gas decomposition product samples; the samples are mixed gases collected after simulating a fault event in a fault generation device filled with SF6 gas and conventional internal insulating medium based on preset fault characteristics. The fault events include different types of discharge faults at different voltage levels and overheating faults at different temperatures; samples of single fault events are collected periodically, wherein the number of collection cycles n > 300, and the cycle interval is 1h ≤ t ≤ 2h.

[0039] Step S6: Analyze the decomposition components of each sample in a single fault event, determine the concentration values ​​of SO2, H2S, and CO, and obtain the time series sequence of decomposition component data.

[0040] Step S7: With the cycle number n as the horizontal axis and the concentration values ​​of the three components as the vertical axis, perform curve polymerization to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve.

[0041] Step S8: Establish the correspondence between the slope k of the curve and the fault characteristics over time, and store it as a diagnostic reference model.

[0042] This invention provides a closed-loop switchgear gas component polymerization curve monitoring system, including the aforementioned closed-loop switchgear gas component polymerization curve monitoring device and the device under test. The gas path module (126) in the closed-loop switchgear gas component polymerization curve monitoring device is connected to the charging and discharging port of the device under test through an adapter. The closed-loop switchgear gas component polymerization curve monitoring device periodically collects mixed gas in the device under test for component analysis and analyzes the fault type of the device under test in real time.

[0043] As can be seen from the above technical solution, the gas component polymerization curve monitoring method, device, and system for enclosed switchgear provided by the embodiments of the present invention first collects SF6 gas decomposition product samples and sends them to the monitoring device. The samples are mixed gases collected after simulating a fault event in a fault generation device filled with SF6 gas and conventional internal insulating medium. The decomposition components of each sample in a single fault event are analyzed to determine the concentration values ​​of SO2, H2S, and CO, and a time sequence of decomposition component data is obtained. Curve polymerization is performed separately to obtain SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve. The correspondence between the slope k of the curve and the fault characteristics is established and stored as a diagnostic reference model. Gas samples of the equipment under test are collected and sent to the monitoring device, the decomposition components are analyzed, and curve polymerization is performed. The obtained polymerization curves are compared with the stored diagnostic reference models to determine the fault type of the equipment under test. The device of the present invention supports on-site inspection, quickly detects the content of SF6 gas decomposition product components in the equipment, and can further quickly diagnose latent faults in the equipment based on the diagnostic model, which can effectively improve the accuracy and efficiency of SF6 electrical equipment fault diagnosis. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the gas component polymerization curve monitoring device for enclosed switchgear according to the present invention.

[0045] Figure 2 This is a top view of the equipment box in the enclosed switchgear gas component polymerization curve monitoring device of the present invention.

[0046] Figure 3 This is a front view schematic diagram of the embedded box in the enclosed switchgear gas component polymerization curve monitoring device of the present invention.

[0047] Figure 4 This is a top view of the sinking support structure in the enclosed switchgear gas component polymerization curve monitoring device of the present invention.

[0048] Figure 5 This is a top view of the pre-reserved partition plate in the gas component polymerization curve monitoring device for enclosed switchgear of the present invention.

[0049] Figure 6 This is a side view of the enclosure structure of the gas component polymerization curve monitoring device for enclosed switchgear according to the present invention.

[0050] Figure 7 This is a front view schematic diagram of the auxiliary heat dissipation device in the gas component polymerization curve monitoring device of the enclosed switchgear of the present invention.

[0051] Figure 8 This is a three-dimensional structural diagram of the limiting rod in the gas component polymerization curve monitoring device of the enclosed switchgear of the present invention.

[0052] Figure 9 This is a three-dimensional structural diagram of the heat dissipation component in the gas component polymerization curve monitoring device of the enclosed switchgear of the present invention.

[0053] Figure 10 This is a rear view schematic diagram of the fixed plate in the enclosed switchgear gas component polymerization curve monitoring device of the present invention.

[0054] Figure 11 This is a schematic diagram illustrating the detection principle of the gas component polymerization curve monitoring method for enclosed switchgear according to the present invention.

[0055] Figure 12 Example of a polymerization curve for decomposition products.

[0056] In the diagram: Equipment box-1, Top cover-2, Base-3, U-shaped sheet metal frame-11, Embedded box-12, Slide rail-13, Sliding component-14, Auxiliary heat dissipation device-15, Rear heat dissipation plate-16, Box body-121, Slide rail-122, Sinking frame-123, Monitoring module-124, Detection module-125, Air circuit module-126, Wiring harness reserved partition-127, Side sliding groove-1211, Anti-detachment slider-1212, U-shaped groove frame-1231, Auxiliary sliding rail-1232, Wire clip groove-1233, Connecting rod-1234, Groove -1271, Wire hole -1272, Wire clamp bracket -1273, Reset spring -1274, Left inner frame plate -151, Limiting rod -152, Through slot -153, Heat dissipation assembly -154, Hollow column -155, Pull ring -1521, Bending rod -1522, Pin -1523, Fixing plate -1541, Dust cover -1542, Rotating shaft -1543, Connecting block -1544, Adjusting hole rod -1545, Air guide slot -1546, Fixing bracket -1547, Electric fan -1548, Guide slider -1549. Detailed Implementation

[0057] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0058] This invention provides a closed-type gas component polymerization curve monitoring device for switchgear, which can perform on-site monitoring and use the polymerization curve of decomposition products of high-voltage SF6 circuit breakers to monitor the equipment status. Meanwhile, existing SF6 circuit breaker decomposition product polymerization curve monitoring devices, due to the limited space within the enclosed enclosure, cannot fully observe and inspect the internal modules and systems during maintenance, leading to inconvenience. Furthermore, high temperatures can affect the sensitivity of gas sensors. This invention provides specific solutions for ventilation and heat dissipation.

[0059] refer to Figure 1-10 As shown, the enclosed switchgear gas component polymerization curve monitoring device provided by the present invention includes a top cover 2, an equipment box 1, and a base 3 connected in sequence. The equipment box 1 consists of a U-shaped sheet metal frame 11, an inner box 12, a heat dissipation device 15, a monitoring module 124, a detection module 125, and a gas path module 126. (Refer to...) Figure 1 As shown, the U-shaped sheet metal frame 11, the auxiliary heat dissipation device 15, and the embedded box 12 are arranged sequentially from the outside to the inside and are all fixedly installed on the base 3. The air circuit module 126, the detection module 125, and the monitoring module 124 are connected sequentially and are all installed in the embedded box 12. Braked rollers are installed on the lower surface of the base 3. The rollers can be one-way wheels or omnidirectional wheels to achieve corresponding auxiliary displacement to the designated area or position. The device provides a power supply module for powering each module, which will not be described in detail here.

[0060] One end of the gas circuit module 126 is connected to the charging and discharging port of the device under test via an adapter, and the other end is connected to the detection module, which is used to collect gas samples in the device under test and pump them into the detection module 125.

[0061] The detection module 125 provides a gas sensor for detecting the decomposition component data of the gas sample and sends the detection data to the monitoring module 124; the decomposition component data includes the concentration values ​​of SO2, H2S, and CO.

[0062] The monitoring module 124 is used to record the time sequence of the decomposition component data of the tested equipment, and further aggregates the curves with the number of cycles n as the horizontal axis and the concentration values ​​of the three components as the vertical axis to obtain the SO2 polymerization curve, H2S polymerization curve and CO polymerization curve; the obtained polymerization curves are compared with the stored diagnostic reference models to determine the fault type of the tested equipment.

[0063] During operation, the monitoring module 124, detection module 125, and gas path module 126 generate a large amount of heat. The auxiliary heat dissipation device 15 is used to dissipate heat for the monitoring module 124, detection module 125, and gas path module 126, so as to avoid the gas sensor from becoming less sensitive due to heat and improve the accuracy of the sensor data acquisition.

[0064] Monitoring module 124 is also used for:

[0065] The decomposition components of each sample from a single fault event were analyzed to determine the concentrations of SO2, H2S, and CO, resulting in a time-series sequence of decomposition component data. The samples were mixed gases collected after simulating fault events in a fault generation device filled with SF6 gas and conventional internal insulating media, based on preset fault characteristics. Fault events included different types of discharge faults at different voltage levels and overheating faults at different temperatures. Samples from single fault events were periodically collected, with the number of collection periods n > 300 and the period interval 1 h ≤ t ≤ 2 h. Furthermore, curve aggregation was performed with the number of periods n as the horizontal axis and the concentrations of the three components as the vertical axis to obtain SO2 aggregation curves, H2S aggregation curves, and CO aggregation curves, thus obtaining a time-series sequence of decomposition component data. The relationship between the slope k of the curves and the fault characteristics was established and stored as a diagnostic reference model.

[0066] In terms of structure, refer to Figure 2 As shown, the U-shaped sheet metal frame 11 includes a left limiting plate, a rear heat dissipation plate 16, and a right limiting plate connected in sequence. The rear heat dissipation plate 16 has a heat dissipation hole structure. The integrated rear heat dissipation plate on the rear wall of the sheet metal frame mainly serves to dissipate heat from the electronic equipment in the embedded box, thereby ensuring the normal operation of the electronic equipment. At the same time, the slide rail fixed on the inner wall of the auxiliary heat dissipation device allows for the displacement of the structure in the embedded box.

[0067] The auxiliary heat dissipation device 15 includes a left inner frame plate fixedly installed on the inner surface of the left limiting plate, a right inner frame plate installed on the inner surface of the right limiting plate, a heat dissipation component support frame, and a heat dissipation component 154.

[0068] The heat dissipation assembly 154 includes a fixed plate 1541, a rotating shaft 1543 fixedly connected to the upper part of the left and right sides of the fixed plate 1541, a connecting block 1544 rotatably connected to the lower part of the left and right sides of the fixed plate 1541, and an adjusting hole rod 1545 connected to the end of the connecting block 1544. The adjusting hole rod 1545 has a set of limiting holes, and a guide slider 1549 is fixedly installed on the adjusting hole rod 1545. N2 air guide slots 1546 are opened on the fixed plate 1541. A dust cover 1542 is installed at the opening of the air guide slot 1546 facing the rear heat dissipation plate 16, and a fixing frame 1547 is installed at the opening facing the inner box 12. An electric fan 1548 is installed on each fixing frame 1547. The electric fan is mainly installed on the fixing frame and faces the box, so that when heat is dissipated through the heat dissipation holes on the box, the heat is extracted, thereby ensuring the normal operation of the internal structure of the box.

[0069] The heat dissipation component support frame is fixedly installed between the left inner frame plate and the right inner frame plate. The heat dissipation component support frame is a hollow structure with N1 heat dissipation component mounting slots from top to bottom in the middle for installing N1 heat dissipation components 154. A pair of rotating shaft holes are opened on the upper part of the inner surface of the left and right sides of the heat dissipation component mounting slots. The two rotating shafts 1543 of the heat dissipation component 154 are located on the same axis, and their ends are respectively rotatably connected to the rotating shaft holes of the heat dissipation component mounting slots. N1 through slots 153 are opened on each of the two hollow columns 155 on the left and right sides of the heat dissipation component support frame. The through slots 153 are located at... The heat dissipation component mounting slot is located on both the left and right sides; the through slot 153 is opened along the front and back direction; the upper inner wall of the through slot 153 has a pin through hole; a guide slide groove is opened on each of the left and right inner walls of the through slot 153, the shape of the guide slide groove is set according to the movement trajectory of the guide slider 1549, the two adjusting hole rods 1545 are respectively placed in the through slots 153 on the left and right sides of the heat dissipation component mounting slot, and the two ends of the guide slider 1549 are respectively slidably connected to the two guide slide grooves of the through slot 153; a limit pull rod 152 is installed in each of the two hollow columns 155;

[0070] The limiting rod 152 comprises a pull ring 1521, a continuously right-angled bent rod 1522, and a pin assembly 1523. The pull ring 1521 is connected to the top of the bent rod 1522 and is located outside the hollow column 155. The bent rod 1522 includes a vertical structure and a horizontal structure that are connected in a repeating loop shape. The vertical structure is located on the side of the through groove 153, and the horizontal structure is located below the through groove 153. The through groove 153 is used to limit the rod and prevent it from dislodging from the hollow column 155, thus achieving the function of auxiliary fixing and adjustment. The pin fixing member in the pin assembly 1523 is fixedly installed on the vertical structure of the bent rod 1522. The pin fixing member fixes the pin direction to be vertically downward and facing the pin through hole. The pin 1523 is used to insert into the limiting insertion hole of the adjusting rod 1545 to perform the limiting function.

[0071] The fixing plate is connected to the through slot via adjusting rods on the connecting blocks at both ends. The adjusting rods engage with the pins, which move up and down in cooperation with the bending rod and the pull ring. The electric fan is positioned directly opposite the heat dissipation slot at the rear of the enclosure, and the dust cover is positioned directly opposite the rear heat dissipation plate. The two ends of the fixing plate are connected to the side wall of the inner frame plate via rotating shafts, allowing for hinged swinging. The fixing plate can adjust the suction angle of the electric fan via the adjusting rods. The fixing plate can form a hinged swing through the rotating shafts at both ends. Lifting the limit rod 152 upwards causes the pins 1523 to disengage from the adjusting rod 1545, adjusting each fixing plate 1541 to the desired angle, thus changing the tilt angle of the fixing plate. Lowering the limit rod 152 causes the pins 1523 to engage with the adjusting rod 1545 again, achieving the aligned output of the fan 1548 and allowing for better heat dissipation from the enclosure. Each fan 1548 is connected to and individually controlled by a sub-controller, which is mounted on a fixed plate 1541. Each sub-controller is connected to and centrally controlled by a monitoring module 124. This means that the heat dissipation assembly 154 can be manually turned on and off individually, or it can be automatically controlled directly by the monitoring module 124. As one implementation, a temperature sensor can be installed inside the embedded box 12 (or in each placement slot). The temperature sensor is connected to the monitoring module 124, which controls the number of fans operating based on the temperature sensor data range.

[0072] The number of heat dissipation components 154 is N1≥5, one side corresponds to the heat dissipation hole opened on the housing 121, and the other side corresponds to the rear heat dissipation plate 16, forming a pull-out exhaust to achieve the effect of rapid heat dissipation; the number of electric control fans 1548 on the fixing plate 1541 is N2≥3.

[0073] N3 slide rails 13 are horizontally installed on the inner surfaces of the left and right support plates of the auxiliary heat dissipation device 15, and sliding parts 14 are slidably connected on the slide rails 13.

[0074] The inner box 12 consists of a box body 121 and a sunken frame 123 for placing each module; the inner box 12 has an opening on the front and ventilation holes on the rear panel; wherein:

[0075] Inside the housing 121, N3-1 wire harness pre-reserved partitions 127 are installed from top to bottom to form N3 placement slots for placing the sinking load 123. Each placement slot has a side sliding groove 1211 on its left and right inner sidewalls. Anti-detachment sliders 1212 are slidably connected in the side sliding grooves 1211. A slide rail 122 is installed on the inner sidewalls of the two placement slots at the position corresponding to the side sliding grooves 1211. The anti-detachment sliders 1212 pass through and are slidably connected in the side sliding grooves 1211, slide rails 122, and auxiliary transfer rails 1232 in sequence.

[0076] The sinking frame 123 includes a U-shaped trough frame 1231 with an outer edge platform structure. An auxiliary transfer rail 1232 is horizontally installed on the left and right sides of the U-shaped trough frame 1231 and located below the outer edge platform structure. A connecting rod 1234 is fixedly connected to the rear side of each of the two outer walls of the U-shaped trough frame 1231. The connecting rod 1234 passes through the slide rail 122 and is fixedly connected to the surface of the sliding member 14. A wire slot 1233 is provided on the U-shaped trough frame 1231.

[0077] The structure is arranged from top to bottom: the first sinking frame houses the monitoring module 124, the second sinking frame houses the detection module 125, and the third sinking frame houses the air circuit module 127. The air circuit module 127 and the detection module 125 are connected by a wiring harness and an air circuit, and the detection module 125 and the monitoring module 124 are connected by a wiring harness.

[0078] The wire harness pre-reservation partition 127 has a groove 1271, and a set of wire holes 1272 are provided on the surface of the groove 1271. A set of wire clamps 1273 are provided next to each wire hole 1272. Several reset tension springs 1274 are fixedly installed on the side wall of the groove 1271. The wire clamps are mainly used for the nesting and locking of wire harnesses or conduits. During use, the wire harness or conduit is nested and passed through, and the clamps on the side complete the locking of the wire harness or conduit, so that the wire harness forms a "U" shape to complete the wire harness or conduit pre-reservation. A set of wire clamps 1273 consists of fixed wire clamps and movable wire clamps. The wire harness or air pipe is wound in the wire harness reserved partition 127 in the following manner: from the bottom, it passes through the wire hole 1272, the anti-detachment wire clamp, the movable end of the reset spring 1274, and the movable wire clamp in sequence, forming a U-shape. Then, it passes through the wire slot 1233 to connect to the equipment or enter the upper wire harness reserved partition 127. The anti-detachment wire clamp is used to fix the wire harness or air pipe to prevent it from falling off and is used for the wire harness to pass through. The movable wire clamp is used to fix the wire harness or air pipe but allows the wire harness or air pipe to fall off under external force and is used for the wire harness to lock. The air pipe used for air connection passes through the wire hole 1272 and out.

[0079] When the sinking frame 123 is pushed or pulled by external forces, the connecting rod 1234, supported by the auxiliary moving rail 1232, the slide rail 122, and the anti-detachment slider 1212, drives the sliding component 14 to move horizontally, causing the sinking frame 123 to extend out of the placement slot or return to its original position. When the sinking frame 123 extends out of the placement slot, the wire harness or air pipe falls off the movable wire clamp, and the return spring 1274 extends. When the sinking frame 123 returns to the placement slot, the return spring 1274 returns to its original position, and the wire harness or air pipe enters and engages with the movable wire clamp through external force. The frame is mainly connected to the external sliding component through the auxiliary moving rails on both sides and the connecting rod, so as to extend the frame out of the box, thereby allowing the systems and modules installed on the frame to expand out of the narrow box to complete maintenance and repair.

[0080] The adapter has two interconnecting quick interfaces. One quick interface is connected to the gas inlet of the gas circuit module 126, and the other quick interface is connected to the charging and discharging port of the device under test via an adapter. The adapter is equipped with a filter for filtering out impurity particles.

[0081] The gas path module 126 has an air pump and an electronic control switch; the electronic control switch is connected to and controlled by the detection module 125, and is located at the connection point of the detection module 125. It is used to control the on / off of the gas path between the gas path module 126 and the detection module 125. The air pump is used to pump the gas in the gas path into the detection module 125. The electronic control switch can be a solenoid valve.

[0082] The specific working principle is as follows:

[0083] This invention assembles an equipment box 1 by combining a U-shaped sheet metal frame 11 with an embedded box 12 and an auxiliary heat dissipation device 15, then installs a top cover 2 and a base 3, and attaches a rear heat dissipation plate 16 behind the embedded box 12. After opening the front cover of the box 121, the sliding piece 14 passing through the slide rail 122 is connected to the built-in connecting rod 1234. The end of the connecting rod 1234 is fixed to the side wall of the frame 1231, and then the monitoring modules 124 are installed one by one. The detection module 125 and the air circuit module 126 are installed on the surface of the sinking frame 123 and connected by wiring harnesses or pipes. The connecting pipes or wiring harnesses are first inserted into the wire hole 1272 in the groove 1271, then into the wire clamp 1273 and the reset spring 1274, then clamped onto another clamp on the wire clamp frame 1273, and finally clamped into the wire clamp slot 1233 to connect with the system or module, forming a reserved pipeline or wiring harness. When corresponding maintenance is required, it can be opened through the front door of the enclosure 121 to remove the pipes or wiring harnesses. With the cooperation of the drying 1234 and the anti-detachment slider 1212, the frame 1231 extends out of the box, thus exposing the monitoring module 124, detection module 125 and air circuit module 126 to the outside, making it easy to access or inspect and maintain. When the frame 1231 is displaced, the wire harness disengages from one of the clamping wire clips, and the reserved pipes and wire harness are extended outward with the assistance of the reset tension spring 1274. This also prevents the wire harness from falling off, effectively avoiding the inconvenience of inspection and maintenance in the narrow space inside the box.

[0084] The bending rod 1522 is made of unmodified material and has a pull ring 1521 at the top, which is embedded in the inner frame plate 151. The center of the inner frame plate 151 on which the bending rod 1522 is installed is hollow and the surface has at least five sets of through slots 153.

[0085] The heat dissipation assembly 154 is provided with at least five sets, one for each of the heat dissipation holes opened on the casing, and the other for each of the rear heat dissipation holes, forming a pull-out exhaust to achieve the effect of rapid heat dissipation.

[0086] At least three sets of electrically controlled fans 1548 are installed on the fixed plate 1541 to exhaust heat, thereby ensuring the heat generated by the internal electronic components is discharged.

[0087] Furthermore, the two ends of the fixed plate 1541 are connected by a rotating shaft 1543, and the rotating shaft 1543 is nested in the side wall of the inner clamping plate 151. The electric control fan 1548 can be aligned and output by adjusting the front and rear of the adjusting hole rod 1545.

[0088] Furthermore, within the through groove 153, such as Figure 7 In a magnified view, the side wall of the through groove 153 has an inclined slide groove. The inclined slide groove is mainly used for the slider of the integrated structure on the adjusting hole rod 1545 to slide at an angle, so as to form a constraint while ensuring that the adjusting hole rod 1545 keeps moving in parallel to match the swing adjustment of the fixed plate 1541.

[0089] The specific working principle is as follows:

[0090] This invention fixes the inner frame plate 151 to the inner wall of the U-shaped sheet metal frame 11 and nests it with the limiting pull rod 152. Simultaneously, the adjusting hole rod 1545, fixed by the connecting block 1544 on the fixing plate 1541, passes through the through groove 153. An integrated slider on the adjusting hole rod 1545 slides at an angle within the inclined groove on the side wall of the through groove 153, thus creating a restriction while ensuring the adjusting hole rod 1545 maintains parallel movement. This matches the swing adjustment of the fixing plate 1541, completing the adjustment of the heat dissipation alignment. When adjustment is needed, the pull ring 1... Pulling 521 upwards causes the pin 1523 on the bent rod 1522 to disengage from the through-hole rod 1545, and then, with the assistance of the rotating shafts 1543 at both ends of the fixed plate 1541, it forms a hinged swing, thereby changing the orientation of the electric fan 1548. However, when the heat of the housing 121 is discharged from the rear hole, the electric fan 1548 on the fixed frame 1547 is pulled, causing the heat to be output from the dust cover 1542 in the air guide groove 1546, and then directly from the rear heat dissipation plate 16 to accelerate heat dissipation, achieving a highly efficient heat dissipation effect.

[0091] Furthermore, the present invention provides a closed-loop switchgear gas component polymerization curve monitoring system, including... Figure 1-10 The enclosed switchgear gas component polymerization curve monitoring device and the equipment under test are shown. The gas circuit module 126 in the enclosed switchgear gas component polymerization curve monitoring device is connected to the charging and discharging port of the equipment under test through an adapter. The enclosed switchgear gas component polymerization curve monitoring device periodically collects mixed gas in the equipment under test for component analysis and analyzes the fault type of the equipment under test in real time.

[0092] First, data is collected and analyzed by building a fault model. A diagnostic reference model is then built and integrated into monitoring module 124. The specific process is as follows:

[0093] Step 1: Simulate different types of discharge faults and overheating faults at different voltage levels in a fault generation device filled with SF6 gas and conventional internal insulating medium.

[0094] Step 2: Periodically monitor the decomposition components in the SF6 gas inside the fault simulation unit, mainly monitoring the concentration values ​​of SO2, H2S, and CO;

[0095] Step 3: The number of cycles for the SO2, H2S, and CO monitoring data above is n > 300, and the cycle interval is 1h ≤ t ≤ 2h, where n is a natural number;

[0096] Step 4: SO2, H2S, and CO monitoring data are plotted as a curve with the number of cycles n on the horizontal axis and the monitored concentration values ​​on the vertical axis.

[0097] Step 5: Establish the relationship between the slope k of the curve and the voltage level and fault type over time, and store it as a diagnostic reference model;

[0098] The specific process of the monitoring module analyzing equipment faults is as follows:

[0099] Step S1: The gas path module collects the gas inside the device under test and sends the collected sample to the detection module; wherein, the number of collection cycles n>300, and the cycle interval time is 1h≤t≤2h;

[0100] Step S2: The detection module analyzes the decomposition components of each sample, determines the concentration values ​​of SO2, H2S, and CO, and inputs the time sequence of decomposition component data into the monitoring module.

[0101] Step S3: The monitoring module performs curve polymerization with the cycle number n as the horizontal axis and the concentration values ​​of the three components as the vertical axis to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve.

[0102] In step S4, the monitoring module compares the obtained aggregation curve with the stored diagnostic reference models to determine the fault type of the tested equipment.

[0103] The reference model construction involves establishing and storing the correspondence between the slope k of the curve changing over time and the voltage level and fault type. This step establishes the diagnostic standard, and the data from on-site testing is analyzed using this model to determine whether the equipment has a fault and what type of fault it is. The implementation plan for using the correspondence between the slope k changing over time and the voltage level and fault type as a model, and comparing the real-time changes in slope k, can refer to existing technologies, such as curve similarity. When the similarity of three aggregated curves in the tested equipment is all higher than a threshold, the current fault condition is considered to conform to the model, and the fault characteristics corresponding to the model are taken as the current fault condition of the tested equipment.

[0104] For example, if the decomposition products of a circuit breaker gas chamber are monitored over a 2-hour period, the monitoring aggregate graph would look like this: Figure 12 As shown: the SO2 concentration increases slowly over time, then the rate of increase accelerates significantly. After five monitoring cycles, the SO2 concentration fluctuates within a relatively stable range. Meanwhile, the H2S concentration is zero, and the CO concentration remains relatively stable with no significant changes. Comparison with a reference fault model suggests the following: This is a floating potential discharge fault. In the initial stage of a floating potential discharge fault, the total amount of SO2 produced by decomposition is small. Due to diffusion dissolution and adsorption of the sample gas by the sampling system, the monitored SO2 concentration is low. As the fault progresses, the amount of SO2 produced increases accordingly. At this point, SO2 diffusion intensifies, and the SO2 monitoring value rises rapidly before reaching a relatively stable value. This indicates that SO2 production, diffusion, and adsorption have reached a relative equilibrium, but the overall SO2 concentration remains within a relatively small range, suggesting a small fault energy and a continuous or intermittent discharge fault. The zero H2S concentration and consistently stable CO value indicate that the decomposition of the internal insulation material is not involved. These phenomena are consistent with a floating potential discharge fault.

[0105] The connection process for SF6 circuit breaker decomposition products involves connecting the quick-connect adapter to the gas inlet / outlet of the device under test (DUT). The adapter is equipped with a filter, while the other end connects to the back of the gas circuit module via a quick-connect interface. Holding the adapter and aligning it with the quick-connect interface on the panel, push it forward until you hear a "click." If no gas is discharged from the DUT's outlet during the connection process, use a flathead screwdriver to adjust the adapter's set screw to allow the gas being tested to communicate with the gas circuit module. Finally, by comparing the results with the detection module and the monitoring module above, the polymerization curve of the high-voltage SF6 circuit breaker decomposition products is analyzed.

[0106] Specifically, a fault simulation device is used to simulate various discharge faults, such as corona discharge, floating potential discharge, conductive metal-to-ground discharge, and equipment insulation material decomposition faults caused by different temperature conditions. Due to the different types of faults, the composition and concentration of the decomposition products vary significantly. Because of their chemical properties, SF6 decomposition products continuously diffuse and adsorb within the equipment, and their concentration changes over time with a clear regularity. Aggregating the monitoring data into curves visualizes this regularity and serves as a reference model for fault analysis.

[0107] For example, if the decomposition products of a circuit breaker gas chamber are monitored over a 2-hour period, the monitoring aggregate graph would look like this: Figure 2 As shown: the SO2 concentration increases slowly over time, then the rate of increase accelerates significantly. After five monitoring cycles, the SO2 concentration fluctuates within a relatively stable range, while the H2S concentration is zero, and the CO concentration remains relatively stable with no significant changes. Comparison with a reference fault model suggests the following: This is a floating potential discharge fault. In the initial stage of a floating potential discharge fault, the total amount of SO2 produced by decomposition is small. Due to diffusion dissolution and adsorption of the sample gas by the sampling system, the monitored SO2 concentration is low. As the fault progresses, the amount of SO2 produced increases accordingly. At this point, SO2 diffusion intensifies, and the SO2 monitoring value rises rapidly before reaching a relatively stable value. This indicates that SO2 production, diffusion, and adsorption have reached a relative equilibrium, but the overall SO2 concentration remains within a relatively small range, suggesting a low fault energy and a continuous or intermittent discharge fault. The zero H2S concentration and consistently stable CO value indicate that the decomposition of the internal insulation material is not involved. These phenomena are consistent with a floating potential discharge fault.

[0108] Compared with the prior art, the solution of the present invention has the following beneficial effects;

[0109] 1. This invention effectively improves the detection rate of latent faults. Compared with routine on-site inspections, this invention also has the advantages of a large amount of detection sample data, reducing the dispersion of detection data caused by objective factors, and greatly improving the reliability of fault detection data. It also enriches the diagnostic models for equipment fault types and, compared with existing diagnostic technologies and corresponding standards, can accurately diagnose fault types under different voltage levels.

[0110] 2. The present invention embeds the inner box between the auxiliary heat dissipation devices, and the slide rail on the inner wall of the auxiliary heat dissipation device, together with the sliding component, allows the sinking frame in the box to move accordingly. Thus, when maintenance and repair are required, the frame can be moved out of the box, thereby indirectly expanding its space and facilitating subsequent observation, inspection and maintenance.

[0111] 3. This invention installs auxiliary heat dissipation devices on both sides of the inner box and installs heat dissipation components on the inner frame plate. With the cooperation of the fixed plate in the heat dissipation components, the rotating shaft can drive the hinge swing. The adjustment hole rod fixed on the connecting block passes through the through groove. With the assistance of the limiting pull rod, the pin passes through the hole to form a positioning, thereby achieving adjustable angle of the fixed plate to adapt to the heat conduction position in the box and achieve efficient heat dissipation.

[0112] In the description of this invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0113] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two main bodies are not connected through a transitional structure, but rather formed as a whole through a connecting structure. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0114] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0115] It should be understood that the embodiments disclosed herein are not limited to the specific processing steps or materials disclosed herein, but should be extended to equivalent substitutions of such features as understood by those skilled in the art. It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.

[0116] The term "embodiment" as used in this specification means that a specific feature or characteristic described in connection with an embodiment is included in at least one embodiment of the invention. Therefore, phrases or "embodiments" appearing in various places throughout the specification do not necessarily refer to the same embodiment.

[0117] Furthermore, the described features or characteristics can be incorporated into one or more embodiments in any other suitable manner. In the above description, specific details, such as thickness, quantity, etc., are provided to provide a comprehensive understanding of embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented without the aforementioned specific details or may be implemented using other methods, components, materials, etc.

Claims

1. A closed-loop switchgear gas component polymerization curve monitoring device, characterized in that, The equipment includes a top cover (2), an equipment box (1), and a base (3) connected in sequence. The equipment box (1) consists of a U-shaped sheet metal frame (11), an inner box (12), a heat dissipation device (15), a monitoring module (124), a detection module (125), and an air circuit module (126). The U-shaped sheet metal frame (11), the heat dissipation device (15), and the inner box (12) are arranged in sequence from the outside to the inside and are all fixedly installed on the base (3). The air circuit module (126), the detection module (125), and the monitoring module (124) are connected in sequence and are all installed in the inner box (12). One end of the gas circuit module (126) is connected to the charging and discharging port of the device under test via an adapter, and the other end is connected to the detection module. It is used to collect gas samples from the device under test and pump them into the detection module (125). The detection module (125) provides a gas sensor for detecting the decomposition component data of the gas sample and sending the detection data to the monitoring module (124); the decomposition component data includes SO2, H2S and CO concentration values; The monitoring module (124) is used to record the time sequence of the decomposition component data of the tested equipment, and further aggregate the curves with the number of cycles n as the horizontal axis and the concentration values ​​of the three components as the vertical axis to obtain the SO2 polymerization curve, H2S polymerization curve and CO polymerization curve; the obtained polymerization curves are compared with the stored diagnostic reference models to determine the fault type of the tested equipment. During operation, the monitoring module (124), detection module (125), and gas path module (126) generate a large amount of heat. The auxiliary heat dissipation device (15) is used to dissipate heat for the monitoring module (124), detection module (125), and gas path module (126), so as to avoid the gas sensor from becoming less sensitive due to heat and improve the accuracy of the sensor data acquisition. The U-shaped sheet metal frame (11) includes a left limiting plate, a rear heat dissipation hole plate (16) and a right limiting plate connected in sequence. The rear heat dissipation hole plate (16) has a heat dissipation hole structure. The auxiliary heat dissipation device (15) includes a left inner frame plate fixedly installed on the inner surface of the left limiting plate, a right inner frame plate installed on the inner surface of the right limiting plate, a heat dissipation component support frame, and a heat dissipation component (154). The heat dissipation assembly (154) includes a fixed plate (1541), a rotating shaft (1543) fixedly connected to the upper part of the left and right sides of the fixed plate (1541), a connecting block (1544) rotatably connected to the lower part of the left and right sides of the fixed plate (1541), and an adjusting hole rod (1545) connected to the end of the connecting block (1544). The adjusting hole rod (1545) has a set of limiting holes, and a guide slider (1549) is fixedly installed on the adjusting hole rod (1545). N2 air guide slots (1546) are opened on the fixed plate (1541). A dust cover (1542) is installed at the opening of the air guide slot (1546) facing the rear heat dissipation plate (16), and a fixing bracket (1547) is installed at the opening of the air guide slot (1546) facing the inner box (12). An electric fan (1548) is installed on each fixing bracket (1547). The heat dissipation component support frame is fixedly installed between the left inner frame plate and the right inner frame plate; the heat dissipation component support frame is a hollow structure, with N1 heat dissipation component mounting slots opened from top to bottom in the middle for installing N1 heat dissipation components (154); a pair of rotating shaft holes are opened on the upper part of the inner surface of the left and right sides of the heat dissipation component mounting slots, and the two rotating shafts (1543) of the heat dissipation component (154) are located on the same axis, and their ends are respectively rotatably connected to the rotating shaft holes of the heat dissipation component mounting slots; N1 through slots (153) are opened on each of the two hollow columns (155) of the heat dissipation component support frame. Located on the left and right sides of the heat dissipation component mounting slot; the through slot (153) is opened in the front-back direction; the upper inner side wall of the through slot (153) is opened with a pin through hole; a guide slide groove is opened on each of the left and right inner side walls of the through slot (153), the shape of the guide slide groove is set according to the movement trajectory of the guide slider (1549), the two adjusting hole rods (1545) are respectively placed in the through slots (153) on the left and right sides of the heat dissipation component mounting slot, and the two ends of the guide slider (1549) are respectively slidably connected to the two guide slide grooves of the through slot (153); a limit pull rod (152) is installed in each of the two hollow cylinders (155); The limiting pull rod (152) comprises a pull ring (1521), a continuous right-angle loop-shaped bent rod (1522), and a pin assembly; the pull ring (1521) is connected to the top of the bent rod (1522) and is located outside the hollow column (155); the bent rod (1522) comprises a vertical structure and a horizontal structure that are connected in a loop shape in sequence, the vertical structure is located on the side of the through groove (153), and the horizontal structure is located below the through groove (153), the through groove (153) is used to limit and prevent the limiting pull rod (152) from dislodging from the hollow column (155); the pin fixing member in the pin assembly is fixedly installed on the vertical structure of the bent rod (1522), the pin fixing member fixes the pin direction to be vertically downward and facing the pin through hole, the pin is used to insert into the limiting insertion hole of the adjusting hole rod (1545) to play a limiting role; Lift the limit lever (152) upwards to disengage each pin from the adjustment hole rod (1545), adjust each fixing plate (1541) to the required angle, and then lower the limit lever (152) to re-engage each pin with the adjustment hole rod (1545), thereby achieving the alignment output of the fan (1548); each fan (1548) is connected to a sub-controller and is individually controlled by the sub-controller, which is installed on the fixing plate (1541); each sub-controller is connected to the monitoring module (124) and is centrally controlled by the monitoring module (124).

2. The closed-type switchgear gas component polymerization curve monitoring device as described in claim 1, characterized in that, The monitoring module (124) is used for: The decomposition components of each sample from a single fault event were analyzed to determine the concentrations of SO2, H2S, and CO, resulting in a time-series sequence of decomposition component data. The samples were mixed gases collected after simulating a fault event in a fault generation device filled with SF6 gas and conventional internal insulating medium, based on preset fault characteristics. The fault events included different types of discharge faults at different voltage levels and overheating faults at different temperatures. Samples from single fault events were collected periodically, with the number of collection periods n > 300 and the period interval 1h ≤ t ≤ 2h. Furthermore, with the cycle number n as the horizontal axis and the concentration values ​​of the three components as the vertical axis, curve polymerization was performed to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve. Obtain the time series of decomposed component data; establish the correspondence between the slope k of the curve and the fault characteristics over time, and store it as a diagnostic reference model.

3. The closed-loop switchgear gas component polymerization curve monitoring device as described in claim 2, characterized in that, The number of heat dissipation components (154) is N1≥5, one side corresponds to the heat dissipation hole opened on the box (121), and the other side corresponds to the rear heat dissipation plate (16), forming a pumping exhaust to achieve the effect of rapid heat dissipation; the number of electric control fans (1548) on the fixed plate (1541) is N2≥3.

4. The closed-loop switchgear gas component polymerization curve monitoring device as described in claim 3, characterized in that, The inner surfaces of the left and right support plates of the auxiliary heat dissipation device (15) are horizontally mounted with N3 slide rails (13), and sliding parts (14) are slidably connected on the slide rails (13). The embedded box (12) consists of a box body (121) and a recessed frame (123) for placing each module; the embedded box (12) has an opening on the front and ventilation holes on the rear panel; wherein: N3-1 wire harness pre-reserved partitions (127) are installed from top to bottom inside the housing (121) to form N3 placement slots for placing the sinking load frame (123). Each placement slot has a side sliding groove (1211) on its left and right inner sidewalls. A slide rail (122) is installed on the inner sidewalls of the two placement slots at the position corresponding to the side sliding groove (1211). The anti-detachment slider (1212) passes through and slides in the side sliding groove (1211), slide rail (122), and auxiliary transfer rail (1232) in sequence. The sinking frame (123) includes a U-shaped trough frame (1231) with an outer edge platform structure. The auxiliary transfer rail (1232) is horizontally installed on the left and right sides of the U-shaped trough frame (1231) and located below the outer edge platform structure. The two outer walls of the U-shaped trough frame (1231) are each fixedly connected to a connecting rod (1234). The connecting rod (1234) passes through the slide rail (122) and is fixedly connected to the surface of the sliding component (14). A wire slot (1233) is provided on the U-shaped trough frame (1231). The structure is arranged from top to bottom: a monitoring module (124) is installed in the first sinking frame, a detection module (125) is installed in the second sinking frame, and a pneumatic module is installed in the third sinking frame. The pneumatic module and the detection module (125) are connected by a wiring harness and a pneumatic connection, and the detection module (125) and the monitoring module (124) are connected by a wiring harness. A groove (1271) is provided on the wire harness pre-reserved partition (127), and a set of wire holes (1272) is provided on the surface of the groove (1271). A set of wire clamps (1273) is provided next to each wire hole (1272). A set of reset springs (1274) is fixedly installed on the side wall of the groove (1271). A set of wire clamps (1273) consists of a fixed wire clamp and a movable wire clamp. The wire harness or air pipe is wound in the wire harness pre-reserved partition (127) in the following manner, passing through sequentially from the bottom. The wire hole (1272), the anti-detachment clamp, the movable end of the reset spring (1274), and the movable wire clamp form a U-shape, and then connect to the equipment or enter the upper wire harness reserved partition (127) through the wire slot (1233). The anti-detachment clamp is used to fix the wire harness or air pipe to keep it from falling off, and the movable wire clamp is used to fix the wire harness or air pipe but allows the wire harness or air pipe to fall off under the action of external force; the air pipe for air connection passes through the wire hole (1272) and out. When the sinking frame (123) is pushed or pulled by external forces, the connecting rod (1234), under the support of the auxiliary sliding rail (1232), the slide rail (122), and the anti-detachment slider (1212), drives the sliding component (14) to move horizontally, causing the sinking frame (123) to extend out of the placement slot or return to its original position; when the sinking frame (123) extends out of the placement slot, the wire harness or air pipe falls off the movable wire clamp, and the return spring (1274) extends; when the sinking frame (123) returns to the placement slot, the return spring (1274) returns to its original position, and the wire harness or air pipe enters and engages with the movable wire clamp by external force; this facilitates the observation, inspection, and maintenance of the monitoring module (124), the detection module (125), and the air circuit module (126).

5. The closed-loop switchgear gas component polymerization curve monitoring device as described in claim 4, characterized in that, The adapter has two interconnected quick interfaces, one of which is connected to the gas inlet of the gas circuit module (126), and the other quick interface is connected to the charging and discharging port of the device under test via an adapter. The adapter is equipped with a filter for filtering impurity particles. The gas path module (126) has an air pump and an electric control switch; the electric control switch is connected to the detection module (125), controlled by the detection module (125), and located at the connection of the detection module (125). It is used to control the gas path between the gas path module (126) and the detection module (125). The air pump is used to pump the gas in the gas path into the detection module (125).

6. The closed-loop switchgear gas component polymerization curve monitoring device as described in claim 5, characterized in that, A braked roller is installed on the lower surface of the base (3). The roller is either a one-way roller or a universal roller. The electric control switch is a solenoid valve.

7. A method for monitoring the polymerization curve of gas components in a closed-loop switchgear, characterized in that, The implementing entity is the enclosed switchgear gas component polymerization curve monitoring device according to any one of claims 1-6, and the steps include: Step S1: The gas path module collects the gas inside the device under test and sends the collected sample to the detection module; wherein, the number of collection cycles n>300, and the cycle interval time is 1h≤t≤2h; In step S2, the detection module analyzes the decomposition components of each sample, determines the concentration values ​​of SO2, H2S, and CO, and inputs the time sequence of decomposition component data into the monitoring module. Step S3: The monitoring module performs curve polymerization with the number of cycles n as the horizontal axis and the concentration values ​​of the three components as the vertical axis to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve. In step S4, the monitoring module compares the obtained aggregation curve with each of the stored diagnostic reference models to determine the fault type of the tested equipment.

8. The method for monitoring the polymerization curve of gas components in a closed-loop switchgear as described in claim 7, characterized in that, Before step S1, the method further includes: Step S5: Collect SF6 gas decomposition product samples; the samples are mixed gases collected after simulating a fault event in a fault generation device filled with SF6 gas and conventional internal insulating medium based on preset fault characteristics. The fault events include different types of discharge faults at different voltage levels and overheating faults at different temperatures; samples of single fault events are collected periodically, wherein the number of collection cycles n > 300, and the cycle interval is 1h ≤ t ≤ 2h. Step S6: Analyze the decomposition components of each sample in a single fault event, determine the concentration values ​​of SO2, H2S, and CO, and obtain the time series sequence of decomposition component data. Step S7: With the cycle number n as the horizontal axis and the concentration values ​​of the three components as the vertical axis, perform curve polymerization to obtain the SO2 polymerization curve, H2S polymerization curve, and CO polymerization curve. Step S8: Establish the correspondence between the slope k of the curve and the fault characteristics over time, and store it as a diagnostic reference model.

9. A closed-loop switchgear gas component polymerization curve monitoring system, comprising the closed-loop switchgear gas component polymerization curve monitoring device as described in any one of claims 1-6, and the device under test, wherein the gas path module (126) in the closed-loop switchgear gas component polymerization curve monitoring device is connected to the charging and discharging port of the device under test via an adapter, and the closed-loop switchgear gas component polymerization curve monitoring device periodically collects mixed gas in the device under test for component analysis, and analyzes the fault type of the device under test in real time.

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