Intelligent monitoring method and system for high-voltage switch equipment, medium and equipment

Abstract

The invention provides an intelligent monitoring method and system for high-voltage switch equipment, a medium and equipment, and relates to the technical field of equipment monitoring. According to the application, the standard temperature portrait is determined by acquiring the internal structure information and the electrical parameters of the high-voltage switchgear, and the standard temperature portrait is dynamically adjusted in combination with the environment temperature to obtain the first temperature image, so that the temperature reference can adapt to different environment conditions. The second temperature image is generated by acquiring the infrared thermal image of the equipment, and the actual temperature state of the equipment is reflected. The first temperature image is compared with the second temperature image, and two dimensions of the temperature difference value and the temperature difference area are considered at the same time, so that local hot spots can be identified, the distribution range of abnormal temperature can be evaluated, and whether the equipment has a thermal abnormal fault or not can be comprehensively and accurately judged. The defect that the temperature condition of the internal component is difficult to accurately capture in the prior art can be overcome, and the internal thermal state of the high-voltage switchgear can be accurately monitored.

Description

Technical Field

[0001] The present application relates to the technical field of equipment monitoring, and in particular to an intelligent monitoring method, system, medium and equipment for high-voltage switchgear. Background Art

[0002] High-voltage switchgear is an indispensable electrical equipment for protecting various types of power distribution devices in the power system. During operation, it is subject to the combined effects of high voltage, high current, mechanical stress and environmental factors, which causes high-voltage switchgear to generate heat. Monitoring and diagnosing thermal abnormalities has become an important part of ensuring the safe operation of equipment.

[0003] In the related art, sensors are often used to monitor the real-time temperature of high-voltage switchgear to monitor whether there is a thermal fault. However, since high-voltage switchgear usually contains multiple precision components, such as contact systems, arc extinguishing chambers, and operating mechanisms, the use of sensors will be affected by the complexity of the structure, making it difficult to accurately capture the temperature conditions of internal components, resulting in inaccurate thermal anomaly monitoring of high-voltage switchgear. Summary of the invention

[0004] The present application provides an intelligent monitoring method, system, medium and device for high-voltage switchgear, which can realize accurate thermal anomaly monitoring of high-voltage switchgear.

[0005] In a first aspect, the present application provides an intelligent monitoring method for a high-voltage switchgear, the method comprising: Obtaining internal structural information and electrical parameters of the high-voltage switchgear and determining a standard temperature profile of the high-voltage switchgear; The standard temperature image is adjusted according to the ambient temperature of the high-voltage switchgear to obtain a first temperature image of the high-voltage switchgear as the ambient temperature changes; Acquire an infrared thermal image of the high-voltage switchgear to generate a second temperature image of the high-voltage switchgear; Whether the high-voltage switchgear has a thermal abnormality fault is monitored according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image.

[0006] By adopting the above technical solution, the internal structure information and electrical parameters of the high-voltage switchgear are obtained to determine the standard temperature image, providing an accurate benchmark for thermal anomaly monitoring. The standard temperature image is dynamically adjusted in combination with the ambient temperature to obtain the first temperature image, so that the temperature benchmark can adapt to different environmental conditions and improve the adaptability of monitoring. The second temperature image is generated by acquiring the infrared thermal image of the equipment, which reflects the actual temperature state of the equipment. The first temperature image is compared with the second temperature image, and the two dimensions of temperature difference value and temperature difference area are considered at the same time. It can not only identify local hot spots, but also evaluate the distribution range of abnormal temperatures, so as to comprehensively and accurately determine whether the equipment has thermal anomaly faults. It can overcome the defect that related technologies are difficult to accurately capture the temperature conditions of internal components, and realize accurate monitoring of the internal thermal state of high-voltage switchgear.

[0007] Optionally, monitoring whether the high-voltage switchgear has a thermal abnormality fault according to a temperature difference value and a temperature difference area between the first temperature image and the second temperature image includes: Comparing temperature difference values ​​at corresponding positions between the first temperature image and the second temperature image, determining a first abnormal area where the temperature difference value is greater than a preset first threshold; If the temperature difference area of ​​the first abnormal region is greater than a preset second threshold, it is determined that the high-voltage switchgear has a thermal abnormality fault, and a thermal abnormality fault signal is output.

[0008] By adopting the above technical solution, the solution compares the temperature difference values ​​of the corresponding positions between the first temperature image and the second temperature image, and sets a preset first threshold to determine the first abnormal area, thereby realizing accurate identification of local thermal anomalies. The concept of temperature difference area is further introduced, and a preset second threshold is set to evaluate the distribution range of abnormal temperature based on the first abnormal area, effectively avoiding misjudgment caused by local small-scale temperature fluctuations.

[0009] Optionally, before comparing the temperature difference values ​​at corresponding positions between the first temperature image and the second temperature image to determine the first abnormal area where the temperature difference value is greater than a preset first threshold, the method further includes: Acquire historical temperature data corresponding to each position in the high-voltage switchgear, and draw a temperature change curve corresponding to each position; According to the temperature change interval and the temperature change rate in the temperature change curve, a first threshold value corresponding to each position in the high-voltage switchgear is determined.

[0010] By adopting the above technical solution, the temperature change curve drawn using these historical data not only reflects the temperature change characteristics of the equipment under different operating conditions and environments, but also reflects the temperature change pattern of each location. By analyzing the temperature change range and temperature change rate in the temperature change curve, the solution can fully consider the temperature dynamic characteristics of each part of the equipment, thereby determining a more accurate and personalized first threshold for each location. This threshold determination method based on historical data and dynamic characteristics enables the system to adapt to the characteristic differences of different parts of high-voltage switchgear and improves the sensitivity and accuracy of temperature anomaly detection.

[0011] Optionally, the obtaining of internal structural information and electrical parameters of the high-voltage switchgear and determining a standard temperature profile of the high-voltage switchgear includes: Acquire internal structure information of the high-voltage switchgear, wherein the internal structure information includes component information and connection structure information; Acquire electrical parameters of the high-voltage switchgear, determine a first standard temperature corresponding to the component information, and a second standard temperature corresponding to the connection structure information; The first standard temperature and the second standard temperature are integrated to obtain a standard temperature profile of the high-voltage switchgear.

[0012] By adopting the above technical solution, the solution obtains the internal structure information of the high-voltage switchgear, including component information and connection structure information, to provide comprehensive and detailed basic data for determining the standard temperature portrait. Combined with the electrical parameters of the high-voltage switchgear, the first standard temperature corresponding to the component information and the second standard temperature corresponding to the connection structure information are determined respectively, so as to achieve an accurate characterization of the temperature characteristics of different components of the equipment. This hierarchical temperature determination method not only takes into account the unique thermal characteristics of each component, but also takes into account the influence of the connection structure between components on the temperature distribution, thereby more comprehensively reflecting the overall thermal state of the high-voltage switchgear.

[0013] Optionally, after acquiring the electrical parameters of the high-voltage switchgear and determining the first standard temperature corresponding to the component information and the second standard temperature corresponding to the connection structure information, the method further includes: Determining whether the electrical parameters corresponding to the component information are the rated operating parameters corresponding to the component information; If the electrical parameter corresponding to the component information is not the rated operating parameter corresponding to the component information, the first standard temperature corresponding to the component information is re-determined according to the difference between the rated operating parameter and the electrical parameter.

[0014] By adopting the above technical solution, the difference between the actual electrical parameters and the rated operating parameters is compared, and the first standard temperature is corrected accordingly. This dynamic adjustment mechanism based on the actual operating parameters enables the generated standard temperature portrait to more accurately reflect the actual working status and thermal characteristics of the equipment. By timely adjusting the first standard temperature, the solution effectively overcomes the misjudgment problem that may be caused by the fixed standard temperature, and improves the accuracy and reliability of thermal anomaly detection. This dynamic adjustment mechanism can not only adapt to the temperature change characteristics of the equipment under different load conditions, but also capture performance changes caused by equipment aging or other factors, thereby providing a more accurate reference benchmark for thermal anomaly detection.

[0015] Optionally, the integrating the first standard temperature and the second standard temperature to obtain a standard temperature profile of the high-voltage switchgear includes: Determine, according to the temperature radiation area corresponding to the first standard temperature, an influence value of the temperature radiation area on the second standard temperature; Correcting the second standard temperature according to the influence value to obtain a third standard temperature; The first standard temperature and the third standard temperature are integrated to obtain a standard temperature profile of the high-voltage switchgear.

[0016] By adopting the above technical solution and introducing the third standard temperature, the solution effectively integrates the temperature characteristics of the component itself and the thermal influence of the surrounding environment to form a more comprehensive and accurate temperature distribution model. Finally, by integrating the first standard temperature and the third standard temperature, the standard temperature portrait obtained not only includes the independent temperature characteristics of each component, but also reflects the thermal interaction between the components, thereby more comprehensively describing the overall thermal state of the high-voltage switchgear. This method of generating temperature portraits that takes into account the influence of thermal radiation significantly improves the accuracy and reliability of the standard temperature portrait.

[0017] Optionally, acquiring two adjacent frames of initial infrared images of the high-voltage switchgear; The initial infrared images of two adjacent frames are averaged to obtain a second temperature image of the high-voltage switchgear.

[0018] By adopting the above technical solution, the method of collecting two adjacent frames of initial infrared images can capture the continuous changes in the temperature state of high-voltage switchgear, reducing the instantaneous fluctuations or anomalies that may exist in a single frame image. Secondly, the two frames of initial infrared images are averaged, which effectively reduces the influence of random noise and instantaneous interference and improves the stability and credibility of temperature data.

[0019] In a second aspect, the present application provides an intelligent monitoring system for high-voltage switchgear, the system comprising: A standard temperature profile determination module, used to obtain internal structure information and electrical parameters of the high-voltage switchgear and determine a standard temperature profile of the high-voltage switchgear; A first temperature image determination module, configured to adjust the standard temperature image according to the ambient temperature of the high-voltage switchgear, and obtain a first temperature image of the high-voltage switchgear as it changes with the ambient temperature; A second temperature image generating module, used for acquiring an infrared thermal image of the high-voltage switchgear and generating a second temperature image of the high-voltage switchgear; The monitoring module is used to monitor whether the high-voltage switch device has a thermal abnormality fault according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image.

[0020] In a third aspect, the present application provides a computer storage medium, wherein the computer storage medium stores a plurality of instructions, wherein the instructions are suitable for being loaded by a processor and executing any one of the above methods.

[0021] In a fourth aspect, the present application provides an electronic device, comprising a processor, a memory and a transceiver, wherein the memory is used to store instructions, the transceiver is used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device performs any one of the methods described above.

[0022] In summary, the beneficial effects brought about by the technical solution of this application include: By adopting the above technical solution, the internal structure information and electrical parameters of the high-voltage switchgear are obtained to determine the standard temperature image, providing an accurate benchmark for thermal anomaly monitoring. The standard temperature image is dynamically adjusted in combination with the ambient temperature to obtain the first temperature image, so that the temperature benchmark can adapt to different environmental conditions and improve the adaptability of monitoring. The second temperature image is generated by acquiring the infrared thermal image of the equipment, which reflects the actual temperature state of the equipment. The first temperature image is compared with the second temperature image, and the two dimensions of temperature difference value and temperature difference area are considered at the same time. It can not only identify local hot spots, but also evaluate the distribution range of abnormal temperatures, so as to comprehensively and accurately determine whether the equipment has thermal anomaly faults. It can overcome the defect that related technologies are difficult to accurately capture the temperature conditions of internal components, and realize accurate monitoring of the internal thermal state of high-voltage switchgear. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a flow chart of an intelligent monitoring method for high-voltage switchgear according to an embodiment of the present application; Figure 2 It is a structural schematic diagram of an intelligent monitoring system for high-voltage switchgear according to an embodiment of the present application; Figure 3It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0024] Description of reference numerals: 300, electronic device; 301, processor; 302, communication bus; 303, user interface; 304, network interface; 305, memory. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0026] In the description of the embodiments of the present application, words such as "illustrative", "for example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "illustrative", "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "illustrative", "for example" or "for example" is intended to present related concepts in a specific way.

[0027] In the description of the embodiments of the present application, the meaning of the term "multiple" refers to two or more. For example, multiple systems refer to two or more systems, and multiple screen terminals refer to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0028] See also Figure 1 , is a flow chart of an intelligent monitoring method for high-voltage switchgear provided in an embodiment of the present application. The method can be implemented by a computer program, can be implemented by a single-chip microcomputer, or can be run on an intelligent monitoring system for high-voltage switchgear based on the von Neumann system. The computer program can be integrated into an application or run as an independent tool application. The specific steps of the intelligent monitoring method for high-voltage switchgear are described in detail below.

[0029] S101: Obtain internal structure information and electrical parameters of the high-voltage switchgear, and determine a standard temperature profile of the high-voltage switchgear.

[0030] Among them, high-voltage switchgear refers to a device used for current breaking and closing operations in power systems, mainly used to control and protect high-voltage power systems. In power engineering, switchgear with a rated voltage of 3kV and above is usually referred to as high-voltage switchgear. Such equipment includes but is not limited to circuit breakers, disconnectors, load switches, grounding switches, etc. In the embodiments of the present application, high-voltage switchgear can be understood as large-scale electrical equipment installed in substations, distribution rooms or other power facilities. These devices usually have complex internal structures and contain multiple functional elements and connecting parts.

[0031] Among them, internal structure information refers to detailed data describing the internal composition and layout of a device or system, usually including the type, specification, location of each component, and the connection relationship between them. This information is essential for understanding the working principle, performance characteristics, and potential failure points of the device. In the embodiment of the present application, the internal structure information can be understood as the detailed construction data of the high-voltage switchgear.

[0032] Among them, the electrical parameters of high-voltage switchgear refer to various quantitative indicators that describe the electrical performance and working status of the equipment. These parameters reflect the operating characteristics and capabilities of the equipment in the power system. In the embodiment of the present application, the electrical parameters of the high-voltage switchgear can be understood as the rated voltage, rated current, rated frequency, rated short-circuit breaking current, rated short-time withstand current, rated number of operations, contact resistance and insulation resistance of the equipment. These parameters are mainly used in this application to determine the standard temperature portrait, adjust the temperature threshold, evaluate the load status of the equipment, assist in fault diagnosis and optimize the monitoring strategy.

[0033] Among them, the standard temperature portrait refers to a model or image that describes the expected temperature distribution of the equipment under normal working conditions. In the embodiment of the present application, the standard temperature portrait can be understood as a temperature distribution model of the high-voltage switchgear under ideal working conditions. This model comprehensively considers the internal structure information, electrical parameters and environmental factors of the equipment, and reflects the temperature state that each part of the equipment should have during normal operation. The standard temperature portrait is mainly used as a reference benchmark in this application, and is compared with the actual measured temperature distribution to identify potential thermal anomalies.

[0034] In this embodiment, the internal structure information and electrical parameters of the high-voltage switchgear are obtained and the standard temperature profile of the device is determined, in order to establish an accurate temperature reference model for subsequent abnormality detection.

[0035] First, it is necessary to obtain the internal structure information of the high-voltage switchgear, including component information and connection structure information. Component information covers the detailed data of each functional component in the equipment, such as the material, size and rated parameters of the contact, arc extinguishing chamber, operating mechanism, etc. The connection structure information describes the physical connection method and relative position relationship between these components. At the same time, it is also necessary to obtain the electrical parameters of the equipment, such as rated voltage, rated current, rated frequency, etc. This information together constitutes the basis for understanding the thermal characteristics of the equipment. After obtaining this information, the thermodynamic model and electromagnetic field analysis method can be used to combine the thermal and electrical characteristics of each component to calculate the theoretical temperature distribution of each part of the equipment under normal working conditions. This theoretical temperature distribution constitutes the standard temperature profile of the high-voltage switchgear. In this way, a standard temperature profile that fully reflects the temperature distribution of the equipment under normal working conditions can be obtained. This standard temperature profile takes into account the structural characteristics and working parameters of the equipment, so it can more accurately reflect the actual situation of the equipment. The effect of this is to provide a reliable reference benchmark for subsequent temperature anomaly detection, which helps to improve the accuracy and sensitivity of anomaly detection, thereby better realizing intelligent monitoring and fault warning of high-voltage switchgear.

[0036] Based on the above embodiment, as an optional implementation manner, a method of determining a standard temperature profile of a high-voltage switchgear device may be specifically implemented through the following steps S201 - S203 .

[0037] S201: Acquire internal structure information of a high-voltage switchgear, where the internal structure information includes component information and connection structure information.

[0038] Among them, component information refers to the detailed data and characteristics that describe each independent component that constitutes a device or system. This information usually includes the type, function, physical characteristics and performance parameters of the component. In an embodiment of the present application, component information can be understood as a specific description of each functional component in the high-voltage switchgear, such as detailed data of contacts, arc extinguishing chambers, operating mechanisms, insulators, etc. These data include but are not limited to the material composition, geometric dimensions, rated operating parameters, thermal properties and electrical properties of the components. Component information is mainly used in this application to gain an in-depth understanding of the thermal characteristics of high-voltage switchgear. By analyzing the characteristics of each component, its heat generation and heat dissipation under different working conditions can be predicted, thereby providing basic data for determining the standard temperature portrait.

[0039] Among them, the connection structure information refers to the detailed data describing the physical connection mode and relative position relationship between each component in the device or system. This information usually includes the spatial layout of the components, the location of the connection points, the connection mode and the interaction, etc. In the embodiment of the present application, the connection structure information can be understood as a specific description of the spatial arrangement and connection mode between the functional components in the high-voltage switchgear. This includes the layout of the conductive circuit, the configuration of the mechanical transmission structure, the arrangement of the insulation structure, etc. The connection structure information is mainly used in this application to understand the heat transfer path and heat distribution characteristics inside the high-voltage switchgear. By analyzing the connection mode and relative position between the components, the transfer and distribution of heat inside the equipment can be more accurately predicted, thereby providing an important basis for determining the standard temperature portrait.

[0040] In specific implementation, the internal structure information includes component information and connection structure information. These two types of information together constitute the key to understanding the thermal characteristics of the equipment. First, it is necessary to obtain component information, that is, detailed data of each functional component in the high-voltage switchgear, such as the material composition, geometric dimensions, rated operating parameters, thermal properties and electrical properties of contacts, arc extinguishing chambers, operating mechanisms, insulators, etc. This information can be obtained by consulting the technical documents of the equipment, the data manual provided by the manufacturer, or conducting field measurements. At the same time, it is also necessary to obtain connection structure information, that is, the spatial arrangement and connection method between the functional components, including the layout of the conductive circuit, the configuration of the mechanical transmission structure, the arrangement of the insulation structure, etc. This information can be obtained by analyzing the structural drawings of the equipment or three-dimensional modeling. The purpose of obtaining this internal structure information is to gain a deep understanding of the thermal characteristics of the high-voltage switchgear. Component information helps to predict the heat generation and heat dissipation of each component under different working conditions, while connection structure information helps to understand the heat transfer and distribution law inside the equipment. By comprehensively analyzing these two types of information, the temperature distribution characteristics of the equipment can be predicted more accurately, providing reliable basic data for determining the standard temperature profile.

[0041] S202: Acquire electrical parameters of the high-voltage switchgear, and determine a first standard temperature corresponding to the component information and a second standard temperature corresponding to the connection structure information.

[0042] Among them, the first temperature standard temperature corresponding to the component information refers to the expected temperature value of the component under normal operating conditions determined based on the characteristics and working conditions of the specific component. This temperature value reflects the ideal thermal state of the component under the designed working parameters. In an embodiment of the present application, the first temperature standard temperature corresponding to the component information can be understood as the expected temperature of each functional component in the high-voltage switchgear, such as contacts, arc extinguishing chambers, operating mechanisms, insulators, etc., under normal working conditions. This temperature value is calculated based on the component information such as the material composition, geometric dimensions, rated operating parameters, thermal properties and electrical properties of the component, combined with the overall working conditions of the equipment. The first temperature standard temperature corresponding to the component information is mainly used in this application to establish a temperature reference benchmark for each key component.

[0043] Among them, the second standard temperature corresponding to the connection structure information refers to the expected temperature value of the connection point or contact area under normal operating conditions determined based on the connection mode and relative position relationship between the components inside the device. This temperature value reflects the impact of the internal structure layout of the equipment on heat transfer and distribution. In an embodiment of the present application, the second standard temperature corresponding to the connection structure information can be understood as the expected temperature at the connection point, contact surface or heat transfer path between the functional components in the high-voltage switchgear. This temperature value is calculated based on the connection structure information such as the layout of the conductive circuit, the configuration of the mechanical transmission structure, the arrangement of the insulation structure, combined with the overall working conditions and thermal conductivity characteristics of the equipment. The second standard temperature corresponding to the connection structure information is mainly used in this application to evaluate the rationality of heat transfer and distribution inside the equipment.

[0044] In this embodiment, obtaining the electrical parameters of the high-voltage switchgear and determining the first temperature standard temperature corresponding to the component information and the second standard temperature corresponding to the connection structure information are key steps to achieve accurate thermal monitoring. First, it is necessary to obtain the electrical parameters of the equipment, including the rated voltage, rated current, rated frequency, rated short-circuit breaking current, etc. These parameters can be obtained by consulting the equipment nameplate, technical documents or on-site testing. The purpose of obtaining the electrical parameters is to accurately understand the working state and load conditions of the equipment, which directly affects the heating characteristics of the equipment. Next, based on the acquired component information and electrical parameters, the first temperature standard temperature of each key component under normal working conditions is determined by thermodynamic calculation methods. This process needs to consider factors such as the material properties, geometric dimensions, and current density of the components, and calculate the expected temperature of each component through the heat balance equation. At the same time, it is also necessary to calculate the second standard temperature at the connection point, contact surface or heat transfer path based on the connection structure information and electrical parameters. This process needs to consider factors such as heat conduction, heat convection and heat radiation, and analyze the heat transfer and distribution rules inside the equipment. The purpose of determining these two types of standard temperatures is to establish a comprehensive temperature reference benchmark for subsequent thermal anomaly detection. The effect of this is that the thermal state of the equipment can be evaluated more accurately.

[0045] Based on the above embodiment, as an optional implementation manner, it is determined whether the electrical parameters corresponding to the component information are the rated operating parameters corresponding to the component information; if the electrical parameters corresponding to the component information are not the rated operating parameters corresponding to the component information, the first standard temperature corresponding to the component information is re-determined based on the difference between the rated operating parameters and the electrical parameters.

[0046] In this embodiment, it is determined whether the electrical parameters corresponding to the component information are the rated working parameters corresponding to the component information, and the first standard temperature corresponding to the component information is re-determined when necessary, in order to improve the accuracy and applicability of the standard temperature image. The purpose of this step is to ensure that the first standard temperature can truly reflect the thermal characteristics of the device under the current working state. First, it is necessary to compare the acquired electrical parameters (such as actual current and voltage) with the rated working parameters of the component. This can be done by simple numerical comparison, setting a reasonable error range (such as ±5%) to determine whether there is a significant difference. If it is found that the electrical parameters are not within the error range of the rated working parameters, adjustments need to be made. The specific approach is to use a thermodynamic model to recalculate the first standard temperature based on the difference between the electrical parameters and the rated working parameters. For example, if the actual current is higher than the rated current, the increase in Joule heat needs to be considered, and the first standard temperature needs to be increased accordingly; conversely, if the actual current is lower than the rated current, the first standard temperature needs to be lowered. This adjustment process can use the relationship that the square of the current is proportional to the temperature rise for preliminary estimation, and then consider other factors such as ambient temperature, heat dissipation conditions, etc. for fine-tuning. In this way, a first standard temperature that is more in line with the actual operating conditions can be obtained. The effect of this is to significantly improve the accuracy and practicality of the standard temperature profile. Since high-voltage switchgear often does not work exactly at rated parameters in actual operation, this dynamic adjustment mechanism can better adapt to various working conditions and provide a more accurate temperature reference benchmark.

[0047] S203: Integrate the first standard temperature and the second standard temperature to obtain a standard temperature profile of the high-voltage switchgear.

[0048] In this embodiment, in order to create a complete and accurate temperature reference benchmark for subsequent thermal anomaly detection and equipment status assessment, the first standard temperature and the second standard temperature can be integrated to obtain a standard temperature profile of the high-voltage switchgear to achieve subsequent thermal status assessment.

[0049] In the specific implementation, it is first necessary to systematically integrate the first standard temperature corresponding to the component information and the second standard temperature corresponding to the connection structure information. This process involves mapping and data fusion of spatial temperature distribution. Specifically, the discrete first standard temperature and second standard temperature points can be extended to the entire equipment space using interpolation algorithms or thermal field simulation technology. In this process, the continuity and boundary conditions of heat transfer need to be considered to ensure that the generated temperature distribution conforms to physical laws. At the same time, the influence of the first standard temperature and the second standard temperature needs to be weighed. In some areas, weighted averaging or more representative temperature values ​​may need to be preferred. In this way, a continuous temperature distribution covering the entire high-voltage switchgear can be obtained, that is, a standard temperature portrait. This standard temperature portrait not only contains the expected temperature of each key component, but also reflects the transfer and distribution of heat inside the equipment. The effect of this is to provide a comprehensive temperature reference benchmark that can more accurately reflect the overall thermal characteristics of the equipment under normal working conditions. With this standard temperature portrait, more accurate thermal anomaly detection can be performed, which can not only detect overheating problems of individual components, but also identify local heat accumulation caused by abnormal heat transfer.

[0050] Based on the above embodiment, as an optional implementation, step S203 specifically also includes S301-S303.

[0051] S301: Determine, according to a temperature radiation area corresponding to a first standard temperature, an influence value of the temperature radiation area on a second standard temperature.

[0052] The temperature radiation area refers to the range of influence of heat transfer from a specific part or element in a device or system to the surrounding environment. This area usually includes the heat source itself and the surrounding space affected by thermal radiation. In the embodiment of the present application, the temperature radiation area can be understood as the range of heat diffusion from a certain element or connection point in the high-voltage switchgear to the surrounding area. This area includes not only the heat source element itself, but also the surrounding adjacent areas affected by thermal radiation, heat conduction and thermal convection. The temperature radiation area is mainly used in this application to accurately describe and analyze the thermal distribution characteristics inside the equipment. By defining and analyzing the temperature radiation area, we can better understand the law of heat transfer inside the equipment and identify possible hot spots or heat accumulation areas.

[0053] In this embodiment, the influence value on the second standard temperature is determined according to the temperature radiation area corresponding to the first standard temperature in order to more accurately describe the overall thermal characteristics of the high-voltage switchgear. The purpose of this step is to consider the thermal interaction between components, so as to obtain a more accurate standard temperature portrait. First, it is necessary to determine the temperature radiation area corresponding to the first standard temperature of each component. This can be achieved through thermal field simulation or empirical formulas, taking into account factors such as the geometry, material properties and surrounding environment of the component. Then, it is necessary to analyze the spatial relationship between these temperature radiation areas and the second standard temperature points corresponding to the connection structure information. For each second standard temperature point, it is necessary to identify all temperature radiation areas that have a significant impact on it. Next, it is necessary to calculate the influence value of each temperature radiation area on the corresponding second standard temperature point. This calculation process can be based on the basic principles of heat conduction, heat convection and heat radiation, taking into account factors such as distance, material thermal properties, and spatial barriers.

[0054] S302: Correct the second standard temperature according to the influence value to obtain a third standard temperature.

[0055] The third standard temperature refers to a more accurate and comprehensive temperature reference value obtained after comprehensively considering the characteristics of the component itself, the influence of the connection structure and thermal interaction. In the embodiment of the present application, the third standard temperature can be understood as the ideal temperature value of each key point or area in the high-voltage switchgear after considering all relevant factors. This temperature value is a comprehensive result obtained after further considering the influence of the temperature radiation area on the basis of the first standard temperature (based on component information) and the second standard temperature (based on connection structure information). The third standard temperature is mainly used in this application to provide a more accurate and comprehensive temperature reference benchmark to improve the accuracy of thermal anomaly detection.

[0056] In this embodiment, correcting the second standard temperature according to the impact value to obtain the third standard temperature is a key step to create a more accurate and comprehensive temperature reference benchmark. First, it is necessary to use the influence values ​​calculated in the previous steps. These influence values ​​reflect the degree of influence of the temperature radiation area corresponding to the first standard temperature on the second standard temperature. The correction process can be achieved through a weighted summation or a more complex thermal field superposition algorithm. Specifically, the second standard temperature can be used as the basis, and then the combined effect of the influence values ​​of all relevant temperature radiation areas can be added. This combined effect may be a simple linear superposition, or it may need to consider nonlinear factors such as thermal saturation effects. When making corrections, the physical properties of heat conduction, heat convection, and heat radiation must also be considered to ensure that the correction results conform to the principles of thermodynamics. In addition, it may be necessary to introduce some correction coefficients to adapt to the influence of different materials, geometric structures, and environmental conditions. In this way, the third standard temperature obtained will be closer to the temperature distribution of the equipment under actual operating conditions.

[0057] S303: Integrate the first standard temperature and the third standard temperature to obtain a standard temperature profile of the high-voltage switchgear.

[0058] The purpose of integrating these two standard temperatures is to combine the characteristics of the components themselves and the influence of the overall thermal interaction of the system, so as to obtain a more comprehensive and accurate temperature distribution model. In the specific implementation, it is first necessary to spatially map the first standard temperature (based on component information) and the third standard temperature (taking into account the correction results of thermal interaction). This can be achieved through interpolation algorithms or thermal field simulation technology, extending discrete temperature points to the entire device space. In this process, the continuity and boundary conditions of heat transfer need to be considered to ensure that the generated temperature distribution conforms to the laws of physics. At the same time, it is also necessary to weigh the effects of the first standard temperature and the third standard temperature. In some areas, it may be necessary to perform weighted averaging or give priority to more representative temperature values. For example, in the component body area, the first standard temperature may be more valuable for reference; while in the area between components, the third standard temperature may better reflect the actual situation.

[0059] S102: Adjust the standard temperature image according to the ambient temperature of the high-voltage switchgear to obtain a first temperature image of the high-voltage switchgear as the ambient temperature changes.

[0060] Among them, in the embodiment of the present application, the first temperature image can be understood as a snapshot of the actual temperature distribution of the high-voltage switchgear at a specific time point or operating state. This temperature image is usually presented in two-dimensional or three-dimensional form, using different colors or gray levels to represent the temperature values ​​of various parts of the equipment. The first temperature image is mainly used in this application to reflect the actual thermal state of the high-voltage switchgear and provide basic data for subsequent temperature analysis and abnormality detection. Specifically, it is used to capture the temperature changes during the operation of the equipment and reflect the real-time temperature levels of various components and connection points.

[0061] In this embodiment, in order to consider the influence of ambient temperature on the thermal state of the equipment and obtain a temperature distribution diagram that is closer to the actual operating conditions, the standard temperature image needs to be adjusted according to the ambient temperature to obtain a first temperature image of the high-voltage switchgear changing with the ambient temperature.

[0062] When implementing it, we first need to establish the relationship between the ambient temperature and the device temperature. This can be achieved by analyzing historical data, performing thermodynamic calculations, or conducting experimental tests. This relationship should take into account the temperature response characteristics of each part of the device at different ambient temperatures, including factors such as heat conduction, heat convection, and heat radiation.

[0063] Next, the standard temperature profile needs to be adjusted accordingly based on the current or predicted ambient temperature. This adjustment process may involve nonlinear transformations because different parts of the device may have different sensitivities to ambient temperature. For example, external components may be more sensitive to changes in ambient temperature, while the temperature of internal components may be relatively stable. When making adjustments, interpolation or extrapolation methods can be used to calculate the expected temperature value for each point at a given ambient temperature based on the established relationship.

[0064] It is also necessary to consider the thermal inertia of the device, which is the time-delay effect of temperature changes. This can be achieved by introducing a time factor or using dynamic thermal analysis methods. In addition, factors such as the workload and operating time of the device should also be considered, which may interact with the ambient temperature to affect the thermal state of the device.

[0065] This method can obtain a dynamic first temperature image that changes with the ambient temperature. This temperature image not only reflects the expected temperature distribution of the device at a specific ambient temperature, but also predicts the impact of ambient temperature changes on the thermal state of the device. The effect of this is to significantly improve the accuracy and practicality of temperature monitoring and anomaly detection. By considering the impact of ambient temperature, it is possible to more accurately determine whether the actual thermal state of the device is normal, reducing false alarms or missed alarms caused by ambient temperature changes.

[0066] S103: Acquire an infrared thermal image of the high-voltage switchgear to generate a second temperature image of the high-voltage switchgear.

[0067] Among them, the second temperature image refers to the real-time temperature distribution diagram of the high-voltage switchgear obtained by actual measurement. In the embodiment of the present application, the second temperature image can be understood as a visual representation of the current temperature state of the equipment directly collected by the temperature measurement device using infrared thermal imaging technology. This temperature image is usually presented in two-dimensional or three-dimensional form, using different colors or grayscale levels to intuitively display the actual temperature values ​​of various parts of the equipment. The second temperature image is mainly used in this application to reflect the actual thermal state of the high-voltage switchgear, and provide key data for real-time monitoring and abnormal diagnosis of the equipment.

[0068] In this embodiment, obtaining an infrared thermal image of the high-voltage switchgear and generating a second temperature image are key steps to achieve real-time temperature monitoring. This process aims to accurately capture the actual thermal state of the equipment and provide reliable basic data for subsequent temperature analysis and abnormality detection. First, it is necessary to use a high-precision infrared thermal imaging device to scan the high-voltage switchgear. These devices can be fixed infrared cameras or portable thermal imagers, and the specific selection depends on the layout of the equipment and monitoring requirements. When performing infrared scanning, it is necessary to ensure that all key parts of the equipment are covered, including various components, connection points, and areas where thermal problems may occur. During the scanning process, the geometric structure and material properties of the equipment should be considered to minimize the errors caused by differences in reflection and emissivity. After obtaining the infrared thermal image, the image needs to be processed and analyzed to convert the thermal image into accurate temperature data. This process involves steps such as image calibration, temperature calculation, and spatial mapping. At the same time, the image needs to be filtered and enhanced to improve the clarity and readability of the temperature distribution. In the spatial mapping stage, the two-dimensional thermal image needs to be matched with the three-dimensional structure of the equipment to ensure that the temperature data can accurately correspond to each part of the equipment.

[0069] Based on the embodiment, as an optional implementation, initial infrared images of two adjacent frames of the high-voltage switchgear are acquired; the initial infrared images of the two adjacent frames are averaged to obtain a second temperature image of the high-voltage switchgear.

[0070] In this embodiment, the process of obtaining the second temperature image of the high-voltage switchgear is further optimized. This optimization method involves obtaining two adjacent frames of initial infrared images and performing mean processing on the two frames of images to obtain a more stable and accurate second temperature image. This improvement is intended to reduce the impact of instantaneous fluctuations and noise on temperature measurement and improve the quality and reliability of temperature images.

[0071] In the specific implementation, it is first necessary to use infrared thermal imaging equipment to continuously collect thermal images of high-voltage switchgear at a high frame rate. From these continuously collected images, two adjacent initial infrared images are selected as processing objects. The two adjacent frames are selected to ensure that the time interval is short enough so that the thermal state of the equipment will not change significantly during this time period, while capturing small temperature fluctuations.

[0072] Next, the two initial infrared images are averaged. This process is essentially to perform arithmetic averaging on the temperature value of each pixel. Specifically, for each corresponding position in the image, the average value of the temperature values ​​of the two frames at that position is calculated, and this average value is used as the temperature value of that position in the final second temperature image. This average processing can be achieved by an image processing algorithm, such as using a matrix operation at the pixel level.

[0073] S104: monitoring whether the high-voltage switchgear has a thermal abnormality fault according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image.

[0074] The temperature difference value refers to the numerical difference between the actual measured temperature and the expected temperature of the high-voltage switchgear. In the embodiment of the present application, the temperature difference value can be understood as the difference between the temperature values ​​at the corresponding positions between the second temperature image (the temperature distribution obtained by actual measurement) and the first temperature image (the expected temperature distribution obtained based on the standard temperature image and the ambient temperature adjustment). The temperature difference value is mainly used in the present application to quantify and evaluate the deviation between the actual thermal state and the expected state of the high-voltage switchgear, and to provide key indicators for the health status monitoring and abnormal diagnosis of the equipment.

[0075] Among them, the temperature difference area refers to the area range where there is a significant difference between the actual measured temperature and the expected temperature of the high-voltage switchgear. In the embodiment of the present application, the temperature difference area can be understood as the total area of ​​the region where the temperature difference value exceeds a specific threshold after comparing the second temperature image (the temperature distribution obtained by actual measurement) with the first temperature image (the expected temperature distribution obtained based on the standard temperature portrait and ambient temperature adjustment). This area can be expressed in terms of the number of pixels, the actual physical area (such as square meters), or the percentage of the entire monitoring area. The temperature difference area is mainly used in this application to evaluate the scope and degree of temperature anomalies in high-voltage switchgear, providing an important reference for equipment health status monitoring and risk assessment.

[0076] In this embodiment, by comparing the first temperature image and the second temperature image, the temperature difference value and the temperature difference area are calculated, so as to monitor whether the high-voltage switchgear has a thermal abnormality fault. The core of this method is to comprehensively utilize the information of the two dimensions of the amplitude and range of the temperature difference to achieve a more comprehensive and accurate fault diagnosis. First, it is necessary to compare the first temperature image (the expected temperature distribution obtained based on the standard temperature portrait and the ambient temperature adjustment) with the second temperature image (the temperature distribution obtained by actual measurement) at the pixel level. Through this comparison, the temperature difference value of each pixel point can be calculated, that is, the difference between the actual temperature and the expected temperature. This process can be achieved by an image processing algorithm, such as a matrix subtraction operation. Next, a threshold value of the temperature difference value needs to be set to determine which areas have significant temperature differences. The setting of this threshold is usually determined based on the characteristics of the equipment, the operating environment and the safety standards. For example, an area that exceeds the expected temperature by 5°C or is lower than the expected temperature by 3°C may be regarded as a significant difference area. Based on this threshold, the temperature difference area can be calculated, that is, the total area of ​​the area where the temperature difference value exceeds the threshold. After obtaining the temperature difference value and the temperature difference area, a multi-level judgment strategy can be used to monitor thermal abnormality faults. Furthermore, different thresholds can be set for different components or areas, taking into account the characteristics and importance of each component. We can also introduce the time dimension to track the changing trends of temperature difference values ​​and temperature difference areas to capture potential progressive failures.

[0077] Based on the above embodiment, as an optional implementation, step S104 specifically also includes S401-S402.

[0078] S401: Compare temperature difference values ​​at corresponding positions between the first temperature image and the second temperature image to determine a first abnormal area where the temperature difference value is greater than a preset first threshold.

[0079] The first abnormal area refers to the area in the high-voltage switchgear where the temperature deviation exceeds the preset first threshold. In the embodiment of the present application, the first abnormal area can be understood as a continuous area where the temperature difference value exceeds the first threshold after comparing the second temperature image (the temperature distribution actually measured) with the first temperature image (the expected temperature distribution adjusted based on the standard temperature image and the ambient temperature). The first threshold here indicates that the actual temperature is higher than the allowable range of the expected temperature.

[0080] First, the first temperature image (the expected temperature distribution based on the standard temperature profile and the ambient temperature adjustment) needs to be compared with the second temperature image (the actual measured temperature distribution) at the pixel level. This process can be achieved through image processing algorithms, such as matrix subtraction operations. For each pixel, the difference between the actual temperature and the expected temperature is calculated, that is, the temperature difference value. This pixel-accurate comparison ensures that we capture every temperature change on the surface of the device and do not miss any potential problem areas.

[0081] Then a preset first threshold needs to be set. This threshold represents how much temperature difference we consider to be significant, and may indicate a potential overheating problem. The setting of the first threshold is usually determined based on the characteristics of the equipment, the operating environment, safety standards, and historical operating data. For example, the first threshold may be set to 5°C, which means that when the actual temperature is 5°C or more higher than the expected temperature, it is considered that this area may have an overheating problem. After setting the first threshold, the entire temperature difference image is traversed to identify all pixels whose temperature difference values ​​are greater than the first threshold. These pixels together constitute the first abnormal area. It is worth noting that the first abnormal area may not be a continuous area, but may be composed of multiple scattered hot spots or hot zones.

[0082] In an optional implementation, the first threshold may be determined using the following steps.

[0083] Obtain historical temperature data corresponding to each position in the high-voltage switchgear, and draw a temperature change curve corresponding to each position; determine the first threshold value corresponding to each position in the high-voltage switchgear according to the temperature change range and temperature change rate in the temperature change curve.

[0084] In order to improve the accuracy and sensitivity of thermal anomaly detection, taking into account the characteristics of different parts of the equipment and the differences in the normal operating temperature range, the historical temperature data of each position in the high-voltage switchgear can be obtained, the temperature change curve can be drawn, and the first threshold corresponding to each position can be determined based on the characteristics of these curves.

[0085] First, it is necessary to collect and organize the historical temperature data of various locations in the high-voltage switchgear. These data may come from long-term temperature monitoring records, including temperature data during normal operation, temperature data under different load conditions, and temperature data during possible minor anomalies or faults. The time span of the data should be long enough to cover the temperature changes of the equipment in different seasons and under different operating conditions.

[0086] Next, use these historical temperature data to draw temperature change curves for each key location of the equipment. These curves can be two-dimensional time-temperature curves or multi-dimensional curves that consider multiple factors such as load and ambient temperature. The purpose of drawing these curves is to intuitively display the temperature change pattern of each location, including the temperature fluctuation range, change trend, periodic change and other characteristics.

[0087] After obtaining the temperature change curve, we focus on analyzing two key features: temperature change range and temperature change rate. The temperature change range reflects the temperature fluctuation range of the location under normal operating conditions, which can be determined by calculating the statistical characteristics of historical data (such as mean and standard deviation). The temperature change rate reflects the speed of temperature change, which can be obtained by calculating the derivative of temperature change over time.

[0088] S402: If the temperature difference area of ​​the first abnormal region is greater than a preset second threshold, it is determined that a thermal abnormality fault exists in the high-voltage switchgear, and a thermal abnormality fault signal is output.

[0089] In-depth analysis based on the identification of the first abnormal area can improve the accuracy and reliability of fault diagnosis and avoid false alarms caused by local small-scale temperature fluctuations. The temperature difference area of ​​the first abnormal area can be further evaluated and compared with the preset second threshold to determine whether the high-voltage switchgear has a thermal abnormality fault.

[0090] First, the temperature difference area of ​​the first abnormal area needs to be calculated. This can be achieved by counting the number of pixels in the first abnormal area, and then converting the number of pixels into the actual physical area. For example, if we know the actual area represented by each pixel, we can multiply the number of pixels by the unit pixel area to get the temperature difference area. Or we can calculate the ratio of the number of pixels in the first abnormal area to the total number of pixels in the entire monitoring area to get a percentage value.

[0091] Next, a preset second threshold needs to be set. This threshold represents how large the temperature difference area must be before we can determine that there is a thermal anomaly fault. The setting of the second threshold is usually determined based on the size, type, importance and historical operating data of the equipment. For example, the second threshold may be set to 5% of the surface area of ​​the equipment, which means that when the area of ​​the first abnormal area exceeds 5% of the total surface area of ​​the equipment, it is considered that the equipment may have a thermal anomaly fault.

[0092] After setting the second threshold, the calculated temperature difference area is compared with the second threshold. If the temperature difference area is greater than the second threshold, it is determined that the high-voltage switchgear has a thermal abnormality fault, and a thermal abnormality fault signal is output immediately. This signal can be a simple Boolean value (such as true indicates a fault) or a data structure containing more information, such as detailed information such as the fault type, severity, and location of the fault area.

[0093] The following is an embodiment of the system of the present application, which can be used to execute the embodiment of the method of the present application. For details not disclosed in the embodiment of the system of the present application, please refer to the embodiment of the method of the application.

[0094] See also Figure 2 , which shows a schematic diagram of the structure of an intelligent monitoring system for high-voltage switchgear provided by an exemplary embodiment of the present application. The system can be implemented as all or part of the system through software, hardware, or a combination of both. The intelligent monitoring system for high-voltage switchgear includes: A standard temperature profile determination module is used to obtain internal structure information and electrical parameters of the high-voltage switchgear and determine a standard temperature profile of the high-voltage switchgear; A first temperature image determination module, used to adjust the standard temperature image according to the ambient temperature of the high-voltage switchgear, and obtain a first temperature image of the high-voltage switchgear changing with the ambient temperature; A second temperature image generating module, used to acquire an infrared thermal image of the high-voltage switchgear and generate a second temperature image of the high-voltage switchgear; The monitoring module is used to monitor whether the high-voltage switchgear has a thermal abnormality fault according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image.

[0095] Based on the above embodiments, as an optional embodiment, the standard temperature portrait determination module is also used to obtain internal structure information of the high-voltage switchgear, the internal structure information includes component information and connection structure information; obtain electrical parameters of the high-voltage switchgear, determine the first standard temperature corresponding to the component information, and the second standard temperature corresponding to the connection structure information; integrate the first standard temperature and the second standard temperature to obtain a standard temperature portrait of the high-voltage switchgear.

[0096] Based on the above embodiment, as an optional embodiment, the standard temperature portrait determination module is also used to determine whether the electrical parameters corresponding to the component information are the rated operating parameters corresponding to the component information; if the electrical parameters corresponding to the component information are not the rated operating parameters corresponding to the component information, then the first standard temperature corresponding to the component information is re-determined based on the difference between the rated operating parameters and the electrical parameters.

[0097] Based on the above embodiments, as an optional embodiment, the standard temperature portrait determination module is also used to determine the influence value of the temperature radiation area on the second standard temperature according to the temperature radiation area corresponding to the first standard temperature; correct the second standard temperature according to the influence value to obtain the third standard temperature; integrate the first standard temperature and the third standard temperature to obtain the standard temperature portrait of the high-voltage switchgear.

[0098] Based on the above embodiment, as an optional embodiment, the second temperature image generation module is also used to obtain the initial infrared images of two adjacent frames of the high-voltage switchgear; perform mean processing on the initial infrared images of the two adjacent frames to obtain the second temperature image of the high-voltage switchgear.

[0099] Based on the above embodiment, as an optional embodiment, the monitoring module is also used to compare the temperature difference values ​​at corresponding positions between the first temperature image and the second temperature image, and determine a first abnormal area where the temperature difference value is greater than a preset first threshold; if the temperature difference area of ​​the first abnormal area is greater than the preset second threshold, it is determined that the high-voltage switchgear has a thermal abnormality fault, and a thermal abnormality fault signal is output.

[0100] Based on the above embodiments, as an optional embodiment, the monitoring module is also used to obtain historical temperature data corresponding to each position in the high-voltage switch device, and draw a temperature change curve corresponding to each position; according to the temperature change range and temperature change rate in the temperature change curve, determine the first threshold value corresponding to each position in the high-voltage switch device.

[0101] The present application also provides a computer storage medium that can store multiple instructions, which are suitable for being loaded and executed by a processor as described above. Figure 1 The intelligent monitoring method for high-voltage switchgear of the embodiment shown in the figure can be specifically implemented by referring to Figure 1 The specific description of the illustrated embodiment will not be repeated here.

[0102] See also Figure 3 , is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3 As shown, the electronic device 300 may include: at least one processor 301 , at least one network interface 304 , a user interface 303 , a memory 305 , and at least one communication bus 302 .

[0103] The communication bus 302 is used to realize the connection and communication between these components.

[0104] The user interface 303 may include a standard wired interface or a wireless interface.

[0105] The network interface 304 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).

[0106] Among them, the processor 301 may include one or more processing cores. The processor 301 uses various interfaces and lines to connect various parts in the entire server, and executes various functions of the server and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 305, and calling data stored in the memory 305. Optionally, the processor 301 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 301 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 301, and it can be implemented separately through a chip.

[0107] Among them, the memory 305 may include a random access memory (Random Access Memory, RAM) and may also include a read-only memory (Read-Only Memory). Optionally, the memory 305 includes a non-transitory computer-readable storage medium. The memory 305 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 305 may also be optionally at least one storage device located away from the aforementioned processor 301. As Figure 3 As shown, the memory 305 as a computer storage medium may include an operating system, a network communication module, a user interface module, and an application program of an intelligent monitoring method for high-voltage switchgear.

[0108] exist Figure 3 In the electronic device 300 shown, the user interface 303 is mainly used to provide an input interface for the user and obtain data input by the user; and the processor 301 can be used to call an application program stored in the memory 305 for an intelligent monitoring method for high-voltage switchgear. When executed by one or more processors, the electronic device executes one or more methods in the above-mentioned embodiments.

[0109] An electronic device readable storage medium stores instructions, which, when executed by one or more processors, enable the electronic device to execute one or more methods in the above embodiments.

[0110] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the order of the actions described, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for the present application.

[0111] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0112] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0113] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0114] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0115] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: various media that can store program codes, such as USB flash drives, mobile hard drives, magnetic disks or optical disks.

[0116] The above are only exemplary embodiments of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and the truth of practice, it will be easy for those skilled in the art to think of other embodiments of the present disclosure. This application is intended to cover any variation, use or adaptive change of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the technical field that are not recorded in the present disclosure.

Claims

1. An intelligent monitoring method for high-voltage switchgear, characterized in that: The method comprises: Obtaining internal structural information and electrical parameters of the high-voltage switchgear and determining a standard temperature profile of the high-voltage switchgear; The standard temperature image is adjusted according to the ambient temperature of the high-voltage switchgear to obtain a first temperature image of the high-voltage switchgear as the ambient temperature changes; Acquire an infrared thermal image of the high-voltage switchgear to generate a second temperature image of the high-voltage switchgear; Whether the high-voltage switchgear has a thermal abnormality fault is monitored according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image.

2. The method according to claim 1, characterized in that The step of monitoring whether the high-voltage switchgear has a thermal abnormality fault according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image includes: Comparing temperature difference values ​​at corresponding positions between the first temperature image and the second temperature image, determining a first abnormal area where the temperature difference value is greater than a preset first threshold; If the temperature difference area of ​​the first abnormal region is greater than a preset second threshold, it is determined that the high-voltage switchgear has a thermal abnormality fault, and a thermal abnormality fault signal is output.

3. The method according to claim 2, characterized in that Before comparing the temperature difference values ​​at corresponding positions between the first temperature image and the second temperature image to determine the first abnormal area where the temperature difference value is greater than a preset first threshold, the method further includes: Acquire historical temperature data corresponding to each position in the high-voltage switchgear, and draw a temperature change curve corresponding to each position; According to the temperature change interval and the temperature change rate in the temperature change curve, a first threshold value corresponding to each position in the high-voltage switchgear is determined.

4. The method according to claim 1, characterized in that: The obtaining of internal structural information and electrical parameters of the high-voltage switchgear and determining a standard temperature profile of the high-voltage switchgear includes: Acquiring internal structure information of the high-voltage switchgear, wherein the internal structure information includes component information and connection structure information; Acquire electrical parameters of the high-voltage switchgear, determine a first standard temperature corresponding to the component information, and a second standard temperature corresponding to the connection structure information; The first standard temperature and the second standard temperature are integrated to obtain a standard temperature profile of the high-voltage switchgear.

5. The method according to claim 4, characterized in that After acquiring the electrical parameters of the high-voltage switchgear and determining the first standard temperature corresponding to the component information and the second standard temperature corresponding to the connection structure information, the method further includes: Determining whether the electrical parameters corresponding to the component information are the rated operating parameters corresponding to the component information; If the electrical parameter corresponding to the component information is not the rated operating parameter corresponding to the component information, the first standard temperature corresponding to the component information is re-determined according to the difference between the rated operating parameter and the electrical parameter.

6. The method according to claim 4, characterized in that The integrating the first standard temperature and the second standard temperature to obtain a standard temperature profile of the high-voltage switchgear includes: Determine, according to the temperature radiation area corresponding to the first standard temperature, an influence value of the temperature radiation area on the second standard temperature; Correcting the second standard temperature according to the influence value to obtain a third standard temperature; The first standard temperature and the third standard temperature are integrated to obtain a standard temperature profile of the high-voltage switchgear.

7. The method according to claim 1, characterized in that The step of acquiring the infrared thermal image of the high-voltage switchgear and generating a second temperature image of the high-voltage switchgear comprises: Acquiring two adjacent frames of initial infrared images of the high-voltage switchgear; The initial infrared images of two adjacent frames are averaged to obtain a second temperature image of the high-voltage switchgear.

8. An intelligent monitoring system for high-voltage switchgear, characterized in that: The system comprises: A standard temperature profile determination module, used to obtain internal structure information and electrical parameters of the high-voltage switchgear and determine a standard temperature profile of the high-voltage switchgear; A first temperature image determination module, configured to adjust the standard temperature image according to the ambient temperature of the high-voltage switchgear, and obtain a first temperature image of the high-voltage switchgear as it changes with the ambient temperature; A second temperature image generating module, used for acquiring an infrared thermal image of the high-voltage switchgear and generating a second temperature image of the high-voltage switchgear; The monitoring module is used to monitor whether the high-voltage switch device has a thermal abnormality fault according to the temperature difference value and the temperature difference area between the first temperature image and the second temperature image.

9. A computer storage medium, characterized in that The computer storage medium stores a plurality of instructions, and the instructions are suitable for being loaded by a processor and executing the method according to any one of claims 1 to 7.

10. An electronic device, characterized in that: It includes a processor, a memory and a transceiver, the memory is used to store instructions, the transceiver is used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device executes the method according to any one of claims 1 to 7.

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