400G DR4 silicon optical chip, optical engine and coupling method

Abstract

The invention relates to a 400G DR4 silicon optical chip which is characterized in that two input waveguides are distributed in a splayed shape, beam opening ends of the two input waveguides face outwards, one input waveguide is inclined forwards by 8 degrees + / -1 degrees, the other input waveguide is inclined backwards by 8 degrees + / -1 degrees, and each input waveguide is respectively coupled with four output waveguides. A 400G DR4 silicon optical engine is characterized in that a light emitting assembly, an aspheric lens, an optical isolator, a prism and a 400G DR4 silicon optical chip are sequentially coupled in the light propagation direction, and the center of the optical axis of the light emitting assembly is located in the middle of two input waveguides in the 400G DR4 silicon optical chip; the light emitted by the light emitting assembly in the horizontal direction is turned by 8 degrees + / -1 degrees in the forward direction or the reverse direction by the prism and then is coupled into the input waveguide which is inclined by 8 degrees + / -1 degrees in the forward direction or the reverse direction. The beneficial effects are that the laser chip in the light emitting assembly can be pasted without inclining 8 degrees + / -1 degrees, the pasting difficulty can be reduced, and the light power and the yield can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of optical engines, and in particular to a 400G DR4 silicon photonic chip, an optical engine and a coupling method. Background Art

[0002] The structure of the traditional 400G DR4 silicon photonic engine is as follows: Figure 1 As shown, it includes: a 400G DR4 silicon photonic chip, an optical transmitter component, an aspheric lens, an optical isolator and a multi-channel optical fiber array. The 400G DR4 silicon photonic chip has an input waveguide and four output waveguides. To reduce light reflection, the input waveguide and the output waveguide are both tilted forward by 8°±1°. The input waveguide is coupled with the four output waveguides. The specific coupling method is: the input waveguide is first divided into 2 paths by a 1×2 geometric coupler, and then divided into 4 paths by two 1×2 geometric couplers. The emission light of the optical transmitter component is coupled into the input waveguide of the 400G DR4 silicon photonic chip through the aspheric lens and the optical isolator in turn. Since the input waveguide is tilted forward by 8°±1°, the optical transmitter component, the aspheric lens and the optical isolator are all tilted forward by 8°±1°, and the laser chip in the optical transmitter component is tilted by 8°±1°, which makes it difficult to patch. In addition, the quality of the input waveguide coupling end face is not high, and some 400G The input waveguide insertion loss of the DR4 silicon photonic chip will be about 1dB larger. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a 400G DR4 silicon photonic chip, an optical engine and a coupling method to overcome the deficiencies in the above-mentioned prior art.

[0004] The technical solution of the present invention to solve the above technical problems is as follows: a 400G DR4 silicon photonic chip, which has two input waveguides and four output waveguides, the two input waveguides are distributed in an eight-shaped shape, and the bundle end faces outward, one of the two input waveguides is positively tilted 8°±1°, and the other input waveguide is negatively tilted 8°±1°, each input waveguide is coupled with four output waveguides, and the four output waveguides are all positively tilted 8°±1°.

[0005] The beneficial effects of the present invention are as follows: a 400G DR4 silicon photonic chip is designed with two input waveguides, and one of the two input waveguides is tilted positively by 8°±1°, and the other input waveguide is tilted negatively by 8°±1°, and each input waveguide is coupled with four output waveguides respectively. Therefore, any one of the two input waveguides can propagate light to the four output waveguides in equal proportion. When it is applied to a 400G DR4 silicon photonic engine, the optical axis center of the optical transmitting component is located in the middle of the two input waveguides in the 400G DR4 silicon photonic chip. First, a prism is coupled between the optical isolator and the 400GDR4 silicon photonic chip in an unfixed manner, and then a non-spherical lens is coupled between the optical transmitting component and the optical isolator, and the coupled optical power P1 is recorded. Then, the prism is flipped 180°, and the prism is coupled between the optical isolator and the 400G in an unfixed manner. The DR4 silicon photonic chip is connected between the optical emitting component and the optical isolator, and the aspheric lens is coupled between the optical emitting component and the optical isolator. The coupled optical power P2 is recorded and the coupled optical power P1 is compared with the coupled optical power P2. The prism is fixed in the direction with the larger optical power. With this structure, the laser chip in the optical emitting component does not need to be tilted 8°±1° for patching, which not only reduces the difficulty of patching, but also improves the optical power and yield. When one of the input waveguides is damaged or the insertion loss is large, the other input waveguide can be used, so that the 400G DR4 silicon photonic chip can continue to be used.

[0006] Based on the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the two input waveguides are coupled to the two input ends of a 2×2 geometric ratio coupler, the two output ends of the 2×2 geometric ratio coupler are respectively coupled to the input ends of two 1×2 geometric ratio couplers, and the four output ends of the two 1×2 geometric ratio couplers are respectively coupled to the four output waveguides.

[0008] A further beneficial effect of the above method is that each input waveguide can transmit light to four output waveguides in equal proportions.

[0009] Furthermore, the four output ends of the two 1×2 equal ratio couplers are coupled to the four output waveguides via an MZM modulator respectively.

[0010] Based on the above technical solution, the present invention also provides a 400G DR4 silicon photonic engine, including: an optical emitting component, an aspheric lens, an optical isolator, a prism and a 400G DR4 silicon photonic chip. The optical emitting component, the aspheric lens, the optical isolator, the prism and the 400G DR4 silicon photonic chip are coupled in sequence along the light propagation direction. The optical emitting component is horizontally arranged and the center of its optical axis is located in the middle of the two input waveguides in the 400G DR4 silicon photonic chip. The horizontally emitted light of the optical emitting component is coupled into the input waveguide of the 400G DR4 silicon photonic chip after being turned 8°±1° forward or reversely by the prism and then tilted 8°±1° forward or reversely.

[0011] The further beneficial effect of adopting the above is: let the optical axis center of the optical transmission component be located in the middle of the two input waveguides in the 400G DR4 silicon photonic chip, first couple the prism between the optical isolator and the 400G DR4 silicon photonic chip in an unfixed manner, then couple the aspherical lens between the optical transmission component and the optical isolator, and record the coupled optical power P1, then flip the prism 180°, couple the prism between the optical isolator and the 400G DR4 silicon photonic chip in an unfixed manner, then couple the aspherical lens between the optical transmission component and the optical isolator, and record the coupled optical power P2, compare the coupled optical power P1 and the coupled optical power P2, and fix the prism in the direction with the larger optical power. With this structure, the laser chip in the optical transmission component does not need to be tilted 8°±1° for patching, which can not only reduce the difficulty of patching, but also improve the optical power and yield. When one of the input waveguides is damaged or the insertion loss is large, the other input waveguide can be used, so that the 400G DR4 silicon photonic chip can continue to be used.

[0012] Furthermore, the input waveguide is made of silicon dioxide, the prism is made of silicon dioxide, the refractive index of silicon dioxide is 1.44 to 1.46, and the light incident surface of the prism is inclined at 10.08° to 13.18°.

[0013] The above further beneficial effect is that the emitted light can be coupled into the input waveguide of the 400G DR4 silicon photonic chip with a forward tilt of 8°±1° after being turned forward by the prism by 8°±1°, or the emitted light can be coupled into the input waveguide of the 400G DR4 silicon photonic chip with a reverse tilt of 8°±1° after being turned backward by the prism by 8°±1°.

[0014] Furthermore, the light incident surface of the prism is coated with an anti-reflection film.

[0015] Further beneficial effects of adopting the above are: reducing light reflection and improving coupling efficiency.

[0016] Furthermore, the prism is bonded to the 400G DR4 silicon photonic chip using glue with a refractive index of 1.4 to 1.45.

[0017] The further beneficial effect of adopting the above method is: due to the glue with a point refractive index of 1.4 to 1.45 between the prism and the 400G DR4 silicon photonic chip, the light reflection at the input waveguide end face of the 400G DR4 silicon photonic chip can be reduced, and the mode spot of the input waveguide can be increased to further improve the coupling efficiency.

[0018] Furthermore, the optical emission component includes: a ceramic heat sink and a laser chip integrated on the ceramic heat sink.

[0019] Furthermore, the four output waveguides of the 400G DR4 silicon photonic chip are coupled to a multi-channel optical fiber array, and the end face of the multi-channel optical fiber array is tilted by 8°±1°.

[0020] Based on the above technical solution, the present invention also provides a 400G DR4 silicon photonic engine coupling method for coupling a 400G DR4 silicon photonic engine, comprising the following steps:

[0021] S1. Fix the optical transmitter assembly, optical isolator and 400G DR4 silicon photonic chip horizontally in the direction of light propagation, and make the optical axis center of the optical transmitter assembly located in the middle of the two input waveguides in the 400G DR4 silicon photonic chip;

[0022] S2, coupling the prism between the optical isolator and the 400G DR4 silicon photonic chip in an unfixed manner;

[0023] S3, couple the aspherical lens between the optical transmitter and the optical isolator, and record the coupled optical power P1 of the 400G DR4 silicon photonic chip;

[0024] S4, flip the prism 180° and couple the prism between the optical isolator and the 400G DR4 silicon photonic chip in an unfixed manner;

[0025] S5. Couple the aspheric lens between the optical transmitter and the optical isolator, and record the coupled optical power P2 of the 400G DR4 silicon photonic chip;

[0026] S6, comparing the coupling optical power P1 and the coupling optical power P2, and selecting a scheme with a larger coupling optical power, and then fixing the prism according to the prism distribution method in the scheme;

[0027] S7, fix the aspheric lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a structural diagram of a 400G DR4 silicon photonics engine in the prior art;

[0029] Figure 2 This is a structural diagram of the 400G DR4 silicon photonic chip in the present invention;

[0030] Figure 3 This is a first structural diagram of the 400G DR4 silicon photonic engine in the present invention;

[0031] Figure 4 This is the second structural diagram of the 400G DR4 silicon photonic engine in the present invention.

[0032] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0033] 1. 400G DR4 silicon photonic chip, 110. Input waveguide, 120. Output waveguide, 130. 2×2 ratio coupler, 140. 1×2 ratio coupler, 150. MZM modulator, 2. Optical transmission component, 210. Ceramic heat sink, 220. Laser chip, 3. Aspherical lens, 4. Optical isolator, 5. Prism, 6. Multi-channel fiber array. DETAILED DESCRIPTION

[0034] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0035] Example 1

[0036] like Figure 2 As shown, a 400G DR4 silicon photonic chip has two input waveguides 110 and four output waveguides 120, wherein the two input waveguides 110 are distributed in an eight-shaped shape, and the beam end of the eight-shaped shape is facing outward, and the so-called outward subsequent refers to facing the optical transmission component 2; one of the two input waveguides 110 is positively tilted by 8°±1°, preferably 8°, and the other of the two input waveguides 110 is negatively tilted by 8°±1°, preferably 8°, which can also be understood as the two input waveguides 110 are mirror-distributed, and each input waveguide 110 is coupled with four output waveguides 120 respectively, which can also be understood as: one of the two input waveguides 110 is coupled with four output waveguides 120, and the other of the two input waveguides 110 is also coupled with four output waveguides 120, and the four output waveguides 120 are all positively tilted by 8°±1°, preferably 8°;

[0037] The 400G DR4 silicon photonic chip 1 is designed with two input waveguides 110, and one of the two input waveguides 110 is tilted positively by 8°±1°, and the other input waveguide 110 is tilted negatively by 8°±1°, and each input waveguide 110 is coupled with four output waveguides 120 respectively. Therefore, any one of the two input waveguides 110 can propagate light to the four output waveguides 120 in equal proportion. When it is applied to the 400G DR4 silicon photonic engine, the optical axis center of the optical transmitting component 2 is located in the middle of the two input waveguides 110 in the 400G DR4 silicon photonic chip 1. The prism 5 is first coupled between the optical isolator 4 and the 400G DR4 silicon photonic chip 1 in an unfixed manner. The 400G DR4 silicon photonic chip 1 is connected to the optical isolator 4, and then the aspheric lens 3 is coupled between the optical emitting component 2 and the optical isolator 4, and the coupled optical power P1 is recorded. The prism 5 is then flipped 180°, and the prism 5 is coupled between the optical isolator 4 and the 400G DR4 silicon photonic chip 1 in an unfixed manner. The aspheric lens 3 is then coupled between the optical emitting component 2 and the optical isolator 4, and the coupled optical power P2 is recorded. The coupled optical power P1 and the coupled optical power P2 are compared, and the prism 5 is fixed in the direction in which the optical power is larger. With this structure, the laser chip 220 in the optical emitting component 2 does not need to be tilted 8°±1° for patching, which can not only reduce the difficulty of patching, but also improve the optical power and yield. When one of the input waveguides 110 is damaged or the insertion loss is large, the other input waveguide 110 can be used, so that the 400G DR4 silicon photonic chip 1 can continue to be used.

[0038] Example 2

[0039] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0040] The two input waveguides 110 are coupled to the two input ends of a 2×2 geometric ratio coupler 130, and the two output ends of the 2×2 geometric ratio coupler 130 are respectively coupled to the input ends of two 1×2 geometric ratio couplers 140. Since there are two 1×2 geometric ratio couplers 140, there are four output ends of the two 1×2 geometric ratio couplers 140. The four output ends of the two 1×2 geometric ratio couplers 140 are respectively coupled to the four output waveguides 120. Taking one of the input waveguides 110 as an example, when the emission light is coupled into the input waveguide 110, the initial emission light will be split into two beams by the 2×2 equal ratio coupler 130 at a splitting ratio of 50:50, and propagate to two 1×2 equal ratio couplers 140 respectively. Each 1×2 equal ratio coupler 140 will then split the emission light accounting for 50% of the initial emission light into two beams at a splitting ratio of 50:50, and propagate to the two output waveguides 120 coupled to it respectively.

[0041] Furthermore, the four output ends of the two 1×2 equal-ratio couplers 140 are coupled to the four output waveguides 120 via a MZM modulator 150 respectively, that is, four MZM modulators 150 are provided.

[0042] Example 3

[0043] like Figure 3 , Figure 4 As shown, a 400G DR4 silicon photonic engine comprises: an optical transmitting component 2, an aspheric lens 3, an optical isolator 4, a prism 5 and the 400G DR4 silicon photonic chip 1 as described in Embodiment 1 or 2, wherein the optical transmitting component 2, the aspheric lens 3, the optical isolator 4, the prism 5 and the 400G DR4 silicon photonic chip 1 are coupled in sequence along the light propagation direction, and the optical transmitting component 2 is arranged horizontally and the center of its optical axis is located in the middle of two input waveguides 110 in the 400G DR4 silicon photonic chip 1;

[0044] The horizontally emitted light of the optical emission component 2 is coupled into the input waveguide 110 of the 400G DR4 silicon photonic chip 1 with a forward tilt of 8°±1° after being forward-bent by the prism 5. Figure 3 As shown;

[0045] Or, the horizontally emitted light of the optical emitting component 2 is reversely turned by the prism 5 by 8°±1° and then coupled into the input waveguide 110 of the 400G DR4 silicon photonic chip 1 which is reversely tilted by 8°±1°, as shown in FIG. Figure 4 shown.

[0046] Example 4

[0047] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of embodiment 3, and the details are as follows:

[0048] The material of the prism 5 is preferably the same as that of the input waveguide 110, that is, the same material, and the material of the input waveguide 110 is usually silicon dioxide, so the material of the prism 5 is silicon dioxide, and the refractive index of silicon dioxide is 1.44-1.46. The light incident surface of the prism 5 is inclined by 10.08°-13.18°, and the specific inclination angle calculation method is as follows:

[0049] Si n(a)×air refractive index=sin(b)×prism refractive index. Since prism 5 will reverse the emitted light by 8°±1° or forward by 8°±1°, then b=8°±1°. The refractive index of silica is 1.44~1.46, and the refractive index of the prism is also 1.44~1.46. Therefore, the final light incident surface of prism 5 is inclined vertically by 10.08°~13.18°. In this embodiment, b is preferably 8°, and the refractive index of silica is preferably 1.45. Then the final light incident surface of prism 5 is inclined by 11.64°.

[0050] Example 5

[0051] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of embodiment 4, and the details are as follows:

[0052] The light incident surface of the prism 5 is coated with an anti-reflection film to reduce light reflection and improve coupling efficiency.

[0053] Example 6

[0054] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of Embodiment 4 or 5, and the details are as follows:

[0055] The prism 5 is bonded to the 400G DR4 silicon photonic chip 1 with glue having a refractive index of 1.4 to 1.45. Since the glue having a point refractive index of 1.4 to 1.45 is present between the prism 5 and the 400G DR4 silicon photonic chip 1, the light reflection at the end face of the input waveguide 110 of the 400G DR4 silicon photonic chip 1 can be reduced, and the mode spot of the input waveguide 110 can be increased to further improve the coupling efficiency.

[0056] Example 7

[0057] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on any one of Embodiments 3 to 6, and the details are as follows:

[0058] The light emitting assembly 2 includes a ceramic heat sink 210 and a laser chip 220 integrated on the ceramic heat sink 210 .

[0059] Furthermore: the four output waveguides 120 of the 400G DR4 silicon photonic chip are coupled to the multi-channel optical fiber array 6, and the end face of the multi-channel optical fiber array 6 is inclined by 8°±1°, preferably 8°.

[0060] Example 8

[0061] A 400G DR4 silicon photonic engine coupling method is used to couple the above 400G DR4 silicon photonic engine, comprising the following steps:

[0062] S1, horizontally fix the optical transmission component 2, the optical isolator 4 and the 400G DR4 silicon photonic chip in sequence along the light propagation direction, and make the optical axis center of the optical transmission component 2 located in the middle of the two input waveguides 110 in the 400G DR4 silicon photonic chip 1;

[0063] S2, coupling the prism 5 between the optical isolator 4 and the 400G DR4 silicon photonic chip in a non-fixed manner;

[0064] S3, coupling the aspherical lens 3 between the optical emitting component 2 and the optical isolator 4, and recording the coupled optical power P1;

[0065] S4, flip the prism 5 180°, and couple the prism 5 between the optical isolator 4 and the 400G DR4 silicon photonic chip 1 in a non-fixed manner;

[0066] S5, coupling the aspherical lens 3 between the optical emitting component 2 and the optical isolator 4, and recording the coupled optical power P2;

[0067] S6, comparing the coupling optical power P1 and the coupling optical power P2, and selecting the scheme with the larger coupling optical power, and then fixing the prism 5 according to the distribution mode of the prism 5 in the scheme, that is, it can be understood that: the prism 5 is fixed in the direction in which the optical power is larger;

[0068] S7. Fix the aspheric lens 3.

[0069] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A 400G DR4 silicon photonic chip, characterized in that: The invention comprises two input waveguides (110) and four output waveguides (120); the two input waveguides (110) are distributed in an eight-shaped pattern with the bundle ends facing outwards; one of the two input waveguides (110) is tilted in a positive direction by 8°±1°, and the other input waveguide (110) is tilted in a negative direction by 8°±1°; each input waveguide (110) is coupled to four output waveguides (120) respectively, and the four output waveguides (120) are all tilted in a positive direction by 8°±1°.

2. The 400G DR4 silicon photonic chip according to claim 1, characterized in that: Two input waveguides (110) are coupled to two input ends of a 2×2 geometric ratio coupler (130), two output ends of the 2×2 geometric ratio coupler (130) are respectively coupled to input ends of two 1×2 geometric ratio couplers (140), and four output ends of the two 1×2 geometric ratio couplers (140) are respectively coupled to four output waveguides (120).

3. The 400G DR4 silicon photonic chip according to claim 2, characterized in that: The four output ends of the two 1×2 equal ratio couplers (140) are respectively coupled to the four output waveguides (120) via an MZM modulator (150).

4. A 400G DR4 silicon photonics engine, characterized in that: include: An optical emitting component (2), an aspheric lens (3), an optical isolator (4), a prism (5), and a 400G DR4 silicon photonic chip (1) as claimed in any one of claims 1 to 3, wherein the optical emitting component (2), the aspheric lens (3), the optical isolator (4), the prism (5), and the 400G DR4 silicon photonic chip (1) are coupled in sequence along the light propagation direction, the optical emitting component (2) is arranged horizontally and the center of its optical axis is located in the middle of two input waveguides (110) in the 400G DR4 silicon photonic chip (1), and the horizontally emitted light of the optical emitting component (2) is coupled into the input waveguide (110) in the 400G DR4 silicon photonic chip (1) after being turned 8°±1° in the forward or reverse direction by the prism (5) and then tilted 8°±1° in the forward or reverse direction.

5. The 400G DR4 silicon photonics engine according to claim 4, characterized in that: The material of the input waveguide (110) is silicon dioxide, the material of the prism (5) is silicon dioxide, the refractive index of silicon dioxide is 1.44 to 1.46, and the light incident surface of the prism (5) is inclined at 10.08° to 13.18°.

6. A 400G DR4 silicon photonics engine according to claim 4 or 5, characterized in that: The light incident surface of the prism (5) is coated with an anti-reflection film.

7. A 400G DR4 silicon photonics engine according to claim 4, 5 or 6, characterized in that: The prism (5) is bonded to the 400G DR4 silicon photonic chip (1) using glue with a refractive index of 1.4 to 1.

45.

8. The 400G DR4 silicon photonics engine according to claim 4, characterized in that: The light emitting component (2) comprises: a ceramic heat sink (210) and a laser chip (220) integrated on the ceramic heat sink (210).

9. The 400G DR4 silicon photonics engine according to claim 4, characterized in that: The four output waveguides (120) of the 400G DR4 silicon photonic chip are coupled to a multi-channel optical fiber array (6), and the end face of the multi-channel optical fiber array (6) is inclined at 8°±1°.

10. A 400G DR4 silicon photonic engine coupling method, characterized in that: Used to couple the 400G DR4 silicon photonics engine as claimed in any one of claims 4 to 9, comprising the following steps: S1, horizontally fixing the optical transmission component (2), the optical isolator (4) and the 400G DR4 silicon photonic chip in sequence along the light propagation direction, and making the optical axis center of the optical transmission component (2) located in the middle of the two input waveguides (110) in the 400G DR4 silicon photonic chip (1); S2, coupling the prism (5) between the optical isolator (4) and the 400G DR4 silicon photonic chip (1) in a non-fixed manner; S3, coupling the aspheric lens (3) between the optical emitting component (2) and the optical isolator (4), and recording the coupled optical power P1; S4, flipping the prism (5) by 180°, and coupling the prism (5) between the optical isolator (4) and the 400G DR4 silicon photonic chip (1) in a non-fixed manner; S5, coupling the aspheric lens (3) between the optical emitting component (2) and the optical isolator (4), and recording the coupled optical power P2; S6, comparing the coupling optical power P1 and the coupling optical power P2, and selecting a solution with a larger coupling optical power, and then fixing the prism (5) according to the distribution mode of the prism (5) in the solution; S7. Fix the aspheric lens (3).

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