TiNi alloy supporting plate, display module, electronic equipment and terminal equipment

Abstract

The invention provides a TiNi alloy supporting plate, a display module, electronic equipment and terminal equipment, based on the mass of TiNi alloy, the mass percentage of Ni element is 50%-59%; and the phase transition temperature of the TiNi alloy is less than or equal to-10 DEG C. According to the TiNi alloy supporting plate, high rigidity and small bending radius can be both considered, the bending fatigue frequency is high, the TiNi alloy supporting plate is applied to the electronic equipment, and the reliability of the electronic equipment is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a TiNi alloy support plate, a display module, an electronic device and a terminal device. Background Art

[0002] In recent years, display technology for electronic devices has developed rapidly, especially the emergence of bendable flexible screens, which has enabled electronic devices to develop more product forms.

[0003] Folding screens or other flexible structures need to be provided with a support structure that can be bent and deformed. Currently, the support structure in the prior art mostly uses stainless steel or titanium alloy as the support structure, but it cannot take into account both bending performance and rigidity. Summary of the invention

[0004] The purpose of this application is to provide a TiNi alloy support plate, a display module, an electronic device and a terminal device, wherein the TiNi alloy support plate can take into account both high rigidity and small bending radius, and has a high bending fatigue number. The specific technical solution is as follows:

[0005] It should be noted that, in the invention content of the present application, a foldable mobile phone is used as an example of an electronic device to explain the present application, but the electronic device of the present application is not limited to a foldable mobile phone.

[0006] A first aspect of the present application provides a TiNi alloy support plate, wherein the mass percentage of Ni element is 50% to 59% based on the mass of the TiNi alloy; and the phase transition temperature of the TiNi alloy is less than or equal to -10°C.

[0007] In some embodiments of the present application, the thickness of the TiNi alloy support plate is 0.03 mm to 0.1 mm.

[0008] In some embodiments of the present application, the TiNi alloy has linear superelasticity, the stress of the TiNi alloy at a strain of 2% is a, the stress of the TiNi alloy at a strain of 4% is b, and 80 MPa≤ba≤200 MPa.

[0009] In some embodiments of the present application, the superelasticity of the TiNi alloy in the temperature range of 18° C. to 25° C. is 4% to 6%.

[0010] In some embodiments of the present application, the superelasticity of the TiNi alloy in the temperature range of -25°C to 60°C is 2% to 6%.

[0011] In some embodiments of the present application, the elastic modulus of the TiNi alloy in the temperature range of 18° C. to 25° C. is 30 GPa to 70 GPa.

[0012] In some embodiments of the present application, the TiNi alloy further includes an X element, and the X element includes at least one of Cu, Nb, Fe, Co, or Cr.

[0013] In some embodiments of the present application, the bending stiffness of the TiNi alloy support plate is 20N / mm 2 Up to 625N / mm 2 .

[0014] In some embodiments of the present application, the minimum bending radius of the TiNi alloy support plate in the temperature range of -20°C to 60°C is 0.75 mm to 2.5 mm.

[0015] A second aspect of the present application provides a method for preparing a TiNi alloy support plate according to any one of the above embodiments, comprising the following steps:

[0016] (1) melting and casting a TiNi alloy to obtain an ingot and rolling it into a plate;

[0017] (2) After cutting the sheet, perform aging heat treatment;

[0018] (3) A TiNi alloy support plate is obtained through an etching process.

[0019] In some embodiments of the present application, in the method for preparing the TiNi alloy support plate, the temperature of the aging heat treatment is 100° C. to 350° C., and the time of the aging heat treatment is 5 min to 60 min.

[0020] A third aspect of the present application provides a display module, which includes a cover plate, a display panel, a supporting component, a door panel structure, and a TiNi alloy supporting plate in any of the aforementioned embodiments, wherein the TiNi alloy supporting plate is located between the supporting component and the door panel structure.

[0021] A fourth aspect of the present application provides an electronic device, which includes the display module in any of the aforementioned embodiments.

[0022] A fifth aspect of the present application provides a terminal device, which includes the electronic device in any of the aforementioned embodiments.

[0023] Beneficial effects of this application:

[0024] The present application provides a TiNi alloy support plate, a display module, an electronic device and a terminal device. Based on the mass of the TiNi alloy, the mass percentage of the Ni element is 50% to 59%; the phase transition temperature of the TiNi alloy is less than or equal to -10°C. By regulating the mass percentage of the Ni element in the TiNi alloy within the scope of the present application, when the TiNi alloy is in an austenitic state, the TiNi alloy undergoes a martensitic phase transformation under stress to obtain superelasticity, and the obtained TiNi alloy has a high bending stiffness and a small bending radius. The TiNi alloy support plate is applied to the display module, which can further improve the support effect on the display screen. The phase transition temperature of the TiNi alloy is within the scope of the present application. Applying it to electronic equipment can meet the use requirements of electronic equipment under different environmental conditions, and the reliability of the electronic equipment is improved.

[0025] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and a person skilled in the art can also obtain other embodiments based on these drawings.

[0027] Figure 1 This is a schematic diagram showing the structure of a module in some embodiments of the present application;

[0028] Figure 2 is the loading-unloading curve of the TiNi alloy support plate in Example 1 of the present application;

[0029] Figure 3 is the loading-unloading curve of the TiNi alloy support plate in Example 2 of the present application;

[0030] Figure 4 This is the elastic performance curve of the steel foil in Comparative Example 1 of the present application;

[0031] Figure 5 This is the elastic performance curve of the steel foil in Comparative Example 2 of this application;

[0032] Figure 6 This is the loading-unloading curve of the TiNi alloy support plate in Comparative Example 5 of the present application;

[0033] Reference numerals: display module 10; cover plate 11; display panel 12; support component 13; TiNi alloy support plate 14; door panel structure 15; rotating door panel 15a; middle door panel 15b. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those skilled in the art based on the present application belong to the scope of protection of the present application.

[0035] It should be noted that in the specific implementation manner of the present application, a foldable mobile phone is used as an example of an electronic device to explain the present application, but the electronic device of the present application is not limited to a foldable mobile phone.

[0036] The first aspect of the present application provides a TiNi alloy support plate, based on the mass of the TiNi alloy, the mass percentage of the Ni element is 50% to 59%, for example, the mass percentage of the Ni element is 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59% or a range consisting of any two of the values. The phase transition temperature of the TiNi alloy is less than or equal to -10°C. For example, the phase transition temperature of the TiNi alloy is -30°C, -25°C, -20°C, -15°C, -10°C or a range consisting of any two of the values. By regulating the mass percentage of Ni element in TiNi alloy within the above range, when TiNi alloy is in austenite state, TiNi alloy undergoes martensitic phase transformation under stress to obtain superelasticity, and the bending rigidity of the obtained TiNi alloy support plate is higher and the bending radius is smaller. The TiNi alloy support plate is applied to the display module, which can further improve the support effect on the display screen. The phase change temperature of TiNi alloy is within the above range. When it is applied to electronic equipment, it can meet the use requirements of electronic equipment under different environmental conditions, and the reliability of electronic equipment is improved. In this application, the alloy produces a strain much greater than its elastic limit strain under the action of external force, and this strain can be automatically restored when unloading, indicating that the alloy has superelasticity.

[0037] In some embodiments of the present application, the thickness of the TiNi alloy support plate is 0.03mm to 0.1mm. For example, the thickness of the TiNi alloy support plate is 0.03mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 0.1mm or a range consisting of any two of the values. By regulating the thickness of the TiNi alloy support plate within the above range, it is beneficial for the TiNi alloy support plate to have a smaller bending radius while having a higher bending stiffness, and to apply it to electronic equipment, which is beneficial to improving the reliability of the electronic equipment and taking into account the overall thickness of the electronic equipment.

[0038] In some embodiments of the present application, the TiNi alloy has linear superelasticity, the stress of the TiNi alloy strain of 2% is a, the stress of the TiNi alloy strain of 4% is b, and 80MPa≤ba≤200MPa. For example, the value of ba is 80MPa, 100MPa, 120MPa, 140MPa, 160MPa, 180MPa, 200MPa or a range consisting of any two of the values. When the value of ba is within the above range, the TiNi alloy support plate has good elasticity, high rigidity, a small bending radius and good fatigue resistance, and is applied to electronic equipment, thereby improving the reliability of the electronic equipment. In the present application, linear superelasticity refers to superelasticity in which stress and strain are linearly related.

[0039] In some embodiments of the present application, the superelasticity of the TiNi alloy in the temperature range of 18°C ​​to 25°C is 4% to 6%. For example, the superelasticity of the TiNi alloy in the temperature range of 18°C ​​to 25°C is 4%, 4.5%, 5%, 5.5%, 6%, or a range consisting of any two of these values. When the superelasticity of the TiNi alloy is within the above range, the TiNi alloy support plate has good elasticity, high rigidity, a small bending radius and good fatigue resistance, and is applied to electronic equipment, thereby improving the reliability of the electronic equipment.

[0040] In some embodiments of the present application, the superelasticity of the TiNi alloy in the temperature range of -25°C to 60°C is 2% to 6%. For example, the superelasticity of the TiNi alloy in the temperature range of -25°C to 60°C is 2%, 3%, 4%, 5%, 6%, or a range consisting of any two of these values. When the superelasticity of the TiNi alloy is within the above range, the TiNi alloy support plate has good elasticity, high rigidity, a small bending radius and good fatigue resistance, and is applied to electronic equipment, thereby improving the reliability of the electronic equipment.

[0041] In some embodiments of the present application, the elastic modulus of the TiNi alloy in the temperature range of 18°C ​​to 25°C is 30GPa to 70GPa. For example, the elastic modulus of the TiNi alloy in the temperature range of 18°C ​​to 25°C is 30GPa, 40GPa, 50GPa, 60GPa, 70GPa or a range consisting of any two of these values. When the elastic modulus of the TiNi alloy is within the above range, the TiNi alloy support plate has good elasticity, high rigidity, a small bending radius and good fatigue resistance, and is applied to electronic equipment, thereby improving the reliability of the electronic equipment. Among them, the elastic modulus refers to the stress divided by the strain in the direction under a unidirectional stress state.

[0042] In some embodiments of the present application, the TiNi alloy also includes an X element, and the X element includes at least one of Cu, Nb, Fe, Co or Cr. When the TiNi alloy includes the above elements, it is beneficial to reduce the phase transition temperature of the TiNi alloy, and applying it to electronic equipment is beneficial to meet the use requirements of electronic equipment under different environmental conditions, thereby improving the reliability of the electronic equipment. The present application has no particular restrictions on the content of the X element in the TiNi alloy, as long as the purpose of the present application can be achieved. For example, the content of the X element in the TiNi alloy is 0% to 15%.

[0043] In some embodiments of the present application, the bending stiffness of the TiNi alloy support plate is 20N / mm 2 Up to 625N / mm 2 For example, the bending stiffness of the TiNi alloy support plate is 20N / mm 2 , 50N / mm 2 , 100N / mm 2 , 200N / mm 2 、300N / mm 2 , 400N / mm 2 , 500N / mm 2 、600N / mm 2 、625N / mm 2 Or a range consisting of any two values. When the bending stiffness of the TiNi alloy support plate is within the above range, the bending radius is small and the stiffness of the TiNi alloy support plate is high, and the TiNi alloy support plate is applied to electronic equipment, thereby improving the reliability of the electronic equipment.

[0044] In some embodiments of the present application, the minimum bending radius of the TiNi alloy support plate in the temperature range of -20°C to 60°C is 0.75mm to 2.5mm. For example, the minimum bending radius of the TiNi alloy support plate in the temperature range of -20°C to 60°C is 0.75mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, or a range consisting of any two of these values. When the bending radius of the TiNi alloy support plate is within the above range, the bending radius of the TiNi alloy support plate is small while the stiffness is high, and it is applied to electronic devices, thereby improving the reliability of the electronic devices.

[0045] A second aspect of the present application provides a method for preparing a TiNi alloy support plate according to any one of the above embodiments, comprising the following steps:

[0046] (1) melting and casting a TiNi alloy to obtain an ingot and rolling it into a plate;

[0047] (2) After cutting the sheet, perform aging heat treatment;

[0048] (3) A TiNi alloy support plate is obtained through an etching process.

[0049] In some embodiments of the present application, in the method for preparing the TiNi alloy support plate, the temperature of the aging heat treatment is 100°C to 350°C, and the time of the aging heat treatment is 5min to 60min. By regulating the temperature and time of the aging heat treatment within the above range, it is beneficial to reduce the phase transition temperature of the TiNi alloy, and to apply it to electronic devices, which is beneficial to meet the use requirements of electronic devices under different environmental conditions.

[0050] The present application has no particular restrictions on the melting and casting method of the TiNi alloy, as long as the purpose of the present application can be achieved, for example, electric arc, electron beam or plasma, etc. can be used. The present application has no particular restrictions on the rolling process, as long as the purpose of the present application can be achieved. For example, rolling can be performed by a roller press. The present application has no particular restrictions on the cutting size, and it can be cut according to actual needs. The present application has no particular restrictions on the etching process, as long as the purpose of the present application can be achieved, for example, acid corrosion, etc. can be used.

[0051] A third aspect of the present application provides a display module, which includes a cover plate, a display panel, a support component, a door panel structure, and a TiNi alloy support plate in any of the aforementioned embodiments.

[0052] In some embodiments of the present application, Figure 1As shown, the display module 10 includes a cover plate 11, a display panel 12, a support component 13, a TiNi alloy support plate 14 and a door panel structure 15 from top to bottom. The cover plate 11 is arranged at the top of the display module 10 and can be attached to the top of the display panel 12 by optical glue. This application has no special restrictions on the cover plate, as long as the purpose of this application can be achieved. For example, in a folding screen device, considering the bending performance, the cover plate can be made of a transparent film material, such as a transparent polyimide film CPI or other materials. The display panel 12 is located between the cover plate 11 and the support structure 13, and can be attached to the top of the support structure 13 by a pressure-sensitive adhesive. This application has no special restrictions on the display panel, as long as the purpose of this application can be achieved. For example, the display panel can be a flexible organic light-emitting diode (OLED) display panel, or other flexible (bendable) display panels. The support structure 13 is arranged above the TiNi alloy support plate 14 and can be attached with AB hot melt adhesive. The support structure 13 is used to support and maintain the display module shape in various opening and closing states of the fuselage. The present application has no particular restrictions on the support structure, as long as the purpose of the present application can be achieved. For example, the support structure can be made of stainless steel, TA4 titanium alloy or other materials with a certain rigidity. The door panel structure 15 is arranged at the bottom of the display module, including a revolving door panel 15a and an intermediate door panel 15b, which are used for shaft support. The TiNi alloy support plate 14 and the door panel structure 15 can be connected by a dispensing process. The present application has no particular restrictions on the door panel structure, as long as the purpose of the present application can be achieved. For example, the revolving door panel can be plastic or carbon fiber, and the intermediate door panel can be plastic or carbon fiber.

[0053] In the present application, the display module includes not only the cover plate, the display panel, the support component, the door panel structure and the TiNi alloy support plate, but also other necessary or optional components constituting the electronic device. The present application does not limit the above other necessary or optional components, as long as the required display module can be formed.

[0054] The fourth aspect of the present application provides an electronic device, which includes a display module in any of the foregoing embodiments. The electronic device may be, for example, a folding screen device, a scroll screen device, or any electronic device with a bendable display screen. The electronic device may include one or more display modules. Among them, at least one display module is a display module provided in an embodiment of the present application, or at least one display module includes a TiNi alloy support plate provided in any embodiment of the present application.

[0055] In the present application, electronic devices include handheld devices with image processing functions, vehicle-mounted devices, wearable devices, etc. For example, electronic devices may include but are not limited to: non-folding mobile phones, folding mobile phones, tablet computers, PDAs, laptop computers, watches, etc.

[0056] The fifth aspect of the present application provides a terminal device, which includes an electronic device in any of the aforementioned embodiments. In the present application, the terminal device may include but is not limited to mobile Internet devices, wearable devices, virtual reality devices, augmented reality devices, wireless terminals in industrial control, wireless terminals in unmanned driving, wireless terminals in remote surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, cellular phones, cordless phones, session initiation protocol phones, wireless local loop stations, personal digital assistants, handheld devices with wireless communication functions, computing devices, terminal devices in 5G networks, terminal devices in public land mobile communication networks, etc., and the implementation scheme of the present application is not limited to this.

[0057] Example

[0058] Hereinafter, the embodiments of the present application will be described in more detail with reference to Examples and Comparative Examples. Various tests and evaluations were performed according to the following methods.

[0059] Test methods and equipment:

[0060] Ni element content test:

[0061] The Ni content in the support plates of the embodiments and comparative examples was tested by inductively coupled plasma emission spectrometry (ICP).

[0062] Phase change temperature test:

[0063] Differential Scanning Calorimetry (DSC) was used to test the phase transition temperature of the support plates in the embodiments and comparative examples.

[0064] Test the value of ba:

[0065] A mechanical tensile test is performed on the support plates in the embodiment and the comparative example, and the difference can be directly read out according to the stress-strain curve of the tensile test.

[0066] Superelastic test from 18°C ​​to 25°C:

[0067] The support plates in the embodiments and comparative examples were subjected to mechanical tensile tests at 18°C, 20°C, 22°C, and 25°C, and the superelasticity of the support plates was measured using a loading and unloading mode. If the alloy produces a strain much larger than its elastic limit strain under the action of an external force, and this strain can be automatically restored when unloaded, it means that the tested support plate has superelasticity at the corresponding temperature. If it cannot be restored, it means that the tested support plate does not have superelasticity. If the tested support plate has superelasticity at all the tested temperature points, it means that the tested support plate has superelasticity at 18°C ​​to 25°C.

[0068] Elastic modulus test at 18℃ to 25℃:

[0069] The support plates in the embodiments and comparative examples were subjected to mechanical tensile tests at 18°C, 20°C, 22°C, and 25°C, and a loading and unloading mode was used to obtain a mechanical property curve, and the slope of the elastic section was the elastic modulus of the support plate measured at the corresponding temperature. The elastic modulus of the support plate measured at 18°C ​​to 25°C was equal to the average value of all elastic moduli at the measured temperature points.

[0070] Superelasticity test from -25°C to 60°C:

[0071] The support plates in the embodiments and comparative examples are subjected to mechanical tensile tests at -25°C, -10°C, 5°C, 20°C, 40°C, and 60°C, and the superelasticity of the support plates is measured in a loading and unloading mode. If the alloy produces a strain much larger than its elastic limit strain under the action of an external force, and this strain can be automatically restored when unloaded, it means that the tested support plate has superelasticity at the corresponding temperature. If it cannot be restored, it means that the tested support plate does not have superelasticity. If the tested support plate has superelasticity at all the tested temperature points, it means that the tested support plate has superelasticity at -25°C to 60°C.

[0072] Determination of linear hyperelasticity:

[0073] Based on the relationship between stress and strain in the tensile performance curve, it can be directly determined whether there is a linear relationship.

[0074] Bending stiffness test:

[0075] Calculate the bending stiffness of the corresponding support plate according to the elastic modulus and the thickness of the support plate. Bending stiffness of the support plate = Ehb 3 / 12, where E is the elastic modulus of the support plate at 18°C ​​to 25°C, h is the width of the support plate, and b is the thickness of the support plate.

[0076] Minimum bending radius test:

[0077] The minimum bending radius is calculated based on the thickness of the support plate and the length of the elastic section. The minimum bending radius of the support plate = b / 2ε, where b is the thickness of the support plate and ε is the maximum elastic strain.

[0078] Bending fatigue test:

[0079] The support plates in the embodiments and comparative examples were pasted on a steel substrate and subjected to a 180° bending test. The number of bending times corresponding to when the support plates broke was the number of bending fatigue times.

[0080] Example 1

[0081] <Alloy Casting>

[0082] Using pure Ti and pure Ni as raw materials, a melting furnace is used to melt and cast the raw materials. The melting and casting process parameters are as follows: argon environment (purity greater than 99.9%), furnace temperature 1250 °C, time 40 min. An ingot of TiNi alloy is obtained by melting and casting, in which the content of Ni element is 56 wt%, the content of C element is less than 0.05 wt%, the content of O element is less than 0.05 wt%, and the remaining content is Ti.

[0083] <Sheet rolling>

[0084] The obtained ingot of TiNi alloy is rolled into a sheet with a thickness of 0.06 mm by a rolling press. During the cold rolling process, the annealing temperature is 650 °C, and the rolling reduction per pass is about 10%.

[0085] <Ageing heat treatment>

[0086] The obtained sheet is cut to a size of 160 mm × 300 mm, fixed with a fixture, and placed in a muffle furnace for ageing heat treatment. The treatment temperature is 200 °C, and the treatment time is 60 min.

[0087] <Processing of TiNi alloy support plate>

[0088] The sheet after ageing heat treatment is processed by acid etching using an etching process. The sheet after ageing heat treatment is placed in a mixed solution of hydrogen peroxide and concentrated hydrochloric acid for etching to obtain a TiNi alloy support plate with a size of 15 mm × 150 mm. Among them, the mass ratio of hydrogen peroxide to concentrated hydrochloric acid is 1:1.

[0089] Example 2

[0090] Except that the treatment temperature in <Ageing heat treatment> is adjusted to 150 °C, the treatment time is adjusted to 30 min, and the rolling process is adjusted so that the thickness of the TiNi alloy support plate is as shown in Table 1, the rest is the same as in Example 1.

[0091] Examples 3 to 5

[0092] Except that the feeding ratio of pure Ti and pure Ni raw materials is adjusted so that the Ni content is as shown in Table 1, the rest is the same as in Example 1.

[0093] Examples 6 to 8

[0094] Except that the rolling process is adjusted so that the thickness of the TiNi alloy support plate is as shown in Table 1, the rest is the same as in Example 1.

[0095] Example 9

[0096] Except for adding single substance Cu in <alloy casting> so that the content of Cu element in TiNi alloy is 9wt%, the contents of Ni, C and O elements remain unchanged, and the content of Ti element changes accordingly, the rest is the same as Example 1.

[0097] Comparative Example 1

[0098] A steel foil with a thickness of 0.02 mm was used as the support plate.

[0099] Comparative Example 2

[0100] A steel foil with a thickness of 0.03 mm was used as the support plate.

[0101] Comparative Example 3 to Comparative Example 4

[0102] Except for adjusting the relevant preparation parameters according to Table 1, the rest is the same as Example 1.

[0103] Comparative Example 5

[0104] Except that the treatment temperature in <Aging Heat Treatment> is adjusted to 350° C. and the relevant preparation parameters are adjusted according to Table 1, the rest is the same as Example 1.

[0105] The preparation parameters and performance tests of various embodiments and comparative examples are shown in Table 1.

[0106] Table 1

[0107]

[0108]

[0109] Note: “ / ” in Table 1 means there is no corresponding parameter.

[0110] It can be seen from Examples 1 to 10 and Comparative Examples 1 to 4 that the TiNi alloy support plate in the embodiment of the present application has a high bending stiffness while taking into account a small bending radius. By regulating the mass percentage of the Ni element in the TiNi alloy within the scope of the present application, the phase change temperature of the TiNi alloy is within the scope of the present application, the superelasticity of the TiNi alloy in the temperature range of -25°C to 60°C in the embodiment of the present application is greater than or equal to 2%, the superelasticity of the TiNi alloy in the temperature range of 18°C ​​to 25°C is greater than or equal to 4%, and the number of bending fatigue is large. By applying it to electronic equipment, the reliability of the electronic equipment is improved.

[0111] like Figure 2As shown, curve 1 is the load curve of the TiNi alloy support plate in Example 1, with a pre-strain of 6%, curve 2 is the load unloading curve of the TiNi alloy support plate in Example 1, with the strain restored to 0%, and curve 3 is the load curve of the TiNi alloy support plate in Example 1 until the support plate breaks. Figure 3 As shown, curve 1 is the load curve of the TiNi alloy support plate in Example 2, with a pre-strain of 6%, curve 2 is the load unloading curve of the TiNi alloy support plate in Example 2, with the strain restored to 0%, and curve 3 is the load curve of the TiNi alloy support plate in Example 2 until the support plate breaks. Figure 6 As shown, curve 1 is the load curve of the TiNi alloy support plate in comparative example 3, with a pre-strain of 6%, curve 2 is the load unloading curve of the TiNi alloy support plate in embodiment 3, with the strain restored to 0%, and curve 3 is the load curve of the TiNi alloy support plate in embodiment 3 until the support plate breaks.

[0112] from Figure 2 , Figure 3 and Figure 6 It can be seen from Table 1 that although the TiNi alloy support plates in Comparative Example 5 and Examples 1 and 2 can all recover after pre-straining of 6%, the TiNi alloy support plate in Comparative Example 5 has broken at a stress of 800MPa, while the TiNi alloy support plates in Examples 1 to 2 only break when the stress is greater than 1000MPa. It can also be seen from Table 1 that the bending stiffness of the TiNi alloy support plates in Examples 1 to 2 is higher. It can be seen from Table 1 that when the aging heat treatment temperature changes, the phase change temperature of the TiNi alloy support plate also changes accordingly. When the phase change temperature is within the range of this application, the bending fatigue times of the TiNi alloy support plate are higher.

[0113] from Figure 4 and Figure 5 It can be seen that the elastic sections of the steel foils in Comparative Examples 1 and 2 are both less than 1%, where the elastic section refers to the portion where the curve in the figure is linear. In actual production, in order to ensure the number of bending fatigue times, a stainless steel foil with a thickness of less than 0.03 mm is required, which will result in a lower bending stiffness of the support plate. As shown in Table 1, the bending stiffness of Comparative Example 1 is 19 N / mm 2 , the bending stiffness of comparative example 2 is 55N / mm 2 .

[0114] The terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus.

[0115] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0116] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A TiNi alloy support plate, wherein the mass percentage of Ni element is 50% to 59% based on the mass of the TiNi alloy; and the phase transition temperature of the TiNi alloy is less than or equal to -10°C.

2. The TiNi alloy support plate according to claim 1, wherein: The thickness of the TiNi alloy support plate is 0.03 mm to 0.1 mm.

3. The TiNi alloy support plate according to claim 1, wherein: The TiNi alloy has linear superelasticity, the stress of the TiNi alloy at a strain of 2% is a, the stress of the TiNi alloy at a strain of 4% is b, and 80MPa≤ba≤200MPa.

4. The TiNi alloy support plate according to claim 1, wherein: The superelasticity of the TiNi alloy in the temperature range of 18° C. to 25° C. is 4% to 6%.

5. The TiNi alloy support plate according to claim 1, wherein: The superelasticity of the TiNi alloy in the temperature range of -25°C to 60°C is 2% to 6%.

6. The TiNi alloy support plate according to claim 1, wherein: The elastic modulus of the TiNi alloy in a temperature range of 18° C. to 25° C. is 30 GPa to 70 GPa.

7. The TiNi alloy support plate according to claim 1, wherein: The TiNi alloy further includes an X element, and the X element includes at least one of Cu, Nb, Fe, Co or Cr.

8. The TiNi alloy support plate according to claim 1, wherein: The bending stiffness of the TiNi alloy support plate is 20N / mm 2 Up to 625N / mm 2 .

9. The TiNi alloy support plate according to claim 1, wherein: The minimum bending radius of the TiNi alloy support plate in the temperature range of -20°C to 60°C is 0.75mm to 2.5mm.

10. A method for preparing the TiNi alloy support plate according to any one of claims 1 to 9, comprising the following steps: (1) melting and casting the TiNi alloy to obtain an ingot and rolling it into a plate; (2) cutting the sheet and then subjecting it to aging heat treatment; (3) The TiNi alloy support plate is obtained through an etching process.

11. The method for preparing a TiNi alloy support plate according to claim 10, wherein: The temperature of the aging heat treatment is 100° C. to 350° C., and the time of the aging heat treatment is 5 min to 60 min.

12. A display module, comprising a cover plate, a display panel, a supporting component, a door panel structure, and the TiNi alloy supporting plate according to any one of claims 1 to 9, wherein the TiNi alloy supporting plate is located between the supporting component and the door panel structure.

13. An electronic device comprising the display module according to claim 12.

14. A terminal device, comprising the electronic device according to claim 13.

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