Semiconductor device processing method and fixture for semiconductor device processing
By designing the top through holes and stops on the package of the semiconductor device and filling the insulating colloid, the problem of device damage caused by disassembly when measuring the junction temperature is solved, and damage-free online measurement of junction temperature is achieved.
Patent Information
- Application Number
- CN202411890620.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2044-12-20
AI Technical Summary
Prior art When measuring the junction temperature of a semiconductor device, it is necessary to remove the housing of the device, resulting in the potential damage to the device.
By forming a package on the substrate, the package has a top through hole, and the top through hole exposes the temperature measurement area of the chip, and a stop is penetrated in the through hole. The end of the stop covers the temperature measurement area, and insulating colloids are filled between the package, the base and the stop to prevent the insulating colloid from covering the temperature measurement area.
The junction temperature measurement is achieved without disassembly of the housing during the operation of semiconductor devices, avoiding device damage and improving measurement accuracy and efficiency.
Smart Images
Figure CN119340220B_ABST
Abstract
Citation Information
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