Semiconductor circuit module and manufacturing method thereof

Abstract

The invention is suitable for the technical field of semiconductors, and particularly relates to a semiconductor circuit module and a manufacturing method thereof. The semiconductor circuit module includes: a metal substrate; a plurality of circuit components, wherein the plurality of circuit components are configured at preset positions of the metal substrate; the binding metal wire is used for realizing electric connection among the plurality of circuit components; a package; an electric control board; the metal substrate comprises a metal base material and a copper foil layer attached to the metal base material, the copper foil layer extends outwards to form a plurality of flexible pins, and the flexible pins penetrate through the plastic package structure and are electrically connected with the electric control board. Compared with the prior art, the copper foil layer of the metal substrate extends outwards to form the flexible pins, staggered connection can be carried out according to output contact welding positions, single-side double-pin structural design is achieved, development cost is reduced, the problem of layering of an insulating layer is solved, and the reliability of a semiconductor circuit is improved.

Description

Technical Field

[0001] The present invention is applicable to the field of semiconductor technology, and in particular relates to a semiconductor circuit module and a manufacturing method thereof. Background Art

[0002] The semiconductor circuit, namely the modular intelligent power system MIPS (Module Intelligent Power System), not only integrates the power switch device and the drive circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send the detection signal to the CPU or DSP for interrupt processing. It is composed of high-speed and low-power consumption tube cores, optimized gate-level drive circuits and fast protection circuits. Even if a load accident or improper use occurs, the MIPS itself will not be damaged. MIPS generally uses IGBT as the power switch element, and has an integrated structure of built-in current sensor and drive circuit.

[0003] The existing MIPS modular intelligent power system IC drive control circuit, MIPS sampling amplifier circuit, PFC current protection circuit and other low-voltage control circuits and the inverter circuit composed of high-voltage semiconductor circuit modules are arranged on the same board. At the same time, the existing MIPS modular intelligent power system only integrates a single MIPS module, and the integration of multiple MIPS modular intelligent power systems has not yet been realized. In the face of market miniaturization and low-cost competition, higher requirements are placed on the high integration and high heat dissipation technology of the MIPS modular intelligent power system.

[0004] Therefore, there is an urgent need for a new semiconductor circuit module and a manufacturing method thereof to solve the above problems. Summary of the invention

[0005] The present invention proposes a semiconductor circuit module and a manufacturing method thereof, aiming to solve the problem of insulating layer delamination in existing semiconductor circuits and improve the reliability of semiconductor circuits. At the same time, the module can be installed and replaced at any time according to different pin schemes inside the semiconductor circuit, thereby improving product design flexibility and reducing development costs.

[0006] In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising:

[0007] metal substrate;

[0008] A plurality of circuit components, wherein the plurality of circuit components are arranged at preset positions on the metal substrate;

[0009] A binding metal wire, wherein the binding metal wire is used to realize electrical connection between the plurality of circuit components;

[0010] A packaging body, wherein the packaging body packages the metal substrate, the plurality of circuit components and the binding metal wires into a plastic packaging structure;

[0011] An electric control board, the electric control board is fixedly connected to the plastic packaging structure;

[0012] The metal substrate comprises a metal substrate and a copper foil layer attached to the metal substrate. The copper foil layer extends outward to form a plurality of flexible pins. The flexible pins penetrate the plastic packaging structure and are electrically connected to the electric control board.

[0013] Preferably, the metal substrate further includes an insulating layer and a protective layer, the insulating layer is attached to one side of the metal substrate, the copper foil layer is laminated to the side of the insulating layer away from the metal substrate, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

[0014] Preferably, the flexible pin is coated with green oil or conformal paint.

[0015] Preferably, the circuit wiring layer is produced by etching the copper foil layer.

[0016] Preferably, a fixing bracket is provided between the plastic packaging structure and the electric control board, one end of the fixing bracket is fixedly connected to the plastic packaging structure, and the other end of the fixing bracket is fixedly connected to the electric control board.

[0017] Preferably, the fixing bracket comprises a receiving portion and two connecting arms fixed to opposite sides of the receiving portion, the receiving portion is abutted and fixed to the plastic packaging structure, and the connecting arm is fixed to the electric control board at a side away from the receiving portion.

[0018] Preferably, the circuit components include chip capacitors, chip resistors and components, and the chip capacitors, chip resistors and components are respectively mounted on the metal substrate.

[0019] In a second aspect, the present invention further provides a method for manufacturing a semiconductor circuit module as described in the above embodiment, the manufacturing method comprising the following steps:

[0020] S1. Etching the epitaxial portion of the copper foil layer of the metal substrate to form a flexible pin, and coating the flexible pin with green oil or conformal paint;

[0021] S2, placing the metal substrate with the flexible pins on a special carrier by automated equipment or manually;

[0022] S3, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device;

[0023] S4, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component;

[0024] S5, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position;

[0025] S6, placing the flexible pins on the corresponding welding positions of the metal substrate by a robot or manually, passing the metal substrate and the special carrier together through a reflow furnace, and welding all the circuit components to the corresponding mounting positions;

[0026] S7, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound;

[0027] S8, electrically connecting the circuit components and the circuit wiring layer by binding metal wires;

[0028] S9, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking;

[0029] S10, performing post-curing stress relief treatment in a high-temperature oven and conducting electrical parameter testing to obtain the semiconductor circuit module, thereby achieving installation and manufacturing of the semiconductor circuit module.

[0030] Compared with the prior art, the present invention forms flexible pins by extending the copper foil layer of the metal substrate outward, which can be staggered according to the output contact welding position to achieve a single-sided double-pin structure design; the welding position can be changed by bending the arc while keeping the length of the flexible pins consistent, thereby improving product design flexibility and reducing development costs; stress-free packaging is achieved to solve the problem of insulation layer delamination in semiconductor circuits in the industry, thereby improving the reliability of semiconductor circuits; while solving the stress problem, the problem of lead frame and substrate overflow is solved; seamless switching between semi-encapsulated structure and fully encapsulated structure can be achieved without changing the mold carrier, thereby not only reducing costs and improving efficiency, but also greatly improving product flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:

[0032] Figure 1 is a structural schematic diagram of a metal substrate of a semiconductor circuit module provided by an embodiment of the present invention;

[0033] Figure 2is a schematic diagram of a packaging structure of a semiconductor circuit module provided by an embodiment of the present invention;

[0034] Figure 3 is a top view of a semiconductor circuit module provided by an embodiment of the present invention;

[0035] Figure 4 It is a structural schematic diagram of a semiconductor circuit module provided by an embodiment of the present invention from another perspective.

[0036] In the figure, 1. metal substrate, 01. metal base material, 02. insulation layer, 03. copper foil layer, 04. protective layer, 05. chip resistor, 06. chip capacitor, 07. components, 08. semi-finished components, 09. heat sink, 10. flexible pins, 11. packaging body, 12. binding metal wire, 13. fixing bracket, 131. receiving part, 132. connecting arm, 14. plastic sealing structure, 15. electronic control board. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] Please refer to Figure 1-Figure 4 In a first aspect, the present invention proposes a semiconductor circuit module, which includes a metal substrate 1, circuit components, binding metal wires 12, a packaging body 11, and an electric control board 15.

[0039] In this embodiment, the metal substrate 1 includes a metal substrate 01, an insulating layer 02, a copper foil layer 03 and a protective layer 04, wherein the insulating layer 02 is attached to one side of the metal substrate 01, the copper foil layer 03 is pressed on the side of the insulating layer 02 away from the metal substrate 01, and the protective layer 04 is attached to the side of the copper foil layer 03 away from the insulating layer 02. Among them, the metal substrate 01 serves as a carrier of the entire internal circuit of the semiconductor circuit and plays a heat dissipation role for the entire semiconductor circuit; the insulating layer 02 prevents the circuit wiring layer from being energized with the metal substrate 01, resulting in the risk of short circuit and leakage of the internal circuit; the copper foil layer 03 is formed by etching the copper foil layer 03 to form the required circuit, and is made into a circuit wiring layer; the protective layer 04 is also called a green oil layer, which prevents tinning where it should not be tinned, increases the withstand voltage between the circuits, prevents short circuits caused by oxidation or contamination of the circuits, and protects the circuits.

[0040] The copper foil layer 03 extends outward to form a plurality of flexible pins 10, which pass through the package body 11 (plastic package structure) and are electrically connected to the electronic control board 15. The flexible pins 10 can be staggered and connected (to increase the creepage distance) according to the output contact welding position (pad) to achieve a single-sided double-pin structure design.

[0041] In this embodiment, the flexible pin 10 is in the same layer as the copper foil layer 03 and is formed when etching the circuit of the metal substrate 1. As an input and output pin, the flexible pin 10 is coated with green oil or three-proof paint by electroplating, coating, spraying, etc. to form a protective layer with insulation, anti-oxidation, high temperature resistance and other characteristics.

[0042] The plurality of circuit components (not shown in the figure) are arranged at preset positions on the metal substrate 1 .

[0043] In this embodiment, the circuit components include chip capacitors 06, chip resistors 05, semi-finished components 08, heat sinks 09 and components 07, and the chip capacitors 06, chip resistors 05, semi-finished components 08, heat sinks 09 and components 07 are respectively mounted on the metal substrate 1.

[0044] Specifically, the chip resistor 05 is connected to the gate of the IGBT chip in the semiconductor circuit to limit the switching speed of the IGBT by limiting the current; the chip capacitor 06 plays a role of filtering, coupling and bootstrapping in the semiconductor circuit; the components 07 constitute the chips required for the internal functional circuits of the semiconductor circuit; the semi-finished component 08 mounts the high-voltage power component 07 with high heat dissipation requirements on a small heat sink 09 to form the semi-finished component 08; the heat sink 09 adopts the copper surface silver plating process to achieve better bonding between the surface components and the heat sink 09, thereby improving the heat dissipation capacity;

[0045] The binding metal wire 12 is used to realize electrical connection between the plurality of circuit components, and the binding metal wire 12 is made of gold, aluminum, copper or the like.

[0046] The packaging body 11 encapsulates the metal substrate 1, the plurality of circuit components and the binding metal wires 12 into a plastic package structure 14, which is a powdered molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder and the like as fillers, and a variety of additives. The powdered molding compound is extruded into a mold cavity by a heat transfer molding method and the semiconductor chip therein is embedded, and is cross-linked and cured to form a device with a certain external structure.

[0047] The electric control board 15 is fixedly connected to the plastic package structure 14, and the circuit is controlled and managed by the electric control board 15 to ensure the normal operation of the electrical equipment.

[0048] In this embodiment, a fixing bracket 13 is provided between the plastic packaging structure 14 and the electric control board 15 , one end of the fixing bracket 13 is fixedly connected to the plastic packaging structure 14 , and the other end of the fixing bracket 13 is fixedly connected to the electric control board 15 .

[0049] The fixing bracket 13 includes a receiving portion 131 and two connecting arms 132 fixed on opposite sides of the receiving portion 131. The receiving portion 131 is fixed to the plastic package structure 14, and the connecting arm 132 is fixed to the electric control board 15 at a side away from the receiving portion 131. The components and condensed water above the electric control board 15 are prevented from directly contacting with the semiconductor circuit; the components and condensed water above the electric control board 15 are prevented from directly contacting with the semiconductor circuit.

[0050] Compared with the prior art, the present invention forms flexible pins by extending the copper foil layer of the metal substrate outward, which can be staggered according to the output contact welding position to achieve a single-sided double-pin structure design; the welding position can be changed by bending the arc while keeping the length of the flexible pins consistent, thereby improving product design flexibility and reducing development costs; stress-free packaging is achieved to solve the problem of insulation layer delamination in semiconductor circuits in the industry, thereby improving the reliability of semiconductor circuits; while solving the stress problem, the problem of lead frame and substrate overflow is solved; seamless switching between semi-encapsulated structure and fully encapsulated structure can be achieved without changing the mold carrier, thereby not only reducing costs and improving efficiency, but also greatly improving product flexibility.

[0051] In a second aspect, the present invention further provides a method for manufacturing a semiconductor circuit module as described in the above embodiment, the manufacturing method comprising the following steps:

[0052] S1. Etching the epitaxial portion of the copper foil layer of the metal substrate to form a flexible pin, and coating the flexible pin with green oil or conformal coating; etching the epitaxial portion of the copper foil layer to form an input / output pin, and coating the surface of the formed pin portion with a protective layer composed of green oil or conformal coating. The protective layer can be formed by electroplating, coating, spraying, etc., and any layer that can provide insulation, anti-oxidation, high temperature resistance, etc. can be used as a protective layer.

[0053] S2. Place the metal substrate with the flexible pins on a special carrier by automated equipment or manually. Specifically, the special carrier can be made of aluminum, synthetic stone, ceramic, PPS or other materials that are resistant to high temperatures above 200°C.

[0054] S3, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device;

[0055] S4, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component;

[0056] S5, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position;

[0057] S6, placing the flexible pins on the corresponding welding positions of the metal substrate by a robot or manually, passing the metal substrate and the special carrier together through a reflow furnace, and welding all the circuit components to the corresponding mounting positions;

[0058] S7, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound;

[0059] S8, electrically connecting the circuit components and the circuit wiring layer by binding metal wires;

[0060] S9, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking;

[0061] S10, performing post-curing stress relief treatment in a high-temperature oven and conducting electrical parameter testing to obtain the semiconductor circuit module, thereby achieving installation and manufacturing of the semiconductor circuit module.

[0062] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0063] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A semiconductor circuit module, characterized in that: The semiconductor circuit module comprises: metal substrate; A plurality of circuit components, wherein the plurality of circuit components are arranged at preset positions on the metal substrate; A binding metal wire, wherein the binding metal wire is used to realize electrical connection between the plurality of circuit components; A packaging body, wherein the packaging body packages the metal substrate, the plurality of circuit components and the binding metal wires into a plastic packaging structure; An electric control board, the electric control board is fixedly connected to the plastic packaging structure; The metal substrate comprises a metal substrate and a copper foil layer attached to the metal substrate. The copper foil layer extends outward to form a plurality of flexible pins. The flexible pins penetrate the plastic packaging structure and are electrically connected to the electric control board.

2. The semiconductor circuit module according to claim 1, wherein: The metal substrate also includes an insulating layer and a protective layer. The insulating layer is attached to one side of the metal substrate, the copper foil layer is laminated to the side of the insulating layer away from the metal substrate, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

3. The semiconductor circuit module according to claim 1, wherein: The flexible pin is coated with green oil or conformal paint.

4. The semiconductor circuit module according to claim 1, wherein: A circuit wiring layer is produced by etching the copper foil layer.

5. The semiconductor circuit module according to claim 1, wherein: A fixing bracket is provided between the plastic packaging structure and the electric control board, one end of the fixing bracket is fixedly connected to the plastic packaging structure, and the other end of the fixing bracket is fixedly connected to the electric control board.

6. The semiconductor circuit module according to claim 5, wherein: The fixing bracket includes a receiving portion and two connecting arms fixed at opposite sides of the receiving portion. The receiving portion is fixed to the plastic packaging structure, and a side of the connecting arm away from the receiving portion is fixed to the electric control board.

7. The semiconductor circuit module according to claim 1, wherein: The circuit components include chip capacitors, chip resistors and components, and the chip capacitors, chip resistors and components are respectively mounted on the metal substrate.

8. A method for manufacturing a semiconductor circuit module, used for manufacturing the semiconductor circuit module according to any one of claims 1 to 7, characterized in that: The manufacturing method comprises the following steps: S1. Etching the epitaxial portion of the copper foil layer of the metal substrate to form a flexible pin, and coating the flexible pin with green oil or conformal paint; S2, placing the metal substrate with the flexible pins on a special carrier by automated equipment or manually; S3, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device; S4, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component; S5, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position; S6, placing the flexible pins on the corresponding welding positions of the metal substrate by a robot or manually, passing the metal substrate and the special carrier together through a reflow furnace, and welding all the circuit components to the corresponding mounting positions; S7, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound; S8, electrically connecting the circuit components and the circuit wiring layer by binding metal wires; S9, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking; S10, performing post-curing stress relief treatment in a high-temperature oven and conducting electrical parameter testing to obtain the semiconductor circuit module, thereby achieving installation and manufacturing of the semiconductor circuit module.

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