Heat dissipation transistor components and electronic equipment

Abstract

The present application relates to a heat dissipation transistor assembly and electronic equipment, wherein the heat dissipation transistor assembly includes a transistor, a heat dissipation unit and a protective cover. The transistor body is arranged on a mounting plate, and a packaging cover is arranged on the mounting plate to form a transistor. The transistor is mounted on a heat conducting member, and the heat of the transistor is transferred to the heat dissipation member by utilizing the cooperation of the heat dissipation members and the heat conducting members on both sides, thereby improving the heat dissipation efficiency of the transistor and providing a mounting platform for the transistor. The protective cover is arranged between the two heat dissipation members and is arranged on the packaging cover, which not only protects the transistor, but also further dissipates the heat through the heat dissipation structure on the protective cover. The transistor is protected by the protective cover without affecting the heat dissipation performance of the transistor. The heat dissipation transistor assembly of the present application aims to improve the heat dissipation effect through an innovative heat dissipation structure while providing more effective protection for the transistor to meet the growing power requirements of electronic equipment.

Description

Technical Field

[0001] The present application relates to the field of transistor technology, and in particular to heat dissipation transistor components and electronic devices. Background Art

[0002] Among existing semiconductor devices, crystal transistors, as basic electronic components, have the core function of controlling and amplifying current. In practical applications, the current amplification capability of crystal transistors is their most critical characteristic: small changes in base current control larger changes in collector current. Therefore, as the power demands of electronic devices increase, the heat dissipation problem of transistors in medium- and high-power applications has become particularly prominent.

[0003] Traditional transistor heat dissipation designs typically employ a heat sink in contact with the bottom of the transistor to absorb and dissipate heat. However, this design has significant limitations. First, the heat dissipation efficiency is insufficient and cannot meet the demand for rapid heat dissipation in medium and high power applications. Second, the transistor is not adequately protected under this heat dissipation method and is easily damaged during installation, transportation, or maintenance. In order to overcome the shortcomings of the prior art, improve the heat dissipation performance of transistors in medium and high power applications, and ensure their long-term stable operation, the present invention proposes an improved heat dissipation design. Summary of the Invention

[0004] Based on this, it is necessary to provide a heat dissipation transistor component and electronic device that can improve heat dissipation efficiency and achieve protection to address the above problems.

[0005] A heat dissipation transistor assembly includes a transistor, a heat dissipation unit, and a protective cover. The transistor includes a transistor body, a packaging cover, and a mounting plate. The transistor body is disposed on the mounting plate, and the packaging cover is disposed on the mounting plate. The heat dissipation unit includes a heat conductor and two heat sinks. The mounting plate is mounted on the heat conductor. Both heat sinks are mounted on the heat conductor, and the two heat sinks are arranged on both sides of the packaging cover. A protective cavity is formed within the protective cover. The protective cover is disposed between the two heat sinks and sleeved on the packaging cover so that the packaging cover is located within the protective cavity. A heat dissipation structure is provided on the side of the protective cover facing the two heat sinks.

[0006] In one embodiment, the mounting plate includes a mounting portion, a fixing portion and a heat dissipation portion, wherein there are two fixing portions, which are respectively located on opposite sides of the mounting portion; there are two heat dissipation portions, which are respectively located on opposite sides of the mounting portion; and a heat dissipation portion is provided between the two fixing portions. The fixing portion is mounted on the heat conducting member, and the two heat dissipation members are respectively located on the two fixing portions. The protective cover is mounted on the heat dissipation portion so that the outer edge of the heat dissipation portion abuts against the inner wall of the protective cover.

[0007] In one embodiment, the heat-conducting component includes a heat-conducting mounting plate and a plurality of heat-conducting spacers. The transistor is mounted on one surface of the heat-conducting mounting plate, and a plurality of heat-conducting spacers are arranged at intervals on the other surface of the heat-conducting mounting plate, and the intervals between the plurality of heat-conducting spacers form a heat dissipation channel for air circulation.

[0008] In one embodiment, the heat sink includes heat sink fins and connecting columns. The number of the heat sink fins is several and they are distributed parallel to each other. There is a gap between each two adjacent heat sink fins for heat dissipation. Each heat sink fin is connected and fixed in position by the connecting column. The heat dissipation structure includes heat dissipation holes. The heat dissipation holes are connected to the protective cavity, and the heat dissipation holes are correspondingly connected to the gaps between the heat sink fins.

[0009] In one embodiment, the heat sink further includes a heat-conducting rod, which is an L-shaped structure. One end of the heat-conducting rod is spaced apart from the connecting column, and one end of the heat-conducting rod passes through each of the heat-dissipating fins and is fixedly connected to each of the heat-dissipating fins. The other end of the heat-conducting rod is fixed on the surface of the heat-conducting mounting plate facing away from the transistor, and the connecting column is fixed on the surface of the heat-conducting mounting plate on which the transistor is mounted.

[0010] In one embodiment, the heat-conducting member further includes a heat-conducting frame, which is mounted on the surface of the heat-conducting mounting plate on which the heat-conducting partition is mounted and is located in the heat dissipation channel. The heat-conducting frame is provided with a heat dissipation port connected to the heat dissipation channel, and the pins of the transistor body pass through the heat-conducting mounting plate and are located in the heat-conducting frame.

[0011] In one embodiment, the heat dissipation element protrudes from the heat conductive mounting plate on the side facing away from the other heat dissipation element, and a heat dissipation groove is formed on the side of the heat dissipation element facing away from the other heat dissipation element, and the heat dissipation groove can be connected to the heat dissipation port through the heat dissipation channel.

[0012] In one embodiment, the protective cover is provided with guide protrusions on the two opposite outer walls facing the two heat sinks, and the two heat sinks are provided with guide grooves on one side facing the protective cover, the direction of the guide grooves is toward the heat conducting element, and the guide protrusions can be inserted into and moved in the guide grooves; a snap-fit ​​structure is provided on the protective cover, and when the protective cover is placed on the packaging cover, the snap-fit ​​structure can be snapped onto the heat sink.

[0013] In one embodiment, a vent hole is formed on the outer wall of the protective sleeve facing away from the heat conducting component, and the vent hole is communicated with the protective cavity.

[0014] An electronic device comprises the heat dissipation transistor assembly described above.

[0015] In the above-mentioned heat dissipation transistor assembly and electronic equipment, the transistor body is arranged on a mounting plate, and the packaging cover is arranged on the mounting plate to form a transistor. The transistor is mounted on a heat-conducting member, and the heat dissipating members and the heat-conducting members on both sides are used to transfer the heat of the transistor to the heat dissipating member through the heat-conducting member, thereby improving the heat dissipation efficiency of the transistor while providing a mounting platform for the transistor. The protective cover is arranged between the two heat dissipating members and is sleeved on the packaging cover, which can not only protect the transistor, but also further dissipate the heat through the heat dissipation structure on the protective cover. The transistor is protected by the protective cover without affecting the heat dissipation performance of the transistor. The heat dissipation transistor assembly of the present application aims to improve the heat dissipation effect through an innovative heat dissipation structure while providing more effective protection for the transistor to meet the growing power requirements of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings that constitute a part of this application are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of various elements are drawn only as examples in the drawings and are not necessarily drawn to true scale.

[0019] Figure 1 FIG. 4 is a schematic diagram of the three-dimensional structure of a heat dissipation transistor assembly in one embodiment of the present invention.

[0020] Figure 2 for Figure 1 The heat dissipation transistor assembly shown omits a heat dissipation member.

[0021] Figure 3 for Figure 1 Front view of the heatsink transistor assembly shown.

[0022] Figure 4 for Figure 1 A side view of a heatsinking transistor assembly is shown.

[0023] Figure 5 for Figure 1 Bottom view of the heatsink transistor assembly is shown.

[0024] Figure 6 for Figure 1 A top view of a heatsinking transistor assembly is shown.

[0025] Description of reference numerals:

[0026] Heat dissipation transistor assembly 1; transistor 10; packaging cover 11; fixing portion 12; pin 13; mounting hole 14; heat dissipation portion 15; mounting plate 16; mounting portion 17; heat dissipation unit 20; heat dissipation fin 21; connecting column 22; heat conducting rod 23; heat dissipation groove 24; heat dissipation port 26; snap member 28; heat dissipation member 29; guide groove 291; heat conducting member 30; heat conducting mounting plate 31; heat conducting spacer 32; threaded hole 33; heat conducting frame 34; through hole 342; protective cover 40; guide protrusion 42; snap structure 43; vent 44; heat conducting sheet 45; heat dissipation hole 46. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] See Figure 1 and Figure 2The heat dissipation transistor assembly 1 in one embodiment of the present application can at least improve the heat dissipation efficiency and protect the transistor. Specifically, the heat dissipation transistor assembly 1 includes a transistor 10, a heat dissipation unit 20, and a protective cover 40. The transistor 10 includes a transistor body, a packaging cover 11, and a mounting plate 16. The transistor body is disposed on the mounting plate 16, and the packaging cover 11 is mounted on the mounting plate 16. The heat dissipation unit 20 includes two heat sinks 29 and a heat conductor 30. The mounting plate 16 is mounted on the heat conductor 30. Both heat sinks 29 are mounted on the heat conductor 30, and the two heat sinks 29 are arranged on both sides of the packaging cover 11. A protective cavity is formed in the protective cover 40. The protective cover 40 is disposed between the two heat sinks 29 and is sleeved on the packaging cover 11 so that the packaging cover 11 is located in the protective cavity. A heat dissipation structure is provided on the side of the protective cover 40 facing the two heat sinks 29.

[0029] The transistor 10 is mounted on the heat conducting member 30, and the heat of the transistor 10 is transferred to the heat dissipating member 29 through the heat conducting member 30 by utilizing the cooperation of the heat dissipating members 29 and the heat conducting member 30 on both sides, thereby improving the heat dissipation efficiency of the transistor 10 while providing an installation platform for the transistor 10. The protective cover 40 is arranged between the two heat dissipating members 29 and is sleeved on the packaging cover 11, which can not only protect the transistor 10, but also further dissipate the heat through the heat dissipation structure on the protective cover 40. The protection of the transistor 10 is achieved by the protective cover 40, and the installation does not affect the heat dissipation performance of the transistor 10. The heat dissipating transistor assembly 1 of the present application is intended to provide more effective protection for the transistor 10 while improving the heat dissipation effect through an innovative heat dissipation structure to meet the growing power requirements of electronic equipment.

[0030] In one embodiment, the mounting plate 16 includes a mounting portion 17, a fixing portion 12, and a heat dissipation portion 15. There are two fixing portions 12, which are respectively located on opposite sides of the mounting portion 17. There are two heat dissipation portions 15, which are respectively located on opposite sides of the mounting portion 17, and a heat dissipation portion 15 is provided between the two fixing portions 12. The fixing portion 12 is mounted on a heat conducting member 30, and two heat dissipation members 29 are respectively located on the two fixing portions 12. The protective cover 40 is sleeved on the heat dissipation portion 15 so that the outer edge of the heat dissipation portion 15 abuts against the inner wall of the protective cover 40. In this embodiment, the mounting plate 16 can be an integrally molded structure, and the mounting plate 16 is made of a heat-conducting material, for example, a copper sheet. By providing two fixing portions 12, it is convenient to install the transistor 10, and by providing two heat dissipation portions 15, it is convenient to transfer the heat of the transistor body directly to the protective cover. At the same time, since the outer edge of the heat dissipation portion 15 abuts against the inner wall of the protective sleeve 40 , it can reduce or even prevent foreign matter from entering the protective cavity from between the two heat dissipation elements 29 , thereby improving the reliability of protecting the transistor 10 .

[0031] In this embodiment, the two fixing portions 12 are provided with mounting holes 14, and the heat conducting member 30 is provided with threaded holes 33 (such as Figure 5 As shown, each threaded hole 33 is in communication with a corresponding mounting hole 14. The mounting holes 14 are used to insert screws, and the threaded holes 33 are threadedly connected to the screws. The fixing portion 12 is fixedly connected to the thermal conductor 30 via the screws in the mounting holes 14 and threaded holes 33. In other embodiments, the fixing portion 12 can also be attached to the thermal conductor 30 through other means such as snap-fitting.

[0032] See Figures 3 to 5 In one embodiment, the heat conducting member 30 includes a heat conducting mounting plate 31 and a plurality of heat conducting baffles 32. The transistor 10 is mounted on one surface of the heat conducting mounting plate 31, and the plurality of heat conducting baffles 32 are spaced apart on the other surface of the heat conducting mounting plate 31. The spaces between the plurality of heat conducting baffles 32 form heat dissipation channels for air circulation. When the heat dissipating transistor assembly 1 is installed and used, the side provided with the heat conducting baffles 32 is generally mounted on another component. The heat dissipation channels formed by the spaces between the heat conducting baffles 32 facilitate air flow from the bottom wall of the transistor 10 through the transistor 10 and other components, thereby removing heat from the mounting and connection locations.

[0033] like Figure 5 As shown, specifically, the heat conducting member 30 also includes a heat conducting frame 34, which is mounted on the surface of the heat conducting mounting plate 31 on which the heat conducting baffle 32 is mounted, and is located in the heat dissipation channel. The heat conducting frame 34 is provided with a heat dissipation port 26 connected to the heat dissipation channel, and the pins 13 of the transistor body pass through the heat conducting mounting plate 31 and are located in the heat conducting frame 34. In this embodiment, the transistor body is a triode, and the number of pins 13 is three. In other embodiments, the transistor body can also be other semiconductor devices, and the number of pins 13 can also be two or other numbers. By providing the heat conducting frame 34, the pins 13 can be displaced into the heat conducting frame 34 to facilitate protection of the pins 13, while guiding the heat around the pins 13. The heat dissipation port 26 on the heat conducting frame 34 is connected to the heat dissipation channel, which facilitates the circulation of air through the pins 13, thereby improving the heat dissipation effect on the pins 13.

[0034] In this embodiment, the thickness of the heat-conducting frame 34 is consistent with the thickness of the heat-conducting spacer 32 , so that the back surface of the heat-conducting member 30 is more flat, which is beneficial for the installation of the heat-dissipating transistor assembly 1 .

[0035] In this embodiment, the thermal frame 34 is provided with a through hole 342, and the thermal frame 34 is fixedly connected to the bottom of the thermal mounting plate 31 by inserting screws through the through hole 342. In other embodiments, the thermal frame 34 can be integrally formed with the bottom of the thermal mounting plate 31, or welded to the bottom of the thermal mounting plate 31.

[0036] In this embodiment, a heat sink 29 has a protruding heat-conducting mounting plate 31 on the side facing away from the other heat sink 29. A heat dissipation groove 24 is formed on the side of the heat sink 29 facing away from the other heat sink 29. The heat dissipation groove 24 is connected to the heat dissipation port 26 via a heat dissipation channel. When the heat dissipating transistor assembly 1 is mounted on other components, the heat sink 29 can be aligned with the other structure. By forming the heat dissipation groove 24 on the side of the heat sink 29, a channel is formed between the heat sink 29 and the other structure, which further facilitates air circulation around the entire heat dissipating transistor assembly 1 and further improves heat dissipation efficiency.

[0037] See Figures 1 to 3 In one embodiment, the heat sink 29 includes heat sink fins 21 and connecting posts 22. The number of heat sink fins 21 is several and they are distributed parallel to each other. There is a gap between each two adjacent heat sink fins 21 for heat dissipation. Each heat sink fin 21 is connected and fixed in position by a connecting post 22. The heat dissipation structure includes heat dissipation holes 46. The heat dissipation holes 46 are connected to the protective cavity, and the heat dissipation holes 46 are correspondingly connected to the gaps between the heat sink fins 21. Heat conduction is achieved through the heat sink fins 21, and air circulation is facilitated through the gaps between the heat sink fins 21. At the same time, because the space in the protective cavity is correspondingly connected to the gaps between the heat sink fins 21 through the heat dissipation holes 46, the portion of the transistor 10 located above the heat conductor 30 is cooled by air circulation through the protective cover 40 and the heat sink 29, while the portion located below the heat conductor 30 is cooled by air circulation through the heat conductor 30 and the heat dissipation channel formed, the heat dissipation groove 24.

[0038] Specifically, the connecting posts 22 are fixed to the surface of the thermally conductive mounting plate 31 on which the transistor 10 is mounted, effectively securing the heat sink 21 to the thermally conductive mounting plate 31. In this embodiment, a heat sink 29 includes two connecting posts 22, which are spaced apart. The provision of two connecting posts 22 effectively improves the reliability of the installation of each heat sink fin 21.

[0039] See also Figure 5 Specifically, the heat sink 29 further includes a heat-conducting rod 23, which is an L-shaped structure. One end of the heat-conducting rod 23 is spaced apart from the connecting column 22, and one end of the heat-conducting rod 23 passes through each heat-dissipating fin 21 and is fixedly connected to each heat-dissipating fin 21. The other end of the heat-conducting rod 23 is fixed to the surface of the heat-conducting mounting plate 31 facing away from the transistor 10. The provision of the heat-conducting rod 23 not only improves the reliability of the installation of each heat-dissipating fin 21, but also transfers the heat dissipated from the bottom of the transistor 10 to the heat-dissipating fin 21, thereby improving heat dissipation efficiency. In this embodiment, the other end of the heat-conducting rod 23 is fixed to the surface of the heat-conducting mounting plate 31 facing away from the transistor 10 via a plurality of clips 28.

[0040] See Figure 1 、 Figure 2 and Figure 6 In one embodiment, guide protrusions 42 are provided on the outer walls of the protective cover 40 on opposite sides of the two heat sinks 29. Guide grooves 291 are provided on the sides of the two heat sinks 29 facing the protective cover 40. The guide grooves 291 are oriented toward the heat conductor 30. The guide protrusions 42 are inserted into and move within the guide grooves 291. A snap-fit ​​structure 43 is provided on the protective cover 40. When the protective cover 40 is mounted on the packaging cover 11, the snap-fit ​​structure 43 snaps onto the heat sink 29. The coordination of the guide protrusions 42 and the guide grooves 291 not only facilitates installation of the protective cover 40 but also ensures a close fit between the protective cover 40 and the heat sink 29, facilitating heat transfer from the transistor 10 through the protective cover 40 to the heat sink 29. In other embodiments, the guide protrusions 42 may be formed on the heat sink 29, and the guide grooves 291 may be formed on the protective cover 40.

[0041] In this embodiment, there are two guide protrusions 42 on one side of the outer wall of the protective cover 40, and the number of guide grooves 291 matches the number of guide protrusions 42. The heat dissipation structure on the protective cover 40 is disposed between the two guide protrusions 42. In this embodiment, since the heat dissipation structure is a heat dissipation hole 46, by disposing the heat dissipation hole 46 between the two guide protrusions 42, it is possible to prevent the heat dissipation hole 46 from being directly exposed to the outside. The heat dissipation hole 46 is provided with a heat sink 29, which can reduce the possibility of the heat dissipation hole 46 damaging the transistor 10.

[0042] Specifically, the protective cover 40 is provided with a vent hole 44 on its outer wall facing away from the heat conducting member 30. The vent hole 44 is connected to the protective cavity. The vent hole 44 further enhances the air circulation in the protective cavity and further improves the heat dissipation effect.

[0043] In one embodiment, a heat conducting sheet 45 is provided on the outer wall of the protective cover 40 to improve the heat conduction effect of the protective cover 40. In other embodiments, the protective cover 40 is directly made of a heat conducting material.

[0044] The present application also discloses an electronic device, which includes the heat dissipation transistor assembly 1 in any one of the above embodiments.

[0045] The electronic device and heat-dissipating transistor assembly 1 utilizes a heat-conducting member 30 to not only mount the transistor 10 but also conduct heat to the transistor 10. The upper heat sink 29 and the lower heat dissipation channel simultaneously transfer heat to both the upper and lower surfaces of the transistor 10, improving heat dissipation. A protective cover 40, in conjunction with multiple heat-dissipating fins 21, is employed above the heat-conducting member 30 to protect the transistor 10 while ensuring efficient heat dissipation. Furthermore, the heat-dissipating transistor assembly 1 is compact in structure, providing good ventilation around the transistor 10 and ensuring the performance of the transistor 10 to meet the growing power demands of electronic devices.

[0046] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0047] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0048] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0049] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0050] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0051] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A heat dissipation transistor assembly, characterized in that: The heat dissipation transistor assembly comprises: A transistor, comprising a transistor body, a packaging cover and a mounting plate, wherein the transistor body is arranged on the mounting plate and the packaging cover is arranged on the mounting plate; 12. The heat dissipation device as claimed in claim 11, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the end of the bridge and the mounting plate, and the other end is forwarded to the mounting plate by the runners up and down, the wire being a cutout between the bridge and the mounting plate. The heat dissipation device as claimed in claim 12, further comprising the bridge having two opposite ends, the wires being forwarded to the mounting plate and the runners being connected.

12. The heat dissipation device as described in claim 9, wherein the bridge has two opposite sides, and one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, and the two ends are connected along the gap between the end of the heat dissipation device and the mounting plate, so that the heat dissipation device can be connected along the gap between the two mounting plates.

2. The heat dissipating transistor assembly according to claim 1, wherein: The mounting plate includes a mounting portion, a fixing portion and a heat dissipation portion. There are two fixing portions, which are respectively located on opposite sides of the mounting portion. There are two heat dissipation portions, which are respectively located on opposite sides of the mounting portion, and a heat dissipation portion is provided between the two fixing portions. The fixing portion is mounted on the heat conducting member, and the two heat dissipation members are respectively located on the two fixing portions. The protective cover is sleeved on the heat dissipation portion so that the outer edge of the heat dissipation portion abuts against the inner wall of the protective cover.

3. The heat dissipation transistor assembly according to claim 1 or 2, characterized in that: The heat conducting member further includes a heat conducting frame, which is mounted on the surface of the heat conducting mounting plate on which the heat conducting baffle is mounted and is located in the heat dissipation channel. The heat conducting frame is provided with a heat dissipation port connected to the heat dissipation channel. The pins of the transistor body pass through the heat conducting mounting plate and are located in the heat conducting frame.

4. The heat dissipating transistor assembly according to claim 3, wherein: The heat conducting mounting plate protrudes from the side of the heat sink facing away from the other heat sink, and a heat dissipation groove is formed on the side of the heat sink facing away from the other heat sink. The heat dissipation groove can be connected to the heat dissipation port through the heat dissipation channel.

5. An electronic device, characterized in that: The electronic device comprises the heat dissipation transistor assembly according to any one of claims 1 to 4.

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