PCBA assembly and vehicle

Abstract

The embodiment of the invention relates to the technical field of automobiles, and particularly provides a PCBA assembly and a vehicle, and the PCBA assembly comprises a chip assembly which is arranged on a PCBA and comprises at least one chip; a mounting space is formed in the mounting part, and the PCBA and the chip assembly are accommodated in the mounting space; wherein the mounting part comprises a heat dissipation assembly, and an electric path can be formed in the heat dissipation assembly and / or between the heat dissipation assembly and other parts of the mounting part. By means of the structure, the risk that the PCBA generates radiation through the heat dissipation assembly can be effectively reduced. The formation of the electrical path should be understood as a condition that the electrical path can be formed, for example, the conductive structures in the mounting part are connected with one another through one or more conductive structures.

Description

Technical Field

[0001] The present application relates to the field of automobile technology, and specifically provides a PCBA component and a vehicle. Background Art

[0002] With the development of automobile technology, different chips are needed to achieve corresponding control for different domains. Especially when the computing power is high, the heat consumption of the chip is more obvious. Therefore, it is usually necessary to configure a heat dissipation component for the chip. For example, in general, after the chip is set on the PCBA, a heat dissipation component is configured for the chip to ensure its operational reliability.

[0003] The common treatment method at present is to use structural adhesive and other media to achieve the connection between the heat dissipation component and other structures. However, since the structure of the heat dissipation component contains inlets and outlets for the cooling medium to enter and exit the cooling channel, there is a risk of PCBA generating radiation through the inlets and outlets.

[0004] Accordingly, this field requires a new technical solution to solve the above technical problems. Summary of the invention

[0005] The present application aims to at least partially solve the above technical problems and / or solve at least part of the above technical problems, specifically, how to reduce the risk of radiation generated by PCBA components as much as possible while ensuring their operational reliability.

[0006] In a first aspect, the present application provides a PCBA assembly, which includes: a PCBA; a chip assembly, which is arranged on the PCBA, and the chip assembly includes at least one chip; and a mounting portion, which forms a mounting space, and the PCBA and the chip assembly are accommodated in the mounting space; wherein the mounting portion includes a heat dissipation assembly, and an electrical path can be formed inside the heat dissipation assembly and / or between the heat dissipation assembly and other parts of the mounting portion.

[0007] Through such a structure, it is possible to effectively reduce the risk of radiation generated by the PCBA through heat dissipation components (such as water inlet / outlet ends).

[0008] It is understandable that those skilled in the art can determine the structural form of the mounting portion, the formation method of the mounting space, the specific form of the mounting space, the specific fixing method of the PCBA / chip assembly in the mounting space, etc. according to actual needs. For example, in addition to the heat dissipation assembly, the mounting portion also includes one or more parts, and the PCBA / chip assembly can be fixed on a component of the mounting portion, between two components, etc.

[0009] In addition, the term "capable of forming an electrical path" herein should be understood as having conditions for forming an electrical path, such as connecting the structures currently capable of conducting electricity in the mounting portion to each other through one or more structures capable of conducting electricity.

[0010] For the above-mentioned PCBA assembly, in a possible implementation, the heat dissipation assembly includes a heat dissipation substrate and a frame, a cooling channel is formed on the heat dissipation substrate, wherein the heat dissipation substrate and the frame are connected to each other by means of at least one second connecting part, and based on the connection, an electrical path can be formed between the heat dissipation substrate and the frame.

[0011] With such a configuration, it is possible to form an electrical path inside the heat dissipation component.

[0012] It is understandable that those skilled in the art can determine the structural form, number and location of the second connecting part according to actual needs.

[0013] For the above-mentioned PCBA assembly, in a possible implementation, the second connection portion includes a conductive connection structure, and accordingly, the heat dissipation substrate and the frame have a first feature and a second feature, respectively, and the heat dissipation substrate is connected to the frame by means of the cooperation between the connection structure and the first feature and the second feature.

[0014] Through such a configuration, a possible structural form of the second connecting portion is given. Those skilled in the art can determine the connecting structure, the structural form of the first / second feature, the specific location where the connection relationship is established, and the matching relationship between the connecting structure and the first / second feature according to actual needs. Exemplarily, the connecting structure is a connecting column, and the two sections of the connecting column are respectively connected to the first feature and the second feature.

[0015] For the above PCBA assembly, in a possible implementation manner, the mounting portion includes a bottom cover, and the mounting space is formed between the heat dissipation assembly and the bottom cover.

[0016] Through such a configuration, a possible structural form of the mounting portion is provided.

[0017] For the above PCBA assembly, in a possible implementation, the heat dissipation assembly and the bottom cover are connected to each other by means of at least one third connection portion, and based on the connection, an electrical path can be formed between the heat dissipation assembly and the bottom cover.

[0018] With such a configuration, it is possible to form an electrical path outside the heat sink, specifically, between the heat sink of the mounting portion and the bottom cover.

[0019] It can be understood that, similar to the aforementioned second connecting part, those skilled in the art can determine the structural form, number and setting position of the third connecting part according to actual needs.

[0020] For the above PCBA assembly, in a possible implementation, the heat dissipation assembly and the bottom cover are connected at at least one position by means of the third connecting portion; and / or the heat dissipation base of the heat dissipation assembly and the bottom cover are connected by means of the third connecting portion.

[0021] Through such a configuration, it is possible to achieve electrical conduction between the heat dissipation assembly (between the heat dissipation substrate and / or the frame) and the bottom cover by single-point / multi-point connection. Taking multi-point connection as an example, the structural forms of the third connection parts corresponding to different positions can be the same or different. Exemplarily, they are connected to each other by means of fasteners such as screws and features such as mounting holes at corresponding positions.

[0022] For the above PCBA assembly, in a possible implementation manner, a heat conducting layer is provided between the chip assembly and the heat dissipation substrate.

[0023] With such a configuration, it is possible to better conduct heat from the chip assembly to a cooling medium such as cooling water in the cooling channel.

[0024] For the above PCBA assembly, in a possible implementation, the heat dissipation substrate and the frame are connected to each other by means of at least one first connection portion, and based on the connection, no electrical path can be formed between the heat dissipation substrate and the frame.

[0025] With such a configuration, it is possible to achieve connection between the heat dissipation base and the frame body via a non-conductive connection medium.

[0026] For the above PCBA assembly, in a possible implementation manner, the at least one first connecting portion includes structural adhesive.

[0027] This configuration provides a possible structural form of the first connecting part.

[0028] For the above PCBA assembly, in a possible implementation manner, the frame includes a main body and a retaining wall, and the heat dissipation substrate, the main body and the retaining wall form a chamber.

[0029] Through such a configuration, a possible structural form of the heat dissipation component is provided.

[0030] For the above PCBA assembly, in a possible implementation manner, an exhaust structure is provided on the heat dissipation substrate and / or the frame.

[0031] With such a configuration, it is possible to effectively control the pressure inside the chamber through the exhaust structure during the curing process of the structural adhesive, thereby ensuring the reliability of the connection of the heat dissipation component through the structural adhesive.

[0032] For the above PCBA assembly, in a possible implementation manner, the exhaust structure is configured with a blocking structure.

[0033] With such a configuration, it is possible to avoid the phenomenon in which condensation accumulates on the inner wall of the chamber.

[0034] In a second aspect, the present application provides a vehicle, comprising a PCBA assembly as described in any one of the above.

[0035] It can be understood that the vehicle has all the technical effects of the PCBA assembly described in any of the above items, which will not be repeated here.

[0036] For the above-mentioned vehicle, in one possible implementation, the chip assembly includes a smart cockpit chip and a smart driving chip.

[0037] Through such a structure, it is possible to achieve deep integration across domains.

[0038] Proposal 1. A PCBA assembly, characterized in that the PCBA assembly comprises:

[0039] PCBA;

[0040] A chip assembly, which is arranged on the PCBA, wherein the chip assembly includes at least one chip; and

[0041] An installation portion, which forms an installation space, and the PCBA and the chip assembly are accommodated in the installation space;

[0042] Wherein, the mounting portion includes a heat dissipation component, and an electrical path can be formed inside the heat dissipation component and / or between the heat dissipation component and other parts of the mounting portion.

[0043] Proposal 2. The PCBA assembly according to Proposal 1 is characterized in that the heat dissipation assembly comprises a heat dissipation substrate and a frame, and a cooling channel is formed on the heat dissipation substrate.

[0044] The heat dissipation substrate and the frame are connected to each other by means of at least one second connecting portion, and

[0045] Based on this connection, an electrical path can be formed between the heat dissipation substrate and the frame.

[0046] Proposal 3. The PCBA assembly according to Proposal 2, wherein the second connecting portion comprises a conductive connecting structure,

[0047] Correspondingly, the heat dissipation substrate and the frame have a first feature and a second feature respectively.

[0048] The heat dissipation substrate is connected to the frame by means of the cooperation between the connection structure and the first feature and the second feature.

[0049] Proposal 4. The PCBA assembly according to Proposal 2 is characterized in that the mounting portion includes a bottom cover, and the mounting space is formed between the heat dissipation assembly and the bottom cover.

[0050] Proposal 5. The PCBA assembly according to Proposal 4, characterized in that the heat dissipation assembly and the bottom cover are connected to each other by means of at least one third connecting portion, and

[0051] Based on this connection, an electrical path can be formed between the heat dissipation assembly and the bottom cover.

[0052] Proposal 6. The PCBA assembly according to Proposal 5, characterized in that the heat dissipation assembly and the bottom cover are connected at at least one position by means of the third connecting portion; and / or

[0053] The heat dissipation base of the heat dissipation assembly is connected to the bottom cover by means of the third connecting portion.

[0054] Proposal 7. The PCBA assembly according to Proposal 2 is characterized in that a heat-conducting layer is provided between the chip assembly and the heat dissipation substrate.

[0055] Proposal 8. The PCBA assembly according to Proposal 2, characterized in that the heat dissipation substrate and the frame are connected to each other by means of at least one first connecting portion, and

[0056] Based on this connection, no electrical path can be formed between the heat dissipation substrate and the frame.

[0057] Proposal 9. The PCBA assembly according to Proposal 8, wherein the at least one first connecting portion comprises a structural adhesive.

[0058] Proposal 10. The PCBA assembly according to Proposal 9 is characterized in that the frame includes a main body and a retaining wall, and the heat dissipation substrate, the main body and the retaining wall form a chamber.

[0059] Proposal 11. The PCBA assembly according to Proposal 9 is characterized in that an exhaust structure is provided on the heat dissipation substrate and / or the frame.

[0060] Proposal 12. The PCBA assembly according to Proposal 11, characterized in that the exhaust structure is configured with a blocking structure.

[0061] Proposal 13. A vehicle, characterized in that the vehicle comprises the PCBA assembly according to any one of Proposals 1 to 12.

[0062] Proposal 14. The vehicle according to Proposal 13 is characterized in that the chip components include a smart cockpit chip and a smart driving chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] The preferred embodiments of the present application are described below in conjunction with the chip assembly including the smart cockpit chip and the smart driving chip with reference to the accompanying drawings, in which:

[0064] Figure 1 A schematic diagram of the assembly of a PCBA assembly according to an embodiment of the present application is shown;

[0065] Figure 2 An exploded schematic diagram of a heat dissipation component in a mounting portion of a PCBA component according to an embodiment of the present application is shown;

[0066] Figure 3 An exploded schematic diagram of a mounting portion in a PCBA assembly according to an embodiment of the present application is shown, wherein the third feature, the fourth feature, the fifth feature and the sixth feature are shown;

[0067] Figure 4 Shows Figure 3 An enlarged schematic diagram of a part A in the figure shows a copper bus, a first feature and a second feature;

[0068] Figure 5 A schematic diagram showing the structure of the main part of the frame in the heat dissipation assembly of a PCBA assembly according to an embodiment of the present application Figure 1 (Inside);

[0069] Figure 6 Shows Figure 5 An enlarged schematic diagram of a part B in the middle part shows the exhaust holes in the exhaust structure;

[0070] Figure 7 A schematic diagram showing the structure of the main part of the frame in the heat dissipation assembly of a PCBA assembly according to an embodiment of the present application Figure 2 (outside); and

[0071] Figure 8 Shows Figure 7 An enlarged schematic diagram of a part C in the figure shows the exhaust pipe in the exhaust structure.

[0072] List of reference numerals:

[0073] 100. PCBA components;

[0074] 1. PCBA;

[0075] 21. Smart cockpit chip; 22. Smart driving chip;

[0076] 3. Installation department;

[0077] 31. Heat dissipation components;

[0078] 311, heat dissipation substrate; 3111, water inlet end; 3112, water outlet end;

[0079] 3121. Main part; 3122. Retaining wall;

[0080] 313, chamber;

[0081] 32. Bottom cover;

[0082] 4. Copper busbar;

[0083] 51. First feature; 52. Second feature; 53. Third feature; 54. Fourth feature; 55. Fifth feature; 56. Sixth feature;

[0084] 611, exhaust hole; 612, exhaust pipe;

[0085] 62. Plug. DETAILED DESCRIPTION

[0086] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. For example, those skilled in the art can adjust the number and type of chips included in the chip assembly according to actual needs.

[0087] It should be noted that in the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0088] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installation", "setting", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal connection of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0089] In addition, in order to better illustrate the present application, many specific details are given in the specific implementation below, and those skilled in the art should understand that the present application can also be implemented without certain specific details. In some examples, the control principle of the chip well known to those skilled in the art is not described in detail in order to highlight the main purpose of the present application.

[0090] Main references Figures 1 to 4 In a possible implementation, a PCBA assembly is provided on the vehicle. The PCBA assembly 100 mainly includes PCBA1 and a chip assembly provided on PCBA1. In this example, the chip assembly includes a smart cockpit chip 21 and a smart driving chip 22. By arranging the two chips on the same PCBA1, faster signal interaction can be achieved. For example, since the smart driving chip 22 has higher computing power, the performance of the cockpit domain corresponding to the smart driving chip can be improved through the fast interaction between the two, based on the hardware merger.

[0091] For example, in traditional domain controllers, the hardware related to autonomous driving and smart cockpits belong to two independent parts, which is not conducive to the deep integration of electronic and electrical equipment, and the cost is relatively high. Accordingly, in this example, by integrating the smart cockpit chip 21 and the smart driving chip 22 on the same PCBA, a deep integration of cross-domain fusion is achieved and a high-performance computing center (central computing platform) is generated, which is accompanied by the formation of the central computing platform and reduces costs. Obviously, those skilled in the art can determine the number and type of chips contained in the chip assembly and the way they are integrated on the PCBA according to actual needs. For example, it includes only one chip, two chips that are not cross-domain, more cross-domain / non-cross-domain chips, etc.

[0092] In addition, the PCBA assembly 100 also includes an installation part 3, which mainly includes a heat dissipation assembly 31 and a bottom cover 32. The PCBA1 and the chip component 2 are sandwiched between the heat dissipation assembly 31 and the bottom cover 32, that is, an installation space that can sandwich the PCBA1 and the chip component 2 is formed between the heat dissipation assembly 31 and the bottom cover 32, and the chip assembly is located on a side of the installation part 3 close to the heat dissipation assembly 31 in the assembled state. The heat dissipation assembly 31 is mainly used to effectively dissipate heat for the smart cockpit chip 21 and the smart driving chip 22.

[0093] In a possible implementation, the heat dissipation assembly 31 includes a heat dissipation base 311 and a frame, the heat dissipation base 311 includes a cooling channel, the heat dissipation base 311 and the frame are connected to each other and form a chamber 313, the chamber can play a certain protective role for the chip assembly, and the chip assembly is arranged on the side of the heat dissipation base 311 away from the frame. For example, the chip assembly is directly attached to the cooling channel of the heat dissipation base 311, so that the heat dissipation assembly can effectively dissipate the heat of the two integrated chips. Exemplarily, a heat conductive layer such as a thermal conductive adhesive can be applied between the chip assembly and the heat dissipation base.

[0094] In this example, the heat dissipation base 311 is a water-cooled plate assembly with a cooling channel formed inside, such as a water-cooled plate assembly is a water channel brazing assembly, and the two ends of the cooling channel have a water inlet end 3111 and a water outlet end 3112 that can be connected to an external water source, such as the water inlet end 3111 and the water outlet end 3112 pass through the frame.

[0095] In this example, the frame mainly includes a main body 3121 and a retaining wall 3122 . The main body 3121 , the retaining wall 3122 and the water channel brazing assembly surround a chamber 313 . The water inlet 3111 and the water outlet 3112 pass through the main body 3121 and exit the chamber 313 .

[0096] In a possible implementation, the heat dissipation substrate 311 and the frame are both structures made of conductive materials such as metal parts. The heat dissipation substrate 311, the main body 3121 and the retaining wall 3122 are bonded and cured together by a structural adhesive (not shown) as a first connection part, thereby achieving mutual connection and constructing the chamber 313. Since the structural adhesive is not conductive, no electrical path is formed between the heat dissipation substrate 311 and the frame in the first connection relationship established based on the structural adhesive.

[0097] In a possible implementation manner, the heat dissipation substrate 311 and the frame are further connected to each other via at least one second connection portion. For example, in this example, the at least one second connection portion includes a conductive connection structure such as a copper busbar 4 .

[0098] In a specific example, the copper bar 4 is arranged at a position of the heat dissipation component close to the outer edge of the frame, such as approximately located in the chamber at a position corresponding to the corner of the frame. The copper bar 4 has two mounting holes, and the positions of the copper bar 4 corresponding to the two mounting holes are respectively locked with the first feature 51 on the waterway brazing component and the second feature 52 on the frame (main body) by means of fasteners such as screws, such as the positions of the waterway brazing component corresponding to the first feature 51 and the frame corresponding to the second feature 52 should also be conductive metal structures. In this way, in addition to the aforementioned basic connection (first connection relationship) established based on the structural adhesive, a second connection relationship is established between the heat dissipation base 311 and the frame through the copper bar 4. Based on the establishment of the second connection relationship, an electrical path is formed between the heat dissipation base 311 and the frame.

[0099] In a possible implementation, the heat dissipation assembly 31 and the bottom cover 32 of the mounting portion 3 are connected to each other via at least one third connection portion, and based on the connection, an electrical path can be formed between the heat dissipation assembly 31 and the bottom cover 32. As in this example, the at least one third connection portion includes two fasteners (not shown) such as screws, bolts, and pins.

[0100] In a specific example, the third feature 53 on the bottom cover 32 and the fourth feature 54 on the water-cooled plate brazing assembly, and the fifth feature 55 on the bottom cover and the sixth feature 56 on the water-cooled plate brazing assembly are connected by means of fasteners. In this example, the connection relationship established between the third feature 53 and the fourth feature 54 is roughly located near the middle of the heat dissipation assembly, and the connection relationship established between the fifth feature 55 and the sixth feature 56 is roughly located near the outer edge of the heat dissipation assembly, such as roughly located in the chamber corresponding to the corner of the frame. As in this example, the connection relationship established between the fifth feature 55 and the sixth feature 56 and the second connection relationship established based on the copper busbar 4 are roughly distributed on a diagonal line of the frame.

[0101] In this way, on the one hand, in addition to the first connection relationship between the heat dissipation base 311 and the frame based on the structural adhesive, an electrical path is formed between the heat dissipation base 311 and the frame through the second connection relationship established based on the copper busbar 4. On the other hand, outside the heat dissipation component 31, specifically, between the heat dissipation component 31 of the mounting portion and the bottom cover 32, an electrical path is formed between the heat dissipation component 31 and the bottom cover 32 through the third connection relationship established based on the fastener. Based on the formation of the electrical path, the waterway brazing component and the frame can be electrically connected inside the heat dissipation component 31, so that the signal radiated from the chip component set on the PCBA1 to the water-cooled plate brazing component can be conducted to the frame / bottom cover through the established electrical path. Since the frame / bottom cover is grounded (such as grounded by the legs), the risk of radiation generated by the PCBA1 through the waterway brazing component can be effectively reduced.

[0102] It can be seen that in this example, electrical conduction between the various parts of the mounting portion is established through three sets of features. Obviously, those skilled in the art can determine the position, number, and specific structure by which electrical conduction can be achieved based on actual needs. For example, the corresponding electrical connection point can be located inside the chamber, at the position where the heat dissipation substrate / frame / bottom cover snaps together (outer edge), or at any position outside the chamber. The electrical conduction between each set of elements can be achieved based on a single-point connection or a multi-point connection.

[0103] As in this example, the heat dissipation component is connected inside the chamber by means of a copper busbar with a sheet structure and the existing features of the heat dissipation substrate / frame. Obviously, the copper busbar can also be replaced with structures such as a connection block, a connection column, a connection seat, etc. The features corresponding to the heat dissipation substrate / frame can be existing features or additional features, and the establishment of the connection relationship can also be moved from the chamber to the overlapping position of the two or outside the chamber. For example, a second connection component (such as the aforementioned connection block, connection line, connection seat, etc.) is added to the outside of the PCBA component (outside the chamber), and the second connection component is connected to the heat dissipation substrate and the frame respectively to achieve electrical conduction. Similarly, as in the present example, the outside of the heat dissipation assembly (between the heat dissipation assembly and the bottom cover) is connected by means of a multi-point connection (the features corresponding to the heat dissipation assembly / bottom cover may be existing features or additional features). Obviously, the number, position, and features corresponding to the multi-point connections may be flexibly selected. For example, one or more of the connections implemented by means of fasteners may be replaced with the aforementioned copper busbar-based connection, the connection may be replaced with the aforementioned connection based on structures such as connection blocks, connection columns, and connection seats, and the establishment of the connection relationship may be moved from the inside / outside edge of the chamber (the overlapping position between the two) to outside the chamber.

[0104] In a possible implementation, considering that the first connection relationship realized based on the structural adhesive belongs to a relatively sealed connection relationship that can construct a chamber, the position where the second / third connection relationship is established does not overlap with the position of the structural adhesive. For example, the second connection relationship corresponding to the copper bus 4 and the features (51, 52) and the third connection relationship (one of them) corresponding to the features (55, 56) are both located on the inner side of the ring-shaped portion formed by the structural adhesive. However, where possible, at least a portion of the positions where the connection relationships are established can also overlap. Exemplarily, multiple connection points that can achieve electrical conduction are added in the ring-shaped portion corresponding to the structural adhesive.

[0105] And, in this example, the connection relationship that can achieve electrical conduction inside / outside the heat dissipation component is established by indirect screw connection (screw connection is added on the basis of introducing the copper busbar between the first feature and the second feature) and direct screw connection (between the third feature and the fourth feature, and between the fifth feature and the sixth feature). Obviously, those skilled in the art can adopt other methods to achieve corresponding electrical conduction according to actual needs. For example, electrical conduction between the inside / outside of the heat dissipation component can be achieved by conductive glue, a combination of multiple connecting parts, etc.

[0106] As mentioned above, after the water channel brazing assembly and the frame are bonded and cured together by the structural adhesive, a cavity 313 is formed between the water channel brazing assembly and the frame. Figures 5 to 8 In a possible implementation, in order to cater to the process of using structural adhesive to achieve the connection between the two, an exhaust structure is provided on the waterway brazing assembly. For example, in this example, an exhaust hole 611 is provided on the inner side of the main body of the frame, and an exhaust pipe 612 extending from the exhaust hole is provided on the outer side of the main body. Through the provision of the exhaust structure, the chamber 313 can be connected to the outside. In this way, when the structural adhesive is cured (a high temperature furnace is required), the pressure in the chamber can be effectively controlled by the exhaust structure, thereby avoiding the phenomenon of the structural adhesive being broken due to excessive pressure in the chamber during the curing process, thereby ensuring that the connection relationship is reliably established. Obviously, the combination of the exhaust hole and the exhaust pipe is only an exemplary description of the exhaust structure, and those skilled in the art can flexibly adjust it according to actual needs, such as including an exhaust pipe extending into the chamber, an exhaust hole directly connected to the external environment, etc.

[0107] However, in actual use, since there is cooling water in the cooling channel formed inside the waterway brazing assembly, the temperature in the chamber 313 often forms a certain difference with the outer ring temperature. Based on this, assuming that the air inside and outside the chamber is allowed to exchange freely, the existence of the difference will cause condensation to form on the inner wall of the chamber, and the generation of condensation will affect the performance of the heat dissipation assembly to a certain extent. In view of this, in a possible implementation, in order to avoid condensation on the inner wall of the chamber, more precisely, to avoid obvious / excessive condensation accumulation on the inner wall of the chamber, a blocking structure such as a plug 62 is configured for the exhaust pipe 612, so that after the PCBA assembly 100 enters the use state, the exhaust pipe 612 on the waterway brazing assembly (finished product) can be continuously blocked by the plug 62, thereby ensuring the use performance of the PCBA assembly 100.

[0108] It can be seen that in the preferred embodiment of the present application, by integrating the smart cockpit chip and the smart driving chip on the same PCBA, it is expected to achieve rapid signal interaction. By directly attaching the chip assembly to the waterway brazing assembly, the heat dissipation performance of the chip assembly can be effectively guaranteed. By designing an exhaust structure on the frame, it can be ensured that the high-pressure gas inside the chamber is discharged in time during the high-temperature curing of the structural adhesive, thereby effectively preventing the structural adhesive from bursting during the curing process due to excessive air pressure inside the chamber. By adding a plug that matches the exhaust pipe of the exhaust structure to the finished product, the exhaust structure can be blocked, thereby effectively preventing the exchange of gases inside and outside the chamber, and thereby reducing the risk of condensation inside the chamber.

[0109] On the basis of realizing basic connection based on structural adhesive, an electrical path is formed among the water channel brazing assembly, the frame and the bottom cover by establishing connection relationships between the water channel brazing assembly and the frame, and between the heat dissipation assembly and the bottom cover, thereby effectively reducing the EMC radiation risk of the PCBA / chip assembly through the water channel brazing assembly.

[0110] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A PCBA assembly, characterized in that: The PCBA assembly includes: PCBA; A chip assembly, which is arranged on the PCBA, wherein the chip assembly includes at least one chip; and An installation portion, which forms an installation space, and the PCBA and the chip assembly are accommodated in the installation space; Wherein, the mounting portion includes a heat dissipation component, and an electrical path can be formed inside the heat dissipation component and / or between the heat dissipation component and other parts of the mounting portion.

2. The PCBA assembly according to claim 1, characterized in that: The heat dissipation assembly comprises a heat dissipation base and a frame, wherein a cooling channel is formed on the heat dissipation base. The heat dissipation substrate and the frame are connected to each other by means of at least one second connecting portion, and Based on this connection, an electrical path can be formed between the heat dissipation substrate and the frame.

3. The PCBA assembly according to claim 2, characterized in that: The second connecting portion includes a conductive connecting structure, Correspondingly, the heat dissipation substrate and the frame have a first feature and a second feature respectively. The heat dissipation substrate is connected to the frame by means of the cooperation between the connection structure and the first feature and the second feature.

4. The PCBA assembly according to claim 2, characterized in that: The installation portion includes a bottom cover, and the installation space is formed between the heat dissipation assembly and the bottom cover.

5. The PCBA assembly according to claim 4, characterized in that: The heat dissipation assembly and the bottom cover are connected to each other by means of at least one third connection portion, and Based on this connection, an electrical path can be formed between the heat dissipation assembly and the bottom cover.

6. The PCBA assembly according to claim 5, characterized in that: The heat dissipation assembly and the bottom cover are connected at at least one position by means of the third connecting portion; and / or The heat dissipation base of the heat dissipation assembly is connected to the bottom cover by means of the third connecting portion.

7. The PCBA assembly according to claim 2, characterized in that: A heat-conducting layer is arranged between the chip assembly and the heat-dissipating substrate.

8. The PCBA assembly according to claim 2, characterized in that: The heat dissipation substrate and the frame are connected to each other by means of at least one first connecting portion, and Based on this connection, no electrical path can be formed between the heat dissipation substrate and the frame.

9. The PCBA assembly according to claim 8, characterized in that: The at least one first connecting portion comprises a structural adhesive.

10. The PCBA assembly according to claim 9, characterized in that: The frame includes a main body and a retaining wall, and the heat dissipation substrate, the main body and the retaining wall form a cavity.

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