Multi-core-group ceramic capacitor and preparation method thereof

Abstract

The invention relates to a multi-core-group ceramic capacitor and a preparation method thereof, and the capacitor comprises a first welding piece and a second welding piece which are oppositely arranged, a capacitor body arranged between the first welding piece and the second welding piece, and a mold pressing housing wrapping the periphery of the capacitor body. Comprising two connecting frames arranged oppositely, a supporting frame arranged between the two connecting frames and two capacitor chip sets arranged between the connecting frames and the supporting frame respectively, each capacitor chip set comprises a plurality of capacitor chips arranged in sequence, a first welding piece is connected with the tops of the two connecting frames, and a second welding piece is connected with the bottom of the supporting frame; the structure of the multi-core group ceramic capacitor is limited, the internal structure of the multi-core group ceramic capacitor is improved, the ends of the capacitor chips are welded with the connecting frame and the supporting frame and then are welded with the welding sheets, and the connecting frame and the supporting frame can be locally deformed when bearing stress, so that the impact of the stress on the capacitor chips is released, and meanwhile, the strain resistance is improved.

Description

Technical Field

[0001] The invention belongs to the field of ceramic capacitor preparation, and in particular relates to a multi-core ceramic capacitor and a preparation method thereof. Background Art

[0002] The existing multi-core ceramic capacitors are divided into two series: molded multi-core capacitors and bracket ceramic capacitors. The traditional internal chips and frames of multi-core ceramic capacitors are mainly welded together at the E width, and the effective welding area is small. When subjected to mechanical vibration or impact, it is easy to crack and fail at the E width, which needs further improvement. Summary of the invention

[0003] The object of the present invention is to overcome the disadvantages of the prior art and provide a multi-core ceramic capacitor and a preparation method thereof.

[0004] The present invention adopts the following technical solution: A multi-core ceramic capacitor comprises a first welding sheet and a second welding sheet arranged opposite to each other, a capacitor body arranged between the first welding sheet and the second welding sheet, and a molded shell covering the periphery of the capacitor body. The capacitor body comprises two connecting frames arranged opposite to each other, a supporting frame arranged between the two connecting frames, and two capacitor chip groups respectively arranged between the connecting frames and the supporting frames, wherein the capacitor chip group comprises a plurality of capacitor chips arranged in sequence, the first welding piece is connected to the tops of the two connecting frames, and the second welding piece is connected to the bottom of the supporting frame; The support frame comprises a support section and a connecting section vertically arranged on the support section and connected to the capacitor chip group. The support section comprises a plurality of supporting feet alternately arranged on the left and right sides at the bottom of the connecting section.

[0005] Furthermore, the first welding plate includes a first welding plate connected to the tops of the two connecting frames, a first connecting section connected to the first welding plate and extending downward, and a first lead-out end connected to the first connecting section and extending outward from the molded shell, and the second welding plate includes a second welding plate connected to the bottom of the supporting frame, a second connecting section connected to the second welding plate and extending upward, and a second lead-out end connected to the second connecting section and extending outward from the molded shell.

[0006] Furthermore, the first lead-out end and the second lead-out end are arranged on both sides of the molded shell relatively to each other, the first lead-out end includes a first horizontal section connected to the first connecting section and a first lead-out section arranged on the outside of the molded shell and connected to the first horizontal section, and the second lead-out end includes a second horizontal section connected to the second connecting section and a second lead-out section arranged on the outside of the molded shell and connected to the second horizontal section.

[0007] Furthermore, the first lead-out section is arranged in an L shape, and the second lead-out section is arranged in an inverted L shape.

[0008] Furthermore, the connection frame includes a connection frame body connected to the end of the capacitor chipset and a welding section vertically connected to the end of the connection frame body, the first welding sheet is connected to the welding section, and the capacitor chipset is located below the welding section.

[0009] A method for preparing a multi-core ceramic capacitor comprises the following steps: Step 1: Use a welding jig to weld the support frame, two connection frames and two capacitor chip groups to form a capacitor body: Step 2, placing the first original welding frame on the welding base, and applying solder paste on the first original welding frame, and then placing multiple capacitor bodies on the first original welding frame one by one, and then applying solder paste on the welding position of the second original welding frame, and then placing it on the top of the multiple capacitor bodies, and then fixing the welding pressure plate on the welding base to fix the second original welding frame, and sending it to reflow soldering for welding; Step 3, after welding is completed, the welding pressing plate is removed, the finished capacitor is taken out, and the multi-core ceramic capacitor is obtained after cleaning, rib cutting and forming.

[0010] Furthermore, the welding base includes a welding groove extending downward from its top surface for placing the capacitor body, and a first placement groove and a second placement groove respectively arranged on both sides of the welding groove for installing the first original welding frame and the second original welding frame respectively.

[0011] Furthermore, the welding base includes a base body and a welding base plate arranged on the base body, the base body is provided with a limiting hole for the lower end of the welding base plate to be embedded, the welding base plate includes a plurality of welding plates that can be spliced ​​in sequence, the upper end of the welding plate is formed with a supporting edge that can be supported on the top surface of the base body, and the welding groove, the first placement groove, and the second placement groove are formed on the welding base plate.

[0012] Furthermore, a plurality of strip-shaped exhaust grooves are arranged at intervals on the welding plate.

[0013] Furthermore, the welding pressure plate is fixed to the welding base by a fixing mechanism, and the fixing mechanism includes two fixing blocks relatively arranged on the welding base, two fixing magnets respectively arranged on the two fixing blocks and capable of adsorbing the welding pressure plate, a plurality of fixing bolts spaced apart on the welding pressure plate and respectively opposite to a plurality of capacitor bodies, and a plurality of fixing screw holes arranged on the welding pressure plate and cooperating with the plurality of fixing bolts, and the two ends of the welding pressure plate are respectively adsorbed and fixed on the two fixing blocks.

[0014] From the above description of the present invention, it can be seen that compared with the prior art, the beneficial effects of the present invention are as follows: the present application improves the internal structure of the multi-core ceramic capacitor by limiting the structure of the multi-core group, and sets two connecting frames and a supporting frame connected to the first welding plate and the second welding plate between the two capacitor chip groups, so that the capacitor chip group is adjusted to a structure with a frame, and after the capacitor chip end is welded with the connecting frame and the supporting frame, the connecting frame and the supporting frame are welded with the welding plate, and the connecting frame and the supporting frame can be partially deformed when subjected to stress, so as to relieve the impact of stress on the capacitor chip and improve the ability to resist strain; in addition, the structure of the first welding plate and the second welding plate is limited, and the first welding plate and the second welding plate are respectively connected to the two connecting frames and the supporting frame, which greatly improves the effective welding area, so that the combined multi-core capacitor has better electrical performance parameters, reliability and structural strength, while meeting the product reliability, providing customers with more choices; and providing a multi-core capacitor welding jig and a welding method, which are simple to produce and can be applied to mass production occasions; high reliability, strong mechanical and environmental usability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of a multi-core ceramic capacitor; Figure 2 It is a disassembled schematic diagram of a multi-core ceramic capacitor; Figure 3 It is a structural schematic diagram of the capacitor body; Figure 4 It is a schematic diagram of the exploded view of the capacitor body; Figure 5 is a structural schematic diagram of the support frame; Figure 6 It is a structural schematic diagram of the welding fixture; Figure 7 This is a schematic diagram of the decomposition of the welding fixture; Figure 8 The assembly diagram of welding base and welding pressure plate Figure 1 ; Fig. 9 The assembly diagram of welding base and welding pressure plate Figure 2 ; Fig.10 It is a structural schematic diagram of the welding plate; Fig.11 is a structural schematic diagram of the first original frame; Fig.12 is a schematic diagram of the structure of the second original frame; In the figure, 1-first welding piece, 2-second welding piece, 3-capacitor body, 4-molded housing, 5-welding platform, 6-positioning mechanism, 7-welding base, 8-welding pressure plate, 9-fixing mechanism, 11-first welding piece, 12-first connecting section, 13-first lead-out end, 14-first horizontal section, 15-first lead-out section, 21-second welding piece, 22-second connecting section, 23-second lead-out end, 24-second horizontal section, 25-second lead-out section, 31-connecting frame, 311-connecting frame body, 312-welding section, 32-supporting frame, 321-supporting section, 322-connecting section, 323-supporting foot, 33-capacitor chipset, 331-capacitor chip, 51-mounting table, 52-mounting slot, 521-mounting slot body, 522-extension groove, 53-second positioning groove, 61-positioning seat, 62-positioning magnet, 63-positioning metal magnetic conductor, 64-positioning seat body, 641-first positioning groove, 65-limiting section, 71-welding groove, 72-first placement groove, 73-second placement groove, 74-welding base, 741-limiting hole, 75-welding bottom plate, 751-welding plate, 752-supporting edge, 753-strip exhaust groove, 76-first original frame, 761-first connecting rib, 762-first original welding sheet, 763-first molding section, 77-second original frame, 771-second connecting rib, 772-second original welding sheet, 773-second molding section, 91-fixing block, 92-fixing magnet, 93-fixing bolt, 94-fixing screw hole. DETAILED DESCRIPTION

[0016] The present invention is further described below through specific implementation modes.

[0017] Reference Figures 1 to 12 As shown, a multi-core ceramic capacitor comprises a first welding plate 1 and a second welding plate 2 arranged opposite to each other, a capacitor body 3 arranged between the first welding plate 1 and the second welding plate 2 , and a molded shell 4 covering the outer periphery of the capacitor body 3 .

[0018] The capacitor body 3 includes two connecting frames 31 arranged opposite to each other, a supporting frame 32 arranged between the two connecting frames 31, and two capacitor chip groups 33 respectively arranged between the connecting frames 31 and the supporting frames 32, wherein the capacitor chip group 33 includes a plurality of capacitor chips 331 arranged in sequence, and the two ends of the capacitor chip 331 are respectively connected between the connecting frames 31 and the supporting frames 32.

[0019] The support frame 32 includes a support section 321 and a connecting section 322 vertically arranged on the support section 321 and connected to the capacitor chipset group 33, wherein the support section 321 includes a plurality of support feet 323 alternately arranged on the left and right sides at the bottom of the connecting section 322. By limiting the structure of the support section 32, the contact area between the support frame 32 and the relative welding plate is increased, thereby increasing the ability of the capacitor to withstand vibration and impact.

[0020] The connecting frame 31 includes a connecting frame body 311 connected to the end of the capacitor chip group 33 and a welding section 312 vertically connected to the end of the connecting frame body 311, wherein the welding section 312 is located above the capacitor chip group 33, and a gap is formed between the welding section 312 and the capacitor chip group 33; and a gap is also formed between the connecting section 322 of the support frame 32 and the relative capacitor chip group 33, so that the capacitor body 3 can be partially deformed when subjected to stress to relieve the impact of stress on the capacitor chip, while improving the capacitor's ability to resist strain and increasing product reliability.

[0021] The first welding plate 1 is connected to the top of the two connecting frames 31, and includes a first welding plate 11 connected to the welding section 312, a first connecting section 12 connected to the first welding plate 11 and extending downward, and a first lead-out end 13 connected to the first connecting section 12 and extending outward from the molded shell 4, wherein the first lead-out end 13 includes a first horizontal section 14 vertically connected to the first connecting section 12 and a first lead-out section 15 arranged on the outside of the molded shell 4 and vertically connected to the first horizontal section 14. Specifically, the first lead-out section 15 is arranged in an L-shape.

[0022] The second welding piece 2 is connected to the bottom of the support frame 32, including a second welding piece 21 connected to the bottom of the support section 321, a second connecting section 22 connected to the second welding piece 21 and extending upward, and a second lead-out end 23 connected to the second connecting section 22 and extending outward from the molded housing 4, wherein the second lead-out end 23 is arranged on both sides of the molded housing 4 relative to the first lead-out end 13. Specifically, the second lead-out end 23 includes a second horizontal section 24 vertically connected to the second connecting section 22 and a second lead-out section 25 arranged on the outside of the molded housing 4 and vertically connected to the second horizontal section 24. Further, the second lead-out section 25 is arranged in an inverted L shape; by limiting the structure of the first welding piece 1 and the second welding piece 2, the first welding piece 11 and the second welding piece 21 are respectively connected to the two connecting frames 31 and the supporting frame 32, so as to increase the force bearing area of ​​the capacitor chip 331 and increase its ability to withstand vibration and impact, and the design of the first welding piece 11 and the second welding piece 21 can transfer the direct contact point and improve the structural strength; at the same time, the structure of the first lead-out terminal 13 and the second lead-out terminal 23 is further limited, and the transmission of the impact stress is relieved through the design of multiple folding angles on the same side, so that the energy is released in advance on the molded housing 4 contacted by the welding piece.

[0023] The capacitor body 3 is welded by a welding jig, wherein the welding jig includes a welding table 5, a mounting table surface 51 arranged on the welding table 5 for placing two capacitor chip groups 33, a mounting groove 52 arranged on the welding table 5 for installing the support frame 32, and two positioning mechanisms 6 arranged on the welding table 5 for fixing the two connection frames 31 respectively.

[0024] The mounting groove 52 is extended inward from the side of the welding platform 5, and includes a mounting groove body 521 for mounting the support section 321 and an extension groove 522 extending downward from the mounting table surface 51 and communicating with the mounting groove body 521, wherein the connecting section 322 is arranged in the extension groove 522, and the two sides are respectively connected to the two capacitor chip groups 33 located on the mounting table surface 51.

[0025] The positioning mechanism 6 includes a positioning seat 61 arranged on the welding table 5 to limit the connecting frame 31 to the side of the capacitor chip group 33, a positioning magnet 62 arranged on the positioning seat 61, and a positioning metal magnetic conductor 63 arranged on the welding table 5 and cooperating with the positioning magnet 62. Specifically, the positioning seat 61 includes a positioning seat body 64 arranged on the side of the connecting frame 31 and a limiting section 65 arranged vertically with the positioning seat body 64 and extending to the end of the connecting frame 31, wherein the limiting section 65 of the positioning seat 61 and the limiting section of another positioning seat are arranged at the two ends of the connecting frame 31 relative to each other, so that a welding area for welding the two capacitor chip groups 33 and the support frame 32 and the two connecting frames 31 is formed between the two positioning seats 61; further, the positioning seat body 64 is provided with a first positioning groove 641 for installing the positioning magnet 62, and the welding table 5 is provided with a second positioning groove 53 for installing the positioning metal magnetic conductor 63.

[0026] When welding the capacitor body 3, place the support frame 32 opposite to the side of the installation slot 52, and then push the support frame 32 inward into the installation slot 52, so that the support section 321 is limited in the installation slot body 521, and the connecting section 322 is limited in the extension section 522; then place the two capacitor chip groups 33 on the mounting table 51, so that the ends of the two capacitor chip groups 33 are respectively connected to the two sides of the connecting section 322, and then the two connecting frames 31 are relatively arranged at the ends of the two capacitor chip groups 33, and the two positioning mechanisms 6 are used to cooperate to fix the two connecting frames 31, and finally send them into the reflow soldering for welding. After welding is completed, demolding is performed to form the capacitor body 3.

[0027] A method for preparing a multi-core ceramic capacitor comprises the following steps: Step 1: Use a welding jig to weld the support frame 32, the two connection frames 31 and the two capacitor chip groups 33 to form a capacitor body 3: Step 2, placing the first original welding frame 76 on the welding base 7, and applying solder paste on the first original welding frame 76, and then placing multiple capacitor bodies 3 on the first original welding frame 76 one by one, and then applying solder paste on the welding position of the second original welding frame 77, and placing it on the top of the multiple capacitor bodies 3, and then fixing the welding pressure plate 8 on the welding base 7 to fix the second original welding frame 77, and sending it to the reflow soldering for welding; Step 3, after the welding is completed, the welding pressing plate 8 is removed, the finished capacitor is taken out, and a multi-core ceramic capacitor is obtained after cleaning, rib cutting and forming.

[0028] Among them, the first original welding frame 76 includes a first connecting rib 761 and a plurality of first original welding plates 762 spaced apart on the first connecting rib 761. Specifically, the first original welding plate 762 includes a first welding plate 11, a first connecting section 12 and a first molding section 763 connected to the first connecting section 12 for molding the first lead-out end 13. The first molding section 763 is connected to the first connecting rib 761.

[0029] The second original welding frame 77 includes a second connecting rib 771 and a plurality of second original welding plates 772 spaced apart on the second connecting rib 771. Specifically, the second original welding plate 772 includes a second welding plate 21, a second connecting section 22 and a second forming section 773 connected to the second connecting section 22 for forming the second lead-out terminal 23. The second forming section 773 is connected to the second connecting rib 771.

[0030] The welding base 7 includes a welding groove 71 extending downward from its top surface for placing the capacitor body 3, a first placement groove 72 and a second placement groove 73 respectively arranged on both sides of the welding groove 71 for placing the first original welding piece 76 and the second original welding piece 77. In step 2, when the first original welding frame 76 is placed on the welding base 7, the first welding piece 11 on the first original welding piece 76 is located in the welding groove 71, and the first connecting rib 761 is just located in the first placement groove 72; when the second original welding frame 77 is placed on the top of multiple capacitor bodies 3, the second connecting rib 771 is located in the second placement groove 73, and the second welding piece 21 of the second original welding piece 77 is just at the top of the multiple capacitor bodies 3; specifically, the welding base 7 includes a base body 74 and a welding bottom plate 75 arranged on the base body 74, and the base body 74 is provided with A limiting hole 741 is provided for the lower end of the welding base plate 75 to be embedded. The welding base plate 75 includes a plurality of welding plates 751 that can be spliced ​​in sequence, and the welding plate 751 includes a support edge 752 arranged at its upper end and can be supported on the top surface of the base body 74 and a plurality of strip exhaust grooves 753 arranged at intervals. Furthermore, a welding groove 71, a first placement groove 72, and a second placement groove 73 are formed on the welding base plate 75; by limiting the structure of the welding base 7, the welding base plate 75 is arranged in sections to reduce the length direction of the welding base plate 75. The problem that the long strip welding base plate is easily deformed and twisted due to high temperature for a long time during welding is overcome, thereby ensuring the positioning accuracy and external dimensions of the product after welding; wherein, the welding base plate 75 is flush with the base body 74 on one side, and a gap is formed with the side wall of the limiting hole 741 on the other side, so that it can freely expand and contract without being squeezed and deformed during welding.

[0031] The welding platen 8 is fixed on the welding base 7 by a fixing mechanism 9, which includes two fixing blocks 91 relatively arranged on the welding base 7, two fixing magnets 92 respectively arranged on the two fixing blocks 91 and capable of adsorbing the welding platen 8, a plurality of fixing bolts 93 arranged at intervals on the welding platen 8 and respectively opposite to the plurality of capacitor bodies 3, and a plurality of fixing screw holes 94 arranged on the welding platen 8 and cooperating with the plurality of fixing bolts 93, wherein when the welding platen 8 is fixed on the welding base 7, its two ends are respectively adsorbed and fixed on the two fixing blocks 91 by a plurality of degrees; by setting a plurality of fixing bolts 93 and cooperating with a plurality of fixing screw holes 94, a plurality of second welding pieces 21 are closely attached to the top of the relative capacitor body 3, so as to avoid the first welding piece 11, the second welding piece 21 and the two connecting frames 31 and the supporting frame 32 being suspended in the air, thereby ensuring the quality after welding and improving the reliability of the capacitor; specifically, the welding plate 8 is made of metal material.

[0032] The present application defines the structure of a multi-core ceramic capacitor, improves its internal structure, and sets two connecting frames 31 and a supporting frame 32 connected to a first welding sheet 1 and a second welding sheet 2 between two capacitor chip groups 33, so that the capacitor chip group 33 is adjusted to a structure with a frame. After the end of the capacitor chip 331 is welded to the connecting frame 31 and the supporting frame 32, the connecting frame 31 and the supporting frame 32 can be partially deformed when subjected to stress, so as to relieve the impact of stress on the capacitor chip 331 and improve the ability to resist strain. In addition, the structure of the first welding sheet 1 and the second welding sheet 2 is defined, and the first welding sheet 11 and the second welding sheet 21 are respectively connected to the two connecting frames 31 and the supporting frame 32, which greatly improves the effective welding area, so that the combined multi-core capacitor has better electrical performance parameters, reliability and structural strength, and provides customers with more choices while meeting product reliability. A multi-core capacitor welding jig and a welding method are provided, which are easy to produce and can be applied to mass production occasions; they have high reliability and strong mechanical and environmental usability.

[0033] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the application scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A multi-core ceramic capacitor, characterized in that: The capacitor comprises a first welding sheet and a second welding sheet which are arranged opposite to each other, a capacitor body arranged between the first welding sheet and the second welding sheet, and a molded shell covering the periphery of the capacitor body. The capacitor body comprises two connecting frames arranged opposite to each other, a supporting frame arranged between the two connecting frames, and two capacitor chip groups respectively arranged between the connecting frames and the supporting frames, wherein the capacitor chip group comprises a plurality of capacitor chips arranged in sequence, the first welding piece is connected to the tops of the two connecting frames, and the second welding piece is connected to the bottom of the supporting frame; The support frame comprises a support section and a connecting section vertically arranged on the support section and connected to the capacitor chip group. The support section comprises a plurality of supporting feet alternately arranged on the left and right sides at the bottom of the connecting section.

2. The multi-core ceramic capacitor according to claim 1, characterized in that: The first welding plate includes a first welding plate connected to the tops of the two connecting frames, a first connecting section connected to the first welding plate and extending downward, and a first lead-out end connected to the first connecting section and extending outward from the molded shell, and the second welding plate includes a second welding plate connected to the bottom of the supporting frame, a second connecting section connected to the second welding plate and extending upward, and a second lead-out end connected to the second connecting section and extending outward from the molded shell.

3. The multi-core ceramic capacitor according to claim 2, characterized in that: The first lead-out end and the second lead-out end are arranged on both sides of the molded shell opposite to each other, the first lead-out end includes a first horizontal section connected to the first connecting section and a first lead-out section arranged on the outside of the molded shell and connected to the first horizontal section, the second lead-out end includes a second horizontal section connected to the second connecting section and a second lead-out section arranged on the outside of the molded shell and connected to the second horizontal section.

4. The multi-core ceramic capacitor according to claim 3, characterized in that: The first lead-out section is arranged in an L shape, and the second lead-out section is arranged in an inverted L shape.

5. The multi-core ceramic capacitor according to claim 1, characterized in that: The connection frame comprises a connection frame body connected to the end of the capacitor chip group and a welding section vertically connected to the end of the connection frame body, the first welding piece is connected to the welding section, and the capacitor chip group is located below the welding section.

6. The method for preparing a multi-core ceramic capacitor according to claim 1, characterized in that: The following steps are involved: Step 1: Use a welding jig to weld the support frame, two connection frames and two capacitor chip groups to form a capacitor body: Step 2, placing the first original welding frame on the welding base, and applying solder paste on the first original welding frame, and then placing multiple capacitor bodies on the first original welding frame one by one, and then applying solder paste on the welding position of the second original welding frame, and then placing it on the top of the multiple capacitor bodies, and then fixing the welding pressure plate on the welding base to fix the second original welding frame, and sending it to reflow soldering for welding; Step 3, after welding is completed, the welding pressing plate is removed, the finished capacitor is taken out, and the multi-core ceramic capacitor is obtained after cleaning, rib cutting and forming.

7. The method for preparing a multi-core ceramic capacitor according to claim 6, characterized in that: The welding base comprises a welding groove extending downward from the top surface thereof for placing the capacitor body, and a first placement groove and a second placement groove respectively arranged on both sides of the welding groove for installing the first original welding frame and the second original welding frame respectively.

8. The method for preparing a multi-core ceramic capacitor according to claim 7, characterized in that: The welding base includes a base body and a welding base plate arranged on the base body, the base body is provided with a limiting hole for the lower end of the welding base plate to be embedded, the welding base plate includes a plurality of welding plates that can be spliced ​​in sequence, the upper end of the welding plate is formed with a supporting edge that can be supported on the top surface of the base body, and the welding groove, the first placement groove, and the second placement groove are formed on the welding base plate.

9. The method for preparing a lock core assembly ceramic capacitor according to claim 8, characterized in that: The welding plate is provided with a plurality of strip-shaped exhaust grooves at intervals.

10. The method for preparing a multi-core ceramic capacitor according to claim 6, characterized in that: The welding pressure plate is fixed on the welding base by a fixing mechanism, and the fixing mechanism includes two fixing blocks relatively arranged on the welding base, two fixing magnets respectively arranged on the two fixing blocks that can adsorb the welding pressure plate, a plurality of fixing bolts spaced apart on the welding pressure plate and respectively opposite to a plurality of capacitor bodies, and a plurality of fixing screw holes arranged on the welding pressure plate and matched with the plurality of fixing bolts, and both ends of the welding pressure plate are respectively adsorbed and fixed on the two fixing blocks.

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