Power supply module

Abstract

The embodiment of the invention discloses a power supply module. The power supply module comprises a substrate, at least one inductance structure and a heat conduction structure. Wherein at least one bare chip is arranged in the substrate, and a first bonding pad is arranged on the top surface of the substrate. The inductor structure is arranged on the top surface of the substrate and is electrically connected with the bare chip through the first bonding pad; the inductor structure comprises a magnetic core; the heat conduction structure at least reuses part of the inductance structure or is an independent structure, the heat conduction structure comprises a first part formed between the top surface of the substrate and the bottom surface of the magnetic core, a second part extending from the bottom surface of the magnetic core to the top surface of the magnetic core and a third part formed on the top surface of the magnetic core, and the first part, the second part and the third part are connected together. Therefore, the heat conduction structure is formed and used as a heat conduction path of the bare chip, so that the heat dissipation performance of the power supply module can be improved when the chip is embedded into the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply packaging, and more specifically, to a power supply module. Background Art

[0002] Power modules are often used to power the core components of a device (such as the core of a graphics processing unit), and they usually include chips and circuit elements such as resistors, capacitors, and inductors. At present, in order to reduce the size of the power module, the existing power module design embeds the chip into the substrate. However, the chip often generates a lot of heat energy during operation. The existing power module design embeds the chip into the substrate, which causes the heat generated by the chip to be unable to be effectively transferred to the outside of the power module, resulting in poor heat dissipation performance of the power module. Summary of the invention

[0003] In view of this, an object of the present invention is to provide a power module to improve the heat dissipation performance of the power module when a chip is embedded in a substrate.

[0004] In a first aspect, an embodiment of the present invention discloses a power supply module, the power supply module comprising:

[0005] A substrate, wherein the interior of the substrate includes at least one bare chip, and a first pad is disposed on the top surface;

[0006] at least one inductor structure, disposed on the top surface of the substrate, the inductor structure being electrically connected to the bare chip through the first pad, the inductor structure comprising a magnetic core;

[0007] A heat-conducting structure, wherein the heat-conducting structure reuses at least part of the inductor structure or is an independent structure, and the heat-conducting structure includes a first part formed between the top surface of the substrate and the bottom surface of the magnetic core, a second part extending from the bottom surface of the magnetic core to the top surface of the magnetic core, and a third part formed on the top surface of the magnetic core, wherein the first part, the second part and the third part are connected together.

[0008] In some embodiments, the third portion of the heat conductive structure is used to connect to a heat sink.

[0009] In some embodiments, the first portion of the thermally conductive structure is at least partially located above the bare chip.

[0010] In some embodiments, the top surface of the substrate exposes the back side of the bare chip, and the back side of the bare chip is connected to the first portion of the thermal conductive structure via a thermal conductive adhesive or a thermal conductive layer.

[0011] In some embodiments, the back surface of the bare chip is connected to the first part of the heat conduction structure through the heat conduction layer. The bottom surface of the heat conduction layer is in contact with the back surface of the bare chip, and the top surface of the heat conduction layer is flush with the top surface of the substrate.

[0012] In some embodiments, the thickness of the substrate material between the back surface of the bare chip and the top surface of the substrate is less than or equal to 200 micrometers.

[0013] In some embodiments, the heat conduction structure is an independent structure. The inductor structure further includes a winding encapsulated by the magnetic core, and the heat conduction structure at least semi - surrounds the outer surface of the magnetic core.

[0014] In some embodiments, a second pad is further provided on the top surface of the substrate, and the first part of the heat conduction structure is connected to the second pad.

[0015] In some embodiments, the second pad is a ground pad, a floating pad, or a pad for connecting to the output pin of the power module.

[0016] In some embodiments, the bottom surface of the magnetic core has a first protruding part, and the bottom surface of the first part of the heat conduction structure is flush with the bottom surface of the first protruding part, and / or the side surface of the magnetic core has a second protruding part, and the side surface of the second part of the heat conduction structure is flush with the side surface of the second protruding part, and / or the top surface of the magnetic core has a third protruding part, and the top surface of the third part of the heat conduction structure is flush with the top surface of the third protruding part.

[0017] In some embodiments, the second part of the heat conduction structure covers at least one side surface of the magnetic core. The second parts covering each side surface of the magnetic core all have a first end and a second end with opposite positions. The second parts covering each side surface of the magnetic core are connected to the third part through the first end, and the second parts covering each side surface of the magnetic core are connected to the first part through the second end.

[0018] In some embodiments, the second part of the heat conduction structure covers two opposite side surfaces of the magnetic core, and the heat conduction structure is arranged as two symmetric "匚" - shaped structures.

[0019] In some embodiments, the third part of each heat conduction structure is an integral body or two mutually separated parts.

[0020] In some embodiments, the second part of the heat conduction structure covers one side surface of the magnetic core, and the heat conduction structure is arranged as a "匚" - shaped structure.

[0021] In some embodiments, the power module includes a plurality of inductor structures, and the third portions of the thermal conductive structure covering the top surfaces of the magnetic cores of the inductor structures are connected to each other.

[0022] In some embodiments, the thermally conductive structure reuses at least a portion of the inductor structure, and the inductor structure also includes a winding, which extends from the bottom surface of the magnetic core to the top surface of the magnetic core and is exposed from the bottom surface and the top surface of the magnetic core respectively, the portion of the winding exposed to the bottom surface of the magnetic core is the first portion of the thermally conductive structure, the portion of the winding located inside the magnetic core is the second portion of the thermally conductive structure, and the portion of the winding covering the top surface of the magnetic core is the third portion of the thermally conductive structure.

[0023] In some embodiments, the first pad is connected to the first portion of the thermally conductive structure.

[0024] In some embodiments, the thickness of the substrate material between the back surface of the bare die and the top surface of the substrate is less than or equal to 100 microns.

[0025] The power module of the embodiment of the present invention includes a substrate, at least one inductance structure and a heat-conducting structure. Among them, the interior of the substrate includes at least one bare chip, and a first solder pad is arranged on the top surface. The inductance structure is arranged on the top surface of the substrate and is electrically connected to the bare chip through the first solder pad, and the inductance structure includes a magnetic core. The heat-conducting structure reuses at least part of the inductance structure or is an independent structure, and the heat-conducting structure includes a first part formed between the top surface of the substrate and the bottom surface of the magnetic core, a second part extending from the bottom surface of the magnetic core to the top surface of the magnetic core, and a third part formed on the top surface of the magnetic core, and the first part, the second part and the third part are connected together. Therefore, by forming and utilizing the heat-conducting structure as the heat-conducting path of the bare chip, the embodiment of the present invention can improve the heat dissipation performance of the power module when the chip is embedded in the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0027] Figure 1 is a schematic structural diagram of a power supply module according to an embodiment of the present invention;

[0028] Figure 2 is a schematic structural diagram of another power supply module according to an embodiment of the present invention;

[0029] Figure 3 is a structural schematic diagram of another power supply module according to an embodiment of the present invention;

[0030] Figure 4 is a structural schematic diagram of another power supply module according to an embodiment of the present invention;

[0031] Figure 5 is a schematic diagram of a substrate according to an embodiment of the present invention;

[0032] Figure 6 is a schematic diagram of an inductor structure according to an embodiment of the present invention;

[0033] Figure 7 is a schematic diagram of another inductor structure according to an embodiment of the present invention;

[0034] Figure 8 is a schematic diagram of another inductor structure according to an embodiment of the present invention;

[0035] Fig. 9 is a schematic diagram of a heat conduction structure according to an embodiment of the present invention;

[0036] Fig.10 A schematic diagram of another heat-conducting structure according to an embodiment of the present invention;

[0037] Fig.11 A schematic diagram of a power module in which a multiplexed winding is a heat-conducting structure according to an embodiment of the present invention;

[0038] Fig.12 A schematic diagram of a winding reused as a heat-conducting structure according to an embodiment of the present invention;

[0039] Fig.13 A schematic diagram of a winding in an embodiment of the present invention being reused as a magnetic core with a heat-conducting structure;

[0040] Fig.14 Schematic diagram of a substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, flows, components and circuits are not described in detail.

[0042] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0043] Unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] For ease of explanation, spatially relative terms such as "inside", "outside", "below", "below", "lower", "above", "upper", etc. are used herein to describe the relationship of one element or feature illustrated in the figures to another element or feature. It will be understood that spatially relative terms may be intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figure is turned over, an element described as being "below" or "below" other elements or features will then be positioned as being "above" the other elements or features. Thus, the example term "below" can include both the orientations of above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0045] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0046] In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0047] Figure 1 FIG. 1 is a schematic diagram of the structure of a power module according to an embodiment of the present invention. Figure 1 As shown, the power module includes a substrate 11 , at least one inductor structure 12 and a heat-conducting structure 13 .

[0048] Among them, the substrate 11 is used to provide necessary physical support for the power module and realize the electrical connection between the power module and other components on the circuit board. The interior of the substrate 11 includes at least one bare chip (the bare chip is not shown in the figure), and the top surface is provided with a first pad 111. It should be understood that the bare chip included in the substrate 11 can be a control chip of the power module, or other related chips required to realize the function of the power module, etc., and this application does not limit this. The inductor structure 12 is arranged on the top surface of the substrate 11, and is electrically connected to the bare chip inside the substrate 11 through the first pad 111. It should be understood that the inductor structure 12 may include a magnetic core 121 and a winding 122. Optionally, the main body of the winding 122 may be encapsulated inside the magnetic core 121. The input and output ends of the winding 122 can be exposed from two opposite side surfaces and / or the bottom surface of the magnetic core 121, respectively (here, the input and output ends of the winding 122 can be led out from any surface of the magnetic core 121, which can be specifically set according to actual needs, and the present application does not limit this), and connected to the corresponding first pad 111 set on the top surface of the substrate 11 to establish an electrical connection between the inductor structure 12 and the bare chip. The thermal conductive structure 13 can be an independent structure. The thermal conductive structure 13 can be at least half-surrounded by the outer surface of the magnetic core 121 (that is, the top surface, side surface and bottom surface of the magnetic core 121). Specifically, the heat-conducting structure 13 may include a first portion formed between the top surface of the substrate 11 and the bottom surface of the magnetic core 121 (the first portion is not shown in the figure), a second portion extending from the bottom surface of the magnetic core 121 to the top surface of the magnetic core 121, and a third portion formed on the top surface of the magnetic core 121 (it should be understood that the third portion may completely cover the top surface of the magnetic core 121, or may partially cover the top surface of the magnetic core 121, and the present application does not limit this). The first portion, the second portion, and the third portion are connected together.

[0049] Specifically, in the actual working process, the heat generated by the bare chip will be transferred to the outside of the power module via the first part, the second part and the third part of the heat-conducting structure 13. Therefore, by forming and using the heat-conducting structure 13 as a heat-conducting path for the bare chip, the embodiment of the present invention can improve the heat dissipation performance of the power module when the chip is embedded in the substrate.

[0050] It should be understood that Figure 1 The power module shown includes two inductor structures 12 , but in actual applications, the number of inductor structures included in the power module may also be one or another number, and the present application does not impose any limitation on this.

[0051] It should be understood that Figure 1The two inductance structures 12 in the power module shown are close to each other, but in actual application, a certain gap may be left between the multiple inductance structures, and the present application does not limit this. Further, when a certain gap is left between the multiple inductance structures, in order to improve the heat conduction effect of the heat conduction structure, the second part of the heat conduction structure can be formed in the gap between the inductance structures.

[0052] Optionally, in addition to the first pad 111, a second pad 112 may be provided on the top surface of the substrate 11. The second pad 112 may be a ground pad, a floating pad, or a pad for connecting to an output pin of the power module, which may be connected to a bare chip. Furthermore, in order to achieve a better heat conduction effect, the first part of the thermal conductive structure 13 may also be connected to the corresponding second pad 112. It is to be noted that by connecting the first part of the thermal conductive structure 13 to the second pad 112 used as a ground pad, the present embodiment may improve the anti-electromagnetic interference capability of the power module.

[0053] Optionally, the heat-conducting structure 13 can be made of a material with good thermal conductivity. Further optionally, the heat-conducting structure 13 can be formed by deposition using one or more semiconductor processes, or can be assembled as a single structure with other components, which is not limited in the present application.

[0054] Optionally, in order to improve the heat conduction effect of the heat conduction structure 13, the present embodiment can shorten the space distance between the heat conduction structure 13 and the bare chip inside the substrate 11 as much as possible. Specifically, in order to achieve the above effect, the present embodiment can adjust the formation position of the first part when forming the first part of the heat conduction structure 13, and can adjust the embedding position of the bare chip when embedding the bare chip inside the substrate 11, so that in the formed power module, the first part of the heat conduction structure 13 can be at least partially located above the bare chip.

[0055] Optionally, in order to further improve the heat conduction effect of the heat-conducting structure 13, the present embodiment can also expose the back of the bare chip from the top surface of the substrate 11, and apply a heat-conducting adhesive or form a heat-conducting layer on the back of the bare chip, so that the back of the bare chip located inside the substrate 11 can be connected to the first part of the heat-conducting structure 13 through the heat-conducting adhesive or the heat-conducting layer. Further optionally, in order to reduce the volume of the power module after molding, when the back of the bare chip is connected to the first part of the heat-conducting structure 13 through the heat-conducting layer, the bottom surface of the heat-conducting layer can be in contact with the back of the bare chip, and the top surface of the heat-conducting layer can be flush with the top surface of the substrate. Further optionally, the heat-conducting layer can be made of a material with good thermal conductivity.

[0056] Optionally, when the back side of the bare chip cannot be exposed from the top surface of the substrate 11, in order to improve the thermal conductivity of the thermal conductive structure 13, when the bare chip is embedded in the substrate 11, the embedding depth of the bare chip can also be adjusted in this embodiment so that the thickness of the substrate material between the back side of the bare chip and the top surface of the substrate 11 is less than or equal to 200 microns.

[0057] Optionally, in order to further help the bare chip dissipate heat, the third portion of the heat-conducting structure 13 may be connected to a heat sink provided by the outside. Further optionally, the third portion of the heat-conducting structure 13 may be connected to the heat sink by a heat-conducting adhesive.

[0058] Optionally, when the power module includes multiple inductor structures, the third parts of the heat-conducting structures formed on the top surfaces of the magnetic cores may be connected to each other.

[0059] Figure 2 FIG. 1 is a schematic diagram of the structure of another power module according to an embodiment of the present invention. Figure 2 As shown, the third portion of the heat-conducting structure 22 formed on the top surface of the magnetic core 211 and the magnetic core 212 can be connected to each other. It should be understood that Figure 2 Except for the third part of the heat conduction structure, the other structures of the power module are the same as Figure 1 The power module is the same as that in the previous example, and will not be described in detail here.

[0060] Optionally, for Figure 1 and Figure 2 In the power module shown, the thickness and specific shape of the first part, the second part and the third part of the heat-conducting structure can be set according to actual needs, and the present application does not limit this.

[0061] Further optionally, since the third part of the heat-conducting structure needs to be connected to the heat dissipation structure, in order to increase the connection area between the two to enhance the heat dissipation effect, the coverage area of ​​the third part of the heat-conducting structure on the top surface of the magnetic core can be set as large as possible. It should be understood that the coverage area of ​​the third part of the heat-conducting structure on the magnetic core can be larger than the second part and the first part.

[0062] Further optionally, since the winding will be exposed from the bottom surface of the magnetic core to be connected to the pad, in order to avoid affecting the connection between the winding and the pad, the first part of the heat-conducting structure may only cover the bottom surface portion of the magnetic core where the winding is not exposed. It should be understood that the first part of the heat-conducting structure may cover a smaller area of ​​the magnetic core than the second part and the third part.

[0063] It should be understood that Figure 1The magnetic core of the inductor structure shown is in the shape of a rectangular parallelepiped, but in actual application, the magnetic core of the inductor structure may also be in other shapes or irregular shapes. In this case, in order to avoid the shape of the magnetic core affecting the specifications and shape of the power module, the thermal conductive structure may also be used to ensure that the surfaces of the power module are flush.

[0064] Figure 3 FIG. 1 is a schematic diagram of the structure of another power module according to an embodiment of the present invention. Figure 3 As shown, compared to Figure 1 The power module in Figure 3 The side surface of the magnetic core 311 of the inductor structure 32 has a second protruding portion 3211. At this time, the side surface of the second portion 331 of the heat-conducting structure 33 can be flush with the side surface of the second protruding portion, thereby ensuring that the side surface of the power module is flush.

[0065] Figure 4 FIG. 1 is a schematic diagram of the structure of another power module according to an embodiment of the present invention. Figure 4 As shown, compared to Figure 3 The power module in Figure 4 The top surface of the magnetic core 421 of the inductor structure 42 also has a third protruding portion 4211. At this time, the top surface of the third portion 431 of the heat-conducting structure 43 can be flush with the top surface of the third protruding portion 4211, thereby ensuring that the top surface of the power module is flush.

[0066] It should be understood that the bottom surface of the magnetic core of the inductor structure may also have a corresponding first protruding portion. In this case, the bottom surface of the first portion of the heat-conducting structure may also be flush with the bottom surface of the first protruding portion.

[0067] Figure 5 Schematic diagram of a substrate of an embodiment of the present invention. It should be understood that Figure 5 The substrate in the embodiment may be Figure 4 The substrate of the power module. Figure 5As shown, at least one bare chip is embedded inside the substrate 51 (the bare chip is not shown in the figure), and a first pad 511 and a second pad 512 are provided on the top surface. Among them, the first pad 511 is used to realize the electrical connection between the bare chip inside the substrate 51 and the inductor structure. The second pad 512 can be a ground pad, a floating pad or a pad for connecting to the output pin of the power module, which can be connected to the bare chip inside the substrate 51. It should be understood that the number of first pads 511 can be determined according to the number of inductor structures in the power module, and the setting position of the first pad 511 can be determined according to the exposed position of the input and output ends of the inductor structure. The number of second pads 512 can be determined according to the number of bare chips inside the substrate 51 and the actual needs of each bare chip, and the setting position of the corresponding second pad 512 needs to match the formation position of the first part of the heat-conducting structure to ensure that the corresponding second pad 512 can be connected to the first part of the heat-conducting structure.

[0068] Optionally, in order to improve the heat conduction effect of the heat conduction structure, the top surface of the substrate 51 can expose the back of the bare chip, and further, a groove for exposing the back of the bare chip can be formed, and the groove can be filled with a heat conduction layer 513. Furthermore, in order to reduce the volume of the power module after molding, the bottom surface of the heat conduction layer 513 can be in contact with the back of the bare chip, and the top surface of the heat conduction layer 513 can be flush with the top surface of the substrate 51.

[0069] Optionally, in addition to the bare chip, circuit elements such as resistors and capacitors may be embedded inside the substrate 51. Also, in order to achieve electrical connection between the power module and other components and inductor structures on the circuit board and the bare chip and circuit elements inside the substrate 51, corresponding conductive paths and conductive through-holes may be embedded inside the substrate 51. Specifically, the first pad 511 and the second pad 512 may establish electrical connection with the bare chip through the conductive paths and conductive through-holes. It should be understood that the present application does not impose specific restrictions on the structure and formation method inside the substrate.

[0070] Figure 6 is a schematic diagram of an inductor structure of an embodiment of the present invention. It should be understood that Figure 6 The inductor structure in can be Figure 4 Inductor structure of the power module ( Figure 4 The power module in the embodiment includes two inductor structures that are closely attached to each other). In order to conveniently show the structural relationship between the magnetic core and the winding, the inductor structure is processed in a perspective manner in this embodiment. Figure 6 The inductor structure is shown after perspective processing. Figure 6As shown, the inductor structure 61 may include a magnetic core 611 and a winding 612. Further, a main body 6121 of the winding 612 may be enclosed inside the magnetic core 611. An input end 6122 and an output end 6123 of the winding 612 may be exposed from two opposite side surfaces and a bottom portion of the magnetic core 611, respectively. It should be understood that the exposed input end 6122 and output end 6123 will be connected to the corresponding first pads provided on the top surface of the substrate, thereby establishing an electrical connection between the inductor structure and the bare chip.

[0071] It should be understood that Figure 6 The winding shape and the magnetic core shape in the inductor structure shown are only for illustration. In actual application, the winding shape and the magnetic core shape in the inductor structure are not limited thereto.

[0072] Figure 7 is a schematic diagram of another inductor structure according to an embodiment of the present invention. It should be understood that Figure 7 The figure shows a single inductor structure. Figure 7 As shown, compared to Figure 6 In the inductor structure 71, the magnetic core 711 of the inductor structure 71 can be a rectangular parallelepiped with protruding parts on the bottom, top and side surfaces respectively (or, the magnetic core 711 of the inductor structure 71 can also be regarded as two interconnected rectangular parallelepipeds). Furthermore, the main body 7121 of the winding 712 of the inductor structure 71 includes two parts that are parallel to each other and are also enclosed inside the magnetic core 711. However, the input end 7122 and the output end 7123 of the winding 712 can be exposed from the same protruding part of the bottom surface of the magnetic core 711 at the same time. It should be understood that in order to adapt the inductor structure 71, the setting positions of the first and second pads on the top surface of the substrate and the shape of the thermal conductive structure can be adjusted according to actual needs.

[0073] Figure 8 FIG. 1 is a schematic diagram of another inductor structure of an embodiment of the present invention. It should be understood that Figure 8 The figure shows a single inductor structure. Figure 8 As shown, compared to Figure 6 and Figure 7 In the inductor structure 81, the magnetic core 811 of the inductor structure 81 can be a rectangular parallelepiped with a plurality of protruding portions on the bottom, top and side surfaces respectively (or, the magnetic core 811 of the inductor structure 81 can also be regarded as three interconnected rectangular parallelepipeds). Furthermore, the main body 8121 of the winding 812 of the inductor structure 81 is also enclosed inside the magnetic core 811. However, the input end 8122 and the output end 8123 of the winding 812 can be exposed from two different protruding portions on the bottom surface of the magnetic core 811, respectively. It should be understood that in order to adapt the inductor structure 81, the setting positions of the first and second pads on the top surface of the substrate and the shape of the thermal conductive structure can be adjusted according to actual needs.

[0074] Fig. 9 Schematic diagram of the heat conduction structure according to an embodiment of the present invention. It should be understood that Fig. 9 the heat conduction structure in Figure 4 can specifically be the heat conduction structure of the power module in Fig. 9 The heat conduction structure on the left side and the heat conduction structure on the right side in Figure 6 are exactly the same (the two heat conduction structures can be respectively mounted on Fig. 9 the two inductance structures in ). The following will describe one of the heat conduction structures. As Fig. 9 shown, the heat conduction structure 91 may include a first part 911, a second part 912, and a third part 913 that are connected together. Among them, the first part 911 may be formed between the top surface of the substrate and the bottom surface of the magnetic core of the inductance structure. Optionally, when the back surface of the bare chip is exposed from the top surface of the substrate, the first part 911 may be connected to the bare chip inside the substrate through a heat-conducting adhesive or a heat-conducting layer. Optionally, when the bottom surface of the magnetic core of the inductance structure has a first protruding part, the bottom surface of the first part 911 may also be flush with the bottom surface of the first protruding part. The second part 912 may be formed on two opposite side surfaces of the magnetic core of the inductance structure. Further, each second part 912 may have a first end 9121 and a second end 9122 that are opposite in position. Through the first end 9121, the second part can be connected to the third part 913. Through the second end 9122, the second part can be connected to the first part 911. Optionally, when the side surface of the magnetic core of the inductance structure has a second protruding part, the side surface of the second part 912 may also be flush with the side surface of the second protruding part. The third part 913 is formed on the top surface of the magnetic core of the inductance structure. Optionally, when the top surface of the magnetic core of the inductance structure has a third protruding part, the top surface of the third part 913 may also be flush with the top surface of the third protruding part. Optionally, the third part 913 may be used to connect to a radiator. Optionally, the third parts of the two heat conduction structures in this embodiment are two separate parts, but in some other embodiments, the third parts of the two heat conduction structures may also be an integral body (as shown by the heat conduction structure 22 in Figure 2 ).

[0075] It should be understood that Fig. 9 the heat conduction structure in only covers one side surface of the inductance structure and can be regarded as a "C"-shaped structure. However, in some embodiments, the second part of the heat conduction structure may also be respectively covered on two opposite side surfaces of the inductance structure. At this time, the heat conduction structure can be regarded as two symmetric "C"-shaped structures spliced together.

[0076] Fig.10 Schematic diagram of another heat conduction structure according to an embodiment of the present invention. It should be understood that Fig.10 the heat conduction structure in can specifically be adapted to Figure 7 or Figure 8The inductance structure therein. As Fig.10 shown, the heat-conducting structure may include a first part 103, a second part 102, and a third part 101 that are connected together. Among them, the first part 103 may be formed between the top surface of the substrate and the bottom surface of the magnetic core of the inductance structure. The second part 102 may be formed on two opposite side surfaces of the magnetic core of the inductance structure. The third part 101 may be formed on the top surface of the magnetic core of the inductance structure. The first part 103, the second part 102, and the third part 101 of the heat-conducting structure may be regarded as two symmetric "匚"-shaped structures spliced together. It should be understood that Fig.10 only the case where the third part of the heat-conducting structure is spliced together is shown, but in actual application, according to actual needs, the first part of the heat-conducting structure may also be spliced together.

[0077] Optionally, in addition to being set as an independent structure, the heat-conducting structure may also at least reuse part of the inductance structure. Specifically, in this embodiment, the winding in the inductance structure may be reused as the heat-conducting structure.

[0078] Fig.11 is a schematic diagram of a power supply module in which the reused winding is a heat-conducting structure according to an embodiment of the present invention. The power supply module includes a substrate 111 and an inductance structure 112. Among them, the inductance structure 112 is disposed on the top surface of the substrate 111, and the inductance structure 112 includes a magnetic core 1121 and a winding 1122. Further, the winding 1122 is reused as the heat-conducting structure. The winding 1122 extends from the bottom surface of the magnetic core 1121 to the top surface of the magnetic core 1121 and is respectively exposed from the bottom surface and the top surface of the magnetic core 1121. Specifically, the part of the winding 1122 exposed on the bottom surface of the magnetic core 1121 may be used as the first part of the heat-conducting structure, the part of the winding 1122 located inside the magnetic core 1121 may be used as the second part of the heat-conducting structure, and the part of the winding 1122 covering the top surface of the magnetic core 1121 may be used as the third part of the heat-conducting structure. Correspondingly, the substrate 111 may also embed at least one bare chip, and a first pad (the first pad is not shown in the figure) may be provided on the top surface. The first part of the winding 1122 may be electrically connected to the bare chip through the first pad. It should be understood that in this case, the back surface of the bare chip cannot be exposed from the top surface of the substrate, but in order to improve the heat-conducting effect that the heat-conducting structure can achieve, the thickness of the substrate material between the back surface of the bare chip and the top surface of the substrate 111 may be set to be less than or equal to 100 microns.

[0079] Fig.12 is a schematic diagram of the winding reused as the heat-conducting structure according to an embodiment of the present invention. As Fig.12As shown, the winding may include a first part 1213, a second part 1212 and a third part 1211 connected together. Wherein, the first part 1213 is formed between the top surface of the substrate and the bottom surface of the magnetic core of the inductor structure. It should be understood that compared with the heat-conducting structure as an independent structure in the above-mentioned embodiment, since the function of the winding itself needs to be realized, the first part 1213 needs to contact the first pad provided on the substrate to establish an electrical connection between the inductor structure and the bare chip. Further, the second part 1212 is located inside the magnetic core, that is, it is formed on the inner side of the magnetic core. The second part 1212 can be used to connect the first part 1213 and the third part 1211. Further, the third part 1211 is formed on the top surface of the magnetic core. Optionally, the third part 1211 can also be used to connect to a heat sink.

[0080] Fig.13 FIG. 1 is a schematic diagram of a winding of an embodiment of the present invention being reused as a magnetic core of a heat-conducting structure. Fig.13 As shown, the magnetic core has a through hole 1311, and the through hole 1311 can be used to accommodate the second part of the winding. In this embodiment, the shape of the magnetic core is a rectangular parallelepiped, but in some embodiments, the magnetic core can also adopt other shapes, which is not limited by the present application.

[0081] Fig.14 Schematic diagram of a substrate according to an embodiment of the present invention. Fig.14 As shown, the substrate 141 and Figure 5 The structure of the substrate 51 is similar, but compared with Figure 5 In the substrate structure, the top surface of the substrate 141 is only provided with a first pad 1411. The inductor structure can be arranged above the first pad 1411 and contact the first part of the winding of the inductor structure to establish an electrical connection between the inductor structure and the bare chip.

[0082] The power module of the embodiment of the present invention includes a substrate, at least one inductance structure and a heat-conducting structure. Among them, the interior of the substrate includes at least one bare chip, and a first solder pad is arranged on the top surface. The inductance structure is arranged on the top surface of the substrate and is electrically connected to the bare chip through the first solder pad, and the inductance structure includes a magnetic core. The heat-conducting structure reuses at least part of the inductance structure or is an independent structure, and the heat-conducting structure includes a first part formed between the top surface of the substrate and the bottom surface of the magnetic core, a second part extending from the bottom surface of the magnetic core to the top surface of the magnetic core, and a third part partially formed on the top surface of the magnetic core, and the first part, the second part and the third part are connected together. Therefore, by forming and utilizing the heat-conducting structure as the heat-conducting path of the bare chip, the embodiment of the present invention can improve the heat dissipation performance of the power module when the chip is embedded in the substrate.

[0083] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power module, characterized in that: The power supply module includes: a substrate, the interior of the substrate includes at least one bare chip, and a first pad is provided on the top surface; at least one inductance structure, disposed on the top surface of the substrate, the inductance structure is electrically connected to the bare chip through the first pad, and the inductance structure includes a magnetic core; a heat conduction structure, the heat conduction structure at least reuses part of the inductance structure or is an independent structure, the heat conduction structure includes a first part formed between the top surface of the substrate and the bottom surface of the magnetic core, a second part extending from the bottom surface of the magnetic core to the top surface of the magnetic core, and a third part formed on the top surface of the magnetic core, wherein the first part, the second part, and the third part are connected together.

2. The power module according to claim 1, characterized in that: The third part of the heat conduction structure is used to connect to a radiator.

3. The power module according to claim 1, characterized in that: The first part of the heat conduction structure is at least partially located above the bare chip.

4. The power module according to claim 3, characterized in that: The back surface of the bare chip is exposed on the top surface of the substrate, and the back surface of the bare chip is connected to the first part of the heat conduction structure through a thermal conductive adhesive or a thermal conductive layer.

5. The power module according to claim 4, characterized in that: The back surface of the bare chip is connected to the first part of the heat conduction structure through the thermal conductive layer, the bottom surface of the thermal conductive layer is in contact with the back surface of the bare chip, and the top surface of the thermal conductive layer is flush with the top surface of the substrate.

6. The power module according to claim 3, characterized in that: The thickness of the substrate material between the back surface of the bare chip and the top surface of the substrate is less than or equal to 200 microns.

7. The power module according to claim 1, characterized in that: The heat conduction structure is an independent structure, the inductance structure further includes a winding encapsulated by the magnetic core, and the heat conduction structure at least semi-surrounds the outer surface of the magnetic core.

8. The power module according to claim 7, characterized in that: A second pad is further provided on the top surface of the substrate, and the first part of the heat conduction structure is connected to the second pad.

9. The power module according to claim 8, characterized in that: The second pad is a ground pad, a floating pad, or a pad for connecting to the output pin of the power supply module.

10. The power module according to claim 7, characterized in that: The bottom surface of the magnetic core has a first protruding part, the bottom surface of the first part of the heat conduction structure is flush with the bottom surface of the first protruding part, and / or the side surface of the magnetic core has a second protruding part, the side surface of the second part of the heat conduction structure is flush with the side surface of the second protruding part, and / or the top surface of the magnetic core has a third protruding part, the top surface of the third part of the heat conduction structure is flush with the top surface of the third protruding part.

11. The power module according to claim 7, characterized in that: The second part of the heat conduction structure covers at least one side surface of the magnetic core, the second part covering the side surface of the magnetic core all has a first end and a second end with opposite positions, the second part covering the side surface of the magnetic core is connected to the third part through the first end, and the second part covering the side surface of the magnetic core is connected to the first part through the second end.

12. The power module according to claim 11, characterized in that: The second part of the heat conduction structure covers two opposite side surfaces of the magnetic core, and the heat conduction structure is arranged as two symmetrical "C"-shaped structures.

13. The power module according to claim 11 or 12, characterized in that: The third part of each heat conduction structure is an integral body or two mutually separated parts.

14. The power module according to claim 11, characterized in that: The second part of the heat conduction structure covers one side surface of the magnetic core, and the heat conduction structure is arranged as a "C"-shaped structure.

15. The power module according to claim 1, characterized in that: The power supply module includes a plurality of inductance structures, and the third parts of the heat conduction structure covering the top surfaces of the magnetic cores of each inductance structure are connected to each other.

16. The power module according to claim 1, characterized in that: The thermal conductive structure reuses at least part of the inductor structure, and the inductor structure also includes a winding, which extends from the bottom surface of the magnetic core to the top surface of the magnetic core and is exposed from the bottom surface and the top surface of the magnetic core respectively. The part of the winding exposed to the bottom surface of the magnetic core is the first part of the thermal conductive structure, the part of the winding located inside the magnetic core is the second part of the thermal conductive structure, and the part of the winding covering the top surface of the magnetic core is the third part of the thermal conductive structure.

17. The power module according to claim 16, characterized in that: The first pad is connected to the first portion of the thermal conductive structure.

18. The power module according to claim 16, characterized in that: The thickness of the substrate material between the back surface of the bare chip and the top surface of the substrate is less than or equal to 100 microns.

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