Circuit board laser photoetching method and system

Abstract

The invention discloses a circuit board laser photoetching method and system. The system comprises an etching module, a control module and a processing module, the etching module is used for carrying out etching processing on the circuit board; the control module is used for setting an etching processing area of the circuit board according to the circuit diagram and setting processing parameters of the etching module according to the etching processing area of the circuit board and the thickness of a conductive layer of the circuit board; and the processing module is used for changing the relative position of the etching module and the circuit board according to the processing parameters of the etching module, so that the etching module carries out etching processing on the etching processing area of the circuit board. The processing method for directly processing and forming the circuit on the circuit board through laser etching has the advantages of simple steps, high processing precision, low cost, great improvement of the processing efficiency and good processing flexibility.

Description

Technical Field

[0001] The present invention relates to the field of laser lithography technology, and in particular to a circuit board laser lithography method and system. Background Art

[0002] The laser lithography system is a high-precision exposure system based on laser technology, which is widely used in the fields of microelectronics manufacturing, PCB manufacturing, etc. It is mainly composed of laser light source, optical system, control system and other parts. It uses laser beam to expose the pattern on the photomask to form microelectronic devices or circuit boards. The core of the laser lithography system lies in its high precision and high speed characteristics. By precisely controlling the intensity, position and moving speed of the laser beam, the system can achieve micron or even nanometer-level exposure accuracy, thus meeting the needs of high-precision graphics processing in the fields of microelectronics manufacturing and PCB manufacturing.

[0003] The traditional photolithography circuit board processing process includes two steps: exposure and development.

[0004] Exposure: Use a laser exposure machine to expose the circuit board. The circuits on the circuit board are black, and the laser exposure machine can accurately expose the circuits.

[0005] Development: After exposure, use a developer to remove the portion of the photosensitive film that is covered by the photosensitive film but not exposed by the laser, exposing the copper layer.

[0006] Specifically, during the exposure process, the laser exposure machine will irradiate the laser onto the photosensitive film of the printed circuit board (PCB), and the areas not directly irradiated by the laser will retain the photosensitive film. After exposure, the PCB is immersed in a developer, which will dissolve the parts of the photosensitive film that are not exposed by the laser, thereby exposing the copper layer underneath. In this way, only the parts irradiated by the laser will retain the photosensitive film, and the parts not irradiated will reveal the copper layer, thus completing the etching process of the entire circuit board.

[0007] In traditional circuit manufacturing, two processes, exposure and development, are required to complete circuit etching. The circuit process of the photolithography board is cumbersome, and the exposure and development process equipment is expensive. Summary of the invention

[0008] The purpose of the present invention is to solve the shortcomings of the above-mentioned background technology and to provide a circuit board laser lithography method and system with fewer process steps, low process equipment cost and short process time.

[0009] To achieve this purpose, the circuit board laser lithography method designed by the present invention comprises: fixing the circuit board whose surface of the conductive layer is not covered with a photosensitive film in a circuit board processing area;

[0010] Set the etching processing area of ​​the circuit board according to the circuit diagram;

[0011] Setting laser etching processing parameters according to the etching processing area of ​​the circuit board and the thickness of the conductive layer of the circuit board;

[0012] The etching area of ​​the circuit board is laser etched according to the laser etching processing parameters.

[0013] Furthermore, the method for setting the etching processing area of ​​the circuit board according to the circuit diagram is: importing the processing drawing into the control software, and the control software edits and fills the graphic area on the circuit board that needs to be laser etched according to the processing drawing.

[0014] Furthermore, the graphic area on the circuit board that needs to be laser etched includes a non-circuit area on the circuit board.

[0015] Furthermore, the setting of the processing parameters of the laser etching includes setting the laser parameters, the scanning parameters, the thickness of the conductive layer to be removed on the circuit board and the motion path of the laser etching processing.

[0016] Furthermore, the method for determining whether the processing parameters for setting laser etching are qualified is: determining the spot size of the laser etching processing, determining the laser average power density required for the laser etching processing according to the spot size of the laser etching processing, calculating the current laser average power density according to the set laser etching processing parameters, and judging whether the current laser average power density meets the required laser average power density requirements.

[0017] Furthermore, the setting of scanning parameters includes setting the number of times the laser scans the graphic area that needs to be laser etched, and the method is: when the set laser etching processing parameters meet the required laser average power density requirements, the thickness of the conductive layer that can be removed by a single laser scan is tested when the laser etching processing is performed under the premise of the currently set laser etching processing parameters, and the ratio of the conductive layer thickness of the graphic area that needs to be laser etched to the thickness of the conductive layer that can be removed by a single laser scan is calculated, and the ratio is the number of times the laser scans the graphic area that needs to be laser etched.

[0018] A laser lithography system for implementing the above-mentioned circuit board laser lithography method, comprising an etching module, a control module and a processing module;

[0019] The etching module is used to perform laser etching processing on the circuit board;

[0020] The control module is used to set the etching processing area of ​​the circuit board according to the circuit diagram, and to set the processing parameters of the etching module according to the etching processing area of ​​the circuit board and the thickness of the conductive layer of the circuit board;

[0021] The processing module is used to change the relative position of the etching module and the circuit board according to the processing parameters of the etching module, so that the etching module performs laser etching processing on the etching processing area of ​​the circuit board.

[0022] Furthermore, the etching module includes a laser and a light guiding device for guiding and processing the laser light emitted by the laser so that the laser light emitted by the laser meets the etching requirements of the circuit board.

[0023] Furthermore, the light guiding device includes a reflector for changing the propagation direction of the laser light emitted by the laser and a galvanometer and focusing lens integrated device docked with the reflector to accurately position and focus the laser light to the etching position; a collimating beam expander, an optical isolator, and a 1 / 2 wave plate and polarizer integrated device for processing the laser light emitted by the laser to make the laser light entering the galvanometer and focusing lens integrated device meet the etching requirements; and an integrator mirror for shaping and focusing the circular light beam to form a rectangular light spot.

[0024] Furthermore, the control module includes a laser ranging sensor for monitoring the laser etching depth; the control module is also used to control the action of the processing module and the start and stop of the etching module according to the laser etching depth monitored by the laser ranging sensor, and after the etching depth of the etching processing area of ​​the circuit board reaches a set value, the laser etching processing of the etching processing area of ​​the circuit board is stopped; the processing module includes a fixture for adsorbing the circuit board and a processing machine for driving the etching module to move and changing the relative position of the etching module and the circuit board.

[0025] The beneficial effects of the present invention are as follows: the technical solution of directly processing and forming a circuit on a circuit board by laser etching has the following advantages and effects:

[0026] 1. High precision: Precisely controlling the laser etching operation through the control module can achieve micron or even nanometer level processing accuracy, which is crucial for the manufacture of high-density integrated circuits.

[0027] 2. Cost-effectiveness: Compared with the traditional multi-step circuit board processing method, the direct etching method of the present invention is designed for circuit boards whose conductive layer surfaces are not covered with a photosensitive film. The conductive layer portion of the circuit board where no circuit is arranged is removed, and the remaining portion automatically forms a conductive circuit, thereby reducing the processing steps and reducing material and time costs.

[0028] 3. Improve production efficiency: Due to the reduction of processing steps, direct etching can shorten the production cycle and increase the throughput of the production line.

[0029] 4. Reduce material waste: The direct etching processing method designed in the present invention can more accurately control the amount of material removed and reduce unnecessary material loss.

[0030] 5. Improve circuit performance: The direct etching processing method designed in the present invention can produce finer circuit patterns, which helps to improve the performance and reliability of the circuit.

[0031] 6. Flexibility: The direct etching processing method designed by the present invention can adapt to different types of materials and different circuit designs, providing more room for design innovation.

[0032] 7. Environmentally friendly: The direct etching processing method designed by the present invention reduces the use of chemical reagents and the generation of waste, which helps to reduce the impact of circuit board processing on the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural schematic diagram of the etching module in the present invention;

[0034] Figure 2 It is a structural schematic diagram of the processing platform in the present invention;

[0035] Figure 3 is a flow chart of the laser lithography method of the present invention;

[0036] Among them, 1 is a laser, 2 is a reflector, 3 is a collimating beam expander, 4 is an optical isolator, 5 is an integrated device of 1 / 2 wave plate and polarizer, 6 is an integrated device of galvanometer and focusing lens (6.1 is a galvanometer, 6.2 is a focusing lens), 7 is an integrator, and 8 is a processing platform. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0038] Definition of noun:

[0039] The collimator and beam expander 3 is an optical element mainly used in laser systems. Its main function is to transform the laser beam from a divergent state to a parallel state while expanding the diameter of the laser beam. This device is generally used to improve the quality of the laser beam and control the propagation characteristics of the laser beam. The collimator and beam expander 3 is generally composed of two lenses, one for collimation and the other for beam expansion. When in use, it is necessary to select a suitable collimator and beam expander 3 according to the wavelength of the laser, the divergence angle and the required output beam diameter.

[0040] The working principle of the optical isolator 4 is mainly based on the Faraday effect. It is a device used to prevent the backward transmission light generated in the optical path due to various reasons from having an adverse effect on the light source and the optical path system. The optical isolator 4 is mainly composed of three main components: a polarizer, an optical rotator and an analyzer. The polarization axes of the polarizer and the analyzer differ by 45 degrees. When the incident light passes through the polarizer, it will be converted into linearly polarized light. Then, this beam of light passes through the optical rotator, and its polarization plane will be rotated 45 degrees to be consistent with the polarization direction of the analyzer, so that the optical signal can smoothly pass through the optical isolator 4 into the optical path. However, if reflected light appears, it will first pass through the analyzer and the optical rotator. In this process, the polarization direction of the reflected light will be rotated, and eventually it will be orthogonal to the polarization direction of the polarizer, and it cannot pass through the polarizer, thereby achieving the purpose of isolating the reflected light.

[0041] The function of the 1 / 2 wave plate and polarizer integrated device 5 is to convert the linearly polarized light output by the laser 1 through the optical isolator 4 into circularly polarized light; the circularly polarized light can eliminate the processing heterogeneity in the XY axis in processing applications and ensure the consistency of the etching depth in the XY axis.

[0042] The integrated device 6 of the galvanometer and focusing lens is composed of a galvanometer 6.1 and a focusing lens 6.2. The galvanometer 6.1 is a device for precisely controlling the direction of light, which changes the reflection path of light by rapidly swinging the mirror. It is widely used in the fields of laser scanning, optical measurement, laser printing and medical imaging. The galvanometer 6.1 is usually driven by a precision motor and can achieve high-speed and high-precision positioning. The galvanometer 6.1 is a special motion device specifically used in the field of laser processing. It reflects the laser through two galvanometers 6.1 to form the movement of the XY plane. The galvanometer 6.1 has a very small inertia and a very small load during the movement, which makes the system respond very quickly. The movement of the galvanometer 6.1 includes two basic types: jump movement and marking movement. During the jump movement, the axis moves to the position to be processed and the laser is in a closed state; during the marking movement, the laser is in an open state to process the trajectory. However, the field of view of the galvanometer 6.1 is limited, so it is necessary to use the movement of the platform to increase the field of view of the galvanometer 6.1 in disguise. This linkage processing method can reduce or eliminate scars or errors caused by secondary processing at the same position. By making all servos, voice coils and other motors form a functional relationship under the same coordinate system, that is, the forward and reverse solution mechanism, the galvanometer platform linkage can achieve improved processing efficiency and shortened cycle time. At the same time, since there is no splicing, the yield rate will also be improved. Focusing lens 6.2 is a lens used in the optical system to focus light to a point or a line. It is used in conjunction with galvanometer 6.1. In the fields of laser processing, optical measurement, etc., focusing lens 6.2 can accurately focus the light reflected by the galvanometer to the desired position, thereby achieving precise processing or measurement. The selection and design of focusing lens 6.2 is crucial to the performance and accuracy of the system.

[0043] The integrator mirror 7 is a special optical device that is mainly used to focus the light beam to its focal point and integrate the energy of the light beam to obtain a uniformly distributed light spot. The integrator mirror shapes and focuses the circular light beam to form a rectangular light spot through its special optical design. In this process, the energy of the light beam is evenly distributed to meet the needs of specific applications. The specific composition and structure of the integrator mirror may vary depending on the application and design, but in general, it may include lenses with large diameters and lenses with small diameters, or be composed of other types of optical elements. These elements work together to achieve the shaping and focusing of the light beam.

[0044] The principle of laser etching is to use a laser beam to produce permanent marks on the surfaces of various materials. This process is achieved through the interaction between the laser and the surface of the material, which is specifically manifested as the evaporation of the surface material to expose the deeper material; or the chemical and physical changes of the surface material caused by light energy to form traces; or the light energy burns off part of the material to reveal the required graphics and text. During the laser marking process, the laser 1 generates a high-energy continuous laser beam. When the laser acts on the printing material, the atoms in the ground state will jump to a higher energy state. Atoms in a higher energy state are unstable and will quickly return to the ground state. In the process of atoms returning to the ground state, additional energy will be released in the form of photons or quanta, which is converted from light energy to heat energy, causing the surface material to melt or even vaporize instantly, thereby forming the required graphic mark.

[0045] The laser lithography system designed by the present invention includes an etching module, a control module and a processing module; the etching module is used to perform laser etching processing on a circuit board; the control module is used to set the etching processing area of ​​the circuit board according to a circuit diagram, and to set the processing parameters of the etching module according to the etching processing area of ​​the circuit board and the thickness of the conductive layer of the circuit board; the processing module is used to change the relative position of the etching module and the circuit board according to the processing parameters of the etching module, so that the etching module performs laser etching processing on the etching processing area of ​​the circuit board.

[0046] like Figure 1 The figure shows a specific embodiment of an etching module designed by the present invention.

[0047] The etching module comprises a laser 1 and a light guiding device for guiding and processing the laser light emitted by the laser 1 so that the laser light emitted by the laser 1 meets the etching requirements of the circuit board.

[0048] The light guiding device includes a reflector 2 for changing the propagation direction of the laser light emitted by the laser 1; a galvanometer and focusing lens integrated device 6 docked with the reflector 2 to accurately position and focus the laser light to the etching position; a collimating beam expander 3, an optical isolator 4 and a 1 / 2 wave plate and polarizer integrated device 5 for processing the laser light emitted by the laser 1 to make the laser light entering the galvanometer and focusing lens integrated device 6 meet the etching requirements; and an integrator 7 for shaping and focusing the circular light beam to form a rectangular light spot.

[0049] The following is a specific embodiment of a processing module designed by the present invention.

[0050] The processing module includes a jig for adsorbing the circuit board and a processing machine for driving the etching module to move and change the relative position of the etching module and the circuit board. The jig is an aluminum alloy workpiece with dense small holes, which can fix the circuit board by negative pressure adsorption. Taking the ceramic circuit board as an example, after sintering copper on both sides, it will produce a certain amount of deformation. Since laser lithography requires extremely precise control of the laser focus, the circuit board needs to be fixed by negative pressure adsorption of the jig to reduce the warping of the circuit board. The processing machine supports the movement of the laser beam along the X, Y, and Z axes, and can drive the laser beam to move at high speed with high precision.

[0051] A specific embodiment of a control module designed by the present invention:

[0052] The control module includes a control software for importing processing drawings; editing and filling the graphics of the area to be processed on the circuit board, that is, the non-circuit area on the circuit board according to the processing drawings; editing the laser parameters and scanning parameters according to the thickness of the conductive layer to be removed on the circuit board; setting the thickness of the conductive layer to be removed on the circuit board; setting the movement path of the etching module according to the graphics of the area to be processed on the circuit board, the laser parameters and the scanning parameters, and the thickness of the conductive layer to be removed on the circuit board.

[0053] Based on the above specific embodiments of the control module, the present invention also designs a preferred specific embodiment of the control module:

[0054] The control module includes a laser rangefinder sensor for monitoring the etching depth; the principle of the laser rangefinder sensor is to use the emission and reflection of the laser beam to accurately measure the distance between the object and the laser rangefinder sensor. The laser generator emits a pulsed laser. When the laser hits the object and reflects back, the laser rangefinder sensor receives the reflected signal. By measuring the propagation time and speed of the laser, the height of the object can be calculated. The laser rangefinder sensor is used to monitor the etching depth in real time to avoid excessive etching and damage to the substrate. The laser rangefinder sensor and the control module perform real-time signal transmission to monitor the circuit board in real time during the continuous etching process.

[0055] The control module controls the action of the processing machine and the start and stop of the etching module according to the etching depth monitored by the laser ranging sensor. When the etching depth of the circuit board processing area reaches the set value, the etching processing of the circuit board processing area is stopped. The control module supports the editing of various formats of drawing files, data filling and optimal path planning, and can support the control of the laser XY axis and the processing machine tool XY axis linkage for flying processing, with high processing efficiency.

[0056] like Figure 3 As shown, the following is an explanation of the processing operation using a ceramic copper clad circuit board as an example.

[0057] Fix the ceramic copper clad laminate to Figure 2 On the processing platform 7 shown, the ceramic copper-clad board is adsorbed through the dense small holes of the fixture, the processing drawings are imported, the part to be etched, that is, the non-circuit area on the circuit board, is edited in the processing software, and the thickness of the removed material is set.

[0058] Embodiment 1:

[0059] Taking a 0.9mm thick ceramic copper clad circuit board as an example, the overall thickness of the material is 0.9mm, the substrate thickness is 0.5mm, and the single-sided copper thickness is 0.2mm.

[0060] The removal depth of the copper layer is set to 200um. The control module makes an overall path planning for the edited graphics, selects the part to be processed, and the processing machine tool lowers the laser head integrated with the etching module to a position 100mm high from the surface of the ceramic copper-clad board. Laser 1 is a green nanosecond laser, and the output frequency of laser 1 is 60khz, and the output pulse width is 1000ns. The processing speed of the galvanometer 6.1 is 1000mm / s. Under the control of the galvanometer 6.1, the laser performs multiple multi-layer repeated scanning of the area to be processed through the processing method linked with the processing machine tool to achieve the depth control effect. The laser ranging sensor performs real-time detection on the processing platform 7 to determine whether the etching depth reaches the set depth. When the etching reaches the set height, the etching process is stopped. The laser ranging sensor and the control module perform real-time signal transmission, and the signal feedback frequency is 1ms / time; the etching depth is monitored in real time during the continuous etching process, and the etching stops and the processing is completed after the etching reaches the set height, and the circuit board is taken out.

[0061] Embodiment 2:

[0062] Taking a 0.5mm thick aluminum nitride ceramic copper-clad substrate as an example, the overall thickness of the material is 0.5mm, the substrate thickness is 0.3mm, and the single-sided copper thickness is 0.1mm.

[0063] The overall processing steps are the same as those in Example 1. On the basis of Example 1, the processing parameters of laser etching are set by the following operation method:

[0064] From the above parameters, we can know that the thickness of the conductive layer removed from the circuit board is 0.1mm, or 100um. Figure 1 In the laser lithography system shown, the spot size of the laser processed by the laser lithography system is a rectangle of 1×0.05 mm (the spot size here is a specific embodiment, and the spot size can be changed according to actual needs).

[0065] Based on the laser etching process test, it is known that the average laser power density required to remove 50um line width and 1um copper thickness is 35668.79kw / mm 2 , the calculation formula of laser average power density is 1000000*laser power / (3.14*(theoretical spot diameter / 2)*(theoretical spot diameter / 2). The calculation formula of theoretical spot diameter is:

[0066]

[0067] Among them, dspotsize: theoretical spot diameter, λ: wavelength, M 2 : beam quality, F: lens focal length, D: input beam diameter (beam diameter of the laser emitted by laser 1). The above parameters are determined by the laser lithography system. Therefore, when the models and parameters of the components selected by the laser lithography system are determined, the theoretical spot diameter during laser etching can be calculated. The laser power can be inferred from the formula of the average laser power density. At this time, adjusting the laser power can meet the requirements of laser etching.

[0068] After determining the laser power, the thickness of the conductive layer that can be removed by the laser lithography system in one scan can be confirmed based on experimental data or laser testing. The thickness of the conductive layer that needs to be removed by the current circuit board is divided by the thickness of the conductive layer that can be removed by the laser in a single scan, and the number of times the laser needs to scan the conductive layer in the same part can be obtained. For example: when the laser power is 70w, the thickness of the conductive layer removed by a single laser scan is 200nm. Based on this embodiment, the thickness of the conductive layer that needs to be removed by laser etching is 100um, so the laser needs to scan the same part 500 times.

[0069] When performing laser etching, import the drawing to be processed, densely fill and edit the area to be processed, and control the software to edit the thickness of the copper layer to be removed. After determining the thickness of the copper layer, the control software directly calculates the required laser power and scanning parameters, sets the laser etching processing path and number of scans, and monitors the height of the conductive layer in the laser etching processing area. The processing machine drives the laser head (the laser head has a laser lithography system integrated in it) to move along the Z axis to the top of the material, and performs multiple multi-layer processing on the material in the XY axis according to the software-planned path. After the scan removes 100um of the copper layer, the processing stops.

[0070] Laser photolithography of ceramic copper-clad circuit boards often involves etching of circuits larger than 0.1 mm, so the laser spot of the etching module on the circuit board needs to be smaller than 0.1 mm to accommodate a variety of circuit etching. Laser 1 can choose to use a 532nm band green light nanosecond laser with high absorption rate for copper elements and low absorption rate for ceramic substrates, thereby extending the use of lasers with high absorption rate for conductive layers and low absorption rate for substrates to perform photolithography operations on circuit boards.

[0071] In summary, the technical solution of directly processing and forming a circuit on a circuit board by laser etching in the present invention has the following advantages and effects:

[0072] 1. High precision: Precisely controlling the laser etching operation through the control module can achieve micron or even nanometer level processing accuracy, which is crucial for the manufacture of high-density integrated circuits.

[0073] 2. Cost-effectiveness: Compared with the traditional multi-step circuit board processing method, the direct etching method of the present invention is designed for circuit boards whose conductive layer surfaces are not covered with a photosensitive film. The conductive layer portion of the circuit board where no circuit is arranged is removed, and the remaining portion automatically forms a conductive circuit, thereby reducing the processing steps and reducing material and time costs.

[0074] 3. Improve production efficiency: Due to the reduction of processing steps, direct etching can shorten the production cycle and increase the throughput of the production line.

[0075] 4. Reduce material waste: The direct etching processing method designed in the present invention can more accurately control the amount of material removed and reduce unnecessary material loss.

[0076] 5. Improve circuit performance: The direct etching processing method designed in the present invention can produce finer circuit patterns, which helps to improve the performance and reliability of the circuit.

[0077] 6. Flexibility: The direct etching processing method designed by the present invention can adapt to different types of materials and different circuit designs, providing more room for design innovation.

[0078] 7. Environmentally friendly: The direct etching processing method designed by the present invention reduces the use of chemical reagents and the generation of waste, which helps to reduce the impact of circuit board processing on the environment.

[0079] It should be noted here that the description of the above technical solutions is exemplary, and this specification can be embodied in different forms and should not be interpreted as being limited to the technical solutions set forth herein. On the contrary, providing these descriptions will make the disclosure of the present invention thorough and complete, and will fully convey the scope disclosed in this specification to those skilled in the art. In addition, the technical solution of the present invention is limited only by the scope of the claims. In the case of using "including", "having" and "comprising" described in this specification, there may also be another part or other parts, and the terms used may generally be singular but may also represent plural forms.

[0080] Finally, it should be pointed out that the above embodiments are only representative examples of the present invention. Obviously, the present invention is not limited to the above embodiments, and there are many variations. Any simple modification, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention should be considered to belong to the protection scope of the present invention.

Claims

1. A circuit board laser lithography method, characterized in that: Fixing the circuit board whose surface of the conductive layer is not covered with the photosensitive film in the circuit board processing area; Set the etching processing area of ​​the circuit board according to the circuit diagram; Setting laser etching processing parameters according to the etching processing area of ​​the circuit board and the thickness of the conductive layer of the circuit board; The etching area of ​​the circuit board is laser etched according to the laser etching processing parameters.

2. The circuit board laser lithography method according to claim 1, characterized in that: The method for setting the etching processing area of ​​the circuit board according to the circuit diagram is: importing the processing drawing into the control software, and the control software edits and fills the graphic area on the circuit board that needs to be laser-etched according to the processing drawing.

3. The circuit board laser lithography method according to claim 2, characterized in that: The graphic area on the circuit board that needs to be laser etched includes the non-circuit area on the circuit board.

4. The circuit board laser lithography method according to claim 3, characterized in that: The setting of the processing parameters of the laser etching includes setting the laser parameters, the scanning parameters, the thickness of the conductive layer to be removed on the circuit board and the motion path of the laser etching processing.

5. The circuit board laser lithography method according to claim 4, characterized in that: The method for setting whether the processing parameters of laser etching are qualified is: determining the spot size of the laser etching processing, determining the laser average power density required for the laser etching processing according to the spot size of the laser etching processing, calculating the current laser average power density according to the set laser etching processing parameters, and judging whether the current laser average power density meets the required laser average power density requirements.

6. The circuit board laser lithography method according to claim 5, characterized in that: The setting of scanning parameters includes setting the number of times the laser scans the graphic area that needs to be laser etched, and the method is: when the set laser etching processing parameters meet the required laser average power density requirements, the thickness of the conductive layer that can be removed by a single laser scan is tested when the laser etching processing is performed under the premise of the currently set laser etching processing parameters, and the ratio of the thickness of the conductive layer of the graphic area that needs to be laser etched to the thickness of the conductive layer that can be removed by a single laser scan is calculated, and the ratio is the number of times the laser scans the graphic area that needs to be laser etched.

7. A laser lithography system for implementing the circuit board laser lithography method according to any one of claims 1 to 6, characterized in that: It includes an etching module, a control module and a processing module; The etching module is used to perform laser etching processing on the circuit board; The control module is used to set the etching processing area of ​​the circuit board according to the circuit diagram, and to set the processing parameters of the etching module according to the etching processing area of ​​the circuit board and the thickness of the conductive layer of the circuit board; The processing module is used to change the relative position of the etching module and the circuit board according to the processing parameters of the etching module, so that the etching module performs laser etching processing on the etching processing area of ​​the circuit board.

8. The laser lithography system according to claim 7, characterized in that: The etching module comprises a laser (1) and a light guiding device for guiding and processing the laser light emitted by the laser (1) so that the laser light emitted by the laser (1) meets the etching requirements of the circuit board.

9. The laser lithography system according to claim 8, characterized in that: The light guiding device comprises a reflector (2) for changing the propagation direction of the laser light emitted by the laser (1); a galvanometer and focusing lens integrated device (6) docked with the reflector (2) to accurately position and focus the laser light to an etching position; a collimating beam expander (3), an optical isolator (4) and a 1 / 2 wave plate and polarizer integrated device (5) for processing the laser light emitted by the laser (1) to make the laser light entering the galvanometer and focusing lens integrated device (6) meet etching requirements; and an integrating mirror (7) for shaping and focusing a circular light beam to form a rectangular light spot.

10. The laser lithography system according to claim 7, characterized in that: The control module includes a laser ranging sensor for monitoring the laser etching depth; the control module is also used to control the action of the processing module and the start and stop of the etching module according to the laser etching depth monitored by the laser ranging sensor, and when the etching depth of the etching processing area of ​​the circuit board reaches a set value, the laser etching processing of the etching processing area of ​​the circuit board is stopped; the processing module includes a fixture for adsorbing the circuit board and a processing machine tool for driving the etching module to move and changing the relative position of the etching module and the circuit board.

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