Cooling device for temperature rise test

Abstract

A temperature rise test cooling device disclosed by the present invention comprises a plurality of semiconductor chilling plates, a heat storage box body and a refrigeration box body, the refrigeration surfaces of the semiconductor chilling plates are attached to the outer wall of the refrigeration box body, and the heating surfaces of the semiconductor chilling plates are attached to the outer wall of the heat storage box body. Heat storage liquid is arranged in the heat storage box body, and refrigerating liquid is injected into the refrigerating box body. The heating outlet pipe, the heating inlet pipe and the first heat exchange cavity channel are connected through a first guide pipe to form a first circulation liquid path, and the refrigeration inlet pipe, the refrigeration outlet pipe and the second heat exchange cavity channel are connected through a second guide pipe to form a second circulation liquid path. The semiconductor refrigeration side is used for refrigeration, the heat of the heating surface of the semiconductor refrigeration sheet is recovered in the refrigeration process of the semiconductor refrigeration sheet and is applied to the subsequent temperature rise test of the electronic equipment, so that the energy loss is effectively reduced, and compared with the traditional compression refrigeration, the cost is low.

Description

Technical Field

[0001] The invention relates to the technical field related to temperature rise test cooling, and in particular to a temperature rise test cooling device. Background Art

[0002] The temperature rise test is mainly to test whether household appliances may cause excessive temperatures in the surrounding environment or cause fires under normal or abnormal conditions of use. With the improvement of people's living standards, the attention paid to potential hidden dangers in family life is constantly increasing. Therefore, household appliances will be subjected to temperature rise tests before leaving the factory, and the test results will be attached to the product manual to ensure the safety of users. However, the existing temperature rise system does not have a cooling device for rapid cooling of the product. It generally relies on natural cooling of the device. At the same time, this will cause the temperature in the environment to be too high and cause discomfort to the staff. At the same time, the heating system is used when the temperature rises, and compression refrigeration is also used for rapid cooling when the temperature drops, but they are two independent systems, which increases the production cost. Summary of the invention

[0003] In order to solve the defect that the prior art uses a heating system when the temperature is raised, and also uses compression refrigeration for rapid cooling when the temperature is lowered, but these are two independent systems, which increases the production cost, the present invention provides a temperature rise test cooling device.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] The present invention discloses a temperature rise test cooling device, comprising a plurality of semiconductor refrigeration sheets, a heat storage box and a refrigeration box, wherein the cooling surface of the semiconductor refrigeration sheet is attached to the outer wall of the refrigeration box, the heating surface of the semiconductor refrigeration sheet is attached to the outer wall of the heat storage box, the interior of the heat storage box is provided with heat storage liquid, and the interior of the refrigeration box is injected with refrigeration liquid;

[0006] The refrigeration box body is provided with a refrigeration inlet pipe and a refrigeration outlet pipe communicating with the inner cavity, and the heat storage box body is provided with a heating inlet pipe and a heating outlet pipe communicating with the inner cavity;

[0007] It also includes a heat exchange base arranged in the temperature rise box, and the heat exchange base is made of copper material, and the heat exchange base is provided with a first heat exchange cavity and a second heat exchange cavity which are arranged tortuously and independently;

[0008] The heating outlet pipe, the heating inlet pipe and the first heat exchange cavity are connected via a first conduit to form a first circulating liquid circuit, and the refrigeration inlet pipe, the refrigeration outlet pipe and the second heat exchange cavity are connected via a second conduit to form a second circulating liquid circuit; a first circulating pump is provided on the first circulating liquid circuit, and a second circulating pump is provided on the second circulating liquid circuit.

[0009] As a preferred technical solution of the present invention, a second temperature sensor for detecting the temperature of the refrigerant liquid sent from the first conduit to the first heat exchange cavity is provided in the first conduit.

[0010] As a preferred technical solution of the present invention, a heat exchange shell is provided on the outer side of the refrigeration box body, a heat exchange cavity is formed between the heat exchange shell and the refrigeration box body, and an air inlet pipe and an air outlet pipe connected to the heat exchange cavity are provided on the heat exchange shell. A lifting frame is installed in the temperature rise box via a lifting mechanism, and a ring-shaped air duct is provided on the lifting frame. An air outlet nozzle facing inward is provided on the air duct. Under the lifting and lowering operation of the lifting mechanism, the air duct is sleeved on the periphery of the electronic equipment for temperature rise detection, and the air duct is connected to the air outlet pipe via an air guide duct, and a conveying fan is provided on the air guide duct.

[0011] As a preferred technical solution of the present invention, a heating shell is provided on the outside of the heat storage box, and a heating chamber is formed between the heating shell and the heat storage box, a connecting pipe communicating with the heating chamber is provided on the heating shell, the connecting pipe is communicated with the air duct, and a first electrically controlled valve is provided on the connecting pipe, a second electrically controlled valve is provided on the air outlet pipe, and an air heater is provided on the air duct.

[0012] As a preferred technical solution of the present invention, the first heat exchange cavity includes a plurality of cooling cavities arranged in parallel and inclined from the water inlet end to the water outlet end, and connecting main pipes are provided on both sides of the cooling cavity.

[0013] As a preferred technical solution of the present invention, the first heat exchange cavity includes a plurality of heat exchange cavities arranged in parallel and inclined from the water inlet end to the water outlet end, and heat exchange main pipes are provided on both sides of the cooling cavity.

[0014] As a preferred technical solution of the present invention, a third temperature sensor for detecting the temperature of the heat exchange liquid sent from the second tube to the second heat exchange cavity is provided in the second conduit.

[0015] As a preferred technical solution of the present invention, when the temperature is increased, when the semiconductor is working, the heating surface is used for heating, and the cooling surface is used for cooling. The first circulation pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to increase the temperature of the heat exchange base, and at the same time, the third temperature sensor is used to detect the temperature of the heat exchange liquid sent into the first heat exchange cavity. At the same time, the first temperature sensor is used to detect the temperature of the heat exchange base. When the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor reaches the set difference, the first circulation pump stops working, the heat exchange cavity at the water inlet end is tilted toward the water outlet end, and the water in the first heat exchange cavity automatically flows out. The temperature increaser is used to increase the temperature of the heat exchange base, and then the electronic equipment fixed on the heat exchange base is heated, and the air duct is used to blow hot air on the electronic equipment.

[0016] When cooling the electronic equipment after temperature rise, because the refrigeration liquid in the refrigeration cavity is cooled down when the semiconductor refrigeration plate works in the last cycle, the second circulation pump can pump the cold water in the refrigeration box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base. At the same time, the conveying fan is used to blow the cold air after heat exchange in the refrigeration box to the surface of the temperature rise test equipment for rapid cooling.

[0017] The beneficial effects of the present invention are:

[0018] 1. The temperature rise test cooling device uses semiconductor cooling to cool down, and in the process of cooling the semiconductor cooling plate, the heat of the heating surface of the semiconductor cooling plate is recovered and applied to the subsequent temperature rise test of the electronic equipment, which effectively reduces energy loss, and compared with the traditional compression refrigeration, it has low cost and small size. The present invention has a heat exchange base in the temperature rise box, and the heat exchange base is made of copper material, and the heat exchange base is provided with a first heat exchange cavity and a second heat exchange cavity that are arranged tortuously and independently; the heating outlet pipe, the heating inlet pipe and the first heat exchange cavity are connected through a first conduit to form a first circulation liquid path, and the cooling inlet pipe and the cooling outlet pipe and the second heat exchange cavity are connected through a second conduit to form a second circulation liquid path; the first circulation liquid path is provided with a first circulation pump, and the second circulation liquid path is provided with a second circulation pump, and liquid cooling is performed to reduce the temperature, thereby improving the cooling efficiency, achieving rapid cooling, and recovering the heat of the heating surface of the semiconductor cooling plate, and applying it to the subsequent temperature rise test of the electronic equipment, which effectively reduces energy loss.

[0019] 2. In this temperature rise test cooling device, the air is cooled to form cold air, and the cold air after heat exchange in the refrigeration box is blown to the surface of the temperature rise test equipment by a conveying fan for rapid cooling.

[0020] 3. In this temperature rise test cooling device, when the temperature rises, when the semiconductor is working, the heating surface is used for heating, and the cooling surface is used for cooling. The first circulation pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to heat the heat exchange base, and at the same time, the third temperature sensor is used to detect the temperature of the heat exchange liquid sent to the first heat exchange cavity. At the same time, the first temperature sensor is used to detect the temperature of the heat exchange base. When the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor exceeds the set difference, the first circulation pump stops working, and the water inlet end is tilted to The heat exchange cavity at the water outlet end, the water in the first heat exchange cavity automatically flows out, and the temperature of the heat exchange base is increased by the temperature increaser, thereby increasing the temperature of the electronic equipment fixed on the heat exchange base, and at the same time, the hot air is blown onto the electronic equipment by the air duct; when cooling the electronic equipment after the temperature increase, because the refrigeration liquid in the refrigeration cavity is cooled when the semiconductor refrigeration plate works in the last cycle, the second circulating pump can pump the cold water in the refrigeration box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base, and at the same time, the conveying fan is used to blow the cold air after heat exchange in the refrigeration box to the surface of the temperature rise test equipment for rapid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a step-by-step understanding of the temperature rise test cooling device of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation of the present invention. In the accompanying drawings:

[0022] Figure 1 It is a structural schematic diagram of a temperature rise test cooling device of the present invention;

[0023] Figure 2 It is a structural schematic diagram of a heat exchange base of a temperature rise test cooling device of the present invention;

[0024] Figure 3 This is the electrical connection intention of a temperature rise test cooling device of the present invention;

[0025] Figure 4 The invention discloses a schematic diagram of the installation structure of a semiconductor refrigeration plate of a temperature rise test cooling device.

[0026] In the figure: 1, semiconductor refrigeration plate; 2, heat storage box; 3, refrigeration box; 5, refrigeration inlet pipe; 6, refrigeration outlet pipe; 8, heating inlet pipe; 7, first circulation pump; 9, heating outlet pipe; 10, heat exchange base 11, first heat exchange cavity; 12, second heat exchange cavity; 13, second circulation pump; 14, temperature riser; 15, first temperature sensor; 16, second temperature sensor; 17, heat exchange shell; 18, air inlet pipe; 19, air outlet pipe; 20, lifting mechanism; 21, lifting frame; 22, air duct; 23, air guide pipe; 25, conveying fan; 26, cooling cavity; 27, connecting main pipe; 28, heat exchange cavity; 29, heat exchange main pipe; 30, third temperature sensor; 31, heating shell; 32, connecting pipe; 33, connecting pipe; 34, first electric control valve; 35, second electric control valve; 36, air heater. DETAILED DESCRIPTION

[0027] The preferred embodiment of the temperature rise test cooling device of the present invention is described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiment described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.

[0028] Example: Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a temperature rise test cooling device of the present invention comprises a plurality of semiconductor refrigeration sheets 1, a heat storage box 2 and a refrigeration box 3, wherein the cooling surface of the semiconductor refrigeration sheet 1 is attached to the outer wall of the refrigeration box, the heating surface of the semiconductor refrigeration sheet 1 is attached to the outer wall of the heat storage box 2, the interior of the heat storage box 2 is provided with a heat storage liquid, and the interior of the refrigeration box 3 is injected with a refrigeration liquid; the refrigeration box 3 is provided with a refrigeration inlet pipe 5 and a refrigeration outlet pipe 6 communicating with the inner cavity, and the heat storage box 7 is provided with a heating inlet pipe 8 and a heating outlet pipe 9 communicating with the inner cavity;

[0029] It also includes a heat exchange base 10 disposed in the temperature rise box, and the heat exchange base 10 is made of copper, and the heat exchange base 10 is provided with a first heat exchange cavity 11 and a second heat exchange cavity 12 which are arranged tortuously and independently;

[0030] The heating outlet pipe 8, the heating inlet pipe 9 and the first heat exchange cavity 11 are connected through a first conduit to form a first circulating liquid circuit, and the cooling inlet pipe 5, the cooling outlet pipe 6 and the second heat exchange cavity 7 are connected through a second conduit to form a second circulating liquid circuit; a first circulating pump 12 is provided on the first circulating liquid circuit, and a second circulating pump 13 is provided on the second circulating liquid circuit. In the process of refrigeration of the semiconductor refrigeration chip, the heat of the heating surface of the semiconductor refrigeration chip is recovered and applied to the subsequent temperature rise test of the electronic equipment, which effectively reduces energy loss, and compared with the traditional compression refrigeration, it is low in cost and small in size.

[0031] The upper part of the heat exchange base 10 is also provided with a heater 14 for heating the heat exchange base 10. The heat exchange base is provided with a first temperature sensor 15 for monitoring the temperature of the heat exchange base, so that the temperature of the heat exchange base can be easily controlled and the heating or cooling operation can be performed.

[0032] Among them, the first conduit is provided with a second temperature sensor 16 for detecting the temperature of the refrigerant liquid sent from the first conduit to the first heat exchange cavity 12, so that the temperature of the refrigerant liquid can be monitored. In subsequent work, the liquid temperature can be cooled by controlling the operation of the semiconductor refrigeration plate.

[0033] Among them, a heat exchange shell 17 is provided on the outside of the refrigeration box 3, and a heat exchange cavity is formed between the heat exchange shell 17 and the refrigeration box 3, and an air inlet pipe 18 and an air outlet pipe 19 connected to the heat exchange cavity are provided on the heat exchange shell 17. A lifting frame 21 is installed in the temperature rise box through a lifting mechanism 20, and a ring-shaped air duct 22 is provided on the lifting frame 21. An air outlet nozzle 23 facing inward is provided on the air duct 17. Under the lifting and lowering operation of the lifting mechanism 20, the air duct 22 is sleeved on the periphery of the electronic equipment for temperature rise detection, and the air duct 22 is connected to the air outlet pipe 19 through the air guide duct 23, and a conveying fan 25 is provided on the air guide duct 23. In this way, the cold air after heat exchange in the refrigeration box is blown to the surface of the temperature rise test equipment by the conveying fan for rapid cooling.

[0034] A heating shell 31 is provided on the outside of the heat storage box 2, and a heating chamber is formed between the heating shell 31 and the heat storage box 2. A connecting pipe 32 communicating with the heating chamber is provided on the heating shell 31. The connecting pipe 32 is communicated with the air duct 23, and a first electric-controlled valve 34 is provided on the connecting pipe 32. A second electric-controlled valve 35 is provided on the air outlet pipe 19, and an air heater 36 is provided on the air duct.

[0035] Among them, the first heat exchange cavity 11 includes a plurality of cooling cavities 26 arranged in parallel and inclined from the water inlet end to the water outlet end, and connecting main pipes 27 are provided on both sides of the cooling cavity 26, so that the liquid can automatically flow out of the cooling cavity, so that there will be no mutual influence when cooling and heating.

[0036] The first heat exchange cavity 11 includes a plurality of heat exchange cavities 28 arranged in parallel and inclined from the water inlet end to the water outlet end, and heat exchange main pipes 29 are provided on both sides of the cooling cavity 26, so that the liquid can automatically flow out of the cooling cavity, so that there will be no mutual influence when cooling and heating.

[0037] Among them, the second conduit is provided with a third temperature sensor 30 for detecting the temperature of the heat exchange liquid sent into the second heat exchange cavity 12 in the second tube, so that the first temperature sensor detects the temperature of the heat exchange base, and when the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor reaches the set difference, the first circulation pump stops working, the heat exchange cavity at the water inlet end is tilted toward the water outlet end, and the water in the first heat exchange cavity automatically flows out, and the temperature of the heat exchange base is increased by the temperature booster, and then the temperature of the electronic equipment fixed on the heat exchange base is increased, and the temperature of the electronic equipment fixed on the heat exchange base is blown by the air duct at the same time, the temperature can be raised to a suitable temperature, because the temperature of the heat exchange liquid may still be lower than the temperature of the temperature rise test, so the heat exchange base can be initially heated by the heat exchange liquid, so as to realize heat recovery and reuse, and then the temperature is increased by the temperature booster, so as to meet the temperature requirement of the temperature rise test.

[0038] Among them, when the temperature rises, when the semiconductor is working, the heating surface is used for heating, and the cooling surface is used for cooling. The first circulation pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to heat the heat exchange base, and at the same time, the third temperature sensor is used to detect the temperature of the heat exchange liquid sent into the first heat exchange cavity. At the same time, the first temperature sensor is used to detect the temperature of the heat exchange base. When the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor reaches the set difference, the first circulation pump stops working, the water inlet end tilts toward the heat exchange cavity at the water outlet end, and the water in the first heat exchange cavity automatically flows out, and the temperature riser is used to heat the heat exchange base, thereby raising the temperature of the electronic equipment fixed on the heat exchange base, and at the same time, the air duct is used to blow hot air on the electronic equipment;

[0039] When cooling the electronic equipment after temperature rise, because the refrigeration liquid in the refrigeration cavity is cooled down when the semiconductor refrigeration plate works in the last cycle, the second circulation pump can pump the cold water in the refrigeration box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base. At the same time, the conveying fan is used to blow the cold air after heat exchange in the refrigeration box to the surface of the temperature rise test equipment for rapid cooling.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the temperature rise test cooling device of the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions of the temperature rise test cooling device described in the aforementioned embodiments, or replace some of the technical features of the temperature rise test cooling device with equivalents. Any modification, equivalent replacement, or change of the temperature rise test cooling device, etc., made within the spirit and principles of the present invention, shall be included in the protection scope of the present invention.

Claims

1. A temperature rise test cooling device, characterized in that: The invention comprises a plurality of semiconductor refrigeration sheets (1), a heat storage box (2) and a refrigeration box (3), wherein the refrigeration surface of the semiconductor refrigeration sheet (1) is attached to the outer wall of the refrigeration box, the heating surface of the semiconductor refrigeration sheet (1) is attached to the outer wall of the heat storage box (2), the interior of the heat storage box (2) is provided with heat storage liquid, and the interior of the refrigeration box (3) is injected with refrigeration liquid; The refrigeration box (3) is provided with a refrigeration inlet pipe (5) and a refrigeration outlet pipe (6) which are in communication with the inner cavity, and the heat storage box (2) is provided with a heating inlet pipe (8) and a heating outlet pipe (9) which are in communication with the inner cavity; It also includes a heat exchange base (10) arranged in the temperature rise box, and the heat exchange base (10) is made of copper material, and the heat exchange base (10) is provided with a first heat exchange cavity (11) and a second heat exchange cavity (12) which are arranged in a tortuous and independent manner; The heating outlet pipe (8), the heating inlet pipe (9) and the first heat exchange cavity (11) are connected via a first conduit to form a first circulating liquid circuit, and the refrigeration inlet pipe (5), the refrigeration outlet pipe (6) and the second heat exchange cavity (7) are connected via a second conduit to form a second circulating liquid circuit; a first circulating pump (7) is provided on the first circulating liquid circuit, and a second circulating pump (13) is provided on the second circulating liquid circuit.

2. A temperature rise test cooling device according to claim 1, characterized in that: A temperature increaser (14) for heating the heat exchange base (10) is also provided on the upper part of the heat exchange base (10), and a first temperature sensor (15) for monitoring the temperature of the heat exchange base is provided on the heat exchange base.

3. A temperature rise test cooling device according to claim 1, characterized in that: A second temperature sensor (16) is provided in the first conduit for detecting the temperature of the refrigeration liquid sent from the first conduit to the first heat exchange cavity (12).

4. A temperature rise test cooling device according to claim 2, characterized in that: A heat exchange shell (17) is provided on the outside of the refrigeration box (3), a heat exchange cavity is formed between the heat exchange shell (17) and the refrigeration box (3), and an air inlet pipe (18) and an air outlet pipe (19) which are connected to the heat exchange cavity are provided on the heat exchange shell (17). A lifting frame (21) is installed in the temperature rise box via a lifting mechanism (20), and an annular air duct (22) is provided on the lifting frame (21). An inwardly facing air outlet nozzle (23) is provided on the air duct (17). Under the lifting operation of the lifting mechanism (20), the air duct (22) is sleeved on the periphery of the electronic equipment for temperature rise detection, and the air duct (22) is connected to the air outlet pipe (19) via an air guide pipe (23), and a conveying fan (25) is provided on the air guide pipe (23).

5. A temperature rise test cooling device according to claim 4, characterized in that: A heating shell (31) is provided on the outside of the heat storage box (2), and a heating chamber is formed between the heating shell (31) and the heat storage box (2). A connecting pipe (32) communicating with the heating chamber is provided on the heating shell (31), the connecting pipe (32) is communicated with the air guide pipe (23), and a first electric control valve (34) is provided on the connecting pipe (32). A second electric control valve (35) is provided on the air outlet pipe (19), and an air heater (36) is provided on the air guide pipe.

6. The temperature rise test cooling device according to claim 1, characterized in that: The second heat exchange cavity (12) comprises a plurality of cooling cavities (26) arranged in parallel and inclined from the water inlet end to the water outlet end, and connecting main pipes (27) are provided on both sides of the cooling cavity (26).

7. A temperature rise test cooling device according to claim 6, characterized in that: The first heat exchange cavity (11) comprises a plurality of heat exchange cavities (28) arranged in parallel and inclined from the water inlet end to the water outlet end, and heat exchange main pipes (29) are provided on both sides of the heat exchange cavity (28).

8. The temperature rise test cooling device according to claim 1, characterized in that: A third temperature sensor (30) is provided in the second conduit for detecting the temperature of the heat exchange liquid sent from the second tube to the second heat exchange cavity (12).

9. A temperature rise test cooling device according to any one of claims 1 to 8, characterized in that: When the temperature is raised, when the semiconductor is working, the heating surface is used for heating, and the cooling surface is used for cooling. The first circulation pump pumps the hot water in the heat storage box into the first heat exchange cavity in the heat exchange base to raise the temperature of the heat exchange base, and at the same time, the third temperature sensor is used to detect the temperature of the heat exchange liquid sent into the first heat exchange cavity. At the same time, the first temperature sensor is used to detect the temperature of the heat exchange base. When the data difference between the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor reaches the set difference, the first circulation pump stops working, the heat exchange cavity at the water inlet end is tilted toward the water outlet end, and the water in the first heat exchange cavity automatically flows out. The temperature riser is used to raise the temperature of the heat exchange base, and then the temperature of the electronic equipment fixed on the heat exchange base is raised, and the air duct is used to blow hot air on the electronic equipment. When cooling the electronic equipment after temperature rise, because the refrigeration liquid in the refrigeration cavity is cooled down when the semiconductor refrigeration plate works in the last cycle, the second circulation pump can pump the cold water in the refrigeration box into the second heat exchange cavity in the heat exchange base to cool the heat exchange base. At the same time, the conveying fan is used to blow the cold air after heat exchange in the refrigeration box to the surface of the temperature rise test equipment for rapid cooling.

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