Electronic equipment

Abstract

Electronic equipment belongs to the technical field of electronic equipment. The electronic equipment comprises a cabinet, a chip module, a reactor and a radiator. A containing cavity is formed in the machine cabinet, the chip module and the electric reactor are both arranged in the containing cavity, the chip module is connected with the evaporator, the evaporator is communicated with the condenser through a pipeline, the condenser is arranged above the evaporator, and a draught fan capable of blowing air downwards to the containing cavity is arranged at the top of the machine cabinet. Due to the fact that the electric reactor is arranged on the side, away from the evaporator, of the chip module, air blown out of the draught fan can flow to the condenser for heat exchange and then flow to the electric reactor for heat exchange, the heat dissipation efficiency of the chip module and the electric reactor can be improved, and the overall size of the electronic equipment can be reduced. And moreover, the humidity of the air subjected to heat exchange with the condenser can be reduced, and the electric reactor is cooled by utilizing the low-humidity air, so that the influence of moisture on the electric reactor can be reduced, and the service life of the core electronic equipment can be prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] At present, high-power electronic devices usually contain more electronic components, which generate a lot of heat during operation. However, the working efficiency of these electronic components will decrease as the heat increases.

[0003] Therefore, in electronic devices, a heat dissipation system is usually required to dissipate heat from various electronic components. For example, electronic devices are usually equipped with chip modules and reactors. The commonly used cooling method is generally to set up a set of independent heat dissipation systems for the chip module and the reactor to dissipate heat from the chip module and the reactor respectively.

[0004] However, currently, multiple independent heat dissipation systems are provided in electronic devices to dissipate heat for chip modules and reactors respectively, which will increase the overall volume of the electronic devices and increase the heat dissipation cost of the electronic devices. Summary of the invention

[0005] Based on the above-mentioned deficiencies, the present application provides an electronic device to improve the problems of large overall size and high heat dissipation cost of electronic devices in related technologies.

[0006] This application is implemented as follows:

[0007] The example of the present application provides an electronic device, including a cabinet, a chip module, a reactor and a heat sink. The cabinet is provided with a receiving cavity inside, the chip module is provided in the receiving cavity, the reactor is provided in the receiving cavity, and the reactor is electrically connected to the chip module; the heat sink includes an evaporator, a condenser and a fan, and the evaporator and the condenser are connected through a pipeline; the evaporator is connected to the chip module, the reactor is located on the side of the chip module away from the evaporator, and the condenser is provided above the evaporator; the fan is provided on the top of the cabinet and above the condenser, and is used to blow air downward to the receiving cavity.

[0008] In the above implementation process, in the electronic device provided by the example of the present application, since the chip module is connected to the evaporator, the reactor is arranged on the side of the chip module away from the evaporator, the evaporator is connected to the condenser located above through a pipeline, and a fan is arranged above the condenser, so that the heat generated by the chip module during operation can be exchanged with the working liquid in the evaporator to reduce the temperature of the chip module, and the working liquid in the evaporator will become gaseous after absorbing heat, and these gases can flow to the condenser above under the action of pressure difference. Since a fan is arranged above the condenser, the gas flowing to the condenser can exchange heat with the wind blown by the fan at the condenser, and then condense into working liquid. The condensed working liquid can flow downward into the evaporator to dissipate heat for the chip module again. Usually, the heat dissipation demand of the reactor is less than the heat dissipation demand of the chip module. Therefore, the reactor is arranged on the side of the chip module away from the evaporator, so that the reactor is located below the condenser, so that the wind after the fan dissipates heat for the condenser can continue to flow downward to the reactor to dissipate heat for the reactor. In addition, the wind blown by the fan can significantly reduce the humidity after heat exchange with the condenser. Using this low-humidity wind to dissipate the heat of the reactor can not only improve the heat dissipation efficiency, but also reduce the impact of moisture on the reactor.

[0009] The electronic device provided in the example of the present application can use a heat sink to dissipate heat from a chip module and a reactor, without the need to separately provide a set of heat sinks for the reactor, thereby reducing the overall size and heat dissipation cost of the electronic device.

[0010] In an optional embodiment of the present application, the condenser is arranged horizontally, the evaporator is arranged vertically at one end of the condenser, the reactor is located below the condenser, and the chip module is located on a side of the evaporator facing the reactor.

[0011] In the above implementation process, the condenser is arranged horizontally and the evaporator is arranged vertically at one end of the condenser, so that an L-shaped heat dissipation structure can be formed. The chip module and the inductor can be arranged in the space below the condenser, and the chip module is connected to the evaporator. The remaining installation space in the radiator is reasonably utilized, which can further reduce the overall volume of the electronic device while improving the heat dissipation efficiency.

[0012] In an optional implementation of the present application, the distance between the reactor and the condenser is 7-10 cm, and the distance between the reactor and the evaporator is 5-7 cm.

[0013] In the above implementation process, the distance between the reactor and the condenser is set to 7-10cm. The appropriate spacing distance can reduce the mutual influence between the reactor and the condenser, and can reduce the overall volume of the electronic device while improving the heat dissipation efficiency. If the spacing distance between the reactor and the condenser is too close, the heat generated by the reactor during operation will affect the heat dissipation of the condenser, and then affect the heat dissipation of the chip module. If the spacing distance between the reactor and the condenser is too far, the overall volume of the electronic device will increase.

[0014] Similarly, the distance between the reactor and the evaporator is 5-7cm. The appropriate spacing distance can reduce the mutual influence between the reactor and the chip module, and can reduce the overall volume of the electronic device while improving the heat dissipation efficiency. If the spacing distance between the reactor and the evaporator is too close, the chip module and the reactor will be too close, and the temperature of the reactor will be high, which will affect the heat dissipation of the chip module. If the spacing distance between the reactor and the evaporator is too far, the overall volume of the electronic device will increase.

[0015] In an optional implementation of the present application, the distance between the lower end of the reactor and the lower end of the evaporator is 5-7 cm.

[0016] In the above implementation process, the distance between the lower end of the reactor and the lower end of the evaporator is set to 5-7 cm. The appropriate spacing distance can improve the heat dissipation efficiency while reducing the overall volume of the electronic equipment.

[0017] In an optional embodiment of the present application, a first mounting plate is provided inside the cabinet, and a first air duct is formed between the circumferential outer wall of the first mounting plate and the inner wall of the cabinet so that the wind blown by the fan can pass through the first air duct; the condenser is arranged on the first mounting plate.

[0018] In the above implementation process, a first mounting plate is arranged in the cabinet, and the condenser can be fixed to the first mounting plate, thereby improving the structural stability of the electronic equipment. In addition, since a first air duct is formed between the circumferential outer wall of the first mounting plate and the inner wall of the cabinet, the wind blown out by the fan can continue to flow downward through the first air duct after heat exchange with the condenser on the first mounting plate, so as to dissipate heat for the reactor located below the first mounting plate.

[0019] In an optional embodiment of the present application, the middle part of the first mounting plate has a hollow portion; the interior of the condenser has a condensation chamber, and the top outer wall and the bottom outer wall of the condenser are both provided with cooling fins; the condenser is arranged on the first mounting plate, and the cooling fins at the bottom outer wall of the condenser are located in the hollow portion.

[0020] In the above implementation process, heat dissipation fins are arranged on the top outer wall and the bottom outer wall of the condenser, which can further improve the condensation efficiency of the working gas in the condensation chamber, thereby improving the heat dissipation efficiency. The middle part of the first mounting plate is set as a hollow part, so that the heat dissipation fins at the bottom outer wall of the condenser placed on the first mounting plate can be located in the hollow part, which is convenient for heat exchange between the heat dissipation fins and the air, and improves the heat dissipation efficiency.

[0021] In an optional embodiment of the present application, a second mounting plate is provided inside the cabinet, and the second mounting plate is located below the first mounting plate. A second air duct is formed between the circumferential outer wall of the second mounting plate and the inner wall of the cabinet, and the second air duct is connected to the first air duct; the reactor is arranged on the second mounting plate.

[0022] In the above implementation process, a second mounting plate is arranged below the first mounting plate, and the reactor can be fixed at the second mounting plate. Since a second air duct is formed between the circumferential outer wall of the second mounting plate and the inner wall of the cabinet, and the second air duct is connected to the first air duct, the wind blown out by the fan can flow from the first air duct to the reactor below the first mounting plate after heat exchange with the condenser, and can flow out from the second air duct to the bottom of the second mounting plate for discharge after heat exchange with the reactor.

[0023] In an optional implementation of the present application, the electronic device is further provided with a waterproof sheet metal, and the waterproof sheet metal is provided between the reactor and the chip module.

[0024] In the above implementation process, a waterproof sheet metal is arranged between the reactor and the chip module, and the waterproof sheet metal can be used to shield and protect the chip module, thereby reducing the influence of humidity on the chip module.

[0025] In an optional embodiment of the present application, the waterproof sheet metal includes a vertical plate and a horizontal plate connected to the upper end of the vertical plate, and the horizontal plate protrudes toward the chip module, and the end of the horizontal plate away from the vertical plate is connected to the chip module. In an optional embodiment of the present application, the electronic device includes two chip modules; an evaporation chamber is arranged inside the evaporator, and the evaporator includes two vertically arranged substrates, and the two substrates are covered to form an evaporation chamber; each substrate is provided with a porous capillary on the inner wall facing the other substrate; the two chip modules are connected to the two substrates one by one, and the two substrates are arranged between the two chip modules.

[0026] In the above implementation process, two substrates are covered with each other to form an evaporation chamber, and the working liquid can be filled in the evaporation chamber, and a porous capillary is set on the inner wall of each substrate facing the other substrate. Therefore, when the substrate absorbs the heat generated by the chip module and transfers it to the porous capillary, the porous capillary can adsorb the working liquid and exchange heat with the adsorbed working liquid. The use of two substrates instead of a traditional substrate can further reduce the size of the evaporator and improve the heat exchange efficiency of the evaporator, and further reduce the overall volume of the electronic device. The two chip modules are connected to the two substrates one by one, and the two substrates are located between the two chip modules. One evaporator can be used to achieve heat dissipation of the two chip modules, which can avoid the need to set up an evaporator separately for the two chip modules, and can further reduce the overall volume of the electronic device and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0028] Figure 1 A bottom-up structural diagram of an electronic device provided as an example of this application;

[0029] Figure 2 A front view of an electronic device provided for an example of this application;

[0030] Figure 3 A schematic diagram of the connection between the chip module and the heat sink provided in the example of this application.

[0031] Icons: 1-electronic equipment; 10-cabinet; 11-accommodating cavity; 12-first mounting plate; 121-hollow portion; 13-first air duct; 14-second mounting plate; 15-second air duct; 16-third air duct; 20-chip module; 30-reactor; 40-radiator; 41-evaporator; 411-substrate; 42-condenser; 421-heat dissipation fins; 43-fan; 50-waterproof sheet metal; 51-horizontal plate; 52-vertical plate. DETAILED DESCRIPTION

[0032] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification of this application and the above-mentioned drawings and any variations thereof are intended to cover non-exclusive inclusions.

[0034] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0035] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0036] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "middle", "upper", "lower", "front", "back", "left", "right", "bottom", and "inside" are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description. They do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the embodiments of the present application.

[0037] At present, high-power electronic devices usually contain a large number of electronic components, which generate a large amount of heat during operation. In order to reduce the temperature of the electronic components and improve the working efficiency of the electronic components, a heat dissipation system is usually required to dissipate heat for various electronic components.

[0038] For example, the electronic device 1 is usually provided with a chip module 20 and a reactor 30. A commonly used cooling method is generally to separately provide a set of independent heat dissipation systems for the chip module 20 and the reactor 30 to dissipate heat for the chip module 20 and the reactor 30 respectively.

[0039] For example, two groups of cooling fans are set in the electronic device, and a group of siphon-type heat sinks are installed at the chip module and the reactor. One group of cooling fans blows air from bottom to top, and another group of cooling fans is set on the top of the electronic device to blow the hot air after heat exchange in the electronic device out of the electronic device.

[0040] However, currently, multiple heat dissipation systems are provided in electronic devices to dissipate heat for chip modules and reactors respectively, which will increase the overall size of the electronic devices and increase the cost of the electronic devices.

[0041] Therefore, the present application further improves the electronic device, thereby improving the problem of large overall size and high heat dissipation cost of the electronic device to a certain extent. In order to make the purpose, technical solution and advantages of the embodiment of the present application clearer, the technical solution in the embodiment of the present application will be clearly and completely described below in conjunction with the drawings in the embodiment of the present application.

[0042] Please combine Figures 1 to 3 The electronic device 1 provided in the example of the present application includes a cabinet 10 , a chip module 20 , a reactor 30 and a heat sink 40 .

[0043] Please continue to read Figure 1 A receiving cavity 11 is provided inside the cabinet 10 .

[0044] Please combine Figure 1 and Figure 3 The chip module 20 is disposed in the accommodating cavity 11 , the reactor 30 is disposed in the accommodating cavity 11 , and the reactor 30 is electrically connected to the chip module 20 .

[0045] Please combine Figure 1 and Figure 3 The heat sink 40 includes an evaporator 41, a condenser 42 and a fan 43. The evaporator 41 and the condenser 42 are connected through a pipeline. The evaporator 41 is connected to the chip module 20. The reactor is located on the side of the chip module away from the evaporator. The condenser 42 is arranged above the evaporator 41.

[0046] Please continue to combine Figure 1 and Figure 2 The fan 43 is disposed on the top of the cabinet 10 and above the condenser 42 , and is used to blow air downward to the accommodating cavity 11 .

[0047] In the electronic device 1 provided by the example of the present application, the heat generated by the chip module 20 during operation can be exchanged with the working liquid in the evaporator 41 to reduce the temperature of the chip module 20, and the working liquid in the evaporator 41 will become gaseous after absorbing heat, and will flow to the condenser 42 above under the action of the pressure difference. A fan 43 is arranged above the condenser 42, and the gas flowing to the condenser 42 can exchange heat with the wind blown by the fan 43 at the condenser 42, and then condense into the working liquid. The condensed working liquid can flow downward into the evaporator 41 to dissipate heat to the chip module 20 again, and the cycle repeats.

[0048] Generally, the heat dissipation requirement of the reactor 30 is smaller than that of the chip module 20. Therefore, in the electronic device 1 provided in the example of the present application, the reactor 30 is arranged on the side of the chip module 20 away from the evaporator 41, so that the reactor 30 is located below the condenser 42, and the wind blown by the fan 43 flows to the condenser 42 for heat exchange, and then can continue to flow downward to the reactor 30 located below the condenser 42 to dissipate heat for the reactor 30.

[0049] Furthermore, after the wind blown out by the fan 43 flows to the condenser 42 for heat exchange, its humidity will be greatly reduced. Therefore, by using the fan 43 to first perform heat exchange on the condenser 42 and then perform heat exchange on the reactor 30, the influence of moisture on the reactor 30 can also be reduced.

[0050] The electronic device 1 provided in the example of the present application can utilize the heat sink 40 to not only efficiently cool the chip module 20, but also dissipate heat from the reactor 30. There is no need to provide a separate heat sink 40 for the reactor 30, which can reduce the overall volume and heat dissipation cost of the electronic device 1.

[0051] The cabinet 10, chip module 20, reactor 30 and heat sink 40 in the electronic device 1 provided by the example of the present application are further described in detail below in conjunction with the accompanying drawings.

[0052] The cabinet 10 is provided with a receiving chamber 11 inside, which is used to receive the chip module 20 , the reactor 30 and the heat sink 40 , and to protect the related components in the receiving chamber 11 .

[0053] For example, please refer to Figure 1 The cabinet 10 is a rectangular parallelepiped frame structure. The cabinet 10 is composed of four cabinet panels connected end to end to form a receiving cavity 11. The front end of the cabinet 10 has an opening connected to the receiving cavity 11.

[0054] The chip module 20 is located in the accommodating cavity 11 of the cabinet 10 and is arranged on the evaporator 41 . The present application does not limit the specific type of the chip module 20 , and relevant personnel can make corresponding settings according to the purpose of the electronic device 1 .

[0055] In some possible embodiments, the chip module 20 can be applied to 5G base stations, servers, medical equipment, new energy, rail transit or large aircraft.

[0056] Further, in order to facilitate the use of the heat sink 40 to dissipate heat for the chip module 20, in some possible embodiments, please continue to refer to Figures 1 to 3 A first mounting plate 12 may be disposed inside the cabinet 10 , a condenser 42 may be disposed on the first mounting plate 12 , an evaporator 41 may be connected to the condenser 42 via a pipe, and a chip module 20 may be disposed at the evaporator 41 .

[0057] The first mounting plate 12 is located below the fan 43 , so the fan 43 can dissipate heat from the condenser 42 placed on the first mounting plate 12 .

[0058] In order to facilitate heat dissipation of the condenser 42 , the fan 43 provided in the example of the present application is arranged on the top of the cabinet 10 , and the fan 43 can blow air downward to the accommodating cavity 11 .

[0059] In some possible embodiments, the condenser 42 has a condensation chamber inside, and the top outer wall and the bottom outer wall of the condenser 42 are both provided with heat dissipation fins 421 .

[0060] Exemplarily, the heat dissipation fins 421 in the condenser 42 are arranged in a wave shape. The heat dissipation fins 421 have a good heat transfer effect, and are arranged in a wave shape, which can increase the heat exchange area, heat dissipation efficiency and heat dissipation effect.

[0061] Exemplarily, the heat dissipation fins 421 are vertically arranged and extend upward and downward to the top and bottom of the condenser 42 .

[0062] In addition, in order to facilitate the wind after heat dissipation in the condenser 42 to continue to flow downward to the reactor 30, please continue to refer to Figure 2 A first air duct 13 is formed between the circumferential outer wall of the first mounting plate 12 and the inner wall of the cabinet 10 provided in the example of the present application.

[0063] Exemplarily, a support beam is provided on one side of the first mounting plate 12 facing the vertical inner wall of the cabinet 10, and the other end of the support beam is fixedly connected to the inner wall of the cabinet 10, so that a first air duct 13 for gas circulation can be formed between the circumferential outer wall of the first mounting plate 12 and the inner wall of the cabinet 10.

[0064] Further, in order to improve the heat dissipation efficiency of the heat dissipation fins 421 at the bottom of the condenser 42, in some possible embodiments, please continue to refer to Figure 1 , the middle part of the first mounting plate 12 can be set as a hollow part 121. The condenser 42 is set on the first mounting plate 12, and the heat dissipation fins 421 at the bottom outer wall of the condenser 42 are located in the hollow part 121.

[0065] In order to improve the installation stability, further, a plurality of supporting beams may be provided at the hollow portion 121, and the gaps between the plurality of supporting beams may allow gas to flow.

[0066] Furthermore, in order to facilitate the connection between the evaporator 41 and the condenser 42, in some possible embodiments, the condenser 42 may be arranged horizontally, and the evaporator 41 may be arranged vertically at one end of the condenser. That is, the condenser 42 and the evaporator 41 are arranged in an L shape.

[0067] The condenser 42 and the evaporator 41 are arranged in an L shape, and an installation space for the inductor 30 and the chip module 20 can be formed below the condenser 42. The inductor 30 and the chip module 20 can be arranged in the installation space below the condenser 42, and the chip module 20 is connected to the vertically arranged evaporator 41, which can improve the heat dissipation efficiency and reduce the overall volume of the electronic device 1.

[0068] Further, in some possible embodiments, the distance between the reactor 30 and the condenser 42 is 7-10 cm, and the distance between the reactor 30 and the evaporator 41 is 5-7 cm.

[0069] Further, in some possible embodiments, the distance between the lower end of the reactor 30 and the lower end of the evaporator 41 is 5-7 cm.

[0070] The present application does not limit how to vertically arrange the evaporator 41 on one side of the condenser 42. In some possible embodiments, a pipe may be arranged at the top of the evaporator 41, and the pipe is connected to the vertically arranged side of the condenser 42. Further, in some possible embodiments, an evaporation chamber is arranged inside the evaporator 41. Please continue to refer to Figure 3 The evaporator 41 includes two vertically arranged substrates 411, which are covered to form an evaporation chamber. The inner wall of each substrate 411 facing the other substrate 411 is provided with a porous capillary, and the side of the substrate 411 facing away from the evaporation chamber is connected to the chip module 20.

[0071] Exemplarily, a pipe is disposed on the top of the two base plates 411, and the outer wall of the pipe can be integrally disposed with the base plate 411. The outer wall of the top end of the pipe is connected to a side wall of the condenser 42 disposed vertically.

[0072] Furthermore, two groups of chip modules 20 may be provided in the electronic device 1 . The two groups of chip modules 20 are connected to the two substrates 411 in a one-to-one correspondence, and the two substrates 411 are located between the two groups of chip modules 20 .

[0073] Further, in order to facilitate the placement of the reactor 30 in the accommodation cavity 11, in some possible embodiments, please continue to refer to Figure 1 and Figure 2 A second mounting plate 14 may be disposed in the accommodating cavity 11 of the cabinet 10 , and the second mounting plate 14 is located below the first mounting plate 12 .

[0074] The reactor 30 is disposed on the second mounting plate 14, and one vertical side of the reactor 30 is disposed opposite to the evaporator 41 in the L-shaped heat sink 40, so that the chip module 20 is located between the reactor 30 and the substrate 411 of the evaporator 41, which can further reduce the overall volume of the electronic device 1.

[0075] Also, please continue reading Figure 2 A second air duct 15 is formed between the circumferential outer wall of the second mounting plate 14 and the inner wall of the cabinet 10 , and the second air duct 15 is connected to the first air duct 13 , so that the wind after heat exchange with the reactor 30 can flow from the second air duct 15 to the bottom of the second mounting plate 14 .

[0076] Furthermore, a third air duct is formed between the bottom of the second mounting plate 14 and the bottom of the cabinet 10 , and the wind blown out of the second air duct 15 can flow out of the cabinet 10 through the third air duct 16 .

[0077] Further, in some possible embodiments, please continue to refer to Figure 3 The electronic device 1 is further provided with a waterproof sheet metal 50 , and the waterproof sheet metal 50 is provided between the reactor 30 and the chip module 20 .

[0078] Exemplarily, the waterproof sheet metal 50 may include a horizontal plate 51 and a vertical plate 52 . The horizontal plate 51 may be protrudingly disposed on a side of the chip module 20 facing the reactor 30 , and the vertical plate 52 may be disposed on an end of the horizontal plate 51 away from the chip module 20 .

[0079] The chip module 20 is shielded and protected by the waterproof sheet metal 50 , which can further reduce the influence of moisture on the chip module 20 .

[0080] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: A cabinet, wherein a receiving cavity is provided inside the cabinet; A chip module, wherein the chip module is disposed in the accommodating cavity; A reactor, the reactor is disposed in the accommodating cavity, and the reactor is electrically connected to the chip module; The radiator comprises an evaporator, a condenser and a fan, wherein the evaporator and the condenser are connected through a pipeline; the evaporator is connected to the chip module, the reactor is located on the side of the chip module away from the evaporator, and the condenser is arranged above the evaporator; the fan is arranged on the top of the cabinet and above the condenser, and is used to blow air downward to the accommodating cavity.

2. The electronic device according to claim 1, characterized in that: The condenser is arranged horizontally, the evaporator is arranged vertically at one end of the condenser, the reactor is located below the condenser, and the chip module is located at a side of the evaporator facing the reactor.

3. The electronic device according to claim 2, characterized in that: The distance between the reactor and the condenser is 7-10 cm, and the distance between the reactor and the evaporator is 5-7 cm.

4. The electronic device according to claim 3, characterized in that: The distance between the lower end of the reactor and the lower end of the evaporator is 5-7 cm.

5. The electronic device according to any one of claims 1 to 4, characterized in that: A first mounting plate is arranged inside the cabinet, and a first air duct is formed between the circumferential outer wall of the first mounting plate and the inner wall of the cabinet so that the wind blown by the fan can pass through the first air duct; the condenser is arranged on the first mounting plate.

6. The electronic device according to claim 5, characterized in that: The first mounting plate has a hollow portion in the middle; the condenser has a condensation chamber inside, and the top outer wall and the bottom outer wall of the condenser are both provided with cooling fins; the condenser is arranged on the first mounting plate, and the cooling fins at the bottom outer wall of the condenser are located in the hollow portion.

7. The electronic device according to claim 5, characterized in that: A second mounting plate is provided inside the cabinet, the second mounting plate is located below the first mounting plate, a second air duct is formed between the circumferential outer wall of the second mounting plate and the inner wall of the cabinet, and the second air duct is connected to the first air duct; the reactor is arranged on the second mounting plate.

8. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device is further provided with a waterproof sheet metal, and the waterproof sheet metal is arranged between the reactor and the chip module.

9. The electronic device according to claim 8, characterized in that: The waterproof sheet metal comprises a vertical plate and a horizontal plate connected to the upper end of the vertical plate, and the horizontal plate protrudes toward the chip module, and one end of the horizontal plate away from the vertical plate is connected to the chip module.

10. The electronic device according to claim 1, characterized in that: The electronic device comprises two chip modules; an evaporation chamber is arranged inside the evaporator, and the evaporator comprises two vertically arranged substrates, which are covered to form the evaporation chamber; a porous capillary is arranged on the inner wall of each substrate facing the other substrate; the two chip modules are connected to the two substrates in a one-to-one correspondence, and the two substrates are arranged between the two chip modules.

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