Bilaterally packaged radio frequency module with ball grid array embedded in underside mold

Abstract

A two-sided packaged radio frequency (RF) module includes a package substrate having a first surface on which at least one RF circuit component is mounted and a second surface opposite the first surface on which at least one circuitry component is mounted; at least one contact feature attached to the second surface of the package substrate, a vertical extension of the at least one contact feature being greater than a distance between a bottom surface of the at least one circuitry component and the second surface of the package substrate; an underside mold encapsulating the at least one circuitry component and the at least one contact feature, a bottom surface of the underside mold being flush with a bottom surface of the at least one circuitry component; and a trench structure formed in the underside mold around the at least one contact feature.

Description

Technical Field

[0001] The present disclosure relates to packaging radio-frequency (RF) modules. Background Art

[0002] In many radio frequency (RF) implementations, one or more integrated circuits are provided in a package module. Such a package module typically includes a package substrate and one or more semiconductor chips mounted on the package substrate. The package module may also include one or more surface mount technology (SMT) devices having, for example, corresponding passive circuit elements. Such SMT devices may also be mounted on the package substrate. Summary of the invention

[0003] According to some implementations, the present disclosure relates to a double-sided packaged radio frequency (RF) module including a packaging substrate. The packaging substrate has a first surface on which at least one RF circuit component is mounted. The packaging substrate also has a second surface opposite to the first surface, on which at least one circuit system component is mounted. At least one contact feature is attached to the second surface of the packaging substrate. The vertical extension of the at least one contact feature is greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the packaging substrate. The double-sided packaged RF module also includes a lower side molding encapsulating the at least one circuit system component and the at least one contact feature. The bottom surface of the lower side molding is flush with the bottom surface of the at least one circuit system component. The double-sided packaged RF module also includes a groove structure formed in the lower side molding around the at least one contact feature.

[0004] In some embodiments, the at least one contact feature comprises a solder ball. According to various embodiments, the solder ball has a diameter greater than the thickness of the lower molding. In certain embodiments, the diameter of the solder ball is greater than twice the thickness of the lower molding.

[0005] In several embodiments, the groove structure is formed circumferentially around the solder ball.In various embodiments, the groove structure includes a recess of a triangular or trapezoidal cross section extending around an edge of a portion of the solder ball exposed from the lower molding.

[0006] In various embodiments, the width of the recessed portion of the trench structure gradually decreases along the surface of the lower molding toward the second surface of the package substrate.

[0007] In some embodiments, the double-sided packaged RF module includes a plurality of contact features forming a ball grid array (BGA) or a land grid array (LGA) on a bottom surface of the lower molding.

[0008] In various embodiments, the double-sided packaged RF module further includes an overmold encapsulating at least one RF circuit component mounted on the first surface of the packaging substrate.

[0009] According to various embodiments, the solder ball includes a solder ball core surrounded by a surrounding solder material. In some embodiments, the solder ball core is formed of a material different from the surrounding solder material. In several embodiments, the surrounding solder material includes a solder alloy. In some embodiments, the solder alloy includes at least one of tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb), or silver (Ag).

[0010] In some embodiments, the material of the solder ball core includes at least one of alloys of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or any combination thereof.

[0011] In various embodiments, the solder ball core has a shape of a partially cut sphere, with the cut plane being flush with the surface of the lower molding.

[0012] According to various embodiments, the double-sided packaged RF module is implemented as a power amplifier (PA) module, a low-noise amplifier (LNA) module, a front-end module (FEM), or a switch module.

[0013] The present disclosure also relates in several aspects to a double-sided packaged radio frequency (RF) module. The double-sided packaged RF module includes a package substrate. The package substrate has a first surface on which at least one RF circuit component is mounted. The package substrate has a second surface opposite to the first surface, on which at least one circuit system component is mounted. At least one solder ball is attached to the second surface of the package substrate. The vertical extension of the at least one solder ball is greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the package substrate. The at least one solder ball includes a solder ball core surrounded by surrounding solder material. The solder ball core is formed of a material different from the surrounding solder material. The double-sided packaged RF module also includes a lower side molding encapsulating the at least one circuit system component and the at least one solder ball. The bottom surface of the lower side molding is flush with the bottom surface of the at least one circuit system component.

[0014] In various embodiments, the double-sided packaged RF module includes a plurality of solder balls forming a ball grid array (BGA) on a bottom surface of the lower molding. In various embodiments, a vertical extension of at least one solder ball is greater than twice a distance between a bottom surface of at least one circuit system component and a second surface of the package substrate.

[0015] In some embodiments, the surrounding solder material includes a solder alloy. According to various embodiments, the solder alloy includes at least one of tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb), or silver (Ag).

[0016] In some embodiments, the material of the solder ball core includes at least one of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or alloys of any combination thereof.

[0017] According to some embodiments, the solder ball core has the shape of a partially cut sphere, and the cutting plane is flush with the surface of the lower molding. In many embodiments, the distance between the cutting plane of the partially cut sphere and the surface of the lower molding is less than half the diameter of the sphere of the solder ball core.

[0018] In some embodiments, the double-sided packaged RF module is implemented as a power amplifier (PA) module, a low noise amplifier (LNA) module, a front end module (FEM), or a switch module.

[0019] The present disclosure also relates to a wireless device in several aspects. The wireless device includes a double-sided packaged radio frequency (RF) module, at least one contact feature, a lower side molding, and a groove structure, wherein the double-sided packaged RF module includes a packaging substrate, the packaging substrate having a first surface and a second surface opposite to the first surface, at least one RF circuit component is mounted on the first surface, at least one circuit system component is mounted on the second surface, the at least one contact feature is attached to the second surface of the packaging substrate, the vertical extension of the at least one contact feature is greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the packaging substrate, the lower side molding encapsulates the at least one circuit system component and the at least one contact feature, the bottom surface of the lower side molding is flush with the bottom surface of the at least one circuit system component, and the groove structure is formed in the lower side molding around the at least one contact feature. The wireless device also includes an antenna coupled to the double-sided packaged RF module.

[0020] In some embodiments, the double-sided packaged RF module is implemented as a diversity receive (RX) module. According to several embodiments, at least one RF circuit component includes one or more surface mount technology (SMT) devices. In various embodiments, at least one circuit system component mounted on the second surface of the package substrate includes at least one of a power amplifier (PA), a low noise amplifier (LNA), or a switch. According to multiple embodiments, the at least one contact feature is a solder ball. In multiple embodiments, the vertical extension of at least one solder ball is greater than twice the distance between the bottom surface of the at least one circuit system component and the second surface of the package substrate.

[0021] The present disclosure also relates to a wireless device in several aspects. The wireless device includes a double-sided packaged radio frequency (RF) module, at least one solder ball, a lower side molding, and a groove structure, wherein the double-sided packaged RF module includes a packaging substrate, the packaging substrate has a first surface and a second surface opposite to the first surface, at least one RF circuit component is disposed on the first surface, at least one circuit system component is mounted on the second surface, at least one solder ball is attached to the second surface of the packaging substrate, the vertical extension of the at least one solder ball is greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the packaging substrate, at least one solder ball includes a solder ball core surrounded by surrounding solder material, the solder ball core is formed of a material different from the surrounding solder material, the lower side molding encapsulates the at least one circuit system component and the at least one solder ball, and the bottom surface of the lower side molding is flush with the bottom surface of the at least one circuit system component. The wireless device also includes an antenna coupled to the double-sided packaged RF module.

[0022] In some embodiments, the double-sided packaged RF module is implemented as a diversity receive (RX) module. According to several embodiments, at least one RF circuit component includes one or more surface mount technology (SMT) devices. In various embodiments, at least one circuit system component mounted on the second surface of the package substrate includes at least one of a power amplifier (PA), a low noise amplifier (LNA), or a switch.

[0023] The present disclosure also relates in several aspects to a method for forming a double-sided packaged radio frequency (RF) module. The method includes mounting at least one RF circuit component on a first surface of a package substrate, and mounting at least one circuit system component on a second surface of the package substrate opposite to the first surface. The method also includes attaching at least one contact feature to the second surface of the package substrate so that the vertical extension of the at least one contact feature is greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the package substrate. The method also includes encapsulating the at least one contact feature and the at least one circuit system component with an encapsulation molding material. The method also includes thinning the encapsulation molding material so that the material of the at least one contact feature is exposed from the bottom surface of the encapsulation molding material. The method also includes forming a groove structure in the thinned lower side molding around the at least one contact feature.

[0024] In some embodiments, the method further includes reforming the at least one contact feature by forming a solder material cap on a portion of the at least one contact feature exposed from the bottom surface of the encapsulation molding material.

[0025] According to various embodiments, at least one contact feature comprises a solder ball. In some embodiments, forming the trench structure comprises forming the trench structure circumferentially around the solder ball. According to several embodiments, thinning the encapsulation molding material comprises removing material of at least one solder ball to greater than half of its diameter.

[0026] In some embodiments, the solder ball includes a solder ball core surrounded by a surrounding solder material. In various embodiments, the solder ball core is formed of a material different from the surrounding solder material. In some embodiments, the surrounding solder material includes a solder alloy. According to various embodiments, the solder alloy includes at least one of tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb), or silver (Ag). In several embodiments, the material of the solder ball core includes at least one of an alloy of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or any combination thereof.

[0027] In various embodiments, thinning the encapsulation molding material involves at least one of grinding and milling.

[0028] According to some embodiments, forming the trench structure includes controlled laser ablation of a material of the encapsulating molding material.

[0029] The present disclosure also relates in several aspects to a method for forming a double-sided packaged radio frequency (RF) module. The method includes mounting at least one RF circuit component on a first surface of a package substrate, and mounting at least one circuit system component on a second surface of the package substrate opposite to the first surface. The method also includes attaching at least one solder ball, the at least one solder ball being attached to the second surface of the package substrate, the at least one solder ball having a vertical extension greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the package substrate, the at least one solder ball comprising a solder ball core surrounded by surrounding solder material, the solder ball core being formed of a material different from the surrounding solder material. The method also includes encapsulating at least one solder ball and at least one circuit system component with an encapsulating molding material. The method also includes thinning the encapsulating molding material so that the material of the solder ball core is exposed from the bottom surface of the encapsulating molding material. The method also includes reforming at least one solder ball by forming a solder material cap on a portion of the solder ball core exposed from the bottom surface of the encapsulating molding material.

[0030] In some embodiments, the surrounding solder material includes a solder alloy. According to several embodiments, the solder alloy includes at least one of tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb), or silver (Ag). In many embodiments, the material of the solder ball core includes at least one of an alloy of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or any combination thereof.

[0031] In various embodiments, thinning the encapsulation molding material involves at least one of grinding and milling. In some embodiments, thinning the encapsulation molding material includes removing material of the solder ball core to greater than half of its diameter. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Embodiments of the present disclosure will now be described by way of non-limiting examples with reference to the accompanying drawings.

[0033] Figure 1 depicts a side cross-sectional view of an example double-sided module having a ball grid array (BGA) on its underside according to some embodiments of the present disclosure;

[0034] Figure 2 Some embodiments of the present disclosure are shown Figure 1 Example of a double-sided BGA module mounted on a circuit board;

[0035] Figure 3 depicts a side cross-sectional view of an exemplary double-sided packaged RF module having a ball grid array (BGA) on its underside and mounted on a circuit board according to some embodiments of the present disclosure;

[0036] FIG. 4A to FIG. 4E According to some embodiments of the present disclosure, Figure 3 Stages of an exemplary process for molding the underside of an exemplary double-sided packaged RF module having a ball grid array (BGA);

[0037] Figure 5 depicts a side cross-sectional view of another exemplary double-sided packaged RF module having a ball grid array (BGA) on its underside and mounted on a circuit board according to some embodiments of the present disclosure;

[0038] FIG. 6A to FIG. 6D According to some embodiments of the present disclosure, Figure 5 stages of an exemplary process for molding the underside of an exemplary double-sided packaged RF module having a ball grid array (BGA);

[0039] Figure 7depicts a side cross-sectional view of another exemplary double-sided packaged RF module having a ball grid array (BGA) on its underside and mounted on a circuit board according to some embodiments of the present disclosure;

[0040] FIG. 8A to FIG. 8E According to some embodiments of the present disclosure, Figure 7 a stage of another exemplary process of molding the underside of an exemplary double-sided packaged RF module having a ball grid array (BGA);

[0041] Fig. 9 A double-sided packaged RF module according to some embodiments of the present disclosure is shown, comprising a shielded package having one or more surface mount technology (SMT) devices mounted on a package substrate;

[0042] Fig.10 shows a double-sided packaged RF module that may be a more specific example of the double-sided packaged RF module of FIG. 8 according to some embodiments of the present disclosure;

[0043] Fig.11 shows a double-sided packaged RF module that may be a more specific example of the double-sided packaged RF module of FIG. 8 according to some embodiments of the present disclosure;

[0044] Fig.12 shows an example of a radio frequency (RF) module having one or more features as described herein according to some embodiments of the present disclosure; and

[0045] Fig.13 An example of a wireless device having one or more features as described herein is shown in accordance with some embodiments of the present disclosure. DETAILED DESCRIPTION

[0046] The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the claimed invention. The following description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein may be implemented in a variety of different ways, for example, as defined and covered by the claims. In this specification, reference numerals are added to the accompanying drawings, where the same reference numerals may indicate the same or functionally similar elements. It should be understood that the elements shown in the drawings are not necessarily drawn to scale. In addition, it should be understood that certain embodiments may include more elements than shown in the drawings and / or a subset of the elements shown in the drawings. In addition, some embodiments may include any suitable combination of features from two or more drawings.

[0047] Figure 1A side cross-sectional view of an example of a double-sided packaged RF module 100 having a ball grid array (BGA) on its underside is depicted. More specifically, the module 100 includes a package substrate 102 having a radio frequency (RF) circuit (collectively referred to as 104) implemented on a first side (e.g., upper side) thereof, and one or more components (collectively referred to as 116) mounted on a second side (e.g., lower side) thereof. The RF circuit 104 on the upper side of the package substrate 102 may include, for example, one or more semiconductor dies and / or one or more surface mount technology (SMT) devices. The lower side component(s) 116 may include, for example, one or more semiconductor dies and / or one or more SMT devices.

[0048] exist Figure 1 In the example module 100 of FIG. 1 , an overmold 106 is shown as being implemented on the upper side of the package substrate 102 so as to encapsulate the RF circuit 104. In addition, the upper surface of the overmold 106 and the sidewalls of the module 100 are shown as having a conductive layer 108 (e.g., a conformal conductive layer) electrically connected to a ground plane 110 within the package substrate 102 through a conductor 112. Thus, the conductive layer 108 and the ground plane 110 generally define an internal volume and provide an RF shielding function between the internal volume and (one or more) external locations. In some embodiments, the module 100 may or may not include additional shielding functions (e.g., intra-module shielding between regions within the internal volume).

[0049] Although various examples are described herein in the context of modules having such shielding functionality (eg, conformal shielding and / or intra-module shielding), one or more features of the present disclosure may also be implemented in modules without such shielding functionality.

[0050] exist Figure 1 In the example of FIG. 1 , a BGA is shown as including a plurality of solder balls 120 a, 120 b, etc., generally designated 120. Such solder balls 120 a, 120 b, 120 are shown arranged to provide a lower side volume that is sized to allow mounting of (one or more) lower side components 116. Such (one or more) lower side components 116 may be mounted to the lower side of the package substrate 102 with or without an underfill.

[0051] Although various examples are described herein in the context of a module having such a BGA with solder balls, one or more features of the present disclosure may also be implemented in a module having other conductive structures as underside contact features. For example, a pillar (e.g., a column, a post, etc.) may be used to provide a similar function as a solder ball.

[0052] Figure 2 Shows Figure 1 An example of a double-sided packaged RF module 100 mounted on a circuit board 130 (e.g., a telephone board). Such a circuit board can be configured to include various electrical connections to facilitate various functions of the module 100. For example, the ground of the module 100 (e.g., at the ground plane 110) can be electrically connected to the ground of the circuit board 130 (e.g., at the ground plane 132) through the example solder ball 120a. Such an electrical connection is indicated as 134. In another example, a non-grounded electrical connection can be made between the RF circuit 104 of the module 100 and another location associated with the circuit board 130 (e.g., another module) through the example solder ball 120b. Such an electrical connection is indicated as 136. In some embodiments, the non-grounded electrical connection 136 can transmit, for example, power, control signals, and RF signals associated with the operation of the module 100.

[0053] Figure 3 A side cross-sectional view of another example of a double-sided packaged RF module 100 having a ball grid array (BGA) on its underside is shown. More specifically, the module 100 includes a packaging substrate having a radio frequency (RF) circuit implemented with various devices (collectively referred to as RFIC 104), such as one or more semiconductor chips and / or one or more surface mount technology (SMT) devices. Such devices are shown as being implemented on a first side (e.g., upper side) of the packaging substrate. A second side (e.g., lower side or bottom side) of the packaging substrate is shown as including one or more components, such as a semiconductor chip.

[0054] exist Figure 3 In the example module 100 of FIG. 1 , an overmold is shown implemented on the upper side of the package substrate to encapsulate the various RFIC components 104. Figure 3 In the example module 100 of FIG. 1 , the upper surface of the overmold and the sidewalls of the module 100 may or may not have a conductive layer (e.g., a conformal conductive layer) electrically connected to a ground plane within the package substrate. Such a conductive layer and ground plane generally define an internal volume and provide RF shielding functionality between the internal volume and (one or more) external locations. In some embodiments, the module 100 may or may not include additional shielding functionality (e.g., intra-module shielding between regions within the internal volume).

[0055] Although various examples are described herein in the context of modules having such shielding functionality (eg, conformal shielding and / or intra-module shielding), one or more features of the present disclosure may also be implemented in modules without such shielding functionality.

[0056] exist Figures 1 to 3In the example of FIG. 1 , the BGA is shown to include a plurality of solder balls 120. Such solder balls are shown to be arranged to provide an underside volume that is sized to allow mounting of underside component(s) 116. Such underside component(s) may be mounted to the underside of the package substrate 102 using one or more underside solder balls, underfill, and / or similar mounting elements.

[0057] In some embodiments, Figure 1 Module 100, Figure 2 Module 100 and Figure 3 Each of the modules 100 may include an underside molding. Figure 1 , Figure 2 and Figure 3 In the example of FIG. 1 , such a lower side molding is indicated as 113 .

[0058] exist Figure 2 and Figure 3 In the example of FIG. 1 , the underside molding 113 is depicted as being implemented between the underside of the module 100 and a circuit board 130 (e.g., a phone board) on which the module 100 is mounted. In some embodiments, the underside molding 113 can be implemented on the underside of the package substrate 102. In such an embodiment, the underside molding 113 is part of the module 100 that is not mounted.

[0059] In some embodiments, the lower side molding 113 on the lower side of the shielding package can provide a more secure mounting for the lower component(s) 116. In some embodiments, the lower side molding 113 on the lower side of the shielding package can provide additional shielding for the lower component(s) 116.

[0060] The example of the double-sided packaged RF module 100 shows one or more lower components 116 that can be mounted below the shielding package, typically within a volume defined on the underside of the shielding package. In some embodiments, a collection of through-mold connections (e.g., one or more through-mold connections) can be on the underside of the shielding package (e.g., Figure 1 , Figure 2 and Figure 3 The set of through-mold connections may be defined as a volume on the underside of the shielding package. The volume below the shielding package is shown as being defined by the underside of the shielding package and the solder balls 120 of the ball grid array (BGA). The BGA may be a set of through-mold connections. For example, each solder ball 120 of the BGA may be a through-mold connection in a set of through-mold connections. Other examples of through-mold connections include, but are not limited to, solder balls, pillars, columns, posts, bases, and the like.

[0061] The through-mold connections described herein may also be referred to as contact features. The contact features (e.g., solder balls 120) allow the double-sided packaged RF module 100 to be mounted on a circuit board such as a telephone board 130. The contact features may be configured so that when mounted to the circuit board 130, there is sufficient vertical space between the upper surface of the circuit 130 and the lower surface of the shielding package for the lower component 116. This volume may be at least partially filled with the lower side molding 113, for example, up to a thickness T1, which is Figure 1 The thickness T1 may be specifically smaller than the thickness of the contact feature, i.e. Figure 1 , Figure 2 and Figure 3 The diameter of the solder ball 120 in Figure 2 and Figure 3 In particular, the thickness T1 is less than the distance between the bottom side of the package substrate 102 and the top side of the circuit board 130. In some embodiments, the thickness T1 of the bottom molding may be less than half the thickness of the contact feature, that is, less than Figure 1 , Figure 2 and Figure 3 113. The lower molding 113 substantially encapsulates the lower component 116. In some embodiments, at least a portion of the contact feature (e.g., solder ball 120) may be exposed through the lower molding 113. Exposing at least a portion of the solder ball 120 may provide a connection (e.g., electrical connection and / or thermal connection) through the lower molding 113. For example, the solder ball 120 may provide a connection (e.g., electrical connection) to the lower component 116 and / or the upper component 104 in the shielding package. In various embodiments, solder (or other conductive material) may be applied to the exposed portion of the solder ball 120 to form a connection (e.g., electrical connection) with the circuit board 130. In some embodiments, the lower molding 113 may be formed in a land grid array (LGA) type / style package together with the solder ball 120 (e.g., the exposed portion of the solder ball 120).

[0062] When the double-sided packaged RF module 100 is attached to the circuit board 130, the electrical connection between the double-sided packaged RF module 100 and the circuit board 130 can be facilitated by solder material from the contact features that is deposited / melted onto the pads of the circuit board 130. For example, during the reflow process, heat can be applied to melt at least a portion of the contact features, such as the solder balls 120, to form the solder material. The solder material may also include additional materials formed, implemented, deposited, etc. above the solder balls 120. The (one or more) pads may provide electrical and / or thermal conductivity between the double-sided packaged RF module 100 and other components / circuits (not shown) attached to the circuit board 130. In some embodiments, the pads may also include solder material.

[0063] The lower molding 113 may have a surface facing downward toward the circuit board 130. In some embodiments, the surface is not in physical contact with the upper surface of the circuit board 130, so that there is a gap between the two adjacent surfaces. In some embodiments, such a gap can help protect the (one or more) lower components 116 from mechanical damage caused by linear displacement of the double-sided package RF module 100, such as bending, impact, or other mechanical impact that may be the result of the circuit board 130 falling. The portion of the lower molding 113 adhered to the side of the (one or more) lower components 116 can provide additional protection from damage caused by linear displacement of the double-sided package RF module 100, such as bending, impact, or other mechanical impact that may be the result of the circuit board 130 falling. In some embodiments, when the double-sided package RF module 100 is mounted on the circuit board 130, the gap between the bottom surface of the lower molding 113 and the upper surface of the circuit board 130 can also allow the double-sided package RF module 100 to adapt to process / manufacturing variations. For example, different temperatures can be used to melt the solder balls 120 during the installation of the double-sided package RF module 100. The gap can help ensure proper mounting of the double-sided packaged RF module 100 by providing sufficient distance between the bottom surface of the lower molding 113 and the upper surface of the circuit board 130, while still allowing the solder material of the (one or more) solder balls 120 to properly engage with the (one or more) corresponding pads of the circuit board 130 to form an electrical connection.

[0064] Figure 31 . A close-up view of the surroundings of the contact features (e.g., solder balls 120) is also illustrated in FIG. As shown in the close-up view, the solder balls 120 are surrounded by a groove structure 115 formed in the lower molding 113. The groove structure 115 can be, for example, a circumferentially closed recess or depression in the material of the lower molding 113. The groove structure 115 can be formed, for example, by targeted removal of the material of the lower molding 113 after the lower molding 113 has been applied to the bottom side of the package substrate 102. In addition, in some embodiments, the bottom side of the lower molding 113 can be flush with the bottom side of one or more lower components 116. In those configurations, the opening of the groove structure 115 can also be flush with the bottom side of (one or more) lower components 116, and thus the depth of the groove structure 115 can exceed the plane of the bottom side of (one or more) lower components 116. In other words, the distance between the depth of the trench structure 115 and the bottom side of the package substrate 102 is less than the distance T1 between the bottom side of the (one or more) lower components 116 and the bottom side of the package substrate 102. More specifically, in some embodiments, the distance T1 between the bottom side of the (one or more) lower components 116 and the bottom side of the package substrate may be less than half the thickness of the solder ball 120.

[0065] The groove structure 115 may be, for example, a concave portion with a triangular or trapezoidal cross section extending around the edge of the solder ball 120 exposed from the lower molding 113. The width of the concave portion of the groove structure may gradually decrease along the surface of the lower molding 113 toward the bottom side of the package substrate 102.

[0066] The double-sided packaged RF module 100 can be arranged on a circuit board 130 using solder balls 120a, 120b, 120. The solder balls 120 can be attached to the circuit board 130 (by, for example, arrangement, mounting, fixing, or other means). As shown in a close-up view of the solder balls 120, the solder balls 120 are at least partially embedded in the lower molding 113, surrounded by corresponding groove structures 115. The solder balls 120 can be formed in a process that involves: installing an initial or preliminary solder ball, creating a lower molding 113 around the initial or preliminary solder ball and above (one or more) lower components 116, thinning the lower molding 113 together with a portion of the initial or preliminary solder ball and a portion of (one or more) lower components 116 to a thickness less than the diameter of the initial or preliminary solder ball, and at least partially reforming the thinned solder ball by forming a solder cap on the lower side of the thinned solder ball. Specifically, thinning of the lower molding 113 may be performed until more than half of the initial or preliminary solder balls are also removed. During the thinning process, the lower component (s) 116 is ground to a thickness lower than the initial thickness of the component (s) after installation. Thus, it is convenient to reform the thinned solder balls by forming solder caps. FIG. 4A to FIG. 4E An exemplary process for forming a ball grid array (BGA) at the bottom side of the double-sided packaged RF module 100 is discussed with reference to FIG.

[0067] like Figure 4A As shown, in order to manufacture a double-sided packaged RF module according to some embodiments, the package substrate 102 may be provided with an overmold 106 on its upper side. The overmold 106 may, for example, encapsulate various RFIC components arranged or mounted on the upper side of the package substrate 102, such as Figure 1 , Figure 2 or Figure 3 The RFIC component 104. One or more lower components 116 can be mounted on the bottom side of the package substrate 102, that is, on the surface of the package substrate 102 opposite to the surface on which the overmold 106 is formed. A plurality of initial or preliminary solder balls 122 are formed on the bottom side of the package substrate 102.

[0068] like Figure 4B As shown, the lower component(s) 116 and the initial or preliminary solder balls 122 are overmolded with an encapsulation molding material 117. The encapsulation molding material 117 completely covers the lower component(s) 116 and the initial or preliminary solder balls 122. The thickness T of the encapsulation molding material 117, i.e., the distance between the bottom side of the package substrate 102 and the bottom surface of the encapsulation molding material 117, can be selected to be greater than the maximum vertical extension of the lower component(s) 116 and the initial or preliminary solder balls 122 perpendicular to the bottom surface of the package substrate 102. Figure 4A and Figure 4B As exemplarily shown in FIG. 1 , the vertical extension of the initial or preliminary solder ball 122 is greater than the vertical extension of the lower feature(s) 116 .

[0069] like Figure 4CAs shown, the encapsulation molding material 117 is then thinned, for example, by grinding, milling, or otherwise skimming a layer of the molding material 117 from the bottom surface of the encapsulation molding material 117. In some embodiments, the process of thinning the encapsulation molding material 117 can be performed until a portion of the initial or preliminary solder ball 122 is ablated so that material of the initial or preliminary solder ball 122 is shown through the bottom surface of the encapsulation molding material 117. Specifically, in some embodiments, the process of thinning the encapsulation molding material 117 can be performed until more than half of the diameter of the initial or preliminary solder ball 122 is ablated. In some embodiments, the process of thinning the encapsulation molding material 117 can be stopped before the lower component 116 is exposed from the encapsulation molding material 117. In some embodiments, the lower component 116 is milled or ground to a thickness that is less than the initial thickness of the component(s) after installation. That is, the process of thinning the encapsulation molding material 117 can be continued until a portion of the lower component 116 is exposed from the encapsulation molding material 117. In some embodiments, the process of thinning the encapsulation molding material 117 may continue until not only a portion of the lower component 116 is exposed from the encapsulation molding material 117 , but also a portion of the lower component 116 is removed during the grinding or milling process and as the encapsulation molding material 117 is removed.

[0070] Further references Figure 4C , after the process of thinning the encapsulation molding material has been stopped, the thinned portion of the encapsulation molding material will form the lower molding 113. The lower molding 113 will have a thickness T1, i.e., a vertical extension from the bottom surface of the package substrate 102, which is less than the initial thickness T of the encapsulation molding material 117. Specifically, the thickness T1 of the lower molding 113 may be less than the maximum vertical extension of the lower component(s) 116 and the initial or preliminary solder balls 122 perpendicular to the bottom surface of the package substrate 102. Figure 4C As shown, a portion of the initial or preliminary solder ball 122 remaining after the process of thinning the encapsulation molding material 117 is a partially cut-away sphere 121 , the circle of which is flush with the bottom surface of the lower molding 113 .

[0071] like Figure 4DAs shown, a groove structure 115 is then formed in the molding material of the lower molding 113. The groove structure 115 is formed around the periphery of the partially cut-away sphere 121 of the solder ball. The groove structure 115 can be formed, for example, by targeted removal of material of the lower molding 113 after the lower molding 113 has been applied to the bottom side of the package substrate 102, such as, for example, by controlled laser ablation. The opening of the groove structure 115 can also be flush with the bottom side of the (one or more) lower parts 116, and thus the depth of the groove structure 115 can exceed the plane of the bottom side of the (one or more) lower parts 116. The groove structure 115 can, for example, be a concave portion of a triangular or trapezoidal cross-section extending around the edge of the partially cut-away sphere 121 of the solder ball exposed from the lower molding. The width of the concave portion of the groove structure 115 can gradually decrease as it moves along the surface of the lower molding 113 toward the bottom surface of the package substrate 102. In some embodiments, the trench structure 115 may be formed around the entirety of the partially cut-away sphere 121 of the solder ball. In some embodiments, the trench structure 115 may be formed around only a selected portion of the partially cut-away sphere 121 of the solder ball.

[0072] like Figure 4E As shown, after the groove structure 115 is formed, the solder ball can be reformed in a post-ablation process. To this end, a cap 123 of solder material can be formed on the partially cut sphere 121 of the solder ball. For example, additional solder material can be printed by paste on the top of the solder material that has been exposed from the surface of the lower molding 113. The additional solder material can be, for example, a solder paste, such as a powdered solder material in a flux paste. The solder paste can be applied to the partially cut sphere 121 of the solder ball by a stencil printing process, a pin transfer process, or a jet printing process. After processing the additional solder material, the solder cap 123 can be reflowed and cleaned. In some embodiments, the solder cap 123 can be plasma treated after reflow and cleaning. Together with the remaining solder material of the initial or preliminary solder ball 122, the properly treated solder cap 123 can form a reformed solder ball, such as a combined Figure 1 , Figure 2 and Figure 3 The illustrated and explained solder balls 120a, 120b and / or 120. The diameter T2 of the reformed solder balls may be greater than the thickness T1 of the lower molding 113, so that the reformed solder balls will create a gap or spacing between the bottom surface of the lower molding 113 and the surface of the circuit board on which the double-sided packaged RF module is placed.

[0073] Figure 5A side cross-sectional view of another example of a double-sided packaged RF module 100 having a ball grid array (BGA) on its underside is shown. More specifically, the module 100 includes a packaging substrate having a radio frequency (RF) circuit implemented with various devices (collectively referred to as RFIC 104), such as one or more semiconductor chips and / or one or more surface mount technology (SMT) devices. Such devices are shown as being implemented on a first side (e.g., upper side) of the packaging substrate. A second side (e.g., lower side or bottom side) of the packaging substrate is shown as including one or more components, such as a semiconductor chip.

[0074] Figure 5 The double-sided packaged RF module 100 is similar to Figure 2 The double-sided packaged RF module 100 is formed with a solder ball core 126 in addition to the solder ball 120. The solder ball core 126 is formed of a material different from the surrounding solder material of the solder ball 120. For example, the surrounding solder material of the solder ball may be a solder alloy. In some embodiments, the solder alloy of the surrounding solder material may contain tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb) and / or silver (Ag) in variable relative amounts. In some embodiments, the solder ball core 126 may be formed of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or an alloy of any combination of these metals.

[0075] Similar to Figure 2 The double-sided packaged RF module 100 can be formed by using solder balls 120a, 120b, 120 with partially cut solder cores 126. Figure 5The double-sided packaged RF module 100 is disposed on a circuit board 130. The solder ball 120 may be attached to the circuit board 130 (by, for example, disposing, mounting, fixing, or other means). The solder ball 120 may be formed in a process involving: installing an initial or preliminary solder ball having a solder core 126, creating a lower side molding 113 around the initial or preliminary solder ball and above (one or more) lower components 116, thinning the lower side molding 113 together with a portion of the initial or preliminary solder ball and a portion of (one or more) lower components 116 to a thickness less than the diameter of the initial or preliminary solder ball, and at least partially reforming the thinned solder ball by forming a solder cap of solder material on the lower side of the thinned solder ball. Specifically, the process of thinning the lower side molding 113 together with a portion of the initial or preliminary solder ball involves ablating a surrounding solder material layer and a portion of the solder core 126. During the thinning process, the lower component (s) 116 are ground to a thickness below the initial thickness of the component (s) after installation. In some embodiments, the lower molding 113 can be ablated so that more than half of the diameter of the solder core 126 is also ablated. This can help to properly rebuild the solder balls 120a, 120b, 120 after removing the material of the lower molding 113 during the manufacture of the double-sided packaged RF module 100. FIG. 6A to FIG. 6D The diagram discussion is used in Figure 5 A first exemplary process of forming a ball grid array (BGA) at the bottom side of the double-sided package RF module 100 .

[0076] like Fig. 6A As shown, in order to manufacture a double-sided packaged RF module according to some embodiments, the package substrate 102 may be provided with an overmold 106 on its upper side. The overmold 106 may, for example, encapsulate various RFIC components arranged or mounted on the upper side of the package substrate 102, such as Figure 5RFIC component 104. One or more lower components 116 can be mounted on the bottom side of the package substrate 102, that is, on the surface of the package substrate 102 opposite to the surface on which the overmold 106 is formed. A plurality of initial or preliminary solder balls 124 are formed on the bottom side of the package substrate 102. The initial or preliminary solder balls 124 are formed with preliminary solder ball cores 127. The preliminary solder ball cores 127 are formed of a material different from the surrounding solder material of the initial or preliminary solder balls 124. For example, the surrounding solder material of the solder balls may be a solder alloy. In some embodiments, the solder alloy of the surrounding solder material may contain tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb) and / or silver (Ag) in variable relative amounts. In some embodiments, the preliminary solder ball core 127 may be formed of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or an alloy of any combination of these metals.

[0077] like Figure 6B As shown, the lower component(s) 116 and the initial or preliminary solder balls 124 with the preliminary solder cores 127 are overmolded with an encapsulation molding material 117. The encapsulation molding material 117 completely covers the lower component(s) 116 and the initial or preliminary solder balls 124. The thickness T of the encapsulation molding material 117, i.e., the distance between the bottom side of the package substrate 102 and the bottom surface of the encapsulation molding material 117, can be selected to be greater than the maximum vertical extension of the lower component(s) 116 and the initial or preliminary solder balls 124 perpendicular to the bottom surface of the package substrate 102. As shown in FIG. Fig. 6A and 6B As exemplarily shown in FIG. 1 , the vertical extension of the initial or preliminary solder ball 124 is greater than the vertical extension of the lower component(s) 116 .

[0078] like Figure 6CAs shown, the encapsulating molding material 117 is then thinned, for example, by grinding, milling, or otherwise skimming a layer of the molding material 117 from the bottom surface of the encapsulating molding material 117. In some embodiments, the process of thinning the encapsulating molding material 117 may be performed until a portion of the initial or preliminary solder ball 124 and a portion of the preliminary solder ball core 127 are ablated such that material of the initial or preliminary solder ball 124 and the preliminary solder ball core 127 is shown through the bottom surface of the encapsulating molding material 117. Specifically, in some embodiments, the process of thinning the encapsulating molding material 117 may be performed until more than half of the diameter of the initial or preliminary solder ball 124 and the preliminary solder ball core 127 is ablated. In some embodiments, the process of thinning the encapsulating molding material 117 may be stopped before the lower component 116 is exposed from the encapsulating molding material 117. In some embodiments, the lower component 116 is milled or ground to a thickness that is less than the initial thickness of the component(s) after mounting. That is, the process of thinning the encapsulation molding material 117 may continue until a portion of the lower component 116 is exposed from the encapsulation molding material 117. In some embodiments, the process of thinning the encapsulation molding material 117 may continue until not only a portion of the lower component 116 is exposed from the encapsulation molding material 117, but also a portion of the lower component 116 is removed during the grinding or milling process and as the encapsulation molding material 117 is removed.

[0079] Further references Figure 6C , after the process of thinning the encapsulation molding material has been stopped, the thinned portion of the encapsulation molding material will form the lower molding 113. The lower molding 113 will have a thickness T1, i.e., a vertical extension from the bottom surface of the package substrate 102, which is less than the initial thickness T of the encapsulation molding material 117. Specifically, the thickness T1 of the lower molding 113 may be less than the maximum vertical extension of the lower component(s) 116 and the initial or preliminary solder balls 124 perpendicular to the bottom surface of the package substrate 102. Figure 6C As shown, a portion of the initial or preliminary solder ball 124 remaining after the process of thinning the encapsulation molding material 117 is a partially cut-away sphere 125 , the circle of which is flush with the bottom surface of the lower molding 113 .

[0080] like Fig.6D As shown, in Figure 6CAfter the thinning process, the solder ball can be reformed in a post-ablation process. To this end, a cap 123 of solder material can be formed on the partially cut sphere 125 of the solder ball. For example, additional solder material can be paste-printed on the top of the solder material that has been exposed from the surface of the lower molding 113. The additional solder material can be, for example, a solder paste, such as a powdered solder material in a flux paste. The solder paste can be applied to the partially cut sphere 125 of the solder ball by a stencil printing process, a pin transfer process, or a jet printing process. After processing the additional solder material, the solder cap 123 can be reflowed and cleaned. In some embodiments, the solder cap 123 can be plasma treated after reflow and cleaning. Together with the remaining solder material of the initial or preliminary solder ball 124 and the core material of the cut solder core 126, the properly treated solder cap 123 can form a reformed solder ball, such as a combined Figure 2 and Figure 5 The illustrated and explained solder balls 120a, 120b and / or 120. The diameter of the reformed solder balls can be greater than the thickness T1 of the lower molding 113, so that the reformed solder balls will create a gap or spacing between the bottom surface of the lower molding 113 and the surface of the circuit board on which the double-sided packaged RF module is placed.

[0081] Figure 7 A side cross-sectional view of another example of a double-sided packaged RF module 100 having a ball grid array (BGA) on its underside is shown. More specifically, the module 100 includes a packaging substrate having a radio frequency (RF) circuit implemented with various devices (collectively referred to as RFIC 104), such as one or more semiconductor chips and / or one or more surface mount technology (SMT) devices. Such devices are shown as being implemented on a first side (e.g., an upper side) of the packaging substrate. A second side (e.g., a lower side or bottom side) of the packaging substrate is shown as including one or more components, such as a semiconductor chip.

[0082] Figure 7 The double-sided packaged RF module 100 is similar to Figure 3 The double-sided packaged RF module 100 is formed with a solder ball core 126 in addition to the solder ball 120. The solder ball core 126 is formed of a material different from the surrounding solder material of the solder ball 120. For example, the surrounding solder material of the solder ball may be a solder alloy. In some embodiments, the solder alloy of the surrounding solder material may contain tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb) and / or silver (Ag) in variable relative amounts. In some embodiments, the solder ball core 126 may be formed of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or an alloy of any combination of these metals.

[0083] Similar to Figure 3 The double-sided packaged RF module 100 can be formed by using solder balls 120a, 120b, 120 with solder cores 126. Figure 7 The double-sided packaged RF module 100 is disposed on a circuit board 130. The solder ball 120 may be attached to the circuit board 130 (by, for example, disposition, mounting, fixing or other means). As shown in a close-up view of the solder ball 120, the solder ball 120 is at least partially embedded in the lower molding 113 and surrounded by a corresponding groove structure 115. The solder ball 120 may be formed in a process that involves: installing an initial or preliminary solder ball having a preliminary solder core 127, creating a lower molding 113 around the initial or preliminary solder ball and above (one or more) lower components, thinning the lower molding 113 together with a portion of the initial or preliminary solder ball and a portion of (one or more) lower components to a thickness less than the diameter of the initial or preliminary solder ball, and at least partially reforming the thinned solder ball by forming a solder cap of solder material on the lower side of the thinned solder ball. Specifically, the process of thinning the lower molding 113 together with a portion of the initial or preliminary solder ball involves ablating a layer of surrounding solder material and a portion of the preliminary solder core 127. During the thinning process, the lower component(s) are ground down to a thickness below the initial thickness of the component(s) after installation. FIG. 8A to FIG. 8E The graphic discussion is used in Figure 7 A second exemplary process of forming a ball grid array (BGA) at the bottom side of the double-sided packaged RF module 100 .

[0084] like Fig. 8A As shown, in order to manufacture a double-sided packaged RF module according to some embodiments, the package substrate 102 may be provided with an overmold 106 on its upper side. The overmold 106 may, for example, encapsulate various RFIC components arranged or mounted on the upper side of the package substrate 102, such as Figure 3 or Figure 7RFIC component 104. One or more lower components 116 can be mounted on the bottom side of the package substrate 102, that is, on the surface of the package substrate 102 opposite to the surface on which the overmold 106 is formed. A plurality of initial or preliminary solder balls 124 are formed on the bottom side of the package substrate 102. The initial or preliminary solder balls 124 are formed with preliminary solder ball cores 127. The preliminary solder ball cores 127 are formed of a material different from the surrounding solder material of the initial or preliminary solder balls 124. For example, the surrounding solder material of the solder balls may be a solder alloy. In some embodiments, the solder alloy of the surrounding solder material may contain tin (Sn), copper (Cu), bismuth (Bi), indium (In), antimony (Sb) and / or silver (Ag) in variable relative amounts. In some embodiments, the preliminary solder ball core 127 may be formed of copper (Cu), nickel (Ni), silver (Ag), gold (Au), aluminum (Al), molybdenum (Mo), magnesium (Mg), zinc (Zn), cobalt (Co), or an alloy of any combination of these metals.

[0085] like Figure 8B As shown, the lower component(s) 116 and the initial or preliminary solder balls 124 with the preliminary solder cores 127 are overmolded with an encapsulation molding material 117. The encapsulation molding material 117 completely covers the lower component(s) 116 and the initial or preliminary solder balls 124. The thickness T of the encapsulation molding material 117, i.e., the distance between the bottom side of the package substrate 102 and the bottom surface of the encapsulation molding material 117, can be selected to be greater than the maximum vertical extension of the lower component(s) 116 and the initial or preliminary solder balls 124 perpendicular to the bottom surface of the package substrate 102. As shown in FIG. Fig. 8A and Figure 8B As exemplarily shown in FIG. 1 , the vertical extension of the initial or preliminary solder ball 124 is greater than the vertical extension of the lower component(s) 116 .

[0086] like Figure 8CAs shown, the encapsulating molding material 117 is then thinned, for example, by grinding, milling, or otherwise skimming a layer of the molding material 117 from the bottom surface of the encapsulating molding material 117. In some embodiments, the process of thinning the encapsulating molding material 117 may be performed until a portion of the initial or preliminary solder ball 124 and a portion of the preliminary solder ball core 127 are ablated such that material of the initial or preliminary solder ball 124 and the preliminary solder ball core 127 is shown through the bottom surface of the encapsulating molding material 117. Specifically, in some embodiments, the process of thinning the encapsulating molding material 117 may be performed until more than half of the diameter of the initial or preliminary solder ball 124 and the preliminary solder ball core 127 is ablated. In some embodiments, the process of thinning the encapsulating molding material 117 may be stopped before the lower component 116 is exposed from the encapsulating molding material 117. In some embodiments, the lower component 116 is milled or ground to a thickness that is less than the initial thickness of the component(s) after mounting. That is, the process of thinning the encapsulation molding material 117 may continue until a portion of the lower component 116 is exposed from the encapsulation molding material 117. In some embodiments, the process of thinning the encapsulation molding material 117 may continue until not only a portion of the lower component 116 is exposed from the encapsulation molding material 117, but also a portion of the lower component 116 is removed during the grinding or milling process and as the encapsulation molding material 117 is removed.

[0087] Further references Figure 8C , after the process of thinning the encapsulation molding material has been stopped, the thinned portion of the encapsulation molding material will form the lower molding 113. The lower molding 113 will have a thickness T1, i.e., a vertical extension from the bottom surface of the package substrate 102, which is less than the initial thickness T of the encapsulation molding material 117. Specifically, the thickness T1 of the lower molding 113 may be less than the maximum vertical extension of the lower component(s) 116 and the initial or preliminary solder balls 124 perpendicular to the bottom surface of the package substrate 102. Figure 8C As shown, a portion of the initial or preliminary solder ball 124 remaining after the process of thinning the encapsulation molding material 117 is a partially cut-away sphere 125 , the circle of which is flush with the bottom surface of the lower molding 113 .

[0088] like Fig.8DAs shown, a groove structure 115 is then formed in the molding material of the lower molding 113. The groove structure 115 is formed around the periphery of the partially cut-away sphere 125 of the solder ball. The groove structure 115 can be formed, for example, by targeted removal of material of the lower molding 113 after the lower molding 113 has been applied to the bottom side of the package substrate 102, such as, for example, by controlled laser ablation. The opening of the groove structure 115 can also be flush with the bottom side of the (one or more) lower parts 116, and thus the depth of the groove structure 115 can exceed the plane of the bottom side of the (one or more) lower parts 116. The groove structure 115 can, for example, be a concave portion of a triangular or trapezoidal cross-section extending around the edge of the partially cut-away sphere 125 of the solder ball exposed from the lower molding 113. The width of the concave portion of the groove structure 115 can gradually decrease as it moves along the surface of the lower molding 113 toward the bottom surface of the package substrate 102. In some embodiments, the trench structure 115 may be formed around the entirety of the partially cut-away sphere 125 of the solder ball. In some embodiments, the trench structure 115 may be formed around only a selected portion of the partially cut-away sphere 125 of the solder ball.

[0089] like Fig. 8E As shown, after forming (one or more) groove structures 115, the solder ball can be reformed in a post-ablation process. To this end, a cap 123 of solder material can be formed on the partially cut sphere 125 of the solder ball. For example, additional solder material can be paste-printed on the top of the solder material that has been exposed from the surface of the lower molding 113. The additional solder material can be, for example, a solder paste, such as a powdered solder material in a flux paste. The solder paste can be applied to the partially cut sphere 125 of the solder ball by a stencil printing process, a pin transfer process, or a jet printing process. After processing the additional solder material, the solder cap 123 can be reflowed and cleaned. In some embodiments, the solder cap 123 can be plasma treated after reflow and cleaning. Together with the remaining solder material of the initial or preliminary solder ball 124 and the core material of the cut solder core 126, the properly treated solder cap 123 can form a reformed solder ball, such as a combined Figure 2 and Figure 5 The illustrated and explained solder balls 120a, 120b and / or 120. The diameter T2 of the reformed solder balls may be greater than the thickness T1 of the lower molding 113, so that the reformed solder balls will create a gap or spacing between the bottom surface of the lower molding 113 and the surface of the circuit board on which the double-sided packaged RF module is placed.

[0090] Examples of products related to double-sided packaged RF modules

[0091] As described herein, the shielding package and lower components of the double-sided packaged RF module may include different combinations of components. Fig. 9 1 shows that in some embodiments, the double-sided packaged RF module 100 may include a shielded package having one or more surface mount technology (SMT) devices 400 mounted on a package substrate 102. Fig. 9 As further shown in FIG. 1 , one or more semiconductor dies 116 may be mounted below the package substrate 102. As described herein, the one or more dies may be mounted within an area generally defined by an array of contact features (eg, solder balls 120).

[0092] As further described herein, an overmold 106 may be formed over the package substrate 102 to substantially encapsulate the SMT device(s) 400 and facilitate shielding functionality. It should be appreciated that the shielded package module may include one or more shielding features as described herein.

[0093] Fig.10 A double-sided packaged RF module 100 is shown, which may be Fig. 9 A more specific example of a double-sided packaged RF module 100 is shown. Fig.10 In the example of , (one or more) SMT devices 400 can be one or more filters and / or filter-based devices 400 encapsulated by the overmold 106. In addition, the semiconductor chip mounted below the package substrate 102 can be a chip with (one or more) RF amplifiers and / or (one or more) switches. Therefore, such a double-sided package can be implemented as different modules configured to facilitate the transmission and / or reception of RF signals. For example, the double-sided packaged RF module 100 can be implemented as a power amplifier (PA) module, a low noise amplifier (LNA) module, a front-end module (FEM), a switch module, etc.

[0094] Fig.11 A double-sided packaged RF module 100 is shown, which may be Fig. 9 A more specific example of a double-sided packaged RF module. Fig.11 In the example of FIG. 1 , the semiconductor die mounted under the package substrate 102 may be a die having one or more LNAs and one or more switches. In some embodiments, such a double-sided packaged RF module may be implemented as a module having LNA-related functions, including, for example, an LNA module.

[0095] In some embodiments, a packaged module having one or more features as described herein can be used in various products. For example, Fig.12 and Fig.13 Examples are shown of how a packaged module having one or more features as described herein may be configured for use in and / or implemented in a wireless device. Fig.12In some embodiments, a packaged module having one or more features as described herein may be implemented as a diversity receive (RX) module 150. In some applications, such a module may be implemented relatively close to a diversity antenna 420 to minimize or reduce losses and / or noise in a signal path 422.

[0096] Fig.12 The diversity RX module 150 in the example of can be configured such that switches 410 and 412 and LNA 414 are implemented in a semiconductor die (depicted as 116) mounted below a packaging substrate (such as packaging substrate 102 described with reference to various embodiments above). One or more filters 400 can be mounted on such a packaging substrate as described herein.

[0097] like Fig.12 As further shown in , the RX signals processed by the diversity RX module 150 can be routed to the transceiver via signal path 424. In wireless applications where the signal path 424 is relatively long and lossy, the aforementioned implementation of the diversity RX module 150 close to the antenna 420 can provide many desirable features.

[0098] It should be understood that one or more features of the present application may also be used in conjunction with Fig.12 The diversity reception example functionality is implemented in a dual-sided packaged RF module with different functions. For example, any packaged BGA-based module with an underside molding on the underside can be implemented with one or more features as described herein.

[0099] Fig.13 It is shown that in some embodiments, a double-sided packaged RF module having one or more features as described herein may be implemented in the wireless device 500. For example, the LNA or LNA-related module 150 may be implemented as a double-sided packaged RF module as described herein, and such a module may be used with the primary antenna 524.

[0100] Fig.13 An example LNA module 150 may include, for example, one or more LNAs 116, bias / logic circuits 432, and a band select switch 430. Some or all of these circuits may be implemented in a semiconductor die mounted below a package substrate of the LNA module 150. In such an LNA module 150, some or all of the duplexers 400 may be mounted on the package substrate to form a double-sided packaged RF module having one or more features as described herein.

[0101] Fig.13 Various features associated with the example wireless device 500 are further described. Fig.13 However, Fig.12The diversity RX module 100 may be included in the wireless device 500 with the LNA module 150, in place of the LNA module 150, or any combination thereof. It will also be understood that the double-sided packaged RF module having one or more features as described herein may be implemented in the wireless device 500 as a non-LNA module.

[0102] In the example wireless device 500, a PA circuit 518 having multiple power amplifiers (PAs) may provide an amplified RF signal to a switch 430 (via a duplexer 400), and the switch 430 may route the amplified RF signal to an antenna 524. The PA circuit 518 may receive an unamplified RF signal from a transceiver 514, which may be configured and operated in a known manner.

[0103] The transceiver 514 may also be configured to process received signals. Such received signals may be routed from the antenna 524 to the LNA 104 via the duplexer 400. The bias / logic circuit 432 may facilitate various operations of the LNA 104.

[0104] The transceiver 514 is shown interacting with the baseband subsystem 510, which is configured to provide conversion between data and / or voice signals suitable for a user and RF signals suitable for the transceiver 514. The transceiver 514 is also shown connected to a power management component 506, which is configured to manage power for the operation of the wireless device 500. Such a power management component may also control the operation of the baseband subsystem 510.

[0105] The baseband subsystem 510 is shown connected to the user interface 502 to facilitate various inputs and outputs of voice and / or data provided to and received from the user. The baseband subsystem 510 may also be connected to a memory 504 that is configured to store data and / or instructions to facilitate the operation of the wireless device, and / or to provide storage of information for the user.

[0106] Many other wireless device configurations can utilize one or more of the features described herein. For example, a wireless device need not be a multi-band device. In another example, a wireless device can include additional antennas such as a diversity antenna, and additional connectivity features such as Wi-Fi, Bluetooth, and GPS.

[0107] Any of the above embodiments may be implemented in association with a mobile device such as a cellular handset. The principles and advantages of the embodiments may be used in any system or apparatus that may benefit from any embodiment described herein, such as any uplink wireless communication device. The teachings herein are applicable to a variety of systems. Although the present disclosure includes example embodiments, the teachings described herein may be applied to a variety of structures. Any of the principles and advantages discussed herein may be implemented in association with an RF circuit configured to process a signal having a frequency in a range from about 30 kHz to 300 GHz, such as in a frequency range from about 400 MHz to 25 GHz.

[0108] Aspects of the present disclosure may be implemented in various electronic devices. Examples of electronic devices may include, but are not limited to, consumer electronic products, parts of consumer electronic products (such as packaged RF modules), RF filter wafers, uplink wireless communication equipment, wireless communication infrastructure, electronic test equipment, etc. Examples of electronic devices may include, but are not limited to, mobile phones (such as smart phones), wearable computing devices (such as smart watches or headphones), phones, televisions, computer monitors, computers, modems, handheld computers, laptop computers, tablet computers, microwave ovens, refrigerators, vehicle electronic systems (such as automotive electronic systems), robots (such as industrial robots), Internet of Things devices, stereo systems, digital music players, radios, cameras (such as digital cameras), portable memory chips, household appliances (such as washing machines or dryers), peripherals, watches, clocks, etc. In addition, electronic devices may include unfinished products.

[0109] Unless the context indicates otherwise, throughout the specification and claims, the words "comprise", "comprising", "include", "including", etc. are generally interpreted in an inclusive sense, rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to". Unless explicitly stated otherwise, or otherwise understood in the context of use, conditional language used herein, such as "can", "could", "might", "may", "eg", "for example", "such as", etc., is generally intended to express that certain embodiments include and other embodiments do not include certain features, elements, and / or states. The word "coupled" as generally used herein means that two or more elements can be directly coupled or coupled through one or more intermediate elements. Similarly, the word "connected", as generally used herein, means that two or more elements can be directly connected or connected through one or more intermediate elements. In addition, when used in this application, the words "herein", "above", "below" and words of similar meaning shall refer to this application as a whole, rather than any particular parts of this application. Where the context permits, words used in the singular or plural number in the above specific embodiments may also include the plural or singular number respectively.

[0110] Although certain embodiments have been described, these embodiments are presented as examples only and are not intended to limit the scope of the present disclosure. In fact, the novel filters, multiplexers, devices, modules, wireless communication devices, apparatuses, methods and systems described herein can be embodied in various other forms. In addition, without departing from the spirit of the present disclosure, the forms of the filters, multiplexers, devices, modules, wireless communication devices, apparatuses, methods and systems described herein can be variously omitted, replaced and changed. For example, although blocks are presented in a given arrangement, alternative embodiments can utilize different components and / or circuit topologies to perform similar functions, and some blocks can be deleted, moved, added, subdivided, combined and / or modified. Each of these blocks can be implemented in various different ways. Any suitable combination of the elements and / or actions of the various embodiments described above can be combined to provide further embodiments. The attached claims and their equivalents are intended to cover these forms or modifications that fall within the scope and spirit of the present disclosure.

Claims

1. A double-sided packaged radio frequency (RF) module, comprising: A packaging substrate, the packaging substrate having a first surface and a second surface opposite to the first surface, at least one RF circuit component is mounted on the first surface, and at least one circuit system component is mounted on the second surface; at least one contact feature attached to the second surface of the packaging substrate, the at least one contact feature having a vertical extension greater than a distance between a bottom surface of the at least one circuitry component and the second surface of the packaging substrate; an undermolding encapsulating the at least one circuitry component and the at least one contact feature, the bottom surface of the undermolding being flush with the bottom surface of the at least one circuitry component; and A channel structure is formed in the undermolding around the at least one contact feature. 2 . The double-sided packaged RF module of claim 1 , wherein the at least one contact feature comprises a solder ball having a diameter greater than a thickness of the underside molding. 3 . The double-sided packaged RF module of claim 2 , wherein the diameter of the solder balls is greater than twice the thickness of the lower molding. The double-sided packaged RF module according to claim 2 , wherein the groove structure is formed circumferentially around the solder ball.

5. The double-sided packaged RF module according to claim 1, wherein the groove structure includes a recess with a triangular or trapezoidal cross-section extending around the edge of a portion of the solder ball exposed from the lower side molding, and the width of the recess of the groove structure gradually decreases along the bottom surface of the lower side molding toward the second surface of the packaging substrate. 6 . The double-sided packaged RF module of claim 1 , comprising a plurality of contact features forming a ball grid array (BGA) or a land grid array (LGA) on the bottom surface of the lower molding. 7 . The double-sided packaged RF module of claim 1 , further comprising an overmold encapsulating the at least one RF circuit component mounted on the first surface of the package substrate. 8 . The double-sided packaged RF module of claim 2 , wherein the solder ball comprises a solder ball core surrounded by a surrounding solder material comprising a solder alloy, the solder ball core being formed of a material different from the surrounding solder material. 9 . The double-sided packaged RF module according to claim 8 , wherein the solder ball core has a shape of a partially cut sphere, a cutting plane of the partially cut sphere being flush with the bottom surface of the lower molding. 10 . The double-sided packaged RF module of claim 1 , wherein the double-sided packaged RF module is implemented as a power amplifier (PA) module, a low noise amplifier (LNA) module, a front end module (FEM), or a switch module.

11. A double-sided packaged radio frequency (RF) module, comprising: A packaging substrate, the packaging substrate having a first surface and a second surface opposite to the first surface, at least one RF circuit component is mounted on the first surface, and at least one circuit system component is mounted on the second surface; at least one solder ball attached to the second surface of the package substrate, the at least one solder ball having a vertical extension greater than a distance between a bottom surface of the at least one circuit system component and the second surface of the package substrate, the at least one solder ball including a solder ball core surrounded by surrounding solder material, the solder ball core being formed of a material different from the surrounding solder material; and A lower molding encapsulates the at least one circuit system component and the at least one solder ball, wherein a bottom surface of the lower molding is flush with the bottom surface of the at least one circuit system component.

12. The double-sided packaged RF module of claim 11, wherein the vertical extension of the at least one solder ball is greater than twice the distance between the bottom surface of the at least one circuitry component and the second surface of the package substrate. 13 . The double-sided packaged RF module of claim 11 , comprising a plurality of solder balls forming a ball grid array (BGA) on the bottom surface of the lower molding.

14. The double-sided packaged RF module of claim 11, wherein the surrounding solder material comprises a solder alloy. 15 . The double-sided packaged RF module of claim 11 , wherein the solder ball core has a shape of a partially cut sphere, a cutting plane of the partially cut sphere being flush with the bottom surface of the lower molding. 16 . The double-sided packaged RF module of claim 11 , wherein the double-sided packaged RF module is implemented as a power amplifier (PA) module, a low noise amplifier (LNA) module, a front end module (FEM), or a switch module.

17. A wireless device comprising: A double-sided packaged radio frequency (RF) module, at least one contact feature, a lower side molding, and a groove structure, wherein the double-sided packaged RF module comprises a packaging substrate, the packaging substrate having a first surface and a second surface opposite to the first surface, at least one RF circuit component is mounted on the first surface, at least one circuit system component is mounted on the second surface, the at least one contact feature is attached to the second surface of the packaging substrate, the vertical extension of the at least one contact feature is greater than the distance between the bottom surface of the at least one circuit system component and the second surface of the packaging substrate, the lower side molding encapsulates the at least one circuit system component and the at least one contact feature, the bottom surface of the lower side molding is flush with the bottom surface of the at least one circuit system component, and the groove structure is formed in the lower side molding around the at least one contact feature; and An antenna is coupled to the double-sided packaged RF module.

18. The wireless device of claim 17, wherein the double-sided packaged RF module is implemented as a diversity receive (RX) module.

19. The wireless device of claim 18, wherein the at least one RF circuit component comprises one or more surface mount technology (SMT) devices.

20. The wireless device of claim 18, wherein the at least one circuitry component mounted on the second surface of the packaging substrate comprises at least one of a power amplifier (PA), a low noise amplifier (LNA), and a switch.

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