New energy automobile electric drive control circuit board production monitoring method and device, computer equipment and storage medium

Abstract

The invention provides a new energy automobile electric drive control circuit board production monitoring method and device, computer equipment and a storage medium. The production monitoring method for the electric drive control circuit board of the new energy automobile comprises the following steps: acquiring a dielectric layer lamination state parameter of a high-density interconnection circuit board; performing lamination adjustment processing on the dielectric layer lamination state parameter and a preset lamination state parameter to obtain a dielectric lamination adjustment amount; and according to the medium pressing adjustment amount, a medium pressing early warning on-off signal is sent to a circuit board pressing upper computer. According to the method, the current in-board dielectric layer lamination condition of the high-density interconnection circuit board is determined, and then the dielectric layer lamination state parameters are compared with the standard dielectric layer lamination parameters, so that the difference between the current in-board dielectric layer lamination condition of the high-density interconnection circuit board and the standard in-board dielectric layer lamination condition is conveniently determined; and finally, optimizing and adjusting the pressing working mode of the circuit board pressing upper computer according to the difference value.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a production monitoring method, device, computer equipment and storage medium for electric drive control circuit boards for new energy vehicles. Background Art

[0002] With the rapid development of new energy vehicles, the electric drive control circuit boards of new energy vehicles are developing towards the direction of dense, thin and flat with high-density interconnection technology (HDI: High Density Interconnection) as the main body, that is, high-density interconnection circuit boards (i.e. HDI circuit boards) with fine lines, tiny holes and thin dielectric layers. At present, the traditional Tenging subtractive process can no longer meet the fine requirements of HDI boards, especially under the premise that the IC packaging substrate has increasingly smaller requirements for line width and line spacing, and the full additive process is mostly used for processing: inner layer circuit board AOI → super coarsening → ABF film pressing / leveling / baking → Xray target forming positioning holes → trimming waste → laser hole forming → Plasma hole forming slag removal → Desmear hole forming slag removal → copper deposition.

[0003] In the process of producing printed circuit boards, lamination is a crucial and indispensable key link. For HDI boards, the dielectric layer is usually thin, only 2-3.5mil. And the tolerance is generally required to be controlled within the range of ±10%. In the existing lamination process, the dielectric layer cannot be accurately controlled, which has a great impact on the final electrical performance of the product, resulting in greater difficulty in the finished product of HDI boards and a higher probability of scrapping HDI boards. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method, device, computer equipment and storage medium for monitoring the production of electric drive control circuit boards for new energy vehicles that effectively reduce the probability of scrapping circuit boards.

[0005] The purpose of this disclosure is achieved through the following technical solutions:

[0006] A method for monitoring the production of an electric drive control circuit board for a new energy vehicle, the method comprising:

[0007] Obtaining the dielectric layer pressing state parameters of a high density interconnect circuit board;

[0008] Performing a pressing adjustment process on the pressing state parameters of the medium layer and the preset pressing state parameters to obtain a pressing adjustment amount of the medium;

[0009] A medium pressing warning on / off signal is sent to a circuit board pressing host computer according to the medium pressing leveling amount to adjust the board edge pressing mode of the high-density interconnection circuit board.

[0010] In one of the embodiments, the obtaining of the dielectric layer pressing state parameters of the high-density interconnect circuit board includes: obtaining the dielectric layer pressing temperature of the high-density interconnect circuit board.

[0011] In one of the embodiments, the pressing state parameters of the medium layer are subjected to pressing adjustment processing with preset pressing state parameters to obtain a medium pressing adjustment amount, including: obtaining an adjustment between the pressing temperature of the medium layer and the preset pressing temperature to obtain a medium pressing temperature adjustment.

[0012] In one of the embodiments, sending a medium pressing warning start and stop signal to the circuit board pressing host computer according to the medium pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board includes: detecting whether the medium pressing temperature adjustment matches the preset temperature adjustment; when the medium pressing temperature adjustment matches the preset temperature adjustment, sending a medium pressing warning stop signal to the circuit board pressing host computer to continue the board edge pressing of the high-density interconnected circuit board.

[0013] In one of the embodiments, the step of obtaining the dielectric layer lamination state parameters of the high-density interconnect circuit board includes: obtaining the high-temperature lamination duration of the dielectric layer of the high-density interconnect circuit board.

[0014] In one of the embodiments, the pressing state parameters of the medium layer are pressed and adjusted with preset pressing state parameters to obtain the medium pressing adjustment amount, including: obtaining the adjustment of the high temperature pressing duration of the medium layer and the preset high temperature pressing duration to obtain the medium pressing high temperature time adjustment.

[0015] In one of the embodiments, a medium pressing warning start and stop signal is sent to a circuit board pressing host computer according to the medium pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board, including: detecting whether the medium pressing high temperature time adjustment matches the preset high temperature time adjustment; when the medium pressing high temperature time adjustment does not match the preset high temperature time adjustment, a medium pressing warning start signal is sent to the circuit board pressing host computer to stop the board edge pressing of the high-density interconnected circuit board.

[0016] A production monitoring device for electric drive control circuit boards of new energy vehicles comprises: a pressing acquisition module, a board edge pressing processing module and a pressing warning module; the pressing acquisition module is used to obtain the pressing state parameters of the dielectric layer of the high-density interconnected circuit board; the board edge pressing processing module is used to perform pressing adjustment processing on the pressing state parameters of the dielectric layer and preset pressing state parameters to obtain the dielectric pressing adjustment amount; the pressing warning module is used to send a dielectric pressing warning start and stop signal to a circuit board pressing host computer according to the dielectric pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board.

[0017] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0018] Obtaining the dielectric layer pressing state parameters of a high density interconnect circuit board;

[0019] Performing a pressing adjustment process on the pressing state parameters of the medium layer and the preset pressing state parameters to obtain a pressing adjustment amount of the medium;

[0020] A medium pressing warning on / off signal is sent to a circuit board pressing host computer according to the medium pressing leveling amount to adjust the board edge pressing mode of the high-density interconnection circuit board.

[0021] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0022] Obtaining the dielectric layer pressing state parameters of a high density interconnect circuit board;

[0023] Performing a pressing adjustment process on the pressing state parameters of the medium layer and the preset pressing state parameters to obtain a pressing adjustment amount of the medium;

[0024] A medium pressing warning on / off signal is sent to a circuit board pressing host computer according to the medium pressing leveling amount to adjust the board edge pressing mode of the high-density interconnection circuit board.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] After collecting the dielectric layer pressing state parameters, the current dielectric layer pressing state of the high-density interconnected circuit board is determined, and then the dielectric layer pressing state parameters are compared with the standard dielectric layer pressing parameters to facilitate determining the difference between the current dielectric layer pressing state of the high-density interconnected circuit board and the standard dielectric layer pressing state. Finally, according to the above difference value, the pressing working mode of the circuit board pressing host computer is optimized and adjusted, which effectively reduces the probability of scrapping the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 This is a flow chart of a method for monitoring production of electric drive control circuit boards for new energy vehicles in one embodiment;

[0029] Figure 2 is a schematic diagram of a high density interconnect circuit board in one embodiment;

[0030] Figure 3 for Figure 2 Schematic diagram of copper blocks on the edge of a high-density interconnect circuit board;

[0031] Figure 4 1 is a diagram of the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0035] The present disclosure relates to a production monitoring method for an electric drive control circuit board for a new energy vehicle. In one embodiment, the production monitoring method for an electric drive control circuit board for a new energy vehicle includes obtaining a dielectric layer pressing state parameter of a high-density interconnected circuit board; performing a pressing adjustment process on the dielectric layer pressing state parameter and a preset pressing state parameter to obtain a dielectric pressing adjustment amount; and sending a dielectric pressing warning start-stop signal to a circuit board pressing host computer according to the dielectric pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board. After collecting the dielectric layer pressing state parameter, the current in-board dielectric layer pressing condition of the high-density interconnected circuit board is determined, and then the dielectric layer pressing state parameter is compared with the standard dielectric layer pressing parameter to facilitate determining the difference between the current in-board dielectric layer pressing condition of the high-density interconnected circuit board and the standard in-board dielectric layer pressing condition. Finally, according to the above difference value, the pressing working mode of the circuit board pressing host computer is optimized and adjusted, effectively reducing the probability of scrapping the circuit board.

[0036] See also Figure 1 , which is a flow chart of a method for monitoring the production of electric drive control circuit boards for new energy vehicles according to an embodiment of the present disclosure. The method for monitoring the production of electric drive control circuit boards for new energy vehicles includes some or all of the following steps.

[0037] S100: Obtaining a dielectric layer pressing state parameter of a high-density interconnect circuit board.

[0038] In this embodiment, the dielectric layer pressing state parameter is the current dielectric layer pressing state of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter is the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter corresponds to the dielectric layer pressing operation state of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameter, it is convenient to determine the pressing execution condition of the dielectric layer in the high-density interconnected circuit board during the pressing process.

[0039] S200: performing a lamination adjustment process on the lamination state parameters of the medium layer and preset lamination state parameters to obtain a medium lamination adjustment amount.

[0040] In this embodiment, the dielectric layer pressing state parameter is the current in-board dielectric layer pressing state of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter is the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter corresponds to the dielectric layer pressing operation state of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameter, it is convenient to determine the pressing execution condition of the in-board dielectric layer of the high-density interconnected circuit board during the pressing process. The preset pressing state parameter is the standard in-board dielectric layer pressing state of the high-density interconnected circuit board, that is, the preset pressing state parameter is the specified dielectric layer pressing process data under the pressing process of the high-density interconnected circuit board, that is, the preset pressing state parameter corresponds to the dielectric layer pressing reference operation state of the high-density interconnected circuit board. By performing press-adjustment processing on the press-fit state parameters of the dielectric layer and the preset press-fit state parameters, it is convenient to determine the difference between the current press-fit state of the dielectric layer in the high-density interconnected circuit board and the standard press-fit state, thereby facilitating the determination of the degree of press-fit deformation difference of the current dielectric layer of the high-density interconnected circuit board.

[0041] S300: sending a medium pressing warning start and stop signal to a circuit board pressing host computer according to the medium pressing leveling amount, so as to adjust the board edge pressing mode of the high-density interconnection circuit board.

[0042] In this embodiment, the dielectric pressing adjustment amount is obtained based on the dielectric layer pressing state parameter and the preset pressing state parameter, and the dielectric layer pressing state parameter is the current dielectric layer pressing state of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter is the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter corresponds to the dielectric layer pressing operation of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameter, it is convenient to determine the pressing execution condition of the dielectric layer in the board of the high-density interconnected circuit board during the pressing process. The preset pressing state parameter is the standard dielectric layer pressing state of the high-density interconnected circuit board, that is, the preset pressing state parameter is the specified dielectric layer pressing process data under the pressing process of the high-density interconnected circuit board, that is, the preset pressing state parameter corresponds to the dielectric layer pressing reference operation of the high-density interconnected circuit board. By processing the press-fit adjustment of the dielectric layer press-fit state parameters with the preset press-fit state parameters, it is convenient to determine the difference between the current press-fit state of the dielectric layer in the high-density interconnected circuit board and the standard press-fit state, so as to determine the degree of press-fit deformation difference of the current dielectric layer of the high-density interconnected circuit board. After obtaining the dielectric press-fit adjustment amount, by sending a dielectric press-fit warning start-stop signal to the circuit board press-fit host computer, it is convenient to accurately control the press-fit of the dielectric layer of the high-density interconnected circuit board, so as to avoid the situation where the dielectric layer of the board edge of the high-density interconnected circuit board overflows too much and causes the dielectric layer thickness to be too small.

[0043] In the above embodiment, after collecting the dielectric layer pressing state parameters, the current in-board dielectric layer pressing state of the high-density interconnected circuit board is determined, and then the dielectric layer pressing state parameters are compared with the standard dielectric layer pressing parameters to facilitate determining the difference between the current in-board dielectric layer pressing state of the high-density interconnected circuit board and the standard in-board dielectric layer pressing state. Finally, based on the above difference value, the pressing working mode of the circuit board pressing host computer is optimized and adjusted, thereby effectively reducing the probability of scrapping the circuit board.

[0044] In one of the embodiments, the obtaining of the dielectric layer pressing state parameters of the high-density interconnected circuit board includes: obtaining the dielectric layer pressing temperature of the high-density interconnected circuit board. In this embodiment, the dielectric layer pressing state parameters are the current in-board dielectric layer pressing state of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameters are the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameters correspond to the dielectric layer pressing operation state of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameters, it is convenient to determine the pressing execution condition of the in-board dielectric layer of the high-density interconnected circuit board during the pressing process. The dielectric layer pressing state parameters include the dielectric layer pressing temperature of the high-density interconnected circuit board, and the dielectric layer pressing temperature is the pressing temperature to which the in-board dielectric layer of the high-density interconnected circuit board is subjected during the pressing process, that is, the dielectric layer pressing temperature is the temperature when the internal dielectric layer of the high-density interconnected circuit board is pressed. By collecting the pressing temperature of the dielectric layer, it is convenient to determine the pressing temperature that the dielectric layer of the high-density interconnection circuit board is subjected to in the current pressing process.

[0045] Furthermore, the dielectric layer pressing state parameter is subjected to pressing adjustment processing with the preset pressing state parameter to obtain the dielectric pressing adjustment amount, including: obtaining the adjustment between the dielectric layer pressing temperature and the preset pressing temperature to obtain the dielectric pressing temperature adjustment. In this embodiment, the dielectric layer pressing state parameter is the current in-board dielectric layer pressing condition of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter is the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter corresponds to the dielectric layer pressing operation condition of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameter, it is convenient to determine the pressing execution condition of the in-board dielectric layer of the high-density interconnected circuit board during the pressing process. The preset pressing state parameter is the standard in-board dielectric layer pressing condition of the high-density interconnected circuit board, that is, the preset pressing state parameter is the specified dielectric layer pressing process data under the pressing process of the high-density interconnected circuit board, that is, the preset pressing state parameter corresponds to the dielectric layer pressing reference operation condition of the high-density interconnected circuit board. By performing pressing adjustment processing on the dielectric layer pressing state parameter and the preset pressing state parameter, it is convenient to determine the difference between the current in-board dielectric layer pressing state of the high-density interconnected circuit board and the standard pressing state, so as to facilitate determining the degree of difference in pressing deformation of the current dielectric layer of the high-density interconnected circuit board. The dielectric layer pressing state parameter includes the dielectric layer pressing temperature of the high-density interconnected circuit board, and the dielectric layer pressing temperature is the pressing temperature to which the in-board dielectric layer of the high-density interconnected circuit board is subjected during the pressing process, that is, the dielectric layer pressing temperature is the temperature when the internal dielectric layer of the high-density interconnected circuit board is pressed. By collecting the dielectric layer pressing temperature, it is convenient to determine the pressing temperature to which the dielectric layer of the high-density interconnected circuit board is subjected during the current pressing process. By obtaining the difference between the dielectric layer pressing temperature and the preset pressing temperature, it is convenient to determine the difference between the pressing temperature borne by the dielectric layer of the high-density interconnection circuit board in the current pressing process and the standard pressing temperature.

[0046] Furthermore, the medium pressing warning start and stop signal is sent to the circuit board pressing host computer according to the medium pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board, including: detecting whether the medium pressing temperature adjustment matches the preset temperature adjustment; when the medium pressing temperature adjustment matches the preset temperature adjustment, a medium pressing warning shutdown signal is sent to the circuit board pressing host computer to continue the board edge pressing of the high-density interconnected circuit board. In this embodiment, the medium pressing adjustment amount is obtained based on the medium layer pressing state parameter and the preset pressing state parameter, and the medium layer pressing state parameter is the current in-board medium layer pressing condition of the high-density interconnected circuit board, that is, the medium layer pressing state parameter is the medium layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the medium layer pressing state parameter corresponds to the medium layer pressing operation condition of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameters, it is convenient to determine the pressing execution condition of the dielectric layer in the board of the high-density interconnected circuit board during the pressing process. The preset pressing state parameters are the standard dielectric layer pressing conditions in the board of the high-density interconnected circuit board, that is, the preset pressing state parameters are the specified dielectric layer pressing process data under the pressing process of the high-density interconnected circuit board, that is, the preset pressing state parameters correspond to the reference operation conditions of the dielectric layer pressing of the high-density interconnected circuit board. By performing pressing adjustment processing on the dielectric layer pressing state parameters and the preset pressing state parameters, it is convenient to determine the difference between the current dielectric layer pressing state in the board of the high-density interconnected circuit board and the standard pressing state, so as to facilitate the determination of the degree of difference in pressing deformation of the current dielectric layer of the high-density interconnected circuit board. After obtaining the dielectric pressing adjustment amount, by sending the dielectric pressing warning start-stop signal to the circuit board pressing host computer, it is convenient to accurately control the pressing of the dielectric layer of the high-density interconnected circuit board, so as to avoid the situation where the dielectric layer of the board edge of the high-density interconnected circuit board overflows too much and causes the dielectric layer thickness to be too small. The dielectric layer pressing state parameter includes the dielectric layer pressing temperature of the high-density interconnected circuit board, and the dielectric layer pressing temperature is the pressing temperature to which the dielectric layer in the board of the high-density interconnected circuit board is subjected during the pressing process, that is, the dielectric layer pressing temperature is the temperature when the internal dielectric layer of the high-density interconnected circuit board is pressed. By collecting the dielectric layer pressing temperature, it is convenient to determine the pressing temperature to which the dielectric layer of the high-density interconnected circuit board is subjected during the current pressing process. By calculating the difference between the dielectric layer pressing temperature and the preset pressing temperature, it is convenient to determine the degree of difference between the pressing temperature to which the dielectric layer of the high-density interconnected circuit board is subjected during the current pressing process and the standard pressing temperature.The dielectric pressing temperature difference matches the preset temperature difference, indicating that the pressing temperature to which the dielectric layer of the high-density interconnected circuit board is subjected in the current pressing process is normal, i.e., that the amount of glue flow at the edge of the high-density interconnected circuit is appropriate, so that the thickness of the edge of the board is maintained within the tolerance range, ensuring that the thickness of the dielectric layer of the high-density interconnected circuit is accurately controlled within the standard dielectric thickness.

[0047] In another embodiment, when the medium pressing temperature difference does not match the preset temperature difference, a medium pressing warning start signal is sent to the circuit board pressing host computer to stop the board edge pressing of the high-density interconnected circuit board, thereby avoiding excessive glue flow on the board edge due to excessive pressing of the high-density interconnected circuit board, and also avoiding the situation where the thickness requirement of the medium layer after pressing is not met.

[0048] In one of the embodiments, the obtaining of the dielectric layer pressing state parameters of the high-density interconnected circuit board includes: obtaining the high-temperature pressing duration of the dielectric layer of the high-density interconnected circuit board. In this embodiment, the dielectric layer pressing state parameters are the current in-board dielectric layer pressing state of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameters are the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameters correspond to the dielectric layer pressing operation state of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameters, it is convenient to determine the pressing execution conditions of the in-board dielectric layer of the high-density interconnected circuit board during the pressing process. The dielectric layer pressing state parameters include the high-temperature pressing duration of the dielectric layer of the high-density interconnected circuit board, and the high-temperature pressing duration of the dielectric layer is the high-temperature pressing time that the in-board dielectric layer of the high-density interconnected circuit board is subjected to during the pressing process, that is, the high-temperature pressing duration of the dielectric layer is the high-temperature pressing time when the internal dielectric layer of the high-density interconnected circuit board is pressed. By collecting the high-temperature pressing duration of the dielectric layer, it is convenient to determine the high-temperature pressing time that the dielectric layer of the high-density interconnection circuit board is subjected to in the current pressing process.

[0049] Furthermore, the dielectric layer pressing state parameter is subjected to pressing adjustment processing with the preset pressing state parameter to obtain the dielectric pressing adjustment amount, including: obtaining the adjustment of the dielectric layer pressing high temperature duration time with the preset pressing high temperature duration time to obtain the dielectric pressing high temperature time adjustment. In this embodiment, the dielectric layer pressing state parameter is the current in-board dielectric layer pressing condition of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter is the dielectric layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the dielectric layer pressing state parameter corresponds to the dielectric layer pressing operation condition of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameter, it is convenient to determine the pressing execution condition of the in-board dielectric layer of the high-density interconnected circuit board during the pressing process. The preset pressing state parameter is the standard in-board dielectric layer pressing condition of the high-density interconnected circuit board, that is, the preset pressing state parameter is the specified dielectric layer pressing process data under the pressing process of the high-density interconnected circuit board, that is, the preset pressing state parameter corresponds to the dielectric layer pressing reference operation condition of the high-density interconnected circuit board. By performing pressing adjustment processing on the dielectric layer pressing state parameter and the preset pressing state parameter, it is convenient to determine the difference between the current in-board dielectric layer pressing state of the high-density interconnected circuit board and the standard pressing state, so as to facilitate determining the degree of difference in pressing deformation of the current dielectric layer of the high-density interconnected circuit board. The dielectric layer pressing state parameter includes the high-temperature pressing duration of the dielectric layer of the high-density interconnected circuit board, and the high-temperature pressing duration of the dielectric layer is the high-temperature pressing time to which the in-board dielectric layer of the high-density interconnected circuit board is subjected during the pressing process, that is, the high-temperature pressing duration of the dielectric layer is the high-temperature pressing time when the internal dielectric layer of the high-density interconnected circuit board is pressed. By collecting the high-temperature pressing duration of the dielectric layer, it is convenient to determine the high-temperature pressing time that the dielectric layer of the high-density interconnection circuit board is subjected to in the current pressing process. By calculating the difference between the high-temperature pressing duration of the dielectric layer and the preset high-temperature pressing time, it is convenient to determine the degree of difference between the high-temperature pressing time that the dielectric layer of the high-density interconnection circuit board is subjected to in the current pressing process and the standard high-temperature pressing time.

[0050] Furthermore, the medium pressing warning start and stop signal is sent to the circuit board pressing host computer according to the medium pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board, including: detecting whether the medium pressing high temperature time adjustment matches the preset high temperature time adjustment; when the medium pressing high temperature time adjustment does not match the preset high temperature time adjustment, a medium pressing warning start signal is sent to the circuit board pressing host computer to stop the board edge pressing of the high-density interconnected circuit board. In this embodiment, the medium pressing adjustment amount is obtained based on the medium layer pressing state parameter and the preset pressing state parameter, and the medium layer pressing state parameter is the current in-board medium layer pressing condition of the high-density interconnected circuit board, that is, the medium layer pressing state parameter is the medium layer pressing process data under the current pressing process of the high-density interconnected circuit board, that is, the medium layer pressing state parameter corresponds to the medium layer pressing operation condition of the high-density interconnected circuit board. By collecting the dielectric layer pressing state parameters, it is convenient to determine the pressing execution condition of the dielectric layer in the board of the high-density interconnected circuit board during the pressing process. The preset pressing state parameters are the standard dielectric layer pressing conditions in the board of the high-density interconnected circuit board, that is, the preset pressing state parameters are the specified dielectric layer pressing process data under the pressing process of the high-density interconnected circuit board, that is, the preset pressing state parameters correspond to the reference operation conditions of the dielectric layer pressing of the high-density interconnected circuit board. By performing pressing adjustment processing on the dielectric layer pressing state parameters and the preset pressing state parameters, it is convenient to determine the difference between the current dielectric layer pressing state in the board of the high-density interconnected circuit board and the standard pressing state, so as to facilitate the determination of the degree of difference in pressing deformation of the current dielectric layer of the high-density interconnected circuit board. After obtaining the dielectric pressing adjustment amount, by sending the dielectric pressing warning start-stop signal to the circuit board pressing host computer, it is convenient to accurately control the pressing of the dielectric layer of the high-density interconnected circuit board, so as to avoid the situation where the dielectric layer of the board edge of the high-density interconnected circuit board overflows too much and causes the dielectric layer thickness to be too small. The dielectric layer pressing state parameter includes the dielectric layer pressing high temperature duration of the high-density interconnected circuit board. The dielectric layer pressing high temperature duration is the high temperature pressing time to which the dielectric layer in the board of the high-density interconnected circuit board is subjected during the pressing process, that is, the dielectric layer pressing high temperature duration is the high temperature pressing time when the internal dielectric layer of the high-density interconnected circuit board is pressed. By collecting the dielectric layer pressing high temperature duration, it is convenient to determine the high temperature pressing time to which the dielectric layer of the high-density interconnected circuit board is subjected in the current pressing process. By calculating the difference between the dielectric layer pressing high temperature duration and the preset high temperature pressing time, it is convenient to determine the degree of difference between the high temperature pressing time to which the dielectric layer of the high-density interconnected circuit board is subjected in the current pressing process and the standard high temperature pressing time.The medium high-temperature pressing time deviation does not match the preset high-temperature pressing time deviation, indicating that the high-temperature pressing time to which the medium layer of the high-density interconnected circuit board is subjected in the current pressing process is too short or too long, that is, it indicates that the amount of glue flowing at the edge of the board of the high-density interconnected circuit is too little or too much. At this time, the board edge pressing of the high-density interconnected circuit board is stopped to avoid excessive pressing of the high-density interconnected circuit board resulting in excessive glue flowing at the edge of the board, and also to avoid insufficient thickness of the medium layer in the high-density interconnected circuit board.

[0051] In another embodiment, when the medium high temperature pressing time difference matches the preset high temperature pressing time difference, a medium pressing warning closing signal is sent to the circuit board pressing host computer. The medium high temperature pressing time difference matches the preset high temperature pressing time difference, indicating that the high temperature pressing time to which the medium layer of the high-density interconnected circuit board is subjected in the current pressing process is just right, that is, the amount of glue flow at the edge of the high-density interconnected circuit is appropriate, so that the thickness of the edge of the board is maintained within the tolerance range, ensuring that the thickness of the medium layer of the high-density interconnected circuit is accurately controlled within the standard medium thickness.

[0052] During the actual pressing operation of the high-density interconnected circuit board, when the dielectric layer in the high-density interconnected circuit board is pressed by the mold of the pressing machine, the dielectric layer flows to the edge of the board after being squeezed, so that the dielectric layer is filled in the board in a planar distribution manner. After the dielectric layer reaches the specified dielectric thickness, it is still affected by the residual heat of the pressing, resulting in a too long curing time of the dielectric layer, which causes the dielectric layer to be in a state of strong fluidity after reaching the specified dielectric thickness, and then causes the dielectric layer to flow out from the edge of the board under the action of gravity of each layer of the core board, affecting the thickness consistency of the dielectric layer.

[0053] In order to improve the thickness consistency of the dielectric layer, the method further includes the following steps: sending a dielectric pressing warning start-stop signal to a circuit board pressing host computer according to the dielectric pressing level difference to adjust the board edge pressing mode of the high-density interconnection circuit board:

[0054] Obtaining the spacing of the exhaust grooves of the copper blocks at the edge of the high-density interconnection circuit board;

[0055] Detect whether the spacing between the exhaust grooves of the copper block at the edge of the board is greater than or equal to the preset exhaust groove spacing;

[0056] When the spacing between the exhaust grooves of the copper block at the edge of the board is greater than or equal to the preset exhaust groove spacing, an increase-pound-reduction signal is sent to the circuit board pressing host computer to increase the pressing force and reduce the pressure contact time at the same time.

[0057] In this embodiment, the spacing between the exhaust grooves of the copper block at the edge of the board is the spacing between the PADs at the edge of the high-density interconnection circuit board. Figure 2 and 3 The edge of the high-density interconnection circuit board is provided with a plurality of evenly distributed copper blocks to fill the edge area of ​​the board. Here, the copper blocks replace the original circular PAD. The size of the copper blocks is 17*17mm, and the standard spacing between the copper blocks is 1.28mm, that is, the preset exhaust groove spacing. Board edge copper block exhaust grooves are formed between adjacent copper blocks. The gas in the dielectric layer during pressing is quickly discharged through the board edge copper block exhaust grooves to avoid the situation where the thickness of the dielectric layer is inconsistent due to the residual gas in the dielectric layer. The spacing between the exhaust grooves of the copper blocks at the edge of the board is greater than or equal to the preset exhaust groove spacing, indicating that the slot diameter of the exhaust grooves of the copper blocks at the edge of the board of the high-density interconnected circuit board is larger, that is, it indicates that the spacing between the copper blocks at the edge of the board of the high-density interconnected circuit board is wider. At this time, although the gas in the dielectric layer can be quickly discharged, it is also easy to cause the flowing dielectric layer to flow out quickly. In order to reduce the probability of outflow of the dielectric layer, an increase-pound and decrease-contact signal is sent to the circuit board pressing host computer to increase the pressing force and reduce the pressure contact time at the same time, so that the gas in the dielectric layer is increased by the extrusion pressure and the gas discharge is accelerated, but the pressing contact time at this time is shortened simultaneously, so that after as much gas as possible is discharged, the dielectric layer can be prevented from being squeezed out through the exhaust grooves of the copper blocks at the edge of the board.

[0058] Furthermore, the detecting whether the spacing between the exhaust slots of the copper block at the edge of the board is greater than or equal to the preset exhaust slot spacing further includes:

[0059] When the spacing between the exhaust grooves of the copper block at the edge of the board is less than the preset exhaust groove spacing, obtaining the pressing process section time of the high-density interconnection circuit board;

[0060] Detecting whether the pressing process section time is greater than a preset process section time;

[0061] When the pressing process section time is greater than the preset process section time, a weight reduction and contact raising signal is sent to the circuit board pressing host computer to reduce the pressing square inch pound force and at the same time extend the pressure contact time.

[0062] In this embodiment, the spacing between the exhaust grooves of the copper block at the edge of the board is smaller than the preset exhaust groove spacing, indicating that the slot diameter of the exhaust groove of the copper block at the edge of the board of the high-density interconnection circuit board is too small, that is, the spacing between the copper blocks at the edge of the board of the high-density interconnection circuit board is too fine. Although it can effectively delay the outflow probability of the dielectric layer, the gas discharge rate in the dielectric layer is also reduced synchronously, which easily leads to the dielectric layer being blocked in the exhaust groove of the copper block at the edge of the board and unable to be exhausted. At this time, by collecting the time of the pressing process section, it is convenient to determine the running time of the high-density interconnection circuit board in the current pressing process section, so as to facilitate the determination of the remaining time allowed for the pressing action of the high-density interconnection circuit board. The pressing process section time is greater than the preset process section time, indicating that the remaining time allowed for the pressing action of the high-density interconnected circuit board is too short, that is, the remaining pressing time of the high-density interconnected circuit board in the current pressing process section is too short, that is, the distance from the dielectric layer on the high-density interconnected circuit board to the exhaust groove of the copper block at the edge of the board is too short. By sending a weight reduction and connection raising signal to the circuit board pressing host computer to reduce the pressing force and extend the pressure contact time at the same time, the gas in the dielectric layer can be continuously discharged, and the flow rate of the dielectric layer is low, so as to avoid the dielectric layer flowing before the gas in the dielectric layer is completely discharged from blocking the exhaust groove of the copper block at the edge of the board.

[0063] In another embodiment, when the pressing process segment time is less than or equal to the preset process segment time, step S300 is performed.

[0064] In another embodiment, the pressing parameters corresponding to the pressing sections of the high-density interconnect circuit board are different, and the specific design is shown in Table 1 below.

[0065] Table 1

[0066]

[0067]

[0068] The above-mentioned various preset variables are all set in the database for timely retrieval, and different preset variables are placed in different storage units, that is, in different storage stacks. Moreover, the spacing between the exhaust grooves of the copper blocks on the edge of the board and the time of the pressing process can be collected by corresponding detectors, for example, by the CCD camera in the pressing collection module and the pressing timer.

[0069] In one of the embodiments, the present disclosure also relates to a new energy vehicle electric drive control circuit board production monitoring device, including: a pressing acquisition module, a board edge pressing processing module and a pressing warning module; the pressing acquisition module is used to obtain the dielectric layer pressing state parameters of the high-density interconnected circuit board; the board edge pressing processing module is used to perform pressing adjustment processing on the dielectric layer pressing state parameters and preset pressing state parameters to obtain the dielectric pressing adjustment amount; the pressing warning module is used to send a dielectric pressing warning start and close signal to the circuit board pressing host computer according to the dielectric pressing adjustment amount to adjust the board edge pressing mode of the high-density interconnected circuit board.

[0070] In this embodiment, after the pressing acquisition module collects the pressing state parameters of the dielectric layer, the pressing state of the current dielectric layer in the high-density interconnected circuit board is determined, and then the board edge pressing processing module compares the dielectric layer pressing state parameters with the standard dielectric layer pressing parameters to facilitate determining the difference between the current pressing state of the dielectric layer in the high-density interconnected circuit board and the standard pressing state of the dielectric layer in the board. Finally, the pressing warning module optimizes and adjusts the pressing working mode of the circuit board pressing host computer according to the above difference value, thereby effectively reducing the probability of scrapping the circuit board.

[0071] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 4 As shown. The computer device includes a processor, a memory and a network interface connected via a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as charge and discharge suppression state parameters, preset suppression state parameters and positive sulfur warning signals. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for detecting the positive electrode suppression of a solid-state lithium-sulfur battery is implemented.

[0072] Those skilled in the art will understand that Figure 4 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0073] In one of the embodiments, the present application further provides a computer device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0074] In one of the embodiments, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0075] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0076] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. A production monitoring method for electric drive control circuit boards of new energy vehicles, characterized in that: include: Obtaining the dielectric layer pressing state parameters of a high density interconnect circuit board; Performing a press-fit adjustment process on the medium layer press-fit state parameter and the preset press-fit state parameter to obtain a medium press-fit adjustment amount; A medium pressing warning on / off signal is sent to a circuit board pressing host computer according to the medium pressing leveling amount to adjust the board edge pressing mode of the high-density interconnection circuit board.

2. The production monitoring method of the new energy vehicle electric drive control circuit board according to claim 1 is characterized in that: The method of obtaining the dielectric layer pressing state parameters of the high-density interconnect circuit board includes: The dielectric layer pressing temperature of the high density interconnect circuit board is obtained.

3. The production monitoring method of the new energy vehicle electric drive control circuit board according to claim 2 is characterized in that: The step of performing a press-fit adjustment process on the medium layer press-fit state parameter and the preset press-fit state parameter to obtain a medium press-fit adjustment amount includes: The difference between the medium layer pressing temperature and the preset pressing temperature is calculated to obtain the medium pressing temperature difference.

4. The production monitoring method of the new energy vehicle electric drive control circuit board according to claim 3 is characterized in that: The method of sending a medium pressing warning start and stop signal to a circuit board pressing host computer according to the medium pressing leveling amount to adjust the board edge pressing mode of the high-density interconnection circuit board includes: Detecting whether the medium pressing temperature difference matches the preset temperature difference; When the medium pressing temperature difference matches the preset temperature difference, a medium pressing early warning closing signal is sent to the circuit board pressing host computer to continue the board edge pressing of the high-density interconnection circuit board.

5. The method for monitoring the production of electric drive control circuit boards for new energy vehicles according to claim 1, characterized in that: The method of obtaining the dielectric layer pressing state parameters of the high-density interconnect circuit board includes: The high temperature duration of the dielectric layer lamination of the high-density interconnect circuit board is obtained.

6. The method for monitoring the production of electric drive control circuit boards for new energy vehicles according to claim 5, characterized in that: The step of performing a press-fit adjustment process on the medium layer press-fit state parameter and the preset press-fit state parameter to obtain a medium press-fit adjustment amount includes: The difference between the high temperature duration of the medium layer pressing and the preset high temperature duration is calculated to obtain the medium pressing high temperature time difference.

7. The method for monitoring the production of electric drive control circuit boards for new energy vehicles according to claim 6, characterized in that: The method of sending a medium pressing warning start and stop signal to a circuit board pressing host computer according to the medium pressing leveling amount to adjust the board edge pressing mode of the high-density interconnection circuit board includes: Detecting whether the medium pressing high temperature time adjustment matches the preset high temperature time adjustment; When the medium pressing high temperature time difference does not match the preset high temperature time difference, a medium pressing warning start signal is sent to the circuit board pressing host computer to stop the board edge pressing of the high-density interconnection circuit board.

8. A production monitoring device for electric drive control circuit boards of new energy vehicles, characterized in that: include: A pressing acquisition module, which is used to obtain the pressing state parameters of the dielectric layer of the high-density interconnection circuit board; A plate edge pressing processing module, the plate edge pressing processing module is used to perform pressing adjustment processing on the pressing state parameters of the medium layer and the preset pressing state parameters to obtain the medium pressing adjustment amount; A pressing warning module is used to send a medium pressing warning start and stop signal to a circuit board pressing host computer according to the medium pressing difference, so as to adjust the board edge pressing mode of the high-density interconnection circuit board.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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