An electronic label preparation device that is easy to load

Abstract

The present invention relates to the field of electronic label technology, specifically to an electronic label preparation device that is easy to load, which solves the problem that the loading process is relatively cumbersome when preparing electronic labels, and the electronic components inside the electronic labels after being processed and produced by this equipment will be directly fixed with glue, which makes it cumbersome to disassemble for recycling. The present invention can automatically replace the film substrate roll and automatically transfer the electronic label substrate wrapped on the film substrate roll to the interior of the electronic core placement machine through an efficient continuous loading auxiliary mechanism, and can isolate the electronic components from the glue through a sub-core disassembly processing mechanism. When the electronic label needs to be recycled and reused, it is only necessary to use scissors to cut off one end of the electronic label to extract the electronic component. Through the above technical solution, the staff can extract the electronic components more conveniently and quickly, while reducing the time consumed when replacing the film substrate roll, thereby improving the processing efficiency of the equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic labels, in particular to an electronic label preparation device which is easy to load. Background Art

[0002] When preparing an electronic label, you first need to use a label printer to print the corresponding pattern at the corresponding position on the electronic label substrate, and then use an electronic label patch machine to apply electronic components at the corresponding printing position. After the electronic components are patched, use a glue dispenser to apply glue on the electronic components, and finally apply the film to the label substrate. The excess part can be cut off according to the shape of the electronic label. When using these devices, the electronic label substrate needs to be rolled onto the corresponding receiving roll and the receiving roll is placed on the corresponding electric roller. During the processing of the electronic label substrate, the receiving roll needs to be rotated by the electric roller to continuously transport the electronic label substrate to the interior of the electronic label preparation device. The equipment used in this process to process the electronic label substrate is all equipment required in the electronic label preparation process. Therefore, these equipment can be called an electronic label preparation equipment, and these equipment and the auxiliary equipment that plays a loading role in the processing process can be called an electronic label preparation device that is easy to load.

[0003] However, after attaching the electronic components to the electronic tag substrate, the next step is to apply glue on the outer surface of the electronic components. When the glue solidifies, the electronic components will be fixed to the glue. When recycling the electronic tag, the first step is to remove the electronic components fixed to the glue from the inside of the electronic tag. However, since the electronic components are fixed to the glue at this time, the removal process is more troublesome. In addition, in the process of removing the electronic components, the electronic components will inevitably be pulled by the glue, which may cause the electronic components to break. The breakage of the sub-label substrate wound on the reel will damage its internal structure and reduce its recycling rate. When the sub-label substrate wound on the reel is used up, the equipment needs to be temporarily stopped to wait for the staff to remove the old reel, fix the new reel on the electric roller, and pass the part of the electronic label substrate wound on the reel through the multiple pressing rollers located inside the equipment before it can continue to work. This operation process is relatively cumbersome, which affects the overall processing efficiency of the equipment. Therefore, it does not meet the existing needs. In this regard, we propose an electronic label preparation device that is easy to load. Summary of the Invention

[0004] The purpose of the present invention is to provide an electronic label preparation device that is easy to load, so as to solve the problem raised in the above background technology that after applying electronic components on the electronic label substrate, the next step is to apply glue on the outer surface of the electronic components. When the glue solidifies, the electronic components and the glue will be fixed. When the electronic label is recycled and reused, the first step is to extract the electronic components fixed with the glue from the inside of the electronic label. However, since the electronic components and the glue are fixed to each other at this time, the removal process is relatively troublesome, and the process of extracting the electronic components is difficult. In the process, the electronic components will inevitably be pulled against the glue, which may cause the electronic components to break, thereby damaging their internal structure and reducing their recycling rate. When the sub-label substrate wrapped on the reel is used up, the equipment needs to be temporarily stopped to wait for the staff to remove the old reel, fix the new reel on the electric roller, and pass the part of the electronic label substrate wrapped on the reel through the multiple pressing rollers inside the equipment before continuing to work. This operation process is relatively cumbersome, which affects the overall processing efficiency of the equipment.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an electronic label preparation device that is easy to load, comprising an electronic chip placement machine, wherein a high-efficiency splicing and loading auxiliary mechanism is installed on the rear end face of the electronic chip placement machine, wherein the high-efficiency splicing and loading auxiliary mechanism comprises a square metal shell, two film substrate rolls, two round-shaped metal shells, four concave bars A, a moving mechanism, and two automatic substrate splicing transmission mechanisms, wherein the two round-shaped metal shells are respectively fixed to two sides of the outer surface of the square metal shell, and the positions of the two film substrate rolls correspond to the positions of the two round-shaped metal shells;

[0006] The four concave strips A are respectively fixed on both sides of the inside of the two circular metal shells, a plurality of transmission rollers A are provided between the two concave strips A, a filling strip plate A is provided between every two transmission rollers A, and a concave strip B fixed to the inside of the electronic chip placement machine is provided on both sides in front of the first circular metal shell from left to right, a plurality of transmission rollers B are provided between the two concave strips B, a filling strip plate B is provided between every two transmission rollers B, the front and rear end surfaces of the filling strip plate B and the filling strip plate A are both arc-shaped, and the positions of the first and second concave strips A from left to right correspond to the positions of the two concave strips B respectively;

[0007] The third and fourth concave strips A from the left to the right can be moved to positions corresponding to the two concave strips B by a moving mechanism, and the substrate automatic connection transmission mechanism can drive the film substrate roll to rotate while driving the two transmission rollers A located at the rear end of the circular metal shell to rotate synchronously;

[0008] The interior of the electronic core placement machine is installed with an electronic core disassembly processing mechanism, which includes a metal plate, an interlayer liquid cotton roller, a circulating movement mechanism and multiple label positioning through holes. The multiple label positioning through holes are all located on the outer surface of the metal plate. The lower end face of the interlayer liquid cotton roller is in contact with the upper end face of the metal plate, and the interlayer liquid cotton roller can roll back and forth on the outer surface of the metal plate through the circulating movement mechanism.

[0009] Preferably, a combined filling strip plate A is fixed evenly on the upper and lower sides of the front end surfaces of the two concave strips A fixed inside the circular metal shell, and a combined filling strip plate B is fixed on the upper and lower sides of the rear end surfaces of the two concave strips B. The front end surface of the combined filling strip plate B and the rear end surface of the combined filling strip plate A are both arc-shaped, and the opposing surfaces of the combined filling strip plate A and the combined filling strip plate B are both flat surfaces;

[0010] The outer surfaces of the two film substrate rolls are both wrapped with electronic label substrates.

[0011] Preferably, the moving mechanism includes a metal base, a slide rail is fixedly mounted on the upper end surface of the metal base, an electric slide is mounted on the outer surface of the slide rail, and the lower end surface of the square metal shell is fixed to the upper end surface of the electric slide.

[0012] Preferably, a positioning plate is provided on both sides above the metal base, and the outer surface of the second circular metal shell from left to right is in contact with the outer surface of the second positioning plate from left to right.

[0013] Preferably, the automatic substrate connection transmission mechanism includes a synchronous motor, the output shaft of the synchronous motor is connected to a transmission shaft through a coupling, the outer surface fixed sleeve of the transmission shaft is provided with a first bevel gear, the first bevel gear is engaged with a second bevel gear, the axis of the second bevel gear is connected to a long shaft, the lower side fixed sleeve of the outer surface of the long shaft is provided with a third bevel gear, the third bevel gear is engaged with a fourth bevel gear, the axis of the fourth bevel gear is connected to a material roller shaft, and the two film substrate rolls are respectively sleeved with the outer surfaces of the two material roller shafts.

[0014] Preferably, a gear A is fixed on both sides of the middle position of the outer surface of the long rotating shaft, the gear A is engaged with a gear B, the axis of the gear B is connected to the gear transmission rotating shaft, the outer surface fixed sleeve of the gear transmission rotating shaft is provided with a fifth bevel gear, the fifth bevel gear is engaged with a sixth bevel gear, the axis of the sixth bevel gear is connected to the synchronous transmission rotating shaft, the outer surface fixed sleeve of the synchronous transmission rotating shaft is provided with a synchronous sprocket, and the two synchronous sprockets are respectively connected in series with the two transmission rollers A located at the rear of the circular metal shell through a synchronous chain.

[0015] Preferably, a plurality of movable rollers installed inside the electronic chip placement machine are provided below the metal plate;

[0016] The four end corners of the end surface of the metal plate are all connected with a horizontal bar cylinder fixedly installed on the inner wall of the electronic core placement machine.

[0017] Preferably, the circular moving mechanism includes two stepper motors, the output shaft of the stepper motor is connected to a metal column through a coupling, the outer surface of the metal column is provided with a wavy line slide rail, a slide rod is slidably installed on one side inside the wavy line slide rail, and the opposite surfaces of the two slide rods are fixedly connected to a moving plate.

[0018] Preferably, an arc-shaped plate is fixed between the two movable plates, the lower end surface of the arc-shaped plate is arc-shaped, the interlayer liquid cotton roller is located below the arc-shaped plate, and the two ends of the interlayer liquid cotton roller are respectively connected to the two movable plates.

[0019] Preferably, a receiving groove is provided inside the arc-shaped plate, and a plurality of through holes penetrating the receiving groove are provided on the inner wall of the lower end of the receiving groove;

[0020] A connecting tube is connected to the middle position of the upper end surface of the arc-shaped plate, and the other end of the connecting tube is connected to a barrier liquid storage box fixedly mounted on the upper end surface of the electronic chip placement machine. The interior of the barrier liquid storage box is communicated with the interior of the storage groove through the connecting tube, and the interior of the barrier liquid storage box contains waterproof isolation liquid.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The present invention connects the electronic label substrate wound on the outer surface of the first film substrate roll from left to right to the device. When the electronic label substrate on this film substrate roll is continuously consumed, a film substrate roll can be installed on the rotating shaft of another material roller, and a part of the electronic label substrate on the outer surface of the newly installed film substrate roll is introduced between the corresponding multiple transmission rollers A. When the electronic label substrate on the film substrate roll in use is used up, the newly installed film substrate roll can be moved to the back of the electronic chip placement machine by the moving mechanism, and the electronic label substrate on the film substrate roll is automatically transferred to the inside of the electronic chip placement machine for use by the substrate automatic connection transmission mechanism. The above technical solution increases the convenience of device operation, reduces the time consumed in replacing film substrate rolls, and improves the processing efficiency of the equipment.

[0023] 2. The present invention uses an electronic core disassembly processing mechanism to apply a layer of waterproof insulating liquid to the outer surface of the electronic component attached to the outer surface of the electronic tag substrate. When the glue dispensing operation is performed, the applied waterproof insulating liquid can isolate the glue and the electronic tag to prevent direct contact between the two. After the glue solidifies, the waterproof insulating liquid will gradually dry up. When the waterproof insulating liquid is completely dry, the glue has solidified at this time, and the two will not be fixed again. When the electronic tag needs to be recycled and reused, it is only necessary to use scissors to cut off one end of the electronic tag, so that a part of the electronic component located inside it is exposed to the outside world, and then it can be directly pulled out from the inside of the electronic tag. Since there is no fixation between the electronic component and the glue, the glue will not have any impact on the electronic component during the extraction process. With the above technical solution, staff can extract the electronic components more conveniently and quickly, and reduce the risk of damage to the electronic components during the recycling process, thereby improving the efficiency of reuse. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of the present invention as a whole;

[0025] Figure 2 This is a schematic diagram of the overall structure of the present invention from the back, partially viewed from the inside;

[0026] Figure 3 For the present invention Figure 2 Top view of the internal structure at C in the middle;

[0027] Figure 4 For the present invention Figure 1 A magnified view of the structure at point A;

[0028] Figure 5 For the present invention Figure 1 Side view of the internal structure at A in the middle;

[0029] Figure 6 For the present invention Figure 5 A magnified view of the structure at point B.

[0030] Figure 1: Electronic chip placement machine; 2: Efficient continuous loading auxiliary mechanism; 201: Metal base; 202: Slide rail; 203: Electric slide; 204: Square metal housing; 205: Synchronous motor; 206: Transmission shaft; 207: First bevel gear; 208: Second bevel gear; 209: Long shaft; 210: Third bevel gear; 211: Fourth bevel gear; 212: Material roller shaft; 213: Film substrate roll; 214: Round metal housing; 215: Concave strip A; 216: Transmission roller A; 217: Filling strip plate A; 218: Combined filling strip plate A; 219: Combined filling strip plate B; 22 0. Concave bar B; 221. Drive roller B; 222. Filling bar plate B; 223. Gear A; 224. Gear B; 225. Gear drive shaft; 226. Fifth bevel gear; 227. Sixth bevel gear; 228. Synchronous drive shaft; 229. Synchronous sprocket; 230. Synchronous chain; 231. Positioning plate; 3. Interlayer liquid storage box; 4. Moving roller; 5. Metal plate; 6. Label positioning through hole; 7. Horizontal bar cylinder; 8. Connecting pipe; 9. Arc plate; 10. Storage slot; 11. Through hole; 12. Interlayer liquid cotton roller; 13. Moving plate; 14. Stepper motor; 15. Metal column; 16. Wave line slide rail; 17. Sliding rod. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0032] See also Figures 1 to 6 The present invention provides an embodiment of an electronic label preparation device that is easy to load, including an electronic chip placement machine 1, characterized in that: the rear end face of the electronic chip placement machine 1 is equipped with an efficient continuous loading auxiliary mechanism 2, the efficient continuous loading auxiliary mechanism 2 comprising a square metal shell 204, two film substrate rolls 213, two round-shaped metal shells 214, four concave bars A215, a moving mechanism and two substrate automatic continuous transmission mechanisms, the two round-shaped metal shells 214 are respectively fixed to both sides of the outer surface of the square metal shell 204, and the positions of the two film substrate rolls 213 correspond to the positions of the two round-shaped metal shells 214 respectively;

[0033] Four concave strips A215 are respectively fixed on both sides of the inside of the two circular metal shells 214, a plurality of transmission rollers A216 are provided between the two concave strips A215, and a filling strip plate A217 is provided between every two transmission rollers A216. A concave strip B220 fixed to the inside of the electronic chip placement machine 1 is provided on both sides in front of the first circular metal shell 214 from left to right, a plurality of transmission rollers B221 are provided between the two concave strips B220, and a filling strip plate B222 is provided between every two transmission rollers B221. The front and rear end surfaces of the filling strip plate B222 and the filling strip plate A217 are both arc-shaped, and the positions of the first and second concave strips A215 from left to right correspond to the positions of the two concave strips B220 respectively;

[0034] The moving mechanism can move the third and fourth concave bars A215 from left to right to positions corresponding to the two concave bars B220, and the automatic substrate connection transmission mechanism can drive the film substrate roll 213 to rotate while driving the two transmission rollers A216 located at the rear of the circular metal shell 214 to rotate synchronously.

[0035] A combined filling strip plate A218 is fixed evenly on the upper and lower sides of the front end faces of the two concave strips A215 fixed inside the circular metal shell 214, and a combined filling strip plate B219 is fixed on the upper and lower sides of the rear end faces of the two concave strips B220. The front end faces of the combined filling strip plates B219 and the rear end faces of the combined filling strip plates A218 are both arc-shaped, and the facing surfaces of the combined filling strip plates A218 and B219 are both flat.

[0036] The outer surfaces of the two film substrate rolls 213 are both wound with electronic label substrates; when the electronic label substrate wound on the outer surface of the first film substrate roll 213 from left to right is connected to the equipment, the electronic label substrate on this film substrate roll 213 is continuously consumed, and the film substrate roll 213 can be installed on another material roller shaft 212, and a part of the electronic label substrate on the outer surface of the newly installed film substrate roll 213 is introduced between the corresponding multiple transmission rollers A216.

[0037] The moving mechanism includes a metal base 201, the upper end surface of the metal base 201 is fixedly installed with a slide rail 202, the outer surface of the slide rail 202 is installed with an electric slide 203, and the lower end surface of the square metal shell 204 is fixed to the upper end surface of the electric slide 203; when the electronic label substrate on the film substrate roll 213 being used is used up, the square metal shell 204 is driven to move by the electric slide 203. During the movement of the square metal shell 204, the positions of the two material roller shafts 212 connected thereto and the two film substrate rolls 213 respectively installed on the outer surfaces of the two material roller shafts 212 will change accordingly. At this time, the newly installed film substrate roll 213 is moved to the back of the electronic chip placement machine 1.

[0038] A positioning plate 231 is provided on both sides above the metal base 201, and the outer surface of the second circular metal shell 214 from left to right is in contact with the outer surface of the second positioning plate 231 from left to right; when the newly installed film substrate roll 213 moves to the rear of the electronic chip placement machine 1, the first circular metal shell 214 from left to right will also contact the positioning plate 231. The positioning plate 231 in contact with the circular metal shell 214 can prompt the staff that the film substrate roll 213 has been moved to the corresponding position and limited, ensuring that the film substrate roll 213 can be moved to the corresponding position.

[0039] The automatic substrate connection transmission mechanism includes a synchronous motor 205, the output shaft of the synchronous motor 205 is connected to the transmission shaft 206 through a coupling, the outer surface of the transmission shaft 206 is fixedly sleeved with a first bevel gear 207, the first bevel gear 207 is meshed with a second bevel gear 208, the axis of the second bevel gear 208 is connected to a long shaft 209, the lower side of the outer surface of the long shaft 209 is fixedly sleeved with a third bevel gear 210, the third bevel gear 210 is meshed with a fourth bevel gear 211, the axis of the fourth bevel gear 211 is connected to a material roller shaft 212, and two film substrate rolls 213 are respectively sleeved with the outer surfaces of the two material roller shafts 212; when the newly installed film substrate roll 213 has completed its movement, the synchronous motor 205 is started, and the synchronous motor 205 can drive the transmission shaft 206 connected thereto. The first bevel gear 207 fixedly sleeved on the outer surface of the transmission shaft 206 rotates. When the first bevel gear 207 rotates, the second bevel gear 208 meshing with it and the long shaft 209 connected to the axis of the second bevel gear 208 will rotate together. When the long shaft 209 rotates, the third bevel gear 210 fixedly sleeved on the outer surface of the long shaft 209 and the fourth bevel gear 211 meshing with it will rotate together. The rotating fourth bevel gear 211 will drive the material roller shaft 212 connected to the axis of the fourth bevel gear 211 to rotate. When the material roller shaft 212 rotates, the film substrate roll 213 newly installed on the outer surface of the material roller shaft 212 will rotate accordingly. As the film substrate roll 213 rotates, the electronic label substrate wrapped around the outer surface of the film substrate roll 213 can be released.

[0040] A gear A223 is fixedly provided on both sides of the middle position of the outer surface of the long rotating shaft 209, and the gear A223 is meshed with a gear B224. The axis of the gear B224 is connected to the gear transmission rotating shaft 225. The outer surface of the gear transmission rotating shaft 225 is fixedly provided with a fifth bevel gear 226. The fifth bevel gear 226 is meshed with a sixth bevel gear 227. The axis of the sixth bevel gear 227 is connected to the synchronous transmission rotating shaft 228. The outer surface of the synchronous transmission rotating shaft 228 is fixedly provided with a synchronous sprocket 229. The two synchronous sprockets 229 are respectively connected in series with the two transmission rollers A216 located at the rear end of the inner side of the circular metal shell 214 through a synchronous chain 230. During the rotation process, the long rotating shaft 209 is fixedly sleeved on the long rotating shaft 20 The gear A223 on the outer surface and the gear B224 meshing with it will rotate accordingly. When the gear B224 rotates, the gear transmission shaft 225 connected to the axis of the gear B224 and the fifth bevel gear 226 fixedly sleeved on the outer surface of the gear transmission shaft 225 will rotate together. The rotating fifth bevel gear 226 will drive the sixth bevel gear 227 meshing with it and the synchronous transmission shaft 228 connected to the axis of the sixth bevel gear 227 to rotate. When the synchronous transmission shaft 228 rotates, it can drive the transmission roller A216 connected in series with it to rotate through the synchronous sprocket 229 and the synchronous chain 230. The rotating transmission roller A216 can drive the electronic tag substrate located between the transmission rollers A216 to move forward.

[0041] The filling strip plate A217 fixed between the transmission rollers A216 can prevent the top end of the electronic tag substrate from being stuck between the two transmission rollers A216 located above or below. When the newly installed film substrate roll 213 is moved to the rear of the electronic chip placement machine 1, the combined filling strip plate A218 fixed between the concave strips A215 located inside the circular metal shell 214 will contact the combined filling strip plate B219 fixed on the rear end face of the concave strip B220. When the combined filling strip plate A218 contacts the combined filling strip plate B219, they will be combined into a completed filling strip plate A217 to fill the gap at the connection between the two. When the moving electronic tag substrate passes from the two fixed After passing through the multiple transmission rollers A216 between the concave bars A215, it will enter the multiple transmission rollers B221 between the two concave bars B220 fixed inside the electronic core placement machine 1. When the electronic label substrate passes through the multiple transmission rollers B221, it will move to the processing position inside the electronic core placement machine 1. Thereafter, the electronic label substrate moved here can be processed by the electronic core placement machine 1. Through the above technical solution, the film substrate roll 213 can be automatically replaced and the electronic label substrate wrapped on the film substrate roll 213 can be connected to the electronic core placement machine 1, thereby increasing the convenience of equipment operation, reducing the time consumed in replacing the film substrate roll 213, and improving the processing efficiency of the equipment.

[0042] The interior of the electronic core placement machine 1 is installed with an electronic core disassembly processing mechanism, which includes a metal plate 5, an interlayer liquid cotton roller 12, a circulating moving mechanism and multiple label positioning through holes 6. The multiple label positioning through holes 6 are all located on the outer surface of the metal plate 5. The lower end face of the interlayer liquid cotton roller 12 is in contact with the upper end face of the metal plate 5, and the interlayer liquid cotton roller 12 can roll back and forth on the outer surface of the metal plate 5 through the circulating moving mechanism.

[0043] A plurality of moving rollers 4 are provided below the metal plate 5 and are installed inside the electronic chip placement machine 1. When the electronic tag substrate passes between the plurality of transmission rollers B221, it will move to the upper end surface of the moving roller 4 and continue to move on the upper end surface of the moving roller 4.

[0044] The four end corners of the upper end surface of the metal plate 5 are connected to a horizontal bar cylinder 7 fixedly mounted on the inner wall of the electronic core placement machine 1; when the electronic label substrate moves to the bottom of the metal plate 5, the metal plate 5 is moved downward by the horizontal bar cylinder 7 until the upper end surface of the metal plate 5 is in contact with the upper end surface of the electronic label substrate, and then the electronic core placement machine 1 is started. The electronic core placement machine 1 can apply electronic components to the outer surface of the electronic label substrate through the label positioning through hole 6 located on the outer surface of the metal plate 5.

[0045] The circular moving mechanism includes two stepper motors 14, the output shaft of the stepper motor 14 is connected to a metal column 15 through a coupling, the outer surface of the metal column 15 is provided with a wavy slide rail 16, and a slide rod 17 is slidably installed on one side of the inside of the wavy slide rail 16, and the opposite surfaces of the two slide rods 17 are fixedly connected to a moving plate 13; when each label positioning through hole 6 contains an electronic component, the stepper motor 14 is started, and the stepper motor 14 can drive the metal column 15 connected thereto to rotate. Since one side of the outer surface of the slide rod 17 inside the wavy slide rail 16 slidably installed on the outer surface of the metal column 15 is fixedly connected to a moving plate 13, the slide rod 17 and the moving plate 13 cannot rotate with the metal column 15 as the center, and the stepper motor 14 can drive the metal column 15 and the wavy slide rail 16 located on the outer surface of the metal column 15 to rotate. When the wavy slide rail 16 rotates, the slide rod 17 slidably installed inside the wavy slide rail 16 will move back and forth along the rotating wavy slide rail 16.

[0046] An arc-shaped plate 9 is fixed between the two movable plates 13, and the lower end surface of the arc-shaped plate 9 is arc-shaped. The interlayer liquid cotton roller 12 is located below the arc-shaped plate 9, and the two ends of the interlayer liquid cotton roller 12 are respectively connected to the two movable plates 13; as the slide bar 17 moves, the movable plate 13 fixed thereto and the interlayer liquid cotton roller 12 connected to the movable plate 13 will roll on the outer surface of the metal plate 5. As the interlayer liquid cotton roller 12 rolls, a layer of waterproof isolation liquid can be applied to the outer surface of the electronic components located inside the label positioning through hole 6, while the interlayer liquid cotton roller 12 cannot contact the part isolated by the metal plate 5. During the rolling process, the interlayer liquid cotton roller 12 cannot apply waterproof isolation liquid to the part isolated by the metal plate 5.

[0047] When the waterproof insulating liquid is applied, lift the metal plate 5, move the electronic tag substrate with electronic components on the outer surface to the inside of the glue dispenser, and add glue to the outer surface of the electronic components through the glue dispenser. The waterproof insulating liquid applied by it can isolate the glue from the electronic tag, and the glue that is not in contact with the electronic components will come into contact with the electronic tag substrate that is not coated with the waterproof insulating liquid. The glue will be fixed in this position due to its own properties and gradually solidify, thereby fixing the electronic components inside it in the current position. As time goes by, the waterproof insulating liquid will gradually dry up. When After the waterproof insulating liquid is completely dried, the glue has solidified at this time, so the two will not be fixed again. When the electronic tag needs to be recycled and reused, just use scissors to cut off one end of the electronic tag, so that a part of the electronic components inside it is exposed to the outside world, and then it can be directly pulled out from the inside of the electronic tag. Moreover, since there is no fixation between the electronic components and the glue, the glue will not cause any impact on the electronic components during the extraction process. With the above technical solution, staff can extract the electronic components more conveniently and quickly, and reduce the risk of damage to the electronic components during the recycling process, thereby improving the efficiency of reuse.

[0048] The interior of the arc-shaped plate 9 is provided with a receiving groove 10, and the inner wall of the lower end of the receiving groove 10 is provided with a plurality of through holes 11 penetrating the receiving groove 10;

[0049] A connecting tube 8 is connected to the middle position of the upper end surface of the arc-shaped plate 9, and the other end of the connecting tube 8 is connected to the interlayer liquid storage box 3 fixedly mounted on the upper end surface of the electronic chip placement machine 1. The interior of the interlayer liquid storage box 3 is communicated with the interior of the storage tank 10 through the connecting tube 8, and the interior of the interlayer liquid storage box 3 contains waterproof isolation liquid; before using the equipment, waterproof isolation liquid is added to the interior of the interlayer liquid storage box 3, and this waterproof isolation liquid will enter the interior of the storage tank 10 along the connecting tube 8, and pass through the through hole 11 on the inner wall of the lower end of the storage tank 10 to drip onto the interlayer liquid cotton roller 12 and be absorbed by the interlayer liquid cotton roller 12.

[0050] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. An electronic label preparation device that is easy to load, comprising an electronic chip placement machine (1), characterized in that: The rear end face of the electronic chip placement machine (1) is equipped with a high-efficiency splicing and feeding auxiliary mechanism (2), the high-efficiency splicing and feeding auxiliary mechanism (2) comprising a square metal shell (204), two film substrate rolls (213), two round-shaped metal shells (214), four concave bars A (215), a moving mechanism and two substrate automatic splicing transmission mechanisms, the two round-shaped metal shells (214) are respectively fixed to two sides of the outer surface of the square metal shell (204), and the positions of the two film substrate rolls (213) correspond to the positions of the two round-shaped metal shells (214); The four concave strips A (215) are respectively fixed on both sides of the inside of the two circular metal shells (214), a plurality of transmission rollers A (216) are provided between the two concave strips A (215), and a filling strip plate A (217) is provided between each two transmission rollers A (216). A concave strip B (220) fixed to the inside of the electronic chip placement machine (1) is provided on both sides in front of the first circular metal shell (214) from left to right, a plurality of transmission rollers B (221) are provided between the two concave strips B (220), and a filling strip plate B (222) is provided between each two transmission rollers B (221). The front and rear end surfaces of the filling strip plate B (222) and the filling strip plate A (217) are both arc-shaped, and the positions of the first and second concave strips A (215) from left to right correspond to the positions of the two concave strips B (220). The third and fourth concave strips A (215) from the left to the right can be moved to positions corresponding to the two concave strips B (220) by a moving mechanism, and the two driving rollers A (216) located at the rear end of the circular metal shell (214) can be driven to rotate synchronously while driving the film substrate roll (213) to rotate by a substrate automatic connection transmission mechanism; The electronic core placement machine (1) is internally mounted with an electronic core disassembly processing mechanism, which comprises a metal plate (5), an interlayer liquid cotton roller (12), a circulating movement mechanism, and a plurality of label positioning through holes (6), wherein the plurality of label positioning through holes (6) are all located on the outer surface of the metal plate (5), the lower end surface of the interlayer liquid cotton roller (12) is in contact with the upper end surface of the metal plate (5), and the interlayer liquid cotton roller (12) can be caused to roll back and forth on the outer surface of the metal plate (5) through the circulating movement mechanism; The automatic substrate connection transmission mechanism includes a synchronous motor (205), the output shaft of the synchronous motor (205) is connected to a transmission shaft (206) through a coupling, the outer surface of the transmission shaft (206) is fixedly sleeved with a first bevel gear (207), the first bevel gear (207) is meshed with a second bevel gear (208), the axis of the second bevel gear (208) is connected to a long rotating shaft (209), the lower side of the outer surface of the long rotating shaft (209) is fixedly sleeved with a third bevel gear (210), the third bevel gear (210) is meshed with a fourth bevel gear (211), the axis of the fourth bevel gear (211) is connected to a material roller rotating shaft (212), and the two film substrate rolls (213) are respectively sleeved with the outer surfaces of the two material roller rotating shafts (212); The cyclic movement mechanism includes two stepper motors (14), the output shafts of the stepper motors (14) are connected to metal columns (15) via couplings, the outer surface of the metal columns (15) is provided with a wavy line slide rail (16), a slide rod (17) is slidably mounted on one side of the interior of the wavy line slide rail (16), and the opposing surfaces of the two slide rods (17) are fixedly connected to a moving plate (13); An arc-shaped plate (9) is fixedly provided between the two movable plates (13), the lower end surface of the arc-shaped plate (9) is arc-shaped, the interlayer liquid cotton roller (12) is located below the arc-shaped plate (9), and the two ends of the interlayer liquid cotton roller (12) are respectively connected to the space between the two movable plates (13); A receiving groove (10) is provided inside the arc-shaped plate (9), and a plurality of through holes (11) penetrating the receiving groove (10) are provided on the inner wall of the lower end of the receiving groove (10); A connecting tube (8) is connected to the middle position of the upper end surface of the arc-shaped plate (9), and the other end of the connecting tube (8) is connected to an interlayer liquid storage box (3) fixedly mounted on the upper end surface of the electronic chip placement machine (1). The interior of the interlayer liquid storage box (3) and the interior of the storage tank (10) are communicated through the connecting tube (8), and the interior of the interlayer liquid storage box (3) contains waterproof isolation liquid.

2. The electronic label preparation device that is easy to load according to claim 1, characterized in that: A combined filling strip plate A (218) is fixed evenly on the upper and lower sides of the front end surfaces of the two concave strips A (215) fixed inside the circular metal shell (214), and a combined filling strip plate B (219) is fixed on the upper and lower sides of the rear end surfaces of the two concave strips B (220), the front end surfaces of the combined filling strip plate B (219) and the rear end surfaces of the combined filling strip plate A (218) are both arc-shaped, and the opposing surfaces of the combined filling strip plate A (218) and the combined filling strip plate B (219) are both flat surfaces; The outer surfaces of the two film substrate rolls (213) are both wrapped with electronic label substrates.

3. The electronic label preparation device that is easy to load according to claim 1, characterized in that: The moving mechanism comprises a metal base (201), a slide rail (202) is fixedly mounted on the upper end surface of the metal base (201), an electric slide table (203) is mounted on the outer surface of the slide rail (202), and the lower end surface of the square metal shell (204) is fixed to the upper end surface of the electric slide table (203).

4. The device for preparing electronic labels that is easy to load according to claim 3, characterized in that: A positioning plate (231) is provided on both sides above the metal base (201), and the outer surface of the second circular metal shell (214) from the left to the right is in contact with the outer surface of the second positioning plate (231) from the left to the right.

5. The electronic label preparation device that is easy to load according to claim 1, characterized in that: A gear A (223) is fixedly provided on both sides of the middle position of the outer surface of the long rotating shaft (209), the gear A (223) is meshed with a gear B (224), the axis of the gear B (224) is connected to a gear transmission rotating shaft (225), the outer surface fixed sleeve of the gear transmission rotating shaft (225) is provided with a fifth bevel gear (226), the fifth bevel gear (226) is meshed with a sixth bevel gear (227), the axis of the sixth bevel gear (227) is connected to a synchronous transmission rotating shaft (228), the outer surface fixed sleeve of the synchronous transmission rotating shaft (228) is provided with a synchronous sprocket (229), and the two synchronous sprockets (229) are respectively connected in series with the two transmission rollers A (216) located at the rear end of the circular metal shell (214) through a synchronous chain (230).

6. The electronic label preparation device that is easy to load according to claim 1, characterized in that: A plurality of movable rollers (4) installed inside the electronic chip placement machine (1) are provided below the metal plate (5); The four end corners of the upper end surface of the metal plate (5) are each connected to a horizontal bar cylinder (7) fixedly mounted on the inner wall of the electronic chip placement machine (1).

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