Horizontal electroplating device

Abstract

The invention provides a horizontal electroplating device. The horizontal electroplating device comprises an electroplating tank, a cup-shaped isolation tank, a cathode roller, a cathode electroplating liquid supply pipe, a cathode electroplating liquid adsorption layer and a driving assembly, the cup-shaped isolation groove is adopted, so that the effective electroplating area can be increased, and the equipment cost, power and occupied area are reduced; the cup-shaped isolation grooves are formed in the two sides of the cathode roller, so that the effective electroplating distance of the two sides of the electroplated part can be reduced, the phenomenon that coatings on the two sides of the electroplated part are thickened due to the edge effect can be avoided, and uniform electroplating is achieved; the cathode electroplating liquid adsorption layer and the cathode roller have insulativity, and power is supplied to the electroplated part by adsorbing the charged cathode electroplating liquid, so that a deplating process is not needed, the production cost can be reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of electroplating and relates to a horizontal electroplating device. Background Art

[0002] In the solar industry, the horizontal electroplating process of cells is widely used, such as BC (Back Contact) cells. Since the conductive surface and the electroplating surface of BC cells are on the same surface, the cell needs to contact the electroplating solution and the conductor at the same time to achieve electroplating.

[0003] In the current BC horizontal electroplating process, most electroplating devices use a conductive roller connected to the negative electrode of a constant current source as a cathode, and a titanium rod connected to the positive electrode of a constant current source and placed in the electroplating solution as an insoluble anode. When the cell is transferred in the tank, the cell contacts the electroplating solution and the conductive roller at the same time, so that the conductive roller, the electroplating solution, the titanium rod and the cell form a closed circuit to achieve electroplating.

[0004] However, the existing horizontal electroplating devices have many application limitations during the electroplating process, such as:

[0005] First, the conductive roller needs to be placed in an isolation tank to be isolated from the plating solution. Only when the battery cell contacts the plating solution can a closed circuit be formed for electroplating. Since there is no plating solution in the isolation tank, the area where the isolation tank is located cannot be electroplated, which will shorten the effective plating distance in the plating tank of the same length. This will lead to an increase in the number of plating tanks, making the overall length of the equipment longer and occupying plant space.

[0006] Second, once the number of electroplating tanks increases, more constant current sources, insoluble anodes, pumps and other components need to be equipped, which increases additional costs;

[0007] Third, since the conductive roller will contact the electroplating solution, the conductive roller will also be plated with a metal layer during the electroplating process. Since the conductive roller is located in an isolation tank in the equipment, the deplating method of the conductive roller is more complicated. If deplating is required, the machine needs to be shut down, which will undoubtedly increase the downtime of the equipment and reduce production capacity.

[0008] Therefore, it is necessary to provide a horizontal electroplating device. Summary of the invention

[0009] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a horizontal electroplating device for solving the above-mentioned series of application limitation problems existing in the horizontal electroplating device in the prior art during the electroplating process.

[0010] To achieve the above-mentioned object and other related objects, the present invention provides a horizontal electroplating device, which comprises:

[0011] Electroplating tanks;

[0012] A cup-shaped isolation tank, the cup-shaped isolation tank is arranged in the electroplating tank, comprising a cathode plating liquid chamber surrounded by a first partition, a cathode plating liquid reflux chamber surrounded by the first partition and the second partition, and an anode plating liquid reflux chamber surrounded by the second partition and the third partition, the cathode plating liquid chamber, the cathode plating liquid reflux chamber and the anode plating liquid reflux chamber are isolated from the inside to the outside, and the cathode plating liquid chamber is provided with a cathode plating liquid overflow port, the cathode plating liquid reflux chamber is provided with a cathode plating liquid outlet, and the anode plating liquid reflux chamber is provided with an anode plating liquid outlet;

[0013] A cathode roller, the cathode roller is disposed in the electroplating tank and mounted on the cup-shaped isolation tank;

[0014] a cathode plating liquid supply pipe, through which negatively charged cathode plating liquid is supplied to the cathode plating liquid chamber;

[0015] A cathode plating liquid adsorption layer, the cathode plating liquid adsorption layer is arranged at intervals on the periphery of the cathode roller, the electroplating parts are carried by the cathode plating liquid adsorption layer, and the cathode plating liquid adsorption layer is located in the corresponding cathode plating liquid cavity to adsorb the negatively charged cathode plating liquid;

[0016] A driving assembly is connected to the cathode roller to drive the cathode roller to rotate.

[0017] Optionally, the cathode plating liquid supply pipe is arranged in the cathode plating liquid chamber and / or above the cathode plating liquid chamber.

[0018] Optionally, the cathode plating solution overflow ports are arranged at equal intervals on the first partition plate.

[0019] Optionally, a cathode plating liquid reflux hole and a cathode plating liquid reflux pipe communicating with the cathode plating liquid reflux hole and the cathode plating liquid outlet are provided at the bottom of the cathode plating liquid reflux chamber, and the cathode plating liquid reflux holes are distributed at equal intervals.

[0020] Optionally, an anode plating liquid reflux hole and an anode plating liquid reflux pipe communicating with the anode plating liquid reflux hole and the anode plating liquid outlet are provided at the bottom of the anode plating liquid reflux chamber, and the anode plating liquid reflux holes are distributed at equal intervals.

[0021] Optionally, the cathode plating liquid adsorption layer includes a sponge layer or a groove roller; the cathode roller includes a PE roller, a PP roller or a PVDF roller.

[0022] Optionally, the cup-shaped isolation grooves are located on both sides of the cathode roller so that the cathode plating solution contacts the edge area of ​​the electroplated part.

[0023] Optionally, the cross-sectional shape of the cup-shaped isolation groove includes a circle, an ellipse or a rectangle.

[0024] Optionally, it further includes a pressure wheel located above the cathode roller and arranged corresponding to the cathode roller.

[0025] Optionally, the top of the third partition is serrated; and the cathode plating liquid overflow port is a lifting overflow port.

[0026] As described above, the horizontal electroplating device of the present invention includes an electroplating tank, a cup-shaped isolation tank, a cathode roller, a cathode plating liquid supply tube, a cathode plating liquid adsorption layer and a driving component, wherein the cup-shaped isolation tank includes a cathode plating liquid chamber, a cathode plating liquid reflux chamber and an anode plating liquid reflux chamber which are isolated from the inside to the outside, the cathode plating liquid supply tube can provide negatively charged cathode plating liquid to the cathode plating liquid chamber, and the cathode plating liquid adsorption layer can adsorb the cathode plating liquid to contact the electroplating part as the cathode end.

[0027] The horizontal electroplating device of the present invention adopts a cup-shaped isolation groove, which can increase the effective electroplating area and reduce equipment cost, power and floor space; the cup-shaped isolation groove is arranged on both sides of the cathode roller, which can reduce the effective electroplating distance on both sides of the electroplated part, and can avoid the phenomenon of thickening of the plating layer on both sides of the electroplated part due to the edge effect, thereby achieving uniform electroplating; the cathode plating liquid adsorption layer and the cathode roller itself are insulating, and power is supplied to the electroplated part by adsorbing the charged cathode plating liquid, so there is no need for a deplating process, which can reduce production costs and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Shown is a schematic structural diagram of a horizontal electroplating device in the prior art.

[0029] Figure 2 Shown is a schematic structural diagram of a cathode roller in an embodiment of the present invention.

[0030] Figure 3 Display as Figure 2 Schematic diagram of the cross-sectional structure along the A-A' line.

[0031] Figure 4 It is a schematic diagram showing the distribution structure of the electroplating parts, cathode rollers and pressure rollers in an embodiment of the present invention.

[0032] Figure 5 Display as Figure 4 A partial enlarged view of .

[0033] Figure 6It is a schematic diagram showing the structure of a cup-shaped isolation groove in an embodiment of the present invention.

[0034] Figure 7 Display as Figure 6 Schematic diagram of the top view structure.

[0035] Figure 8 Display as Figure 6 Schematic diagram of the cross-sectional structure along the B-B' line.

[0036] Fig. 9 Display as Figure 6 Schematic diagram of the cross-sectional structure along C-C'.

[0037] Fig.10 Shown is a schematic diagram of the three-dimensional structure of a horizontal electroplating device in an embodiment of the present invention.

[0038] Description of Reference Numerals

[0039] 1 Anode

[0040] 2 Drive rollers

[0041] 3 Cathode roller

[0042] 4 Isolation slots

[0043] 5. Battery Cell

[0044] 6 Trough

[0045] 7 Power Supply

[0046] 100 Cathode roller

[0047] 101 Stainless steel pipe

[0048] 102 PE pipe

[0049] 200 Cathodic plating solution adsorption layer

[0050] 300 Axis support

[0051] 400 Collar

[0052] 500 Bevel gear

[0053] 600 Spur Gear

[0054] 700 Cup Isolation Tank

[0055] 701 First Bulkhead

[0056] 711 Plating solution overflow port

[0057] 702 Second partition

[0058] 703 Third partition

[0059] 710 Cathode Plating Chamber

[0060] 720 Cathode plating solution reflux chamber

[0061] 721 Cathode plating solution return hole

[0062] 722 Cathode plating solution return pipe

[0063] 723 Cathode plating solution outlet

[0064] 730 Anodic Plating Solution Reflux Chamber

[0065] 731 Anode plating solution return hole

[0066] 732 Anode plating solution return pipe

[0067] 733 Anodic plating solution outlet

[0068] 800 Press Roller

[0069] 900 Plating Tank

[0070] 110 Cathode plating liquid supply pipe bracket

[0071] 120 cells DETAILED DESCRIPTION

[0072] See also Figure 1 An existing horizontal electroplating equipment is illustrated, wherein 1 represents anode, 2 represents driving roller, 3 represents cathode roller, 4 represents isolation tank, 5 represents battery sheet, 6 represents tank body, 7 represents power source, and all cathode rollers 3 are connected to the negative pole of power source 7 by wires, and anode 1 is connected to the positive pole of power source 7. The existing horizontal electroplating equipment encounters many problems in production due to the structural setting of isolation tank and cathode roller.

[0073] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0074] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0075] See also Figure 2 to Figure 10, this embodiment provides a horizontal electroplating device, the horizontal electroplating device comprising:

[0076] Plating tank 900;

[0077] A cup-shaped isolation tank 700, wherein the cup-shaped isolation tank 700 is disposed in the electroplating tank 900, and comprises a cathode plating liquid chamber 710 surrounded by a first partition plate 701, a cathode plating liquid reflux chamber 720 surrounded by the first partition plate 701 and the second partition plate 702, and an anode plating liquid reflux chamber 730 surrounded by the second partition plate 702 and the third partition plate 703. The cathode plating liquid chamber 710, the cathode plating liquid reflux chamber 720, and the anode plating liquid reflux chamber 730 are isolated from the inside to the outside, and the cathode plating liquid chamber 710 is provided with a cathode plating liquid overflow port 711, the cathode plating liquid reflux chamber 720 is provided with a cathode plating liquid outlet 723, and the anode plating liquid reflux chamber 730 is provided with an anode plating liquid outlet 733;

[0078] A cathode roller 100, wherein the cathode roller 100 is disposed in the electroplating tank 900 and mounted on the cup-shaped isolation tank 700;

[0079] a cathode plating liquid supply pipe (not shown), through which negatively charged cathode plating liquid is supplied to the cathode plating liquid chamber 710;

[0080] A cathode plating liquid adsorption layer 200, wherein the cathode plating liquid adsorption layer 200 is disposed at intervals on the periphery of the cathode roller 100, and the electroplated parts are carried by the cathode plating liquid adsorption layer 200, and the cathode plating liquid adsorption layer 200 is located in the corresponding cathode plating liquid cavity 710 to adsorb the negatively charged cathode plating liquid;

[0081] A driving assembly is connected to the cathode roller 100 to drive the cathode roller 100 to rotate.

[0082] In this embodiment, due to the use of the cup-shaped isolation groove 700, the effective electroplating area can be increased, and the equipment cost, power and floor space can be reduced; the cup-shaped isolation groove 700 is arranged on both sides of the cathode roller 100, so that the effective electroplating distance on both sides of the electroplated parts can be reduced, and the phenomenon of thickening of the plating layer on both sides of the electroplated parts due to the edge effect can be avoided, thereby achieving uniform electroplating; the cathode plating liquid adsorption layer 200 and the cathode roller 100 themselves are insulating, and power is supplied to the electroplated parts by adsorbing the charged cathode plating liquid, so there is no need for a deplating process, which can reduce production costs and improve production efficiency.

[0083] As an example, the top of the third partition 703 may be configured to be serrated to facilitate the flow of the electroplating solution, achieve a good liquid isolation effect, and prevent a large flow of solution from rushing through the partition and causing liquid cross-talk.

[0084] As an example, the cathode roller 100 includes a PE roller, a PP roller or a PVDF roller.

[0085] For details, see Figure 2 and Figure 3 In this embodiment, the cathode roller 100 includes a stainless steel tube 101 and a PE tube 102 located on the periphery of the stainless steel tube 101, so that the cathode roller 100 has sufficient strength through the stainless steel tube 101, and in order to prevent the stainless steel tube 101 from being electroplated, it is preferred to arrange the PE tube 102 covering the stainless steel tube 101 and having insulation and corrosion resistance on the periphery of the stainless steel tube 101. Of course, a PP tube or PVDF tube can also be used to cover the stainless steel tube 101, or a PE roller, PP roller or PVDF roller can be directly used as the cathode roller 100 to avoid being electroplated itself, thereby avoiding the deplating process, extending the service life of the cathode roller, reducing costs, and increasing production capacity.

[0086] As an example, the cathode plating liquid adsorption layer 200 includes a sponge layer to carry liquid for conduction. Of course, it is not limited to the sponge material. Other water-absorbent and acid-resistant materials can also be used as the cathode plating liquid adsorption layer 200, or the cathode plating liquid adsorption layer 200 can also be a groove roller to carry liquid for conduction through the threads on the groove roller.

[0087] Specifically, the cathode plating solution adsorption layer 200 can be used to adsorb the negatively charged plating solution in the cathode plating solution chamber 710. Figure 4 , Figure 5 and Fig.10 When the battery cell 120 is transferred to the cathode plating solution adsorption layer 200, the cathode plating solution in the cathode plating solution adsorption layer 200 can contact the surface of the battery cell 120, thereby serving as the cathode of the battery cell 120, and the anode plating solution in the electroplating tank 900 can serve as the anode of the battery cell 120. When the battery cell 120 contacts the cathode plating solution in the cathode plating solution adsorption layer 200 and the anode plating solution in the electroplating tank 900 at the same time, a closed circuit can be formed to perform an electroplating process on the battery cell 120.

[0088] The cathode plating liquid adsorption layer 200 is preferably made of an insulating material with good liquid absorption performance, so that it can avoid being electroplated while absorbing the cathode plating liquid, thereby avoiding the deplating process, extending the service life, reducing costs, and improving production capacity.

[0089] As an example, a pressure wheel 800 is further included, which is located above the cathode roller 100 and is arranged corresponding to the cathode roller 100 .

[0090] For details, see Figure 4 and Figure 5 When the pressing wheel 800 is set, when the battery cell 120 passes over the cathode roller 100, the pressing wheel 800 can make the battery cell 120 fully contact with the cathode plating solution adsorption layer 200 to achieve good electroplating.

[0091] In this embodiment, the driving component adopts bearing transmission, that is, the driving component may include a bevel gear 500, a spur gear 600 and a rotating shaft (not shown) connected to the bevel gear 500 and the spur gear 600, and the rotating shaft may be fixed by a shaft support 300 and a shaft ring 400, and the shaft support 300 and the shaft ring 400 may be fixed on the equipment, and the rotating shaft may rotate in the shaft support 300 and the shaft ring 400, so that when a power part such as a motor drives the bevel gear 500 and the spur gear 600 to rotate, it can synchronously drive the rotating shaft to rotate, so as to drive the cathode roller 100 to rotate, and the pressure wheel 800 can be driven to operate through the bevel gear 500, but the type of the driving component is not limited to this.

[0092] As an example, the cathode plating liquid supply pipe is disposed in the cathode plating liquid chamber 710 and / or above the cathode plating liquid chamber 710 .

[0093] For details, see Fig.10 In this embodiment, the horizontal electroplating device includes a first water washing area Q1, an electroplating area Q2 and a second water washing area Q2. The electroplating tank 900 is located in the electroplating area Q2. The type of electroplating solution in the electroplating area Q2 can be selected according to needs and is not overly limited here.

[0094] The cathode plating liquid supply pipe can be used to replenish the cathode plating liquid so that the cathode plating liquid can flow into the cathode plating liquid reflux chamber 720 along the cathode plating liquid overflow port 711, so as to ensure that the cathode plating liquid adsorption layer 200 can adsorb the cathode plating liquid with negative charge, thereby avoiding the circuit breaking phenomenon caused by the loss of cathode plating liquid.

[0095] The location of the cathode plating liquid supply pipe can be selected as required, such as being arranged in the cathode plating liquid chamber 710, or being arranged above the cathode plating liquid chamber 710. Fig.10The cathode plating liquid supply pipe is fixed on the cathode plating liquid supply pipe bracket 110, and the liquid outlet of the cathode plating liquid supply pipe is aligned with the cathode plating liquid chamber 710, and of course, it can also be aligned with the cathode plating liquid adsorption layer 200, and no excessive restrictions are made here.

[0096] In this embodiment, the cathode plating liquid reflux pipe 722 is connected to the cathode replenishing tank (not shown), a cathode titanium rod is installed in the cathode replenishing tank, and the cathode titanium rod is connected to the negative electrode of the constant current source. When the solution in the cathode replenishing tank flows into the cathode plating liquid cavity 710 through the cathode plating liquid reflux pipe 722 under the action of the pump and is adsorbed by the cathode plating liquid adsorption layer 200 or directly flows to the cathode plating liquid adsorption layer 200 and is adsorbed by the cathode plating liquid adsorption layer 200, a negatively charged cathode plating liquid can be provided, and an anode titanium mesh is installed in the electroplating tank 900, and the anode titanium mesh is connected to the positive electrode of the constant current source. When the battery cell 120 simultaneously contacts the cathode plating liquid adsorption layer 200 with the negatively charged cathode plating liquid and the positively charged anode plating liquid in the electroplating tank 900, the circuit is turned on and electroplating begins.

[0097] As an example, the cathode plating solution overflow ports 711 are arranged at equal intervals on the first separator 701 .

[0098] Specifically, when the cathode plating liquid overflow ports 711 are arranged at equal intervals on the first partition 701, the flow stability of the plating liquid can be improved, so as to improve the uniformity of electroplating. The bottom of the cathode plating liquid overflow port 711 exceeds the plane where the bottom of the cathode plating liquid adsorption layer 200 is located, so as to ensure that the cathode plating liquid adsorption layer 200 can adsorb the cathode plating liquid. The size, morphology, position distribution, etc. of the cathode plating liquid overflow port 711 are not excessively limited here.

[0099] As an example, the cathode plating solution overflow port 711 is a lifting overflow port.

[0100] Specifically, the cathode plating liquid overflow port 711 can be provided with a lifting function by, for example, setting an adjustment plate, so as to adjust the liquid level as needed, avoid liquid cross-talk, and achieve good electroplating.

[0101] As an example, the bottom of the cathode plating liquid reflux chamber 720 is provided with a cathode plating liquid reflux hole 721 and a cathode plating liquid reflux pipe 722 that penetrates the cathode plating liquid reflux hole 721 and the cathode plating liquid outlet 723, and the cathode plating liquid reflux holes 721 are distributed at equal intervals.

[0102] As an example, the bottom of the anode plating liquid reflux chamber 730 is provided with an anode plating liquid reflux hole 731 and an anode plating liquid reflux pipe 732 which is connected to the anode plating liquid reflux hole 731 and the anode plating liquid outlet 733, and the anode plating liquid reflux holes 731 are distributed at equal intervals.

[0103] For details, see Figure 6 to Figure 9 In this embodiment, the cathode plating liquid reflux hole 721 is provided at the bottom of the cathode plating liquid reflux chamber 720, and the cathode plating liquid reflux pipe 722 is connected with the cathode plating liquid reflux hole 721 and the cathode plating liquid outlet 723, so that the cathode plating liquid in the cathode plating liquid reflux chamber 720 can be reused to reduce costs. Similarly, in this embodiment, the anode plating liquid reflux hole 731 is provided at the bottom of the anode plating liquid reflux chamber 730, and the anode plating liquid reflux pipe 732 is connected with the anode plating liquid reflux hole 731 and the anode plating liquid outlet 733, so that the anode plating liquid in the anode plating liquid reflux chamber 730 can be reused. Timely discharge of the cathode plating liquid and the anode plating liquid can also avoid the problem of cross-liquid of the plating liquid.

[0104] Furthermore, the cathode plating solution reflux holes 721 and / or the anode plating solution reflux holes 731 are arranged to be equally spaced, which can improve the flow stability of the plating solution and improve the uniformity of electroplating. The size, shape, and position distribution of the individual pipes in the cup-shaped isolation tank 700 are not excessively limited here.

[0105] As an example, the cross-sectional shape of the cup-shaped isolation trench 700 includes a circle, an ellipse or a rectangle.

[0106] For details, see Figure 6 and Figure 7 In this embodiment, the cross-sectional shape of the cup-shaped isolation groove 700 is rectangular, but the cross-sectional shape of the cup-shaped isolation groove 700 is not limited thereto, and a circular or elliptical shape that can make the liquid have better fluidity can also be selected. Figure 4 The installation position between the cathode roller 100 and the cup-shaped isolation groove 700 may be provided with an O-ring seal or the like to avoid liquid cross-talk at the installation position.

[0107] As an example, the cup-shaped isolation groove 700 is preferably located on both sides of the cathode roller 100 so that the cathode plating solution contacts the edge area of ​​the plated part.

[0108] Specifically, Figure 4In this embodiment, the cup-shaped isolation groove 700 is arranged on both sides of the cathode roller 100, which can increase the effective electroplating area and reduce equipment cost, power and floor space; it can reduce the effective electroplating distance on both sides of the battery cell 120, and can avoid the phenomenon that the plating layer on both sides of the battery cell 120 is thickened due to the edge effect, thereby achieving uniform electroplating.

[0109] In summary, the horizontal electroplating device of the present invention includes an electroplating tank, a cup-shaped isolation tank, a cathode roller, a cathode plating liquid supply tube, a cathode plating liquid adsorption layer and a driving component, wherein the cup-shaped isolation tank includes a cathode plating liquid chamber, a cathode plating liquid reflux chamber and an anode plating liquid reflux chamber which are isolated from the inside to the outside, the cathode plating liquid supply tube can provide negatively charged cathode plating liquid to the cathode plating liquid chamber, and the cathode plating liquid adsorption layer can adsorb the cathode plating liquid to contact the electroplating part as the cathode end.

[0110] The horizontal electroplating device of the present invention adopts a cup-shaped isolation groove, which can increase the effective electroplating area and reduce equipment cost, power and floor space; the cup-shaped isolation groove is arranged on both sides of the cathode roller, which can reduce the effective electroplating distance on both sides of the electroplated part, and can avoid the phenomenon of thickening of the plating layer on both sides of the electroplated part due to the edge effect, thereby achieving uniform electroplating; the cathode plating liquid adsorption layer and the cathode roller itself are insulating, and power is supplied to the electroplated part by adsorbing the charged cathode plating liquid, so there is no need for a deplating process, which can reduce production costs and improve production efficiency.

[0111] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A horizontal electroplating device, characterized in that: The horizontal electroplating device comprises: Electroplating tanks; A cup-shaped isolation tank, the cup-shaped isolation tank is arranged in the electroplating tank, comprising a cathode plating liquid chamber surrounded by a first partition, a cathode plating liquid reflux chamber surrounded by the first partition and the second partition, and an anode plating liquid reflux chamber surrounded by the second partition and the third partition, the cathode plating liquid chamber, the cathode plating liquid reflux chamber and the anode plating liquid reflux chamber are isolated from the inside to the outside, and the cathode plating liquid chamber is provided with a cathode plating liquid overflow port, the cathode plating liquid reflux chamber is provided with a cathode plating liquid outlet, and the anode plating liquid reflux chamber is provided with an anode plating liquid outlet; A cathode roller, the cathode roller is disposed in the electroplating tank and mounted on the cup-shaped isolation tank; a cathode plating liquid supply pipe, through which negatively charged cathode plating liquid is supplied to the cathode plating liquid chamber; A cathode plating liquid adsorption layer, the cathode plating liquid adsorption layer is arranged at intervals on the periphery of the cathode roller, the electroplating parts are carried by the cathode plating liquid adsorption layer, and the cathode plating liquid adsorption layer is located in the corresponding cathode plating liquid cavity to adsorb the negatively charged cathode plating liquid; A driving assembly is connected to the cathode roller to drive the cathode roller to rotate.

2. The horizontal electroplating device according to claim 1, characterized in that: The cathode plating liquid supply pipe is arranged in the cathode plating liquid cavity and / or arranged above the cathode plating liquid cavity.

3. The horizontal electroplating device according to claim 1, characterized in that: The cathode plating solution overflow ports are arranged on the first partition plate at equal intervals.

4. The horizontal electroplating device according to claim 1, characterized in that: The bottom of the cathode plating liquid reflux chamber is provided with a cathode plating liquid reflux hole and a cathode plating liquid reflux pipe which is connected with the cathode plating liquid reflux hole and the cathode plating liquid outlet, and the cathode plating liquid reflux holes are distributed at equal intervals.

5. The horizontal electroplating device according to claim 1, characterized in that: The bottom of the anode plating liquid reflux chamber is provided with an anode plating liquid reflux hole, and an anode plating liquid reflux pipe which is connected with the anode plating liquid reflux hole and the anode plating liquid outlet, and the anode plating liquid reflux holes are distributed at equal intervals.

6. The horizontal electroplating device according to claim 1, characterized in that: The cathode plating liquid adsorption layer includes a sponge layer or a groove roller; the cathode roller includes a PE roller, a PP roller or a PVDF roller.

7. The horizontal electroplating device according to claim 1, characterized in that: The cup-shaped isolation grooves are located on both sides of the cathode roller so that the cathode plating solution contacts the edge area of ​​the electroplated part.

8. The horizontal electroplating device according to claim 1, characterized in that: The cross-sectional shape of the cup-shaped isolation groove includes a circle, an ellipse or a rectangle.

9. The horizontal electroplating device according to claim 1, characterized in that: It also includes a pressure wheel located above the cathode roller and arranged corresponding to the cathode roller.

10. The horizontal electroplating device according to claim 1, characterized in that: The top of the third partition is serrated; the cathode plating solution overflow port is a lifting overflow port.

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