A TMAH etching tank flow plate for silicon pressure sensor and its application

Abstract

The present invention discloses a TMAH etching tank flow equalizer plate for silicon pressure sensor and an etching tank for its application, comprising a plate body, the plate body having a flow equalizer hole, the plate body being installed in the etching tank, and the bottom of the etching tank having a liquid inlet hole, the liquid inlet hole being opposite to the plate body, and different from the prior art, the bottom of the plate body is installed with an auxiliary flow equalizer plate opposite to the liquid inlet hole; the auxiliary flow equalizer plate comprises a mounting part, the mounting part is installed on the plate body, a plate body is vertically rotatably mounted on the mounting part, the axis of rotation of the plate body relative to the mounting part is parallel to the axis of the liquid inlet hole, the plate body has a part opposite to the liquid inlet hole, and the liquid discharged from the liquid inlet hole impacts the plate body and drives the plate body to rotate. In the present invention, the structure is simple, and the auxiliary flow equalizer plate is opposite to the liquid inlet hole to avoid the liquid in the liquid inlet hole directly impacting the flow equalizer hole opposite to it, thereby increasing the pressure consistency of the liquid discharged from multiple flow equalizer holes.

Description

Technical Field

[0001] The invention relates to the technical field of single crystal growth post-processing devices, and in particular to a TMAH etching tank flow-distributing plate for a silicon pressure sensor and an etching tank used therein. Background Art

[0002] The TMAH cleaning area is a key device for preparing pressure sensors. Its main purpose is to corrode silicon through chemical reactions to achieve the purpose of preparing high-precision sensitive diaphragms. The diaphragm is used to sense external pressure changes, thereby changing the resistance value to achieve the function of detecting pressure. Therefore, the uniformity of the diaphragm thickness directly affects the accuracy of the device in measuring pressure.

[0003] The flow plate of the existing trough equipment is mainly used for cleaning processes in the semiconductor field. For example, Chinese utility model patents with announcement numbers CN217043763U, CN207250546U and CN202989355U disclose a flow plate for cleaning processes in the photovoltaic field. This type of process has low requirements for the consistency of the flow plate and the flow field. Therefore, the flow plate cannot be used for the preparation requirements of the sensitive diaphragm of the pressure sensor.

[0004] Moreover, the flow equalizer plate is installed in the cleaning area. The bottom of the cleaning area is generally provided with a liquid inlet hole. TMAH (tetramethylammonium hydroxide) passes through the liquid inlet hole and then through the flow equalizer hole of the flow equalizer plate to clean the pressure sensor diaphragm. Since there are multiple flow equalizer holes on the flow equalizer plate, generally there is only one or two liquid inlets. Generally, the flow field of TMAH discharged from the flow equalizer hole opposite to the liquid inlet hole is relatively larger. Therefore, it affects the consistency of the flow field to a certain extent. Summary of the invention

[0005] In order to solve the technical problems existing in the background technology, the present invention proposes a TMAH etching tank flow plate for a silicon pressure sensor and an etching tank used therein.

[0006] The present invention proposes a flow equalizer plate for a TMAH etching tank of a silicon pressure sensor, comprising a plate body, the plate body having a flow equalizer hole, the plate body being installed in the etching tank, and the bottom of the etching tank having a liquid inlet hole, the liquid inlet hole being opposite to the plate body, and different from the prior art, the bottom of the plate body is installed with an auxiliary flow equalizer plate opposite to the liquid inlet hole;

[0007] The auxiliary flow-uniform disk includes a mounting part, which is mounted on the plate body. A disk body is vertically rotatably mounted on the mounting part. The axis of rotation of the disk body relative to the mounting part is parallel to the axis of the liquid inlet hole. The disk body has a portion opposite to the liquid inlet hole. Liquid discharged from the liquid inlet hole impacts the disk body and drives the disk body to rotate.

[0008] Preferably, the outer diameter of the disk body is larger than the diameter of the liquid inlet hole. Specifically, the outer diameter of the disk body is 1.5-3 times the diameter of the liquid inlet hole.

[0009] In order to further reduce the consistency of the pressure of the liquid discharged from the multiple flow-distributing holes, preferably, at least two groups of the auxiliary flow-distributing disks are provided, and at least two groups of the auxiliary flow-distributing disks are circumferentially distributed outside the axis of the liquid inlet hole.

[0010] In order to further reduce the consistency of the pressure of the liquid discharged from the multiple flow-distributing holes, preferably, the disk bodies of at least two groups of the auxiliary flow-distributing disks are distributed along the axial direction of the liquid inlet hole.

[0011] Preferably, a plurality of flushing grooves are formed at the bottom end of the tray.

[0012] Preferably, a stirring protrusion is provided at the top of the disc body along its radial direction, and the stirring protrusion forms a stirring interval with the disc body or plate body located above it.

[0013] Preferably, a reflow groove is formed at the bottom of the plate body, and the reflow groove is located outside the auxiliary flow equalizing plate.

[0014] Preferably, at least four groups of the reflow grooves are provided, and the reflow grooves are connected to the flow-uniforming holes located at the corners of the plate body.

[0015] Preferably, the diameter of the flow-uniform holes is 1-3 mm, and the distance between any two adjacent flow-uniform holes is 1.5-3 times the diameter of the flow-uniform holes.

[0016] A corrosion tank comprises a shell having a cleaning area and a liquid outlet tank, and also comprises the above-mentioned flow equalizer plate, wherein an extension ring is provided in the cleaning area, the plate body is mounted on the extension ring and divides the cleaning area into a corrosion area and a liquid inlet area, the liquid inlet hole is connected to the liquid inlet area, the flow equalizer hole connects the liquid inlet area and the corrosion area, and the auxiliary flow equalizer plate is located in the liquid inlet area.

[0017] Preferably, a fixing hole is opened on the plate body, and the plate body is installed on the extension ring by installing a fixing piece in the fixing hole; an auxiliary through hole is opened on the plate body, and the auxiliary through hole is opposite to the extension ring, thereby increasing its flow uniformity effect to a certain extent.

[0018] In the present invention, the proposed TMAH etching tank flow plate for silicon pressure sensor and the etching tank used therein have a simple structure. By relative positioning of the auxiliary flow plate to the liquid inlet hole, the liquid in the liquid inlet hole is prevented from directly impacting the flow hole opposite to it, thereby increasing the pressure consistency of the liquid discharged from multiple flow holes. By discharging liquid from the liquid inlet hole to flush the plate body and causing the plate body to rotate, the stirring effect on the liquid is further achieved while ensuring the consistency of the flow field.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the flow equalizer of the present invention;

[0021] Figure 2 This is a partial enlarged view of the auxiliary flow-uniform disk of the present invention;

[0022] Figure 3 It is a schematic diagram of the local structure of the disk body in some embodiments of the present invention;

[0023] Figure 4 It is a partial cross-sectional view of the plate body of the present invention;

[0024] Figure 5 It is a schematic diagram of the corrosion tank structure of the present invention;

[0025] Figure 6 For the present invention Figure 5 A cross-sectional view of

[0026] Figure 7 For the present invention Figure 6 A partial enlarged view of the middle A area;

[0027] In the figure: 1. plate body; 10. reflux groove; 11. fixing hole; 12. auxiliary through hole; 13. connecting channel; 2. uniform flow hole; 3. liquid inlet hole; 4. auxiliary uniform flow disk; 40. mounting part; 41. disk body; 410. flushing groove; 5. stirring protrusion; 6. shell; 60. extension ring; 7. cleaning area; 70. corrosion area; 71. liquid inlet area; 8. liquid outlet groove; 9. fixing part. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar symbols throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] like Figure 1-Figure 4 The illustrated flow equalizer plate for a TMAH etching tank of a silicon pressure sensor comprises a plate body 1, a flow equalizer hole 2 is formed on the plate body 1, the plate body 1 is installed in the etching tank, and a liquid inlet hole 3 is formed at the bottom of the etching tank, and the liquid inlet hole 3 is opposite to the plate body 1. Different from the prior art, an auxiliary flow equalizer plate 4 opposite to the liquid inlet hole 3 is installed at the bottom of the plate body 1;

[0030] The auxiliary uniform flow disk 4 includes a mounting member 40, which is mounted on the plate body 1. The mounting member 40 is provided with a disk body 41 which is vertically rotatably mounted on the mounting member 40. The disk body 41 is rotatably mounted on the mounting member 40 through a bearing. The axis of rotation of the disk body 41 relative to the mounting member 40 is parallel to the axis of the liquid inlet hole 3, that is, the axis of rotation of the disk body 41 relative to the plate body 1 deviates from the axis of the liquid inlet hole 3. The disk body 41 has a portion opposite to the liquid inlet hole 3. The liquid discharged from the liquid inlet hole 3 impacts the disk body 41 and drives the disk body 41 to rotate, thereby preventing the liquid discharged from the liquid inlet hole 3 from directly impacting the uniform flow hole 2 opposite thereto, thereby ensuring the consistency of the flow field, and at the same time, the rotating disk body 41 realizes the stirring of the corrosive liquid.

[0031] Preferably, the outer diameter of the disk body 41 is larger than the aperture of the liquid inlet hole 3. Specifically, the outer diameter of the disk body 41 is 1.5-3 times the aperture of the liquid inlet hole 3. In the present embodiment, the outer diameter of the disk body 41 is twice the aperture of the liquid inlet hole 3. Specifically, preferably, the mounting member 40 is detachably mounted on the plate body 1. Specifically, the mounting member 40 can be fixed to the plate body 1 by screws, or can be mounted on the plate body 1 by snap-fitting. Different types of auxiliary flow uniforming disks 4 can be replaced according to the size of the liquid inlet hole 3 or the flow rate of the liquid inlet hole 3.

[0032] In order to further reduce the consistency of the pressure of the liquid discharged from the multiple flow-distributing holes 2, at least two groups of auxiliary flow-distributing plates 4 are provided, at least two groups of auxiliary flow-distributing plates 4 are circumferentially distributed outside the axis of the liquid inlet hole 3, at least two groups of auxiliary flow-distributing plates have their plates 41 distributed along the axis direction of the liquid inlet hole 3, and at least two groups of auxiliary flow-distributing plates have their plates 41 cross-distributed in the transverse direction and cover the liquid inlet hole 3. In the present embodiment, four groups of auxiliary flow-distributing plates 4 are provided, and the four groups of flow-distributing plates are distributed along the axis direction of the liquid inlet hole 3.

[0033] Preferably, a plurality of flushing grooves 410 are formed at the bottom end of the disc body 41. Preferably, the depth of the flushing grooves 410 gradually becomes shallower from the end away from the axis of the disc body 41 to the end close to the axis of the disc body 41, further increasing the liquid discharged from the liquid inlet hole 3 to flush the disc body 41 and drive the disc body 41 to rotate.

[0034] Preferably, the top of the disk body 41 is provided with a stirring protrusion 5 along its radial direction, and the stirring protrusion 5 forms a stirring interval with the disk body 41 or the plate body 1 located above it. Under the premise of increasing the stirring effect, the fluid formed by the stirring protrusion 5 stirring the corrosive liquid has a certain degree of impact on the liquid discharged directly from the liquid inlet hole 3 and the impact force on the disk body 41 located above, thereby further increasing the flow field consistency.

[0035] Preferably, a reflux groove 10 is opened at the bottom of the plate body 1, and the reflux groove 10 is located outside the auxiliary uniform flow plate 4. The reflux groove 10 is a blind hole. The liquid colliding with the reflux groove 10 flows back to the bottom of the plate body 1, which increases the consistency of the flow field to a certain extent.

[0036] Preferably, at least four groups of reflow grooves 10 are provided, and the reflow grooves 10 are connected to the uniform flow holes 2 located at the corners of the plate body 1. Specifically, the plate body 1 includes an upper plate and a lower plate, and the upper plate and the lower plate are fixed by welding. In order to facilitate the connection between the reflow grooves 10 and the uniform flow holes 2 at the corners, the consistency of the flow field is increased to a certain extent.

[0037] Preferably, the aperture of the flow-uniform hole 2 is 1-3 mm, and the distance between any two adjacent flow-uniform holes 2 is 1.5-3 times the aperture of the flow-uniform hole 2, which further effectively improves the flow field consistency in the process tank, increases the exchange rate of the TMAH solution, increases the uniformity of the diaphragm corrosion, and improves the accuracy of the device in measuring pressure.

[0038] like Figure 5-Figure 7 The corrosion tank shown in the figure comprises a shell 6, a cleaning area 7 and a liquid outlet groove 8 are provided on the shell 6, a liquid inlet hole 3 and a liquid outlet hole are provided at the bottom of the shell 6, the liquid inlet hole 3 is connected with the cleaning area 7, the liquid outlet hole is connected with the liquid outlet groove 8, the liquid outlet groove 8 is located at the periphery of the cleaning area 7, and also comprises the above-mentioned flow equalizing plate, an extension ring 60 is provided in the cleaning area 7, a plate body 1 is installed on the extension ring 60 and divides the cleaning area 7 into a corrosion area 70 and a liquid inlet area 71, the liquid inlet hole 3 at the bottom of the cleaning area 7 is connected with the liquid inlet area 71, the flow equalizing hole 2 connects the liquid inlet area 71 with the corrosion area 70, and the auxiliary flow equalizing plate 4 is located in the liquid inlet area 71;

[0039] In actual use, the MAH (tetramethylammonium hydroxide) corrosive liquid is pumped into the liquid inlet hole 3 through a pump, enters the liquid inlet area 71, and impacts the disk body 41 of the auxiliary uniform flow disk 4 in the liquid inlet area 71. Due to the structure of the scouring groove 410 on the disk body 41 and the deviation of the axis of rotation of the disk body 41 relative to the mounting part 40 from the axis of the liquid inlet hole 3, the disk body 41 is driven to rotate. The rotating disk body 41 distributes the corrosive liquid to the surrounding of the disk body 41, avoiding the corrosive liquid in the liquid inlet hole 3 directly impacting the uniform flow hole 2 opposite thereto, thereby increasing the consistency of the flow field; further, the rotating disk body 41 stirs the liquid in the liquid inlet area 71; further, the stirring protrusions 5 on the disk body 41 can achieve stirring of the liquid, and at the same time, the stirring protrusions 5 on multiple disk bodies 41 are not vertically distributed, which increases the consistency of the flow field to a certain extent.

[0040] Preferably, a fixing hole 11 is opened on the plate body 1, and the plate body 1 is installed on the extension ring 60 by installing a fixing member 9 in the fixing hole 11. The fixing member 9 can be a screw or a fixing pin in the prior art. The fixing member 9 in this embodiment is a screw. An auxiliary through hole 12 is opened on the plate body 1, and the auxiliary through hole 12 is opposite to the upper surface where the extension ring 60 and the plate body 1 are in contact, thereby increasing its uniform flow effect to a certain extent. Specifically, part of the liquid discharged from the gap between the plate body 1 and the extension ring 60 enters the corrosion area 70 from the auxiliary through hole.

[0041] Preferably, in some embodiments, there is a connecting channel 13 between the auxiliary through hole 12 and the reflux groove 10, so that the liquid in the reflux groove 10 can be discharged through the auxiliary through hole 12, thereby further increasing the uniform flow effect while increasing the stability of the connection between the plate body 1 and the extension ring 60.

[0042] It should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "circumferential", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0043] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrated; it can be mechanically connected, electrically connected, or communicable with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0045] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A flow-distributing plate for a TMAH etching tank of a silicon pressure sensor, comprising a plate body (1), the plate body (1) being provided with a flow-distributing hole (2), the plate body (1) being installed in the etching tank, and the bottom of the etching tank being provided with a liquid inlet hole (3), the liquid inlet hole (3) being opposite to the plate body (1), characterized in that: An auxiliary flow-distributing plate (4) is installed at the bottom of the plate body (1) and is opposite to the liquid inlet hole (3); The auxiliary flow-uniform disk (4) comprises a mounting member (40), wherein the mounting member (40) is mounted on the plate body (1), and a disk body (41) is mounted on the mounting member (40) for vertical rotation, wherein the axis of rotation of the disk body (41) relative to the mounting member (40) is parallel to the axis of the liquid inlet hole (3), and the disk body (41) has a portion opposite to the liquid inlet hole (3), and the liquid discharged from the liquid inlet hole (3) impacts the disk body (41) and drives the disk body (41) to rotate; At least two groups of the auxiliary flow equalizing disks (4) are provided, and at least two groups of the auxiliary flow equalizing disks (4) are circumferentially distributed outside the axis of the liquid inlet hole (3); and the disk bodies (41) of at least two groups of the auxiliary flow equalizing disks (4) are distributed along the axis direction of the liquid inlet hole (3).

2. The TMAH etching tank flow plate for silicon pressure sensor according to claim 1, characterized in that: The outer diameter of the disk body (41) is greater than the diameter of the liquid inlet hole (3).

3. The flow plate for TMAH etching tank of silicon pressure sensor according to claim 1, characterized in that: A plurality of flushing grooves (410) are formed at the bottom end of the disk body (41).

4. The flow plate for TMAH etching tank of silicon pressure sensor according to claim 3, characterized in that: The depth of the scouring groove (410) gradually decreases from an end away from the axis of the disc body (41) to an end close to the axis of the disc body (41).

5. The flow plate for TMAH etching tank of silicon pressure sensor according to any one of claims 1 to 4, characterized in that: The top end of the disk body (41) is provided with a stirring protrusion (5) along its radial direction, and the stirring protrusion (5) forms a stirring interval with the disk body (41) or the plate body (1) located above it.

6. The flow plate for TMAH etching tank of silicon pressure sensor according to claim 1, characterized in that: A reflow groove (10) is provided at the bottom of the plate body (1), and the reflow groove (10) is located outside the auxiliary flow-uniform plate (4).

7. The flow plate for TMAH etching tank of silicon pressure sensor according to claim 6, characterized in that: At least four groups of the reflow grooves (10) are provided, and the reflow grooves (10) are connected to the flow-uniform holes (2) located at the corners of the plate body (1).

8. The flow plate for TMAH etching tank of silicon pressure sensor according to claim 1, characterized in that: The diameter of the flow-uniform holes (2) is 1-3 mm, and the distance between any two adjacent flow-uniform holes (2) is 1.5-3 times the diameter of the flow-uniform holes (2).

9. A corrosion tank, comprising a shell (6), wherein the shell (6) has a cleaning area (7) and a liquid outlet tank (8), characterized in that: It also includes a flow equalizer plate as described in any one of claims 1 to 8, wherein an extension ring (60) is provided in the cleaning area (7), the plate body (1) is installed on the extension ring (60) and divides the cleaning area (7) into a corrosion area (70) and a liquid inlet area (71), the liquid inlet hole (3) is connected to the liquid inlet area (71), the flow equalizer hole (2) connects the liquid inlet area (71) and the corrosion area (70), and the auxiliary flow equalizer plate (4) is located in the liquid inlet area (71).

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