A SOC test device for gallium nitride semiconductor chips
By designing a closed operating device and a cleaning and vacuuming device in the gallium nitride semiconductor chip SOC testing equipment, the problem of the equipment being susceptible to factors such as dust is solved, the normal operation and automatic cleaning of the equipment are achieved, and the service life of the equipment is extended.
Patent Information
- Application Number
- CN202411900170.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2044-12-23
AI Technical Summary
Existing gallium nitride semiconductor chip SOC testing equipment is susceptible to factors such as dust, humidity, and magnetic fields, which will cause the equipment to not operate normally and will damage the equipment if it is not cleaned in time.
A test device including a closed operating device and a cleaning and vacuum cleaner device is designed. The closed operating device is used to seal the microscope and the stage to prevent the influence of dust and other factors; the cleaning and vacuum cleaner device automatically cleans the microscope and the stage through the blower and the exhaust fan.
It effectively prevents the impact of dust, humidity, magnetic field and other factors on the equipment, ensures the normal operation of the probe table, and reduces manual cleaning errors and damage through the automatic cleaning function, and extends the service life of the equipment.
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Figure CN119355495B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip SOC testing equipment, and in particular to a SOC testing equipment for a gallium nitride semiconductor chip. Background Art
[0002] Gallium nitride is an inorganic substance with the chemical formula GaN. It is a compound of nitrogen and gallium and a direct bandgap semiconductor. Gallium nitride has the comprehensive advantages of wide bandgap, high electron mobility, high switching frequency, low on-resistance, high voltage resistance, and high temperature resistance. The wider bandgap enables gallium nitride to operate at higher voltages, while the higher electron mobility improves the current driving capability and response speed, significantly reduces heat dissipation and improves power efficiency. Therefore, it is widely used in SOC chip manufacturing. It should be noted that the probe station is mainly used in the testing of the semiconductor industry, optoelectronic industry, integrated circuits and packaging, and is widely used in the research and development of precision electrical measurements of complex and high-speed devices, aiming to ensure quality and reliability, and reduce the research and development time and the cost of device manufacturing processes.
[0003] When the probe station tests the chip, the chip is fixed on the stage, and then the chip can be tested by adjusting the probe holder to the appropriate position. At the same time, the test process can be observed through a microscope to facilitate operation. However, microscopes and stages are relatively sophisticated equipment. These devices are easily affected by factors such as dust, humidity, and magnetic fields in the surrounding environment. Therefore, long-term exposure affects the equipment, which in turn causes the probe station to fail to operate normally, resulting in poor test accuracy or even inability to test. At the same time, subtle changes are often not easy to detect, posing hidden dangers. In addition, after the probe station is used, cleaning of the microscope and stage is an essential step, but in the actual testing process, the staff often forgets to clean or does not clean in time due to negligence, which causes these stains to seriously affect the use of the equipment or even damage the equipment. Summary of the invention
[0004] The object of the present invention is to provide a SOC testing device for gallium nitride semiconductor chips to solve the problems raised in the above background technology.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A test device for gallium nitride semiconductor chip SOC, comprising a test main frame and a microscope, wherein a mounting bracket is mounted on the test main frame, the microscope is mounted on the mounting bracket, an objective lens and an eyepiece are mounted on the bottom and top of the microscope respectively, and a stage for mounting chips is mounted on the test main frame, a mounting platform is provided on the test main frame, and a plurality of probe seats are provided on the mounting platform;
[0007] It also includes a closed operating device, which is installed on the mounting bracket and is used to close the microscope and the stage; the closed operating device includes four lens closing boxes and two driven closing boxes, the four lens closing boxes are used to close the objective lens and the eyepiece respectively, and the two driven closing boxes are used to close the stage, and the two lens closing boxes and the driven closing boxes located on the same side are connected to an opening and closing frame, and an adapter frame is installed on the mounting bracket, and the two opening and closing frames are both slidably installed on the adapter frame;
[0008] It also includes a cleaning and dust collection device, which is installed in the closed operating device and is used to vacuum and clean the microscope and the stage; the cleaning and dust collection device includes a blower and an exhaust fan, which are both installed on the test main frame, and the blower and the exhaust fan are respectively connected to a blowing pipe and an exhaust pipe, and the blowing pipe is connected to three transfer boxes, which are respectively installed on two of the lens closing boxes and the driven closing boxes, and the exhaust pipe is connected to the other two lens closing boxes and the driven closing boxes, and cleaning slide bars for cleaning are slidably installed in the lens closing box and the driven closing box.
[0009] Furthermore, in a preferred embodiment of the present invention, the closed operating device further comprises a push-pull rod, the push-pull rod is movably mounted in the adapter frame, a return spring is mounted at one end of the push-pull rod, and the other end of the return spring is mounted in the adapter frame;
[0010] A contact plate is installed on the top end of the push-pull rod, and the contact surface of the contact plate is made of soft material.
[0011] Furthermore, in a preferred embodiment of the present invention, a transverse groove is provided on the adapter frame, and the two opening and closing frames are slidably installed in the two transverse grooves respectively;
[0012] A pull-back spring is installed on one side of the opening and closing frame, and the other end of the pull-back spring is installed on the inner wall of the transverse displacement groove.
[0013] Furthermore, in a preferred embodiment of the present invention, a push slider is installed at one end of the two opening and closing frames, and a transfer rod is rotatably installed on the two pushing sliders, and the two transfer rods are rotatably connected;
[0014] A driving shaft is rotatably installed in the two transfer rods, and the driving shaft is installed on the push-pull rod. A transfer shaft is installed on the two push sliders, and the two transfer shafts are rotatably installed on the two transfer rods respectively.
[0015] Furthermore, in a preferred embodiment of the present invention, a central shaft is rotatably mounted on the inner walls of the two lens sealing boxes and the driven sealing box located on the same side, and a driving rotating column is rotatably mounted on the two cleaning slides;
[0016] The two driving rotating columns are movably connected, and the two driving rotating columns are respectively installed on the two rotating shafts.
[0017] Furthermore, in a preferred embodiment of the present invention, a rotation hole is provided on the cleaning slide bar, and the driving rotating column is rotatably installed in the rotation hole;
[0018] A driving groove is provided in an annular and inclined manner on the driving rotating column, and a driving ball block is installed on the inner wall of the rotating hole, and the driving ball block is located in the driving groove.
[0019] Furthermore, in a preferred embodiment of the present invention, an end portion of one of the driving rotating columns is provided with an alignment slot, and a corresponding end portion of the other driving rotating column is provided with a block;
[0020] The end of the clamping block is arranged in an arc shape, and one of the driving rotating columns is clamped in the alignment clamping groove through the clamping block;
[0021] A time delay switch is embedded in the end face of one of the driven closing boxes, and the two driven closing boxes are closed to squeeze and trigger the time delay switch.
[0022] Furthermore, in a preferred embodiment of the present invention, a rotating shaft is rotatably installed in the transfer box, and a plurality of blowing blades are equidistantly installed in an annular manner on the rotating shaft;
[0023] Bevel gears are installed on the rotating shaft and one of the intermediate shafts, and the two bevel gears are meshed with each other.
[0024] Furthermore, in a preferred embodiment of the present invention, a lifting and separating device is further included, wherein the lifting and separating device is installed on the test main frame, and the lifting and separating device is used to lift the mounting platform;
[0025] Four support columns are installed on the test main frame, and lifting rods are movably installed in the four support columns. The four lifting rods are installed on the top side of the installation platform.
[0026] Furthermore, in a preferred embodiment of the present invention, a lifting slot is provided on the top side of the support column, the bottom end of the lifting rod extends into the lifting slot, and a return spring is installed, and the bottom end of the return spring is installed on the bottom inner wall of the lifting slot;
[0027] Lifting plates are installed on the two opening and closing frames, and the opening and closing frames drive the lifting plates to move so as to squeeze the mounting platform upward.
[0028] The beneficial effects of the SOC testing device for gallium nitride semiconductor chips proposed by the present invention are:
[0029] In the present invention, by setting up a closed operating device, after the probe station is used, two opening and closing frames drive multiple lens closing boxes and driven closing boxes to be closed. At this time, the objective lens, eyepiece and stage of the microscope are closed to avoid the objective lens, eyepiece and stage of the microscope from being affected by dust, humidity, magnetic field and other factors as much as possible, thereby ensuring the normal operation of the probe station.
[0030] Furthermore, in the present invention, by setting up a cleaning and dust collection device, after the probe station is used, when multiple lens closing boxes and driven closing boxes are reset and closed, the blower and the exhaust fan are started, and the blower blows air and blows it into multiple transfer boxes through the blowing pipe to clean the objective lens, eyepiece and stage. At the same time, the exhaust fan is used to draw away the exhaust gas, and the cleaning slide bar moves back and forth during blowing, so that the objective lens, eyepiece and stage of the microscope are automatically cleaned, thereby achieving the purpose of sufficient cleaning.
[0031] Furthermore, in the present invention, by setting up a lifting and separation device, when the opening and closing frame is unfolded, the lifting plate is driven to separate from the mounting table. At this time, under the return force of multiple reset springs, multiple lifting rods are pulled downward, so that the lifting rods drive the mounting table to move downward. At this time, the mounting table drives multiple probe seats to move downward to test the chip. Similarly, when the opening and closing frame is reset, the mounting table drives multiple probe seats to move upward, thereby avoiding the problem of affecting the probe seats when the loading platform is closed. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 A schematic diagram of the three-dimensional structure of a SOC testing device for a gallium nitride semiconductor chip provided by an embodiment of the present invention;
[0033] Figure 2 A schematic diagram of the structure of the connection between a test main frame and a closed operating device and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0034] Figure 3 A schematic diagram of the structure of the connection between a lens sealing box and a transfer box and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0035] Figure 4 A schematic diagram of the structure of the connection between an adapter frame and an opening and closing frame and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0036] Figure 5 A SOC test device for a gallium nitride semiconductor chip provided by an embodiment of the present invention Figure 4 Schematic diagram of the structure of part A;
[0037] Figure 6 A schematic diagram of a partial structure of a connection between an adapter frame and a push-pull rod and other structures for a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0038] Figure 7 A schematic diagram of the structure of the connection between a cleaning slide bar and a driving rotating column and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0039] Figure 8 A schematic diagram of the structure of the connection between a transfer box and a cleaning slider shaft and other structures for a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0040] Fig. 9 A schematic diagram of a partial cross-sectional structure of a connection between a driving rotating column and a central rotating shaft and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0041] Fig.10 A schematic diagram of a partial cross-sectional structure of a connection between a cleaning slide bar and a driving rotating column and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention;
[0042] Fig.11 A partial cross-sectional structural schematic diagram of the connection between a support column and a lifting rod and other structures of a gallium nitride semiconductor chip SOC test device provided by an embodiment of the present invention.
[0043] In the figure: 1-test main frame; 2-microscope; 3-objective lens; 4-eyepiece; 5-stage; 6-closed operating device; 601-lens closing box; 602-driven closing box; 603-adapter frame; 604-push-pull rod; 605-opening and closing frame; 606-return spring; 607-transverse groove; 608-pushing slider; 609-return spring; 610-adapter rod; 611-adapter shaft; 612-contact plate; 613-driving shaft; 7-cleaning and dust collection device; 701-transfer box; 702-blower; 703-exhaust fan; 704-pull-pull rod; 605-opening and closing frame; 606-return spring; 607-transverse groove; 608-pushing slider; 609-return spring; 610-adapter rod; 611-adapter shaft; 612-contact plate; 613-driving shaft; 701-transfer box; 702-blower; 703-exhaust fan; 704-pull-pull rod; 6 ... 04-blowing pipe; 705-exhaust pipe; 706-cleaning slide; 707-rotating hole; 708-driving rotating column; 709-driving slot; 710-driving ball block; 711-aligning slot; 712-block; 713-rotating shaft; 714-blowing blades; 715-transfer shaft; 716-bevel gear; 717-delay switch; 8-probe seat; 9-lifting and separating device; 901-support column; 902-reset spring; 903-lifting rod; 904-lifting slot; 905-lifting plate; 10-mounting bracket; 11-mounting table. DETAILED DESCRIPTION
[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.
[0045] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0046] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0047] In addition, in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invented product is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0048] In addition, the terms "horizontal", "vertical", "perpendicular" and the like do not mean that the components are required to be absolutely vertical, but can be slightly tilted. For example, "vertical" only means that its direction is more vertical than "horizontal", and does not mean that the structure must be completely vertical, but can be slightly tilted.
[0049] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0050] Please refer to the attached manual Figure 1-11 An embodiment of the present invention provides a SOC testing device for gallium nitride semiconductor chips, which includes a test main frame 1 and a microscope 2. A mounting bracket 10 is installed on the test main frame 1, and the microscope 2 is installed on the mounting bracket 10. An objective lens 3 and an eyepiece 4 are installed on the bottom and top sides of the microscope 2, respectively. A stage 5 for mounting chips is installed on the test main frame 1, and a mounting table 11 is provided on the test main frame 1, and a plurality of probe seats 8 are provided on the mounting table 11.
[0051] For further information, please refer to the attached manual. Figure 3-6 The embodiment of the present invention provides a SOC testing device for gallium nitride semiconductor chips, which also includes a closed operating device 6, which is installed on the mounting bracket 10 and is used to close the microscope 2 and the stage 5; the closed operating device 6 includes four lens closing boxes 601 and two driven closing boxes 602, the four lens closing boxes 601 are used to close the objective lens 3 and the eyepiece 4 respectively, and the two driven closing boxes 602 are used to close the stage 5, and the two lens closing boxes 601 and the driven closing boxes 602 located on the same side are connected with an opening and closing frame 605, and the mounting bracket 10 is installed with an adapter frame 603, and the two opening and closing frames 605 are both slidably installed on the adapter frame 603. It should be noted that, in the embodiment of the present invention, after the chip test is completed, the two opening and closing frames 605 drive the multiple lens closing boxes 601 and the driven closing boxes 602 to be closed. At this time, the objective lens 3 and the eyepiece 4 of the microscope 2 and the stage 5 are closed to avoid the objective lens 3 and the eyepiece 4 and the stage 5 of the microscope 2 from being affected by dust, humidity, magnetic field and other factors as much as possible, so as to ensure the normal operation of the probe station.
[0052] More specifically, in the embodiment of the present invention, it also includes a cleaning and dust collection device 7, which is installed in the closed operating device 6, and is used to vacuum and clean the microscope 2 and the stage 5; the cleaning and dust collection device 7 includes a blower 702 and an exhaust fan 703, and the blower 702 and the exhaust fan 703 are both installed on the test main frame 1, and the blower 702 and the exhaust fan 703 are respectively connected to the blow pipe 704 and the exhaust pipe 705, and the blow pipe 704 is connected to three transfer boxes 701, and the three transfer boxes 701 are respectively installed on two lens closing boxes 601 and the driven closing box 602, and the exhaust pipe 705 is connected to the other two lens closing boxes 601 and the driven closing box 602, and the lens closing box 601 and the driven closing box 602 are both slidably installed with a cleaning slide bar 706 for cleaning. It should be noted that, in the embodiment of the present invention, after use, when the multiple lens sealing boxes 601 and the driven sealing boxes 602 are reset and closed, the blower 702 and the exhaust fan 703 are started, and the blower 702 blows air and blows it into the multiple transfer boxes 701 through the blowing pipe 704, and the objective lens 3, the eyepiece 4 and the stage 5 are blown and cleaned. At the same time, the exhaust fan 703 extracts the waste gas, and when blowing, the cleaning slide bar 706 moves back and forth, and the objective lens 3 and the eyepiece 4 of the microscope 2 and the stage 5 are automatically cleaned, so as to achieve the purpose of sufficient cleaning;
[0053] It should be emphasized that the surface of the cleaning slide 706 is covered with cleaning materials corresponding to the objective lens 3, eyepiece 4 and stage 5, such as lens cleaning paper, soft cloth or other materials with similar functions, and is easy to replace. Corresponding cleaning agents can be added when necessary.
[0054] Furthermore, in the embodiment of the present invention, a SOC test device for gallium nitride semiconductor chips is provided, and the closed operation device 6 also includes a push-pull rod 604, which is movably installed in the adapter frame 603, and one end of the push-pull rod 604 is installed with a return spring 606, and the other end of the return spring 606 is installed in the adapter frame 603; in addition, a contact plate 612 is installed at the top of the push-pull rod 604, and the contact surface of the contact plate 612 is made of soft material. It should be noted that in the embodiment of the present invention, the staff can drive the push-pull rod 604 to move by squeezing the contact plate 612 with their hands or heads, thereby realizing the automatic deployment of multiple lens closure boxes 601 and driven closure boxes 602.
[0055] Please continue to refer to the instruction manual Figure 3-6, more specifically, in the embodiment of the present invention, a transverse slot 607 is provided on the adapter frame 603, and the two opening and closing frames 605 are slidably installed in the two transverse slots 607 respectively; a pull-back spring 609 is installed on one side of the opening and closing frame 605, and the other end of the pull-back spring 609 is installed on the inner wall of the transverse slot 607. It should be noted that in the embodiment of the present invention, when the opening and closing frame 605 moves, it moves horizontally in the transverse slot 607 and drives the pull-back spring 609 to be stressed, so the pull-back spring 609 can help the opening and closing frame 605 to reset.
[0056] Please continue to refer to the instruction manual Figure 3-6 , more specifically, in the embodiment of the present invention, one end of the two opening and closing frames 605 is installed with a push slider 608, and the two push sliders 608 are rotatably installed with a transfer rod 610, and the two transfer rods 610 are rotatably connected;
[0057] In addition, a driving shaft 613 is rotatably installed in the two transfer rods 610, and the driving shaft 613 is installed on the push-pull rod 604. The two push sliders 608 are both installed with a transfer shaft 611, and the two transfer shafts 611 are rotatably installed on the two transfer rods 610. It should be noted that in the embodiment of the present invention, the push-pull rod 604 moves through the driving shaft 613 to drive the two transfer rods 610 to rotate and unfold, and the two transfer rods 610 drive the two push sliders 608 to slide and unfold through the two transfer shafts 611, and the two push sliders 608 drive the two opening and closing frames 605 to slide and unfold, so that the two opening and closing frames 605 drive multiple lens closure boxes 601 and driven closure boxes 602 to unfold.
[0058] For further information, please refer to the attached manual. Figure 3 and Figure 7-10 In the embodiment of the present invention, a SOC test device for gallium nitride semiconductor chips is provided. A central rotating shaft 715 is rotatably mounted on the inner wall of two lens sealing boxes 601 and a driven sealing box 602 located on the same side. A driving rotating column 708 is rotatably mounted on two cleaning slide bars 706. The two driving rotating columns 708 are movably connected and are respectively mounted on two central rotating shafts 715. It should be noted that in the embodiment of the present invention, the two driving rotating columns 708 rotate in the two driven sealing boxes 602 through the two central rotating shafts 715.
[0059] More specifically, in the embodiment of the present invention, a rotation hole 707 is provided on the cleaning slide 706, and the driving rotating column 708 is rotatably installed in the rotation hole 707; in addition, a driving groove 709 is provided in an annular manner on the driving rotating column 708, and a driving ball block 710 is installed on the inner wall of the rotation hole 707, and the driving ball block 710 is located in the driving groove 709. It should be noted that in the embodiment of the present invention, when the driving rotating column 708 rotates, the driving ball block 710 is driven to move through the driving groove 709, thereby driving the cleaning slide 706 to move, and when the driving rotating column 708 rotates one circle, the cleaning slide 706 is driven to move back and forth once, thereby realizing that in the process of driving the rotating column 708 to rotate, the cleaning slide 706 reciprocates to fully clean the objective lens 3, the eyepiece 4 and the stage 5.
[0060] Please continue to refer to the instruction manual Figure 3 and Figure 7-10 More specifically, in the embodiment of the present invention, an end of one driving rotating column 708 is provided with an alignment slot 711, and a corresponding end of another driving rotating column 708 is provided with a clamping block 712; the end of the clamping block 712 is arc-shaped, and one driving rotating column 708 is clamped in the alignment slot 711 through the clamping block 712;
[0061] In addition, a delay switch 717 is embedded in the end surface of a driven sealing box 602, and the two driven sealing boxes 602 are closed to squeeze and trigger the delay switch 717. It should be noted that in the embodiment of the present invention, when the two driven sealing boxes 602 are closed, one driving rotating column 708 is stuck in the alignment slot 711 through the clamping block 712, so that one driving rotating column 708 is connected to the other driving rotating column 708, so that the two driving rotating columns 708 rotate synchronously, and when the two driven sealing boxes 602 are closed, the delay switch 717 is triggered, so that the blower 702 is automatically started, and the purpose of automatic cleaning is achieved;
[0062] It should be emphasized that in the embodiment of the present invention, the end of the block 712 is arc-shaped, so that when the block 712 is stuck in the alignment slot 711, it can quickly adjust its position to facilitate insertion, thereby allowing the two driving rotating columns 708 to automatically complete the connection.
[0063] More specifically, in the embodiment of the present invention, a rotating shaft 713 is rotatably installed in the transfer box 701, and a plurality of blowing blades 714 are equidistantly installed on the rotating shaft 713 in an annular manner; a bevel gear 716 is installed on each of the rotating shaft 713 and a transfer shaft 715, and the two bevel gears 716 are meshed. It should be noted that in the embodiment of the present invention, the blower 702 blows air and blows it into the plurality of transfer boxes 701 through the blowing pipe 704, and blows the plurality of blowing blades 714 to rotate, and the blowing blades 714 drive the plurality of rotating shafts 713 to rotate, and when the rotating shaft 713 rotates, it drives a bevel gear 716 to drive another bevel gear 716 to rotate, and then drives a transfer shaft 715 to rotate, and the transfer shaft 715 drives the driving rotating column 708 to rotate, and the rotation of one driving rotating column 708 drives another driving rotating column 708, so that the purpose of synchronous rotation of the two driving rotating columns 708 is achieved when blowing air.
[0064] Please refer to the instruction manual Fig.11 Furthermore, the SOC test equipment for gallium nitride semiconductor chips provided in the embodiment of the present invention further includes a lifting and separating device 9, which is installed on the test main frame 1 and is used to lift the mounting platform 11; in addition, four support columns 901 are installed on the test main frame 1, and lifting rods 903 are movably installed in the four support columns 901, and the four lifting rods 903 are installed on the top side of the mounting platform 11. It should be noted that in the embodiment of the present invention, when the mounting platform 11 moves, it moves vertically in the four support columns 901 through the four lifting rods 903.
[0065] Please continue to refer to the instruction manual Fig.11 , further specifically, in the embodiment of the present invention, a lifting slot 904 is provided on the top side of the support column 901, the bottom end of the lifting rod 903 extends into the lifting slot 904, and a return spring 902 is installed, and the bottom end of the return spring 902 is installed on the bottom inner wall of the lifting slot 904;
[0066] In addition, a lifting plate 905 is installed on both opening and closing frames 605, and the opening and closing frames 605 drive the lifting plate 905 to move, so as to squeeze the mounting platform 11 to move upward. It should be noted that in the embodiment of the present invention, when the opening and closing frames 605 are unfolded, the lifting plate 905 is driven to separate from the mounting platform 11. At this time, under the pullback force of multiple reset springs 902, multiple lifting rods 903 are pulled downward, so that the lifting rods 903 drive the mounting platform 11 to move downward, and at this time, the mounting platform 11 drives multiple probe seats 8 to move downward to test the chip.
[0067] In summary, the working principle of a SOC test device for a gallium nitride semiconductor chip provided by an embodiment of the present invention is:
[0068] When testing the chip, the staff moves by pressing the contact plate 612 with their head, and the contact plate 612 moves in the adapter frame 603 through the push-pull rod 604, and drives the return spring 606 to contract. At the same time, the push-pull rod 604 moves and drives the two adapter rods 610 to rotate and unfold through the push shaft 613. The two adapter rods 610 drive the two push sliders 608 to slide and unfold through the two adapter shafts 611. The two push sliders 608 drive the two opening and closing frames 605 to slide and unfold, and pull the two return springs 609 to be stretched. At this time, the two opening and closing frames 605 drive multiple lens closure boxes 601 and driven closure boxes 602 to unfold. At the same time, the objective lens 3 and the eyepiece 4 of the microscope 2 unfold, and drive the stage 5 to unfold. Then the staff can use the microscope 2 to place the chip on the stage 5 for operation, and the staff can use the contact plate 612 with their head to remind the staff to stay alert during operation, so as to ensure the concentration of the operation.
[0069] Further, when the opening and closing frame 605 is unfolded, the lifting plate 905 is driven to separate from the mounting platform 11. At this time, under the pullback force of the multiple reset springs 902, the multiple lifting rods 903 are pulled downward, so that the lifting rods 903 drive the mounting platform 11 to move downward. At this time, the mounting platform 11 drives the multiple probe seats 8 to move downward to test the chip;
[0070] Furthermore, after use, the contact plate 612 is released, and when the multiple lens sealing boxes 601 and the driven sealing boxes 602 are reset and closed, a driving rotating column 708 is inserted into the alignment slot 711 through the card block 712, and then the two driving rotating columns 708 are connected to close the objective lens 3 and the eyepiece 4 of the microscope 2; it should be noted that when the two driven sealing boxes 602 are closed, the delay switch 717 is squeezed and triggered, and the blower 702 and the exhaust fan 703 are started at this time, and the blower 702 blows air and blows it into the multiple transfer boxes 701 through the blowing pipe 704, and blows the multiple blowing blades 717. 14 rotates, the blowing blades 714 drive the multiple rotating shafts 713 to rotate, when the rotating shaft 713 rotates, it drives a bevel gear 716 to drive another bevel gear 716 to rotate, and then drives a transfer shaft 715 to rotate, the transfer shaft 715 drives the driving rotating column 708 to rotate, the rotation of one driving rotating column 708 drives another driving rotating column 708 to rotate, and then the two driving rotating columns 708 rotate in the two rotating holes 707, and then the driving rotating columns 708 drive the driving ball block 710 to move through the driving slot 709, and then drive the cleaning slide 706 to move;
[0071] It should be further explained that when the driving rotating column 708 rotates one circle, the driving cleaning slide bar 706 moves back and forth once, so that the cleaning slide bar 706 moves back and forth when blowing air, thereby automatically cleaning the objective lens 3 and eyepiece 4 of the microscope 2 and the stage 5 to ensure cleanliness; in addition, the exhaust fan 703 draws away the air in the lens sealing box 601 and the driven sealing box 602 through the exhaust pipe 705 to achieve the purpose of sufficient cleaning.
[0072] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A SOC test device for gallium nitride semiconductor chips, characterized in that: It comprises a test main frame and a microscope, wherein a mounting bracket is mounted on the test main frame, the microscope is mounted on the mounting bracket, an objective lens and an eyepiece are mounted on the bottom and top of the microscope respectively, and a stage for mounting a chip is mounted on the test main frame, a mounting platform is provided on the test main frame, and a plurality of probe seats are provided on the mounting platform; It also includes a closed operating device, which is installed on the mounting bracket and is used to close the microscope and the stage; the closed operating device includes four lens closing boxes and two driven closing boxes, the four lens closing boxes are used to close the objective lens and the eyepiece respectively, and the two driven closing boxes are used to close the stage, and the two lens closing boxes and the driven closing boxes located on the same side are connected to an opening and closing frame, and an adapter frame is installed on the mounting bracket, and the two opening and closing frames are both slidably installed on the adapter frame; It also includes a cleaning and dust collection device, which is installed in the closed operating device and is used to vacuum and clean the microscope and the stage; the cleaning and dust collection device includes a blower and an exhaust fan, which are both installed on the test main frame, and the blower and the exhaust fan are respectively connected to a blowing pipe and an exhaust pipe, and the blowing pipe is connected to three transfer boxes, which are respectively installed on two of the lens closing boxes and the driven closing boxes, and the exhaust pipe is connected to the other two of the lens closing boxes and the driven closing boxes, and cleaning slide bars for cleaning are slidably installed in the lens closing box and the driven closing box; The closed operation device further comprises a push-pull rod, which is movably mounted in the adapter frame, one end of which is mounted with a return spring, and the other end of which is mounted in the adapter frame; A contact plate is installed at the top end of the push-pull rod, and the contact surface of the contact plate is made of soft material; The transfer frame is provided with a transverse groove, and the two opening and closing frames are respectively slidably installed in the two transverse grooves; A pull-back spring is installed on one side of the opening and closing frame, and the other end of the pull-back spring is installed on the inner wall of the transverse displacement groove; One end of the two opening and closing frames is equipped with a push slider, and the two push sliders are rotatably equipped with a transfer rod, and the two transfer rods are rotatably connected; A driving shaft is rotatably installed in the two transfer rods, and the driving shaft is installed on the push-pull rod. A transfer shaft is installed on the two push sliders, and the two transfer shafts are rotatably installed on the two transfer rods respectively.
2. The SOC testing device for gallium nitride semiconductor chips according to claim 1, characterized in that: A central shaft is rotatably mounted on the inner walls of the two lens sealing boxes and the driven sealing box located on the same side, and a driving rotating column is rotatably mounted on the two cleaning slide bars; The two driving rotating columns are movably connected, and the two driving rotating columns are respectively installed on the two rotating shafts.
3. The SOC testing device for gallium nitride semiconductor chips according to claim 2, characterized in that: The cleaning slide bar is provided with a rotation hole, and the driving rotating column is rotatably installed in the rotation hole; A driving groove is provided in an annular and inclined manner on the driving rotating column, and a driving ball block is installed on the inner wall of the rotating hole, and the driving ball block is located in the driving groove.
4. The SOC testing device for gallium nitride semiconductor chips according to claim 3, characterized in that: An alignment slot is provided at the end of one of the driving rotating columns, and a corresponding clamping block is installed at the end of the other driving rotating column; The end of the clamping block is arranged in an arc shape, and one of the driving rotating columns is clamped in the alignment clamping groove through the clamping block; A time delay switch is embedded in the end face of one of the driven closing boxes, and the two driven closing boxes are closed to squeeze and trigger the time delay switch.
5. The SOC testing device for gallium nitride semiconductor chips according to claim 4, characterized in that: A rotating shaft is rotatably installed in the transfer box, and a plurality of blowing blades are equidistantly installed in an annular manner on the rotating shaft; Bevel gears are installed on the rotating shaft and one of the intermediate shafts, and the two bevel gears are meshed with each other.
6. The SOC testing device for gallium nitride semiconductor chips according to claim 1, characterized in that: It also includes a lifting and separating device, which is installed on the test main frame and is used to lift the mounting platform; Four support columns are installed on the test main frame, and lifting rods are movably installed in the four support columns. The four lifting rods are installed on the top side of the installation platform.
7. The SOC testing device for gallium nitride semiconductor chips according to claim 6, characterized in that: A lifting slot is provided on the top side of the support column, the bottom end of the lifting rod extends into the lifting slot and is provided with a return spring, the bottom end of the return spring being installed on the bottom inner wall of the lifting slot; Lifting plates are installed on the two opening and closing frames, and the opening and closing frames drive the lifting plates to move so as to squeeze the mounting platform upward.
Citation Information
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