Backlight module and preparation method thereof

Abstract

The invention provides a backlight module and a preparation method thereof. The backlight module comprises a back plate, a circuit board, a reflecting film, a diffusion plate and a plurality of light-emitting units, the back plate is provided with a groove, the circuit board is located at the bottom of the groove, the reflecting film is attached to the inner wall of the groove and covers the circuit board, the light-emitting units are located on the reflecting film at the bottom of the groove and penetrate through the reflecting film to be electrically connected with the circuit board, and the diffusion plate is located at an opening of the groove. According to the backlight module, the reflecting film is directly manufactured on the back plate to replace a double-faced adhesive tape to attach a reflecting sheet, so that the problem of reworking caused by attachment is avoided, the reflectivity and the optical grade are improved, the procedure of assembling the reflecting sheet by the backlight module is omitted, and the production efficiency of the backlight module is improved. In addition, the reflecting film is arranged above the circuit board, so that the reflecting effect of the reflecting film is improved. Through the improvement, the lighting effect of the backlight module is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a backlight module and a preparation method thereof. Background Art

[0002] The backlight module is a device that provides light source in a display device.

[0003] The related technology provides a backlight module, which includes a back panel, a reflective sheet, a circuit board, a light bar, a diffuser, etc. The reflective sheet is fixed to the back panel using double-sided tape during assembly, and then the circuit board, light bar and other structures are arranged on the reflective sheet, and finally the diffuser is arranged.

[0004] According to the related art, if the reflector is reworked after installation, it will cause deformation and wrinkling, thus affecting the optical quality; and the backlight module of the above structure has low light efficiency. Summary of the invention

[0005] The disclosed embodiment provides a backlight module and a method for manufacturing the same, which reduces the risk of deformation and wrinkling of the reflector sheet caused by rework and improves the optical quality and operation efficiency of the backlight module. The technical solution is as follows:

[0006] In one aspect, a backlight module is provided, the backlight module comprising:

[0007] A back plate, a circuit board, a reflective film, a diffuser plate and a plurality of light-emitting units;

[0008] The back plate has a groove, the circuit board is located at the bottom of the groove, the reflective film is attached to the inner wall of the groove and covers the circuit board, the multiple light-emitting units are located on the reflective film at the bottom of the groove and are electrically connected to the circuit board through the reflective film, and the diffuser is located at the opening of the groove.

[0009] Optionally, the material of the reflective film is a mixture of polyethylene terephthalate and titanium dioxide, a mixture of epoxy resin and titanium dioxide, or a mixture of silica gel and titanium dioxide.

[0010] Optionally, the reflective film has a thickness of 50 to 150 microns.

[0011] Optionally, the circuit board includes a plurality of light emitting unit mounting positions, the reflective film has a plurality of through holes exposing the light emitting unit mounting positions; and the plurality of light emitting units are correspondingly connected to the plurality of light emitting unit mounting positions.

[0012] Optionally, the light-emitting unit includes: a carrier, a first electrode connecting portion, a second electrode connecting portion, a light-emitting diode chip, a fluorescent layer and a light diffusion layer;

[0013] The carrier has a mounting groove, a first through hole and a second through hole, wherein the mounting groove is located between the first through hole and the second through hole;

[0014] The light-emitting diode chip is installed in the mounting groove, the first electrode connecting portion and the second electrode connecting portion are respectively connected to the two electrodes of the light-emitting diode chip, and the first electrode connecting portion and the second electrode connecting portion pass through the first through hole and the second through hole respectively, the fluorescent layer is located in the mounting groove and covers the light-emitting diode chip, and the light diffusion layer covers a side of the carrier having the mounting groove.

[0015] Optionally, the first electrode connecting part and the second electrode connecting part both include a first connecting part, a second connecting part and a third connecting part, one end of the first connecting part is connected to the light-emitting diode chip, the other end of the first connecting part extends out of the mounting groove, the second connecting part passes through the first through hole or the second through hole, one end of the second connecting part is connected to the other end of the first connecting part, the other end of the second connecting part is connected to the third connecting part, and the third connecting part is located on a side of the carrier opposite to the mounting groove.

[0016] On the other hand, a method for preparing a backlight module is provided, and the method for preparing the backlight module comprises:

[0017] Making a back plate, wherein the back plate has a groove;

[0018] Making a circuit board on the back plate, wherein the circuit board is located at the bottom of the groove;

[0019] A reflective film is made on the back plate, and the reflective film is attached to the inner wall of the groove and covers the circuit board;

[0020] Installing a plurality of light-emitting units, wherein the plurality of light-emitting units are located on the reflective film at the bottom of the groove and are electrically connected to the circuit board through the reflective film;

[0021] A diffusion plate is manufactured, wherein the diffusion plate is located at the opening of the groove.

[0022] Optionally, manufacturing a circuit board on the backplane includes:

[0023] forming an insulating layer on the back plate;

[0024] forming a layer of copper foil on the insulating layer;

[0025] The copper foil is patterned to form a circuit layer to obtain the circuit board.

[0026] Optionally, the method further comprises: manufacturing the light-emitting unit in the following manner:

[0027] Providing a carrier, the carrier having a mounting groove, a first through hole and a second through hole, the mounting groove being located between the first through hole and the second through hole;

[0028] Manufacturing a first electrode connection portion and a second electrode connection portion on the carrier, wherein the first electrode connection portion and the second electrode connection portion pass through the first through hole and the second through hole respectively;

[0029] Installing a light-emitting diode chip, wherein the light-emitting diode chip is installed in the installation groove, and the first electrode connecting portion and the second electrode connecting portion are respectively connected to two electrodes of the light-emitting diode chip;

[0030] Making a fluorescent layer, wherein the fluorescent layer is located in the mounting groove and covers the light emitting diode chip;

[0031] A light diffusion layer is manufactured, wherein the light diffusion layer covers a side of the carrier having the mounting groove.

[0032] Optionally, the first electrode connecting part and the second electrode connecting part both include a first connecting part, a second connecting part and a third connecting part, one end of the first connecting part is connected to the light-emitting diode chip, the other end of the first connecting part extends out of the mounting groove, the second connecting part passes through the first through hole or the second through hole, one end of the second connecting part is connected to the other end of the first connecting part, the other end of the second connecting part is connected to the third connecting part, and the third connecting part is located on a side of the carrier opposite to the mounting groove.

[0033] The technical solution provided by the embodiments of the present disclosure brings the following beneficial effects:

[0034] In the disclosed embodiment, a reflective film is directly made on the back panel instead of using double-sided tape to attach the reflective sheet, so as to avoid the problem of rework caused by attachment, improve the reflectivity and optical quality, save the process of assembling the reflective sheet in the backlight module, and improve the production efficiency of the backlight module. Using multiple light-emitting units as light sources saves the processing cost of the light bar under the traditional process, and multiple light-emitting units are directly connected to the circuit board through the reflective film, and heat can be transferred through the back panel, which reduces the thermal resistance and improves the reliability, and avoids the light decay and inconsistent light color caused by the long-term heat dissipation of the lamp beads in the light bar in the related technology; and the spacing between the multiple light-emitting units is easy to adjust, so that the light output of the backlight module is more in line with the needs of the display panel. In addition, by setting the reflective film above the circuit board, the reflection effect of the reflective film is improved. The above improvements improve the light efficiency of the backlight module. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 is a structural schematic diagram of a backlight module provided by an embodiment of the present disclosure;

[0037] Figure 2 is a top view of the structure of a backlight module provided by an embodiment of the present disclosure;

[0038] Figure 3 is a structural schematic diagram of a light-emitting unit provided in an embodiment of the present disclosure;

[0039] Figure 4 is a flow chart of a method for preparing a backlight module provided by an embodiment of the present disclosure;

[0040] Figure 5 is a flow chart of another method for preparing a backlight module provided by an embodiment of the present disclosure;

[0041] Figure 6 It is a structural schematic diagram of the backlight module manufacturing process provided by the embodiment of the present disclosure;

[0042] Figure 7 It is a structural schematic diagram of the backlight module manufacturing process provided by the embodiment of the present disclosure;

[0043] Figure 8 It is a structural schematic diagram of the backlight module manufacturing process provided by the embodiment of the present disclosure;

[0044] Fig. 9 It is a structural schematic diagram of the backlight module manufacturing process provided by the embodiment of the present disclosure.

[0045] The reference numerals are as follows:

[0046] 101: back plate; 102: circuit board; 103: reflective film; 104: diffuser plate; 105: light emitting unit;

[0047] 201: carrier; 202: first electrode connection portion; 203: second electrode connection portion; 204: light emitting diode chip; 205: fluorescent layer; 206: light diffusion layer;

[0048] 2010: mounting groove; 2011: first through hole; 2012: second through hole;

[0049] 231: first connection part; 232: second connection part; 233: third connection part;

[0050] 301: groove; 302: light emitting unit installation position; 303: through hole. DETAILED DESCRIPTION

[0051] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0052] Figure 1 It is a structural schematic diagram of a backlight module provided in an embodiment of the present disclosure. Figure 2 is a top view of the structure of a backlight module provided by an embodiment of the present disclosure. Figure 1 and Figure 2 , the backlight module includes: a back plate 101, a circuit board 102, a reflective film 103, a diffusion plate 104 and a plurality of light-emitting units 105;

[0053] The back plate 101 has a groove 301, the circuit board 102 is located at the bottom of the groove 301, the reflective film 103 is attached to the inner wall of the groove 301 and covers the circuit board 102, a plurality of light-emitting units 105 are located on the reflective film 103 at the bottom of the groove 301, and are electrically connected to the circuit board 102 through the reflective film 103, and the diffuser 104 is located at the opening of the groove 301.

[0054] In the disclosed embodiment, a reflective film is directly made on the back panel instead of using double-sided tape to attach the reflective sheet, so as to avoid the problem of rework caused by attachment, improve the reflectivity and optical quality, save the process of assembling the reflective sheet in the backlight module, and improve the production efficiency of the backlight module. Using multiple light-emitting units as light sources saves the processing cost of the light bar under the traditional process, and multiple light-emitting units are directly connected to the circuit board through the reflective film, and heat can be transferred through the back panel, which reduces the thermal resistance and improves the reliability, and avoids the light decay and inconsistent light color caused by the long-term heat dissipation of the lamp beads in the light bar in the related technology; and the spacing between the multiple light-emitting units is easy to adjust, so that the light output of the backlight module is more in line with the needs of the display panel. In addition, by setting the reflective film above the circuit board, the reflection effect of the reflective film is improved. The above improvements improve the light efficiency of the backlight module.

[0055] In the embodiment of the present disclosure, the reflective film 103 may be a mixture of polyethylene terephthalate and titanium dioxide, a mixture of epoxy resin and titanium dioxide, or a mixture of silica gel and titanium dioxide, etc. Titanium dioxide has good reflectivity. By mixing with other materials, the reflectivity of the material can be improved, the mechanical properties and thermal stability can be enhanced, and the weather resistance and chemical stability can be improved. Polyethylene terephthalate, epoxy resin and silica gel are all transparent polymer materials. When mixed with titanium dioxide, the light efficiency and reflection effect of the light can be guaranteed.

[0056] Exemplarily, the reflective film 103 may be made of a mixture of polyethylene terephthalate and titanium dioxide.

[0057] In other embodiments, the reflective film 103 may include an insulating layer and a silver-plated layer, wherein the insulating layer is used to isolate the circuit board from the silver-plated layer, and the silver-plated layer is responsible for reflection.

[0058] In the embodiment of the present disclosure, the thickness of the reflective film 103 can be 50 to 150 micrometers. The reflective film made with the above thickness will not be too thin to reduce the reflection effect, nor will it be too thick to cause the overall thickness of the module to be too thick.

[0059] Exemplarily, when the reflective film 103 is a film layer made of a mixture of polyethylene terephthalate and titanium dioxide, the thickness of the reflective film 103 can be 80 micrometers.

[0060] Exemplarily, the reflective film 103 includes an insulating layer and a silver-plated layer, and the thickness of the silver-plated layer may be 120 microns.

[0061] In the disclosed embodiment, the circuit board 102 includes a plurality of light-emitting unit mounting positions 302, the reflective film 103 has a plurality of through holes 303 exposing the light-emitting unit mounting positions 302, and the plurality of light-emitting units 105 are correspondingly connected to the plurality of light-emitting unit mounting positions 302. By providing the mounting positions and through holes, the installation of the light-emitting units is facilitated, ensuring that each light-emitting unit can be accurately aligned and installed at a predetermined position, thereby improving the assembly efficiency of the circuit board and the uniformity of light output.

[0062] In other embodiments, the light emitting unit 105 may also be formed on a circuit board by means of chips on board packaging.

[0063] In the embodiment of the present disclosure, the back plate 101 may be a metal back plate, for example, a metal back plate that can be stamped by a punching die.

[0064] In the embodiment of the present disclosure, the back plate 101 is in the shape of a circular bowl.

[0065] In the embodiment of the present disclosure, the circuit board 102 may be a circuit board composed of an insulating layer and a circuit layer formed by patterning copper foil. The insulating layer can ensure the insulation between the circuit layer and the metal backplane. The circuit layer is a copper circuit layer. Copper has excellent electrical conductivity and can provide good electrical performance. In addition, the insulating layer also plays a role in heat conduction.

[0066] In the disclosed embodiment, the material of the diffuser 104 can be a diffuser made of silicone, epoxy resin, acrylic material, etc. The silicone diffuser has excellent weather resistance and flexibility; the epoxy diffuser has good mechanical strength and electrical insulation; the acrylic diffuser has high light transmittance and easy processing characteristics, and can be adjusted according to the uniformity of light emission.

[0067] Exemplarily, the material of the diffusion plate 104 is silica gel.

[0068] Figure 3 is a schematic diagram of the structure of the light-emitting unit provided in the embodiment of the present disclosure. Figure 3 The light-emitting unit includes: a carrier 201 , a first electrode connecting portion 202 , a second electrode connecting portion 203 , a light-emitting diode chip 204 , a fluorescent layer 205 and a light diffusion layer 206 .

[0069] The carrier 201 has a mounting groove 2010 , a first through hole 2011 , and a second through hole 2012 . The mounting groove 2010 is located between the first through hole 2011 and the second through hole 2012 .

[0070] The light-emitting diode chip 204 is installed in the mounting groove 2010, the first electrode connecting portion 202 and the second electrode connecting portion 203 are respectively connected to the two electrodes of the light-emitting diode chip 204, and the first electrode connecting portion 202 and the second electrode connecting portion 203 pass through the first through hole 2011 and the second through hole 2012 respectively, the fluorescent layer 205 is located in the mounting groove 2010 and covers the light-emitting diode chip 204, and the light diffusion layer 206 covers the side of the carrier 201 having the mounting groove 2010.

[0071] In the embodiment of the present disclosure, the light-emitting diode chip is installed in the mounting groove to make the light-emitting diode chip more firmly fixed; the first electrode connecting part and the second electrode connecting part are respectively electrically connected to the light-emitting diode to ensure electrical conduction with the light-emitting diode; the first electrode connecting part and the second electrode connecting part pass through the first through hole and the second through hole to ensure electrical conduction with the circuit board; the fluorescent layer is located in the mounting groove and covers the light-emitting diode chip to protect the light-emitting diode and change the color of the light; the light diffusion layer covers the side of the carrier with the mounting groove to protect the light-emitting diode and diffuse the light source.

[0072] In the embodiment of the present disclosure, the material of the carrier 201 may be Al2O3, AlN, Si3N4, SiC or BeO, which may provide excellent thermal conductivity, good mechanical strength and high temperature resistance, which are helpful to ensure efficient heat dissipation and long-term stable operation of the light-emitting unit.

[0073] Exemplarily, the material of the carrier 201 is Al 2 O 3 .

[0074] In the embodiment of the present disclosure, the first electrode connection part 202 and the second electrode connection part 203 both include a first connection part 231, a second connection part 232 and a third connection part 233, one end of the first connection part 231 is connected to the light-emitting diode chip 204, the other end of the first connection part 231 extends out of the mounting groove 2010, the second connection part 232 passes through the first through hole 2011 or the second through hole 2012, one end of the second connection part 232 is connected to the other end of the first connection part 231, the other end of the second connection part 232 is connected to the third connection part 233, and the third connection part 233 is located on the side of the carrier 201 opposite to the mounting groove 2010.

[0075] In the embodiment of the present disclosure, by subdividing the first electrode connecting portion and the second electrode connecting portion into a plurality of connecting portions, the layout and connection mode of the electrodes are optimized, thereby improving the assembly flexibility of the light-emitting unit and the reliability of the electrical connection.

[0076] In the embodiment of the present disclosure, the first electrode connection part 202 and the second electrode connection part 203 may be metal electrode connection parts such as copper, gold, silver, nickel, platinum, etc. Because of their good conductivity and stability, good electrical connection can be achieved.

[0077] Exemplarily, the first electrode connection portion 202 and the second electrode connection portion 203 may be copper electrode connection portions.

[0078] In the disclosed embodiment, the fluorescent layer 205 may be a mixture layer of fluorescent powder and silica gel. The fluorescent powder in the fluorescent layer can change the color of light to meet the different color light emission requirements of the light emitting diode. The silica gel has flexibility and chemical stability, can protect the light emitting diode chip, and prolong the service life of the light emitting diode.

[0079] In the disclosed embodiment, the material of the light diffusion layer 206 can be a light diffusion layer made of silicone, epoxy resin, acrylic material, etc. The silicone light diffusion layer has excellent weather resistance and flexibility; the epoxy resin light diffusion layer has good mechanical strength and electrical insulation; the acrylic light diffusion layer has high light transmittance and easy processing characteristics, and can be adjusted according to the uniformity of light emission.

[0080] Exemplarily, the material of the light diffusion layer 206 is silica gel.

[0081] Figure 4 is a flow chart of a method for preparing a backlight module provided by an embodiment of the present disclosure. Figure 4 The method steps include:

[0082] S11. Making a back plate, wherein the back plate has a groove.

[0083] S12, making a circuit board on the back panel, wherein the circuit board is located at the bottom of the groove.

[0084] S13, making a reflective film on the back plate, the reflective film is attached to the inner wall of the groove and covers the circuit board.

[0085] S14, installing a plurality of light-emitting units, wherein the plurality of light-emitting units are located on the reflective film at the bottom of the groove and are electrically connected to the circuit board through the reflective film.

[0086] S15, making a diffusion plate, wherein the diffusion plate is located at the opening of the groove.

[0087] In the disclosed embodiment, a reflective film is directly made on the back panel instead of using double-sided tape to attach the reflective sheet, so as to avoid the problem of rework caused by attachment, improve the reflectivity and optical quality, save the process of assembling the reflective sheet in the backlight module, and improve the production efficiency of the backlight module. Using multiple light-emitting units as light sources saves the processing cost of the light bar under the traditional process, and multiple light-emitting units are directly connected to the circuit board through the reflective film, and heat can be transferred through the back panel, which reduces the thermal resistance and improves the reliability, and avoids the light decay and inconsistent light color caused by the long-term heat dissipation of the lamp beads in the light bar in the related technology; and the spacing between the multiple light-emitting units is easy to adjust, so that the light output of the backlight module is more in line with the needs of the display panel. In addition, by setting the reflective film above the circuit board, the reflection effect of the reflective film is improved. The above improvements improve the light efficiency of the backlight module.

[0088] Figure 5 is a flow chart of another method for preparing a backlight module provided by an embodiment of the present disclosure. Figure 5 The method steps include:

[0089] S21. Make a back panel.

[0090] In the disclosed embodiment, the back plate may be a metal back plate, for example, a metal back plate that may be formed by stamping with a punch die.

[0091] In the disclosed embodiment, the back plate is in the shape of a circular bowl.

[0092] In the disclosed embodiment, the back plate is formed by punching through a punch die.

[0093] S22. Make a circuit board on the backplane.

[0094] Exemplarily, step S22 may include:

[0095] In the first step, an insulating layer is formed on the back plate.

[0096] The second step is to form a layer of copper foil on the insulating layer.

[0097] The third step is to perform patterning on the copper foil to form a circuit layer to obtain the circuit board.

[0098] In the embodiment of the present disclosure, the circuit layer is a copper circuit layer. Copper has excellent electrical conductivity and can provide efficient electronic signal transmission to achieve electrical connection.

[0099] In the disclosed embodiment, the circuit board may be a circuit board composed of an insulating layer and a circuit layer formed by patterning copper foil. The insulating layer can ensure insulation between the circuit layer and the metal backplane, and the circuit layer is a copper circuit layer. Copper has excellent electrical conductivity and can provide good electrical performance. In addition, the insulating layer also plays a role in heat conduction.

[0100] In the disclosed embodiment, the circuit board includes a plurality of light emitting unit installation positions. By setting the installation positions, the installation of the light emitting units is facilitated, ensuring that each light emitting unit can be accurately aligned and installed at a predetermined position.

[0101] S23, making a reflective film inside the back plate, wherein the reflective film covers the inner area of ​​the back plate.

[0102] In the embodiment of the present disclosure, the reflective film can be a mixture of polyethylene terephthalate and titanium dioxide, a mixture of epoxy resin and titanium dioxide, or a mixture of silica gel and titanium dioxide, etc. Titanium dioxide has good reflectivity and can be mixed with other materials to improve the reflectivity of the material, enhance mechanical properties and thermal stability, and improve weather resistance and chemical stability.

[0103] Exemplarily, the reflective film may be made of a mixture of polyethylene terephthalate and titanium dioxide.

[0104] In other embodiments, the reflective film may include an insulating layer and a silver-plated layer, wherein the insulating layer is used to isolate the circuit board from the silver-plated layer, and the silver-plated layer is responsible for reflection.

[0105] In the embodiment of the present disclosure, the thickness of the reflective film can be 50 to 150 micrometers. The reflective film made with the above thickness will not be too thin to cause a decrease in reflectivity, nor will it be too thick to cause the overall thickness of the module to be too thick.

[0106] Exemplarily, when the reflective film is made of a mixture of polyethylene terephthalate and titanium dioxide, the thickness of the reflective film can be 80 microns.

[0107] Exemplarily, the reflective film includes an insulating layer and a silver-plated layer, and the silver-plated layer may be 120 microns.

[0108] In the disclosed embodiment, the circuit layer is made first and then the reflective film is made, and the light emitted by the light-emitting unit passes through the reflective film and shines on the diffusion plate to achieve a uniform light effect.

[0109] In other examples, the reflective film is made first and then the circuit layer is made. The circuit layer will block the light-emitting unit, resulting in uneven brightness of the light emitted by the light-emitting unit after passing through the reflective film and shining on the diffuser.

[0110] In the disclosed embodiment, the reflective film has a plurality of through holes exposing the mounting positions of the light-emitting units, which facilitates the installation of the light-emitting units and ensures that each light-emitting unit can be accurately aligned and installed in a predetermined position, thereby improving the assembly efficiency of the circuit board and the uniformity of light output.

[0111] S24, manufacturing light-emitting units, wherein a plurality of light-emitting units are distributed above the substrate at intervals.

[0112] In the embodiment of the present disclosure, step S24 may include:

[0113] In the first step, a carrier is provided, wherein the carrier has a mounting groove, a first through hole and a second through hole, and the mounting groove is located between the first through hole and the second through hole.

[0114] Figure 6 FIG. 1 is a schematic diagram of the structure of the backlight module manufacturing process provided by the embodiment of the present disclosure. Figure 6 The carrier 201 has a mounting groove 2010, and the mounting groove 2010 is in a circular bowl shape in a top view.

[0115] In the embodiment of the present disclosure, the material of the carrier can be Al2O3, AlN, Si3N4, SiC or BeO. It can provide excellent thermal conductivity, good mechanical strength and high temperature resistance, which are helpful to ensure efficient heat dissipation and long-term stable operation of the light-emitting unit.

[0116] Exemplarily, the support is Al2O3.

[0117] In the disclosed embodiment, the carrier is grooved by laser on the carrier material to obtain the overall contour, and then the final structure is obtained by opening holes.

[0118] Figure 7 FIG. 1 is a schematic diagram of the structure of the backlight module manufacturing process provided by the embodiment of the present disclosure. Figure 7 The carrier 201 has a first through hole 2011 and a second through hole 2012 at both ends.

[0119] In the disclosed embodiment, holes are drilled at both ends of the carrier by laser.

[0120] In the disclosed embodiment, the diameter of the through hole is 0.05-0.15 mm.

[0121] Exemplarily, the through hole diameter is 0.1 mm.

[0122] In the second step, a first electrode connecting portion and a second electrode connecting portion are manufactured on the carrier, and the first electrode connecting portion and the second electrode connecting portion pass through the first through hole and the second through hole respectively.

[0123] In the embodiment of the present disclosure, the first electrode connection part and the second electrode connection part may be metal electrode connection parts such as copper, gold, silver, nickel, platinum, etc. Because of their good conductivity and stability, good electrical connection can be achieved.

[0124] Exemplarily, the first electrode connection portion and the second electrode connection portion may be copper electrode connection portions.

[0125] The third step is to install the light emitting diode chip. The light emitting diode chip is installed in the installation groove, and the first electrode connecting part and the second electrode connecting part are respectively connected to the two electrodes of the light emitting diode chip.

[0126] In the embodiment of the present disclosure, the first electrode connecting part and the second electrode connecting part each include a first connecting part, a second connecting part and a third connecting part, one end of the first connecting part is connected to the light-emitting diode chip, the other end of the first connecting part extends out of the mounting groove, the second connecting part passes through the first through hole or the second through hole, one end of the second connecting part is connected to the other end of the first connecting part, the other end of the second connecting part is connected to the third connecting part, and the third connecting part is located on the side of the carrier opposite to the mounting groove.

[0127] In the embodiment of the present disclosure, by subdividing the first electrode connecting portion and the second electrode connecting portion into a plurality of connecting portions, the layout and connection mode of the electrodes are optimized, thereby improving the assembly flexibility of the light-emitting unit and the reliability of the electrical connection.

[0128] Figure 8 FIG. 1 is a schematic diagram of the structure of the backlight module manufacturing process provided by the embodiment of the present disclosure. Figure 8 The light emitting diode chip 204 is fixed on the first electrode connecting portion 202 and the second electrode connecting portion 203 .

[0129] In the disclosed embodiment, the light-emitting diode chip can be fixed by any one of the methods of flux eutectic, solder paste reflow soldering and silver glue baking solid crystal, so that the light-emitting diode is fixed on the first electrode connecting part and the second electrode connecting part.

[0130] Exemplarily, the light emitting diode chip tube is fixed on the first electrode connecting portion and the second electrode connecting portion by a spot flux eutectic method.

[0131] The fourth step is to make a fluorescent layer, which is located in the mounting groove and covers the light emitting diode chip.

[0132] Fig. 9 FIG. 1 is a schematic diagram of the structure of the backlight module manufacturing process provided by the embodiment of the present disclosure. Fig. 9 The fluorescent layer 205 covers the light emitting diode chip 204 .

[0133] In the disclosed embodiment, the fluorescent layer may be a mixture layer of fluorescent powder and silica gel. The fluorescent powder in the fluorescent layer may change the color of light to meet the different color emission requirements of the light emitting diode chip. The silica gel has flexibility and chemical stability, and may protect the light emitting diode chip and extend the service life of the light emitting diode.

[0134] In the disclosed embodiment, the fluorescent layer is formed in the carrier groove by compression molding.

[0135] The fifth step is to manufacture a light diffusion layer, wherein the light diffusion layer covers the side of the carrier having the mounting groove.

[0136] In the disclosed embodiment, a light diffusion layer is formed on the surface of the carrier by compression molding.

[0137] In the disclosed embodiment, the material of the light diffusion layer can be a light diffusion layer made of silicone, epoxy resin, acrylic material, etc. The silicone light diffusion layer has excellent weather resistance and flexibility; the epoxy resin light diffusion layer has good mechanical strength and electrical insulation; the acrylic light diffusion layer has high light transmittance and easy processing characteristics, and can be adjusted according to the uniformity of light emission.

[0138] Exemplarily, the material of the light diffusion layer is silica gel.

[0139] S25, connecting the light-emitting unit to the circuit board to form an electrical path.

[0140] Exemplarily, step S25 may include:

[0141] The first step is to place an appropriate amount of conductive material at the mounting location on the circuit board.

[0142] In the embodiment of the present disclosure, the conductive material may be silver glue, solder paste, etc.

[0143] Exemplarily, the conductive material may be silver paste.

[0144] In the disclosed embodiment, a suitable amount of conductive material is placed at the mounting position of the circuit board by printing or spraying the dispensing valve body.

[0145] Exemplarily, a suitable amount of conductive material is placed at the mounting position of the circuit board by printing.

[0146] In the second step, high temperature curing forms an electrical path.

[0147] In the disclosed embodiment, the light emitting unit is fixed to the mounting position of the circuit board by a chip mounter or a die bonder.

[0148] Exemplarily, the light-emitting unit is fixed to the mounting position of the circuit board by a placement machine.

[0149] The plurality of light-emitting units are correspondingly connected to the plurality of light-emitting unit mounting positions, ensuring that each light-emitting unit can be accurately aligned and mounted at a predetermined position, thereby improving the assembly efficiency of the circuit board and the uniformity of light output.

[0150] In other embodiments, the light emitting unit may also be formed on a circuit board by means of Chips on Board packaging.

[0151] S26, assembling a diffusion plate, wherein the diffusion plate encapsulates a plurality of light-emitting units inside the module.

[0152] In the disclosed embodiment, the material of the diffuser plate can be a diffuser plate made of silicone, epoxy resin, acrylic material, etc. The silicone diffuser plate has excellent weather resistance and flexibility; the epoxy resin diffuser plate has good mechanical strength and electrical insulation; the acrylic diffuser plate has high light transmittance and easy processing characteristics, and can be adjusted according to the uniformity of light emission.

[0153] Exemplarily, the material of the diffusion plate is silica gel.

[0154] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A backlight module, characterized in that: The backlight module comprises: a back plate (101), a circuit board (102), a reflective film (103), a diffusion plate (104) and a plurality of light-emitting units (105); The back plate (101) has a groove (301), the circuit board (102) is located at the bottom of the groove (301), the reflective film (103) is attached to the inner wall of the groove (301) and covers the circuit board (102), the plurality of light-emitting units (105) are located on the reflective film (103) at the bottom of the groove (301) and are electrically connected to the circuit board (102) through the reflective film (103), and the diffuser plate (104) is located at the opening of the groove (301).

2. The backlight module according to claim 1, characterized in that: The material of the reflective film (103) is a mixture of polyethylene terephthalate and titanium dioxide, a mixture of epoxy resin and titanium dioxide, or a mixture of silica gel and titanium dioxide.

3. The backlight module according to claim 1, characterized in that: The thickness of the reflective film (103) is 50 to 150 microns.

4. The backlight module according to any one of claims 1 to 3, characterized in that: The circuit board (102) comprises a plurality of light-emitting unit mounting positions (302); the reflective film (103) has a plurality of through holes (303) exposing the light-emitting unit mounting positions (302); and the plurality of light-emitting units (105) are correspondingly connected to the plurality of light-emitting unit mounting positions (302).

5. The backlight module according to claim 4, characterized in that: The light-emitting unit comprises: a carrier (201), a first electrode connecting portion (202), a second electrode connecting portion (203), a light-emitting diode chip (204), a fluorescent layer (205) and a light diffusion layer (206); The carrier (201) comprises a mounting groove (2010), a first through hole (2011) and a second through hole (2012), wherein the mounting groove (2010) is located between the first through hole (2011) and the second through hole (2012); The light-emitting diode chip (204) is installed in the installation groove (2010); the first electrode connection part (202) and the second electrode connection part (203) are respectively connected to two electrodes of the light-emitting diode chip (204); and the first electrode connection part (202) and the second electrode connection part (203) respectively pass through the first through hole (2011) and the second through hole (2012); the fluorescent layer (205) is located in the installation groove (2010) and covers the light-emitting diode chip (204); and the light diffusion layer (206) covers a side of the carrier (201) having the installation groove (2010).

6. The backlight module according to claim 5, characterized in that: The first electrode connection part (202) and the second electrode connection part (203) both comprise a first connection part (231), a second connection part (232) and a third connection part (233); one end of the first connection part (231) is connected to the light-emitting diode chip (204); the other end of the first connection part (231) extends out of the mounting groove (2010); the second connection part (232) passes through the first through hole (2011) or the second through hole (2012); one end of the second connection part (232) is connected to the other end of the first connection part (231); the other end of the second connection part (232) is connected to the third connection part (233); the third connection part (233) is located on a side of the carrier (201) opposite to the mounting groove (2010).

7. A method for preparing a backlight module, characterized in that: The backlight module preparation method comprises: Making a back plate, wherein the back plate has a groove; Making a circuit board on the back plate, wherein the circuit board is located at the bottom of the groove; A reflective film is made on the back plate, and the reflective film is attached to the inner wall of the groove and covers the circuit board; Installing a plurality of light-emitting units, wherein the plurality of light-emitting units are located on the reflective film at the bottom of the groove and are electrically connected to the circuit board through the reflective film; A diffusion plate is manufactured, wherein the diffusion plate is located at the opening of the groove.

8. The method for preparing a backlight module according to claim 7, characterized in that: The manufacturing of the circuit board on the backplane comprises: forming an insulating layer on the back plate; forming a layer of copper foil on the insulating layer; The copper foil is patterned to form a circuit layer to obtain the circuit board.

9. The method for preparing a backlight module according to claim 7, characterized in that: The method further comprises: manufacturing the light-emitting unit in the following manner: Providing a carrier, the carrier having a mounting groove, a first through hole and a second through hole, the mounting groove being located between the first through hole and the second through hole; Manufacturing a first electrode connection portion and a second electrode connection portion on the carrier, wherein the first electrode connection portion and the second electrode connection portion pass through the first through hole and the second through hole respectively; Installing a light-emitting diode chip, wherein the light-emitting diode chip is installed in the installation groove, and the first electrode connecting portion and the second electrode connecting portion are respectively connected to two electrodes of the light-emitting diode chip; Making a fluorescent layer, wherein the fluorescent layer is located in the mounting groove and covers the light emitting diode chip; A light diffusion layer is manufactured, wherein the light diffusion layer covers a side of the carrier having the mounting groove.

10. The method for preparing a backlight module according to claim 9, characterized in that: The first electrode connection part and the second electrode connection part each include a first connection part, a second connection part and a third connection part, one end of the first connection part is connected to the light-emitting diode chip, the other end of the first connection part extends out of the mounting groove, the second connection part passes through the first through hole or the second through hole, one end of the second connection part is connected to the other end of the first connection part, the other end of the second connection part is connected to the third connection part, and the third connection part is located on a side of the carrier opposite to the mounting groove.

Images