Chip inductor forming method and chip inductor forming equipment

Abstract

The present invention relates to a chip inductor forming method and a chip inductor forming device. The mold in the chip inductor forming method includes an upper mold, a lower mold, and a mother panel; a forming block is installed on the mother panel, an inductor cavity is provided at the center of the forming block, a first convex plate is provided on the side wall of the inductor cavity, and a pad is installed at the bottom of the mother panel. The method includes: placing a copper sheet terminal in the inductor cavity so that the end of the copper sheet terminal abuts against the first convex plate; controlling the lower mold to move upward from the inductor cavity to a preset height; adding magnetic core powder to the inductor cavity so that the copper sheet terminal contacts the magnetic core powder; controlling the upper mold to move downward to press the magnetic core powder and the copper sheet terminal into a chip inductor; controlling the upper mold to reset; controlling the lower mold to continue to move upward to eject the pressed chip inductor; and controlling the lower mold to reset. The chip inductor pressed by the chip inductor forming method of the present invention can withstand high voltage and high current, and has a higher power density.

Description

Technical Field

[0001] The present invention relates to the technical field of chip inductor production, and in particular to a chip inductor forming method and a chip inductor forming device. Background Art

[0002] Chip inductors are miniaturized electronic components that are mainly used to store and convert electrical energy. Through their unique electromagnetic induction characteristics, they can transfer and regulate voltage, current, and energy in the circuit. Chip inductors are manufactured using advanced miniaturization technology. They are tiny in size, but can achieve efficient electrical energy storage and conversion in a small space, making it possible for the integration and miniaturization of electronic devices.

[0003] In the related technology, the chip inductor processing generally adopts the method of winding the copper coil with a magnetic bar, which has many defects. On the one hand, the copper coil is easy to deform during the chip inductor forming process, resulting in a decrease in inductance performance; on the other hand, the copper coil has low voltage and current resistance, which seriously restricts the chip inductor performance. Summary of the invention

[0004] Based on this, it is necessary to provide a chip inductor forming method and a chip inductor forming device to address the many defects in chip inductor processing.

[0005] A chip inductor molding method is applied to a chip inductor molding mold, wherein the chip inductor includes a copper sheet terminal and a magnetic core, and the chip inductor molding mold includes an upper mold, a lower mold, and a mother panel installed between the upper mold and the lower mold;

[0006] A forming block is installed on the mother panel, an inductor cavity is provided at the center of the forming block, a first convex plate abutting against the copper sheet terminal is provided on the side wall of the inductor cavity, a pad matching the mother panel is installed at the bottom of the mother panel, and the thickness of the forming block is equal to the sum of the thickness of the mother panel and the thickness of the pad;

[0007] The chip inductor forming method includes: placing a copper sheet terminal in the inductor cavity so that the end of the copper sheet terminal abuts against the first convex plate; controlling the lower mold to move upward from the inductor cavity to a preset height; adding magnetic core powder to the inductor cavity so that the copper sheet terminal contacts the magnetic core powder; controlling the upper mold to move downward to press the magnetic core powder and the copper sheet terminal into a chip inductor; controlling the upper mold to move upward to reset; controlling the lower mold to continue to move upward to eject the pressed chip inductor; controlling the lower mold to move downward to reset.

[0008] When processing the chip inductor, the above-mentioned chip inductor forming method first places the copper sheet terminal in the inductor cavity so that the end of the copper sheet terminal abuts against the upper surface of the first convex plate; then controls the lower mold to move upward from the inductor cavity to a preset height; then adds magnetic core powder into the inductor cavity so that the copper sheet terminal contacts the magnetic core powder; then controls the upper mold to move downward to press the magnetic core powder and the copper sheet terminal into a chip inductor; then controls the upper mold to move upward to reset; then controls the lower mold to continue to move upward to eject the pressed chip inductor; finally controls the lower mold to move downward to reset. During the chip inductor pressing and forming process, the upper surface of the first convex plate abuts against the end of the copper sheet terminal, which can prevent the copper sheet terminal from being displaced in the vertical direction. At the same time, the inductor cavity and the lower mold cooperate with each other to abut the side of the copper sheet terminal, which can prevent the copper sheet terminal from being displaced in the horizontal direction, so that the copper sheet terminal is not easy to be displaced or deformed; further, the copper sheet terminal is a single-winding copper sheet structure, which does not require coil winding. Compared with the multi-winding coil structure of the prior art, it has higher structural strength, can withstand higher voltage and current, and has higher power density. The above chip inductor forming method is easy to operate and has high production efficiency, and the pressed chip inductor has excellent product performance.

[0009] In one embodiment, before placing the copper sheet terminal in the inductor cavity, the method further includes:

[0010] Determine the inductor model of the chip inductor to be formed;

[0011] Selecting a forming block and a backing plate according to the inductor model, determining the positions of the selected forming block and backing plate in the first mold frame, and installing the selected forming block and backing plate on the mother mold panel respectively through the first mold changing mechanism;

[0012] The upper mold and the lower mold are selected according to the inductor model, the positions of the selected upper mold and the lower mold in the second mold frame are determined, and the selected upper mold and the lower mold are respectively installed at the corresponding positions above and below the mother panel through the second mold changing mechanism.

[0013] In one embodiment, the first convex plate is respectively disposed on a first side and a second side opposite to the side wall of the inductor cavity, and the copper sheet terminal includes a first end and a second end;

[0014] The step of making the end of the copper sheet terminal abut against the first convex plate comprises:

[0015] The first end of the copper sheet terminal is abutted against the first convex plate provided on the first side of the inductor cavity side wall, and the second end of the copper sheet terminal is abutted against the first convex plate provided on the second side of the inductor cavity side wall.

[0016] In one embodiment, the lower surface of the first convex plate is aligned with the lower surface of the forming block, and the height of the first convex plate is less than the thickness of the forming block;

[0017] When the lower mold moves upward from the inductor cavity to a preset height, the following conditions are met:

[0018] The height of the upper surface of the lower mold = the height of the lower surface of the molding block + the height of the first convex plate + the compensation height, and the compensation height is the length of the copper sheet terminal extending out of the lower surface of the magnetic core.

[0019] In one embodiment, the side wall of the inductor cavity is further provided with a second convex plate matched with the side surface of the magnetic core, and the second convex plate is respectively provided on the third side and the fourth side opposite to the side wall of the inductor cavity;

[0020] The lower end surface of the upper mold is also provided with a first groove matching with the top surface of the magnetic core, and the upper end surface of the lower mold is also provided with a second groove matching with the bottom surface of the magnetic core;

[0021] The side surface of the upper mold is also provided with a third groove matching the second convex plate;

[0022] The side surfaces of the lower mold are also respectively provided with a fourth groove matching the first convex plate and a fifth groove matching the second convex plate.

[0023] In one embodiment, the mother panel is provided with a cutting slope and an inductive push rod;

[0024] After controlling the lower die to move downward and reset, the method further includes:

[0025] The pressed chip inductor is pushed onto the material cutting slope by the inductor push rod, and the material is cut through the material cutting slope.

[0026] In one embodiment, the molding block is cylindrical, and the second convex plate is integrally formed with the molding block.

[0027] In one embodiment, the pad is square, and the four corners of the pad are chamfered.

[0028] In one embodiment, the upper mold is connected to a first cylinder, and the lower mold is connected to a second cylinder, and the first cylinder and the second cylinder are used to drive the upper mold and the lower mold to move respectively.

[0029] A chip inductor molding device comprises a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the above-mentioned chip inductor molding method is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the process of the chip inductor forming method of the present invention;

[0031] Figure 2 It is a schematic structural diagram of a chip inductor in the chip inductor forming method of the present invention;

[0032] Figure 3 It is a structural schematic diagram of a chip inductor mold in the chip inductor molding method of the present invention;

[0033] Figure 4 for Figure 3 Schematic diagram of the structure of the middle and upper mold;

[0034] Figure 5 for Figure 3 Schematic diagram of the structure of the middle and lower molds;

[0035] Figure 6 for Figure 2 Schematic diagram of the structure of the middle copper sheet terminal;

[0036] Figure 7 for Figure 3 Schematic diagram of the structure of the middle forming block;

[0037] Among them, 10 is a chip inductor molding mold, 11 is an upper mold, 111 is a first groove, 112 is a third groove, 12 is a lower mold, 121 is a second groove, 122 is a fourth groove, 123 is a fifth groove, 13 is a mother panel, 131 is a blanking slope, 14 is a molding block, 141 is an inductor cavity, 142 is a first convex plate, 143 is a second convex plate, 15 is a pad, 20 is a chip inductor, 21 is a copper sheet terminal, 211 is a first end, 212 is a second end, and 22 is a magnetic core. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0039] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only."

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] The invention discloses a chip inductor forming method.

[0042] like Figures 1 to 7 As shown, the chip inductor molding method is applied to a chip inductor molding mold 10, the chip inductor 20 includes a copper sheet terminal 21 and a magnetic core 22, and the chip inductor molding mold 10 includes an upper mold 11, a lower mold 12, and a mother panel 13 installed between the upper mold 11 and the lower mold 12; a molding block 14 is installed on the mother panel 13, an inductor cavity 141 is provided at the center of the molding block 14, and a first protrusion 142 abutting the copper sheet terminal 21 is provided on the side wall of the inductor cavity 141, and a pad 15 matching the mother panel 13 is installed at the bottom of the mother panel 13, and the thickness of the molding block 14 is equal to the sum of the thickness of the mother panel 13 and the thickness of the pad 15.

[0043] The chip inductor forming method comprises:

[0044] Step S01, placing the copper sheet terminal 21 in the inductor cavity 141, so that the end of the copper sheet terminal 21 abuts against the first convex plate 142;

[0045] Step S02, controlling the lower mold 12 to move upward from the inductor cavity 141 to a preset height;

[0046] Step S03, adding magnetic core powder into the inductor cavity 141, so that the copper sheet terminal 21 is in contact with the magnetic core powder;

[0047] Step S04, controlling the upper mold 11 to move downward, pressing the magnetic core powder and the copper sheet terminal 21 into a chip inductor 20;

[0048] Step S05, controlling the upper mold 11 to move upward and reset;

[0049] Step S06, controlling the lower mold 12 to continue to move upward to eject the pressed chip inductor 20;

[0050] Step S07: Control the lower mold 12 to move downward for resetting.

[0051] When processing the chip inductor, the above-mentioned chip inductor forming method first places the copper sheet terminal in the inductor cavity so that the end of the copper sheet terminal abuts against the upper surface of the first convex plate; then controls the lower mold to move upward from the inductor cavity to a preset height; then adds magnetic core powder into the inductor cavity so that the copper sheet terminal contacts the magnetic core powder; then controls the upper mold to move downward to press the magnetic core powder and the copper sheet terminal into a chip inductor; then controls the upper mold to move upward to reset; then controls the lower mold to continue to move upward to eject the pressed chip inductor; finally controls the lower mold to move downward to reset. During the chip inductor pressing and forming process, the upper surface of the first convex plate abuts against the end of the copper sheet terminal, which can prevent the copper sheet terminal from being displaced in the vertical direction. At the same time, the inductor cavity and the lower mold cooperate with each other to abut the side of the copper sheet terminal, which can prevent the copper sheet terminal from being displaced in the horizontal direction, so that the copper sheet terminal is not easy to be displaced or deformed; further, the copper sheet terminal is a single-winding copper sheet structure, which does not require coil winding. Compared with the multi-winding coil structure of the prior art, it has higher structural strength, can withstand higher voltage and current, and has higher power density. The above chip inductor forming method is easy to operate and has high production efficiency, and the pressed chip inductor has excellent product performance.

[0052] Among them, different types of chip inductors 20 have different sizes, and processing chip inductors 20 of different sizes requires the use of molding blocks 14, pads 15, upper molds 11 and lower molds 12 of different sizes. Furthermore, before placing the copper sheet terminal 21 in the inductor cavity 141 in step S01, it is necessary to determine the inductor model of the chip inductor 20 to be formed; select the molding block 14 and pad 15 according to the inductor model, determine the position of the selected molding block 14 and pad 15 in the first mold frame, and install the selected molding block 14 and pad 15 on the mother panel 13 through the first mold changing mechanism; select the upper mold 11 and lower mold 12 according to the inductor model, determine the position of the selected upper mold 11 and lower mold 12 in the second mold frame, and install the selected upper mold 11 and lower mold 12 at the corresponding positions above and below the mother panel 13 through the second mold changing mechanism. Through the cooperation of the first mold frame and the first mold changing mechanism, the molding block 14 and the pad 15 can be automatically replaced to improve the chip inductor molding efficiency; through the cooperation of the second mold frame and the second mold changing mechanism, the upper mold 11 and the lower mold 12 can be automatically replaced to further improve the chip inductor molding efficiency.

[0053] The first convex plate 142 is respectively arranged on the first side and the second side opposite to the side wall of the inductor cavity 141, and the copper sheet terminal 21 includes a first end 211 and a second end 212. Further, in step S01, making the end of the copper sheet terminal 21 butt against the first convex plate 142 includes: making the first end 211 of the copper sheet terminal 21 butt against the first convex plate 142 arranged on the first side of the side wall of the inductor cavity 141, and making the second end 212 of the copper sheet terminal 21 butt against the first convex plate 142 arranged on the second side of the side wall of the inductor cavity 141. By making the first end 211 and the second end 212 of the copper sheet terminal 21 butt against the first convex plate 142 respectively, the force on the copper sheet terminal 21 during the pressing process is made more uniform, and the displacement or deformation of the copper sheet terminal is avoided.

[0054] The lower surface of the first convex plate 142 is aligned with the lower surface of the forming block 14, and the height of the first convex plate 142 is less than the thickness of the forming block 14. Since the lower surface of the first end 211 and the lower surface of the second end 212 of the copper sheet terminal 21 are respectively in contact with the upper surface of the first convex plate 142, and the copper sheet terminal 21 in the chip inductor 20 extends out of the lower surface of the magnetic core 22, in order to make the size of the copper sheet terminal 21 meet the product design specifications after the chip inductor 20 is pressed and formed, when the lower mold 12 moves upward from the inductor cavity 141 to a preset height, step S02 needs to meet the following conditions:

[0055] The height of the upper surface of the lower mold 12 = the height of the lower surface of the molding block 14 + the height of the first protruding plate 142 + the compensation height, and the compensation height is the length of the copper terminal 21 extending out of the lower surface of the magnetic core 22.

[0056] Furthermore, the side wall of the inductor cavity 141 is also provided with a second protrusion 143 that cooperates with the side surface of the magnetic core 22. The second protrusion 143 is respectively arranged on the third side and the fourth side opposite to the side wall of the inductor cavity 141, and the upper surface and the lower surface of the second protrusion 143 are respectively aligned with the upper surface and the lower surface of the molding block 14; the lower end surface of the upper mold 11 is also provided with a first groove 111 that cooperates with the top surface of the magnetic core 22, and the upper end surface of the lower mold 12 is also provided with a second groove 121 that cooperates with the bottom surface of the magnetic core 22; the side surface of the upper mold 11 is also provided with a third groove 112 that cooperates with the second protrusion 143; the side surface of the lower mold 12 is also provided with a fourth groove 122 that cooperates with the first protrusion 142 and a fifth groove 123 that cooperates with the second protrusion 143.

[0057] By setting the first groove 111 and the third groove 112 on the upper mold 11, the upper mold 11 can enter the inductor cavity 141 and cooperate to press the upper surface of the chip inductor 20; by setting the second groove 121, the fourth groove 122 and the fifth groove 123 on the lower mold 12, the lower mold 12 can enter the inductor cavity 141 and cooperate to press the lower surface of the chip inductor 20; by setting the second convex plate 143 on the side wall of the inductor cavity 141, the side of the chip inductor 20 can be pressed.

[0058] The mother panel 13 is provided with a material cutting slope 131 and an inductor push rod (not shown). After the lower mold 12 is controlled to move downward and reset, the pressed chip inductor 20 can be pushed onto the material cutting slope 131 by the inductor push rod, and the material is cut through the material cutting slope 131. The cooperation between the inductor push rod and the material cutting slope 131 can increase the material cutting speed of the chip inductor 20 and improve the production efficiency of the chip inductor 20.

[0059] The forming block 14 is cylindrical, and the second convex plate 143 is integrally formed with the forming block 14. The forming block 14 is set to be cylindrical so that the force on the forming block 14 is more uniform; the second convex plate 143 is integrally formed with the forming block 14 so that the structure of the pressed chip inductor 20 has better consistency.

[0060] Furthermore, the pad 15 is square, and the four corners of the pad 15 are chamfered. The chamfered corners of the pad 15 can reduce stress concentration and improve the durability of the pad 15.

[0061] Furthermore, the upper die 11 is connected to a first cylinder, and the lower die 12 is connected to a second cylinder, and the first cylinder and the second cylinder are respectively used to drive the upper die 11 and the lower die 12 to move. Through the cooperation of the first cylinder and the second cylinder, the upper die 11 and the lower die 12 are easy to control, simple to maintain, and more adaptable.

[0062] The present invention also discloses a chip inductor forming device. The chip inductor forming device includes a processor and a memory, wherein the memory is used to store a computer program, and the computer program is executed by the processor to implement the above-mentioned chip inductor forming method. By implementing the above-mentioned chip inductor forming method, the chip inductor forming device can prevent the copper sheet terminal from displacement or deformation during the pressing process, and the copper sheet terminal can withstand higher voltage and current, so that the pressed chip inductor has a greater energy storage capacity.

[0063] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A chip inductor forming method, characterized in that: Applicable to a chip inductor forming mold, the chip inductor includes a copper sheet terminal and a magnetic core, and the chip inductor forming mold includes an upper mold, a lower mold, and a mother panel installed between the upper mold and the lower mold; A forming block is installed on the mother panel, an inductor cavity is provided at the center of the forming block, a first convex plate abutting against the copper sheet terminal is provided on the side wall of the inductor cavity, a pad matching the mother panel is installed at the bottom of the mother panel, and the thickness of the forming block is equal to the sum of the thickness of the mother panel and the thickness of the pad; The chip inductor molding method comprises: placing a copper sheet terminal in the inductor cavity so that the end of the copper sheet terminal abuts against the first convex plate; controlling the lower mold to move upward from the inductor cavity to a preset height; adding magnetic core powder into the inductor cavity so that the copper sheet terminal contacts the magnetic core powder; controlling the upper mold to move downward to press the magnetic core powder and the copper sheet terminal into a chip inductor; controlling the upper mold to move upward to reset; controlling the lower mold to continue to move upward to eject the pressed chip inductor; controlling the lower mold to move downward to reset; Before placing the copper sheet terminal in the inductor cavity, the method further includes: Determine the inductor model of the chip inductor to be formed; Selecting a forming block and a backing plate according to the inductor model, determining the positions of the selected forming block and backing plate in the first mold frame, and installing the selected forming block and backing plate on the mother mold panel respectively through the first mold changing mechanism; The upper mold and the lower mold are selected according to the inductor model, the positions of the selected upper mold and the lower mold in the second mold frame are determined, and the selected upper mold and the lower mold are respectively installed at the corresponding positions above and below the mother panel through the second mold changing mechanism.

2. The chip inductor forming method according to claim 1, characterized in that: The first convex plate is respectively arranged on a first side and a second side opposite to the side wall of the inductor cavity, and the copper sheet terminal includes a first end and a second end; The step of making the end of the copper sheet terminal abut against the first convex plate comprises: The first end of the copper sheet terminal is abutted against the first convex plate provided on the first side of the inductor cavity side wall, and the second end of the copper sheet terminal is abutted against the first convex plate provided on the second side of the inductor cavity side wall.

3. The chip inductor forming method according to claim 2, characterized in that: The lower surface of the first convex plate is aligned with the lower surface of the forming block, and the height of the first convex plate is less than the thickness of the forming block; When the lower mold moves upward from the inductor cavity to a preset height, the following conditions are met: The height of the upper surface of the lower mold = the height of the lower surface of the molding block + the height of the first convex plate + the compensation height, and the compensation height is the length of the copper sheet terminal extending out of the lower surface of the magnetic core.

4. The chip inductor forming method according to claim 3, characterized in that: The side wall of the inductor cavity is also provided with a second convex plate matched with the side surface of the magnetic core, and the second convex plate is respectively provided on the third side and the fourth side opposite to the side wall of the inductor cavity; The lower end surface of the upper mold is also provided with a first groove matching with the top surface of the magnetic core, and the upper end surface of the lower mold is also provided with a second groove matching with the bottom surface of the magnetic core; The side surface of the upper mold is also provided with a third groove matching the second convex plate; The side surfaces of the lower mold are also respectively provided with a fourth groove matching the first convex plate and a fifth groove matching the second convex plate.

5. The chip inductor forming method according to any one of claims 1 to 4, characterized in that: The mother panel is provided with a blanking inclined surface and an inductive push rod; After controlling the lower die to move downward and reset, the method further includes: The pressed chip inductor is pushed onto the material cutting slope by the inductor push rod, and the material is cut through the material cutting slope.

6. The chip inductor forming method according to claim 5, characterized in that: The forming block is cylindrical, and the second convex plate is integrally formed with the forming block.

7. The chip inductor forming method according to claim 1, characterized in that: The pad is square, and the four corners of the pad are chamfered.

8. The chip inductor forming method according to claim 1, characterized in that: The upper die is connected to a first cylinder, and the lower die is connected to a second cylinder. The first cylinder and the second cylinder are used to drive the upper die and the lower die to move respectively.

9. A chip inductor forming device, characterized in that: The chip inductor forming device comprises a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the chip inductor forming method according to any one of claims 1 to 8 is implemented.

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