A film cassette return device

Abstract

The present invention discloses a cassette return device, which relates to the technical field of wafer cleaning and includes: a loading and unloading mechanism for separating or assembling a cassette and the wafers inside it, a wafer transfer mechanism, a cassette transfer mechanism, and a wafer cleaning mechanism. The wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transfer mechanism. The wafer transfer mechanism drives the wafers into the wafer cleaning mechanism for cleaning. The transfer paths of the wafer transfer mechanism and the cassette transfer mechanism overlap at both ends, and a loading and unloading mechanism is arranged at the end. In the present invention, the transfer and cleaning are integrated. The loading and unloading mechanism can separate the cassette and the wafers. The separated wafers are transferred by the wafer transfer mechanism into the wafer cleaning mechanism to complete the cleaning process. The separated cassette is transferred by the cassette transfer mechanism to the loading and unloading mechanism at the end to wait for loading the wafers after cleaning, and the cleaning efficiency is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and particularly to a cassette return device. Background Art

[0002] With the continuous reduction of the size of semiconductor devices and the continuous improvement of precision requirements, the technical requirements for wafer cleaning processes have become increasingly stringent. Any tiny particles, organic substances, metal ions or oxide residues on the wafer surface may have a significant impact on device performance, thereby affecting the yield and reliability of semiconductor devices; wafer cleaning is one of the crucial steps in semiconductor manufacturing processes. The purpose is to remove various contaminants on the wafer surface to ensure that subsequent process steps can be carried out on a clean surface. The main cleaning steps include pre-cleaning process, chemical cleaning process, final cleaning process and drying process. Through the cleaning of the wafer, the requirements for cassette return are completed.

[0003] Most of the cassette return devices known to the applicant currently are decentralized devices, that is, the cassettes carrying wafers are transported between each cleaning process through a rotating mechanism. In each cleaning process, the wafers need to be taken out of the cassettes first, and the cleaning efficiency is relatively low.

[0004] Therefore, there is an urgent need for a cassette return device with high cleaning efficiency. Summary of the Invention

[0005] The purpose of the present invention is to provide a cassette return device to solve the problems existing in the above-mentioned prior art. By integrating transportation and cleaning, after separating the wafer from the cassette, the wafer can be directly transported to the wafer cleaning mechanism to complete the cleaning process. After the cleaning is completed, the wafer is placed back into the cassette, and the cleaning efficiency is effectively improved.

[0006] To achieve the above purpose, the present invention provides the following solution: The present invention provides a cassette return device, including a loading and unloading mechanism for separating or assembling a cassette and the wafers inside it, a wafer transfer mechanism for transferring wafers, a cassette transfer mechanism for transferring the cassette separated from the wafers, and a wafer cleaning mechanism for cleaning the wafers. The wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transfer mechanism. The wafer transfer mechanism drives the wafers into the wafer cleaning mechanism for cleaning. The transfer paths of the wafer transfer mechanism and the cassette transfer mechanism overlap at both ends, and the loading and unloading mechanism is arranged at the end; the loading and unloading mechanism includes a cassette positioning member and a wafer support plate with a lifting function. The cassette positioning member is provided with a through hole for the lifting of the wafer support plate corresponding to the bottom opening of the cassette. The wafer support plate moves up and down in the through hole of the cassette positioning member and the bottom opening of the cassette to lift or lower the wafers to separate or assemble them from the cassette.

[0007] Preferably, the loading and unloading mechanism also includes a lifting part with the function of lifting and lowering movement and movement toward or away from the film box positioning member, the lifting part is U-shaped, and the two arms of the lifting part are respectively arranged corresponding to the two ends of the bottom of the film box, and the U-shaped opening of the lifting part is arranged toward the film box positioning member. The lifting part moves up and down on the outer peripheral side of the film box positioning member to place the film box on the film box positioning member.

[0008] Preferably, the wafer transfer mechanism includes a wafer clamp with lifting and lowering movements and movement functions between the loading and unloading mechanisms on both sides, the wafer clamp includes two rotating motors, two rotating shafts and two wafer clamping arms, the rotating motor is transmission-connected to the rotating shaft, the rotating shaft is transmission-connected to the wafer clamping arms, the two rotating shafts are arranged in parallel, and the two wafer clamping arms are swinging towards or away from each other.

[0009] Preferably, the wafer box reflow device is further provided with a detector for detecting whether a wafer is clamped between the two wafer clamping jaws.

[0010] Preferably, the film box transport mechanism includes a film box clamp with translation and lifting functions, a lifting lifter with lifting function, and a transporter that moves toward or away from the lifting lifter and has lifting function, the transporter drives the film box positioning piece to move, the lifting lifter is U-shaped, the opening of the lifting lifter is arranged toward the film box positioning piece, the part of the film box positioning piece used to lift the film box is a U-shaped piece with two openings arranged back to back, the upper surfaces of the two U-shaped pieces are the lifting parts for lifting the film box, and the two ends of the U-shaped opening of the lifting lifter are inwardly provided with support blocks matching the inner cavity of the U-shaped piece, the transporter carries the film box positioning piece, slides into the U-shaped inner cavity of the lifting lifter and moves downward to transport the film box to the lifting lifter, the film box clamp is arranged above the lifting lifter, and the lifting lifter is arranged on the loading and unloading mechanism.

[0011] Preferably, the film box clamp includes a telescope, two sliders and two film box clamp arms, the two film box clamp arms are slidably arranged on the clamp arm slide rail through the slider, the telescopic direction of the telescope is perpendicular to the sliding direction of the film box clamp arm, and L-shaped connecting rods are hinged on both sides of the telescopic end of the telescope, and the end of the L-shaped connecting rod away from the telescope is hinged to the slider.

[0012] Preferably, a supporting plate for supporting the film box is provided on one side of the movement path of the film box clamping claw.

[0013] Preferably, the wafer cleaning mechanism includes a first process tank, a second process tank, a third process tank and a fourth process tank arranged along the wafer transfer mechanism.

[0014] Preferably, the loading and unloading mechanism, the wafer transfer mechanism, the cassette transfer mechanism, and the wafer cleaning mechanism are all arranged inside the cabinet, and an observation window for observing the interior and a maintenance door for inspection and maintenance are provided on the cabinet.

[0015] Preferably, the cassette return device further includes an overall transfer mechanism with translation and lifting functions. The movement path of the overall transfer mechanism is located on one side of the wafer transfer mechanism, and loading and unloading platforms are provided at both the front end and the rear end of the movement path of the overall transfer mechanism.

[0016] The present invention mainly achieves the following technical effects compared with the prior art:

[0017] This device integrates transfer and cleaning. The loading and unloading mechanism can separate the cassette from the wafer. The separated wafer is transferred by the wafer transfer mechanism into the wafer cleaning mechanism to complete the cleaning process. The separated cassette is transferred by the cassette transfer mechanism to the loading and unloading mechanism at the end to wait for loading the cleaned wafer, effectively improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is the front view of the cassette return device in the embodiment of the present invention;

[0020] Figure 2 It is the front sectional view of the cassette return device in the embodiment of the present invention;

[0021] Figure 3 It is the axonometric view of the cassette return device in the embodiment of the present invention;

[0022] Figure 4 It is the left view of the cassette return device in the embodiment of the present invention;

[0023] Figure 5 It is the structural schematic diagram of the wafer transfer mechanism in the embodiment of the present invention;

[0024] Figure 6 It is the structural schematic diagram of the loading and unloading mechanism in the embodiment of the present invention;

[0025] Figure 7 It is the structural schematic diagram of the lifting jack in the embodiment of the present invention;

[0026] Figure 8Schematic diagram of the cassette gripper in the embodiment of the present invention;

[0027] Figure 9 Schematic diagram of the internal structure of the cassette return device in the embodiment of the present invention after removing the cabinet;

[0028] Figure 10 Schematic diagram of the connection between the transporter and the cassette positioning member in the embodiment of the present invention;

[0029] Figure 11 Schematic diagram of the structure of the cassette positioning member in the embodiment of the present invention;

[0030] Figure 12 Schematic diagram of the structure of the U-shaped opening side of the lifting and supporting device in the embodiment of the present invention;

[0031] Wherein, 1. Loading and unloading mechanism; 2. Wafer transfer mechanism; 3. Cassette transfer mechanism; 4. Wafer cleaning mechanism; 5. Cassette positioning member; 6. Wafer support plate; 7. Limiting plate; 8. Lifting part; 9. Wafer gripper; 10. Rotating shaft; 11. Wafer clamping arm; 12. Connecting rod; 13. Detector; 14. Cassette gripper; 15. Lifting and supporting device; 16. Transporter; 17. U-shaped member; 18. Block; 19. Expander; 20. Slide block; 21. Clamping arm slide rail; 22. Cassette clamping arm; 23. L-shaped connecting rod; 24. Supporting plate; 25. First process tank; 26. Second process tank; 27. Third process tank; 28. Fourth process tank; 29. Cabinet; 30. Observation window; 31. Maintenance door; 32. Feeding and discharging port; 33. Overall transfer mechanism; 34. Support block. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] The purpose of the present invention is to provide a cassette return device to solve the problems existing in the prior art, integrate transportation and cleaning, after separating the wafer from the cassette, the wafer can be directly transferred to the wafer cleaning mechanism to complete the cleaning process, and then the wafer is placed in the cassette after cleaning, and the cleaning efficiency is effectively improved.

[0034] To make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the drawings and specific implementation manners.

[0035] Please refer to as Figures 1 to 12As shown in the figure, a cassette return device is provided, which includes a loading and unloading mechanism 1 for separating or assembling a cassette and the wafers inside it, a wafer transfer mechanism 2 for transferring wafers, a cassette transfer mechanism 3 for transferring the cassette after separating from the wafers, and a wafer cleaning mechanism 4 for cleaning wafers. The wafer cleaning mechanism 4 is arranged corresponding to the movement path of the wafer transfer mechanism 2. The wafer transfer mechanism 2 drives the wafers into the wafer cleaning mechanism 4 for cleaning. The transfer paths of the wafer transfer mechanism 2 and the cassette transfer mechanism 3 overlap at both ends, and a loading and unloading mechanism 1 is arranged at the end. The loading and unloading mechanism 1 includes a cassette positioning member 5 and a wafer carrier 6 with a lifting function. The cassette positioning member 5 is provided with a through hole for the wafer carrier 6 to lift corresponding to the bottom opening of the cassette. The wafer carrier 6 moves up and down in the through hole of the cassette positioning member 5 and the bottom opening of the cassette to lift or lower the wafers to separate or assemble them from the cassette. This device integrates transfer and cleaning. The loading and unloading mechanism 1 can separate the cassette from the wafers. The separated wafers are transferred by the wafer transfer mechanism 2 into the wafer cleaning mechanism 4 to complete the cleaning process. The separated cassette is transferred by the cassette transfer mechanism 3 to the loading and unloading mechanism 1 at the end to wait for loading the wafers after cleaning, effectively improving the cleaning efficiency.

[0036] To ensure the stability of the cassette, two limit plates 7 are provided at the top of the cassette positioning member 5. The distance between the two limit plates 7 is the same as the distance between the outer side walls at both ends of the bottom opening of the cassette, realizing clamping the bottom of the cassette. To ensure the stability of wafer lifting, the top of the wafer carrier 6 is of a V-shaped or arc-shaped structure.

[0037] The loading and unloading mechanism 1 further includes a lifting part 8 with a lifting movement and a movement function towards or away from the cassette positioning member 5. The lifting part 8 is U-shaped. The two arms of the lifting part 8 are respectively arranged corresponding to both ends of the bottom of the cassette. The U-shaped opening of the lifting part 8 faces the cassette positioning member 5. The area of the U-shaped inner cavity of the lifting part 8 is larger than the area of the cassette positioning member 5. The two arms of the lifting part 8 are used to lift both ends of the bottom of the cassette, and the cassette positioning member 5 is used to lift the middle of the bottom of the cassette. The lifting part 8 moves up and down on the outer peripheral side of the cassette positioning member 5 to place the cassette on the cassette positioning member 5.

[0038] To ensure that the lifting part 8 stably lifts the cassette, protrusions for clamping both ends of the bottom opening of the cassette from the inside or outside can be provided on both arms of the lifting part 8. The principle of the protrusions clamping the cassette is the same as that of the limit plates 7 clamping.

[0039] The wafer transfer mechanism 2 includes a wafer gripper 9 that has a lifting motion and the function of moving between the loading and unloading mechanisms 1 on both sides. In this embodiment, the wafer gripper 9 includes two rotating motors, two rotating shafts 10, and two wafer gripping arms 11. The rotating motors are drivingly connected to the rotating shafts 10, and the rotating shafts 10 are drivingly connected to the wafer gripping arms 11. The two rotating shafts 10 are arranged in parallel, and the two wafer gripping arms 11 swing towards or away from each other to complete the gripping of the wafer. In order to reduce the weight of the wafer gripping arms 11, the middle part of the wafer gripping arms 11 can be hollowed out; in other embodiments, other grippers that can hold the wafer can be selected.

[0040] In other embodiments, the wafer transfer mechanism 2 can be set to include multiple wafer grippers 9, so as to sequentially grip multiple wafers and enable the multiple wafers to complete the cleaning process in sequence, improving the efficiency. When multiple wafer grippers 9 are set, the multiple wafer grippers 9 have a cleaning path and a return path. The two ends of the cleaning path coincide with the two ends of the transfer path of the cassette transfer mechanism 3, and the two ends of the return path coincide with the two ends of the cleaning path and form a circular ring, and the multiple wafer grippers 9 move in a cycle.

[0041] A flexible pad can be provided on the clamping side of the wafer gripping arm 11 to prevent damage to the wafer during clamping.

[0042] The ends of the two wafer gripping arms 11 close to the rotating shaft 10 are connected by a connecting rod 12. The two ends of the connecting rod 12 are respectively rotatably connected to the two wafer gripping arms 11. The setting of the connecting rod 12 can improve the structural strength and stability.

[0043] The cassette return device is also provided with a detector 13 for detecting whether a wafer is clamped between the two wafer grippers 9. The detector 13 can be an infrared induction sensor or other detectors that can realize the detection of whether a wafer is clamped between the two wafer grippers 9.

[0044] The detector 13 can be directly provided on the driving structure for driving the wafer gripper 9 to move and move along with the wafer gripper 9 to monitor in real time whether a wafer is clamped between the two wafer grippers 9.

[0045] The cassette transfer mechanism 3 includes a cassette gripper 14 with translation and lifting functions, a lifting support 15 with a lifting function, and a transfer device 16 that moves towards or away from the lifting support 15 and has a lifting function. The transfer device 16 drives the cassette positioning member 5 to move. The lifting support 15 is U-shaped, and the opening of the lifting support 15 faces the cassette positioning member 5. The part of the cassette positioning member 5 for supporting the cassette is two U-shaped members 17 with their openings facing away from each other. The upper surfaces of the two U-shaped members 17 are the supporting parts for supporting the cassette. It is possible to set the upper surface of the U-shaped member 17 to be bent upward to form a limiting plate 7. At both ends of the U-shaped opening of the lifting support 15, there are inwardly provided supporting blocks 34 that match the inner cavity of the U-shaped member 17. The supporting blocks 34 can be integrally provided with the lifting support 15 to improve the structural strength. The area of the U-shaped inner cavity of the lifting support 15 is larger than the occupied area of the two U-shaped members 17. The transfer device 16 carries the cassette positioning member 5 and slides into the U-shaped inner cavity of the lifting support 15 and moves downward to transfer the cassette to the lifting support 15. The cassette gripper 14 is arranged above the lifting support 15, and the lifting support 15 is arranged on the loading and unloading mechanism 1.

[0046] The upper surface of the lifting support 15 is provided with a clamping block 18 for clamping the cassette to improve the stability when driving the cassette to move. The principle of the clamping block 18 clamping the cassette is the same as that of the limiting plate 7. When the clamping block 18 is set, it is necessary to ensure that the inner cavity of the U-shaped member 17 can pass through the supporting block 34 and the clamping block 18.

[0047] In this embodiment, the cassette gripper 14 includes a telescopic device 19, two sliders 20, and two cassette clamping arms 22. The two cassette clamping arms 22 are slidably arranged on the clamping arm slide rail 21 through the sliders 20. The telescopic direction of the telescopic device 19 is perpendicular to the sliding direction of the cassette clamping arms 22. On both sides of the telescopic end of the telescopic device 19, there are respectively hinged L-shaped connecting rods 23. The end of the L-shaped connecting rod 23 far from the telescopic device 19 is hinged to the slider 20. When the telescopic device 19 expands and contracts, it drives the L-shaped connecting rods 23 on both sides to swing. When the L-shaped connecting rods 23 swing, the end far from the telescopic device 19 will generate a lateral movement, thereby driving the slider 20 to slide on the clamping arm slide rail 21, thereby adjusting the distance between the two cassette clamping arms 22. In this embodiment, the two cassette clamping arms 22 drive the cassette to move through the flange protruding outward from the top of the cassette; in other embodiments, other grippers that can clamp the cassette can be selected.

[0048] Since the cleaning process takes longer than the transfer of the cassette, a supporting plate 24 for supporting the cassette can be arranged on one side of the movement path of the cassette gripper 14. When the wafer is being cleaned, the cassette can be placed on the supporting plate 24 first and wait.

[0049] The wafer cleaning mechanism 4 includes a first process tank 25, a second process tank 26, a third process tank 27, and a fourth process tank 28 arranged along the wafer transfer mechanism 2. The four process tanks correspond to the pre-cleaning process, chemical cleaning process, final cleaning process, and drying process of the wafer respectively.

[0050] The loading and unloading mechanism 1, wafer transfer mechanism 2, cassette transfer mechanism 3, and wafer cleaning mechanism 4 are all arranged inside the cabinet 29. An observation window 30 for observing the interior and a maintenance door 31 for inspection and maintenance are provided on the cabinet 29.

[0051] The cabinet 29 is provided with loading and unloading ports 32 corresponding to the loading and unloading mechanisms 1 at both ends.

[0052] Since in an actual factory building, it may involve the transfer of cassettes that do not need to be cleaned, an overall transfer mechanism 33 with translation and lifting functions is also provided to integrally transfer the cassettes carrying wafers. The movement path of the overall transfer mechanism 33 is located on one side of the wafer transfer mechanism 2. Loading and unloading platforms are provided at both the front end and the rear end of the movement path of the overall transfer mechanism 33. The loading and unloading platforms can be integrated on the loading and unloading mechanism 1. The structure of the loading and unloading platforms can be the same as that of the lifting parts 8, that is, lifting parts 8 are provided on both sides of the loading and unloading mechanism 1. The lifting parts 8 on both sides of the loading and unloading mechanisms 1 at both ends correspond one by one. The lifting parts 8 corresponding to each other on one side correspond to the movement path of the wafer transfer mechanism 2, and the lifting parts 8 corresponding to each other on the other side correspond to the movement path of the overall transfer mechanism 33.

[0053] In this embodiment, the overall transfer mechanism 33 has the same structure as the wafer transfer mechanism 2.

[0054] In this embodiment, for the movements of the wafer carrier 6, lifting parts 8, wafer grippers 9, cassette grippers 14, lifting and supporting device 15, and transfer device 16, the shorter distances can be controlled by electric / pneumatic / hydraulic telescopic rods, and the longer distances can be controlled by reduction motors. The principle of the reduction motor control is as follows: Tracks are set on the movement path, racks are set on the tracks, the reduction motor is connected to the device that needs to move, and the reduction motor drives the gear to move. The gear meshes with the rack on the track. In this way, when the reduction motor drives the gear to move, the gear can move on the rack.

[0055] During actual use, the cassette with the wafer is placed at the loading and unloading opening 32 on the feeding side of the cabinet body 29. The lifting part 8 lifts the cassette and moves it to the cassette positioning part 5, and transfers the cassette to the cassette positioning part 5. The wafer support plate 6 moves upward to eject the wafer from the cassette. After the wafer gripper 9 grabs the wafer, the wafer support plate 6 descends back to its original position. The wafer gripper 9 drives the wafer to pass through the first process tank 25, the second process tank 26, the third process tank 27, and the fourth process tank 28 in sequence, and then enters the loading and unloading mechanism 1 on the discharging side, waiting to place the wafer on the wafer support plate 6. The transporter 16 moves the cassette after the wafer is grabbed to one side, and adjusts the height of the cassette so that the U-shaped part 17 passes through the supporting block 34 and enters the inside of the lifting and supporting device 15. Then, the transporter 16 lowers the height of the cassette positioning part 5 to transfer the cassette to the lifting and supporting device 15. After the transfer, the transporter 16 drives the cassette positioning part 5 back to its original position to wait for the next cassette. The lifting and supporting device 15 drives the cassette to move upward. When it reaches a certain height, the cassette gripper 14 grabs the cassette and moves it to the supporting plate 24. When the wafer cleaning is about to be completed, the cassette gripper 14 grabs the cassette on the supporting plate 24 and places it on the lifting and supporting device 15 on the discharging side. The lifting and supporting device 15 on the discharging side drives the cassette to move downward. Then, the transporter 16 of the loading and unloading mechanism 1 on the discharging side drives the cassette positioning part 5 to rise from the lifting and supporting device 15 to lift the cassette, and drives the cassette positioning part 5 to slide out from the U-shaped opening of the lifting and supporting device 15. The transporter 16 drives the cassette positioning part 5 to move to the position corresponding to the lifting part 8. The wafer support plate 6 extends, and after the wafer gripper 9 places the cleaned wafer on the wafer support plate 6, the wafer support plate 6 descends to realize the wafer assembly into the cassette. The cassette with the assembled wafer is driven by the lifting part 8 to the loading and unloading opening 32 on the discharging side of the cabinet body 29.

[0056] Adaptations made according to actual requirements are all within the protection scope of the present invention.

[0057] It should be noted that for those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0058] In the present invention, specific examples are used to illustrate the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation on the present invention.

Claims

1. A film box reflow device, characterized in that: It includes a loading and unloading mechanism for separating or assembling a wafer box and the wafers therein, a wafer transport mechanism for transporting wafers, a wafer box transport mechanism for transporting a wafer box separated from a wafer, and a wafer cleaning mechanism for cleaning the wafers. The wafer cleaning mechanism is arranged corresponding to the movement path of the wafer transport mechanism. The wafer transport mechanism drives the wafers to enter the wafer cleaning mechanism for cleaning. The two ends of the transport path of the wafer transport mechanism and the wafer box transport mechanism overlap and the loading and unloading mechanism is arranged at the end. The loading and unloading mechanism includes a wafer box positioning member and a wafer support plate with a lifting and lowering function. The wafer box positioning member is provided with a through hole for lifting and lowering the wafer support plate corresponding to the bottom opening of the wafer box. The wafer support plate is lifted and lowered in the through hole of the wafer box positioning member and the bottom opening of the wafer box to lift or put down the wafer to achieve separation or assembly with the wafer box. The wafer transfer mechanism includes a wafer clamping claw that has the functions of lifting and lowering and moving between the loading and unloading mechanisms on both sides; The film box transport mechanism includes a film box clamp with translation and lifting functions, a lifting lifter with lifting function, and a transporter that moves toward or away from the lifting lifter and has lifting function, the transporter drives the film box positioning piece to move, the lifting lifter is U-shaped, the opening of the lifting lifter is arranged toward the film box positioning piece, the part of the film box positioning piece used to lift the film box is a U-shaped piece with two openings arranged back to back, the upper surfaces of the two U-shaped pieces are the lifting parts for lifting the film box, and the two ends of the U-shaped opening of the lifting lifter are inwardly provided with support blocks matching the inner cavity of the U-shaped piece, the transporter carries the film box positioning piece to slide into the U-shaped inner cavity of the lifting lifter and moves downward to transport the film box to the lifting lifter, the film box clamp is arranged above the lifting lifter, and the lifting lifter is arranged on the loading and unloading mechanism.

2. The film box reflow device according to claim 1, characterized in that: The loading and unloading mechanism also includes a lifting part with the function of lifting and lowering movement and movement toward or away from the film box positioning member. The lifting part is U-shaped, and the two arms of the lifting part are respectively arranged corresponding to the two ends of the bottom of the film box. The U-shaped opening of the lifting part is arranged toward the film box positioning member. The lifting part lifts and lowers on the outer peripheral side of the film box positioning member to place the film box on the film box positioning member.

3. The film box reflow device according to claim 1, characterized in that: The wafer clamp includes two rotating motors, two rotating shafts and two wafer clamping arms. The rotating motors are transmission-connected to the rotating shafts, and the rotating shafts are transmission-connected to the wafer clamping arms. The two rotating shafts are arranged in parallel, and the two wafer clamping arms are swing-arranged to face or back to back.

4. The film box reflow device according to claim 3, characterized in that: The wafer box reflow device is also provided with a detector for detecting whether a wafer is clamped between the two wafer clamping claws.

5. The film box reflow device according to claim 1, characterized in that: The film box clamp includes a telescope, two sliders and two film box clamp arms. The two film box clamp arms are slidably arranged on the clamp arm slide rails through the sliders. The telescopic direction of the telescope is perpendicular to the sliding direction of the film box clamp arms. L-shaped connecting rods are hinged on both sides of the telescopic end of the telescope, and the end of the L-shaped connecting rod away from the telescope is hinged to the slider.

6. The film box reflow device according to claim 1, characterized in that: A supporting plate for supporting the film box is arranged on one side of the moving path of the film box clamping claw.

7. The film box reflow device according to claim 1, characterized in that: The wafer cleaning mechanism includes a first process tank, a second process tank, a third process tank and a fourth process tank arranged along the wafer transfer mechanism.

8. The film box reflow device according to claim 1, characterized in that: The loading and unloading mechanism, the wafer transfer mechanism, the film box transfer mechanism and the wafer cleaning mechanism are all arranged in a cabinet, and the cabinet is provided with an observation window for observing the interior and an inspection door for detection and maintenance.

9. The film box reflow device according to claim 1, characterized in that: The wafer box reflow device also includes an overall transfer mechanism with translation and lifting functions. The movement path of the overall transfer mechanism is located on one side of the wafer transfer mechanism. The front and rear ends of the movement path of the overall transfer mechanism are provided with loading and unloading platforms.

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