Wafer clamping arms and systems, methods and apparatus for controlling wafer clamping arms

Abstract

This invention discloses a wafer clamping arm and a system, method, and apparatus for controlling the wafer clamping arm. The wafer clamping arm includes a clamping arm, a sensor and peripheral support, and a transmission structure. The sensor and peripheral support, connected to the clamping arm, includes a receiving sensor support for the receiving end of a through-beam sensor and a transmitting sensor support for the transmitting end of the through-beam sensor. The bottoms of the receiving sensor support and the transmitting sensor support are both large hydrophobic angle structures. The transmission structure is configured to drive the clamping arm to lift the wafer to be processed from the semiconductor wet processing environment via control commands. The control commands are obtained based on the through-beam sensor determining that the clamping arm is holding the wafer to be processed. Thus, when the wafer clamping arm lifts the wafer from the wet polishing environment, it can divert the path of condensed water droplets, allowing the water droplets to separate and fall quickly, improving the reliability of sensor detection.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to wafer clamping arms and systems, methods and apparatus for controlling wafer clamping arms. Background Technology

[0002] With the development of science and technology, semiconductor products are receiving increasing attention, and the automation level of semiconductor product manufacturing is also increasing. A semiconductor wafer refers to the silicon substrate used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the wafer manufacturing process, one process involves grinding both sides of the wafer. There are many wafer grinding techniques, but the most commonly used grinding method in the modern semiconductor industry is chemical-mechanical polishing (CMP). This method uses chemical-mechanical polishing to flatten the etched surface of the wafer to a nanometer-level smoothness, while also considering various indicators such as warpage and flatness of the silicon wafer. This avoids problems encountered by the silicon wafer in the photolithography process in high-end applications. Therefore, wafer grinding is a crucial part of semiconductor processing technology.

[0003] For double-sided processing units, wafer grinding requires placing the wafer into the groove of the carrier and then into the semiconductor wet process environment for grinding and other processing. In the existing technology, these processes are done manually, which results in low production efficiency, high labor intensity for operators, and low precision, which can easily affect wafer quality. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, this invention provides a wafer clamping arm and a system, method, and apparatus for controlling the wafer clamping arm. The technical problem to be solved by this invention is achieved through the following technical solution:

[0005] A first aspect of the present invention provides a wafer clamping arm, characterized in that it comprises: a clamping arm, a sensor and a peripheral support, and a transmission structure, wherein,

[0006] The sensor and its peripheral support are connected to the clamping arm, including: a receiving sensor support for the receiving end of the clamp-and-shoot sensor, and a transmitting sensor support for the transmitting end of the clamp-and-shoot sensor, wherein the bottom of the receiving sensor support and the transmitting sensor support are respectively large hydrophobic angle structures.

[0007] The transmission structure is configured to drive the clamping arm to lift the wafer to be processed from the semiconductor wet process environment through control commands. The control commands are obtained based on the condition that the clamping arm is holding the wafer to be processed, determined by the through-beam sensor.

[0008] A second aspect of the present invention provides a system for controlling a wafer clamping arm, comprising: a control device, and the aforementioned wafer clamping arm; wherein,

[0009] The control device, connected to the through-beam sensor and the transmission structure of the wafer clamping arm, is configured to, when the through-beam sensor determines that the wafer clamping arm is holding the wafer to be processed, control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

[0010] A third aspect of the present invention provides a method for controlling a wafer clamping arm, comprising:

[0011] Control the transmitter of the through-beam sensor to send a detection signal;

[0012] If the receiver of the through-beam sensor does not receive a detection signal, it is determined that the wafer clamping arm is holding the wafer to be processed.

[0013] The transmission structure controls the wafer clamping arm to pull the wafer to be processed out of the semiconductor wet process environment.

[0014] A fourth aspect of the present invention provides an apparatus for controlling a wafer clamping arm, the apparatus including a processor and a memory storing program instructions, the processor being configured to execute the method for controlling a wafer clamping arm as described above when executing the program instructions.

[0015] The beneficial effects of this invention are:

[0016] The wafer clamping arm includes a clamping arm, a sensor and peripheral support, and a transmission structure. After the through-beam sensor determines that the clamping arm has gripped the wafer to be processed, the clamping arm can hold the wafer and enter the wet polishing environment, improving the safety of semiconductor processing. The clamping arm can also be controlled to perform corresponding operations, improving semiconductor production efficiency and accuracy. Furthermore, the bottom of the sensor and peripheral support features a large hydrophobic angle structure. This large hydrophobic angle structure can divert and condense water droplets, allowing water droplets to quickly separate and drip from both sides of the through-beam sensor when the wafer is removed from the wet polishing environment. This reduces the probability of water droplets entering the through-beam sensor and forming interfering water mist or water film on the lens surface, further improving the reliability of sensor detection.

[0017] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0018] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is a schematic diagram of a wafer clamping arm provided in an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of a wafer clamping arm provided in an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of a water droplet comb for a wafer clamping arm provided in an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of a water droplet comb for a wafer clamping arm provided in an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the architecture of a wafer clamping arm control system provided in an embodiment of the present invention;

[0025] Figure 6 This is a flowchart illustrating a wafer clamping arm control method provided in an embodiment of the present invention.

[0026] Figure 7 This is a schematic diagram of a control device for a wafer clamping arm provided in an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of a wafer clamping arm control device provided in an embodiment of the present invention.

[0028] In the attached diagram: 1. Detection clamping arm; 2. Clamping arm; 3. Receiver sensor bracket; 4. Receiver sensor cover plate; 5. Transmitter sensor bracket; 6. Transmitter sensor bracket cover plate; 7. Supporting ramp; 8. Finger clamping; 9. Detection clamping block; 10. Clamping block; 11. Clamping cylinder; 12. Cylinder bracket; 13. Fiber optic amplifier cover plate; 14. Cylinder cover plate; 15. Through-beam sensor; 16. Semiconductor wafer; 17. Fiber optic amplifier. Detailed Implementation

[0029] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0030] With the development of science and technology, the automation level of semiconductor product manufacturing is getting higher and higher. During the grinding process, the wafer needs to be placed in a wet process environment. In this embodiment of the invention, the wafer to be processed can be held by a clamping arm composed of a detection clamping arm, a holding arm, a support inclined plate, and clamping fingers, and then put into the wet grinding environment for processing. This improves the safety of semiconductor processing and allows the clamping arm to be controlled to operate accordingly, thereby improving semiconductor production efficiency and production accuracy. Furthermore, after the wafer is lifted from the wet polishing environment by the clamping arm, moisture and water droplets in the wet process environment may flow and intrude into the sensor lens surface, forming interfering water mist and water film, which may cause sensor misjudgment. Therefore, in this embodiment of the invention, the wafer clamping arm adopts one or more of the following structures: a flow diversion and avoidance structure, a large hydrophobic angle structure, a descending wedge-shaped inclined surface, and curved surface connection. This enables the wafer clamping arm to quickly condense and separate water droplets when leaving the wet environment and lifting the wafer. This achieves a hydrophobic structure around the wafer sensor support, diverting and condensing water droplets, allowing the water droplets to quickly separate and fall off, preventing them from flowing and intruding into the sensor lens surface to form interfering water mist and water film, thus avoiding sensor misjudgment alarms. This improves the reliability of sensor detection and, in turn, increases the operational rate of the wafer clamping arm during environment switching.

[0031] A first aspect of this invention provides a wafer clamping arm, comprising: a clamping arm, a sensor and peripheral support, and a transmission structure, wherein,

[0032] The clamping arm is configured to clamp the wafer.

[0033] The sensor and its peripheral support, connected to the clamping arm, include: a through-beam sensor and a corresponding sensor support, configured such that when the clamping arm clamps the wafer, the receiver of the through-beam sensor cannot receive the detection signal sent by the transmitter.

[0034] The transmission structure is also connected to the clamping arm and is configured to drive the clamping arm to lift the wafer to be processed out of the semiconductor wet process environment through control commands. The control commands are obtained based on the condition that the clamping arm is holding the wafer to be processed, determined by the through-beam sensor.

[0035] In some embodiments, such as Figure 1 and Figure 2 As shown, the clamping arm includes: a detection clamping arm 1, a gripping arm 2, a support ramp 7, and clamping fingers 8. The clamping fingers 8 are respectively installed at both ends of the detection clamping arm 1 and on the gripping arm 2. In this way, the wafer 16 can be clamped by multiple clamping fingers 8.

[0036] To automatically detect whether the wafer clamping arm has clamped the wafer and automatically determine the wafer's position, in this embodiment of the invention, such as... Figure 1As shown, the sensor and its peripheral support include: a receiving sensor support 3, a transmitting sensor support 5, and a through-beam sensor 15; wherein, the receiving sensor support 3 installed on the detection clamping arm 1 clamps the receiving end of the through-beam sensor 15, and the transmitting sensor support 5 installed on the detection clamping arm 1 clamps the transmitting end of the through-beam sensor 15.

[0037] The transmitter of the through-beam sensor 15 can emit a detection signal. When the clamping finger 8 is not clamping the wafer, the receiver of the through-beam sensor 15 can receive the detection signal. However, if the clamping finger 8 is clamping the wafer, the receiver of the through-beam sensor 15 cannot receive the detection signal. Therefore, the through-beam sensor 15 can be used to determine whether the clamping arm is clamping the semiconductor wafer.

[0038] To enable automated control of the wafer clamping arm to clamp the wafer into or out of the wet process environment, or to control the wafer clamping arm to perform other movements or flips, the wafer clamping arm may also include a transmission structure. Through the transmission structure, the wafer clamping arm can be controlled to lift the wafer to be processed out of the semiconductor wet process environment or to perform other movements.

[0039] like Figure 1 and Figure 2 As shown, the transmission structure includes: a clamping cylinder 11, a cylinder bracket 12 for mounting the clamping cylinder 11, a detection clamping block 9 connecting the clamping cylinder 11 and the detection clamping arm 1, and a clamping block 10 connecting the clamping cylinder 11 and the clamping arm 2. In this way, the detection clamping arm 1 and the clamping arm 2 can be driven to move up and down by controlling the cylinder.

[0040] Of course, in the embodiments of the present invention, the transmission structure is not limited to this, and may be other transmission structures, such as solenoid valves, piston structures and corresponding connecting blocks, which will not be listed in detail.

[0041] Because the wafer clamping arm holds the wafer and enters the wet process environment for corresponding processing, in order to protect various components and ensure electrical safety, etc., Figure 1 and Figure 2 As shown, the wafer clamping arm may further include: a receiving sensor cover plate 4, a transmitting sensor cover plate 6, and a cylinder cover plate 14; thus, the receiving sensor cover plate 4, together with the receiving sensor bracket 3, protects the receiving end of the through-beam sensor 15, while the transmitting sensor cover plate, together with the transmitting sensor bracket 5, protects the transmitting end of the through-beam sensor 15. The cylinder cover plate 14 can protect the clamping cylinder 11.

[0042] Of course, such as Figure 1 and Figure 2As shown, the wafer clamping arm may include: an optical fiber amplifier 17, and an optical fiber amplifier cover 13 that protects the optical fiber amplifier 17, which can further improve the reliability and accuracy of semiconductor processing.

[0043] As can be seen, in this embodiment of the invention, after the wafer clamping arm is determined to be clamping the wafer to be processed according to the through-beam sensor, the clamping arm can clamp the wafer into the wet polishing environment, which improves the safety of semiconductor processing and can control the clamping arm to perform corresponding operations, thereby improving semiconductor production efficiency and production accuracy.

[0044] After the wafer is lifted from the wet polishing environment by the clamping arm, moisture and water droplets in the wet process environment may flow onto the sensor lens surface, forming interfering water mist or water film, which may cause sensor misjudgment. Therefore, in some embodiments of the present invention, the wafer clamping arm adopts one or more of the following structures: a flow diversion and avoidance structure, a large hydrophobic angle structure, a descending wedge-shaped slope, and curved surface connection. This enables the wafer clamping arm to quickly condense and separate water droplets when leaving the wet environment and lifting the wafer. It also achieves a hydrophobic structure around the wafer sensor support, diverting and condensing water droplets, allowing the water droplets to quickly separate and fall off, preventing them from flowing onto the sensor lens surface and forming interfering water mist or water film, thus avoiding sensor misjudgment alarms. This improves the reliability of sensor detection and further enhances the working efficiency of the wafer clamping arm.

[0045] Enlarged views of the wafer inspection sensor and its surrounding support, as well as a schematic diagram of the water droplet combing process, are shown below. Figure 3 As shown, the bottom of the receiving sensor bracket 3 and the transmitting sensor bracket 5 are both large hydrophobic angle structures. When the wafer clamping arm is pulled out from the semiconductor wet process environment, water droplets hanging on the surface of the wafer clamping arm will reach the bottom of the receiving sensor bracket 3 and the transmitting sensor bracket 5. The large hydrophobic angle structure can divert and condense the water droplets, allowing the water droplets to quickly separate and drip from both sides of the through-beam sensor 15. This reduces the probability of water droplets immersing in the through-beam sensor and forming interfering water mist or water film on the lens surface, thus improving the reliability of sensor detection.

[0046] Of course, in some embodiments, such as Figure 3 As shown, the surfaces of the receiving sensor holder 3 and the transmitting sensor holder 5 include descending wedge-shaped ramps. Thus, when the wafer clamping arm is pulled out of the semiconductor wet process environment, water droplets hanging on the surface of the wafer clamping arm descend along the surfaces of the receiving sensor holder 3 and the transmitting sensor holder 5. The descending wedge-shaped ramps contract, and gravity condenses and amplifies the water droplets, which also accelerates the separation and dripping speed of the water droplets, reducing the amount of water droplets hanging on the surface of the through-beam sensor 15, thereby protecting the through-beam sensor 15.

[0047] In some embodiments, the receiving sensor cover 4 and the receiving sensor bracket 3 together not only protect the receiving end of the through-beam sensor 15, but also form a current diversion and avoidance structure. Similarly, the transmitting sensor cover 4 and the transmitting sensor bracket 5 together not only protect the transmitting end of the through-beam sensor 15, but also form a current diversion and avoidance structure. This allows water droplets that may drip onto the surface of the wafer clamping arm when it is pulled out of the semiconductor wet process environment to be diverted by the current diversion and avoidance structure, reducing the amount of water droplets dripping onto the surface of the through-beam sensor 15 and thus protecting the through-beam sensor 15.

[0048] like Figure 3 As shown, in some embodiments, the surfaces of the shunt and avoidance structure are connected by curved surfaces. In this way, when the wafer clamping arm is pulled out from the semiconductor wet process environment, the interface boundary curve amplifies the water droplets. The interface boundary curve arc and the bottom of the surface boundary arc are stretched and separated by gravity. Similarly, the speed of water droplet separation and dripping can be accelerated, and the water droplets flowing on the surface of the through-beam sensor 15 can be reduced, which can also protect the through-beam sensor 15.

[0049] Not only that, such as Figure 4 As shown, the clamping finger 8 includes a V-groove arc-shaped bottom and a V-groove annular sidewall. Thus, when the wafer clamping arm is pulled out of the semiconductor wet process environment, the V-groove arc-shaped bottom interface of the wafer clamping finger 8 diverts water droplets, while the V-groove annular sidewall interface contracts and condenses water droplets. This also accelerates the separation and dripping speed of water droplets, reduces water droplets hanging on the wafer clamping arm, and allows the wafer clamping arm to dry quickly, further improving the stability and working efficiency of the wafer clamping arm.

[0050] Combination Figure 3 and Figure 4 In some embodiments of the present invention, when the wafer clamping arm is pulled out from the semiconductor wet process environment, the water droplets flowing on the surface of the wafer clamping arm can be diverted and diverted through a diversion and avoidance structure and a large hydrophobic angle structure. The water droplets are amplified by gravity condensation on a descending wedge-shaped inclined surface, amplified by flow along the interface boundary curve, and separated by gravity stretching at the bottom of the interface boundary curve arc and the surface boundary arc. Furthermore, the water droplets can be diverted at the bottom interface of the V-shaped groove of the wafer clamping finger 8, and the water droplets are amplified by rheological contraction on the V-shaped groove annular sidewall interface, further diverting the water. This reduces the likelihood of water droplets intruding into the sensor lens surface and forming interfering water mist or water film, thus avoiding false alarms from the sensor, improving sensor detection reliability, and ultimately increasing the operational rate and efficiency of the wafer clamping arm during environment switching.

[0051] The wafer clamping arm provided in this invention can be applied to the semiconductor wafer manufacturing process, and with the development of science and technology, it can automate the manufacturing of semiconductor products. That is, the wafer clamping arm can be controlled by a control device to manufacture semiconductor products. Therefore, the system for the wafer clamping arm includes: a control device and the aforementioned wafer clamping arm. The control device is connected to both a photoelectric sensor and a transmission structure of the wafer clamping arm, and is configured to, when the photoelectric sensor determines that the wafer clamping arm is holding the wafer to be processed, control the wafer clamping arm via the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

[0052] In some embodiments, the control device may also control the wafer clamping arm to move the wafer to be processed into the semiconductor wet process environment for processing by means of a transmission structure when the wafer clamping arm is determined to be clamped by the through-beam sensor.

[0053] The following example illustrates the automated manufacturing process of the wafer clamping arm system provided in the embodiments of the present invention.

[0054] like Figure 5 As shown, a system for a wafer clamping arm may include a control device 100 and a wafer clamping arm 200. The control device 100 may include a CPU, a microcontroller unit (MCU), etc., and may be located in the wafer clamping arm 200 or be a separate device electrically connected to the wafer clamping arm 200.

[0055] 200 wafer clamping arms can Figure 1 and Figure 2 As shown, the transmission mechanism of the wafer clamping arm 200 includes a clamping cylinder, a cylinder support, etc. Therefore, the control device 100 can control the movement of the clamping cylinder by controlling the control command, thereby controlling the movement of the wafer clamping arm.

[0056] Furthermore, the control device 100 can also be connected to the through-beam sensor of the wafer clamping arm 200, which can control the transmitter of the through-beam sensor to emit detection signals and can also acquire the detection signals collected by the receiver of the through-beam sensor.

[0057] Therefore, during the wet process of semiconductor wafer fabrication, the transmitting end of the through-beam sensor is controlled to emit a detection signal. If the receiving end of the through-beam sensor does not receive a detection signal, it is determined that the wafer clamping arm is clamping the wafer to be processed. At this time, the control device 100 can control the clamping cylinder through control commands, and drive the clamping arm by detecting the clamping blocks, holding blocks, etc., to place the wafer to be processed held by the wafer clamping arm into the semiconductor wet process environment for processing.

[0058] After the semiconductor wet process is completed, the control device 100 can control the transmitter of the through-beam sensor to send a detection signal according to the received instruction information. If the receiver of the through-beam sensor does not receive a detection signal, it can determine that the wafer clamping arm has clamped the wafer to be processed. The instruction information may be sent by the user or generated after obtaining the wafer processing parameters or reaching the set processing time.

[0059] Then, the control device 100 can control the clamping cylinder through control commands, and drive the clamping arm by detecting the clamping blocks, holding blocks, etc., to pull the wafer to be processed held by the wafer clamping arm out of the semiconductor wet process environment. During the lifting process, the water droplets flowing on the surface of the wafer clamping arm can be diverted and dispersed through the diversion and avoidance structure and the large hydrophobic angle structure of the wafer clamping arm. The water droplets are amplified by gravity contraction on the descending wedge-shaped slope of the wafer clamping arm, and by the flow and amplification of water droplets at the interface boundary curve. The water droplets are separated by gravity stretching at the bottom of the interface boundary curve arc and the bottom of the surface boundary arc. In addition, the water droplets can be diverted by the V-shaped groove arc bottom interface of the wafer clamping fingers in the wafer clamping arm, and the water droplets are amplified by rheological contraction on the V-shaped groove annular sidewall interface. This further diverts the water, thereby reducing the water droplets from intruding into the surface of the through-beam sensor lens and forming interfering water mist or water film, avoiding the probability of sensor false alarms, improving sensor detection reliability, and thus improving the environmental switching uptime and working efficiency of the wafer clamping arm.

[0060] As can be seen, in this embodiment, the control device can control the through-beam sensor and transmission structure of the wafer clamping arm, realizing the automation of semiconductor wafers entering and exiting the semiconductor wet process environment, thus improving the production efficiency of wafer processing. Furthermore, due to the large hydrophobic angle structure, flow-diverting and obstacle-avoiding structure, curved surface connection, V-groove, and other hydrophobic lifting structures of the wafer clamping arm, water droplets can quickly drip off when the wafer clamping arm is pulled out of the semiconductor wet process environment. This reduces the likelihood of water droplets intruding into the sensor lens surface and forming interfering water mist or water film, thus avoiding the probability of sensor false alarms, improving sensor detection reliability, and consequently increasing the operational rate and working efficiency of the wafer clamping arm during environment switching.

[0061] In systems control equipment used for wafer clamping arms, the through-beam sensors and transmission structures of the wafer clamping arms can be controlled to automate the entry and exit of semiconductor wafers from the semiconductor wet process environment. For example... Figure 6 As shown, in some embodiments, the process for controlling the wafer clamping arm may include:

[0062] Step 601: Control the transmitter of the through-beam sensor to send a detection signal.

[0063] Upon receiving a first instruction message, the control device can control the transmitter of the through-beam sensor to emit a detection signal. This first instruction message may be sent by the user after the completion of the semiconductor wet process, or it may be generated after determining the completion of the semiconductor wet process based on the obtained wafer processing parameters, or it may be generated after reaching a set processing time.

[0064] Step 602: If it is determined that the receiving end of the through-beam sensor has not received a detection signal, it is determined that the wafer clamping arm is clamping the wafer to be processed.

[0065] Step 603: Control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

[0066] If the wafer clamping arm is like Figure 1 and Figure 2 As shown, the control equipment can control the clamping cylinder via control commands. By detecting the clamping blocks, gripping blocks, etc., it drives the clamping arm to lift the wafer to be processed from the semiconductor wet process environment. Similarly, due to the large hydrophobic angle structure, shunt and avoidance structure, curved surface connection, V-groove and other hydrophobic lifting structures of the wafer clamping arm, water droplets can quickly drip off when the wafer clamping arm is lifted from the semiconductor wet process environment. This reduces the amount of water droplets intruding into the sensor lens surface and forming interfering water mist or water film, avoiding the probability of sensor false alarms and improving sensor detection reliability.

[0067] Of course, in this embodiment of the invention, the control device can also control the wafer clamping arm to place the wafer to be processed into the semiconductor wet process environment. That is, the method further includes: controlling the transmitting end of the through-beam sensor to send a detection signal; determining that the wafer clamping arm is clamping the wafer to be processed when the receiving end of the through-beam sensor does not receive a detection signal; and controlling the wafer clamping arm to place the wafer to be processed into the semiconductor wet process environment through a transmission structure. In some embodiments, the transmitting end of the through-beam sensor can be controlled to send a detection signal according to the received second instruction information.

[0068] As can be seen, in this embodiment, the control device can control the through-beam sensor and transmission structure of the wafer clamping arm, thereby automating the entry and exit of semiconductor wafers into and out of the semiconductor wet process environment and improving the production efficiency of wafer processing.

[0069] Based on the above process of controlling the wafer clamping arm, a device for controlling the wafer clamping arm can be constructed. Figure 7 This invention provides a device for controlling a wafer clamping arm. This device can be applied to the control equipment of a system for a wafer clamping arm, and is connected to the through-beam sensor and transmission structure of the wafer clamping arm, respectively. Figure 7 As shown, the device 700 includes: a first control module 710, a first determination module 720, and a second control module 730.

[0070] The first control module 710 is configured to control the transmitter of the through-beam sensor to send detection signals.

[0071] The first determining module 720 is configured to determine that the wafer clamping arm is clamping the wafer to be processed when the receiving end of the determining sensor does not receive a detection signal.

[0072] The second control module 730 is configured to control the wafer clamping arm via a transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

[0073] In some embodiments, the first control module 710 is specifically configured to control the transmitter of the through-beam sensor to send a detection signal according to a received first control instruction.

[0074] In some embodiments, the first control module 710 is further configured to control the transmitter of the through-beam sensor to send a detection signal according to the received second control command.

[0075] In some embodiments, the second control module 730 is further configured to control the wafer clamping arm via a transmission structure to place the wafer to be processed into the semiconductor wet process environment.

[0076] As can be seen, in this embodiment of the invention, for semiconductor wet processing, the device for controlling the wafer clamping arm can control the through-beam sensor and transmission structure of the wafer clamping arm, realizing the automation of semiconductor wafers entering and leaving the semiconductor wet processing environment, and improving the production efficiency of wafer processing. Furthermore, due to the large hydrophobic angle structure, flow-diverting and clearance structure, curved surface connection, V-groove, and other hydrophobic lifting structures of the wafer clamping arm, water droplets can quickly drip off when the wafer clamping arm is pulled out of the semiconductor wet processing environment, reducing the intrusion of water droplets into the sensor lens surface to form interfering water mist or water film, avoiding the probability of sensor false alarms, and improving sensor detection reliability.

[0077] Combination Figure 8 This invention provides a device 800 for controlling a wafer clamping arm, comprising:

[0078] The processor 1000 and memory 1001 may further include a communication interface 1002 and a bus 1003. The processor 1000, communication interface 1002, and memory 1001 can communicate with each other via the bus 1003. The communication interface 1002 can be used for information transmission. The processor 1000 can call logical instructions stored in the memory 1001 to execute the method for controlling a wafer clamping arm described in the above embodiment.

[0079] Furthermore, the logic instructions in the aforementioned memory 1001 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium.

[0080] The memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of the present invention. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, it implements the method for controlling the wafer clamping arm in the above method embodiments.

[0081] The memory 1001 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the terminal device. Furthermore, the memory 1001 may include high-speed random access memory and may also include non-volatile memory.

[0082] This invention provides a wafer clamping arm control device, including: a processor and a memory storing program instructions, wherein the processor is configured to execute a wafer clamping arm control method when executing the program instructions.

[0083] This invention provides a storage medium storing program instructions that, when executed, perform the method described above for controlling a wafer clamping arm.

[0084] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0085] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0086] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0087] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A wafer clamping arm, characterized in that, include: The clamping arm, sensors and surrounding supports, and transmission structure are included. The sensor and its peripheral support are connected to the clamping arm, including: a receiving sensor support (3) for the receiving end of the clamping through-beam sensor (15), and a transmitting sensor support (5) for the transmitting end of the clamping through-beam sensor (15), and the bottom of the receiving sensor support (3) and the transmitting sensor support (5) are respectively large hydrophobic angle structures. The transmission structure is configured to drive the clamping arm to pull the wafer to be processed out of the semiconductor wet process environment by means of control commands, wherein the control commands are obtained based on the condition that the clamping arm is holding the wafer to be processed according to the through-beam sensor (15); It also includes: a receiving sensor cover plate (4) and a transmitting sensor cover plate (6); wherein, The receiving sensor cover plate (4) and the receiving sensor bracket (3) form a diversion and avoidance structure; The transmitter sensor cover (6) and the transmitter sensor bracket (5) form a diversion and avoidance structure; The surfaces of the receiving sensor bracket (3) and the transmitting sensor bracket (5) include: a descending wedge-shaped ramp, and curved surfaces connecting the surfaces of the diversion and avoidance structure.

2. The wafer clamping arm as described in claim 1, characterized in that, The clamping arm includes: a detection clamping arm (1), a gripping arm (2), a support ramp (7), and a finger clamping arm (8); The clamping fingers (8) are respectively installed on both ends of the detection clamping arm (1) and the clamping arm (2). When the clamping fingers (8) clamp the wafer to be processed, the receiving end of the through-beam sensor (15) cannot receive the detection signal emitted by the transmitting end of the through-beam sensor (15).

3. The wafer clamping arm as described in claim 2, characterized in that, The finger clamping device (8) includes: a V-groove arc bottom and a V-groove annular sidewall.

4. The wafer clamping arm as described in any one of claims 1-3, characterized in that, The transmission structure includes: a clamping cylinder (11), a cylinder bracket (12) for mounting the clamping cylinder (11), a detection clamping block (9) connecting the clamping cylinder (11) and the detection clamping arm (1), and a clamping block (10) connecting the clamping cylinder (11) and the clamping arm (2).

5. A system for controlling a wafer clamping arm, characterized in that, Includes: a control device, and a wafer clamping arm as described in any one of claims 1-4; wherein, The control device, connected to the through-beam sensor and the transmission structure of the wafer clamping arm, is configured to, when the through-beam sensor determines that the wafer clamping arm is holding the wafer to be processed, control the wafer clamping arm through the transmission structure to pull the wafer to be processed out of the semiconductor wet process environment.

6. A method for controlling a wafer clamping arm, characterized in that, The wafer clamping arm as described in any one of claims 1-4, the method comprising: Control the transmitter of the through-beam sensor to send a detection signal; If the receiver of the through-beam sensor does not receive a detection signal, it is determined that the wafer clamping arm is holding the wafer to be processed. The transmission structure controls the wafer clamping arm to pull the wafer to be processed out of the semiconductor wet process environment.

7. A device for controlling a wafer clamping arm, the device comprising a processor and a memory storing program instructions, characterized in that, The processor is configured to perform the method for controlling a wafer clamping arm as described in claim 6 when executing the program instructions.

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