Semiconductor electrostatic chuck and preparation method thereof

Abstract

A semiconductor electrostatic chuck and a preparation method thereof, belonging to the field of semiconductor preparation. The semiconductor electrostatic chuck includes: a chuck body, an adsorption assembly and a ventilation assembly; the preparation method includes: chuck installation, trough body and connecting pipe assembly, top rod installation and top cover assembly. The present application adopts an installation assembly to install the electrode assembly, uses the outer shell as a carrier to stably assemble the electrostatic chuck, and uses a detachable top cover to achieve fixation, which is convenient for the preparation of the electrostatic chuck, and a heat dissipation mechanism is provided to achieve heat dissipation of the electrode assembly, and a channel for air flow is provided around the electrode assembly, and an air flow is formed in the middle of the top cover to diffuse outward. The negative pressure adsorption formed can achieve auxiliary fixation of semiconductor materials and reduce the power of the electrode assembly; by providing an air flow channel and forming an air flow in the middle of the top cover to diffuse outward, the top rod and the connecting pipe are connected at the same time, which can be adjusted according to the adsorption force during processing to ensure a stable adsorption function and realize the processing of semiconductor materials.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor preparation, and in particular relates to a semiconductor electrostatic chuck and a preparation method thereof. Background Art

[0002] A semiconductor electrostatic chuck is an adsorption device based on the principle of static electricity, widely used in semiconductor production lines and precision machining equipment. It utilizes the principle of electrostatic adsorption to evenly clamp ultra-thin wafers or other tiny objects. The principle is that when a statically charged object approaches a non-static object, electrostatic induction causes the non-static object to generate a charge of opposite polarity, resulting in mutual attraction and a phenomenon known as "electrostatic adsorption." A semiconductor electrostatic chuck generates high-voltage static electricity through an electrostatic generator, which then forms an electrostatic magnetic field through an electrostatic adsorption unit to electrostatically adsorb objects. As a key piece of equipment in semiconductor manufacturing and precision machining, semiconductor electrostatic chucks offer advantages such as high precision, high efficiency, non-destructiveness, flexibility, and environmental protection and energy conservation. With the continuous development of the semiconductor industry and driven by technological innovation, the semiconductor electrostatic chuck market is expected to continue to grow and diversify.

[0003] Electrostatic chucks are crucial in semiconductor processing. Their advantages include:

[0004] 1) Uniform adsorption force;

[0005] 2) Less pollution;

[0006] 3) Can work in vacuum environment.

[0007] The key and difficulty of electrostatic chuck is temperature control. Taking dry etching as an example, dry etching requires the wafer to be controlled at a specific temperature between 100°C and -70°C to maintain certain etching characteristics. This is mainly achieved through the following two methods:

[0008] 1) Increase gas convection between the wafer surface and the electrostatic chuck surface to dissipate heat (the cooling gas usually used in semiconductor processes is helium);

[0009] 2) Heat is dissipated through heat conduction on the surface of the electrostatic chuck.

[0010] Semiconductor electrostatic chucks are commonly used in processes such as chip packaging, mask handling and wafer processing. When processing wafers, the semiconductor material needs to be placed on the surface of the electrostatic chuck for adsorption and fixation before fine processing. Therefore, the stability of the semiconductor material fixation is crucial. When the existing electrostatic chuck is used, the heat generated by the electrode layer will affect the processing of the semiconductor material. Although the air holes are set to play a heat dissipation role, when the power of the electrode layer is too large, it is still easy to cause the temperature to rise, affecting the processing quality of the semiconductor. In addition, the adsorption force of the electrostatic chuck is not easy to control stably. After the electrostatic chuck is used for a long time, it is not easy to maintain, which increases the difficulty of disassembly and assembly during inspection. Summary of the Invention

[0011] In order to solve the technical problems that semiconductor electrostatic chucks are difficult to maintain and heat cannot be effectively dissipated, the present invention provides a semiconductor electrostatic chuck and a preparation method thereof.

[0012] The present invention solves the above technical problems through the following technical solutions:

[0013] The present invention provides a semiconductor electrostatic chuck, comprising:

[0014] A suction cup body, the suction cup body including a shell, a heat dissipation mechanism fixedly mounted on the bottom of the shell, the heat dissipation mechanism being attached to the bottom surface of the mounting assembly, the mounting assembly being fixedly mounted to the top interior of the shell by screws, and an electrode assembly being fixedly connected to the interior of the mounting assembly;

[0015] An adsorption component is movably connected to the top of the housing, is fitted with the top of the mounting component, and has an external vent for air circulation formed in the middle of the adsorption component;

[0016] The ventilation assembly consists of a connecting pipe, which is respectively inserted into the shell and the mounting assembly. The connecting pipe is distributed corresponding to the edge of the electrode assembly, and a guide groove connected to the external diffusion port is opened on the top of the electrode assembly.

[0017] In the present technical solution, a convex edge is provided on the top of the shell, and a number of evenly distributed positioning grooves are provided on the surface of the convex edge. Each positioning groove is an L-shaped structure for adapting to the adsorption component, and a positioning hole is provided inside the convex edge at the horizontal part of the bottom end of the positioning groove. The adsorption component is composed of a top cover, and the cross-section of the top cover is a U-shaped structure and is fixedly connected with positioning blocks. The positioning blocks are evenly distributed on the inner wall of the top cover and corresponding to the positioning grooves. When the top cover is installed, the positioning blocks are slidably connected to the inside of the positioning grooves. The top cover and the positioning blocks are both threadedly connected with bolts, and the bolts extend to the inside of the positioning holes on the surface of the convex edge.

[0018] In the present technical solution, the heat dissipation mechanism includes a radiator, which is fixedly mounted to the bottom of the outer shell, and is fitly connected to the bottom of the trough body. The radiator is made of metal and has a number of evenly distributed heat dissipation grooves. The two ends of the radiator are respectively connected with the water inlet pipe and the water outlet pipe, and the water inlet pipe and the water outlet pipe are respectively fixedly connected with the two ends of the heat exchange pipe. The heat exchange pipe is an S-shaped structure and is distributed inside the heat dissipation groove. The two ends of the bottom of the outer shell are respectively connected with the air inlet pipe and the air outlet pipe, and the air inlet pipe and the air outlet pipe are respectively distributed corresponding to the two sides of the radiator.

[0019] In the present technical solution, the mounting assembly includes a trough body, the outer bottom of the trough body is fixedly connected to the side trough, the cross-sections of the trough body and the side trough are both U-shaped structures, the inner wall of the side trough is fixedly connected to the inside of the shell by screws, and a ring-shaped cover plate is provided above the side trough and the trough body, and the cover plate is fixedly connected to the edge of the side trough and the trough body respectively by screws, and an insulating layer is provided on the inner wall of the trough body, and an electrode assembly is fixedly installed inside the trough body above the insulating layer.

[0020] In the present technical solution, the electrode assembly includes a shell, a metal body is fixedly installed inside the shell, a guide plate with a spiral structure is fixedly connected to the edge of the shell, the guide plate is located inside the cavity formed by the shell and the groove body, two centrally symmetrical guide grooves are opened on the top of the shell, and a tip is provided on the top of the shell located between the guide grooves, and the tip is fixedly connected to the connecting plate through a connecting rod, and the connecting plate is a flat conical structure.

[0021] In the present technical solution, a metal disk is embedded and installed in the middle of the top cover, and a number of evenly distributed protrusions are provided on the surface of the metal disk. The top cover, the metal disk and the protrusion surfaces are all coated with a coating layer. A channel for air circulation is opened in the middle of the metal disk, and the channel is connected to the diffuser and is smaller than the diameter of the diffuser. A connecting rod is provided inside the channel, and the inner diameter of the channel is larger than the diameter of the connecting disk, and the connecting disk is located inside the diffuser to form an inclined flow channel that diffuses outward.

[0022] In the present technical solution, two external threads are provided on the surface of the connecting pipe, and the connecting pipe is connected through the internal thread of one of the external thread side grooves. One end of the connecting pipe is movably plugged into the inner wall of the bottom end of the groove body, and a sealing ring is sleeved on the surface of the connecting pipe, and the sealing ring is fitly connected to the surface of the groove body. A blocking block and a sealing plug with an annular structure are movably sleeved on the surface of the connecting pipe, and the blocking block is sleeved on another external thread. A sealing plug is fixedly connected to one side of the blocking block, and the sealing plug is chiseled and connected to the inside of the shell.

[0023] In this technical solution, a sleeve is provided on the surface of the connecting pipe, and a pressure sensor is movably sleeved inside the sleeve, and the pressure sensor is connected to the inside of the sleeve through a first spring. The inside of the connecting pipe located on one side of the sleeve is movably sleeved with the push rod, and the top of the push rod is respectively inserted into the cover plate and the top cover. The push rod is made of insulating material and is located at the edge of the top cover.

[0024] In this technical solution, a fixed plate is fixedly connected to the middle part of the push rod, and the fixed plate is connected to the connecting pipe through a second spring. The second spring is sleeved on the surface of the push rod, and a cylinder is fixedly installed on the bottom of the cover plate. The cylinder is correspondingly arranged on one side of the fixed plate, and the other side of the fixed plate is distributed correspondingly to the pressure sensor. The interior of the fixed plate is movably sleeved on the surface of the guide rod, and the guide rod is fixedly connected to the inside of the side groove.

[0025] In this technical solution, a method for preparing a semiconductor electrostatic chuck comprises the following steps:

[0026] (1) Install the suction cup, fix the heat exchange tube to the inside of the shell, and connect the water inlet pipe and outlet pipe respectively. Install the radiator to the bottom of the shell so that the heat exchange tube is located inside the heat dissipation tank and complete the assembly;

[0027] (2) Assemble the tank body and the connecting pipe. Install the side tank to the inner wall of the shell with screws, so that the bottom of the tank body fits with the radiator. Pass the connecting pipe through the side tank and the bottom of the tank body, so that the sealing ring rests on the surface of the tank body to achieve sealing, and make the connecting pipe fit into the inner wall of the tank body. Then tighten the block and drive the sealing plug to fit into the inside of the shell to complete the assembly. Finally, install the cover plate to the top of the tank body and the side tank with screws;

[0028] (3) Installation of the ejector pin: Before installing the cover plate, glue or weld the sleeve to the surface of the connecting pipe, insert the ejector pin through the connecting pipe to complete the ejector pin fixation, and sleeve the cover plate on the surface of the ejector pin when installing.

[0029] (4) Assemble the top cover. Press the top cover tightly against the surface of the cover plate. Retract the top cover into the slot body. After the top cover drives the positioning block to move into position inside the positioning slot, rotate the top cover and tighten the bolts to fix it. At this time, the top rod is extended by the second spring, and the metal disk fits with the top of the motor assembly shell. Finally, connect the air inlet pipe to the air pump, connect the water inlet pipe to the water pump, and finally connect the connecting pipe to the air pump to complete the preparation of the semiconductor electrostatic suction cup.

[0030] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0031] The positive progress effect of the present invention is:

[0032] The above-mentioned semiconductor electrostatic chuck and its preparation method use an installation assembly to install the electrode assembly, use the outer shell as a carrier for stable assembly, and use a detachable top cover for fixation, which can facilitate the assembly of the electrostatic chuck, improve the convenience of disassembly and assembly, and facilitate the preparation of the electrostatic chuck. A heat dissipation mechanism is set inside the electrostatic chuck to realize heat dissipation of the electrode assembly, and a channel for air flow is set around the electrode assembly, and an air flow is formed in the middle of the top cover to diffuse outward. Negative pressure adsorption is achieved by using the Bernoulli principle, which can play a role of partial adsorption force, thereby reducing the power of the electrode assembly and avoiding excessive power that causes the temperature to be unable to dissipate quickly and affect the processing quality of the semiconductor material. At the same time, the top rod and the connecting pipe are connected, and can be adjusted according to the adsorption force during processing to ensure stable adsorption function and realize smooth processing of semiconductor materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0034] Figure 2 It is a schematic diagram of the front view structure of the interior of the present invention;

[0035] Figure 3 For the present invention Figure 2 Schematic diagram of the local enlarged structure at A in the middle;

[0036] Figure 4 This is a front view structural diagram of the connecting pipe of the present invention;

[0037] Figure 5 For the present invention Figure 2 Schematic diagram of the local enlarged structure at B in the middle;

[0038] Figure 6 Schematic diagram of the top view of the electrode assembly of the present invention;

[0039] Figure 7 This is a schematic diagram of the half-section structure of the shell of the present invention;

[0040] Figure 8 It is a schematic diagram of the three-dimensional structure of the shell of the present invention;

[0041] Figure 9 It is a schematic diagram of the three-dimensional structure of the shell of the present invention;

[0042] Figure 10 It is a schematic diagram of the three-dimensional structure of the connecting pipe of the present invention.

[0043] Description of reference numerals:

[0044] 100, suction cup body; 101, housing; 102, flange; 103, positioning groove; 104, positioning hole; 105, air inlet pipe; 106, air outlet pipe; 107, radiator; 108, heat sink; 109, water inlet pipe; 110, heat exchange pipe; 111, water outlet pipe;

[0045] 200, mounting assembly; 201, tank body; 202, insulation layer; 203, side groove; 204, cover plate;

[0046] 300, electrode assembly; 301, housing; 302, guide plate; 303, guide groove; 304, tip; 305, connecting rod; 306, connecting plate;

[0047] 400, adsorption assembly; 401, top cover; 402, metal plate; 403, coating layer; 404, protrusion; 405, channel; 406, diffuser; 407, positioning block; 408, bolt;

[0048] 500, ventilation assembly; 501, connecting pipe; 502, sleeve; 503, pressure sensor; 504, first spring; 505, push rod; 506, cylinder; 507, second spring; 508, fixing plate; 509, external thread; 510, blocking block; 511, sealing plug; 512, sealing ring; 513, guide rod. DETAILED DESCRIPTION

[0049] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0050] like Figure 1-10 As shown, the semiconductor electrostatic chuck includes:

[0051] The suction cup body 100 includes a housing 101. A heat dissipation mechanism is fixedly mounted on the bottom of the housing 101 and adheres to the bottom surface of the mounting assembly 200. The mounting assembly 200 is fixed to the top of the housing 101 by screws, and an electrode assembly 300 is fixedly connected to the interior of the mounting assembly 200.

[0052] Adsorption assembly 400, the adsorption assembly 400 is movably connected to the top of the housing 101, the adsorption assembly 400 is closely connected to the top of the mounting assembly 200, and an external vent for air circulation is formed in the middle of the adsorption assembly 400;

[0053] The ventilation component 500 is composed of a connecting pipe 501, which is respectively inserted into the shell 101 and the installation component 200. The connecting pipe 501 is distributed corresponding to the edge of the electrode assembly 300, and a guide groove 303 connected to the external diffusion port is provided on the top of the electrode assembly 300.

[0054] The top of the shell 101 is provided with a flange 102, and the surface of the flange 102 is provided with several evenly distributed positioning grooves 103, each positioning groove 103 is an L-shaped structure for adapting to the adsorption component 400, and a positioning hole 104 is provided inside the flange 102 at the horizontal part of the bottom end of the positioning groove 103, and the adsorption component 400 is composed of a top cover 401, and the cross-section of the top cover 401 is a U-shaped structure and is fixedly connected with a positioning block 407, the positioning blocks 407 are evenly distributed on the inner wall of the top cover 401 and corresponding to the positioning groove 103, and when the top cover 401 is installed, the positioning blocks 407 are slidably connected to the inside of the positioning groove 103, the top cover 401 and the positioning block 407 are both threadedly connected with the bolt 408, and the bolt 408 extends to the inside of the positioning hole 104 on the surface of the flange 102.

[0055] By adopting such a solution, the convex edge 102 can be provided to cooperate with the top cover 401, so that the top cover 401 and the outer shell 101 can be socketed to complete the assembly. When the top cover 401 is assembled, the positioning block 407 can be driven to move inside the positioning groove 103. When the positioning block 407 moves to the bottom of the positioning groove 103, the top cover 401 can be rotated to drive the positioning block 407 to move to the horizontal part of the positioning groove 103. At this time, the bolt 408 corresponds to the positioning hole 104. Tighten the bolt 408 to firmly install the top cover 401. When disassembling, you only need to tighten the bolt 408 and rotate the top cover 401 to achieve disassembly and assembly.

[0056] The heat dissipation mechanism includes a radiator 107, which is fixedly mounted to the bottom of the shell 101. The radiator 107 is fitted and connected to the bottom of the tank body 201. The radiator 107 is made of metal and has a number of evenly distributed heat dissipation grooves 108. The two ends of the radiator 107 are respectively connected with the water inlet pipe 109 and the water outlet pipe 111. The water inlet pipe 109 and the water outlet pipe 111 are respectively fixedly connected with the two ends of the heat exchange pipe 110. The heat exchange pipe 110 is an S-shaped structure and is distributed inside the heat dissipation groove 108. The two ends of the bottom of the shell 101 are respectively connected with the air inlet pipe 105 and the air outlet pipe 106. The air inlet pipe 105 and the air outlet pipe 106 are respectively distributed corresponding to the two sides of the radiator 107.

[0057] As an expansion solution, after the water inlet pipe 109 and the water outlet pipe 111 are connected to a water pump and a pipe, the cooling water is transported from the water inlet pipe 109 to the heat exchange pipe 110 and discharged from the water outlet pipe 111 by the water pump. The radiator 107 absorbs the heat generated by the electrode assembly 300. At this time, the heat exchange pipe 110 adsorbs the heat of the radiator 107 and discharges it, thereby realizing rapid cooling of the heat exchanger. The air inlet pipe 105 is connected to an air pump. Before the water pump is started, the air pump is started first to allow the external air to enter the interior of the shell 101 from the air inlet pipe 105, and be discharged from multiple heat dissipation slots 108, and finally discharged from the air outlet pipe 106, thereby realizing the discharge of heat after being absorbed by the radiator 107.

[0058] The installation assembly 200 includes a trough body 201, the outer bottom of the trough body 201 is fixedly connected to the side groove 203, the cross-sections of the trough body 201 and the side groove 203 are both U-shaped structures, the inner wall of the side groove 203 is fixedly connected to the inside of the shell 101 by screws, and a ring-shaped cover plate 204 is provided above the side groove 203 and the trough body 201. The cover plate 204 is fixedly connected to the edge of the side groove 203 and the trough body 201 respectively by screws, and the inner wall of the trough body 201 is provided with an insulating layer 202, and the electrode assembly 300 is fixedly installed inside the trough body 201 above the insulating layer 202.

[0059] As a specific solution, after the heat dissipation mechanism is installed, the trough body 201 and the side trough 203 are installed inside the outer shell 101, and the side trough 203 is fixed to the inner wall of the outer shell 101 by screws, and the insulating layer 202 is used to provide insulation protection between the trough body 201 and the shell 301, and the guide plate 302 on the surface of the shell 301 is installed to the inside of the trough body 201 to realize the flow channel for air circulation, and form an air dissipation channel 405 with the middle part of the top cover 401.

[0060] The electrode assembly 300 includes a shell 301, a metal body is fixedly installed inside the shell 301, a guide plate 302 with a spiral structure is fixedly connected to the edge of the shell 301, and the guide plate 302 is located inside the cavity formed by the shell 301 and the groove body 201. Two centrally symmetrical guide grooves 303 are opened on the top of the shell 301, and a tip 304 is provided on the top of the shell 301 located between the guide grooves 303. The tip 304 is fixedly connected to the connecting plate 306 through a connecting rod 305, and the connecting plate 306 is a flat conical structure.

[0061] As a specific solution, after the connecting pipe 501 is installed, the air pump is connected to the connecting pipe 501 to transport the clean gas to the interior of the tank body 201. After being guided by the guide plate 302, the airflow is transported upward in a spiral shape and enters the interior of the guide groove 303, so that the gas enters the interior of the channel 405 from the tip 304, and is guided by the connecting plate 306 to diffuse from the diffusion port 406 to the surroundings. When the semiconductor material is adsorbed, it is supported by the protrusion 404, so that the airflow is dispersed in the gap formed between the semiconductor material and the top cover 401, and the airflow tends to flow in a horizontal direction, so that a negative pressure is formed at the bottom of the semiconductor material, thereby improving the adsorption capacity. At this time, the power of the electrode layer can be reduced, and the stable fixation of the semiconductor material can be achieved by using electrostatic adsorption and air pressure adsorption.

[0062] A metal disk 402 is embedded in the middle of the top cover 401, and a number of evenly distributed protrusions 404 are provided on the surface of the metal disk 402. The surfaces of the top cover 401, the metal disk 402 and the protrusions 404 are all coated with a coating layer 403. A channel 405 for air circulation is opened in the middle of the metal disk 402. The channel 405 is connected to the diffuser 406 and is smaller than the diameter of the diffuser 406. A connecting rod 305 is provided inside the channel 405. The inner diameter of the channel 405 is larger than the diameter of the connecting disk 306, and the connecting disk 306 is located inside the diffuser 406 to form an inclined flow channel that diffuses outward.

[0063] With this solution, a dielectric layer is formed by coating layer 403 to provide insulation between the semiconductor material and the metal disk 402. The connecting rod 305 is used to fix the connecting disk 306. When the top cover 401 is installed, the channel 405 and the connecting disk 306 can be smoothly assembled, which improves the assembly convenience and enables the formation of an air flow channel. The formed airflow can not only improve the adsorption capacity of the electrostatic suction cup, but also serve as a heat dissipation function for the semiconductor material.

[0064] Two external threads 509 are provided on the surface of the connecting pipe 501, and the connecting pipe 501 is connected to the internal thread of the groove 203 by one of the external threads 509. One end of the connecting pipe 501 is movably plugged into the inner wall of the bottom end of the groove body 201, and a sealing ring 512 is sleeved on the surface of the connecting pipe 501, and the sealing ring 512 is fitly connected to the surface of the groove body 201. A ring-shaped blocking block 510 and a sealing plug 511 are movably sleeved on the surface of the connecting pipe 501, and the blocking block 510 is threadedly sleeved with the other external thread 509. A sealing plug 511 is fixedly connected to one side of the blocking block 510, and the sealing plug 511 is chime-connected with the inside of the outer shell 101.

[0065] As a specific solution, when installing the connecting pipe 501, after passing the connecting pipe 501 through the outer shell 101, the side groove 203 and the tank body 201, the connecting pipe 501 is tightened inside the side groove 203 through one of the external threads 509, so that the sealing ring 512 is pressed against the surface of the tank body 201. At this time, the connecting pipe 501 extends to the inside of the tank body 201, and then the blocking block 510 is tightened on one of the external threads 509. At this time, the blocking block 510 drives the sealing plug 511 to be embedded in the inside of the outer shell 101, and the sealing plug 511 is compressed and deformed to fit tightly on the surface of the connecting pipe 501 between the two external threads 509, thereby achieving sealing at the connection, and facilitating the installation of the connecting pipe 501, so that the air entering through the connecting pipe 501 forms spiral gas inside the tank body 201 and is discharged.

[0066] The surface of the connecting pipe 501 is provided with a sleeve 502, and a pressure sensor 503 is movably sleeved inside the sleeve 502, and the pressure sensor 503 is connected to the inside of the sleeve 502 through a first spring 504. The inside of the connecting pipe 501 on one side of the sleeve 502 is movably sleeved with a push rod 505, and the top of the push rod 505 is respectively inserted through the cover plate 204 and the top cover 401. The push rod 505 is made of insulating material and is located at the edge of the top cover 401; the middle of the push rod 505 is fixedly connected to the cover plate 204 and the top cover 401. It is connected to a fixed plate 508, which is connected to the connecting pipe 501 through a second spring 507. The second spring 507 is sleeved on the surface of the push rod 505. A cylinder 506 is fixedly installed on the bottom of the cover plate 204. The cylinder 506 is correspondingly arranged on one side of the fixed plate 508, and the other side of the fixed plate 508 is distributed correspondingly to the pressure sensor 503. The interior of the fixed plate 508 is movably sleeved on the surface of the guide rod 513, and the guide rod 513 is fixedly connected to the inside of the side groove 203.

[0067] As a specific solution, after the connecting pipe 501 is installed, the sleeve 502 is welded or bonded to the surface of the connecting pipe 501, and after the push rod 505 is assembled, the cover plate 204 is installed. At this time, the cylinder 506 will contact the top of the fixed plate 508. Before processing the semiconductor material, the cylinder 506 is shortened. At this time, the elasticity of the second spring 507 pushes the push rod 505 upward. When the semiconductor material is placed on the suction cup using a bracket, the push rod 505 supports the semiconductor material. The cylinder 506 starts to push the fixed plate 508 downward. At this time, the push rod 505 retracts to stably place the semiconductor material on the surface of the protrusion 404. When the conductive material is adsorbed by electrostatic adsorption and negative pressure, the cylinder 506 resets and separates from the fixed plate 508. At this time, the push rod 505 is limited by the semiconductor material, and the fixed plate 508 drives the pressure sensor 503 to move downward. At this time, the first spring 504 is in a stationary state, so that the pressure value detected by the pressure sensor 503 remains stable. When the adsorption force of the semiconductor material changes, the slight vibration of the semiconductor material will cause the value of the pressure sensor 503 to change. At this time, the cylinder 506 extends to contact the fixed plate 508, driving the push rod 505 to separate from the semiconductor material to increase the adsorption force, so that the adsorption pressure can be adjusted during the processing process.

[0068] In this technical solution, a method for preparing a semiconductor electrostatic chuck comprises the following steps:

[0069] (1) Install the suction cup, fix the heat exchange tube 110 to the inside of the shell 101, and connect the water inlet pipe 109 and the water outlet pipe 111 respectively. Install the radiator 107 to the bottom of the shell 101, so that the heat exchange tube 110 is located inside the heat dissipation groove 108, and then complete the assembly;

[0070] (2) Assemble the tank body 201 and the connecting pipe 501. Install the side groove 203 to the inner wall of the shell 101 with screws, so that the bottom of the tank body 201 is in contact with the radiator 107. Pass the connecting pipe 501 through the side groove 203 and the bottom of the tank body 201, so that the sealing ring 512 is against the surface of the tank body 201 to achieve sealing, so that the connecting pipe 501 is in contact with the inner wall of the tank body 201. Then tighten the block 510 and drive the sealing plug 511 to fit inside the shell 101 to achieve assembly. Finally, install the cover plate 204 to the tank body 201 and the top of the side groove 203 with screws.

[0071] (3) Installation of the ejector pin 505: Before installing the cover plate 204, glue or weld the sleeve 502 to the surface of the connecting pipe 501, insert the ejector pin 505 through the connecting pipe 501 to complete the fixing of the ejector pin 505. When installing the cover plate 204, sleeve it on the surface of the ejector pin 505.

[0072] (4) Assemble the top cover 401. Press the top cover 401 against the surface of the cover plate 204. Retract the top cover 401 into the slot body 201. After the top cover 401 drives the positioning block 407 to move into position inside the positioning slot 103, rotate the top cover 401 and tighten the bolt 408 to fix it. At this time, the top rod 505 is extended by the second spring 507, and the metal disk 402 fits with the top of the motor assembly housing 301. Finally, connect the air inlet pipe 105 to the air pump, connect the water inlet pipe 109 to the water pump, and finally connect the connecting pipe 501 to the air pump to complete the preparation of the semiconductor electrostatic suction cup.

[0073] The present invention is not limited to the above-described embodiments. Any changes in shape or structure fall within the scope of the present invention. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention. Such changes and modifications fall within the scope of the present invention.

Claims

1. A semiconductor electrostatic chuck, characterized in that: include: A suction cup body (100), the suction cup body (100) comprising a shell (101), a heat dissipation mechanism fixedly mounted on the bottom of the shell (101), the heat dissipation mechanism being attached to the bottom surface of the mounting assembly (200), the mounting assembly (200) being fixedly mounted inside the top end of the shell (101), and an electrode assembly (300) being fixedly connected inside the mounting assembly (200); An adsorption component (400), the adsorption component (400) being movably sleeved with the top of the housing (101), the adsorption component (400) being fitted and connected with the top of the mounting component (200), and an external diffusion port for air circulation being formed in the middle of the adsorption component (400); The top of the housing (101) is provided with a convex edge (102), and the surface of the convex edge (102) is provided with a plurality of evenly distributed positioning grooves (103), each positioning groove (103) is an L-shaped structure for matching with the adsorption component (400), and a positioning hole (104) is provided inside the convex edge (102) at the horizontal part of the bottom end of the positioning groove (103), and the adsorption component (400) is composed of a top cover (401), and the cross section of the top cover (401) is U-shaped. The structure is fixedly connected with positioning blocks (407), the positioning blocks (407) are evenly distributed on the inner wall of the top cover (401) and are distributed corresponding to the positioning grooves (103), and when the top cover (401) is installed, the positioning blocks (407) are slidably connected to the inside of the positioning grooves (103), the top cover (401) and the positioning blocks (407) are both threadedly connected to bolts (408), and the bolts (408) extend to the inside of the positioning holes (104) on the surface of the flange (102); A metal disk (402) is embedded and installed in the middle of the top cover (401), and a plurality of evenly distributed protrusions (404) are provided on the surface of the metal disk (402). The surfaces of the top cover (401), the metal disk (402) and the protrusions (404) are all coated with a coating layer (403). A channel (405) for air circulation is opened in the middle of the metal disk (402), and the channel (405) is connected to the diffuser (406) and is smaller than the diameter of the diffuser (406). A connecting rod (305) is provided inside the channel (405), and the inner diameter of the channel (405) is larger than the diameter of the connecting disk (306), and the connecting disk (306) is located inside the diffuser (406) to form an inclined flow channel that diffuses outward, so that the airflow is dispersed outward from the gap formed between the semiconductor material and the top cover (401), and the airflow flows in a horizontal direction, so that a negative pressure is formed at the bottom of the semiconductor material; A ventilation assembly (500), the ventilation assembly (500) comprising a connecting pipe (501), the connecting pipe (501) respectively penetrating and plugging into the housing (101) and the mounting assembly (200), the connecting pipe (501) being arranged corresponding to the edge of the electrode assembly (300), and a guide groove (303) communicating with an external diffuser is provided at the top of the electrode assembly (300).

2. The semiconductor electrostatic chuck according to claim 1, wherein: The heat dissipation mechanism comprises a radiator (107), the radiator (107) being fixedly mounted to the bottom of the housing (101), the radiator (107) being fitted and connected to the bottom of the tank body (201), the radiator (107) being made of metal and being provided with a plurality of evenly distributed heat dissipation slots (108), the two ends of the radiator (107) being respectively connected through a water inlet pipe (109) and a water outlet pipe (111), the water inlet pipe (109) and the water outlet pipe (111) being respectively fixedly connected to the two ends of a heat exchange pipe (110), the heat exchange pipe (110) being an S-shaped structure and being distributed inside the heat dissipation slot (108), the two ends of the bottom of the housing (101) being respectively connected through an air inlet pipe (105) and an air outlet pipe (106), the air inlet pipe (105) and the air outlet pipe (106) being respectively distributed correspondingly to two sides of the radiator (107).

3. The semiconductor electrostatic chuck according to claim 1, wherein: The mounting assembly (200) comprises a trough body (201), the outer bottom of the trough body (201) is fixedly connected to the side trough (203), the cross-sections of the trough body (201) and the side trough (203) are both U-shaped structures, the inner wall of the side trough (203) is fixedly connected to the inside of the housing (101) by means of screws, a cover plate (204) of an annular structure is provided above the side trough (203) and the trough body (201), the cover plate (204) is fixedly connected to the edge of the side trough (203) and the trough body (201) by means of screws, and an insulating layer (202) is provided on the inner wall of the trough body (201), and an electrode assembly (300) is fixedly installed inside the trough body (201) above the insulating layer (202).

4. The semiconductor electrostatic chuck according to claim 3, wherein: The electrode assembly (300) comprises a shell (301), a metal body is fixedly installed inside the shell (301), a guide plate (302) with a spiral structure is fixedly connected to the edge of the shell (301), the guide plate (302) is located inside a cavity formed by the shell (301) and the groove body (201), two centrosymmetrical guide grooves (303) are provided on the top of the shell (301), a tip (304) is provided on the top of the shell (301) between the guide grooves (303), the tip (304) is fixedly connected to a connecting plate (306) via a connecting rod (305), and the connecting plate (306) is a flat conical structure.

5. The semiconductor electrostatic chuck according to claim 1, wherein: The surface of the connecting tube (501) is provided with two external threads (509), and the connecting tube (501) is threadably connected to the inner wall of the side groove (203) through one of the external threads (509). One end of the connecting tube (501) is movably plugged into the inner wall of the bottom end of the groove body (201). A sealing ring (512) is sleeved on the surface of the connecting tube (501), and the sealing ring (512) is closely connected to the surface of the groove body (201). A blocking block (510) and a sealing plug (511) with an annular structure are movably sleeved on the surface of the connecting tube (501), and the blocking block (510) is threadably sleeved with the other external thread (509). A sealing plug (511) is fixedly connected to one side of the blocking block (510), and the sealing plug (511) is chime-connected to the inside of the housing (101).

6. The semiconductor electrostatic chuck according to claim 5, wherein: A sleeve (502) is provided on the surface of the connecting tube (501), a pressure sensor (503) is movably sleeved inside the sleeve (502), and the pressure sensor (503) is connected to the inside of the sleeve (502) via a first spring (504), the inside of the connecting tube (501) located on one side of the sleeve (502) is movably sleeved with a push rod (505), the top of the push rod (505) is respectively inserted through the cover plate (204) and the top cover (401), and the push rod (505) is made of insulating material and is located at the edge of the top cover (401).

7. The semiconductor electrostatic chuck according to claim 6, wherein: A fixing plate (508) is fixedly connected to the middle of the push rod (505), and the fixing plate (508) is connected to the connecting pipe (501) via a second spring (507). The second spring (507) is sleeved on the surface of the push rod (505). A cylinder (506) is fixedly installed on the bottom of the cover plate (204). The cylinder (506) is correspondingly arranged on one side of the fixing plate (508), and the other side of the fixing plate (508) is correspondingly distributed with the pressure sensor (503). The fixing plate (508) is movably sleeved on the surface of the guide rod (513) around the inside, and the guide rod (513) is fixedly connected to the inside of the side groove (203).

8. The method for preparing a semiconductor electrostatic chuck according to any one of claims 1 to 7, characterized in that: The steps include: (1) The heat exchange tube (110) is fixed to the inside of the housing (101), and the water inlet pipe (109) and the water outlet pipe (111) are respectively connected, and the radiator (107) is installed to the bottom of the housing (101), so that the heat exchange tube (110) is located inside the heat dissipation groove (108), and the assembly is completed; (2) The side groove (203) is installed to the inner wall of the housing (101) by means of screws, so that the bottom of the tank body (201) is fitted with the radiator (107), the connecting pipe (501) is passed through the side groove (203) and the bottom of the tank body (201), the sealing ring (512) is pressed against the surface of the tank body (201) to achieve sealing, the connecting pipe (501) is fitted to the inner wall of the tank body (201), the blocking block (510) is tightened and the sealing plug (511) is driven to fit inside the housing (101) to achieve assembly, and finally the cover plate (204) is installed to the tank body (201) and the top of the side groove (203) by means of screws; (3) Before installing the cover plate (204), the sleeve (502) is fixed to the surface of the connecting pipe (501) by bonding or welding, and the push rod (505) is inserted into the connecting pipe (501) to fix the push rod (505). When installing the cover plate (204), the cover plate (204) is sleeved on the surface of the push rod (505); (4) The top cover (401) is pressed against the surface of the cover plate (204), the top cover (401) is retracted into the groove body (201), and the top cover (401) drives the positioning block (407) to move into position inside the positioning groove (103), and then the top cover (401) is rotated and the bolt (408) is tightened to fix it. At this time, the top rod (505) is extended by the second spring (507), and the metal disk (402) is fitted with the top of the housing (301) of the motor assembly. Finally, the air inlet pipe (105) is connected to the air pump, the water inlet pipe (109) is connected to the water pump, and finally the connecting pipe (501) is connected to the air pump to complete the preparation of the semiconductor electrostatic suction cup.

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