Die bonding assembly jig of semiconductor packaging module

Abstract

The invention discloses a solid crystal assembly jig of a semiconductor packaging module, and relates to the technical field of semiconductor manufacturing, the solid crystal assembly jig of the semiconductor packaging module comprises a lead frame jig, a chip jig is arranged below the lead frame jig, the surface of the lead frame jig is provided with a lead frame groove, and the chip jig is arranged in the lead frame groove. A chip groove is formed in the surface of the chip jig, a clamping mechanism for providing clamping force is arranged in the chip jig, a pressing mechanism for fixing a lead frame in the lead frame jig is arranged in the lead frame jig, and an inspection mechanism for inspecting the attaching degree of the lead frame jig and the chip jig is arranged in the chip jig. The pressing plate is arranged in the lead frame groove and is pressed on the upper surface of the lead frame, the lead frame is prevented from sliding, a pushing force is applied to the lower portion of the inner wall of the limiting block clamping groove through the pressure block limiting block, and then a clamping force is provided between the lead frame jig and the chip jig.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a die-bonding assembly jig for a semiconductor packaging module. Background Art

[0002] The background technology of the die-bonding assembly jig for semiconductor packaging modules stems from the growing demand for high-performance semiconductor packaging. In order to ensure that the packaging module can effectively conduct heat and maintain structural integrity during high-temperature welding, the jig assembly accuracy of the chip and the lead frame is adjusted to ensure high-precision alignment and fixation of the chip and the lead frame during the automated assembly process. Automation and robotics technology are used to enable the jig to operate at high speed and high precision to meet the needs of large-scale production.

[0003] There are still many inconveniences in the use of current equipment: the chip and the lead frame are connected through the jig to achieve the bonding of the packaging module, and the assembly of the jig usually uses magnetic attraction to connect the chip and the lead frame. The assembly of the jig using magnetic attraction is usually simple in design and easy to operate, but the magnetic attraction will affect its performance due to the weakening of the magnetic field or excessive temperature, and the decrease in magnetic force is not easy to detect, which may cause the ceramic sheet and the lead frame to loosen easily during the assembly process of the jig, thereby affecting the electrical function of the packaging module.

[0004] Therefore, the present invention proposes a die-bonding assembly fixture for a semiconductor package module to compensate for and improve the deficiencies of the prior art. Summary of the invention

[0005] 1. Technical issues to be resolved In view of the deficiencies of the prior art, the present invention provides a die-bonding assembly jig for a semiconductor packaging module, which solves the problem in the above background technology that the ceramic sheet and the lead frame are easily loosened when the jig is assembled using magnetic attraction.

[0006] (II) Technical solution To achieve the above objectives, the present invention is implemented through the following technical solutions: a die-bonding assembly jig for a semiconductor packaging module, comprising a lead frame jig, a chip jig is arranged below the lead frame jig, a lead frame groove is provided on the surface of the lead frame jig, a chip groove is provided on the surface of the chip jig, a clamping mechanism providing a clamping force is arranged inside the chip jig, a pressing mechanism for fixing the lead frame inside the lead frame jig is arranged inside the lead frame jig, an inspection mechanism for inspecting the degree of fit between the lead frame jig and the chip jig is arranged inside the chip jig, the clamping mechanism comprises a pressure block for clamping the chip jig, the pressing mechanism comprises a connecting support rod for fixing the lead frame on the surface of the lead frame jig, and the inspection mechanism comprises an inspection groove for observing the degree of fit between the lead frame jig and the chip jig.

[0007] Preferably, the clamping mechanism includes a limit block, the limit block is fixedly connected to the lower surface of the limit block, the limit blocks are evenly distributed at the four corners of the limit block, the pressure block is rotatably connected to the inside of the chip jig, the lead frame jig is internally slidably connected with a connecting block and a rebound block, the connecting block contacts with the upper surface of one end of the pressure block, the rebound block contacts with the lower surface of one end of the pressure block, the inside of the chip jig is fixedly connected with a No. 1 spring, the No. 1 spring is fixedly connected to the rebound block, and the inside of the chip jig is slidably connected with a power plate.

[0008] Preferably, one end of the pressure block is fixedly connected with a positioning block, a positioning groove is provided on the surface of the limiting block, and the positioning block on the surface of the pressure block extends into the positioning groove of the limiting block.

[0009] Preferably, a slope is provided on a side of the connection block close to the power plate, and the connection block is located inside the sliding path of the power plate.

[0010] Preferably, the clamping mechanism includes an adjusting support rod, the adjusting support rod is slidably connected to the inside of a lead frame jig, the connecting support rod is rotatably connected to the inside of one end of the adjusting support rod, the surface of the adjusting support rod is fixedly connected to a pressure plate, the inside of the lead frame jig is fixedly connected to a No. 2 spring, the No. 2 spring is fixedly connected to the pressure plate, the inside of the lead frame jig is rotatably connected to a supporting support rod, the connecting support rod is rotatably connected to the inside of one end of the supporting support rod, one end of the connecting support rod is slidably connected to a pressure rod, the lower surface of the connecting support rod is fixedly connected to a No. 3 spring, and the pressure rod and the No. 3 spring are fixedly connected.

[0011] Preferably, a pressure plate is slidably connected inside the lead frame slot of the lead frame jig, and the pressure rod is located in the sliding path of the pressure plate of the lead frame slot of the lead frame jig.

[0012] Preferably, the adjustment rod extends to the lower surface of the lead frame fixture, and the adjustment rod contacts the upper surface of the chip fixture.

[0013] Preferably, the inspection mechanism includes a connecting push rod, which is slidably connected to the inside of the chip jig, a No. 4 spring is fixedly connected to the inside of the chip jig, and the No. 4 spring is fixedly connected to the connecting push rod, the chip jig is rotatably connected to the inside of the No. 1 gear, the No. 1 gear is meshed with the connecting push rod, the chip jig is rotatably connected to the No. 2 gear, and the No. 2 gear is coaxial with the No. 1 gear, the chip jig is slidably connected to the inside of the sliding gear rod, the chip jig is slidably connected to the inside of the sliding piston, the chip jig is fixedly connected to the inside of the No. 5 spring, the sliding piston is fixedly connected to the No. 5 spring, the chip jig is fixedly connected to the inside of the adjusting slider, one end of the sliding piston is slidably connected to the inside of the sliding block, one end of the sliding piston is fixedly connected to the inside of the sliding block, the No. 6 spring is fixedly connected to the sliding block, the surface of the sliding gear rod is fixedly connected to the power slider, the adjusting slider and the power slider are both located in the sliding path of the sliding block, the inspection groove is opened on the upper surface of the chip jig, and the lead frame jig extends to the inside of the inspection groove.

[0014] Preferably, the thickness of the power slider and the adjustment slider are both half of the thickness of the sliding block, and the adjustment slider and the power slider are not located in the same horizontal plane.

[0015] Preferably, an air guide groove is provided inside the chip jig, and the air guide groove of the chip jig is connected to the sliding groove of the sliding piston.

[0016] (III) Beneficial effects The die-bonding assembly jig for the semiconductor packaging module provided by the present invention has the following beneficial effects: 1. Through the coordinated use of the lead frame jig and the clamping mechanism, the chip is manually placed inside the chip slot on the surface of the chip jig, the lead frame is placed inside the lead frame slot on the surface of the lead frame jig, the pressure plate is placed inside the lead frame slot, pressed on the upper surface of the lead frame to prevent the lead frame from sliding, and a thrust is given to the lower wall of the limit block slot through the pressure block limit block, thereby providing a clamping force between the lead frame jig and the chip jig, and limiting the positional relationship between the lead frame jig and the chip jig. The clamping mechanism ensures the precise alignment between the chip and the lead frame through the physical structure, and the clamping mechanism has good durability and is not easy to fail due to long-term use.

[0017] 2. Through the coordinated use of the lead frame jig and the clamping mechanism, during the assembly process of the lead frame jig and the chip jig, the pressure rod contacts the upper surface of the pressure plate, thereby limiting the position of the pressure plate, and in the process of connecting the support rod so that the inclined state gradually changes to the horizontal state, the pressure plate pushes the pressure rod to slide upward, and the No. 3 spring is compressed under the push of the pressure rod. When the chip and the lead frame are bonded, the pressure rod gives the lead frame a downward thrust to ensure that the pads between the chip and the lead frame have sufficient contact area and pressure, thereby reducing problems such as signal attenuation, circuit breakage or insufficient mechanical strength caused by poor contact.

[0018] 3. Through the coordinated use of the clamping mechanism and the pressing mechanism, during the assembly process of the lead frame jig and the chip jig, the gas between the lead frame jig and the chip jig can only be discharged through the edge gap between the lead frame jig and the chip jig. Since the lead frame jig is located inside the inspection groove on the surface of the chip jig, soapy water is provided inside the inspection groove. The soapy water will form bubbles between the lead frame and the chip. The size and number of bubbles can indicate the degree of fit, thereby avoiding the problem of poor fit between the lead frame and the chip assembly jig, resulting in poor contact between the lead frame and the pads on the chip, which in turn affects the reliability of the electrical connection and signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the internal structure of the present invention; Figure 3 This is a location distribution diagram of the internal mechanism of the present invention; Figure 4 It is a schematic diagram of the overall structure of the clamping mechanism of the present invention; Figure 5 For the present invention Figure 4 A partial enlarged view of middle A; Figure 6 It is a schematic diagram of the overall structure of the clamping mechanism of the present invention; Figure 7 For the present invention Figure 6 A partial enlarged view of B in the middle; Figure 8 It is a schematic diagram of the internal structure of the inspection mechanism of the present invention; Fig. 9 It is a schematic diagram of the overall structure of the inspection mechanism of the present invention; Fig.10 For the present invention Fig. 9 A partial enlarged view of middle C; Fig.11 It is a schematic diagram of the connection between the lead frame fixture and the chip fixture of the present invention.

[0020] The numbers in the figure represent: 1. lead frame fixture; 2. chip fixture; 3. clamping mechanism; 311. limit block; 312. pressure block; 313. rebound block; 314. No. 1 spring; 315. connecting block; 316. power plate; 4. clamping mechanism; 411. adjustment support rod; 412. connecting support rod; 413. No. 2 spring; 414. pressure plate; 415. supporting support rod; 416. pressure rod; 417. No. 3 spring; 5. inspection mechanism; 511. connecting push rod; 512. No. 1 gear; 513. No. 4 spring; 514. No. 2 gear; 515. sliding gear rod; 516. No. 5 spring; 517. power slider; 518. adjustment slider; 519. sliding piston; 5110. sliding block; 5111. No. 6 spring; 5112. inspection groove. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] refer to Figures 1 to 11 According to a preferred embodiment of the present invention, a die-bonding assembly jig for a semiconductor packaging module will be described in detail below. A die-bonding assembly jig for a semiconductor packaging module includes a lead frame jig 1, a chip jig 2 is arranged below the lead frame jig 1, a lead frame groove is opened on the surface of the lead frame jig 1, a chip groove is opened on the surface of the chip jig 2, a clamping mechanism 3 providing a clamping force is arranged inside the chip jig 2, a pressing mechanism 4 for fixing the lead frame inside the lead frame jig 1 is arranged inside the lead frame jig 1, an inspection mechanism 5 for inspecting the degree of fit between the lead frame jig 1 and the chip jig 2 is arranged inside the chip jig 2, the clamping mechanism 3 includes a pressure block 312 for clamping the chip jig 2, the pressing mechanism 4 includes a connecting support rod 412 for fixing the lead frame on the surface of the lead frame jig 1, and the inspection mechanism 5 includes an inspection groove 5112 for observing the degree of fit between the lead frame jig 1 and the chip jig 2.

[0023] like Figure 4 In the embodiment, the clamping mechanism 3 includes a limiting block 311, the limiting block 311 is fixedly connected to the lower surface of the limiting block 311, and the limiting blocks 311 are evenly distributed at the four corners of the limiting block 311, such as Fig.11In the embodiment, the chip is manually placed in the chip slot on the surface of the chip fixture 2, the lead frame is placed in the lead frame slot on the surface of the lead frame fixture 1, the pressure plate is placed in the lead frame slot, pressed on the upper surface of the lead frame to prevent the lead frame from sliding, and the lead frame fixture 1 is fixed to the upper surface of the chip fixture 2, and the limit block 311 extends to the inside of the lead frame fixture 1, as shown in FIG. Figure 5 In the embodiment, the pressure block 312 is rotatably connected to the inside of the chip fixture 2, the lead frame fixture 1 is internally slidably connected with a connecting block 315 and a rebound block 313, the connecting block 315 contacts the upper surface of one end of the pressure block 312, the rebound block 313 contacts the lower surface of one end of the pressure block 312, the chip fixture 2 is internally fixedly connected with a spring No. 1 314, the spring No. 1 314 is fixedly connected to the rebound block 313, the chip fixture 2 is internally slidably connected with a power plate 316, one end of the pressure block 312 is fixedly connected with a card The surface of the limit block 311 is provided with a positioning groove. At this time, the lower surface of the limit block 311 contacts the inclined surface of the limit block 312 at one end of the pressure block 312. The limit block 311 slides down to give the inclined surface of the pressure block 312 a leftward thrust. The pressure block 312 rotates counterclockwise inside the chip fixture 2, and the end of the pressure block 312 away from the limit block 311 pushes the rebound block 313 to slide downward. As the limit block 311 continues to slide down, the positioning groove on the surface of the limit block 311 reaches the inside of the rotation path of the pressure block 312. Figure 5 In the embodiment, the surface positioning block of the pressure block 312 extends to the inside of the positioning groove of the limit block 311, and the connecting block 315 is provided with an inclined surface near the side of the power plate 316. The connecting block 315 is located inside the sliding path of the power plate 316. The rebound block 313 loses the restriction of the limit block 311 on the pressure block 312, thereby increasing the thrust, and then the rebound block 313 is driven to slide upward through the No. 1 spring 314, thereby pushing the pressure block 312 to rotate clockwise, and a thrust is given to the lower part of the inner wall of the positioning groove of the limit block 311 through the pressure block 312, thereby providing a clamping force between the lead frame fixture 1 and the chip fixture 2, and limiting the positional relationship between the lead frame fixture 1 and the chip fixture 2. The clamping mechanism 3 ensures the precise alignment between the chip and the lead frame through the physical structure, and the clamping mechanism 3 has good durability and is not easy to fail due to long-term use.

[0024] like Figure 6 In the embodiment, the clamping mechanism 4 includes an adjusting rod 411, which is slidably connected to the inside of the lead frame fixture 1. During the assembly process of the lead frame fixture 1 and the chip fixture 2, the adjusting rod 411 contacts the upper surface of the chip fixture 2, and the chip fixture 2 pushes the adjusting rod 411 to slide upward. Figure 7In the embodiment, the connecting rod 412 is rotatably connected to the inside of one end of the adjusting rod 411, and the surface of the adjusting rod 411 is fixedly connected to a pressure plate 414, and the inside of the lead frame fixture 1 is fixedly connected to a No. 2 spring 413, and the No. 2 spring 413 is fixedly connected to the pressure plate 414, and the inside of the lead frame fixture 1 is rotatably connected to a supporting rod 415, and the connecting rod 412 is rotatably connected to the inside of one end of the supporting rod 415. During the upward sliding process of the adjusting rod 411, the supporting rod 415 is pushed to rotate counterclockwise by the connecting rod 412. When the supporting rod 415 becomes a vertical state, it stops rotating under the restriction of the inner wall of the lead frame fixture 1. As the adjusting rod 411 continues to slide upward, the connecting rod 412 rotates around one end of the supporting rod 415, so that the inclined state gradually changes to a horizontal state. At this time, the pressure rod 416 contacts the upper surface of the pressure plate, thereby limiting the position of the pressure plate, such as Figure 7 In the embodiment, one end of the connecting rod 412 is slidably connected to a pressure rod 416, and a No. 3 spring 417 is fixedly connected to the lower surface of the connecting rod 412. The pressure rod 416 and the No. 3 spring 417 are fixedly connected. A pressure plate is slidably connected inside the lead frame slot of the lead frame fixture 1. The pressure rod 416 is located in the sliding path of the lead frame slot pressure plate of the lead frame fixture 1. In the process that the connecting rod 412 gradually changes from an inclined state to a horizontal state, the pressure plate pushes the pressure rod 416 to slide upward, and the No. 3 spring 417 is compressed under the push of the pressure rod 416. When the chip is bonded to the lead frame, a downward thrust is given to the lead frame through the pressure rod 416 to ensure that the pads between the chip and the lead frame have sufficient contact area and pressure, thereby reducing problems such as signal attenuation, circuit breakage or insufficient mechanical strength caused by poor contact.

[0025] like Figure 8 In the embodiment, the inspection mechanism 5 includes a connecting push rod 511, which is slidably connected to the inside of the chip fixture 2. The inside of the chip fixture 2 is fixedly connected with a No. 4 spring 513, and the No. 4 spring 513 is fixedly connected to the connecting push rod 511. The inside of the chip fixture 2 is rotatably connected to a No. 1 gear 512, and the No. 1 gear 512 is meshed with the connecting push rod 511. The inside of the chip fixture 2 is rotatably connected to a No. 2 gear 514, and the No. 2 gear 514 is coaxial with the No. 1 gear 512. During the assembly process of the lead frame fixture 1 and the chip fixture 2, the limit block 311 slides downward to push the connecting push rod 511 to slide to the right, and pushes the No. 1 gear 512 to rotate counterclockwise through the surface tooth block, thereby driving the No. 2 gear 514 to rotate synchronously. Fig.10In the embodiment, the chip fixture 2 is internally slidably connected with a sliding gear rod 515, the chip fixture 2 is internally slidably connected with a sliding piston 519, the chip fixture 2 is internally fixedly connected with a No. 5 spring 516, the sliding piston 519 and the No. 5 spring 516 are fixedly connected, the chip fixture 2 is internally fixedly connected with an adjusting slider 518, one end of the sliding piston 519 is internally slidably connected with a sliding stop block 5110, one end of the sliding piston 519 is internally fixedly connected with a No. 6 spring 5111, and the No. 6 spring 5111 and the sliding stop block 51 10, the surface of the sliding gear rod 515 is fixedly connected with a power slider 517, the adjusting slider 518 and the power slider 517 are both located in the sliding path of the sliding block 5110, the second gear 514 rotates counterclockwise to push the sliding gear rod 515 to slide left, and the surface power slider 517 gives the sliding block 5110 a leftward thrust, thereby driving the sliding piston 519 to slide leftward, thereby injecting air into the sliding groove of the sliding piston 519 through the one-way valve on the lower surface of the chip fixture 2, as shown in FIG. Fig.10 In the embodiment, the inspection groove 5112 is provided on the upper surface of the chip fixture 2, the lead frame fixture 1 extends to the inside of the inspection groove 5112, the thickness of the power slider 517 and the adjustment slider 518 are both half of the thickness of the sliding block 5110, the adjustment slider 518 and the power slider 517 are not located on the same horizontal plane, an air guide groove is provided inside the chip fixture 2, and the air guide groove of the chip fixture 2 is connected to the sliding groove of the sliding piston 519, when the lead frame fixture 1 and the chip fixture 2 are fitted on the surface, the sliding block 5110 contacts the inclined surface of the sliding piston 519, and the sliding block 5110 extends to the inside of the sliding piston 519 under the push of the inclined surface of the adjustment slider 518, and at this time the sliding block 5110 is separated from the power slider 517. Due to the limitation of the force slider 517, the sliding piston 519 slides to the right under the push of the No. 5 spring 516, and then the gas inside the sliding groove of the sliding piston 519 is injected into the space between the lead frame jig 1 and the chip jig 2 through the air guide groove. Since the limit frame groove of the lead frame jig 1 has a pressure plate and is limited by the clamping mechanism 4, the gas between the lead frame jig 1 and the chip jig 2 can only be discharged intermittently through the edges of the lead frame jig 1 and the chip jig 2. Since the lead frame jig 1 is located inside the inspection groove 5112 on the surface of the chip jig 2, soapy water is provided inside the inspection groove 5112. The soapy water will form bubbles between the lead frame and the chip, and the size and number of bubbles generated can indicate the degree of fitting.

[0026] The following is the entire working process and working principle of the above embodiment: manually place the chip inside the chip slot on the surface of the chip fixture 2, place the lead frame inside the lead frame slot on the surface of the lead frame fixture 1, place the pressure plate inside the lead frame slot, press on the upper surface of the lead frame to prevent the lead frame from sliding, and fix the lead frame fixture 1 to the upper surface of the chip fixture 2. The limit block 311 extends to the inside of the lead frame fixture 1, and the rebound block 313 is driven to slide upward by the first spring 314, thereby pushing the pressure block 312 to rotate clockwise, and the pressure block 312 gives a thrust to the lower wall of the limit block 311 under the positioning slot, thereby providing a clamping force between the lead frame fixture 1 and the chip fixture 2, and clamping the lead frame fixture 1 and the chip fixture 2. The positional relationship between the chip fixture 2 is limited, and the clamping mechanism 3 ensures the precise alignment between the chip and the lead frame through the physical structure. The durability of the clamping mechanism 3 is good and it is not easy to fail due to long-term use. At the same time, during the assembly of the lead frame fixture 1 and the chip fixture 2, the support rod 411 is adjusted to continue to slide upward, and the connecting support rod 412 rotates around one end of the supporting support rod 415, so that the inclined state gradually changes to a horizontal state. At this time, the pressure rod 416 contacts the upper surface of the pressure plate, and the connecting support rod 412 gradually changes from the inclined state to the horizontal state. The pressure plate pushes the pressure rod 416 to slide upward, and the third spring 417 is compressed under the push of the pressure rod 416. When the chip is bonded to the lead frame, the pressure rod 416 is pressed. The force rod 416 gives the lead frame a downward thrust to ensure that the pads between the chip and the lead frame have sufficient contact area and pressure, thereby reducing problems such as signal attenuation, circuit breakage or insufficient mechanical strength caused by poor contact. Furthermore, during the assembly of the lead frame fixture 1 and the chip fixture 2, the limit block 311 slides downward to push the connecting push rod 511 to slide to the right, and pushes the first gear 512 to rotate counterclockwise through the surface tooth block, thereby driving the second gear 514 to rotate synchronously. The second gear 514 rotates counterclockwise to push the sliding gear rod 515 to slide to the left, and gives the sliding block 5110 a leftward thrust through the surface power slider 517, thereby driving the sliding piston 519 to slide to the left, thereby passing through the chip fixture 2. The one-way valve on the lower surface injects air into the sliding groove of the sliding piston 519. When the lead frame jig 1 and the chip jig 2 are fitted on the surface, the sliding piston 519 slides to the right under the push of the No. 5 spring 516, and then the gas inside the sliding groove of the sliding piston 519 is injected into the space between the lead frame jig 1 and the chip jig 2 through the air guide groove. Since the limit frame groove of the lead frame jig 1 has a pressure plate and is limited by the clamping mechanism 4, the gas between the lead frame jig 1 and the chip jig 2 can only be discharged intermittently through the edges of the lead frame jig 1 and the chip jig 2. The soapy water inside the inspection groove 5112 will form bubbles between the lead frame and the chip jig under the blowing of the gas, and the size and number of bubbles produced can indicate the degree of fitting.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A die-bonding assembly jig for a semiconductor packaging module, comprising a lead frame jig (1), a chip jig (2) being arranged below the lead frame jig (1), a lead frame groove being provided on the surface of the lead frame jig (1), and a chip groove being provided on the surface of the chip jig (2), wherein: The chip jig (2) is provided with a clamping mechanism (3) for providing a clamping force, the lead frame jig (1) is provided with a pressing mechanism (4) for fixing the lead frame inside the lead frame jig (1), and the chip jig (2) is provided with an inspection mechanism (5) for inspecting the degree of fit between the lead frame jig (1) and the chip jig (2), the clamping mechanism (3) comprising a pressure block (312) for clamping the chip jig (2), the pressing mechanism (4) comprising a connecting support rod (412) for fixing the lead frame on the surface of the lead frame jig (1), and the inspection mechanism (5) comprising an inspection groove (5112) for observing the degree of fit between the lead frame jig (1) and the chip jig (2).

2. The die-bonding assembly jig for a semiconductor package module according to claim 1, characterized in that: The clamping mechanism (3) comprises a limit block (311), the limit block (311) is fixedly connected to the lower surface of the limit block (311), the limit blocks (311) are evenly distributed at the four corners of the limit block (311), the pressure block (312) is rotatably connected to the inside of the chip fixture (2), the lead frame fixture (1) is internally slidably connected with a connecting block (315) and a rebound block (313), the connecting block (315) is in contact with the upper surface of one end of the pressure block (312), and the rebound block (313) is in contact with the lower surface of one end of the pressure block (312), the chip fixture (2) is internally fixedly connected with a No. 1 spring (314), the No. 1 spring (314) is fixedly connected to the rebound block (313), and the chip fixture (2) is internally slidably connected with a power plate (316).

3. The die-bonding assembly jig for a semiconductor package module according to claim 2, characterized in that: One end of the pressure block (312) is fixedly connected to a positioning block, a positioning groove is provided on the surface of the limiting block (311), and the positioning block on the surface of the pressure block (312) extends into the positioning groove of the limiting block (311).

4. The die-bonding assembly jig for a semiconductor package module according to claim 2, characterized in that: A slope is provided on one side of the connection block (315) close to the power plate (316), and the connection block (315) is located inside the sliding path of the power plate (316).

5. The die-bonding assembly jig for a semiconductor package module according to claim 2, characterized in that: The clamping mechanism (4) comprises an adjusting support rod (411), wherein the adjusting support rod (411) is slidably connected to the inside of the lead frame jig (1), the connecting support rod (412) is rotatably connected to the inside of one end of the adjusting support rod (411), a pressure plate (414) is fixedly connected to the surface of the adjusting support rod (411), a No. 2 spring (413) is fixedly connected to the inside of the lead frame jig (1), the No. 2 spring (413) and the pressure plate (414) are fixedly connected, a supporting support rod (415) is rotatably connected to the inside of one end of the supporting support rod (415), one end of the connecting support rod (412) is slidably connected to a pressure rod (416), a No. 3 spring (417) is fixedly connected to the lower surface of the connecting support rod (412), and the pressure rod (416) and the No. 3 spring (417) are fixedly connected.

6. The die-bonding assembly jig for a semiconductor package module according to claim 5, characterized in that: A pressure plate is slidably connected inside the lead frame slot of the lead frame jig (1), and the pressure rod (416) is located within the sliding path of the pressure plate in the lead frame slot of the lead frame jig (1).

7. The die-bonding assembly jig for a semiconductor package module according to claim 5, characterized in that: The adjusting support rod (411) extends to the lower surface of the lead frame fixture (1), and the adjusting support rod (411) is in contact with the upper surface of the chip fixture (2).

8. The die-bonding assembly jig for a semiconductor package module according to claim 5, characterized in that: The inspection mechanism (5) comprises a connecting push rod (511), wherein the connecting push rod (511) is slidably connected to the inside of the chip fixture (2), a No. 4 spring (513) is fixedly connected to the inside of the chip fixture (2), and the No. 4 spring (513) and the connecting push rod (511) are fixedly connected, the inside of the chip fixture (2) is rotatably connected to a No. 1 gear (512), and the No. 1 gear (512) and the connecting push rod (511) are meshed, the inside of the chip fixture (2) is rotatably connected to a No. 2 gear (514), and the No. 2 gear (514) and the No. 1 gear (512) are coaxial, the inside of the chip fixture (2) is slidably connected to a sliding gear rod (515), the inside of the chip fixture (2) is slidably connected to a sliding piston (519), and the inside of the chip fixture (2) is fixedly connected A No. 5 spring (516) is provided, the sliding piston (519) is fixedly connected to the No. 5 spring (516), an adjusting slider (518) is fixedly connected inside the chip fixture (2), one end of the sliding piston (519) is internally slidably connected to a sliding stopper (5110), one end of the sliding piston (519) is internally fixedly connected to a No. 6 spring (5111), the No. 6 spring (5111) and the sliding stopper (5110) are fixedly connected, a power slider (517) is fixedly connected to the surface of the sliding gear rod (515), the adjusting slider (518) and the power slider (517) are both located in the sliding path of the sliding stopper (5110), the inspection groove (5112) is opened on the upper surface of the chip fixture (2), and the lead frame fixture (1) extends to the inside of the inspection groove (5112).

9. The die-bonding assembly jig for a semiconductor package module according to claim 8, characterized in that: The thickness of the power slider (517) and the adjustment slider (518) are both half the thickness of the sliding stop (5110), and the adjustment slider (518) and the power slider (517) are not located on the same horizontal plane.

10. The die-bonding assembly jig for a semiconductor package module according to claim 8, characterized in that: An air guide groove is provided inside the chip jig (2), and the air guide groove of the chip jig (2) is in communication with the sliding groove of the sliding piston (519).

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