Wafer clamping mechanism, wafer post-processing device and wafer post-processing method

Abstract

The present invention discloses a wafer clamping mechanism, a wafer post-processing device and a wafer post-processing method, wherein the wafer clamping mechanism comprises: a turntable; a claw assembly, which is arranged along the circumference of the turntable, the claw assembly comprises a fixed seat and a pair of claws, and the pair of claws are arranged around a cylindrical member above the fixed seat; the opposite surfaces of the pair of claws are provided with magnetic blocks with the same magnetic poles, and the magnetic repulsion of the two makes the claws move away from each other around the cylindrical member, and the contact posts of the claws move toward the inner side of the turntable to close the claws; an adjusting component, which is arranged on the side of the fixed seat and the front end of which is arranged toward the gap between the claws; the front end of the adjusting component can generate a magnetic pole different from that of the magnetic block of the claws, and the magnetic attraction between the adjusting component and the claws makes the claws approach each other around the cylindrical member, and the contact posts of the claws move toward the outer side of the turntable to open the claws.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer post-processing, and in particular, relates to a wafer clamping mechanism, a wafer post-processing device and a wafer post-processing method. Background Art

[0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry towards digitalization and intelligence. Chips are the carriers of integrated circuits, and chip manufacturing involves process flows such as integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting packaging and testing.

[0003] In the production of integrated circuits, wafers go through multiple processes such as thin film deposition, etching, and polishing. During the wafer processing, the wafer surface will be exposed to a large number of particles. In order to keep the wafer surface clean and eliminate the particles left on the wafer surface during the process, the wafer must be cleaned after each process.

[0004] Whether wafer cleaning or wafer drying, the wafer needs to be reliably clamped by a clamping mechanism. Existing clamping mechanisms mostly use energy storage devices such as springs to clamp and release the wafer.

[0005] The existing clamping mechanism has a relatively complex structure and requires a driving mechanism to drive the spring to expand and contract in order to open and close the claws. The existing structure has interactions between components, and component wear will affect the stability of the clamping force; at the same time, component wear will produce some particulate matter, which will increase the pollution sources in the cleaning environment and is not conducive to improving the wafer cleaning effect.

[0006] In addition, in order to monitor the position and status of the wafer in the clamping mechanism, additional configuration is required, such as a wafer in-situ detection module based on the photoelectric principle. However, the in-situ detection module will undoubtedly occupy the space of the wafer processing chamber. At the same time, the photoelectric sensor used for in-situ detection is easily affected by the humidity in the chamber, which causes the accuracy of wafer in-situ detection to decrease, and even leads to detection errors and misjudgments, resulting in the inability to correctly feedback the status of the wafer and affecting the control of the wafer processing process. Summary of the invention

[0007] The embodiments of the present invention provide a wafer clamping mechanism, a wafer post-processing device and a wafer post-processing method, aiming to solve at least one of the technical problems existing in the prior art.

[0008] A first aspect of an embodiment of the present invention provides a wafer clamping mechanism, comprising:

[0009] Turntable;

[0010] A claw assembly is arranged along the circumference of the turntable, and the claw assembly includes a fixed seat and a pair of claws, and the pair of claws are arranged around the cylindrical member above the fixed seat; the opposite surfaces of the pair of claws are provided with magnetic blocks with the same magnetic poles, and the magnetic repulsion of the two causes the claws to move away from each other around the cylindrical member, and the contact column of the claw moves toward the inner side of the turntable to close the claw;

[0011] A regulating component is arranged on the side of the fixing seat and its front end is arranged toward the gap between the claws; the front end of the regulating component can generate a magnetic pole different from the magnetic block of the claws, and the magnetic attraction between the regulating component and the claws makes the claws approach each other around the cylindrical part, and the contact column of the claws moves toward the outside of the turntable to open the claws.

[0012] In some embodiments, the claw includes a claw body, which is a partial circular ring structure and is rotatably connected to the outer circumference of the cylindrical member; a support member is configured on the upper part of the claw body, and a contact column is provided at the end of the support member to abut the edge of the wafer.

[0013] In some embodiments, the fixing seat is detachably connected to the turntable, and a positioning member is disposed above the fixing seat to limit the circumferential position of the claw relative to the cylindrical member.

[0014] In some embodiments, one end surface of the claw body is a bending surface, and the bending surface includes a first bending surface and a second bending surface, on which a plurality of magnetic blocks are spaced apart.

[0015] In some embodiments, when the jaw assembly is in a clamping state, the first bending surfaces of the two jaws are parallel to each other.

[0016] In some embodiments, the angle between the first bending surface and the second bending surface is 110°-135°.

[0017] In some embodiments, the width of the second bending surface is greater than the width of the first bending surface.

[0018] In some embodiments, the other end surface of the claw body is a plane or an arc surface.

[0019] In some embodiments, the claw body is greater than or equal to 1 / 4 of the circular ring structure.

[0020] In some embodiments, the support member is offsetly disposed on the upper portion of the claw body, and the claw body rotating around the cylindrical member can drive the support member to deflect to change the position of the contact column.

[0021] In some embodiments, the support member of the clamping jaw is vertically staggered with the support member of another clamping jaw, and the contact column is located on the inner side or the outer side of the clamping jaw body.

[0022] In some embodiments, a limiting groove is arranged on the support member, and the contact column of the clamping claw can be clamped in the limiting groove of another clamping claw to limit the deflection range of the support member.

[0023] In some embodiments, the support member extends toward the side where the center of the claw body is located, and the contact column is arranged at one end of the support member facing the center of the claw body.

[0024] In some embodiments, the regulating component includes a regulating block, a rod is disposed inside the regulating block; a coil is wound around the outer circumference of the rod, and the energized coil can form a magnetic field at the end of the rod.

[0025] In some embodiments, there are multiple rods, and their locations correspond to the locations of the magnetic blocks on the claws.

[0026] In some embodiments, the end of the regulating block is a V-shaped surface, which is arranged toward the gap between the claws; the rod at least partially penetrates the regulating block and extends to the V-shaped surface.

[0027] In some embodiments, the regulating block is disposed above the turntable, and a vertical height of the regulating block is smaller than a height of the claw.

[0028] A second aspect of an embodiment of the present invention provides a wafer post-processing device, comprising:

[0029] Box;

[0030] The wafer clamping mechanism described above is arranged inside the box, and a driving mechanism is arranged below the wafer clamping mechanism to drive the clamped wafer to rotate around the axis;

[0031] The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

[0032] A third aspect of an embodiment of the present invention provides a wafer post-processing method, which uses the wafer post-processing device described above to perform a post-processing process, including:

[0033] S1, the regulating component is powered on, and the claw of the claw assembly is in the open state;

[0034] S2, the robot places the wafer on the turntable, the control component is powered off, and the claws of the claw assembly are closed to clamp the wafer;

[0035] S3, the driving mechanism drives the clamped wafer to rotate around the axis, and the post-processing module sprays water and / or chemical liquid toward the wafer to process the wafer surface.

[0036] In some embodiments, during wafer post-processing, if a wafer clamped by the claw assembly breaks, the claws move away from each other around the cylindrical member under the action of magnetic repulsion, causing the magnetic flux of the magnetic block to change. The control component can detect the change in induced current and sound an alarm.

[0037] A fourth aspect of an embodiment of the present invention provides a wafer clamping mechanism, comprising:

[0038] Turntable;

[0039] A claw assembly is arranged along the circumference of the turntable, and the claw assembly clamps or releases the wafer by magnetic force;

[0040] The regulating component is located on the side of the claw component. The regulating component can change the magnetic force direction of the claw component, thereby switching the working state of the claw component.

[0041] In some embodiments, the clamping jaw assembly includes a pair of clamping jaws on which contact pillars are disposed, and the contact pillars abut against an edge of the wafer.

[0042] In some embodiments, the clamping jaw assembly further comprises a fixing seat on which a cylindrical member is disposed, and the pair of clamping jaws are rotatably connected to the outer peripheral side of the cylindrical member.

[0043] In some embodiments, the opposing surfaces of the pair of claws are provided with magnetic blocks, and the opposing magnetic blocks form a magnetic repulsion or magnetic attraction force, so that the claws rotate around the cylindrical member to change the position of the contact column to achieve the opening or closing of the claw assembly.

[0044] In some embodiments, the regulating component includes a regulating block, a rod is disposed inside the regulating block; a coil is wound around the outer circumference of the rod, and the energized coil can form a magnetic field at the end of the rod.

[0045] In some embodiments, the regulating block is arranged on the side of the fixing seat and its front end is arranged toward the gap between the claws. The magnetic poles of the magnetic field formed by the rod are the same as or different from the magnetic poles of the opposite side of the magnetic block to change the direction of the magnetic force between the claws and the regulating component.

[0046] In some embodiments, there are multiple rods, and their locations correspond to the locations of the magnetic blocks on the claws.

[0047] In some embodiments, the claw includes a claw body, which is a partial circular ring structure and is rotatably connected to the outer circumference of the cylindrical member; a support member is offsetly provided on the upper part of the claw body, and the claw body rotating around the cylindrical member can drive the support member to deflect to change the position of the contact column.

[0048] In some embodiments, the fixing seat is detachably connected to the turntable, and a positioning member is disposed above the fixing seat to limit the circumferential position of the claw relative to the cylindrical member.

[0049] A fifth aspect of an embodiment of the present invention provides a wafer post-processing device, comprising:

[0050] Box;

[0051] The wafer clamping mechanism described above is arranged inside the box, and a driving mechanism is arranged below the wafer clamping mechanism to drive the clamped wafer to rotate around the axis;

[0052] The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

[0053] The beneficial effects of the present invention include:

[0054] a. The claw assembly is configured with a pair of claws to form two contact posts above the claws, thereby avoiding single-point contact and causing uneven clamping force;

[0055] b. The claw assembly is provided with two contact pins that abut against the wafer, so that the number of configurations of the claw assembly can be reduced, space can be saved, and wafer clamping can be adapted to different working conditions;

[0056] c. The support member of the jaw body is vertically staggered and toward the center of the jaw body to reduce the space occupied by the jaw assembly;

[0057] d. The support member is provided with a limit groove, the setting position of the limit groove matches the setting position of the contact column on the first claw to limit the deflection range of the support member;

[0058] e. A pair of claws are arranged around the cylindrical member, and the bending surface of the claw body is configured with a magnetic block. The claws can move away from each other based on the cylindrical member under the action of magnetic repulsion to adjust the posture of the support member, change the position of the contact column, and realize the closure of the claw assembly;

[0059] f. The regulating component is disposed on the side of the fixing seat and its front end is disposed toward the gap between the claws. The front end of the regulating component can generate a magnetic pole different from the magnetic block of the claw. The magnetic attraction between the regulating component and the claw makes the claws approach each other around the cylindrical member to adjust the position of the contact column to achieve the opening of the claw assembly;

[0060] g. The control component is in a magnetic field, and the moving magnetic block can cut the magnetic flux lines, so that the control component forms an induced current, so that the control component can detect the breakage of the wafer, and then monitor the in-situ state of the wafer in the wafer clamping mechanism;

[0061] h. The claw body and the support are separate structures. If the contact column is worn and cannot be used, the support can be replaced to avoid overall replacement and reduce costs;

[0062] i. The first bending surface and the second bending surface of the claw body are provided with a plurality of magnetic blocks, the angle between the two being 110°-135°, so that the second bending surface relative to each other also forms a magnetic repulsion force, that is, the double magnetic repulsion force formed by the magnetic blocks on the claw is used to control the claw to rotate with the cylindrical member as a reference;

[0063] j. The second bending surface is relatively inclined relative to the first bending surface, so that adjacent jaws form a gradually opening placement groove to facilitate installation and placement of the control component;

[0064] k. The width of the second bending surface is greater than the width of the first bending surface to expand the size of the placement slot for easy installation of the control component;

[0065] l. The opening and closing of the clamping jaw assembly is controlled by magnetic force to avoid the interaction of components and effectively ensure the reliability of wafer clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, which are only schematic and do not limit the scope of protection of the present invention, wherein:

[0067] Figure 1 is a schematic diagram of a wafer clamping mechanism provided by an embodiment of the present invention;

[0068] Figure 2 yes Figure 1 A top view of the wafer clamping mechanism is shown;

[0069] Figure 3 is a schematic diagram of a claw assembly provided by an embodiment of the present invention;

[0070] Figure 4 is a schematic diagram of a first clamping claw provided by an embodiment of the present invention;

[0071] Figure 5 is a schematic diagram of a second clamping claw provided by an embodiment of the present invention;

[0072] Figure 6 is a schematic diagram of a claw assembly provided by an embodiment of the present invention in a closed state;

[0073] Figure 7 is a schematic diagram of a control component provided by an embodiment of the present invention;

[0074] Figure 8 is a schematic diagram of the mutual repulsion between the first clamping claw and the second clamping claw provided by an embodiment of the present invention;

[0075] Fig. 9 is a schematic diagram of the mutual attraction between the first clamping claw and the second clamping claw provided by one embodiment of the present invention;

[0076] Fig.10 is a schematic diagram of a wafer post-processing device provided by an embodiment of the present invention;

[0077] Fig.11 is a flow chart of a wafer post-processing method provided by an embodiment of the present invention;

[0078] Fig.12 is a schematic diagram of a wafer clamping mechanism provided by another embodiment of the present invention;

[0079] Fig.13 is a schematic diagram of the mutual attraction of the claws provided by another embodiment of the present invention;

[0080] Fig.14 A schematic diagram of the mutual repulsion of claws provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0081] The technical scheme of the present invention is described in detail below in conjunction with specific embodiments and their accompanying drawings. The embodiments recorded herein are specific embodiments of the present invention, which are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary and should not be construed as limitations on the embodiments of the present invention and the scope of protection of the present invention. In addition to the embodiments recorded herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, including technical solutions that adopt any obvious replacements and modifications to the embodiments recorded herein.

[0082] The drawings of this specification are schematic diagrams, which assist in explaining the concept of the present invention and schematically show the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of various components of the embodiments of the present invention, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0083] In the present invention, wafer (W) is also called substrate, and its meaning and practical function are equivalent. The term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. can refer to different or the same objects, and are only used to distinguish the objects referred to, without implying a specific spatial order, time order, order of importance, etc. of the objects referred to. In some embodiments, values, processes, selected items, determined items, equipment, devices, means, components, assemblies, etc. are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and such selections do not need to be better, lower, higher, smaller, larger, or otherwise preferred than other options in other aspects or all aspects.

[0084] Figure 1 is a schematic diagram of a wafer clamping mechanism 100 provided in one embodiment of the present invention. The wafer clamping mechanism 100 comprises:

[0085] The turntable 10 has a driving mechanism disposed below it to drive the turntable 10 to rotate around its central axis;

[0086] The clamping claw assembly 20 is arranged along the circumference of the turntable 10 to uniformly clamp the wafer W on the outer circumference of the wafer W, so that the clamping force of the wafer W in the circumferential direction is relatively uniform.

[0087] Figure 2 1 is a top view of the wafer clamping mechanism 100, wherein the number of the claw assemblies 20 is three, which are roughly evenly distributed on the outer peripheral side of the turntable 10. It can be understood that the wafer clamping mechanism 100 can also be configured with four or five claw assemblies 20 to apply to wafer clamping in different working conditions.

[0088] Furthermore, the claw assembly 20 includes a fixing seat 21 and a claw 22. Figure 3 As shown, the fixing seat 21 is detachably arranged on the turntable 10. A cylindrical member 23 is arranged above the fixing seat 21, and the claw 22 is arranged around the outer circumference of the cylindrical member 23. That is, the claw 22 is rotatably connected to the outer circumference of the fixing member 23, and can rotate relatively with the cylindrical member 23 as a reference.

[0089] In the present invention, the claw assembly 20 includes two claws 22, which are spaced apart and arranged on the outer circumference of the cylindrical member 23. The opposite surfaces of the claws 22 are provided with magnetic blocks 24, and the magnetic poles of the opposite surfaces of the magnetic blocks 24 are the same, such as Figure 3The outer side of the magnetic block 24 shown is an N pole. The magnetic repulsion between the magnetic block 24 of one claw 22 and the magnetic block 24 of another claw 22 can make the claws 22 move away from each other around the cylindrical member 23, and then the contact column 25 of the claw 22 can move toward the inner side of the turntable 10 to achieve the closure of the claw assembly 20.

[0090] Furthermore, the wafer clamping mechanism 100 further includes a regulating component 30, such as Figure 2 As shown, the regulating component 30 is disposed on the turntable 10 , and at the same time, the regulating component 30 is located on the side of the fixing seat 21 , and the front end of the regulating component 30 is disposed toward the gap between the claws 22 .

[0091] When the claw assembly 20 needs to be controlled to open, the regulating assembly 30 is energized to generate a magnetic pole at the front end of the regulating assembly 30 that is different from the magnetic block 24 of the claw 22. A magnetic attraction is formed between the regulating assembly 30 and the claw 22, so that the claws 22 are close to each other around the cylindrical member 23, and the contact column 25 of the claw 22 moves toward the outside of the turntable 10, so that the claw assembly 20 is opened.

[0092] Figure 3 In the illustrated embodiment, the jaw assembly 20 includes a first jaw 20A and a second jaw 20B, which are disposed around the outer circumference of a cylindrical member 23, wherein the cylindrical member 23 may be a ceramic bearing to provide a reference for the rotation of the first jaw 20A and the second jaw 20B.

[0093] Since the structures of the first clamping claw 20A and the second clamping claw 20B are similar, the specific structure of the clamping claw 22 is briefly described below by taking the first clamping claw 20A as an example.

[0094] The first claw 20A includes a claw body 22a. Figure 4 As shown, the claw body 22a is a partial annular structure, which is rotatably connected to the outer circumference of the cylindrical member 23. Specifically, the inner side wall of the claw body 22a abuts against the outer circumference of the cylindrical member 23, and the claw body 22a can rotate around the axis of the cylindrical member 23 to change the position of the claw body 22a on the corresponding circumference of the cylindrical member 23.

[0095] The bottom of the claw body 22 a is substantially flat, so as to facilitate controlling the overall size of the claw assembly 20 and reducing the space occupied by the claw assembly 20 .

[0096] Furthermore, a support member 22b is disposed on the upper portion of the claw body 22a, and a contact column 25 is disposed at the end of the support member 22b. The contact column 25 can abut against the edge of the wafer to fix and clamp the wafer. Figure 3In the embodiment shown, the contact pin 25 is disposed at the end of the support member 22b. It is understandable that the contact pin 25 may also be disposed at other positions of the support member 22b, such as the midpoint or 1 / 4 of the support member 22b, to accommodate wafers of different sizes.

[0097] Furthermore, one end surface of the claw body 22a is a bending surface, and the bending surface includes a first bending surface 22a-1 and a second bending surface 22a-2. Figure 4 As shown, magnetic blocks 24 are disposed on the first bending surface 22a-1 and the second bending surface 22a-2.

[0098] In the present invention, there are multiple magnetic blocks 24, which are arranged at intervals on the first bending surface 22a-1 and the second bending surface 22a-2. Figure 4 In the illustrated embodiment, the first bending surface 22a-1 and the second bending surface 22a-2 are both provided with three magnetic blocks 24, and the magnetic blocks 24 are arranged at intervals along the vertical direction. It should be noted that the number of magnetic blocks 24 on the first bending surface 22a-1 and the second bending surface 22a-2 are not exactly the same, as long as the opposite surfaces of the relatively arranged claws 22 are provided with the same number of magnetic blocks 24. For example, the number of magnetic blocks 24 on the first bending surface 22a-1 of the first claw 20A is equal to the number of magnetic blocks 24 on the first bending surface 22a-1 of the second claw 20B.

[0099] In some embodiments, when the claw assembly 20 is in a clamping state (the claws 22 of the claw assembly 20 are closed), the first bending surfaces 22a-1 of the two claws 22 are parallel to each other. It can be understood that the first bending surfaces 22a-1 are parallel to each other means that the two bending surfaces are roughly parallel, and specifically, the angle between the opposite first bending surfaces 22a-1 is about ±5°, so as to use the principle of mutual repulsion of like magnetic poles to push the claws 22 to rotate around the cylindrical member 23.

[0100] Furthermore, the angle between the first bending surface 22a-1 and the second bending surface 22a-2 is 110°-135°, so that the relative second bending surface 22a-2 also forms a magnetic repulsion force, that is, the double magnetic repulsion force formed by the magnetic block 24 on the claw 22 is used to control the claw 22 to rotate with the cylindrical part 23 as a reference.

[0101] At the same time, the second bending surface 22a-2 is arranged relatively inclined relative to the first bending surface 22a-1, so that the adjacent claws 22 form a placement groove with a gradual opening, such as Figure 6 As shown, it is convenient to install and place the regulating assembly 30. The opening of the placement slot gradually increases from the inside to the outside. The inside and outside here are relative to the cylindrical member 23, the inner side is close to the center of the cylindrical member 23, and the outer side is far from the center of the cylindrical member 23.

[0102] Figure 4In the illustrated embodiment, the width of the second bending surface 22a-2 is greater than the width of the first bending surface 22a-1, so as to expand the size of the placement slot and facilitate the installation of the control component 30. Preferably, the width of the second bending surface 22a-2 is at least 1.5-2 times the width of the first bending surface 22a-1. It should be noted that the width of the bending surface refers to the length of the edge corresponding to the transverse section of the claw body 22a, wherein the position of the transverse section is located in the arc-shaped structural section of the claw body 22a.

[0103] Furthermore, the support member 22b is offsetly disposed on the upper portion of the claw body 22a, and the claw body 22a rotating around the cylindrical member 23 can drive the support member 22b to deflect, so as to change the position of the contact column 25, thereby achieving the clamping and fixing of the wafer.

[0104] Figure 3 In the illustrated embodiment, the support member 22b of the clamping jaw 22 is vertically staggered with the support member 22b of another clamping jaw 22 to prevent the support member 22b of the clamping jaw 22 from interfering with each other and affecting the opening and closing of the clamping jaw assembly 20. That is, the two clamping jaws 22 of the clamping jaw assembly 20 are respectively provided with contact pillars 25 to form two contact points to clamp the wafer, thereby ensuring the reliability of wafer clamping.

[0105] Furthermore, the vertically staggered contact pillars 25 are located on the same side of the claw body 22a, that is, the vertically staggered contact pillars 25 are located on the inner side or the outer side of the claw body 22a, so that the contact points of the claw assembly 20 and the wafer are located on the same side, thereby facilitating the control of wafer clamping. The inner side and the outer side of the claw body 22a are relative to the annular claw body 22a, and the side where the center of the claw body 22a is located is the inner side, and on the contrary, the side opposite to the center of the claw body 22a is the outer side.

[0106] Figure 4 In the embodiment, the support member 22b is offset and arranged on the upper part of the claw body 22a. Specifically, the support member 22b extends toward the side where the center of the claw body 22a is located, and the contact column 25 is arranged at one end of the support member 22b facing the center of the claw body 22a. Such an arrangement can reduce the range of movement of the contact column 25 on the support member 22b, thereby controlling the overall size of the claw assembly 20.

[0107] Figure 52 is a schematic diagram of a second clamping claw 20B provided by an embodiment of the present invention, wherein a limiting groove 22c is arranged on the support member 22b, and the setting position of the limiting groove 22c matches the setting position of the contact column 25 on the first clamping claw 20A to limit the deflection range of the support member 22b. Specifically, when the first clamping claw 20A and the second clamping claw 20B rotate toward each other around the cylindrical member 23, the support member 22b on the upper part of the clamping claw body 22a moves toward the upper side (away from the inner side of the turntable 10), and the setting of the limiting groove 22c can prevent the support member 22b from deflecting upward beyond the limit and causing the contact column 25 to move too far away from the center of the turntable 10. That is, the jaw assembly 20 is too open to complete the pre-positioning of the wafer, which is not conducive to the accurate clamping of the wafer.

[0108] Furthermore, the shape and size of the limiting groove 22c match the shape and size of the contact column 25, so that the contact column 25 can be engaged in the limiting groove 22c, thereby locking the first claw 20A and the second claw 20B. This arrangement can prevent the contact column 25 and the side of the support member 22b from abutting against each other and slipping, so that the rotation of the claw 22 cannot be accurately limited.

[0109] Since the contact pins 25 frequently contact the edge of the wafer, the contact pins 25 are most severely worn. If the entire clamping claw assembly 20 is replaced due to the severe wear of the contact pins 25, the use cost of the wafer clamping mechanism 100 will increase.

[0110] To solve the above problem, the claw body 22a and the support member 22b are separate structures, that is, the support member 22b is detachably connected to the upper part of the claw body 22a. In this way, if the contact column 25 is worn and cannot be used, the support member 22b can be replaced to avoid overall replacement and reduce costs.

[0111] In some embodiments, the contact post 25 may also be provided as a split structure, such as the contact post 25 may be detachably connected to the support member 22b above the claw body 22a, so as to replace the worn contact post 25 as needed. In some embodiments, the contact post 25 is made of a wear-resistant non-metallic material, such as polyetheretherketone, polyphenylene sulfide, etc., to enhance the wear resistance of the contact post 25 and extend the service life of the claw assembly 20.

[0112] As one aspect of this embodiment, the support member 22b is provided with an elongated hole, and the contact pin 25 is detachably installed in the elongated hole so as to adaptively adjust the installation position of the contact pin 25 on the support member 22b and adjust the clamping force of the contact pin 25 on the wafer.

[0113] Furthermore, the claw assembly 20 also includes a positioning member 26, such as Figure 6As shown, the positioning member 26 is vertically arranged above the turntable 10. The positioning member 26 mainly limits the circumferential position of the first clamping claw 20A and the second clamping claw 20B during rotation, that is, limits the circumferential position of the clamping claw 22 relative to the cylindrical member 23, thereby controlling the position of the contact column 25 on the supporting member 22b, and preventing the clamping claw 22 from applying too much clamping force to the wafer and crushing the wafer.

[0114] In the present invention, the end surface of the claw body 22a opposite to the positioning member 26 is a plane or an arc surface, so that the end surface of the claw body 22a abuts against the positioning member 26 to achieve the limitation of the circumferential position of the claw 22. In some embodiments, when the end surface of the claw body 22a is an arc surface, in order to increase the friction between the positioning member 26 and the end surface and prevent the claw 22 from slipping, a concave-convex structure can be provided on the arc surface to increase the friction coefficient between the two.

[0115] As an embodiment of the present invention, the claw body 22a should be greater than or equal to 1 / 4 of the circular ring structure, so that the regulating assembly 30 of the claw assembly 20 can be placed in the gap between the opposite surfaces of the claw 22, while ensuring that the claw 22 has a certain range of motion.

[0116] Figure 7 3 is a schematic diagram of a regulating component 30 provided in an embodiment of the present invention. The regulating component 30 includes a regulating block 31. The regulating block 31 is a block-shaped structure, and a rod 32 is arranged inside the regulating block 31.

[0117] A coil 33 is wound around the outer circumference of the rod 32 , and the coil 33 , when energized, can form a magnetic field at the end of the rod 32 .

[0118] Furthermore, there are multiple rods 32, which are arranged in parallel inside the control block 31. The setting position of the rod 32 corresponds to the position of the magnetic block 24 on the claw 22, so that a magnetic pole different from the magnetic block 24 is formed at the end of the rod 32, and then the magnetic attraction of the two is used to control the rotation of the claw 22 relative to the cylindrical member 23, thereby controlling the position of the contact column 25 relative to the center of the turntable 10. The magnetic field at the end of the rod 32 and the magnetic block 24 on the claw 22 attract each other, so that the support member 22b swings upward, and the contact column 25 moves away from the center of the turntable 10. That is, the contact column 25 changes from abutting against the edge of the wafer to being away from the edge of the wafer, thereby completing the opening action of the claw assembly 20.

[0119] Figure 7 In the embodiment, the end of the regulating block 31 is a V-shaped surface 31a, which is arranged toward the gap between the claws 22, so that the distance between the magnetic field formed by the end of the rod 32 and the magnetic block 24 on the claws 22 is relatively close. It can be understood that the end surface of the regulating block 31 is not a V-shaped surface in the strict sense, but an end surface with the tip of the V-shaped surface removed, so as to reduce the overall size of the regulating assembly 30.

[0120] Furthermore, the rod 32 at least partially penetrates the regulating block 31 and extends to the V-shaped surface 31a, wherein the rod 32 located outside the regulating block 31 is wound with a coil 33; if the coil 33 is energized, a magnetic field is formed at the end of the rod 32 (close to the V-shaped surface 31a).

[0121] In some embodiments, increasing the current of the coil 33 can change the size of the magnetic field formed at the end of the rod 32, thereby changing the magnetic attraction between the magnetic field formed by the rod 32 and the magnet block 24 to adjust the opening amplitude of the claw 22.

[0122] In the present invention, the regulating block 31 is arranged above the turntable 10, and the vertical height of the regulating block 31 is less than the height of the claw 22, ensuring that the magnetic field formed by the regulating block 31 is opposite to the position of the magnetic block 24 on the claw body 22a, so as to form a magnetic attraction through opposite magnetic poles.

[0123] Combine the following Figure 8 and Fig. 9 , briefly explain the working principle of the claw assembly 20.

[0124] Figure 8 2 is a relative position diagram of the first clamping claw 20A and the second clamping claw 20B corresponding to the clamping claw assembly 20 in the closed state, wherein the coil 33 in the regulating assembly 30 is not energized, and no magnetic field is formed at the end of the rod 32. The opposite surfaces of the magnetic blocks 24 of the first clamping claw 20A and the second clamping claw 20B are N poles, and under the action of magnetic repulsion, the first clamping claw 20A and the second clamping claw 20B move away from each other, so that the contact column 25 on the support member 22b moves toward the inner side of the turntable 10 to clamp the wafer.

[0125] Fig. 9 : is a relative position relationship diagram of the first claw 20A and the second claw 20B corresponding to the open state, wherein the coil 33 in the control component 30 is energized, a magnetic field is formed at the end of the rod 32, and the magnetic pole at the outer end surface of the rod 32 is the S pole. A magnetic attraction is formed between the magnetic field of the rod 32 and the magnetic block 24, and under the action of the magnetic attraction, the first claw 20A and the second claw 20B approach each other, so that the contact column 25 on the support member 22b moves away from the center of the turntable 10 to release the wafer.

[0126] It should be noted that when the claw assembly 20 clamps the wafer, Figure 8 The magnetic repulsion force pushes the contact pin 25 against the edge of the wafer to clamp the wafer; if the clamped wafer is broken, the contact pin 25 abutting against the edge of the wafer will lose balance and cause the claw 22 to rotate. During this process, the moving magnetic block 24 cuts the magnetic flux lines at the front end of the rod 32, so that the rod 32 generates an induced current. Therefore, it is possible to monitor whether the wafer clamped by the wafer clamping mechanism 100 is broken by adjusting the induced current of the component 30.

[0127] Therefore, in the present invention, there is no need to configure an additional detection module for the wafer clamping mechanism 100. The change in the induced current of the regulating component 30 can be used to detect whether the wafer is in place in the wafer clamping mechanism 100, which effectively saves space and reduces the manufacturing cost of the wafer clamping mechanism 100.

[0128] At the same time, the control component 30 configured in the present invention is suitable for the detection environment with high humidity in the wafer post-processing chamber, avoiding the influence of the working environment on the detection accuracy, reducing the requirements for the detection environment, and improving the accuracy of the wafer in-situ detection. It should be noted that the magnitude of the induced current formed by the movement of the magnetic block 24 to cut the magnetic flux lines is small, and a signal amplifier needs to be configured for the control component 30 in order to accurately detect the change of the induced current, and then accurately detect the state of the wafer.

[0129] Fig.10 1 is a schematic diagram of a wafer post-processing device 1000 provided in one embodiment of the present invention. The wafer post-processing device 1000 includes:

[0130] The box 200 provides a relatively closed space for wafer post-processing; the box 200 is provided with a switch door so that the robot can place the wafer to be processed in the box 200 through the switch door;

[0131] Figure 1 The wafer clamping mechanism 100 shown is disposed inside a box 200, and a driving mechanism is disposed below the box to drive the clamped wafer to rotate around an axis;

[0132] The post-processing module 300 is disposed above the wafer clamping mechanism 100 to perform a post-processing process on the rotating wafer.

[0133] A protective cover 400 is also provided inside the wafer post-processing device 1000, which is arranged around the outside of the wafer clamping mechanism 100 and can move in the vertical direction to prevent the liquid on the surface of the wafer from being thrown toward the inner wall of the box body 200 under the action of centrifugal force and polluting the wafer post-processing environment during the wafer post-processing process.

[0134] At the same time, a fan filter unit (FFU) is configured on the top of the box 200 to provide clean air into the box 200, thereby improving the post-processing effect of the wafer.

[0135] At the same time, the present invention also provides a wafer post-processing method, which uses Fig.10 The wafer post-processing apparatus 1000 shown performs a post-processing process. Fig.11 : is a flow chart of the wafer post-processing method, and the wafer post-processing method includes:

[0136] S1, the regulating assembly 30 is powered on, and the claw 22 of the claw assembly 20 is in an open state;

[0137] Specifically, the claw assembly 20 is in a closed state by default, that is, no magnetic field is formed at the end of the rod 32 of the regulating assembly 30; at this time, under the action of the magnetic repulsion force between the magnetic blocks 24 of the first claw 20A and the second claw 20B, the claws 22 move away from each other, causing the contact column 25 to move toward the inner side of the turntable 10.

[0138] In order to open the claw assembly 20, the regulating assembly 30 is energized, that is, the coil 33 wound around the outer peripheral side of the rod 32 is energized, so that a magnetic field is formed at the end of the bent surface of the rod 32 close to the claw 22, and the magnetic field is different from the magnetic pole of the opposite surface of the magnetic block 24. Therefore, under the action of the magnetic attraction between the two, the first claw 20A and the second claw 20B approach each other, so that the contact column 25 moves toward the outside of the turntable 10.

[0139] S2, the robot places the wafer on the turntable 10, the regulating assembly 30 is powered off, and the claws 22 of the claw assembly 20 are closed to clamp the wafer;

[0140] The wafer is placed on the turntable 10 by using the robot, and according to the method described in step S1, the regulating component 30 is powered off so that the claw component 20 is in a closed state to clamp the wafer; then, the robot leaves the box 200;

[0141] S3, the driving mechanism drives the clamped wafer to rotate around the axis, and the post-processing module 300 sprays water and / or chemical liquid toward the wafer to process the wafer surface.

[0142] During the wafer post-processing process, if the wafer W clamped by the claw assembly 20 is broken, the claws 22 move away from each other around the cylindrical member 23 under the action of the magnetic repulsion force, so that the magnetic flux of the magnetic block 24 changes, and the control component 30 can detect the change of the induced current and alarm. Therefore, the control component 30 can monitor the operating status of the wafer during the wafer post-processing process and issue a warning for abnormal conditions such as wafer fragments in a timely manner.

[0143] In addition, an embodiment of the present invention further provides a wafer clamping mechanism 100, such as Fig.12 As shown, the wafer clamping mechanism 100 comprises:

[0144] The turntable 10 has a driving mechanism disposed below it to drive the turntable 10 to rotate around its central axis;

[0145] A claw assembly 20 is arranged along the circumference of the turntable 10, wherein the claw assembly 20 clamps or releases the wafer by magnetic force;

[0146] The regulating component 30 is located on the side of the claw component 20. The regulating component 30 can change the magnetic force direction of the claw component 20, thereby switching the working state of the claw component 20 to clamp or release the wafer. For example, the regulating component 30 can switch the claw component 20 from an open state to a closed state, or the regulating component 30 can switch the claw component 20 from a closed state to an open state.

[0147] It is understandable that the magnetic force formed by the claw assembly 20 can be magnetic repulsion or magnetic attraction, so as to form a clamping force acting on the edge of the wafer to clamp the wafer, or to form a pushing force away from the edge of the wafer to release the wafer.

[0148] Fig.12 The structure of the claw assembly 20 in the embodiment is Figure 1 The structure of the claw assembly 20 in the embodiment is similar, and only the composition and connection relationship of the claw assembly 20 are briefly described here.

[0149] The claw assembly 20 includes a pair of claws 22. Figure 3 As shown, the claws 22 are provided with contact pins 25, which are used to abut against the edge of the wafer to clamp the wafer. That is, the pair of claws 22 are the first claw 20A and the second claw 20B, and the contact pins 25 on the first claw 20A and the second claw 20B abut against the surface of the wafer to clamp the wafer.

[0150] Furthermore, the claw assembly 20 also includes a fixed seat 21, on which a cylindrical member 23 is provided, and the cylindrical member 23 can be a bearing, and a pair of claws 22 are rotatably connected to the outer circumference of the cylindrical member 23. That is, the claws 22 can rotate with the cylindrical member 23 as a reference to change the position of the contact column 25, thereby switching the working state of the claw assembly 20.

[0151] In the present invention, magnetic blocks 24 are disposed on opposite surfaces of a pair of claws 22. The opposite magnetic blocks 24 form magnetic repulsion or magnetic attraction, so that the claws 22 rotate around the cylindrical member 23 to change the position of the contact column 25 to achieve the opening or closing of the claw assembly 20.

[0152] Furthermore, the claw 22 includes a claw body 22a, which is a partial circular ring structure and is rotatably connected to the outer peripheral side of the cylindrical member 23; a support member 22b is offsetly provided on the upper part of the claw body 22a, and the claw body 22a rotating around the cylindrical member 23 can drive the support member 22b to deflect to change the position of the contact column 25.

[0153] Figure 4 In the illustrated embodiment, the support member 22 b of the first jaw 20A extends toward the side where the center of the jaw body 22 a is located, so as to reduce the volume of the jaw assembly 20 .

[0154] at the same time, Figure 4 The claws 22 shown are arranged in a vertically staggered manner, and particles formed by post-processing of the wafer may be retained between the claws 22. Therefore, in some embodiments, the support member 22b of the first claw 20A may also extend away from the side where the center of the claw body 22a is located to avoid the first claw 20A and the second claw 20B overlapping in the horizontal direction. At the same time, the distance between the contact pillars 25 of the support member 22b is relatively large, so that a set of claw assemblies 20 can form two clamping points with a long distance, and then two sets of claw assemblies 20 can be used to achieve reliable clamping of the wafer.

[0155] In some embodiments, the fixing seat 21 is detachably connected to the turntable 10 , and a positioning member 26 is disposed above the fixing seat 21 to limit the circumferential position of the claw 22 relative to the cylindrical member 23 .

[0156] Figure 3 In the illustrated embodiment, three magnetic blocks 24 are disposed on the opposite sides of the claw 22 , wherein the magnetic poles of the magnetic blocks 24 of the first claw 20A and the magnetic blocks 24 of the second claw 20B are N poles, and the magnetic repulsion formed by the two can change the position of the contact column 25 .

[0157] It is understandable that the magnetic poles of the opposite surfaces of the magnetic block 24 of the first claw 20A and the magnetic block 24 of the second claw 20B may also be different, such as Fig.13 As shown, a magnetic attraction is formed between the two; Fig.13 In the embodiment shown, the magnetic pole on the outer side of the magnetic block 24 set on the first claw 20A is the N pole, and the magnetic pole on the outer side of the magnetic block 24 set on the second claw 20B is the S pole. The magnetic attraction formed by the two enables the claws 22 to move toward each other with the cylindrical member 23 as a reference to change the position of the contact column 25.

[0158] Fig.13 In the embodiment shown, the structure of the claw 22 is as follows: Figure 3 As shown, the magnetic attraction force formed by the magnetic block 24 on the claw 22 makes the contact pillar 25 move away from the edge of the wafer. At this time, the claw assembly 20 is in an open state.

[0159] Fig.12 In the embodiment shown, the control component 30 includes a control block 31, see Figure 7 A rod 32 is disposed inside the regulating block 31 ; a coil 33 is wound around the outer circumference of the rod 32 , and the energized coil 33 can form a magnetic field at the end of the rod 32 .

[0160] Furthermore, there are multiple rods 32 , and the positions of the rods 32 correspond to the positions of the magnetic blocks 24 on the claws 22 , so that the two can form a greater magnetic repulsion or magnetic attraction.

[0161] The regulating block 31 is arranged on the side of the fixing seat 21 and its front end is arranged toward the gap of the claw 22. The magnetic poles of the magnetic field formed by the rod 32 are the same as or different from the magnetic poles of the opposite side of the magnetic block 24 to change the direction of the magnetic force between the claw 22 and the regulating component 30.

[0162] exist Figure 8 In the illustrated embodiment, when the regulating assembly 30 is not turned on, the magnetic poles of the opposite surfaces of the magnetic block 24 on the claw 22 are the same, and a magnetic repulsion force is formed between the pair of claws 22 to drive the contact column 25 to move toward the inner side of the turntable 10, and the claw assembly 20 is closed; after the regulating assembly 30 is turned on, the magnetic poles of the magnetic field formed by the rod 32 of the regulating assembly 30 are different from the magnetic poles of the opposite surface of the magnetic block 24, such as Fig. 9 As shown, the magnetic attraction force formed between the two drives the contact pin 25 to move away from the center of the turntable 10, and the claw assembly 20 opens. That is, in this embodiment, the magnetic poles of the magnetic field formed by the rod 32 are different from the magnetic poles of the opposite surface of the magnetic block 24.

[0163] exist Fig.13 In the illustrated embodiment, when the regulating assembly 30 is not turned on, the magnetic poles of the opposite surfaces of the magnetic block 24 on the claw 22 are different, and a magnetic attraction is formed between the pair of claws 22 to drive the contact post 25 to move away from the center of the turntable 10, and the claw assembly 20 is opened; after the regulating assembly 30 is turned on, the magnetic poles of the magnetic field formed by the rod 32 of the regulating assembly 30 are the same as the magnetic poles of the opposite surface of the magnetic block 24, such as Fig.14 As shown, the magnetic repulsion force formed therebetween drives the contact pin 25 to move toward the inner side of the turntable 10, and the claw assembly 20 is closed. That is, in this embodiment, the magnetic poles of the magnetic field formed by the rod 32 are the same as the magnetic poles of the opposite surface of the magnetic block 24.

[0164] It should be noted that Fig.13 and Fig.14 In the illustrated embodiment, the regulating assembly 30 includes a pair of sub-regulating assemblies (divided by dashed lines) so as to form magnetic fields of corresponding magnetic poles at the ends of the rod 32 as required.

[0165] At the same time, the present invention also provides a wafer post-processing device 1000, a schematic diagram of which is shown in FIG. Fig.10 As shown, the wafer post-processing device 1000 includes:

[0166] Box 200;

[0167] Fig.12 The wafer clamping mechanism 100 shown in the embodiment is disposed inside the box 200, and a driving mechanism is disposed below the box 200 to drive the clamped wafer to rotate around an axis;

[0168] The post-processing module 300 is disposed above the wafer clamping mechanism 100 to perform a post-processing process on the rotating wafer.

[0169] In this embodiment, the opening and closing of the regulating component 30 can change the working state of the claw component 20 to control the clamping force of the claw 22 on the wafer, thereby avoiding the unstable clamping of the spring in the prior art and causing fragmentation; at the same time, the movement of the claw 22 in the claw component 20 causes the magnetic flux of the magnetic block 24 to change, and the regulating component 30 can detect the change in the induced current and alarm. That is, the regulating component 30 can monitor the operating state of the wafer during the wafer post-processing process and promptly issue an early warning for abnormal conditions such as wafer fragmentation.

[0170] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer clamping mechanism, characterized in that: include: Turntable; A claw assembly is arranged along the circumference of the turntable, the claw assembly includes a fixed seat and a pair of claws, the pair of claws are arranged around the cylindrical member above the fixed seat; the opposite surfaces of the pair of claws are provided with magnetic blocks with the same magnetic poles, the magnetic repulsion of the two causes the claws to move away from each other around the cylindrical member, and the contact column of the claw moves toward the inner side of the turntable to close the claws to clamp the wafer; A regulating component is arranged on the side of the fixing seat and its front end is arranged toward the gap between the claws; the front end of the regulating component can generate a magnetic pole different from the magnetic block of the claws, and the magnetic attraction between the regulating component and the claws makes the claws approach each other around the cylindrical part, and the contact column of the claws moves toward the outside of the turntable to open the claws to release the wafer.

2. The wafer clamping mechanism according to claim 1, characterized in that: The clamping claw comprises a clamping claw body, which is a partial annular structure and is rotatably connected to the outer circumference of a cylindrical member; a supporting member is disposed on the upper portion of the clamping claw body, and a contact column is disposed at the end of the supporting member to abut against the edge of a wafer.

3. The wafer clamping mechanism according to claim 1, characterized in that: The fixing seat is detachably connected to the rotating disk, and a positioning piece is arranged above the fixing seat to limit the circumferential position of the clamping claw relative to the cylindrical piece.

4. The wafer clamping mechanism according to claim 2, characterized in that: One end surface of the claw body is a bending surface, and the bending surface includes a first bending surface and a second bending surface, on which a plurality of magnetic blocks are arranged at intervals.

5. The wafer clamping mechanism according to claim 4, characterized in that: When the clamping jaw assembly is in a clamping state, the first bending surfaces of the two clamping jaws are parallel to each other.

6. The wafer clamping mechanism according to claim 4, characterized in that: The included angle between the first bending surface and the second bending surface is 110°-135°.

7. The wafer clamping mechanism according to claim 4, characterized in that: The width of the second bending surface is greater than the width of the first bending surface.

8. The wafer clamping mechanism according to claim 4, characterized in that: The other end surface of the claw body is a plane or an arc surface.

9. The wafer clamping mechanism according to claim 2, characterized in that: The claw body is larger than or equal to 1 / 4 of the circular ring structure.

10. The wafer clamping mechanism according to claim 2, characterized in that: The support member is offsetly arranged on the upper part of the claw body, and the claw body rotating around the cylindrical member can drive the support member to deflect, so as to change the position of the contact column.

11. The wafer clamping mechanism according to claim 10, wherein: The support member of the clamping jaw is vertically staggered with the support member of another clamping jaw, and the contact column is located on the inner side or the outer side of the clamping jaw body.

12. The wafer clamping mechanism according to claim 11, characterized in that: The support member is provided with a limiting groove, and the contact column of the clamping claw can be clamped in the limiting groove of another clamping claw to limit the deflection range of the support member.

13. The wafer clamping mechanism according to claim 11, wherein: The support member extends toward the side where the center of the claw body is located, and the contact column is arranged at one end of the support member facing the center of the claw body.

14. The wafer clamping mechanism according to claim 1, wherein: The regulating component comprises a regulating block, wherein a rod is arranged inside the regulating block; a coil is wound around the outer circumference of the rod, and the energized coil can form a magnetic field at the end of the rod.

15. The wafer clamping mechanism according to claim 14, wherein: There are multiple rods, and their arrangement positions correspond to the positions of the magnetic blocks on the claws.

16. The wafer clamping mechanism according to claim 14, wherein: The end of the regulating block is a V-shaped surface, which is arranged toward the gap between the claws; the rod at least partially penetrates the regulating block and extends to the V-shaped surface.

17. The wafer clamping mechanism according to claim 14, wherein: The regulating block is arranged above the rotating disk, and the vertical height of the regulating block is smaller than the height of the claw.

18. A wafer post-processing device, characterized in that: include: Box; The wafer clamping mechanism according to any one of claims 1 to 17 is arranged inside the box, and a driving mechanism is arranged below the box to drive the clamped wafer to rotate around the axis; The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

19. A wafer post-processing method, characterized in that: The post-processing process is performed using the wafer post-processing device according to claim 18, comprising: S1, the regulating component is powered on, and the claw of the claw assembly is in the open state; S2, the robot places the wafer on the turntable, the control component is powered off, and the claws of the claw assembly are closed to clamp the wafer; S3, the driving mechanism drives the clamped wafer to rotate around the axis, and the post-processing module sprays water and / or chemical liquid toward the wafer to process the wafer surface.

20. The wafer post-processing method according to claim 19, characterized in that: During wafer post-processing, if a wafer clamped by the claw assembly breaks, the claws move away from each other around the cylindrical member under the action of magnetic repulsion, causing the magnetic flux of the magnetic block to change. The control component can detect the change in induced current and sound an alarm.

21. A wafer clamping mechanism, characterized in that: include: Turntable; A claw assembly is arranged along the circumference of the turntable, and the claw assembly clamps or releases the wafer by magnetic force; A regulating component, which is located on the side of the claw assembly, and the regulating component can change the magnetic force direction of the claw assembly, thereby switching the working state of the claw assembly; The claw assembly includes a pair of claws, on which contact pins are arranged, and the contact pins abut against the edge of the wafer; the claw assembly also includes a fixed seat, on which a cylindrical member is arranged, and the pair of claws are rotatably connected to the outer circumference of the cylindrical member; the opposite surfaces of the pair of claws are arranged with magnetic blocks, and the relative magnetic blocks form a magnetic repulsion or magnetic attraction force, so that the claws rotate around the cylindrical member to change the position of the contact pins to realize the opening or closing of the claw assembly; the regulating assembly includes a regulating block, which is arranged above the turntable and has a rod member arranged inside; a coil is wound around the outer circumference of the rod member, and the energized coil can form a magnetic field at the end of the rod member.

22. The wafer clamping mechanism according to claim 21, wherein: The regulating block is arranged on the side of the fixing seat and its front end is arranged toward the gap between the claws. The magnetic poles of the magnetic field formed by the rod are the same as or different from the magnetic poles of the opposite surface of the magnetic block to change the direction of the magnetic force between the claws and the regulating component.

23. The wafer clamping mechanism according to claim 21, wherein: There are multiple rods, and their arrangement positions correspond to the positions of the magnetic blocks on the claws.

24. The wafer clamping mechanism according to claim 21, wherein: The clamping claw comprises a clamping claw body which is a partial annular structure and is rotatably connected to the outer circumference of the cylindrical member; a support member is offsetly provided on the upper portion of the clamping claw body, and the clamping claw body rotating around the cylindrical member can drive the support member to deflect to change the position of the contact column.

25. The wafer clamping mechanism according to claim 21, wherein: The fixing seat is detachably connected to the rotating disk, and a positioning piece is arranged above the fixing seat to limit the circumferential position of the clamping claw relative to the cylindrical piece.

26. A wafer post-processing device, characterized in that: include: Box; The wafer clamping mechanism according to any one of claims 21 to 25 is arranged inside the box, and a driving mechanism is arranged below the box to drive the clamped wafer to rotate around the axis; The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

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