Board-level architecture, packaging module, electronic equipment and manufacturing method of board-level architecture

Abstract

The embodiment of the invention provides a board-level framework, a packaging module, electronic equipment and a manufacturing method of the board-level framework, the board-level framework is characterized in that a first bonding layer and at least one first conductive medium are arranged between the lower surface of an adapter board and the upper surface of a first circuit board, the first bonding layer is used for bonding the adapter board and the first circuit board, and the first conductive medium is used for bonding the adapter board and the first circuit board; the at least one first conductive medium is used for electrically connecting the adapter plate and the first circuit board, so that the connection reliability between the first circuit board and the adapter plate can be improved, and the overall reliability of the board-level architecture can be improved.

Description

[0001] This application is a divisional application. The application number of the original application is 202111403070.8, and the original application date is November 24, 2021. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The embodiments of the present application relate to the field of integrated circuit packaging technology, and in particular to a board-level architecture, a packaging module, an electronic device, and a method for manufacturing the board-level architecture. Background Art

[0003] With the continuous development of science and technology, ultra-high-speed system architecture has put forward higher and higher requirements on the high-speed performance of signal transmission.

[0004] At present, the electrical connection between the printed circuit board (PCB) and the chip is achieved through solder balls. In order to meet the high-speed performance of signal transmission in the board-level architecture, it is generally achieved by increasing the size of the printed circuit board. However, a circuit board with too large a size is likely to exceed the capacity limit of solder ball welding. Therefore, in the related art, an adapter board is generally set as a bridge between the printed circuit board and the chip. Specifically, the printed circuit board and the adapter board are electrically connected through solder ball welding, so that the high-speed signal can pass smoothly between the high-speed printed circuit board and the chip through the adapter board.

[0005] However, in the above solution, the connection between the printed circuit board and the adapter board is prone to failure and has low reliability. Summary of the invention

[0006] The embodiments of the present application provide a board-level architecture, a packaging module, an electronic device, and a method for manufacturing the board-level architecture, which can improve the connection reliability between the first circuit board and the adapter board, thereby improving the overall reliability of the board-level architecture.

[0007] In a first aspect, an embodiment of the present application provides a board-level architecture, which includes at least: a first circuit board, an adapter board, and at least one first device; the adapter board is located between the upper surface of the first circuit board and the lower surface of the at least one first device, and the upper surface of the adapter board is electrically connected to the at least one first device; and also includes: a first adhesive layer and at least one first conductive medium; the first adhesive layer and the at least one first conductive medium are located between the lower surface of the adapter board and the upper surface of the first circuit board; the first adhesive layer is used to bond the adapter board and the first circuit board, and the at least one first conductive medium is used to electrically connect the adapter board and the first circuit board.

[0008] The board-level architecture provided by the embodiment of the present application is provided with a first adhesive layer and at least one first conductive medium between the lower surface of the adapter board and the upper surface of the first circuit board. The first adhesive layer is used to bond the adapter board and the first circuit board to achieve a fixed connection between the adapter board and the first circuit board, and the at least one first conductive medium is used to electrically connect the adapter board and the first circuit board to achieve electrical conduction between the adapter board and the first circuit board. In this way, compared with the prior art, the high-temperature welding process is eliminated, and the problem of reduced connection reliability or even connection failure due to high-temperature welding between the first circuit board and the adapter board can be avoided. For example, the problem of solder ball welding between the adapter board and the first circuit board in the prior art that easily leads to cracking of solder joints can be avoided. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board and the adapter board, thereby improving the overall reliability of the board-level architecture.

[0009] In a possible implementation, at least one first through hole is provided on the first adhesive layer, and the at least one first through hole extends along the thickness direction of the first adhesive layer, and the first conductive medium is located in the first through hole; one end of the first conductive medium is electrically connected to the first circuit board, and the other end of the first conductive medium is electrically connected to the adapter board.

[0010] The first adhesive layer can reduce the stress generated by the first circuit board and the adapter board during the subsequent packaging process, thereby reducing the adverse effects on the structure of the first circuit board or the adapter board, thereby enhancing the anti-deformation ability between the first circuit board and the adapter board. The first conductive medium has a conductive function and can achieve electrical conduction between the first circuit board and the adapter board.

[0011] In a possible implementation, the first circuit board has at least one first conductive sheet on a surface facing the adapter board, and the adapter board has at least one second conductive sheet on a surface facing the first circuit board; one end of the first conductive medium is electrically connected to the first conductive sheet, and the other end of the first conductive medium is electrically connected to the second conductive sheet.

[0012] In a possible implementation manner, the material used for the first adhesive layer is polypropylene or plastic.

[0013] In a possible implementation manner, the length of the first conductive medium along the thickness direction of the first adhesive layer is 200-300 um; the length of the first conductive medium along the thickness direction perpendicular to the first adhesive layer is 200-300 um.

[0014] In a possible implementation, the adapter board and the first circuit board are electrically connected by pressing the first conductive medium at a preset temperature; wherein the preset temperature is less than or equal to 240 degrees Celsius.

[0015] In this way, when the adapter board and the first circuit board are pressed together through the first conductive medium at a preset temperature less than or equal to 240 degrees Celsius, the pressing temperature is low, which can avoid the problem of reduced connection reliability or even connection failure between the first circuit board and the adapter board due to high-temperature welding.

[0016] In a possible implementation, it also includes: a second adhesive layer and a second conductive medium; the second adhesive layer and the at least one second conductive medium are located between the upper surface of the adapter board and the upper surface of the at least one first device; the second adhesive layer is used to bond the adapter board and the at least one first device, and the at least one second conductive medium is used to electrically connect the adapter board and the at least one first device.

[0017] The second adhesive layer is used to bond the adapter board and at least one first device to achieve a fixed connection between the adapter board and the first device, and at least one second conductive medium is used to electrically connect the adapter board and at least one first device to achieve electrical conduction between the adapter board and the first device. In this way, compared with the prior art, the high-temperature welding process is eliminated, and the problem of reduced connection reliability or even connection failure between the first device and the adapter board due to high-temperature welding can be avoided. For example, the problem of solder ball welding between the adapter board and the first device in the prior art that easily causes solder joint cracking can be avoided, thereby improving the connection reliability between the first device and the adapter board.

[0018] In a possible implementation, at least one second through hole is provided on the second adhesive layer, the at least one second through hole extends along the thickness direction of the second adhesive layer, and the second conductive medium is located in the second through hole; one end of the second conductive medium is electrically connected to the adapter board, and the other end of the second conductive medium is electrically connected to the first device.

[0019] The second adhesive layer can reduce the stress generated by the first device and the adapter board during the subsequent packaging process, thereby reducing the adverse effects on the structure of the first device or the adapter board, thereby enhancing the anti-deformation ability between the first device and the adapter board. The second conductive medium has a conductive function and can achieve electrical conduction between the first device and the adapter board.

[0020] In a possible implementation, the adapter board has at least one third conductive sheet on a surface facing the at least one first device, and the at least one first device has at least one fourth conductive sheet on a surface facing the adapter board; one end of the second conductive medium is electrically connected to the third conductive sheet, and the other end of the second conductive medium is electrically connected to the fourth conductive sheet.

[0021] In a possible implementation, the adapter board and the first device are electrically connected by pressing the second conductive medium at a preset temperature; wherein the preset temperature is less than or equal to 240 degrees Celsius.

[0022] In this way, when the adapter board and the first device are pressed together through the second conductive medium at a preset temperature less than or equal to 240 degrees Celsius, the pressing temperature is low, which can avoid the problem of reduced connection reliability or even connection failure between the first device and the adapter board due to high-temperature welding. Therefore, the connection reliability between the adapter board and the first device can be improved, thereby improving the overall reliability of the board-level architecture.

[0023] In a possible implementation manner, the device further includes: at least one third conductive medium, and the adapter board and the first device are electrically connected by welding the third conductive medium.

[0024] In a possible implementation, the adapter plate is stacked with the first circuit board. By stacking the adapter plate with the first circuit board, the process flow of the electrical connection between the adapter plate and the first circuit board can be relatively simplified, and the process difficulty of the electrical connection between the adapter plate and the first circuit board can also be reduced.

[0025] In a possible implementation, at least a portion of the adapter board is located inside the first circuit board. By disposing at least a portion of the adapter board inside the first circuit board, the overall volume of the adapter board after being electrically connected to the first circuit board can be reduced, thereby facilitating miniaturization of the packaging structure and reducing the occupied space of the board-level architecture.

[0026] In a possible implementation, a groove is provided on a side of the first circuit board facing the first device, and the adapter board is located in the groove. By providing a groove on a side of the first circuit board facing the first device and arranging the adapter board in the groove, the overall volume of the adapter board after being electrically connected to the first circuit board can be reduced, thereby facilitating miniaturization of the packaging structure and reducing the occupied space of the board-level architecture.

[0027] In a possible implementation, the side of the first circuit board provided with the groove is flush with the side of the adapter board facing the first device. In this way, the side of the first circuit board provided with the groove is flush with the side of the adapter board facing the first device, which can ensure that the side of the first circuit board facing the first device is relatively flat, that is, the side of the adapter board facing the first device and the side of the first circuit board facing the first device are coplanar, thereby reducing the difficulty of assembly when the back end is packaged with the first device.

[0028] In a possible implementation, the adapter plate is exposed on one side away from the bottom wall of the groove. The adapter plate is exposed on one side away from the bottom wall of the groove, which can facilitate the subsequent connection between the first device and the side of the adapter plate away from the bottom wall of the groove, thereby shortening the conduction path between the first device and the adapter plate.

[0029] In a possible implementation, it further includes: a second circuit board; the second circuit board is located on the side of the first circuit board where the groove is provided; and the second circuit board and the groove are jointly formed to form a receiving cavity, and the adapter board is located in the receiving cavity. By arranging the second circuit board on the side of the first circuit board where the groove is provided, the second circuit board and the groove are jointly formed to form a receiving cavity, and the adapter board is arranged in the receiving cavity, the surface flatness of the side of the first circuit board facing the first device can be further achieved, and in addition, it is helpful to achieve the increase of layers along the thickness direction of the first circuit board, thereby helping to improve the layout density and space utilization of the entire first circuit board.

[0030] In a possible implementation, at least one opening extending along the thickness direction of the second circuit board is provided in the area of ​​the second circuit board opposite to the adapter board; a third conductive medium is provided in the opening, one end of the third conductive medium is electrically connected to the adapter board, and the other end of the third conductive medium is electrically connected to the second conductive medium. In this way, the electrical connection between the adapter board and the first device can be achieved.

[0031] In a possible implementation, it includes: a system-level packaging module; the system-level packaging module includes: the first device and a third circuit board electrically connected to the first device; the third circuit board is electrically connected to the adapter board on a side away from the first device. In this way, the structural strength of the first device can be improved, and scratches or damages caused when the first device is directly electrically connected to the adapter board can be avoided, which will have an adverse effect on the performance of the first device.

[0032] In a second aspect, an embodiment of the present application provides a board-level architecture, which includes at least: a first circuit board, an adapter board and at least one first device; the adapter board is located between the upper surface of the first circuit board and the lower surface of the at least one first device, and the upper surface of the adapter board is electrically connected to the at least one first device; and also includes: at least one first conductive medium and at least two third adhesive layers; the at least one first conductive medium and the at least two third adhesive layers are located between the lower surface of the adapter board and the upper surface of the first circuit board; at least one of the at least two third adhesive layers is used to bond the adapter board and the first conductive medium, and at least one of the at least two third adhesive layers is used to bond the first circuit board and the first conductive medium.

[0033] The board-level architecture provided by the embodiment of the present application is provided with at least one first conductive medium and at least two third adhesive layers between the lower surface of the adapter board and the upper surface of the first circuit board, at least one of the at least two third adhesive layers is used to bond the adapter board and the first conductive medium, and at least one of the at least two third adhesive layers is used to bond the first circuit board and the first conductive medium, so as to achieve a fixed connection and electrical conduction between the adapter board and the first circuit board. In this way, compared with the prior art, the high-temperature welding process is eliminated, and the problem of reduced connection reliability or even connection failure due to high-temperature welding between the first circuit board and the adapter board can be avoided. For example, the problem of solder ball welding between the adapter board and the first circuit board in the prior art that easily leads to cracking of solder joints can be avoided. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board and the adapter board, thereby improving the overall reliability of the board-level architecture.

[0034] In a possible implementation, the first circuit board has at least one first conductive sheet on a surface facing the adapter board, and the adapter board has at least one second conductive sheet on a surface facing the first circuit board; the first conductive medium and the first conductive sheet, as well as the first conductive medium and the second conductive sheet, are electrically connected via the third adhesive layer.

[0035] In a possible implementation manner, the material used for the third adhesive layer is silicone gel, silver glue or solder paste.

[0036] In a third aspect, an embodiment of the present application provides a packaging module, comprising: a packaging body and a board-level architecture as described in any one of the above.

[0037] The packaging module provided in the embodiment of the present application includes a board-level architecture, wherein a first adhesive layer and at least one first conductive medium are arranged between the lower surface of the adapter board and the upper surface of the first circuit board, wherein the first adhesive layer is used to bond the adapter board and the first circuit board to achieve a fixed connection between the adapter board and the first circuit board, and the at least one first conductive medium is used to electrically connect the adapter board and the first circuit board to achieve electrical conduction between the adapter board and the first circuit board. In this way, compared with the prior art, the high-temperature welding process is eliminated, and the problem of reduced connection reliability or even connection failure between the first circuit board and the adapter board due to high-temperature welding can be avoided. For example, the problem of solder ball welding between the adapter board and the first circuit board in the prior art, which easily leads to cracking of solder joints, can be avoided. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board and the adapter board, thereby improving the overall reliability of the board-level architecture.

[0038] In a fourth aspect, an embodiment of the present application provides an electronic device, which includes any one of the packaging modules described above.

[0039] By setting the above-mentioned packaging module in the electronic device, since the reliability of the board-level architecture in the packaging module is high, a high-reliability board-level architecture can be set in the electronic device, which will optimize the experience effect of the electronic device. At the same time, it also ensures the stability of signal transmission in the electronic device and ensures the normal operation of the electronic device.

[0040] In a fifth aspect, an embodiment of the present application provides a method for manufacturing a board-level architecture, which method for manufacturing a board-level architecture includes at least: providing a first circuit board, an adapter board, and at least one first device; electrically connecting the upper surface of the adapter board with the lower surface of the at least one first device; setting a first adhesive layer between the lower surface of the adapter board and the upper surface of the first circuit board; and providing at least one first through hole on the first adhesive layer, which extends along the thickness direction of the first adhesive layer, and providing a first conductive medium in the first through hole.

[0041] The manufacturing method of the board-level architecture provided in the embodiment of the present application, the manufacturing method of the board-level architecture is provided by setting a first adhesive layer between the lower surface of the adapter board and the upper surface of the first circuit board, the first adhesive layer is used to bond the adapter board and the first circuit board to achieve a fixed connection between the adapter board and the first circuit board, at least one first through hole extending along the thickness direction of the first adhesive layer is provided on the first adhesive layer, a first conductive medium is provided in the first through hole, at least one first conductive medium is used to electrically connect the adapter board and the first circuit board to achieve electrical conduction between the adapter board and the first circuit board. In this way, compared with the prior art, the high-temperature welding process is eliminated, and the problem of reduced connection reliability or even connection failure due to high-temperature welding between the first circuit board and the adapter board can be avoided. For example, the problem of solder ball welding between the adapter board and the first circuit board in the prior art can be avoided, which easily leads to cracking of solder joints. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board and the adapter board, thereby improving the overall reliability of the board-level architecture.

[0042] In a possible implementation, a first adhesive layer is arranged between the lower surface of the adapter board and the upper surface of the first circuit board, and at least one first through hole extending along the thickness direction of the first adhesive layer is arranged on the first adhesive layer. After a first conductive medium is arranged in the first through hole, the method further comprises: pressing the lower surface of the adapter board and the upper surface of the first circuit board at a preset temperature through the first conductive medium to achieve electrical connection; wherein the preset temperature is less than or equal to 240 degrees Celsius.

[0043] The lower surface of the adapter board and the upper surface of the first circuit board are electrically connected by pressing together at a preset temperature less than or equal to 240 degrees Celsius through a first conductive medium, which can avoid the problem of reduced connection reliability or even connection failure between the first circuit board and the adapter board due to high-temperature welding.

[0044] In a possible implementation, a first adhesive layer is arranged between the lower surface of the adapter board and the upper surface of the first circuit board, at least one first through hole extending along the thickness direction of the first adhesive layer is arranged on the first adhesive layer, and a first conductive medium is arranged in the first through hole, including: a first adhesive layer is arranged on one surface of the first circuit board; at least one first through hole extending along the thickness direction of the first adhesive layer is arranged on the first adhesive layer, and a first conductive medium is arranged in the first through hole; and the adapter board is arranged on a surface of the first adhesive layer facing away from the first circuit board.

[0045] By providing a first adhesive layer on one side of the first circuit board, the stress generated by the first circuit board and the adapter board during the subsequent packaging process can be reduced to reduce the adverse effects on the structure of the first circuit board or the adapter board, thereby enhancing the anti-deformation ability between the first circuit board and the adapter board. The first conductive medium has a conductive function and can achieve electrical conduction between the first circuit board and the adapter board. In addition, by providing an adapter board on the side of the first adhesive layer facing away from the first circuit board, the first circuit board and the adapter board can be packaged in an integrated manner.

[0046] In a possible implementation, after setting the first adhesive layer on one side of the first circuit board, the method further includes: setting a protective film layer on the side of the first adhesive layer facing away from the first circuit board; and before setting the adapter board on the side of the first adhesive layer facing away from the first circuit board, the method further includes: removing the protective film layer.

[0047] By providing a protective film layer on the side of the first adhesive layer facing away from the first circuit board, the first adhesive layer can be protected to a certain extent. By removing the protective film layer before providing the adapter board on the side of the first adhesive layer facing away from the first circuit board, it is possible to avoid the protective film layer interfering with or affecting the electrical connection performance of the first conductive medium.

[0048] In a possible implementation, a first adhesive layer is arranged between the lower surface of the adapter board and the upper surface of the first circuit board; at least one first through hole extending along the thickness direction of the first adhesive layer is arranged on the first adhesive layer, and a first conductive medium is arranged in the first through hole, including: a first adhesive layer is arranged on one surface of the adapter board; at least one first through hole extending along the thickness direction of the first adhesive layer is formed on the first adhesive layer, and a first conductive medium is arranged in the first through hole to form an adapter board assembly; a groove is arranged on one surface of the first circuit board; the adapter board assembly is arranged in the groove; wherein the first adhesive layer is in contact with the bottom wall of the groove, and the side of the adapter board facing away from the bottom wall of the groove is exposed.

[0049] By providing a first adhesive layer on one side of the adapter board, the stress generated by the first circuit board and the adapter board during the subsequent packaging process can be reduced to reduce the adverse effects on the structure of the first circuit board or the adapter board itself, thereby enhancing the deformation resistance between the first circuit board and the adapter board. The first conductive medium has a conductive function and can play a role in achieving electrical conduction between the first circuit board and the adapter board. In addition, by providing a groove on one side of the first circuit board and arranging the adapter board in the groove, the overall volume of the adapter board after being electrically connected to the first circuit board can be reduced, and the packaging integration of the first circuit board and the adapter board can be achieved, which helps to achieve the miniaturization of the packaging structure and reduce the occupied space of the board-level architecture. The adapter board is exposed on one side of the bottom wall away from the groove, which can facilitate the subsequent connection of the first device with the side of the adapter board away from the bottom wall of the groove, shortening the conduction path between the first device and the adapter board.

[0050] In a possible implementation, after the adapter board assembly is disposed in the groove, the method further includes: providing a second circuit board; disposing the second circuit board on a surface of the first circuit board where the groove is disposed, so that the second circuit board and the groove together form a accommodating cavity, and the adapter board is located in the accommodating cavity.

[0051] By arranging a second circuit board on a surface where a groove is provided in the first circuit board, the second circuit board and the groove together form an accommodating cavity, and the adapter board is arranged in the accommodating cavity, the surface flatness of the side of the first circuit board facing the first device can be further achieved. In addition, it helps to achieve layer addition along the thickness direction of the first circuit board, thereby helping to improve the layout density and space utilization of the entire first circuit board.

[0052] In a possible implementation, after setting the first adhesive layer on one side of the adapter plate, the method further includes: setting a protective film layer on a side of the first adhesive layer facing away from the adapter plate; and before setting the adapter plate assembly in the groove, the method further includes: removing the protective film layer.

[0053] By disposing a protective film layer on the side of the first adhesive layer facing away from the adapter plate, the first adhesive layer can be protected to a certain extent. By removing the protective film layer before disposing the adapter plate assembly in the groove, the protective film layer can be prevented from interfering with or affecting the electrical connection performance of the first conductive medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0055] Figure 2 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0056] Figure 3 A schematic diagram of the structure of a first circuit board and an adapter board in a board-level architecture provided in an embodiment of the present application;

[0057] Figure 4 A schematic diagram of the structure of a first circuit board and an adapter board in a board-level architecture provided in an embodiment of the present application;

[0058] Figure 5 A schematic diagram of the structure of a first circuit board and an adapter board in a board-level architecture provided in an embodiment of the present application;

[0059] Figure 6 A schematic diagram of the structure of a first circuit board and an adapter board in a board-level architecture provided in an embodiment of the present application;

[0060] Figure 7 A schematic diagram of the structure of a first circuit board and an adapter board in a board-level architecture provided in an embodiment of the present application;

[0061] Figure 8 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0062] Fig. 9 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0063] Fig.10 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0064] Fig.11 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0065] Fig.12 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0066] Fig.13 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0067] Fig.14 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0068] Fig.15A A schematic diagram of a structure in which an adhesive layer is provided on a first circuit board in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0069] Fig. 15B A schematic diagram of a structure in which a protective film layer is provided on an adhesive layer in a method for manufacturing a board-level structure provided in an embodiment of the present application;

[0070] Fig. 15CA schematic diagram of a structure in which through holes are provided on an adhesive layer and a protective film layer in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0071] Fig.15D A schematic diagram of a structure in which a first conductive medium is disposed in a through hole in a method for manufacturing a board-level structure provided in an embodiment of the present application;

[0072] Fig.15E A schematic diagram of a structure in which a transfer board is arranged on an adhesive layer in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0073] Fig.16 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0074] Fig.17 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0075] Fig.18A A schematic diagram of a structure in which an adhesive layer is provided on a transfer board in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0076] Fig.18B A schematic diagram of a structure in which a protective film layer is provided on an adhesive layer in a method for manufacturing a board-level structure provided in an embodiment of the present application;

[0077] Fig.18C A schematic diagram of a structure in which through holes are provided on an adhesive layer and a protective film layer in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0078] Fig.18D A schematic diagram of a structure in which a first conductive medium is disposed in a through hole in a method for manufacturing a board-level structure provided in an embodiment of the present application;

[0079] Fig.18E A schematic diagram of a structure in which a groove is provided on a first circuit board in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0080] Fig.18F A schematic diagram of a structure in which an adapter board assembly is disposed in a groove in a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0081] Fig.19 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0082] Fig. 20A A schematic structural diagram of a method for manufacturing a board-level structure provided in an embodiment of the present application, in which a third circuit board is disposed on a surface of the adapter board facing away from the first conductive medium;

[0083] Fig. 20BA schematic structural diagram of a method for manufacturing a board-level architecture provided in an embodiment of the present application, in which an opening is provided on a third circuit board and a conductive member is provided in the opening;

[0084] Fig.21 A schematic diagram of a process flow of a method for manufacturing a board-level architecture provided in an embodiment of the present application;

[0085] Fig. 22 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0086] Fig.23 A schematic diagram of the structure of a board-level architecture provided in an embodiment of the present application;

[0087] Fig.24 A schematic diagram of the structure of a packaging module provided in one embodiment of the present application;

[0088] Fig.25 A schematic diagram of the structure of a packaging module provided in one embodiment of the present application;

[0089] Fig.26 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application.

[0090] Description of reference numerals:

[0091] 100-board-level architecture; 10-first circuit board; 101-first conductive sheet;

[0092] 102-groove; 1021-bottom wall; 1022-side wall;

[0093] 1023-interval; 103-accommodating cavity; 20-adapter plate;

[0094] 201-second conductive sheet; 202-third conductive sheet; 30-system-level packaging module;

[0095] 301-first device; 3011-fourth conductive sheet; 302-third circuit board;

[0096] 3021 - fifth conductive sheet; 401 - first adhesive layer; 4011 - first through hole;

[0097] 402-first conductive medium; 403-third adhesive layer; 501-second adhesive layer;

[0098] 5011 - second through hole; 502 - second conductive medium; 60 - protective film layer;

[0099] 70-second circuit board; 701-opening; 702-conductive member;

[0100] 80-third conductive medium; 90-packaging layer; 110-packaging body;

[0101] 200-Electronic equipment. DETAILED DESCRIPTION

[0102] The terms used in the implementation method part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application. The implementation method of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0103] Printed circuit boards (PCB), also known as printed circuit boards, are providers of electrical connections for electronic components. Chips are the core part of electronic devices, and they have the functions of logic processing and controlling the normal operation of the whole machine. In electronic devices, the chip is mainly fixed on the printed circuit board in the form of a board-level structure to stabilize the conduction between the chip inside the board-level structure and the external circuit board. Flip Chip is both a chip interconnection technology and an ideal chip bonding technology. It has become a packaging form commonly used in the field of high-end devices and high-density packaging.

[0104] At present, in order to realize chip packaging, the chip is generally electrically connected to the printed circuit board. For example, in the related art, the printed circuit board and the chip are electrically connected by solder ball welding, and in order to meet the high-speed performance of signal transmission between the printed circuit board and the chip, it is generally achieved by increasing the size of the printed circuit board. However, a circuit board with too large a size is likely to exceed the capacity limit of solder ball welding, and the connection reliability between the printed circuit board and the chip is low.

[0105] Alternatively, a special high-speed printed circuit board is generally used. Specifically, the high-speed printed circuit board and the chip are electrically connected through solder balls, so that high-speed signals can pass smoothly between the high-speed printed circuit board and the chip. However, the cost of the high-speed printed circuit board is too high, and the connection reliability between the printed circuit board and the chip is still low.

[0106] Based on this, an embodiment of the present application provides a board-level architecture, by setting a first adhesive layer and at least one first conductive medium between the lower surface of the adapter board and the upper surface of the first circuit board, the first adhesive layer is used to bond the adapter board and the first circuit board to achieve a fixed connection between the adapter board and the first circuit board, and the at least one first conductive medium is used to electrically connect the adapter board and the first circuit board to achieve electrical conduction between the adapter board and the first circuit board. In this way, compared with the prior art, the high-temperature welding process is eliminated, and the problem of reduced connection reliability or even connection failure due to high-temperature welding between the first circuit board and the adapter board can be avoided. For example, the problem of solder ball welding between the adapter board and the first circuit board in the prior art that easily causes solder joint cracking can be avoided. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board and the adapter board, thereby improving the overall reliability of the board-level architecture.

[0107] The specific structure of the board-level architecture and the method for manufacturing the board-level architecture are described in detail below in conjunction with the accompanying drawings.

[0108] Reference Figure 1 and Figure 2 As shown, an embodiment of the present application provides a board-level architecture 100, which may include: a first circuit board 10, an adapter board 20 and at least one first device 301, wherein the adapter board 20 may be located between the upper surface of the first circuit board 10 and the lower surface of the at least one first device 301, and the upper surface of the adapter board 20 is electrically connected to the at least one first device 301.

[0109] It should be noted that, in the embodiment of the present application, the number of the first devices 301 may be one, two, three or more. For example, Figure 1 In the embodiment, there are two first devices 301. The first device 301 may be, for example, a chip, a capacitor, an inductor, or a resistor, etc., which is not limited in the embodiment of the present application and is not limited to the above examples.

[0110] The board-level architecture 100 provided in the embodiment of the present application may further include: a first adhesive layer 401 and at least one first conductive medium 402. Specifically, the first adhesive layer 401 and the at least one first conductive medium 402 are located between the lower surface of the adapter board 20 and the upper surface of the first circuit board 10. The first adhesive layer 401 is used to bond the adapter board 20 and the first circuit board 10, and the at least one first conductive medium 402 is used to electrically connect the adapter board 20 and the first circuit board 20.

[0111] The first adhesive layer 401 may be provided with at least one first through hole 4011 (see Fig. 15CAs shown), at least one first through hole 4011 extends along the thickness direction of the first adhesive layer 401, the first conductive medium 402 is located in the first through hole 4011, one end of the first conductive medium 402 is electrically connected to the first circuit board 10, and the other end of the first conductive medium 402 is electrically connected to the adapter board 20.

[0112] The first adhesive layer 401 can reduce the stress generated during the subsequent packaging process between the first circuit board 10 and the adapter board 20, which may have an adverse effect on the structure of the first circuit board 10 or the adapter board 20, thereby enhancing the anti-deformation ability between the first circuit board 10 and the adapter board 20. The first conductive medium 402 has a conductive function, and can achieve electrical conduction between the first circuit board 10 and the adapter board 20.

[0113] Specifically, in some embodiments, the first circuit board 10 has at least one first conductive sheet 101 on one side facing the adapter board 20, the adapter board 20 has at least one second conductive sheet 201 on one side facing the first circuit board 10, one end of the first conductive medium 402 is electrically connected to the first conductive sheet 101, and the other end of the first conductive medium 402 is electrically connected to the second conductive sheet 201. Exemplarily, the first conductive sheet 101 and the second conductive sheet 201 may be pads, that is, the first conductive sheet 101 may be a first pad, the second conductive sheet 201 may be a second pad, one end of the first conductive medium 402 is electrically connected to the first pad of the first circuit board 10, and the other end of the first conductive medium 402 is electrically connected to the second pad of the adapter board 20.

[0114] In some embodiments, the adapter board 20 and the first circuit board 10 may be electrically connected by pressing the first conductive medium 402 at a preset temperature.

[0115] As an optional implementation, the preset temperature may be less than or equal to 240 degrees Celsius. For example, the preset temperature may be any temperature such as 240 degrees Celsius, 230 degrees Celsius, 220 degrees Celsius, 210 degrees Celsius, 200 degrees Celsius or 190 degrees Celsius, and the present application embodiment does not limit this.

[0116] It should be noted here that the numerical values ​​and numerical ranges involved in this application are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors, which can be considered negligible by those skilled in the art.

[0117] In this way, when the adapter board 20 and the first circuit board 10 are pressed together at a preset temperature less than or equal to 240 degrees Celsius, the pressing temperature is relatively low, which can avoid the problem of reduced connection reliability or even connection failure between the first circuit board 10 and the adapter board 20 due to high-temperature welding, for example, it can avoid the problem of solder joint cracking caused by solder ball welding between the adapter board 20 and the first circuit board 10 in the prior art. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board 10 and the first device 301, thereby improving the overall reliability of the board-level architecture 100.

[0118] Specifically, in practical applications, the adapter plate 20 and the first circuit board 10 may be interconnected by low temperature sintering after being pressed together by the first conductive medium 402, wherein the temperature of the low temperature sintering may be less than or equal to 240 degrees Celsius. In this way, the large-sized adapter plate 20 and the first circuit board 10 may be interconnected, which may avoid or reduce the risk of cracking and warping caused by solder ball welding in the prior art.

[0119] That is to say, only an ordinary high-temperature pressing machine (maximum temperature is about 240°C) is needed to realize the integrated sintering interconnection between the adapter board 20 and the first circuit board 10, thereby avoiding the reliability problem of solder ball welding between the adapter board 20 and the first circuit board 10 in the prior art.

[0120] It should be noted that, in the embodiment of the present application, the size of the first conductive medium 402 may be 200-300um, specifically, the length of the first conductive medium 402 along the thickness direction of the first adhesive layer 401 may be 200-300um, and the length of the first conductive medium 402 along the thickness direction perpendicular to the first adhesive layer 401 may be 200-300um. When soldering with tin balls is used in the prior art, the size of the tin balls is generally 300-500um, so that, under the same conductivity, the smaller the size of the first conductive medium 402 is, the lower the resistivity of the first conductive medium 402 is, so that the first conductive medium 402 can support a larger through-current than the tin balls in the prior art.

[0121] The size of the adapter board 20 may be greater than or equal to 200*200 mm. For example, the size of the adapter board 20 may be 200*200 mm, 210*210 mm, 240*240 mm, or 230*230 mm, etc., to achieve higher density circuit performance.

[0122] In addition, the thickness of the adapter plate 20 may be greater than or equal to 0.4 mm. For example, the thickness of the adapter plate 20 may be 0.4 mm, 0.45 mm, 0.46 mm, or 0.47 mm, etc., which is not limited in the embodiments of the present application.

[0123] It is understood that in the embodiment of the present application, the first conductive medium 402 can be any one or more of other metal or non-metal system materials such as conductive silver paste, conductive copper paste or conductive carbon paste. The first adhesive layer 401 can be polypropylene or plastic.

[0124] In the embodiment of the present application, the number of the first devices 301 may be at least two, and the high-speed signal of one of the at least two first devices 301 may be transmitted to the other of the at least two first devices 301 through the adapter board 20. For example, Figure 1 In the embodiment, the number of the first devices 301 is two, and the high-speed signal of one of the two first devices 301 can be transmitted to the other of the two first devices 301 through the adapter board 20, and the high-speed signal of the other of the two first devices 301 can also be transmitted to one of the two first devices 301 through the adapter board 20.

[0125] In this way, high-speed signals are transmitted between each first device 301 through the adapter board 20. Compared with the prior art in which high-speed signals are transmitted between each first device 301 through the first circuit board 10, the transmission path of the high-speed signal is greatly reduced, thereby reducing the loss of the high-speed signal during the transmission process.

[0126] It should be noted that, in some embodiments, the transmission rate of the high-speed signal when passing through the adapter board 20 may be greater than or equal to 100 GHz. For example, the transmission rate of the high-speed signal when passing through the adapter board 20 may be 100 GHz, 110 GHz, 120 GHz, or 130 GHz, etc., which is not limited in the embodiments of the present application.

[0127] The adapter plate 20 may be an organic substrate or an inorganic substrate. For example, the material of the adapter plate 20 may be ceramic, glass, or silicon, etc., which is not limited in the embodiment of the present application.

[0128] In addition, it is easy to understand that the power signal of the first circuit board 10 can be transmitted to the first device 301 through the adapter board 20, and the transmission rate of the power signal when passing through the first circuit board 10 can be less than or equal to 10 GHz. For example, the transmission rate of the power signal when passing through the first circuit board 10 can be 10 GHz, 9 GHz, 8 GHz or 7 GHz, etc., which is not limited in the embodiment of the present application.

[0129] That is to say, the first circuit board 10 may be a common printed circuit board, and the first circuit board 10 may be, for example, an organic substrate that can carry high current transmission and low-speed signals.

[0130] The power signal is transmitted between the first device 301 and the first circuit board 10 via the adapter board 20, that is, the first circuit board 10 can power the first device 301. In addition, high-speed signals are transmitted between each first device 301 through the adapter board 20. In this way, the power signal is transmitted between the first device 301 and the first circuit board 10, and the high-speed signal is transmitted between each first device 301 and the adapter board 20. The adapter board 20 integrates the functions of high-speed signal and power integrity at the same time.

[0131] Moreover, the high-speed signal does not need to go through the first circuit board 10, but only needs to go through the adapter board 20 to transmit the signal, so that the power signal and the high-speed signal can be separated from each other, thereby avoiding unnecessary interference between the power signal and the high-speed signal. The power signal is separated from the high-speed signal, and the transmission path of the high-speed signal can be designed to be shorter, which is conducive to reducing loss and bandwidth, better meeting the power supply specification requirements of greater than or equal to 100G and 100A+, and reducing costs.

[0132] In the embodiment of the present application, the adapter board 20 may have at least one component (not shown in the figure) inside. By arranging at least one component inside the adapter board 20, the adapter board 20 can integrate more structures and functions to further improve performance.

[0133] Exemplarily, at least one component may be any one or more of a capacitor, a resistor, an inductor or a chip. In other words, the capacitor, the resistor, the inductor and the chip may be integrated in the adapter board 20 to ensure or improve the achievable functions of the adapter board 20.

[0134] In addition, if Figure 3 and Figure 4 As shown, in the embodiment of the present application, the adapter board 20 and the first circuit board 10 can be stacked. By stacking the adapter board 20 and the first circuit board 10, the process flow of the electrical connection between the adapter board 20 and the first circuit board 10 can be relatively simplified, and the process difficulty of the electrical connection between the adapter board 20 and the first circuit board 10 can also be reduced.

[0135] in, Figure 3 and Figure 4 The difference is, Figure 3 In the embodiment, the size of the adapter board 20 is smaller than that of the first circuit board 10. Figure 4 In the embodiment, the size of the adapter board 20 is the same as the size of the first circuit board 10. Of course, in some other embodiments, the size of the adapter board 20 may be larger than the size of the first circuit board 10, which is not limited in the embodiment of the present application.

[0136] Alternatively, at least a portion of the adapter board 20 may be located inside the first circuit board 10. Figures 5 to 7As shown, in the embodiment of the present application, the adapter board 20 may be located inside the first circuit board 10. By arranging the adapter board 20 inside the first circuit board 10, the overall volume of the adapter board 20 after being electrically connected to the first circuit board 10 can be reduced, thereby facilitating miniaturization of the packaging structure and reducing the occupied space of the board-level architecture 100. Moreover, at least a portion of the adapter board 20 is located inside the first circuit board 10, which can also reduce the impact on the back-end assembly and assembly.

[0137] Among them, Figure 5 and Figure 6 As shown, a groove 102 may be provided on the side of the first circuit board 10 facing the first device 301, and the adapter board 20 is located in the groove 102. By providing the groove 102 on the side of the first circuit board 10 facing the first device 301 and arranging the adapter board 20 in the groove 102, the overall volume of the adapter board 20 after being electrically connected to the first circuit board 10 can be reduced, thereby facilitating miniaturization of the packaging structure and reducing the occupied space of the board-level architecture 100.

[0138] Moreover, in a possible implementation, the side of the adapter board 20 away from the bottom wall 1021 of the groove 102 may be exposed. The side of the adapter board 20 away from the bottom wall 1021 of the groove 102 is exposed, which can facilitate the subsequent connection between the first device 301 and the side of the adapter board 20 away from the bottom wall 1021 of the groove 102, thereby shortening the conduction path between the first device 301 and the adapter board 20.

[0139] In addition, it is understandable that Figure 5 In the embodiment, there may be a gap 1023 between the end of the adapter plate 20 and the side wall 1022 of the groove 102, that is, the end of the adapter plate 20 and the side wall 1022 of the groove 102 may not be in direct contact. Figure 6 In the embodiment, the shape of the adapter plate 20 is matched with the shape of the groove 102 , that is, the adapter plate 20 can be just located in the groove 102 and fit with the inner wall of the groove 102 .

[0140] Continue to refer to Figure 5 or Figure 6 As shown, in the embodiment of the present application, the side of the first circuit board 10 provided with the groove 102 can be flush with the side of the adapter board 20 facing the first device 301. In this way, it can be ensured that the side of the first circuit board 10 facing the first device 301 is relatively flat, that is, the side of the adapter board 20 facing the first device 301 can be coplanar with the side of the first circuit board 10 facing the first device 301, so that three-dimensional assembly is not required, thereby reducing the difficulty of assembly when the back end is packaged with the first device 301 or when it is packaged with other external devices.

[0141] like Figure 7As shown, the board-level architecture 100 provided in the embodiment of the present application may also include: a second circuit board 70, wherein the second circuit board 70 is located on a surface of the first circuit board 10 where a groove 102 is provided, and the second circuit board 70 and the groove 102 are jointly arranged to form a receiving cavity 103, and the adapter board 20 is located in the receiving cavity 103.

[0142] By arranging the second circuit board 70 on the surface of the first circuit board 10 where the groove 102 is provided, the second circuit board 70 and the groove 102 together form a receiving cavity 103, and the adapter board 20 is arranged in the receiving cavity 103, the surface flatness of the side of the first circuit board 10 facing the first device 301 can be further achieved. In addition, it helps to achieve layer addition along the thickness direction of the first circuit board 10, thereby helping to improve the layout density and space utilization of the entire first circuit board 10.

[0143] It is understandable that in the embodiments of the present application, see Fig. 9 and Fig.10 As shown, the board-level architecture 100 may further include: a second adhesive layer 501 and at least one second conductive medium 502, wherein the second adhesive layer 501 and the at least one second conductive medium 502 are located between the upper surface of the adapter board 20 and the upper surface of the at least one first device 301. The second adhesive layer 501 is used to bond the adapter board 20 and the at least one first device 301, and the at least one second conductive medium 502 is used to electrically connect the adapter board 20 and the at least one first device 301.

[0144] The second adhesive layer 501 may be provided with at least one second through hole 5011 (see Fig. 9 As shown), at least one second through hole 5011 extends along the thickness direction of the second adhesive layer 501, the second conductive medium 502 is located in the second through hole 5011, one end of the second conductive medium 502 is electrically connected to the adapter board 20, and the other end of the second conductive medium 502 is electrically connected to the first device 30.

[0145] The second adhesive layer 501 can reduce the stress generated by the first device 301 and the adapter board 20 during the subsequent packaging process, which may have an adverse effect on the structure of the first device 301 or the adapter board 20, thereby enhancing the anti-deformation ability between the first device 301 and the adapter board 20. The second conductive medium 502 has a conductive function and can achieve electrical conduction between the first device 301 and the adapter board 20.

[0146] In the embodiment of the present application, the area on the second circuit board 70 opposite to the adapter board 20 (i.e., the side of the accommodating cavity 103 facing the first device 301) may be provided with at least one opening 701 extending along the thickness direction of the second circuit board 70. A conductive member 702 may be provided in the opening 701, one end of the conductive member 702 is electrically connected to the adapter board 20, and the other end of the conductive member 702 may be used to be electrically connected to the second conductive medium 502. In this way, the electrical connection between the adapter board 20 and the first device 301 can be achieved.

[0147] In addition, it should be noted that Figure 8 As shown, the adapter board 20 and the first device 301 can be integrated inside the first circuit board 10 at the same time, so that the integration of the board-level architecture 100 can be further improved. Specifically, the adapter board 20 and the first device 301 can be packaged first, and then the packaged adapter board 20 and the first device 301 are buried inside the first circuit board 10. This has the advantage that the surface can be wired and mounted with devices, forming a higher density structure.

[0148] For example, the adapter plate 20 and the first device 301 can be electrically connected by pressing the second conductive medium 502 at a preset temperature. Specifically, the adapter plate 20 and the first device 301 can be interconnected by pressing the second conductive medium 502 and then sintering at a low temperature (see Fig. 9 and Fig.10 shown).

[0149] As an optional implementation, the preset temperature may be less than or equal to 240 degrees Celsius. For example, the preset temperature may be any temperature such as 240 degrees Celsius, 230 degrees Celsius, 220 degrees Celsius, 210 degrees Celsius, 200 degrees Celsius or 190 degrees Celsius, and the present application embodiment does not limit this.

[0150] In this way, when the adapter board 20 and the first device 301 are pressed together through the second conductive medium 502 at a preset temperature less than or equal to 240 degrees Celsius, the pressing temperature is low, which can avoid the problem of reduced connection reliability or even connection failure between the first device 301 and the adapter board 20 due to high-temperature welding, thereby improving the connection reliability between the adapter board 20 and the first device 301, thereby improving the overall reliability of the board-level architecture 100.

[0151] It should be noted that, in the embodiment of the present application, the second conductive medium 502 can be any one or more of conductive silver paste, conductive copper paste or conductive carbon paste. The second adhesive layer 501 can be polypropylene or plastic.

[0152] Alternatively, in some other embodiments, the board-level architecture 100 may further include: at least one third conductive medium 80, and the adapter board 20 and the first device 301 may be connected via the third conductive medium 80 (see Figure 1 and Figure 2 Specifically, the adapter board 20 and the first device 301 can be interconnected by solder ball welding.

[0153] In addition, it can be understood that the specific assembly method between the adapter board 20 and the first device 301 can refer to the assembly method between the above-mentioned adapter board 20 and the first circuit board 10. Exemplarily, the adapter board 20 and the first device 301 can be stacked, or at least part of the first device 301 can be located inside the adapter board 20, or at least part of the adapter board 20 can be located inside the first device 301, and the embodiment of the present application is not limited to this.

[0154] In the embodiments of the present application, Figure 2 or Fig.10 As shown, the board-level architecture 100 may also include: a system-level packaging module 30, wherein the system-level packaging module 30 may include: a first device 301 and a third circuit board 302, wherein the first device 301 is electrically connected to the third circuit board 302, and the side of the third circuit board 302 facing away from the first device 301 is electrically connected to the adapter board 20.

[0155] In this way, the structural strength of the first device 301 can be improved, and scratches or damages caused when the first device 301 is directly electrically connected to the adapter board 20 can be avoided, which would adversely affect the performance of the first device 301.

[0156] In a possible implementation, the board-level architecture 100 may further include: a packaging layer 90, wherein Figure 1 As shown, the encapsulation layer 90 may be located on the side of the first device 301 facing away from the transfer board 20, that is, the encapsulation layer 90 may be located on the upper surface of the first device 301. Figure 2 As shown, the packaging layer 90 may be located on a side of the system-level packaging module 30 that is away from the adapter board 20, that is, the packaging layer 90 may be located on the upper surface of the system-level packaging module 30. Specifically, Figure 2 In the embodiment, the first device 301 is encapsulated inside the encapsulation layer 90 .

[0157] In addition, it can be understood that the adapter board 20 can have at least one third conductive sheet 202 on the side facing the at least one first device 301, and the at least one first device 301 can have at least one fourth conductive sheet 3011 on the side facing the adapter board 20, one end of the second conductive medium 502 is electrically connected to the third conductive sheet 202, and the other end of the second conductive medium 502 is electrically connected to the fourth conductive sheet 3011.

[0158] In some embodiments, the third conductive sheet 202 and the fourth conductive sheet 3011 may be pads, that is, the third conductive sheet 202 may be a third pad, and the fourth conductive sheet 3011 may be a fourth pad. Specifically, for example, one end of the second conductive medium 502 may be electrically connected to the third pad of the adapter board 20, and the other end of the second conductive medium 502 may be electrically connected to the fourth pad of the first device 301 (see Fig. 9 shown).

[0159] Alternatively, the third circuit board 302 may have at least one fifth conductive sheet 3021 on the side facing the adapter board 20, one end of the second conductive medium 502 is electrically connected to the third conductive sheet 202, and the other end of the second conductive medium 502 is electrically connected to the fifth conductive sheet 3021. The fifth conductive sheet 3021 may be, for example, a solder pad, that is, the fifth conductive sheet 3021 may be a fifth solder pad. Specifically, for example, one end of the second conductive medium 502 may be electrically connected to the third solder pad of the adapter board 20, and the other end of the second conductive medium 502 may be electrically connected to the fifth solder pad of the third circuit board 302 (see Fig.10 shown).

[0160] Based on the above embodiments, Fig.11 As shown, the embodiment of the present application further provides a method for manufacturing a board-level architecture 100, and the method for manufacturing the board-level architecture 100 may at least include:

[0161] S101 : Provide a first circuit board 10 , a transfer board 20 , and at least one first device 301 .

[0162] S102 : electrically connecting the upper surface of the adapter board 20 to the lower surface of at least one first device 301 .

[0163] S103: A first adhesive layer 401 is disposed between the lower surface of the adapter board 20 and the upper surface of the first circuit board 10 , at least one first through hole 4011 extending along the thickness direction of the first adhesive layer 401 is disposed on the first adhesive layer 401 , and a first conductive medium 402 is disposed in the first through hole 4011 .

[0164] It should be noted that S102 may be implemented before S103. Alternatively, in some embodiments, S102 may be implemented after S103. The embodiment of the present application does not limit the execution order of S102 and S103.

[0165] In this way, the problem of reduced connection reliability or even connection failure due to high temperature welding between the first circuit board 10 and the adapter board 20 can be avoided, for example, the problem of solder ball welding between the adapter board 20 and the first circuit board 10 in the prior art that easily leads to solder joint cracking can be avoided. Therefore, the embodiment of the present application can improve the connection reliability between the first circuit board 10 and the first device 301, thereby improving the overall reliability of the board-level architecture 100.

[0166] Specifically, Fig.12 As shown, in the embodiment of the present application, after S103, the manufacturing method may include:

[0167] S104: Pressing the lower surface of the adapter board 20 and the upper surface of the first circuit board 10 together through the first conductive medium 402 at a preset temperature to achieve electrical connection, wherein the preset temperature is less than or equal to 240 degrees Celsius.

[0168] The adapter board 20 and the first circuit board 10 are electrically connected by pressing together at a preset temperature less than or equal to 240 degrees Celsius through the first conductive medium 402. The pressing temperature is relatively low, which can avoid the problem of reduced connection reliability or even connection failure between the first circuit board 10 and the adapter board 20 due to high-temperature welding.

[0169] In the embodiment of the present application, S103 may include the following two possible implementations:

[0170] One possible implementation is: Fig.13 or Fig.14 As shown, S103 may include:

[0171] S1031A: Dispose a first adhesive layer 401 on one surface of the first circuit board 10 .

[0172] Specifically, Fig.15A As shown, a first adhesive layer 401 is provided on one side of the first circuit board 10 having the first conductive sheet 101 to form Fig.15A The structure shown in FIG. 4 , wherein the first adhesive layer 401 can be made of polypropylene or plastic.

[0173] It should be noted that in order to better achieve the approximate alignment relationship between the first adhesive layer 401 and the first circuit board 10, an alignment pattern can be etched on the first circuit board 10, and then the four corners of the first adhesive layer 401 can be ironed and fixed in position using an iron or other method.

[0174] In actual application scenarios, the pre-pressing between the first adhesive layer 401 and the first circuit board 10 can be achieved by using equipment such as a laminator or a vacuum fast press.

[0175] S1033A: at least one first through hole 4011 extending along the thickness direction of the first adhesive layer 401 is formed on the first adhesive layer 401 , and a first conductive medium 402 is disposed in the first through hole 4011 .

[0176] like Fig. 15C As shown, at least one first through hole 4011 is formed on the first adhesive layer 401 , and the first through hole 4011 divides the first adhesive layer 401 into a plurality of mutually separated structures. Fig.15D As shown, the first conductive medium 402 is disposed in the first through hole 4011 . Specifically, the first conductive medium 402 is in electrical contact with the first conductive sheet 101 of the first circuit board 10 .

[0177] It should be noted that at least one first through hole 4011 may be formed on the first adhesive layer 401 by laser drilling, and then the first conductive medium 402 may be printed into the hole pattern of the first through hole 4011 by printing technology. Specifically, the first conductive medium 402 may be printed into the laser-drilled first through hole 4011 by screen printing or steel screen printing, and then pre-baked to evaporate the solvent and maintain the shape of the first conductive medium 402.

[0178] S1035A: Dispose the adapter board 20 on the surface of the first adhesive layer 401 facing away from the first circuit board 10 .

[0179] Specifically, see Fig.15E As shown, the adapter board 20 is arranged on the side of the first adhesive layer 401 facing away from the first circuit board 10 , so that the adapter board 20 and the first circuit board 10 are electrically connected through the first conductive medium 402 .

[0180] Among them, the first adhesive layer 401 can reduce the stress generated by the first circuit board 10 and the adapter board 20 in the subsequent packaging process, which has an adverse effect on the structure of the first circuit board 10 or the adapter board 20, thereby enhancing the anti-deformation ability between the first circuit board 10 and the adapter board 20. The first conductive medium 402 has a conductive function and can play a role in achieving electrical conduction between the first circuit board 10 and the adapter board 20. In addition, by arranging the adapter board 20 on the side of the first adhesive layer 401 away from the first circuit board 10, the packaging integration of the first circuit board 10 and the adapter board 20 can be achieved.

[0181] In the embodiments of the present application, Fig.14 As shown, after S1031A, it may also include:

[0182] S1032A: Dispose a protective film layer 60 on a surface of the first adhesive layer 401 facing away from the first circuit board 10 .

[0183] Specifically, the protective film layer 60 may be made of polyethylene terephthalate (PET) or the like. By disposing the protective film layer 60 on the side of the first adhesive layer 401 facing away from the first circuit board 10 (see Fig. 15B As shown), it can play a certain protective role on the first adhesive layer 401.

[0184] After S1033A, it can also include:

[0185] S1034A: removing the protective film layer 60 .

[0186] After at least one first through hole 4011 is formed on the first adhesive layer 401 and the first conductive medium 402 is disposed in the first through hole 4011 , the protective film layer 60 is removed to prevent the protective film layer 60 from interfering with or affecting the electrical connection performance of the first conductive medium 402 .

[0187] In addition, it should be noted that when the other side of the adapter plate 20 is pressed and electrically connected to the first circuit board 10 at a preset temperature through the first conductive medium 402, the adapter plate 20, the pad plate and the structure formed after S203 can be first aligned and stacked using a pad (not shown in the figure) to ensure that the second conductive sheet 201 of the adapter plate 20 is aligned with the first conductive medium 402, and then the adapter plate 20 and the first circuit board 10 are pressed and sintered using a high-temperature vacuum laminator to form an integrated structure. The integrated structure can improve the ability to resist deformation caused by heat or external force, thereby reducing reliability risks.

[0188] It is understandable that the pad can be made of Teflon or phenolic resin board, etc., the main purpose of which is to make the relative areas of the adapter plate 20 and the first circuit board 10 consistent and the pressure uniform. In addition, in order to accurately align the adapter plate 20 and the first circuit board 10, positioning holes can be set on the four corners of the adapter plate 20 and the first circuit board 10, and the alignment can be achieved by positioning with round pins during lamination.

[0189] Another possible implementation is: Fig.16 or Fig.17 As shown, S103 may include:

[0190] S1031B: Dispose a first adhesive layer 401 on one surface of the adapter plate 20 .

[0191] Specifically, Fig.18AAs shown, a first adhesive layer 401 is disposed on one side of the adapter plate 20 having the second conductive sheet 201 to form Fig.18A The first adhesive layer 401 can reduce the stress generated by the first circuit board 10 and the adapter board 20 in the subsequent packaging process, which may have an adverse effect on the structure of the first circuit board 10 or the adapter board 20, thereby enhancing the anti-deformation ability between the first circuit board 10 and the adapter board 20.

[0192] The first adhesive layer 401 may be made of polypropylene or plastic.

[0193] In actual application scenarios, the pre-pressing between the first adhesive layer 401 and the adapter plate 20 can be achieved by using equipment such as a laminator or a vacuum fast press.

[0194] S1033B: at least one through hole 601 is formed on the first adhesive layer 401 , and a first conductive medium 402 is disposed in the through hole 601 to form a transfer board assembly.

[0195] like Fig.18C As shown, at least one first through hole 4011 extending along the thickness direction of the first adhesive layer 401 is formed on the first adhesive layer 401 , and the first through hole 4011 divides the first adhesive layer 401 into a plurality of mutually separated structures. Fig.18D As shown, the first conductive medium 402 is disposed in the first through hole 4011 . Specifically, the first conductive medium 402 is in electrical contact with the second conductive sheet 201 of the adapter board 20 .

[0196] It should be noted that at least one first through hole 4011 may be formed on the first adhesive layer 401 by laser drilling, and then the first conductive medium 402 may be printed into the hole pattern of the first through hole 4011 by printing technology. Specifically, the first conductive medium 402 may be printed into the laser-drilled first through hole 4011 by screen printing or steel screen printing, and then pre-baked to evaporate the solvent and maintain the shape of the first conductive medium 402.

[0197] S1035B: Set a groove 102 on one surface of the first circuit board 10 .

[0198] like Fig.18E As shown, a groove 102 is provided on one side of the first circuit board 10 .

[0199] S1036B: Set the adapter plate assembly in the groove 102 .

[0200] Among them, Fig.18F As shown, the first adhesive layer 401 is in contact with the bottom wall 1021 of the groove 102 , and the side of the adapter plate 20 facing away from the bottom wall 1021 of the groove 102 is exposed.

[0201] By providing a groove 102 on the side of the first circuit board 10 facing the first device 301 and disposing the adapter board 20 in the groove 102, the overall volume of the adapter board 20 after being electrically connected to the first circuit board 10 can be reduced, and the packaging integration of the first circuit board 10 and the adapter board 20 can be achieved, which helps to miniaturize the packaging structure and reduce the occupied space of the board-level architecture 100.

[0202] The side of the adapter board 20 away from the bottom wall 1021 of the groove 102 is exposed, which can facilitate the subsequent connection between the first device 301 and the side of the adapter board 20 away from the bottom wall 1021 of the groove 102, shortening the conduction path between the first device 301 and the adapter board 20.

[0203] It is understandable that in the embodiments of the present application, Fig.17 As shown, after S1031B, it may also include:

[0204] S1032B: Dispose a protective film layer 60 on the surface of the first adhesive layer 401 facing away from the adapter plate 20 .

[0205] By providing a protective film layer 60 (such as Fig.18B As shown), it can play a certain protective role on the first adhesive layer 401.

[0206] After S1033B, it can also include:

[0207] S1034B: removing the protective film layer 60 .

[0208] After at least one first through hole 4011 is formed on the first adhesive layer 401 and the first conductive medium 402 is disposed in the first through hole 4011 , the protective film layer 60 is removed to prevent the protective film layer 60 from interfering with or affecting the electrical connection performance of the first conductive medium 402 .

[0209] In addition, it should be noted that when the other side of the adapter board 20 is pressed and electrically connected to the first circuit board 10 at a preset temperature through the first conductive medium 402, the adapter board 20 and the first circuit board 10 can be aligned first to ensure that the second conductive sheet 201 of the adapter board 20 is aligned with the first conductive medium 402, and then the adapter board 20 and the first circuit board 10 are pressed and sintered using a high-temperature vacuum laminator to form an integrated structure. The integrated structure can improve the ability to resist deformation caused by heat or external force, thereby reducing reliability risks.

[0210] In addition, in order to accurately align the adapter plate 20 and the first circuit board 10, positioning holes can be respectively provided on the four corners of the adapter plate 20 and the first circuit board 10, and the alignment can be achieved by positioning with round pins during lamination.

[0211] In addition, in a possible implementation, Fig.19 As shown, after S1036B, it may also include:

[0212] S1037B: Provide a second circuit board 70.

[0213] S1038B: Arrange the second circuit board 70 on the side of the first circuit board 10 where the groove 102 is provided (i.e., the side of the adapter board 20 facing away from the bottom wall 1021 of the groove 102), so that the second circuit board 70 and the groove 102 surround and form a accommodating cavity 103, and the adapter board 20 is located in the accommodating cavity 103.

[0214] like Fig. 20A As shown, Fig. 20A It can be in Fig.18F On the basis of the above, a second circuit board 70 is arranged on a side of the adapter board 20 away from the bottom wall 1021 of the groove 102 , and the second circuit board 70 and the first circuit board 10 having the groove 102 are jointly arranged to form an accommodating cavity 103 for accommodating the adapter board 20 .

[0215] By arranging the second circuit board 70 on the surface of the first circuit board 10 where the groove 102 is provided, the second circuit board 70 and the groove 102 together form a receiving cavity 103, and the adapter board 20 is arranged in the receiving cavity 103, the surface flatness of the side of the first circuit board 10 facing the first device 301 can be further achieved. In addition, it helps to achieve layer addition along the thickness direction of the first circuit board 10, thereby helping to improve the layout density and space utilization of the entire first circuit board 10.

[0216] In addition, if Fig. 20B As shown, in the embodiment of the present application, at least one opening 701 may be provided on the side of the accommodating cavity 103 facing the first device 301 (i.e., on the second circuit board 70), and a conductive member 702 may be provided in the opening 701, one end of the conductive member 702 is electrically connected to the adapter board 20, and the other end of the conductive member 702 can be used to be electrically connected to the second conductive medium 502.

[0217] It is understandable that, in order to ensure the performance of the second circuit board 70 , an outer layer pattern may be formed on the side of the second circuit board 70 facing away from the first circuit board 10 .

[0218] It is understandable that the specific assembly method between the adapter board 20 and at least one first device 301 can refer to the assembly method between the adapter board 20 and the first circuit board 10. Exemplarily, the adapter board 20 and the first device 301 can be stacked, or at least part of the first device 301 can be located inside the adapter board 20, or at least part of the adapter board 20 can be located inside the first device 301, which is not limited in the embodiment of the present application.

[0219] In addition, in the embodiments of the present application, Fig.21 As shown, S101 may include:

[0220] S1011: Provide the adapter plate body.

[0221] S1012: Dispose at least one component in the adapter board body to form the adapter board 20.

[0222] By disposing at least one component in the adapter board body, the adapter board 20 can integrate more structures and functions to further improve the performance.

[0223] In addition, the embodiment of the present application also provides another board-level architecture 100, such as Fig. 22 or Fig.23 As shown, the board-level architecture 100 may include at least: a first circuit board 10, an adapter board 20 and at least one first device 301, wherein the adapter board 20 is located between the upper surface of the first circuit board 10 and the lower surface of the at least one first device 301, and the upper surface of the adapter board 20 is electrically connected to the at least one first device 301.

[0224] In the embodiment of the present application, the board-level architecture 100 may further include: at least one first conductive medium 402 and at least two third adhesive layers 403, wherein the at least one first conductive medium 402 and the at least two third adhesive layers 403 are located between the lower surface of the adapter board 20 and the upper surface of the first circuit board 10. At least one of the at least two third adhesive layers 403 is used to bond the adapter board 20 and the first conductive medium 402, and at least one of the at least two third adhesive layers 403 is used to bond the first circuit board 10 and the first conductive medium 402.

[0225] Specifically, Fig. 22 and Fig.23 As shown, the upper surface and the lower surface of each first conductive medium 402 are provided with a third adhesive layer 403. The third adhesive layer 403 located on the upper surface of the first conductive medium 402 is used to bond the transfer board 20 and the first conductive medium 402, and the third adhesive layer 403 located on the lower surface of the first conductive medium 402 is used to bond the first circuit board 10 and the first conductive medium 402.

[0226] In some embodiments, the first circuit board 10 has at least one first conductive sheet 101 on the side facing the adapter board 20, and the adapter board 20 has at least one second conductive sheet 201 on the side facing the first circuit board 10, and the first conductive medium 402 and the first conductive sheet 101 are electrically connected through the third adhesive layer 403, and the first conductive medium 402 and the second conductive sheet 201 are electrically connected through the third adhesive layer 403.

[0227] It should be noted that in the embodiment of the present application, the material used for the third adhesive layer 403 can be any adhesive layer with conductive function such as silicone, silver glue or solder paste, and the embodiment of the present application is not limited to this and is not limited to the above examples.

[0228] Based on the above embodiments, the present application also provides a packaging module. Fig.24 or Fig.25 As shown, the packaging module may at least include: a packaging body 110 and a board-level structure 100 as in any one of the above embodiments, and the board-level structure 100 is covered by the packaging body 110 .

[0229] Specifically, the package body 110 can be covered on the board-level architecture 100. For example, the package body 110 can be covered on the side of the first circuit board 10 facing the adapter board 20 and the first device 301, so as to cover the first adapter board 20 and the first device 301 in the space enclosed by the package body 110 and the first circuit board 10, thereby providing a certain degree of protection for the first adapter board 20 and the first device 301.

[0230] It is understandable that the packaging module may be a system in package (SIP) module or a package on package (POP) module, which is not limited in the embodiments of the present application.

[0231] In addition, if Fig.26 As shown, an embodiment of the present application further provides an electronic device 200 , which may include a packaging module having any one of the above board-level architectures 100 .

[0232] By setting the packaging module with the board-level architecture 100 in the electronic device 200, the reliability of the board-level architecture is better, so that the function of the electronic device 200 can be enhanced and the experience effect of the electronic device 200 can be optimized. At the same time, the stability of signal transmission in the electronic device 200 is also guaranteed, ensuring the normal operation of the electronic device 200.

[0233] It should be noted that the electronic device 200 provided in the embodiment of the present application may include but is not limited to mobile phones, tablet computers, laptop computers, ultra-mobile personal computers (ultra-mobile personal computers, referred to as UMPC), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (personal digital assistants, referred to as PDA), wearable devices, virtual reality devices and other mobile or fixed terminals with board-level architecture.

[0234] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0235] In the embodiments of the present application, the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0236] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "may include" and "have" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0237] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application are described in detail with reference to the above embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A board-level architecture, characterized in that: include: A first circuit board, a transfer board, and at least one first device; The adapter board is located between the upper surface of the first circuit board and the lower surface of the at least one first device, and the upper surface of the adapter board is electrically connected to the at least one first device; The device further comprises: a first adhesive layer and at least one first conductive medium; the first adhesive layer and the at least one first conductive medium are located between the lower surface of the adapter board and the upper surface of the first circuit board; the first adhesive layer is used to bond the adapter board and the first circuit board, and the at least one first conductive medium is used to electrically connect the adapter board and the first circuit board; The adapter board and the first circuit board are electrically connected by pressing the first conductive medium.

2. The board-level architecture according to claim 1, characterized in that: At least one first through hole is provided on the first adhesive layer, the at least one first through hole extends along the thickness direction of the first adhesive layer, and the first conductive medium is located in the first through hole; One end of the first conductive medium is electrically connected to the first circuit board, and the other end of the first conductive medium is electrically connected to the adapter board.

3. The board-level architecture according to claim 1 or 2, characterized in that: The first circuit board has at least one first conductive sheet on one side facing the adapter board, and the adapter board has at least one second conductive sheet on one side facing the first circuit board; One end of the first conductive medium is electrically connected to the first conductive sheet, and the other end of the first conductive medium is electrically connected to the second conductive sheet.

4. The board-level architecture according to any one of claims 1 to 3, characterized in that: The material used for the first adhesive layer is polypropylene or plastic.

5. The board-level architecture according to any one of claims 1 to 4, characterized in that: The length of the first conductive medium along the thickness direction of the first adhesive layer is 200-300 um; The length of the first conductive medium along a thickness direction perpendicular to the first adhesive layer is 200-300 um.

6. The board-level architecture according to any one of claims 1 to 5, characterized in that: The adapter board and the first circuit board are electrically connected by pressing the first conductive medium at a preset temperature; Wherein, the preset temperature is less than or equal to 240 degrees Celsius.

7. The board-level architecture according to any one of claims 1 to 6, characterized in that: Also includes: a second adhesive layer and at least one second conductive medium; The second adhesive layer and the at least one second conductive medium are located between the upper surface of the adapter plate and the upper surface of the at least one first device; The second adhesive layer is used to bond the adapter board and the at least one first device, and the at least one second conductive medium is used to electrically connect the adapter board and the at least one first device.

8. The board-level architecture according to claim 7, characterized in that: At least one second through hole is provided on the second adhesive layer; the at least one second through hole extends along the thickness direction of the second adhesive layer, and the second conductive medium is located in the second through hole; One end of the second conductive medium is electrically connected to the adapter board, and the other end of the second conductive medium is electrically connected to the first device.

9. The board-level architecture according to claim 8, characterized in that: The adapter board has at least one third conductive sheet on one side facing the at least one first device, and the at least one first device has at least one fourth conductive sheet on one side facing the adapter board; One end of the second conductive medium is electrically connected to the third conductive sheet, and the other end of the second conductive medium is electrically connected to the fourth conductive sheet.

10. The board-level architecture according to any one of claims 7 to 9, characterized in that: The adapter plate and the first device are electrically connected by pressing the second conductive medium at a preset temperature; Wherein, the preset temperature is less than or equal to 240 degrees Celsius.

11. The board-level architecture according to any one of claims 1 to 6, characterized in that: Also includes: At least one third conductive medium; the adapter board and the first device are electrically connected by welding the third conductive medium.

12. The board-level architecture according to any one of claims 7 to 11, characterized in that: The adapter board and the first circuit board are stacked.

13. The board-level architecture according to any one of claims 7 to 10, characterized in that: At least a portion of the adapter board is located inside the first circuit board.

14. The board-level architecture according to claim 13, characterized in that: A groove is provided on a side of the first circuit board facing the first component, and the adapter board is located in the groove.

15. The board-level architecture according to claim 14, characterized in that: A side of the first circuit board where the groove is provided is flush with a side of the adapter board facing the first device.

16. The board-level architecture according to claim 14 or 15, characterized in that: The side of the adapter plate facing away from the bottom wall of the groove is exposed.

17. The board-level architecture according to claim 14 or 15, characterized in that: Also includes: A second circuit board; the second circuit board is located on a side of the first circuit board where the groove is provided; The second circuit board and the groove are jointly arranged to form a receiving cavity, and the adapter board is located in the receiving cavity.

18. The board-level architecture according to claim 17, characterized in that: At least one opening extending along the thickness direction of the second circuit board is provided in an area of ​​the second circuit board opposite to the adapter board; A third conductive medium is disposed in the opening, one end of the third conductive medium is electrically connected to the adapter plate, and the other end of the third conductive medium is electrically connected to the second conductive medium.

19. The board-level architecture according to any one of claims 1-18, characterized in that: include: System-in-Package Module; The system-in-package module comprises: the first device and a third circuit board electrically connected to the first device; A side of the third circuit board facing away from the first component is electrically connected to the adapter board.

20. A board-level architecture, characterized in that: At least: A first circuit board, a transfer board, and at least one first device; The adapter board is located between the upper surface of the first circuit board and the lower surface of the at least one first device, and the upper surface of the adapter board is electrically connected to the at least one first device; Also included: at least one first conductive medium and at least two conductive third adhesive layers; The at least one first conductive medium and the at least two third adhesive layers are located between the lower surface of the adapter board and the upper surface of the first circuit board; At least one of the at least two third adhesive layers is used to bond the adapter board and the first conductive medium, and at least one of the at least two third adhesive layers is used to bond the first circuit board and the first conductive medium.

21. The board-level architecture according to claim 20, characterized in that: The first circuit board has at least one first conductive sheet on one side facing the adapter board, and the adapter board has at least one second conductive sheet on one side facing the first circuit board; The first conductive medium and the first conductive sheet are electrically connected, as well as the first conductive medium and the second conductive sheet are electrically connected via the third adhesive layer.

22. The board-level architecture according to claim 20 or 21, characterized in that: The material used for the third bonding layer is silicone, silver glue or solder paste.

23. A packaging module, characterized in that: include: A package and a board-level architecture as described in any one of claims 1 to 22, wherein the board-level architecture is enclosed by the package.

24. An electronic device, characterized in that: include: The packaging module as claimed in claim 23.

25. A method for manufacturing a board-level architecture, characterized in that: At least: Providing a first circuit board, a transfer board and at least one first device; electrically connecting the upper surface of the adapter plate to the lower surface of the at least one first device; A first adhesive layer is provided between the lower surface of the adapter board and the upper surface of the first circuit board, at least one first through hole extending along the thickness direction of the first adhesive layer is provided on the first adhesive layer, and a first conductive medium is provided in the first through hole; Wherein, a first adhesive layer is provided between the lower surface of the adapter board and the upper surface of the first circuit board, at least one first through hole extending along the thickness direction of the first adhesive layer is provided on the first adhesive layer, and after a first conductive medium is provided in the first through hole, the method comprises: The lower surface of the adapter board and the upper surface of the first circuit board are pressed together through the first conductive medium to achieve electrical connection.

26. The method for manufacturing a board-level architecture according to claim 25, characterized in that: Pressing the lower surface of the adapter board and the upper surface of the first circuit board at a preset temperature through the first conductive medium to achieve electrical connection; Wherein, the preset temperature is less than or equal to 240 degrees Celsius.

27. The method for manufacturing a board-level architecture according to claim 25 or 26, characterized in that: The first adhesive layer is provided between the lower surface of the adapter board and the upper surface of the first circuit board, the first adhesive layer is provided with at least one first through hole extending along the thickness direction of the first adhesive layer, and a first conductive medium is provided in the first through hole, including: Disposing a first adhesive layer on one surface of the first circuit board; At least one first through hole extending along the thickness direction of the first adhesive layer is provided on the first adhesive layer, and a first conductive medium is provided in the first through hole; The adapter plate is arranged on a surface of the first adhesive layer facing away from the first circuit board.

28. The method for manufacturing a board-level architecture according to claim 27, characterized in that: After the first adhesive layer is provided on one surface of the first circuit board, the method further includes: Disposing a protective film layer on a surface of the first adhesive layer facing away from the first circuit board; Before arranging the adapter plate on the surface of the first adhesive layer facing away from the first circuit board, the method further comprises: The protective film layer is removed.

29. The method for manufacturing a board-level architecture according to claim 25 or 26, characterized in that: The first adhesive layer is provided between the lower surface of the adapter board and the upper surface of the first circuit board, the first adhesive layer is provided with at least one first through hole extending along the thickness direction of the first adhesive layer, and a first conductive medium is provided in the first through hole, including: Disposing a first adhesive layer on one surface of the adapter plate; At least one first through hole extending along the thickness direction of the first adhesive layer is formed on the first adhesive layer, and a first conductive medium is disposed in the first through hole to form a transfer plate assembly; Disposing a groove on one side of the first circuit board; Disposing the adapter plate assembly in the groove; The first adhesive layer is in contact with the bottom wall of the groove, and the adapter plate is exposed on one side away from the bottom wall of the groove.

30. The method for manufacturing a board-level architecture according to claim 29, characterized in that: After the adapter plate assembly is arranged in the groove, the method further comprises: providing a second circuit board; The second circuit board is arranged on a surface of the first circuit board where the groove is arranged, so that the second circuit board and the groove together form a receiving cavity, and the adapter board is located in the receiving cavity.

31. The method for manufacturing a board-level architecture according to claim 29 or 30, characterized in that: After the first adhesive layer is provided on one surface of the adapter plate, the method further comprises: Disposing a protective film layer on a surface of the first adhesive layer facing away from the adapter plate; Before placing the adapter plate assembly in the groove, the method further includes: The protective film layer is removed.

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