Modular power supply production process

Abstract

The invention discloses a modular power supply production process which is characterized by comprising the following steps: S1, firstly, carrying out demand analysis on a modular power supply; s2, starting to design a circuit of the DC power supply module; s3, PCB design is carried out after the circuit design is completed; s4, after the PCB and the elements are prepared, the elements are installed and welded; s5, testing and debugging are carried out after element installation and welding are completed; and S6, the power module is packaged after being tested and debugged. Each module can be independently tested and optimized through modular design, the power supply design process is simplified, the power supply can be used only by selecting a proper module and matching with a small number of discrete components, the reliability of the whole system is improved, the performance and quality of products are improved, the production process is optimized, the production cost is reduced, and the power supply is suitable for large-scale popularization and application. Through the steps of the process method, high quality and high reliability of the modular power supply can be ensured, and the requirements of various application scenes are met.

Description

Technical Field

[0001] The present invention relates to the technical field of modular power supply production, and in particular to a modular power supply production process. Background Art

[0002] Switching mode power supply, also known as switching power supply or switching converter, is a high-frequency power conversion device and a type of power supply. Its function is to convert a voltage level into the voltage or current required by the user through different forms of architecture. The input of the switching power supply is mostly AC power (such as mains) or DC power, and the output is mostly equipment that requires DC power, such as personal computers, and the switching power supply is used to convert the voltage and current between the two.

[0003] The Chinese patent document with the authorization announcement number CN116191825B discloses a manufacturing control method, a modular power supply circuit and a device for a modular power supply circuit, and relates to the field of circuit manufacturing technology. Obtain the application environment requirements of the modular power supply circuit and the theoretical power consumption of each sub-module circuit in the modular power supply circuit. According to the application environment requirements of the modular power supply circuit and the theoretical power consumption of each sub-module circuit, generate an initial layout plan for the modular power supply circuit, perform a multi-dimensional verification on the initial layout plan, and determine the initial layout plan as the target layout plan when the initial layout plan passes the multi-dimensional verification. Install each sub-module circuit according to the target layout plan to generate a modular power supply circuit. In this application, the hidden risk of poor operation in manual operation can be eliminated to the maximum extent, which greatly reduces labor costs, improves the production and manufacturing efficiency of modular power supply circuits, reduces the failure of modular power supply circuits, and facilitates the handling and tracing of failures.

[0004] The production cost of the modular power supply in the above-mentioned prior art is relatively high, and interference is prone to occur between the modules, resulting in poor safety and stability of the power supply circuit. Therefore, it is necessary to develop a new modular power supply production process. Summary of the invention

[0005] The purpose of the present invention is to provide a modular power supply production process to solve the problems in the prior art proposed in the above background technology that the modular power supply production cost is high and interference between modules is prone to occur, resulting in poor safety and stability of the power supply circuit.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a modular power supply production process, comprising the following process steps: S1, firstly, it is necessary to conduct a demand analysis on the modular power supply to determine the output voltage, current requirements, and other special requirements, including input voltage range and efficiency requirements; S2, according to the results of the demand analysis, start to design the circuit of the DC power supply module, select appropriate components, including rectifiers, filters, and voltage regulators, and draw the corresponding circuit diagram; S3, after completing the circuit design, perform PCB design, including converting the circuit diagram into a PCB layout, arranging the position and connection method of the components, converting the circuit diagram into an actual PCB board, including copper plating, etching, forming Into wires and component pads; S4, PCB board and components will be prepared after the installation and welding of components, including the precise installation of components according to the PCB layout, and the use of welding technology to weld the components to the PCB board; S5, after the installation and welding of components are completed, testing and debugging are carried out, and specific test equipment and instruments are used to perform electrical and performance tests on the DC power module. The test content includes efficiency, stability and thermal performance to ensure that the DC power module meets the design requirements; S6, after the power module passes the test and debugging, it is packaged and a product label is affixed to indicate the product model and specification information. The packaged power module is finally inspected to ensure that all performance indicators meet the requirements.

[0007] Preferably, other special requirements in step S1 also include clarifying the application scenarios, performance requirements, size restrictions, and key parameters of the power module, including input voltage range, output voltage and accuracy, load current, standby power consumption, efficiency, temperature range, and cooling method.

[0008] Preferably, when designing the circuit of the DC power module in step S2, an efficient PWM or PFM controller and corresponding MOSFET or bipolar transistor are selected as switching elements, and appropriate input and output filters are designed to reduce electromagnetic interference and stabilize the output voltage.

[0009] Preferably, when designing the circuit of the DC power module in step S2, it also includes selecting suitable inductors and capacitors according to the required output ripple and response time, the saturation current of the inductor should be greater than the maximum output current, and designing a feedback loop to ensure the stability of the output voltage.

[0010] Preferably, the step S3 converts the circuit diagram into an actual PCB board, and also includes designing a heat dissipation mechanism, including a heat sink or a heat pipe, to ensure that the power module operates within an allowable temperature range; designing overcurrent, overvoltage, undervoltage and thermal protection circuit structures to ensure the safe operation of the power module under abnormal conditions; and minimizing parasitic inductance and capacitance, optimizing signal integrity and power efficiency, and placing key components close to the power pins.

[0011] Preferably, in step S4, the components are soldered together with the PCB board, the components are fixed on the PCB by reflow soldering or wave soldering, and the quality of the solder joints is checked to ensure that there are no cold solder joints or leaking solder joints.

[0012] Preferably, the step S4 further comprises installing the welded PCB into the housing and fixing the position, installing the input and output connectors, and performing glue filling treatment on the module to improve its heat dissipation performance and protection level.

[0013] Preferably, when designing the heat dissipation mechanism in step S3, a baffle is installed between the heat sink or the heat pipe, and the main control board is installed on the top surface of the baffle, the wiring frame is installed on the heat sink or the heat pipe, and the connecting wires between the rectifier bridge module, the IGBT module, the cast transformer, the MOS tube assembly and the main control board are embedded in the wiring frame to ensure that the electrical connection of the power module is stable and reliable.

[0014] Preferably, the test content in step S5 also includes placing the DC power supply module in a high temperature environment for aging test, testing the rate of change of the output voltage of the module when the input voltage changes, testing the voltage resistance and insulation performance of the module, and testing the operating performance of the module under high voltage no-load and low voltage current limiting states.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention adopts modular design so that each module can be independently tested and optimized, which simplifies the power supply design process. It only needs to select a suitable module and match it with a small number of discrete components for use, thereby improving the reliability of the overall system. It not only improves the performance and quality of the product, but also optimizes the production process and reduces production costs. Through the above-mentioned process methods and steps, the high quality and high reliability of the modular power supply can be ensured to meet the needs of various application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a flowchart of the overall process steps of the present invention. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0018] See also Figure 1, an embodiment provided by the present invention: a modular power supply production process, including the following process steps: S1, firstly, it is necessary to conduct a demand analysis on the modular power supply to determine the output voltage, current requirements, and other special requirements, including input voltage range and efficiency requirements; S2, according to the results of the demand analysis, start to design the circuit of the DC power supply module, select suitable components, including rectifiers, filters, and voltage regulators, and draw a corresponding circuit diagram; S3, after completing the circuit design, perform PCB design, including converting the circuit diagram into a PCB layout, arranging the position and connection method of the components, converting the circuit diagram into an actual PCB board, including copper plating and etching to form wires and component pads; S4. After the PCB board and components are ready, the components will be installed and welded, including accurately installing the components according to the PCB layout, and using the welding process to weld the components to the PCB board; S5. After the component installation and welding are completed, testing and debugging will be carried out. Use specific test equipment and instruments to perform electrical and performance tests on the DC power module. The test content includes efficiency, stability and thermal performance to ensure that the DC power module meets the design requirements; S6. After the power module passes the test and debugging, it will be packaged and a product label will be affixed to indicate the product model and specification information. The packaged power module will be finally inspected to ensure that all performance indicators meet the requirements.

[0019] Furthermore, other special requirements in step S1 also include clarifying the application scenarios, performance requirements, size restrictions, input voltage range, output voltage and accuracy, load current, standby power consumption, efficiency, temperature range, and key parameters of the cooling method of the power module. By clarifying the output voltage, current and other parameters, ensure that the power module matches the power requirements of the equipment to avoid equipment damage or unstable operation due to power mismatch. Selecting a power module with high stability and good regulation rate can ensure that the system can work stably under various load conditions. By clarifying the input voltage range, output voltage and accuracy and other parameters, you can choose a power module that adapts to a variety of application scenarios to increase the flexibility and applicability of the system.

[0020] Furthermore, when designing the circuit of the DC power module in step S2, an efficient PWM or PFM controller and corresponding MOSFET or bipolar transistor are selected as switching elements, appropriate input and output filters are designed to reduce electromagnetic interference and stabilize the output voltage, and the design requirements of the filter are determined according to the output parameters of the power module. The value of the inductor should be determined according to the output current and the required ripple suppression degree, and an inductor with low DCR (direct current resistance) is usually selected. The value of the output capacitor should be determined according to the ripple requirement of the output voltage, and an electrolytic capacitor or ceramic capacitor with low ESR (equivalent series resistance) is usually used. If it is necessary to further suppress common-mode interference, a suitable common-mode choke can be selected.

[0021] Furthermore, when designing the circuit of the DC power module in step S2, it also includes selecting suitable inductors and capacitors according to the required output ripple and response time, the saturation current of the inductor should be greater than the maximum output current, designing a feedback loop to ensure the stability of the output voltage, selecting a suitable operational amplifier, such as an operational amplifier with low offset voltage and high gain-bandwidth product, usually using an inverting or non-inverting amplifier configuration, using high-precision, low temperature coefficient resistors to form a voltage divider network to obtain a sampled value of the output voltage, determining the voltage divider ratio according to the output voltage and the reference voltage, and selecting a high-stability reference voltage source, such as a Zener diode with temperature compensation or a dedicated reference voltage IC.

[0022] Further, in step S3, the circuit diagram is converted into an actual PCB board, and the heat dissipation mechanism is also designed, including a heat sink or a heat pipe, to ensure that the power module operates within the allowable temperature range, and a suitable heat sink is selected according to the power consumption and thermal resistance of the power module to ensure that it can effectively dissipate heat, and the heat sink is reasonably arranged to ensure air circulation, improve heat dissipation efficiency, and disperse the layout of high-power consumption components to avoid local overheating; overcurrent, overvoltage, undervoltage and thermal protection circuit structures are designed to ensure the safe operation of the power module under abnormal conditions. When the current exceeds the rated value, the protection circuit automatically cuts off the power supply to prevent equipment damage. The current is converted into voltage through a current detection resistor, and a comparator is used to compare with a preset threshold. When the threshold is exceeded, a protection action is triggered. When the voltage exceeds the rated value, the protection circuit automatically reduces the voltage or cuts off the power supply. The voltage is detected through a voltage divider network, and a comparator is used to compare with a preset threshold. When the threshold is exceeded, a protection action is triggered. When the voltage is lower than the rated value, the protection circuit automatically Automatically cut off the power supply to prevent the device from working abnormally due to undervoltage. The voltage is detected through a voltage divider network and compared with the preset threshold by a comparator. When it is lower than the threshold, the protection action is triggered. When the temperature exceeds the set value, the protection circuit automatically reduces the power or cuts off the power supply to prevent the device from overheating and damage. A temperature sensor (such as a thermistor) is used to detect the temperature and compared with the preset threshold by a comparator. When the threshold is exceeded, the protection action is triggered. Overcurrent, overvoltage, undervoltage and thermal protection are implemented in one circuit to improve the overall safety of the system; to minimize parasitic inductance and capacitance, optimize signal integrity and power efficiency, and place key components close to the power pins. Placing components close to the power pins can reduce wiring impedance, thereby reducing voltage drop and current loss. Short-distance wiring can reduce inductance, which is especially important for high-frequency signals because inductance hinders rapid changes in signals. Placing key components such as MOSFETs and diodes close to the power pins can quickly respond to changes in power supply and improve the dynamic response capability of the system.

[0023] Furthermore, in step S4, the components are soldered together with the PCB board, and the components are fixed on the PCB by reflow soldering or wave soldering, and the quality of the solder joints is checked to ensure that there are no cold solder joints or leaking solder joints. A multimeter is used to test the connectivity of the solder joints to ensure that there are no open circuits or short circuits, thereby improving the reliability and service life of the product.

[0024] Furthermore, step S4 also includes placing the welded PCB into the housing and fixing the position, installing the input and output connectors, filling the module with glue, selecting a suitable epoxy resin according to the size of the power module and the heat dissipation requirements, using a solvent to clean the oil, dust and other impurities on the surface of the PCB to ensure that the potting glue can adhere well, shielding and protecting the parts that do not require potting, such as connectors, switches, etc., using vacuum equipment to remove bubbles during the mixing and potting process of the potting glue to ensure that the potting glue is bubble-free, setting a suitable curing temperature and time according to the type and curing characteristics of the potting glue to ensure that the potting glue is completely cured to achieve optimal performance, checking the quality of the potting glue after curing to ensure that there are no defects such as cracks and bubbles, and improving its heat dissipation performance and protection level.

[0025] Furthermore, when designing the heat dissipation mechanism in step S3, a baffle is installed between the heat sink or the heat pipe, and the main control board is installed on the top surface of the baffle, and the wiring frame is installed on the heat sink or the heat pipe. The wiring frame is in direct contact with the heat sink or the heat pipe, which can increase the heat conduction area and improve the heat conduction efficiency. The wiring frame on the heat sink or the heat pipe helps to improve air convection and accelerate heat dissipation. By installing the wiring frame on the heat sink, the radiation of high-frequency signals can be reduced and EMI can be reduced. Installing the wiring frame on the heat sink can enhance the structural stability of the entire power module and improve the vibration resistance. The connecting wires between the rectifier bridge module, the IGBT module, the cast transformer, the MOS tube assembly and the main control board are embedded in the wiring frame to ensure that the electrical connection of the power module is stable and reliable.

[0026] Furthermore, the test content in step S5 also includes placing the DC power module in a high temperature environment for aging test, performing a long-term aging test at 85°C or higher, simulating high temperature conditions in an industrial environment, and evaluating the stability and reliability of the product through test result analysis to ensure that the product can work stably for a long time in a high temperature environment. Through high temperature aging test, the manufacturer of the DC power module can ensure that its products can maintain good performance and reliability under various extreme conditions and provide users with high-quality products. The change rate of the output voltage of the test module when the input voltage changes, the withstand voltage and insulation performance of the test module, and the operating performance of the test module under high voltage no-load and low voltage current limiting conditions are tested. Under high voltage no-load conditions, verify whether the module can operate stably without abnormal phenomena, and connect the module to a high voltage power supply and a test instrument such as an oscilloscope. , multimeter, etc., gradually apply high voltage to the rated input voltage upper limit of the module, measure the module's output voltage, current, power consumption and other parameters, observe whether the module has abnormal heating, vibration or noise, etc., and verify whether the module can limit the current according to the design requirements under low-voltage current limiting conditions, protect the circuit and load, and ensure that the output current is stable without large fluctuations under current limiting conditions. Test a DC power supply module, high-voltage no-load test: when the input voltage is the rated upper limit of the module (such as 60V), perform a no-load test, and measure the output voltage and power consumption; low-voltage current limiting test: when the input voltage drops to the current limiting starting point of the module (such as 20V), perform a current limiting test, and measure the output current and voltage. Through these tests, it can be ensured that the operating performance of the power supply module under high-voltage no-load and low-voltage current limiting conditions meets the design requirements, thereby improving the reliability and stability of the product.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A modular power supply production process, characterized in that: The process comprises the following steps: S1. First, it is necessary to conduct a demand analysis on the modular power supply to determine the output voltage, current requirements, and other special requirements, including input voltage range and efficiency requirements; S2. Based on the results of the demand analysis, start designing the circuit of the DC power module, select appropriate components, including rectifiers, filters, and voltage regulators, and draw the corresponding circuit diagram; S3. After completing the circuit design, PCB design is performed, including converting the circuit diagram into a PCB layout, arranging the position and connection method of the components, and converting the circuit diagram into an actual PCB board, including copper plating and etching to form wires and component pads; S4, after the PCB board and components are prepared, the components will be installed and soldered, including accurately installing the components according to the PCB layout and soldering the components to the PCB board using a soldering process; S5. After the component installation and welding are completed, testing and debugging are carried out. Specific testing equipment and instruments are used to conduct electrical and performance tests on the DC power module. The test contents include efficiency, stability and thermal performance to ensure that the DC power module meets the design requirements; S6. After the power module has been tested and debugged, it is packaged and labeled with the product model and specification information. The packaged power module is finally inspected to ensure that all performance indicators meet the requirements.

2. A modular power supply production process according to claim 1, characterized in that: Other special requirements in step S1 include clarifying the application scenario, performance requirements, size restrictions, and key parameters of the power module, including input voltage range, output voltage and accuracy, load current, standby power consumption, efficiency, temperature range, and cooling method.

3. A modular power supply production process according to claim 1, characterized in that: When designing the circuit of the DC power module in step S2, an efficient PWM or PFM controller and corresponding MOSFET or bipolar transistor are selected as switch elements, and appropriate input and output filters are designed to reduce electromagnetic interference and stabilize the output voltage.

4. A modular power supply production process according to claim 3, characterized in that: When designing the circuit of the DC power module in step S2, it also includes selecting suitable inductors and capacitors according to the required output ripple and response time. The saturation current of the inductor should be greater than the maximum output current, and a feedback loop is designed to ensure the stability of the output voltage.

5. The modular power supply production process according to claim 1, characterized in that: The step S3 converts the circuit diagram into an actual PCB board, and also includes designing a heat dissipation mechanism, including a heat sink or a heat pipe, to ensure that the power module operates within an allowable temperature range; designing overcurrent, overvoltage, undervoltage and thermal protection circuit structures to ensure the safe operation of the power module under abnormal conditions; and minimizing parasitic inductance and capacitance, optimizing signal integrity and power efficiency, and placing key components close to the power pins.

6. The modular power supply production process according to claim 1, characterized in that: In step S4, the components are soldered together with the PCB board, the components are fixed on the PCB by reflow soldering or wave soldering, and the quality of the solder joints is checked to ensure that there are no cold solder joints or leaking solder joints.

7. A modular power supply production process according to claim 6, characterized in that: The step S4 also includes installing the welded PCB into the housing and fixing the position, installing the input and output connectors, and performing glue filling on the module to improve its heat dissipation performance and protection level.

8. A modular power supply production process according to claim 5, characterized in that: When designing the heat dissipation mechanism in step S3, a baffle is installed between the heat sink or the heat pipe, and the main control board is installed on the top surface of the baffle, the wiring frame is installed on the heat sink or the heat pipe, and the connecting wires between the rectifier bridge module, the IGBT module, the cast transformer, the MOS tube assembly and the main control board are embedded in the wiring frame to ensure that the electrical connection of the power module is stable and reliable.

9. The modular power supply production process according to claim 1, characterized in that: The test content in step S5 also includes placing the DC power supply module in a high temperature environment for aging test, testing the rate of change of the output voltage of the module when the input voltage changes, testing the voltage resistance and insulation performance of the module, and testing the operating performance of the module under high voltage no-load and low voltage current limiting conditions.

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