Automatic surface mounting equipment and method for pressure sensor processing

Abstract

The invention discloses an automatic surface mounting device and method for pressure sensor processing, and the device comprises a positive pressure processing structure and a cooperative production structure which is provided with the positive pressure processing structure in a limiting manner. The positive pressure treatment structure comprises a guide pipe, a communicating seat, a built-in seat frame, a rack, a butt joint channel pipe, a combined pipe, a first transmission control seat, an air supply pipe and a second transmission control seat, the side end of the guide pipe communicates with the communicating seat, the lower end of the communicating seat communicates with the combined pipe, and the lower end of the combined pipe communicates with the second transmission control seat; the side end of the second transmission control base communicates with the butt joint channel pipe, the lower end of the butt joint channel pipe communicates with the first transmission control base, the lower end of the first transmission control base communicates with the air supply pipe, and the lower portion of the center of the communication base is fixedly connected with the rack. According to the automatic surface mounting equipment and method for processing the pressure sensor, the purpose of producing and processing the pressure sensor is achieved through the arrangement of the positive pressure processing structure and the matched production structure.

Description

Technical Field

[0001] The present invention relates to the technical field of pressure sensor production equipment, and in particular to automatic chip placement equipment and method for pressure sensor processing. Background Art

[0002] The placement machine is placed after the dispensing machine or screen printer in the production line. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. In the production process of pressure sensors, the placement machine is required to process and produce PCB boards for streamlined processing.

[0003] According to Chinese patent publication number CN114425866A, an automatic patch production device for an intake air temperature pressure sensor is disclosed, which specifically relates to the technical field of automatic patch of pressure sensors, including a processing table, the upper surface of which is provided with a patch turntable, the lower surface of the inner wall of the patch turntable is provided with six fixed components, an annular pipe is provided above the patch turntable, and six connectors are fixedly connected to the outer surface of the annular pipe.

[0004] However, the current automatic chip placement equipment used in pressure sensor processing and the above-mentioned cases have the following problems: most traditional automatic chip placement equipment used in pressure sensor processing adopts a dust-free design, and is controlled by electronic control components during the production process. Most of the current automatic chip placement equipment adopts a single operating unit design, and the simultaneous operation of two sets of operating units accelerates the operating efficiency. At the same time, it can perform partitioned processing on the PCB board, thereby improving production efficiency and accuracy. Therefore, the existing equipment needs to be improved. Summary of the invention

[0005] The object of the present invention is to provide an automatic chip placement device and method for pressure sensor processing to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: an automatic chip placement device for pressure sensor processing, comprising a positive pressure processing structure and a matching production structure, wherein the matching production structure is provided with a positive pressure processing structure at an upper limit position; The positive pressure treatment structure includes a conduit, a connecting seat, a built-in seat frame, a frame, a docking channel tube, a combination tube, a first transmission control seat, an air supply tube, and a second transmission control seat. The side end of the conduit is connected to the connecting seat, the lower end of the connecting seat is connected to the combination tube, the lower end of the combination tube is connected to the second transmission control seat, the side end of the second transmission control seat is connected to the docking channel tube, the lower end of the docking channel tube is connected to the first transmission control seat, the lower end of the first transmission control seat is connected to the air supply tube, the lower center of the connecting seat is fixedly connected to the frame, and the upper center end of the frame is fixedly connected to the built-in seat frame; The matching production structure includes a first feeding component, a patch component, a second feeding component and a control conduction component. The first feeding component and the second feeding component have the same structure and are symmetrically arranged. The patch component is limitedly connected to the central upper end of the first feeding component and the second feeding component, and the control conduction component is limitedly connected to the central lower end of the first feeding component and the second feeding component. The patch component performs patch processing, and the control conduction component is used for the transmission of circuit boards. By installing a positive pressure processing structure, positive pressure processing can be performed to achieve the purpose of internal dust removal. The duct is connected with the external filter blower, and the airflow is conducted through the duct and the connecting seat and transmitted to the combined pipe. Then, it is conducted to the air supply pipe through the second transmission control seat and the first transmission control seat to perform positive pressure blowing at the outlet, the inlet and both ends of the transmission guide seat. At the same time, the first feeding component, the patch component, the second feeding component and the control conduction component are combined and arranged in the matching production structure. The first feeding component and the second feeding component have the same structure and are used for the transmission of accessories, and the equipment can be controlled at the same time.

[0007] Specifically, the first material feeding component includes a positioning plate, a manipulator, a stable base, a power seat and a transmission guide seat. The lower end of the manipulator is fixedly connected to the stable base. The center of the stable base is provided with a power seat. The power seat controls the operation of the transmission guide seat. The side end of the manipulator is fixedly connected to the positioning plate.

[0008] Specifically, the patch component includes a telescopic rod, a docking column, a first electrically-controlled hydraulic rod, a frame, a vertical frame, a docking protection guide rod, a top plate frame and a second electrically-controlled hydraulic rod. The first electrically-controlled hydraulic rod is installed on the docking column, and the lower end of the first electrically-controlled hydraulic rod controls the height adjustment of the frame through the telescopic rod. The rear end of the frame is fixedly connected to the vertical frame, and the vertical frame is fixedly connected to the docking protection guide rod. The second electrically-controlled hydraulic rod is installed on the docking protection guide rod, and the second electrically-controlled hydraulic rod is limited by the top plate frame. The second electrically-controlled hydraulic rod and the first electrically-controlled hydraulic rod synchronously control the frame to adjust its height.

[0009] Specifically, the patch component also includes a placement machine, a control cylinder, a limit track frame, a sliding adjustment block, a first optical sensor, a docking plate frame and a screw rod. The lower end of the frame is fixedly connected to the docking plate frame, and the docking plate frame is connected to a screw rod through a motor drive. The screw rod is threadedly connected to a sliding adjustment block, and the rear end of the sliding adjustment block is fixedly connected to the limit track frame. The limit position of the limit track frame is provided with a control cylinder, and the control cylinder controls the longitudinal telescopic adjustment of the placement machine. The first optical sensor is symmetrically installed on the lower end side of the placement machine.

[0010] Specifically, the control conduction component includes a discharge port, a guide belt, a PCB board, a limit mechanism and an inlet. The side end of the inlet is docked with the guide belt, and the side end of the guide belt is docked and connected with the discharge port. A limit mechanism is installed at the central lower end of the guide belt. The limit mechanism is used for limiting and fixing the transmitted PCB board, and the guide belt is used for transmission control of the PCB board.

[0011] Specifically, the limiting mechanism includes a limiting airbag, an air pump, a rotating adjustment rod, a power control seat, a docking transverse frame, a second optical sensor and a control processing seat. The second optical sensor is installed on the upper side of the control processing seat. The side end of the control processing seat is fixedly connected to the docking transverse frame. The upper end of the docking transverse frame is fixedly installed with a power control seat. The power control seat is driven by a rotating adjustment rod. The rotating adjustment rod is fixedly installed with an air pump. The air pump controls the inflation and deflation of the limiting airbag.

[0012] Specifically, the control processing seat is fixed on the fixed block at the lower end of the guide belt, the control conduction component is arranged at the lower end of the patch component, and the control conduction component is fixed to the rear end of the power seat on the first feed component and the second feed component, and the upper end of the docking column is fixedly connected to the frame.

[0013] Specifically, the top plate frame is fixed on the positioning plate, the transmission guide seat is used for the transmission of the installed accessories, and the placement machine can perform patch and welding processing.

[0014] Specifically, a motor is fixedly installed on the upper center end of the control processing seat, and the motor is driven and connected to an active gear disk, and a tooth plate is meshedly connected to the active gear disk. A supporting rail frame is provided at the lower end of the tooth plate, and the tooth plate slides on the supporting rail frame. The upper end of the tooth plate is meshedly connected to a gear shaft, and the air pump is installed and limited on the gear shaft.

[0015] A method for using an automatic chip placement device for processing a pressure sensor comprises the following steps: S1. First, the accessories are transmitted through the transmission guide seat, and the guide belt also works to drive the PCB board to be transmitted. The PCB board enters through the feed port and leaves through the discharge port. When it reaches the center position, the limit mechanism works at this time, and the second optical sensor in the limit mechanism senses, and then transmits the data to the control processing seat, controls the power control seat to drive, so that the rotating adjustment rod rotates and maintains a vertical state. At this time, the air pump works to inflate the limit airbag, so that the limit airbag expands, thereby flexibly limiting the PCB board; S2. After that, the user can control the device through the controller, the built-in seat frame and the frame are used for bearing work, and at the same time, the duct introduces the filtered gas, and the gas is transmitted to the connecting seat through the duct, and then transmitted through the combined pipe to the second transmission control seat, and then outputted through the first transmission control seat and the air supply pipe at positive pressure, so as to perform dust removal work; S3, then, the patch component also works, the second electric-controlled hydraulic rod and the first electric-controlled hydraulic rod in the patch component are telescopically controlled to change the position of the telescopic rod and the docking protection guide rod, and then the frame and the stand are adjusted. The lower end of the frame is fixed to the docking plate frame to achieve height control. After reaching the specified height, the motor built into the docking plate frame at the side end of the screw rod works to drive the screw rod to rotate, so that the sliding adjustment block is limited and slidable. The displacement of the sliding adjustment block drives the placement machine, the control cylinder, the limit track frame, and the first optical sensor to change their positions as a whole. At this time, the first optical sensor can analyze the equipment at the lower end; S4. After that, the longitudinal extension and retraction adjustment of the placement machine is controlled by controlling the air cylinder, and the micro height adjustment is performed inside the placement machine to obtain the accessories on the transmission guide seat. After that, the position of the placement machine is changed by controlling the extension and retraction control of the air cylinder, so that the placement machine reaches the specified position on the PCB board. At this time, the placement processing is performed to complete the processing work.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. By installing the positive pressure treatment structure, positive pressure treatment can be performed to achieve the purpose of internal dust removal. The duct is connected with the external filter blower, and the airflow is conducted through the duct and the connecting seat and transmitted to the combined pipe. Then, it is conducted to the air supply pipe through the second transmission control seat and the first transmission control seat to perform positive pressure blowing at the discharge port, the feed port and both ends of the transmission guide seat. At the same time, the first feeding component, the patch component, the second feeding component and the control conduction component are combined in the production structure. The first feeding component and the second feeding component have the same structure and are used for the transmission of accessories. At the same time, the equipment can be controlled.

[0017] Second, by installing the patch component, the second electrically controlled hydraulic rod and the first electrically controlled hydraulic rod in the patch component can operate synchronously to adjust the height, thereby changing the position of the telescopic rod and the docking protection guide rod to achieve the purpose of adjusting the frame position. At the same time, a motor is provided at the side end of the screw rod, and the motor can control the rotation of the screw rod. The rotation of the screw rod drives the sliding adjustment block to adjust the limit position, thereby changing the position of the placement machine, the control cylinder, the limit track frame, and the first optical sensor. At the same time, the first optical sensor analyzes the position of the lower PCB board and can also detect accessories, and then the placement machine can be controlled to work. At this time, the control cylinder can control the longitudinal adjustment of the placement machine, and the placement machine can perform a small range of height telescopic adjustment, which is convenient for alignment and facilitating the processing of the PCB board. At the same time, the PCB board is transported through the transmission of the guide belt to the center position. The second optical sensor can sense it, and the power control seat controls the rotation adjustment rod to rotate. At this time, the PCB board is limited, and the air pump works to inflate the limit airbag, so that the limit airbag expands, thereby facilitating flexible contact and better limiting the PCB board, which is convenient for patch processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the main body of the present invention from a front perspective; Figure 2 It is a schematic diagram of the three-dimensional structure of the main body of the present invention from a side perspective; Figure 3 It is a schematic diagram of the three-dimensional structure of the positive pressure treatment structure of the present invention from a front perspective; Figure 4 This is a disassembled diagram of the production structure of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the first feeding component of the present invention from a front perspective; Figure 6 It is a schematic diagram of the three-dimensional structure of the patch component of the present invention from the front perspective; Figure 7 This is a disassembled diagram of the patch component of the present invention; Figure 8 It is a schematic diagram of the front perspective three-dimensional structure of the control conduction component of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the limiting mechanism of the present invention from a front viewing angle; Fig.10 It is a schematic diagram of the front perspective stereoscopic structure of the second embodiment of the main body of the present invention.

[0019] In the figure: 1-positive pressure treatment structure; 2-cooperating production structure; 3-duct; 4-connecting seat; 5-built-in seat frame; 6-frame; 7-docking channel pipe; 8-combination pipe; 9-first transmission control seat; 10-air supply pipe; 11-second transmission control seat; 12-first material feeding component; 13-patch component; 14-second material feeding component; 15-positioning plate; 16-controller; 17-stable base; 18-power seat; 19-transmission guide seat; 20-telescopic rod; 21-docking column; 22-first electric-controlled hydraulic rod; 23-frame; 24-stand; 25-docking protection guide rod; 26-top plate frame; 27-first Two electrically controlled hydraulic rods; 28-mounting machine; 29-control cylinder; 30-limiting track frame; 31-sliding adjustment block; 32-first optical sensor; 33-docking plate frame; 34-screw rod; 35-discharging port; 36-guide belt; 37-PCB board; 38-limiting mechanism; 39-feeding port; 40-limiting airbag; 41-air pump; 42-rotating adjustment rod; 43-power control seat; 44-docking transverse frame; 45-second optical sensor; 46-control processing seat; 47-gear shaft; 48-gear plate; 49-support rail frame; 50-active gear disc; 51-motor; 52-control transmission component. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example 1

[0021] See also Figure 1-9 , the present invention provides a technical solution: an automatic chip placement device for pressure sensor processing, comprising a positive pressure processing structure 1 and a matching production structure 2, wherein the upper limit of the matching production structure 2 is equipped with the positive pressure processing structure 1; See also Figure 3 The positive pressure treatment structure 1 includes a conduit 3, a connecting seat 4, a built-in seat frame 5, a frame 6, a docking channel tube 7, a combination tube 8, a first transmission control seat 9, an air supply tube 10 and a second transmission control seat 11. The side end of the conduit 3 is connected to the connecting seat 4, the lower end of the connecting seat 4 is connected to the combination tube 8, the lower end of the combination tube 8 is connected to the second transmission control seat 11, the side end of the second transmission control seat 11 is connected to the docking channel tube 7, the lower end of the docking channel tube 7 is connected to the first transmission control seat 9, the lower end of the first transmission control seat 9 is connected to the air supply tube 10, the central lower part of the connecting seat 4 is fixedly connected to the frame 6, and the central upper end of the frame 6 is fixedly connected to the built-in seat frame 5; See also Figure 4The production structure 2 includes a first feed component 12, a patch component 13, a second feed component 14 and a control conduction component 52. The first feed component 12 and the second feed component 14 have the same structure and are symmetrically arranged. The patch component 13 is limitedly connected to the central upper end of the first feed component 12 and the second feed component 14, and the control conduction component 52 is limitedly connected to the central lower end of the first feed component 12 and the second feed component 14. The patch component 13 performs patch processing, and the control conduction component 52 is used for the transmission of circuit boards.

[0022] See also Figure 5 The first feeding component 12 includes a positioning plate 15, a manipulator 16, a stable base 17, a power seat 18 and a transmission guide seat 19. The lower end of the manipulator 16 is fixedly connected to the stable base 17. The center of the stable base 17 is provided with a power seat 18. The power seat 18 controls the operation of the transmission guide seat 19. The side end of the manipulator 16 is fixedly connected to the positioning plate 15.

[0023] See also Figure 6 The patch component 13 includes a telescopic rod 20, a docking column 21, a first electrically-controlled hydraulic rod 22, a frame 23, a vertical frame 24, a docking protection guide rod 25, a top plate frame 26 and a second electrically-controlled hydraulic rod 27. The first electrically-controlled hydraulic rod 22 is installed on the docking column 21. The lower end of the first electrically-controlled hydraulic rod 22 controls the height adjustment of the frame 23 through the telescopic rod 20. The rear end of the frame 23 is fixedly connected to the vertical frame 24, and the vertical frame 24 is fixedly connected to the docking protection guide rod 25. The second electrically-controlled hydraulic rod 27 is installed on the docking protection guide rod 25. The second electrically-controlled hydraulic rod 27 is limited by the top plate frame 26. The second electrically-controlled hydraulic rod 27 and the first electrically-controlled hydraulic rod 22 synchronously control the frame 23 to adjust its height.

[0024] See also Figure 7The patch component 13 also includes a placement machine 28, a control cylinder 29, a limit track frame 30, a sliding adjustment block 31, a first optical sensor 32, a docking plate frame 33 and a screw rod 34. The lower end of the frame 23 is fixedly connected to the docking plate frame 33, and the docking plate frame 33 is connected to the screw rod 34 through a motor drive. The screw rod 34 is threadedly connected to the sliding adjustment block 31. The rear end of the sliding adjustment block 31 is fixedly connected to the limit track frame 30. The upper limit of the limit track frame 30 is provided with a control cylinder 29. The control cylinder 29 controls the longitudinal telescopic adjustment of the placement machine 28. The first optical sensor 32 is symmetrically installed on the lower end side of the placement machine 28. The side end of the screw rod 34 is built into the docking plate frame The motor on 33 works, driving the screw rod 34 to rotate, so that the sliding adjustment block 31 is limited and slidably adjusted. The displacement of the sliding adjustment block 31 drives the placement machine 28, the control cylinder 29, the limit track frame 30, and the first optical sensor 32 to change their positions as a whole. At this time, the first optical sensor 32 can analyze the equipment at the lower end, and then control the placement machine 28 through the control cylinder 29 to control the longitudinal telescopic adjustment, and then perform micro-height adjustment in the placement machine 28 to obtain the accessories on the transmission guide seat 19. Then, the position of the placement machine 28 is changed by controlling the telescopic control of the control cylinder 29, so that the placement machine 28 reaches the specified position on the PCB board 37, and then the patch processing is performed.

[0025] See also Figure 8 The control conduction component 52 includes a discharge port 35, a guide belt 36, a PCB board 37, a limit mechanism 38 and an inlet 39. The side end of the inlet 39 is connected to the guide belt 36, and the side end of the guide belt 36 is connected to the discharge port 35. The limit mechanism 38 is installed at the central lower end of the guide belt 36. The limit mechanism 38 is used for limiting and fixing the transmitted PCB board 37. The guide belt 36 is used for the transmission control of the PCB board 37. The control of the equipment can be controlled by the manipulator 16. The built-in seat frame 5 and the frame 6 perform the bearing work. At the same time, the conduit 3 introduces the filtered gas, and the gas passes It is conducted to the connecting seat 4 through the duct 3, and then conducted to the second transmission control seat 11 through the combined pipe 8, and then output through the first transmission control seat 9 and the air supply pipe 10 at positive pressure, so as to perform dust removal. At this time, the patch component 13 also works, and the second electrically-controlled hydraulic rod 27 and the first electrically-controlled hydraulic rod 22 in the patch component 13 are telescopically controlled to change the position of the telescopic rod 20 and the docking protection guide rod 25, and then the position of the frame 23 and the stand 24 is adjusted, and the lower end of the frame 23 is fixed to the docking plate frame 33 to achieve height regulation to reach the specified height.

[0026] See also Fig. 9The limiting mechanism 38 includes a limiting airbag 40, an air pump 41, a rotating adjustment rod 42, a power control seat 43, a docking transverse frame 44, a second optical sensor 45 and a control processing seat 46. The upper end side of the control processing seat 46 is equipped with a second optical sensor 45. The side end of the control processing seat 46 is fixedly connected to the docking transverse frame 44. The upper end of the docking transverse frame 44 is fixedly equipped with a power control seat 43. The power control seat 43 is driven to be provided with a rotating adjustment rod 42. The rotating adjustment rod 42 is fixedly equipped with an air pump 41. The air pump 41 controls the inflation and deflation of the limiting airbag 40. The accessories are carried out through the transmission guide seat 19. The guide belt 36 also works to drive the PCB board 37 to be transmitted. The PCB board 37 enters through the feed port 39 and leaves through the discharge port 35. When it reaches the center position, the limiting mechanism 38 works at this time, and the second optical sensor 45 in the limiting mechanism 38 senses, and then transmits the data to the control processing seat 46, controls the power control seat 43 to drive, so that the rotating adjustment rod 42 rotates and maintains a vertical state. At this time, the air pump 41 works to inflate the limiting airbag 40, so that the limiting airbag 40 expands, thereby flexibly limiting the PCB board 37.

[0027] The control processing seat 46 is fixed on the fixed block at the lower end of the guide belt 36, the control conduction component 52 is arranged at the lower end of the patch component 13, and the control conduction component 52 is fixed to the rear end of the power seat 18 on the first feed component 12 and the second feed component 14, and the upper end of the docking column 21 is fixedly connected to the frame 6.

[0028] The top plate frame 26 is fixed on the positioning plate 15, the transmission guide seat 19 is used for the transmission of the installed accessories, and the placement machine 28 can perform patch and welding processing.

[0029] Working principle: When work is needed, the user combines the positive pressure processing structure 1 with the production structure 2 for operation, and at the same time transmits the accessories through the transmission guide seat 19, and the guide belt 36 also works to drive the PCB board 37 to be transmitted. The PCB board 37 enters through the inlet 39 and leaves through the outlet 35. When it reaches the center position, the limit mechanism 38 works at this time, and the second optical sensor 45 in the limit mechanism 38 senses, and then transmits the data to the control processing seat 46, controls the power control seat 43 to drive, so that the rotation adjustment The rod 42 rotates and maintains a vertical state. At this time, the air pump 41 works to inflate the limit airbag 40, so that the limit airbag 40 expands, thereby flexibly limiting the PCB board 37. Then the user can control the device through the manipulator 16, and the built-in seat frame 5 and the frame 6 perform the load-bearing work. At the same time, the conduit 3 introduces the filtered gas, and the gas is transmitted to the connecting seat 4 through the conduit 3, and then transmitted through the combined pipe 8 to the second transmission control seat 11, and then outputted through the first transmission control seat 9 and the air supply pipe 10 at a positive pressure, thereby During the dust removal work, the patch component 13 also works at this time. The second electrically-controlled hydraulic rod 27 and the first electrically-controlled hydraulic rod 22 in the patch component 13 are telescopically controlled to change the positions of the telescopic rod 20 and the docking protection guide rod 25. Then, the positions of the frame 23 and the stand 24 are adjusted. The lower end of the frame 23 is fixed to the docking plate frame 33 to achieve height regulation. After reaching the specified height, the motor built into the side end of the screw rod 34 on the docking plate frame 33 works to drive the screw rod 34 to rotate, so that the sliding adjustment block 31 is limited and slidable, and the sliding adjustment block 31 is adjusted. The displacement drives the placement machine 28, the control cylinder 29, the limit track frame 30, and the first optical sensor 32 to change their positions as a whole. At this time, the first optical sensor 32 can analyze the equipment at the lower end, and then the placement machine 28 is controlled by the control cylinder 29 to adjust its longitudinal extension and contraction, and then the placement machine 28 is micro-adjusted in height to obtain the accessories on the transmission guide seat 19. Then, the position of the placement machine 28 is changed by controlling the extension and contraction of the control cylinder 29, so that the placement machine 28 reaches the specified position on the PCB board 37, and then the patch processing is performed to complete the work. Example 2

[0030] On the basis of Example 1, Fig.10 As shown, a motor 51 is fixedly installed at the center upper end of the control processing seat 46, and the motor 51 is driven and connected to an active gear disc 50, and a tooth plate 48 is meshedly connected to the active gear disc 50. A supporting rail frame 49 is provided at the lower end of the tooth plate 48, and the tooth plate 48 slides on the supporting rail frame 49. The upper end of the tooth plate 48 is meshedly connected to a gear shaft 47, and the air pump 41 is installed and limited on the gear shaft 47.

[0031] When this embodiment is in use, the gear shaft 47 replaces the rotating adjustment rod 42. At this time, the motor 51 can drive the active gear plate 50 to rotate, so that the second optical sensor 45 can be adjusted in motion. When the second optical sensor 45 moves, it can drive the meshing gear shaft 47 to limit the rotation, so as to adjust to a suitable position, which is convenient for the subsequent processing of the limiting airbag 40 and the inflation pump 41. Through structural optimization, synchronous control can be performed so that the gear shafts 47 at both ends are upright at the same time, so as to better perform the limiting work of the PCB board 37.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic chip placement equipment for pressure sensor processing, characterized in that: It comprises a positive pressure treatment structure (1) and a matching production structure (2), wherein the matching production structure (2) is provided with a positive pressure treatment structure (1) installed at an upper limit position; The positive pressure treatment structure (1) comprises a conduit (3), a connecting seat (4), a built-in seat frame (5), a frame (6), a docking channel pipe (7), a combination pipe (8), a first transmission control seat (9), an air supply pipe (10) and a second transmission control seat (11); the side end of the conduit (3) is connected to the connecting seat (4); the lower end of the connecting seat (4) is connected to the combination pipe (8); the lower end of the combination pipe (8) is connected to the second transmission control seat (11); the side end of the second transmission control seat (11) is connected to the docking channel pipe (7); the lower end of the docking channel pipe (7) is connected to the first transmission control seat (9); the lower end of the first transmission control seat (9) is connected to the air supply pipe (10); the central lower part of the connecting seat (4) is fixedly connected to the frame (6); the central upper end of the frame (6) is fixedly connected to the built-in seat frame (5); The matching production structure (2) comprises a first material feeding component (12), a patch component (13), a second material feeding component (14) and a control conduction component (52); the first material feeding component (12) and the second material feeding component (14) have the same structure and are symmetrically arranged; the patch component (13) is position-limitedly connected to the central upper ends of the first material feeding component (12) and the second material feeding component (14); the control conduction component (52) is position-limitedly connected to the central lower ends of the first material feeding component (12) and the second material feeding component (14); the patch component (13) performs patch processing; and the control conduction component (52) is used for the transmission of circuit boards.

2. The automatic chip placement equipment for pressure sensor processing according to claim 1 is characterized in that: The first material feeding component (12) comprises a positioning plate (15), a manipulator (16), a stable base (17), a power base (18) and a transmission guide base (19); the lower end of the manipulator (16) is fixedly connected to the stable base (17); the center of the stable base (17) is provided with a power base (18); the power base (18) controls the operation of the transmission guide base (19); and the side end of the manipulator (16) is fixedly connected to the positioning plate (15).

3. The automatic chip placement equipment for pressure sensor processing according to claim 2 is characterized in that: The patch component (13) comprises a telescopic rod (20), a docking column (21), a first electrically controlled hydraulic rod (22), a frame (23), a stand (24), a docking protection guide rod (25), a top plate frame (26) and a second electrically controlled hydraulic rod (27); the docking column (21) is provided with a first electrically controlled hydraulic rod (22); the lower end of the first electrically controlled hydraulic rod (22) controls the height adjustment of the frame (23) through the telescopic rod (20); the rear end of the frame (23) is fixedly connected to the stand (24); the stand (24) is fixedly connected to the docking protection guide rod (25); the docking protection guide rod (25) is provided with a second electrically controlled hydraulic rod (27); the second electrically controlled hydraulic rod (27) is limited by the top plate frame (26); the second electrically controlled hydraulic rod (27) and the first electrically controlled hydraulic rod (22) synchronously control the frame (23) to adjust its height.

4. The automatic chip placement equipment for pressure sensor processing according to claim 3 is characterized in that: The patch component (13) further comprises a placement machine (28), a control cylinder (29), a limit track frame (30), a sliding adjustment block (31), a first optical sensor (32), a docking plate frame (33) and a screw rod (34); the lower end of the frame (23) is fixedly connected to the docking plate frame (33); the docking plate frame (33) is connected to a screw rod (34) through a motor drive; the screw rod (34) is threadedly connected to a sliding adjustment block (31); the rear end of the sliding adjustment block (31) is fixedly connected to the limit track frame (30); the upper limit of the limit track frame (30) is provided with a control cylinder (29); the control cylinder (29) controls the longitudinal telescopic adjustment of the placement machine (28); and the first optical sensor (32) is symmetrically mounted on the side of the lower end of the placement machine (28).

5. The automatic chip placement equipment for pressure sensor processing according to claim 4 is characterized in that: The control conduction component (52) comprises a discharge port (35), a guide belt (36), a PCB board (37), a limit mechanism (38) and an inlet (39); the side end of the inlet (39) is butt-jointed with the guide belt (36); the side end of the guide belt (36) is butt-jointed with the discharge port (35); the central lower end of the guide belt (36) is provided with a limit mechanism (38); the limit mechanism (38) is used for limiting and fixing the transmitted PCB board (37); and the guide belt (36) is used for transmission control of the PCB board (37).

6. The automatic chip placement equipment for pressure sensor processing according to claim 5, characterized in that: The limiting mechanism (38) comprises a limiting airbag (40), an air pump (41), a rotating adjustment rod (42), a power control seat (43), a docking transverse frame (44), a second optical sensor (45) and a control processing seat (46); the second optical sensor (45) is mounted on the side of the upper end of the control processing seat (46); the side end of the control processing seat (46) is fixedly connected to the docking transverse frame (44); the upper end of the docking transverse frame (44) is fixedly mounted with a power control seat (43); the power control seat (43) is driven to be provided with a rotating adjustment rod (42); the rotating adjustment rod (42) is fixedly mounted with an air pump (41); the air pump (41) controls the inflation and deflation of the limiting airbag (40).

7. The automatic chip placement equipment for pressure sensor processing according to claim 6 is characterized in that: The control processing seat (46) is fixed on a fixed block at the lower end of the guide belt (36), the control conduction component (52) is arranged at the lower end of the patch component (13), and the control conduction component (52) is fixedly arranged at the rear end of the power seat (18) on the first feeding component (12) and the second feeding component (14), and the upper end of the docking column (21) is fixedly connected to the frame (6).

8. The automatic chip placement equipment for pressure sensor processing according to claim 7 is characterized in that: The top plate frame (26) is fixed on the positioning plate (15), the transmission guide seat (19) is used for the transmission of the installed accessories, and the mounting machine (28) is capable of performing mounting and welding processing.

9. The automatic chip placement equipment for pressure sensor processing according to claim 8, characterized in that: A motor (51) is fixedly mounted on the central upper end of the control processing seat (46); the motor (51) is drivingly connected to a driving gear disc (50); a toothed plate (48) is meshingly connected to the driving gear disc (50); a supporting rail frame (49) is provided at the lower end of the toothed plate (48); the toothed plate (48) slides on the supporting rail frame (49); the upper end of the toothed plate (48) is meshingly connected to a gear shaft (47); and the air pump (41) is installed and limited on the gear shaft (47).

10. A method for using an automatic chip placement device for processing a pressure sensor, using the automatic chip placement device for processing a pressure sensor according to claim 8, characterized in that: The following steps are involved: S1. First, the accessories are transmitted through the transmission guide seat (19), and the guide belt (36) also works to drive the PCB board (37) to be transmitted. The PCB board (37) enters through the feed port (39) and leaves through the discharge port (35). When the PCB board (37) reaches the center position, the limiting mechanism (38) works at this time, and the second optical sensor (45) in the limiting mechanism (38) senses, and then transmits the data to the control processing seat (46), and controls the power control seat (43) to drive, so that the rotating adjustment rod (42) rotates and maintains a vertical state. At this time, the air pump (41) works to inflate the limiting airbag (40), so that the limiting airbag (40) expands, thereby flexibly limiting the PCB board (37); S2. Afterwards, the user can control the device through the controller (16), the built-in seat frame (5) and the frame (6) perform the load-bearing work, and at the same time, the duct (3) introduces the filtered gas, and the gas is transmitted to the connecting seat (4) through the duct (3), and then transmitted through the combined pipe (8) to the second transmission control seat (11), and then positively pressure output is output through the first transmission control seat (9) and the air supply pipe (10), thereby performing the dust removal work; S3, then, the patch component (13) also works, the second electrically controlled hydraulic rod (27) and the first electrically controlled hydraulic rod (22) in the patch component (13) are telescopically controlled to change the positions of the telescopic rod (20) and the docking protection guide rod (25), and then the positions of the frame (23) and the stand (24) are adjusted, the lower end of the frame (23) is fixed to the docking plate frame (33) to achieve height control, and after reaching the specified height, the motor built into the docking plate frame (33) at the side end of the screw rod (34) works to drive the screw rod (34) to rotate, so that the sliding adjustment block (31) is limited and slidably adjusted, and the displacement of the sliding adjustment block (31) drives the placement machine (28), the control cylinder (29), the limit track frame (30), and the first optical sensor (32) to change their positions as a whole, and the first optical sensor (32) can analyze the equipment at the lower end; S4. After that, the placement machine (28) is longitudinally telescopically adjusted by controlling the air cylinder (29), and micro-height adjustment is performed inside the placement machine (28), so as to obtain the accessories on the transmission guide seat (19). After that, the position of the placement machine (28) is changed by controlling the telescopic control of the air cylinder (29), so that the placement machine (28) reaches the specified position on the PCB board (37), and then the placement processing is performed to complete the processing work.

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