Optical module

Abstract

The optical module provided by the invention comprises a circuit board, a light source and an optical modulation chip, the optical modulation chip is electrically connected with the circuit board, the optical modulation chip comprises an optical modulator, and the optical modulator is configured to modulate direct-current light without carrying data into an optical signal; the light modulator comprises two interference arms; the optical power detection assembly is at least arranged on the light emitting sides of the two interference arms and obtains detection voltage; the MCU is electrically connected with the circuit board, and the MCU is configured to adjust the detection voltage to a preset voltage. The optical power of the optical modulator is adjusted through the heater or the phase converter, and the power consumption of the optical module is reduced.

Description

optical modules

[0001] This application claims priority to application number 202211555988.9 filed with the China Patent Office on December 6, 2022; priority to application number 202310695911.X filed with the China Patent Office on June 12, 2023; and priority to application number 202310861903.8 filed with the China Patent Office on July 13, 2023; all contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising:

[0006] circuit boards;

[0007] a light source electrically connected to the circuit board, the light source being configured to emit direct current light that does not carry data;

[0008] an optical modulation chip electrically connected to the circuit board, the optical modulation chip comprising an optical modulator configured to modulate the direct current light not carrying data into an optical signal; the optical modulator comprising two interference arms;

[0009] An optical power detection component is provided at least on the light-emitting side of the two interferometer arms and obtains a detection voltage;

[0010] an MCU electrically connected to the circuit board, wherein the MCU is configured to adjust the detection voltage to a preset voltage;

[0011] The method of adjusting the detection voltage to the preset voltage includes: a heater is provided on the two interference arms, and the heater is configured to change the refractive index of the interference arm; the MCU outputs a driving voltage to the heater, and the MCU is configured to receive the detection voltage and output a driving voltage to the heater when the detection voltage is not equal to a first preset voltage, and the preset voltage is equal to the first preset voltage;

[0012] or,

[0013] The method of adjusting the detection voltage to the preset voltage includes: the optical modulator includes a phase converter; the MCU is configured to receive a test voltage corresponding to the detection voltage, and when the test voltage is not equal to a second preset voltage, adjust the bias voltage provided to the phase converter, and the preset voltage corresponds to the second preset voltage. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0016] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0017] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0018] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0019] FIG5 is a diagram showing the internal structure of an optical module according to some embodiments of the present disclosure;

[0020] FIG6 is a structural diagram of an optical module provided by some embodiments of the present disclosure without a housing and an unlocking component;

[0021] FIG7 is a structural diagram of a fiber optic adapter, a local oscillator optical component, a coherent optical component, and a circuit board in an optical module according to some embodiments of the present disclosure;

[0022] FIG8 is a first structural diagram of an electro-optical modulator in an optical module according to some embodiments of the present disclosure;

[0023] FIG9 is a signal diagram of an electro-optical modulator in an optical module according to some embodiments of the present disclosure;

[0024] FIG10 is a structural block diagram of an optical module provided according to some embodiments of the present disclosure;

[0025] FIG11 is a second structural diagram of an electro-optical modulator in an optical module according to some embodiments of the present disclosure;

[0026] FIG12 is a structural diagram of a first optical power detection component in an optical module according to some embodiments of the present disclosure;

[0027] FIG13 is a third structural diagram of an electro-optical modulator in an optical module according to some embodiments of the present disclosure;

[0028] FIG14 is a diagram showing the internal structure of another optical module according to some embodiments of the present disclosure;

[0029] FIG15 is a structural diagram of an optical modulation chip in another optical module according to some embodiments of the present disclosure;

[0030] FIG16 is a structural diagram of a first optical power detection component in another optical module according to some embodiments of the present disclosure;

[0031] FIG17 is a structural diagram of a second optical power detection component in another optical module according to some embodiments of the present disclosure;

[0032] FIG18 is a structural diagram of a comparison circuit in another optical module according to some embodiments of the present disclosure;

[0033] FIG19 is a schematic diagram of interaction between an MCU and a phase converter in another optical module according to some embodiments of the present disclosure;

[0034] FIG20 is a structural block diagram 1 of a circuit board in another optical module according to some embodiments of the present disclosure;

[0035] FIG21 is a second structural block diagram of a circuit board in another optical module according to some embodiments of the present disclosure;

[0036] FIG22 is a third structural block diagram of a circuit board in another optical module according to some embodiments of the present disclosure;

[0037] FIG23 is a fourth structural block diagram of a circuit board in another optical module provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0039] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0040] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0041] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0042] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0043] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0044] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0045] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0046] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0047] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0048] FIG1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in FIG1 , the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0049] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0050] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0051] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0052] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote server 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0053] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0054] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0055] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0056] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, an optical modulation chip 900a, a light source 900b, etc., but the present disclosure is not limited thereto.

[0057] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0058] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0059] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0060] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the left end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the right end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger 301 of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, configured to receive an external optical fiber 101, so that the optical fiber 101 can connect to the optical modulation chip 900a and light source 900b in the optical module 200.

[0061] The combined assembly of the upper and lower housings 201 and 202 facilitates installation of the circuit board 300, optical modulation chip 900a, and light source 900b within the housing, with the upper and lower housings 201 and 202 providing encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, optical modulation chip 900a, and light source 900b, the combined assembly of the upper and lower housings 201 and 202 facilitates the placement of positioning components, heat dissipation components, and electromagnetic shielding components for these components, facilitating automated production.

[0062] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0063] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0064] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0065] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0066] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0067] The circuit board 300 also includes a gold finger 301 formed on its end surface, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0068] FIG5 is a diagram illustrating the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in FIG5 , the optical modulation chip 900a does not have its own light source, so a light source 900b is selected as an external light source for the optical modulation chip 900a. The light source 900b can be a laser box, which contains a laser chip. The laser chip emits light to generate a laser beam. The light source 900b is used to provide the emitted laser light to the optical modulation chip 900a. Laser light has excellent single-wavelength characteristics and excellent wavelength tuning characteristics, making it the preferred light source for optical modules and even optical fiber transmission. Other types of light, such as LED light, are generally not used in common optical communication systems. Even if such light sources are used in special optical communication systems, the characteristics of the light source and the chip components are significantly different from those of lasers. This results in significant technical differences between optical modules using lasers and optical modules using other light sources. Those skilled in the art generally do not believe that these two types of optical modules can provide technical inspiration for each other.

[0069] The bottom surface of the optical modulator chip 900a and the bottom surface of the light source 900b are respectively arranged on the substrate. There is an optical connection between the optical modulator chip 900a and the light source 900b. The optical path is very sensitive to the positional relationship between the optical modulator chip and the light source. Materials with different expansion coefficients lead to different degrees of formation, which is not conducive to the realization of the preset optical path.

[0070] In the disclosed embodiment, the light modulation chip 900a and the light source 900b are disposed on the same substrate. Deformation of the substrate, made of the same material, will affect the positions of the light modulation chip 900a and the light source 900b equally, thus avoiding significant changes in their relative positions. In some embodiments, it is preferred that the expansion coefficient of the substrate material be similar to that of the light modulation chip 900a and / or the light source 900b.

[0071] In some embodiments, the optical modulation chip 900a can be formed as a silicon photonic chip or a thin-film lithium niobate chip. Exemplarily, the optical modulation chip 900a is a thin-film lithium niobate chip. The thin-film lithium niobate chip includes a substrate and an optical modulation thin-film layer located on the surface of the substrate. The optical modulation thin-film layer has an input optical waveguide, a Mach Zehnder modulator (MZM modulator), and an output optical waveguide. The substrate is a glass substrate, and the optical modulation thin-film layer can be a lithium niobate thin film, which is laid on the substrate. The thickness of the lithium niobate thin film is less than 100 μm.

[0072] Thin-film lithium niobate chips are relatively small and have high integration precision. Compared with silicon photonic chips, thin-film lithium niobate chips have advantages such as low power consumption and low optical loss. The optical loss of silicon photonic chips is less than 11.2dB, while the optical loss of thin-film lithium niobate chips is less than 10dB.

[0073] The light source 900b provides light to the optical modulation chip 900a, such as a thin-film lithium niobate chip, which is a single-wavelength, stable-power emission light that does not carry any signal. The thin-film lithium niobate chip modulates the emission light to load data into the emission light to obtain a modulated light signal.

[0074] In some embodiments, light modulation chip 900a, such as a thin-film lithium niobate chip, receives light emitted from light source 900b on its side. Modulation of the emitted light is performed by the thin-film lithium niobate chip. The surface of the thin-film lithium niobate chip is provided with pads for electrical connection to circuit board 300. Thus, circuit board 300 provides the thin-film lithium niobate chip with a data signal from a host computer. The thin-film lithium niobate chip modulates the data signal into the emitted light, generating a modulated light signal, which is then transmitted to the host computer.

[0075] Figure 6 is a structural diagram of an optical module provided according to some embodiments of the present disclosure without the shell and unlocking components; Figure 7 is a structural diagram of the optical fiber adapter, local oscillator optical component, coherent optical component and circuit board in an optical module provided according to some embodiments of the present disclosure.

[0076] As shown in Figures 6 and 7 , a light source (referred to as a local oscillator optical component 401 in this example) is connected to circuit board 300 and is used to emit a light beam of a preset specific wavelength. Specifically, local oscillator optical component 401 includes a semiconductor gain chip and a silicon photonics chip. The semiconductor gain chip emits a light beam within a wavelength range, while the silicon photonics chip selects a light beam of a specific wavelength from the light beam within the wavelength range. The specific wavelength light beam reflects back and forth between the silicon photonics chip and the semiconductor gain chip, forming a resonant cavity with the silicon photonics chip and the semiconductor gain chip, achieving stable output of the specific wavelength light beam.

[0077] The optical module further includes a transmitting optical fiber adapter 800 and a receiving optical fiber adapter 801. The transmitting optical fiber adapter 800 is used to transmit high-speed optical signals, and the receiving optical fiber adapter 801 is used to receive high-speed optical signals.

[0078] The optical modulation chip (referred to as the coherent optical component 500 in this example) is placed on the circuit board and is used to achieve high-speed optical-to-electrical signal conversion. Specifically, the coherent optical component 500 includes an optical transmission interface, an optical reception interface, and a local oscillator optical interface. The optical transmission interface extends a first optical fiber, the optical reception interface extends a second optical fiber, and the local oscillator optical interface extends a third optical fiber. The optical transmission interface is connected to the transmission fiber adapter 800, the optical reception interface is connected to the reception fiber adapter 801, and the local oscillator optical interface is connected to the local oscillator optical component 401. The coherent optical component is connected to the transmission fiber adapter, the reception fiber adapter, and the local oscillator optical component 401 via the optical transmission interface, the optical reception interface, and the local oscillator optical interface, respectively. The coherent optical component 500 is also connected to the DSP chip 600.

[0079] The narrow-linewidth, high-power laser light emitted by the local oscillator optical component 401 is input into the coherent optical component 500 through the local oscillator optical interface. Within the coherent optical component 500, this laser light is split into two beams. One beam, acting as the transmit beam, enters the coherent modulator within the coherent optical component. Driven by the high-speed electrical signal of the DSP chip 600, this optical signal is converted into an electrical signal. The converted high-speed optical signal is then output from the module's optical transmit interface. The other beam, acting as the local oscillator beam, undergoes coherent demodulation with the high-speed optical signal input into the coherent optical component 500 from the module's optical receive port. The demodulated electrical signal enters the DSP chip 600 for signal processing, completing the optical-electrical signal conversion. The narrow-linewidth, high-power laser light is a beam of a specific wavelength.

[0080] The local oscillator optical assembly 401 also includes an internal optical fiber adapter. A first optical fiber extends from the internal optical fiber adapter, and a local oscillator optical fiber extends from the local oscillator optical interface. The first optical fiber and the local oscillator optical fiber are fusion-connected to connect the internal optical fiber adapter to the local oscillator optical interface. A second optical fiber extends from the transmitting optical fiber adapter 800, and the transmitting optical fiber extends from the transmitting optical interface. The second optical fiber and the transmitting optical fiber are fusion-connected to connect the transmitting optical fiber adapter 800 to the transmitting optical interface. A third optical fiber extends from the receiving optical fiber adapter 801, and the receiving optical fiber extends from the receiving optical interface. The third optical fiber and the receiving optical fiber are fusion-connected to connect the receiving optical fiber adapter 801 to the receiving optical interface.

[0081] Because there is a certain failure rate when fusion splicing two optical fibers, a certain amount of fiber length must be reserved to ensure successful splicing of the two optical fibers. This allows for continued splicing after a splicing failure. Furthermore, because the connection point between the first optical fiber and the local oscillator fiber is located near the internal fiber adapter, the connection point between the second optical fiber and the transmitting optical fiber is located near transmitting optical fiber adapter 800, and the connection point between the third optical fiber and the receiving optical fiber is located near receiving optical fiber adapter 801, the lengths of the first optical fiber, local oscillator fiber, transmitting optical fiber, and receiving optical fiber are relatively long.

[0082] The fiber winding rack 700 is used to secure the optical fibers. Specifically, because the circuit board 300 is equipped with high-frequency signal lines and numerous components, the optical fibers cannot be laid directly on the surface of the circuit board 300. Furthermore, because the first optical fiber, local oscillator fiber, transmitting fiber, and receiving fiber are relatively long, to prevent damage to the first optical fiber, local oscillator fiber, transmitting fiber, and receiving fiber caused by the upper housing, a fiber winding rack 700 is provided between the coherent optical assembly 500 and the upper housing 201 to secure the optical fibers.

[0083] The first optical fiber, local oscillator optical fiber, transmitting optical fiber and receiving optical fiber are all neatly fixed on the optical fiber winding frame 700, which not only avoids the upper shell from damaging the first optical fiber, local oscillator optical fiber, transmitting optical fiber and receiving optical fiber, but also avoids the signal crosstalk problem caused by directly laying the optical fiber on the surface of the circuit board 300.

[0084] FIG8 is a structural diagram of an electro-optical modulator in an optical module provided according to some embodiments of the present disclosure, and FIG9 is a signal diagram of an electro-optical modulator in an optical module provided according to some embodiments of the present disclosure. As shown in FIG8 and FIG9, an optical modulator chip 900a, such as a thin-film lithium niobate chip, includes an optical modulator, which can be a Mach Zehnder Modulator (MZM). The incident light enters the MZM modulator. After a certain distance, the incident light is divided into two beams of light with completely equal amplitude and frequency at the first Y branch. The two beams of light pass through two branches of the optical waveguide respectively and converge at the second Y branch for interference output. It can also be understood that the MZM modulator divides the input light into two light beams to enter the two optical branches of the modulator respectively. The materials used for these two optical branches are electro-optical materials, and their phases change with the magnitude of the externally applied electrical signal. Since the phase change of the optical branch will cause the change of the light phase, when the output ends of the two branch signal modulators are combined again, the synthesized optical signal will be an interference signal with varying intensity. This is equivalent to converting the change of the electrical signal into the change of the optical signal, realizing light modulation.

[0085] In the MZM modulator, the lithium niobate optical waveguide undergoes an electro-optic effect under the action of electrode voltage, forming electro-optic modulation. Since the two electrodes (upper arm modulation electrode Mu and lower arm modulation electrode Md) are symmetrical structures, the voltages induced in the two arms of the MZM modulator are equal in magnitude and opposite in direction, resulting in equal phase shifts in the two branched light waves and opposite in direction.

[0086] When the phase difference generated by electro-optical modulation is 0 or π, the optical carrier signal will achieve constructive or destructive coherence, thereby completing the modulation of the optical carrier signal. When the phase difference generated by electro-optical modulation is π / 2, the relative output light intensity of the electro-optic modulator is linearly related to the electrode voltage. At this point, the dynamic range and conversion efficiency of the output signal are both maximized. Therefore, it is necessary to add an appropriate DC component to the electrode voltage to ensure the establishment of the appropriate operating point. When this DC component creates a phase difference of π / 2 between the two light waves, the linearity is maximized, and linear modulation can be achieved. In other words, an external DC bias voltage is required to stabilize the operating point at the phase difference of π / 2.

[0087] Ideally, the MZM modulator can operate stably at this operating point. However, over time, ambient temperature, laser optical power, fiber insertion and coupling loss, and other external conditions can cause the optimal operating point of the MZM modulator to drift, resulting in poor signal quality, increased bit error rate, and other adverse effects. To ensure that the optimal operating point remains stable over the long term, compensation must be added to address this drift.

[0088] Figure 10 is a block diagram of an optical module according to some embodiments of the present disclosure. As shown in Figure 10, in some examples, the optical module includes a beam splitter 90a1, a first interferometer arm 90a2, a second interferometer arm 90a3, a regulator 90a4, a combiner 90a5, an optical attenuator, a coherent receiver, a DSP chip, an MCU, a receiving fiber coupler, and a transmitting fiber coupler.

[0089] One end of the optical splitter 90a1 is connected to the light source 900b through an optical fiber. The optical splitter 90a1 is used to split the non-signal emitted light emitted by the light source 900b, such as DC light, into two identical beams of light, that is, the optical splitter 90a1 splits a beam of optical signal that does not carry data into a first beam and a second beam.

[0090] One end of the first interferometer arm 90a2 and the second interferometer arm 90a3 are respectively connected to the beam splitter 90a1. The first interferometer arm 90a2 is used to transmit the first split light, and the second interferometer arm 90a3 is used to transmit the second split light. In other words, the first interferometer arm 90a2 and the second interferometer arm 90a3 each transmit the two light signals separated by the beam splitter 90a1. The first interferometer arm 90a2 and the second interferometer arm 90a3 use the principle of interference of light of the same wavelength to combine the two light signals into a single light signal.

[0091] A first modulation electrode is provided on the first interference arm 90a2. The first modulation electrode uses electro-optical induction to change the refractive index of the modulator material, converts the modulated electrical signal transmitted by the circuit board 300 into a modulated optical signal, and uses the modulated optical signal to convert the DC optical signal (i.e., the first split light) on the first interference arm 90a2 that does not carry data into a first alternating optical signal that carries data.

[0092] A second modulation electrode is provided on the second interference arm 90a3. The second modulation electrode uses electro-optical induction to change the refractive index of the modulator material, converting the modulated electrical signal transmitted by the circuit board 300 into a modulated optical signal, and uses the modulated optical signal to convert the DC optical signal (i.e., the second split light) on the second interference arm 90a3 that does not carry data into a second alternating optical signal that carries data. The second alternating optical signal has a different phase from the first alternating optical signal.

[0093] The optical attenuator attenuates the modulated output optical power emitted from the combiner 90a5 to generate a transmission optical signal. The optical signal is transmitted to the transmission optical fiber coupler via the transmission optical fiber coupling port to realize light transmission.

[0094] The coherent receiver receives the optical signal from the receiving fiber coupler, performs balanced detection on the optical signal and the DC light, and generates an electrical signal; the DSP is electrically connected to the coherent receiver and converts the electrical signal into a data signal.

[0095] The MCU is connected to the optical attenuator to realize switching of the power supply to the optical attenuator. The MCU is also connected to the optical modulator to realize switching of the driving circuit of the optical modulator.

[0096] The regulator 90a4 can be disposed on the first interferometer arm 90a2 and / or the second interferometer arm 90a3. The regulator 90a4 is primarily used to maintain a constant phase difference between the alternating optical signals transmitted on the first interferometer arm 90a2 and the second interferometer arm 90a3. The regulator 90a4 can be a heater disposed on the first interferometer arm 90a2 and the second interferometer arm 90a3; a phase shifter disposed on the first interferometer arm 90a2 and / or the second interferometer arm 90a3; a combination of a heater and a phase shifter disposed on the first interferometer arm 90a2 and / or the second interferometer arm 90a3; or a phase converter disposed on the first interferometer arm 90a2 or the second interferometer arm 90a3.

[0097] FIG11 is a second structural diagram of an electro-optical modulator in an optical module according to some embodiments of the present disclosure.

[0098] As shown in Figure 11, in one example, the regulator can be a heater arranged on the first interference arm 902 and the second interference arm 903. For example, the heater includes a first heater and a second heater, that is, by controlling the operation of the first heater and the second heater, the first interference arm 902 and the second interference arm 903 can be heated or cooled.

[0099] When the heater heats or cools the first interferometer arm 902 and the second interferometer arm 903, it can change the refractive index of the first interferometer arm 902 and the second interferometer arm 903, thereby changing the optical path difference of the two alternating light signals entering the first heater and the second heater, and then changing the phase difference of the two alternating light signals passing through the two heaters, so that the phase difference of the two alternating light signals passing through the two heaters is stabilized at π / 2.

[0100] FIG13 is a third structural diagram of an electro-optical modulator in an optical module according to some embodiments of the present disclosure.

[0101] As shown in FIG13 , in one example, the regulator may include a phase shifter disposed on at least one interference arm, and the phase shifter may change the refractive index of the interference arm. In this way, the refractive index of the interference arm is controlled jointly by the phase shifter and the heater. The adjustment voltage of the heater is less than the adjustment voltage of the phase shifter, so that the operating point of the optical modulator is locked at the optimal operating point under the action of a smaller heating current, thereby reducing the power consumption of the optical module.

[0102] Specifically, the first interferometer arm 902 may be provided with a first phase shifter 907 and a first heater, while the second interferometer arm 903 may be provided with only the second heater; alternatively, the first interferometer arm 902 may be provided with only the first heater, while the second interferometer arm 903 may be provided with a second phase shifter 908 and a second heater; alternatively, the first interferometer arm 902 may be provided with the first phase shifter 907 and the first heater, while the second interferometer arm 903 may be provided with the second phase shifter 908 and the second heater. The above configurations can change the refractive indices of the first interferometer arm 902 and the second interferometer arm 903, thereby changing the optical path difference between the two interferometer arms to ensure a constant phase difference between the two interferometer arms, thereby locking the operating point of the MZM modulator at the optimal operating point.

[0103] FIG15 is a structural diagram of another optical modulation chip provided according to some embodiments of the present disclosure;

[0104] As shown in FIG15 , in one example, the regulator may include a phase converter 900a5 to adjust the phase difference between the light output by the first modulation electrode and the second modulation electrode by π / 2 through the phase converter 900a5 so that the operating point of the MZM modulator is locked at the optimal operating point.

[0105] To address the problem of the MZM modulator's optimal operating point drifting due to a series of external conditions such as time, ambient temperature, laser emission power, fiber insertion and coupling loss, a PD feedback compensation circuit can be built to ensure a constant phase difference between the two arm electrodes, keeping them stable at the optimal operating point for a long time.

[0106] In order to ensure that the two-arm electrodes produce a constant phase difference by adjusting the refractive index of the first interfering arm and the second interfering arm through a regulator, it is stabilized at the optimal working point for a long time. The optical module of the embodiment of the present application also includes an optical power detection component, which is arranged on the optical modulator side, and can be specifically arranged on the light-emitting side of at least two interfering arms (i.e., the upper arm modulation electrode Mu and the lower arm modulation electrode Md) to obtain a detection voltage. The MCU is electrically connected to the circuit board, and the MCU is configured to make the two-arm electrodes produce a constant phase difference, so that it is stabilized at the optimal working point for a long time, thereby adjusting the detection voltage to a preset voltage. The following describes a method for adjusting the detection voltage to a preset voltage in combination with two examples.

[0107] It is understood that the light-emitting side of the interferometer arm can be the side directly connected to the light outlet of the interferometer arm, and the optical power detection component can at least detect the split light voltage emitted by the light outlet of the interferometer arm. In some examples, the light-emitting side of the interferometer arm can also be the side of the light outlet of a light combiner (as mentioned in the examples below), and the optical power detection component can at least detect the modulated light voltage at the light outlet of the light combiner.

[0108] In addition, the MCU can send a control signal to the regulator to control the operation of the regulator, so that the regulator adjusts the phase of the two-arm electrodes to generate a constant phase difference between the two-arm electrodes.

[0109] Among them, the control signal can be a driving voltage or a driving current. In some examples, the MCU can directly send a driving voltage or a driving current to the regulator to control the operation of the regulator. In other examples, the MCU can also control the operation of the power supply so that the power supply sends a driving voltage or a driving current to the regulator. The embodiments of the present disclosure are not limited to this.

[0110] As shown in FIG. 11 , in some examples, the regulator may be a heater disposed on the first interferometer arm 902 and the second interferometer arm 903 , and the optical modulator includes a first beam splitter 901 , a first interferometer arm 902 , a second interferometer arm 903 and a combiner 906 .

[0111] The first optical splitter 901 can split a beam of light into two identical beams of light signals or two non-identical beams of light signals. To facilitate interference between the two beams of light signals, the first optical splitter 901 splits a beam of light into two identical beams of light signals.

[0112] For example, the first heater and the second heater are used to control the phase difference of the alternating optical signals transmitted on the first interferometer arm 902 and the second interferometer arm 903 to be constant according to the driving voltage sent by the MCU. In other words, the first heater and the second heater are controlled to operate according to the driving voltage sent by the MCU to increase or decrease the temperature of the first interferometer arm 902 and the second interferometer arm 903.

[0113] The following is a method for adjusting the detection voltage to a preset voltage when the regulator is a heater:

[0114] As shown in Figure 11, in this example, the optical adjuster also includes a second optical splitter 904 and a third optical splitter 905. The second optical splitter 904 is disposed at one end of the first interferometer arm 902, and is used to split the alternating optical signal on the first interferometer arm 902 into a beam of optical signals with a smaller proportion and a beam of optical signals with a larger proportion. That is, the second optical splitter 904 splits the alternating optical signal on the first interferometer arm 902 into two beams of alternating optical signals, the two beams of optical signals being a first beam of alternating optical signals and a second beam of alternating optical signals, respectively. The first beam of alternating optical signals is an alternating optical signal with a smaller proportion, and the second beam of alternating optical signals is an alternating optical signal with a larger proportion. In some embodiments, the power ratio of the first beam of alternating optical signals to the second beam of alternating optical signals can be set to 2:98.

[0115] Correspondingly, a third optical splitter 905 is disposed at one end of the second interferometer arm 903. The third optical splitter 905 is configured to split the alternating optical signal on the second interferometer arm 903 into a smaller optical signal and a larger optical signal. Specifically, the third optical splitter 905 splits the alternating optical signal on the second interferometer arm 903 into two alternating optical signals: a third alternating optical signal and a fourth alternating optical signal. The third alternating optical signal is the smaller alternating optical signal, while the fourth alternating optical signal is the larger alternating optical signal. In some embodiments, the power ratio of the third alternating optical signal to the fourth alternating optical signal can be set to 2:98.

[0116] One end of the combiner 906 is connected to one end of the second optical splitter 904 and one end of the third optical splitter 905, respectively. The combiner 906 is configured to combine the two alternating optical signals, each with a larger ratio, into a single alternating optical signal. Specifically, the combiner 906 combines the second alternating optical signal, which has a larger ratio, with the fourth alternating optical signal to form a single alternating optical signal, and transmits the single alternating optical signal to achieve transmission of the alternating optical signal.

[0117] In some embodiments, the optical modulation chip 900a, such as a thin-film lithium niobate chip, includes an input optical port, an output optical port, a monitoring optical port, a high-speed electrical signal input interface, and a DC bias signal input interface. The input optical port is used to couple the light that does not carry data output by the light source 900b into the optical modulation chip 900a. The light input through the input optical port is divided into two beams of light of equal proportions by the first optical splitter 901.

[0118] The output optical port is connected to the combiner 906 . The combiner 906 combines the second and fourth alternating optical signals into one alternating optical signal, and then transmits the alternating optical signal through the output optical port.

[0119] In some embodiments, the optical power of the optical modulation chip 900a can be detected by an optical power detection component, thereby determining the operating point state of the optical modulation chip 900a. Therefore, the optical power detection component provided in the embodiment of the present disclosure may include a first optical power detection component 920, a second optical power detection component 930 and an MCU, the first optical power detection component 920 and the second optical power detection component 930 are respectively connected to the optical modulation chip 900a patch, the first optical power detection component 920 is connected to one end of the second optical splitter 904, the first optical power detection component 920 is used to collect a second beam of alternating optical signals with a smaller proportion, and the first optical power detection component 920 converts the second beam of alternating optical signals into a voltage signal to obtain a corresponding first sampling voltage.

[0120] The second optical power detection component 930 is connected to one end of the third optical splitter 905. The second optical power detection component 930 is used to collect a third beam of alternating optical signals with a smaller proportion. The second optical power detection component 930 converts the third beam of alternating optical signals into a voltage signal to obtain a corresponding second sampling voltage.

[0121] The monitoring optical port is connected to the second optical splitter 904 and the third optical splitter 905. The first beam of alternating optical signals split by the second optical splitter 904 is transmitted to the first optical power detection component 920 via the monitoring optical port, and the third beam of alternating optical signals split by the third optical splitter 905 is transmitted to the second optical power detection component 930 via the monitoring optical port. The modulated optical signals are monitored by the first optical power detection component 920 and the second optical power detection component 930. The photodetector generates a photocurrent, which is collected by the sampling circuit and sent to the MCU for processing. That is, in this example, the MCU is configured to receive a first sampling voltage and a second sampling voltage. The detection voltage includes the first sampling voltage and the second sampling voltage.

[0122] The high-speed electrical signal input interface is connected to the first modulation electrode and the second modulation electrode, and a high-speed electrical signal is input to the first modulation electrode and the second modulation electrode through the high-speed electrical signal input interface to perform optical modulation on the first interference arm 902 and the second interference arm 903 .

[0123] The DC bias signal input interface is connected to the MCU, the first heater and the second heater. The MCU inputs a DC bias voltage (current) signal to the DC bias signal input interface and applies the DC bias voltage (current) signal to the first heater and the second heater to control the optimal operating point of the MZM modulator.

[0124] Due to changes in the modulator's operating temperature, the operating point of the optical modulation chip 900a is prone to drift, causing it to not be at its optimal operating point. Therefore, the operating point of the optical modulation chip 900a needs to be locked at the optimal operating point. For example, when the detection voltage received by the MCU is not equal to the first preset voltage, the drive voltage output to the heater is adjusted so that the detection voltage ultimately reaches the first preset voltage. In this example, the preset voltage is equal to the first preset voltage.

[0125] Figure 12 is a block diagram of a first optical power detection assembly in an optical module according to some embodiments of the present disclosure. As shown in Figure 12, in some embodiments, the first optical power detection assembly 920 includes a first photodetector 921 and a first sampling resistor 922. The first photodetector 921 and the first sampling resistor 922 are electrically connected, and can be wired.

[0126] One end of the first photodetector 921 is electrically connected to an external power supply. The first photodetector 921 is configured to convert a relatively small optical signal into a sampling current. One end of a first sampling resistor 922 is electrically connected to the first photodetector 921. The other end of the first sampling resistor 922 is grounded. The first sampling resistor 922 is configured to convert the sampling current into a sampling voltage. Specifically, the sampling current is divided by the first sampling resistor to obtain a first sampling voltage.

[0127] In some embodiments, the second optical power detection component 930 includes a second photodetector and a second sampling resistor, and the second photodetector and the second sampling resistor are electrically connected, and can be connected by wire bonding.

[0128] One end of the second photodetector is electrically connected to an external power supply and is configured to convert a smaller optical signal into a sampling current. One end of a second sampling resistor is electrically connected to the second photodetector and the other end of the second sampling resistor is grounded. The second sampling resistor is configured to convert the sampling current into a sampling voltage. Specifically, the sampling current is divided by the second sampling resistor to generate a second sampling voltage.

[0129] The MCU is electrically connected to the first optical power detection component 920 and the second optical power detection component 930 respectively, and can be connected by patch connection. The MCU is used to compare and analyze the detection voltage, such as the first sampling voltage and the second sampling voltage, and judge whether the output driving voltage should be increased or decreased according to the comparison and analysis results, so as to control the voltage value loaded to the first heater and the second heater through the driving voltage, thereby forming different currents. The heater will produce a thermal effect due to the injection of current, thereby changing the refractive index of the interference arm, thereby changing the optical path difference between the first interference arm 902 and the second interference arm 903, so that the first sampling voltage and the second sampling voltage are finally equal to the preset voltage, such as the first preset voltage.

[0130] In some embodiments, changes in the driving voltage output by the MCU to the heater will affect the phase changes of the light signals output by the two interferometer arms, and the signal amplitude changes of the first photodetector 921 and the second photodetector, that is, affecting the first sampling voltage and the second sampling voltage, thereby forming a closed-loop feedback control loop. The entire loop will enable the dynamic stability of the MZM modulator to be within a small voltage increase or decrease at the optimal operating point, thereby realizing automatic compensation of the DC bias of the MZM modulator at any time.

[0131] In some embodiments, the first heater on the first interference arm 902 and the second heater on the second interference arm 903 need to operate at 1.5V, and then adjust the driving voltage output by the MCU to the first heater and the second heater according to the changes in the light power received by the first photodetector and the second photodetector. The driving voltage can be increased or decreased.

[0132] During the entire process, it is necessary to ensure that the light power received by the first photodetector and the second photodetector is equal. If the monitoring power of the photodetector becomes smaller, the heating current is reduced and the driving voltage is lowered; if the monitoring power of the photodetector becomes larger, the heating current is increased and the driving voltage is increased.

[0133] In some embodiments, the heater on the interference arm is a heating resistor, and the MCU controls the voltage value loaded to the heating resistor, thereby forming different currents. The heating resistor will produce a thermal effect due to the injection of current, thereby changing the refractive index of the interference arm. However, the refractive index of the interference arm is proportional to the current injected into the heating resistor. When the refractive index of the MZM modulator is changed by the heating resistor, additional power consumption will be generated.

[0134] The following is a method for adjusting the detection voltage to a preset voltage when the regulator further includes a phase shifter in addition to the heater:

[0135] As shown in Figure 13, in order to reduce the additional power consumption caused by the heating resistor, a phase shifter is set on at least one interferometer arm. The MCU sends a driving voltage to the phase shifter. Under the action of the driving voltage, the phase shifter can change the refractive index of the interferometer arm. In this way, the refractive index of the interferometer arm is jointly controlled by the phase shifter and the heater. The adjustment voltage of the heater is less than the adjustment voltage of the phase shifter until the detection voltage received by the MCU is equal to the preset voltage. Under the action of a smaller heating current, the operating point of the optical modulator is locked at the optimal operating point, thereby reducing the power consumption of the optical module.

[0136] Exemplarily, the first interferometer arm 902 may be provided with a first phase shifter 907 and a first heater, and the second interferometer arm 903 may only be provided with a second heater. The first sampling voltage of the optical signal output by the first interferometer arm 902 is collected by the first optical power detection component 920, and the second sampling voltage of the optical signal output by the second interferometer arm 903 is collected by the second optical power detection component 930. The MCU compares and analyzes the first sampling voltage and the second sampling voltage to determine whether the driving voltage should be increased or decreased at present, and outputs it through the DAC to control the voltage value loaded to the first phase shifter 907, the first heater and the second heater, and the adjustment voltage of the first heater and the second heater is less than the adjustment voltage of the first phase shifter 907 to change the refractive index of the first interferometer arm 902 and the second interferometer arm 903, thereby changing the optical path difference between the two interferometer arms to ensure that the two interferometer arms produce a constant phase difference, so that the operating point of the MZM modulator is locked at the optimal operating point.

[0137] In some embodiments, only a first heater is provided on the first interferometer arm 902, and a second phase shifter 908 and a second heater are provided on the second interferometer arm 903. The first sampling voltage of the optical signal output by the first interferometer arm 902 is collected by the first optical power detection component 920, and the second sampling voltage of the optical signal output by the second interferometer arm 903 is collected by the second optical power detection component 930. The MCU compares and analyzes the first sampling voltage and the second sampling voltage to determine whether the driving voltage should be increased or decreased, and outputs it through the DAC to control the voltage value loaded to the first heater, the second phase shifter 908 and the second heater, and the adjustment voltage of the first heater and the second heater is less than the adjustment voltage of the second phase shifter 908 to change the refractive index of the first interferometer arm 902 and the second interferometer arm 903, thereby changing the optical path difference between the two interferometer arms to ensure that the two interferometer arms produce a constant phase difference, so that the operating point of the MZM modulator is locked at the optimal operating point.

[0138] In some embodiments, a first phase shifter 907 and a first heater are provided on the first interferometer arm 902, and a second phase shifter 908 and a second heater are provided on the second interferometer arm 903. A first sampling voltage of the optical signal output by the first interferometer arm 902 is collected by a first optical power detection component 920, and a second sampling voltage of the optical signal output by the second interferometer arm 903 is collected by a second optical power detection component 930. The MCU compares and analyzes the first sampling voltage and the second sampling voltage to determine whether the driving voltage should be increased or decreased. The MCU outputs the voltage through a DAC to control the voltage values ​​applied to the first phase shifter 907, the first heater, the second phase shifter 908, and the second heater. The adjustment voltages of the first heater and the second heater are less than the adjustment voltages of the first phase shifter 907 and the second phase shifter 908, so as to change the refractive indexes of the first interferometer arm 902 and the second interferometer arm 903, thereby changing the optical path difference between the two interferometer arms to ensure that the two interferometer arms produce a constant phase difference, so that the operating point of the MZM modulator is locked at the optimal operating point.

[0139] When setting a phase shifter on the interferometer arm, a phase shifter can be set on both the first interferometer arm 902 and the second interferometer arm 903. The MCU controls the driving voltage loaded to the two phase shifters, and sets the driving voltage from low to high, for example, 0 to 3V. The MCU draws a phase shifter voltage-power response curve based on the first sampling voltage and the second sampling voltage obtained by the first optical power detection component 920 and the second optical power detection component 930, and selects the phase shifter with the highest efficiency. The phase shifter on the other path can be discarded.

[0140] Since heaters are provided on the interference arm, the MCU controls the driving voltage loaded to the two heaters and sets the driving voltage from low to high. The MCU draws a heater voltage-power response curve based on the first sampling voltage and the second sampling voltage obtained by the first optical power detection component 920 and the second optical power detection component 930.

[0141] The phase shifter voltage-power response curve and the heater voltage-power response curve are combined to obtain the phase shifter voltage value and heater voltage value corresponding to the preset power. To reduce the current injected into the heater, the driving voltage applied to the phase shifter is adjusted over a large range to coarsely adjust the power curve. Then, the driving voltage applied to the heater is adjusted over a small range to provide a small current to the heater to fine-tune the power curve. As a result, the operating point of the MZM modulator is locked at the optimal operating point under the joint control of the phase shifter and the heater.

[0142] In some embodiments, the MCU may apply 90% of the driving voltage to the phase shifter and apply 10% of the driving voltage to the heater to reduce the current injected into the heater, thereby reducing the additional power consumption caused by the heating resistor.

[0143] In some embodiments, when the MCU analyzes that the first sampling voltage and the second sampling voltage are equal to each other and not equal to the first preset voltage, the MCU outputs equal driving voltages to the first phase shifter and the second phase shifter, and outputs equal heating voltage signals to the first heater and the second heater, so that the adjusted first sampling voltage and the second sampling voltage are both equal to the first preset voltage, so that the operating point of the MZM modulator is locked at the optimal operating point.

[0144] When the MCU analyzes that the first sampling voltage and the second sampling voltage are not equal and are not equal to the first preset voltage, the MCU outputs unequal driving voltages to the first phase shifter and the second phase shifter, and outputs unequal heating voltage signals to the first heater and the second heater, so that the adjusted first sampling voltage and the second sampling voltage are both equal to the first preset voltage, so that the operating point of the MZM modulator is locked at the optimal operating point.

[0145] In some embodiments, piezoelectric crystals are used as phase shifters, integrating piezoelectric devices into the interferometer arms of an MZM modulator to change the refractive index of the interferometer arms. Piezoelectric crystals are pressure-sensitive devices that operate with only an operating voltage and exhibit minimal load, generating virtually no additional current and power consumption.

[0146] The phase shifter provided by the embodiments of the present disclosure is not limited to piezoelectric crystals. As long as the phase shifter operates according to the driving voltage and does not generate additional power consumption, it falls within the scope of protection of the present disclosure.

[0147] In some embodiments, after obtaining the first sampled voltage and the second sampled voltage, the MCU may also generate a power response curve based on the first sampled voltage, the second sampled voltage, the driving voltage output to the phase shifter, and the driving voltage output to the heater. The MCU compares the power response curve with a preset power response curve. When the power response curve is inconsistent with the preset power response curve, the MCU adjusts the driving voltage output to the phase shifter according to the corresponding driving voltage in the preset power response curve to coarsely adjust the power response curve; then the MCU adjusts the driving voltage output to the heater according to the corresponding driving voltage in the preset power response curve, the adjusted voltage output to the heater is less than the adjusted voltage output to the phase shifter, and the coarsely adjusted power response curve is fine-tuned to make the adjusted power response curve consistent with the preset power response curve, so that the operating point of the MZM modulator is locked at the optimal operating point.

[0148] The MCU can fit a curve based on the obtained optical power value, the relationship between the drive voltage output to the phase shifter and the drive voltage output to the heater, store it in the MCU, and perform temperature compensation. This curve is then saved as a LUT table for the long-term operation of the optical module. When the operating environment of the optical module changes, the MCU automatically reads the LUT value for calibration, ensuring that the optical module can stably lock at the optimal operating point under different conditions.

[0149] The optical module provided by the present disclosure adds phase shifters to the two interferometer arms of the optical modulator. The phase difference of the optical signals output by the two interferometer arms is coarsely adjusted by controlling the driving voltage applied to the phase shifter. Then, the phase difference of the optical signals output by the two interferometer arms is finely adjusted by controlling the driving voltage applied to the heater. This reduces the driving voltage applied to the heater, thereby reducing the power consumption of the optical module and improving the signal quality transmitted by the optical module.

[0150] Of course, the regulator can also be a phase converter connected to the MCU in the modulator, thereby solving the problem that the optimal operating point of the MZM modulator drifts due to a series of external conditions such as time, ambient temperature, and laser transmission power.

[0151] For example, in this example, the MCU is configured to receive a test voltage corresponding to the detection voltage and, when the test voltage is not equal to a second preset voltage, adjust the bias voltage provided to the phase converter. The preset voltage corresponds to the second preset voltage. For example, when the test voltage reaches the second preset voltage, the detection voltage output by the modulator reaches the preset voltage, thereby enabling the MZM modulator to reach an optimal operating point.

[0152] The following is a method for adjusting the detection voltage to a preset voltage when the regulator is a phase converter:

[0153] Figure 14 is a diagram illustrating the internal structure of another optical module provided according to some embodiments of the present disclosure. Specifically, as shown in Figures 14 and 15 , in some other embodiments, the optical modulator includes a first beam splitter 900a1, a second beam splitter 900a2, a first interferometer arm 900a3, a second interferometer arm 900a4, a phase converter 900a5, and a combiner 900a6.

[0154] The first optical splitter 900a1 is used to split the light emitted by the light source that does not carry a signal into modulated light and first monitoring light in different proportions.

[0155] The second optical splitter 900a2 is connected to the first optical splitter 900a1 and is used to split the modulated light into a first optical split and a second optical split of the same proportion.

[0156] The first interferometer arm 900a3 is connected to the second optical splitter 900a2. A first modulation electrode is provided on the first interferometer arm 900a3, and the first split light is transmitted through the first interferometer arm 900a3.

[0157] The second interference arm 900a4 is connected to the second optical splitter 900a2. A second modulation electrode is provided on the second interference arm 900a4, and the second split light is transmitted through the second interference arm 900a4.

[0158] The first modulating electrode uses electro-optical induction to change the refractive index of the modulator material, converting the modulated electrical signal output by the circuit board 300 into a modulated optical signal. The modulated optical signal is then used to convert the non-data-carrying DC optical signal on the first interferometer arm (i.e., the first split light) into a data-carrying first alternating optical signal. The second modulating electrode uses electro-optical induction to change the refractive index of the modulator material, converting the modulated electrical signal output by the circuit board 300 into a modulated optical signal. The modulated optical signal is then used to convert the non-data-carrying DC optical signal on the second interferometer arm (i.e., the second split light) into a data-carrying second alternating optical signal. The first alternating optical signal and the second alternating optical signal have different phases. The other end of the first interferometer arm is connected to the first input of a combiner 900a6, and the other end of the second interferometer arm is connected to the second input of the combiner 900a6. The combiner 900a6 combines the first and second alternating optical signals into a transmitted light beam and a second monitoring light beam, thereby loading information into the light to form an information-carrying optical signal, completing the modulation process of the transmitted light. The emitted light is output through an optical modulation chip, such as an output optical port of a thin film lithium niobate chip, while the second monitoring light is output without passing through an optical modulation chip, such as an output optical port of a thin film lithium niobate chip.

[0159] Under the bias voltage output by the MCU, phase converter 900a5 adjusts the phase difference between the light output from the first and second modulation electrodes by π / 2. At this point, the optical modulation chip, such as a thin-film lithium niobate chip, is at its optimal operating point. Due to temperature fluctuations in the modulator, the operating point of the optical modulation chip can easily drift, causing it to operate outside of its optimal state. Therefore, the operating point of the optical modulation chip must be locked at the optimal point.

[0160] In some embodiments, the optical power is detected by an optical power detection component, such as a backlight detector, to determine the operating point state of the optical modulation chip. Exemplarily, the backlight detector can be a monitor photodiode (MPD). MPD is a silicon-based detector, and the MPD can be directly integrated into the silicon photonic chip. Exemplarily, a silicon-based detector is grown inside the silicon photonic chip. However, when the optical modulation chip uses a thin-film lithium niobate chip with relatively low optical loss, since the MPD is silicon-based, the MPD cannot be integrated inside the thin-film lithium niobate chip, and the MPD needs to be set outside the thin-film lithium niobate chip. Exemplarily, the MPD is attached to the outside of the thin-film lithium niobate chip by optical adhesive.

[0161] In some embodiments, a first optical power detection component 900c is provided outside the thin-film lithium niobate chip, illustratively on the light-incoming side of the optical modulator. The first optical power detection component 900c is connected to the optical port outputting the first monitoring light to detect the optical power of the first monitoring light.

[0162] In some embodiments, a second optical power detection component 900d is provided outside the thin-film lithium niobate chip, illustratively on the light output side of the optical modulator. The second optical power detection component 900d is connected to the optical port outputting the second monitoring light to monitor the optical power of the second monitoring light.

[0163] FIG16 is a structural diagram of a first optical power detection component in another optical module provided according to some embodiments of the present disclosure. As shown in FIG16 , in some embodiments, the first optical power detection component 900c includes a first optical power detector (such as a first MPD 900c1) and a first resistor 900c2; one end of the first MPD 900c1 is electrically connected to a reference voltage, and the other end is electrically connected to one end of the first resistor 900c2, and the other end of the first resistor 900c2 is grounded. The first MPD 900c1 has a certain responsiveness, converts the detected optical signal into a response current, and converts the response current into a first detection voltage through the first resistor 900c2. Since the first MPD 900c1 is fixed by optical adhesive, the patch position has a certain error, which causes the responsiveness of the first MPD 900c1 to fluctuate within a certain range, thereby causing the value of the first detection voltage to fluctuate within a certain range.

[0164] FIG17 is a structural diagram of a second optical power detection component in another optical module provided according to some embodiments of the present disclosure. As shown in FIG17 , in some embodiments, the second optical power detection component 900d includes a second optical power detector (such as a second MPD 900d1) and a second resistor 900d2; one end of the second MPD 900d1 is electrically connected to a reference voltage, and the other end is electrically connected to one end of the second resistor 900d2, and the other end of the second resistor 900d2 is grounded. The second MPD 900d1 has a certain responsiveness, converts the detected optical signal into a response current, and converts the response current into a second detection voltage through the second resistor 900d2. Since the second MPD 900d1 is fixed by optical adhesive, the patch position has a certain error, which causes the responsiveness of the second MPD 900d1 to fluctuate within a certain range, thereby causing the value of the second detection voltage to fluctuate within a certain range.

[0165] Figure 18 is a structural diagram of a comparison circuit in another optical module provided according to some embodiments of the present disclosure. As shown in Figure 18, in some embodiments, the optical module further includes a comparison circuit 900e. The comparison circuit 900e includes a first input terminal, a second input terminal, and an output terminal. The first input terminal is electrically connected to the output terminal of the second optical power detection component 900d to receive the second detection voltage. The second input terminal is electrically connected to the output terminal of the first optical power detection component 900c to receive the first detection voltage. Exemplarily, the comparison circuit 900e is an operational amplifier, whose first input terminal is a negative input terminal and the second input terminal is a positive input terminal.

[0166] Comparison circuit 900e outputs a comparison voltage based on the first detection voltage and the second detection voltage. The comparison voltage, as an output voltage, can be monitored by the MCU. It should be noted that in this example, the test voltage corresponding to the detection voltage received by the MCU is the comparison voltage. Therefore, the MCU adjusts the test voltage to the second preset voltage. That is, the MCU adjusts the comparison voltage to the second preset voltage, thereby adjusting the detection voltage to the preset voltage.

[0167] Exemplarily, the comparison voltage is related to the difference between the first detection voltage and the second detection voltage. In some embodiments, when the optical module is in a preset state, exemplarily, the preset state includes: the optical modulator chip 900a, such as the thin-film lithium niobate chip, is in an optimal operating point state, and the comparison voltage at this time is used as the second preset voltage. When the value of the monitored comparison voltage is not equal to the value of the second preset voltage, it means that the optical modulator of the thin-film lithium niobate chip is not in an optimal operating point state. At this time, the MCU adjusts the bias voltage provided to the phase converter 900a5, thereby adjusting the refractive index of one of the interferometer arms, thereby changing the value of the second detection voltage, adjusting the difference between the first detection voltage and the second detection voltage to the preset difference, thereby causing the comparison voltage to reach the second preset voltage, and the optical modulator of the thin-film lithium niobate chip is in an optimal operating point state. Exemplarily, the preset difference corresponds to the second preset voltage.

[0168] Figure 19 is a schematic diagram illustrating the interaction between an MCU and a phase converter in another optical module according to some embodiments of the present disclosure. As shown in Figure 19, by adjusting the bias voltage provided to phase converter 900a5, the difference between the first and second detection voltages is adjusted to a predetermined difference, thereby adjusting the comparison voltage to the second predetermined voltage and adjusting the operating point of the optical modulator to the optimal operating point, thereby achieving continuous feedback control.

[0169] The comparison voltage can only be monitored by the MCU if it is non-negative. However, since the first MPD 900c1 and the second MPD 900d1 are external and their placement is random within a certain range, the magnitude relationship between the first and second detection voltages cannot be guaranteed. Therefore, the difference between the first and second detection voltages of the optical module may be positive or negative. The positive and negative values ​​of the difference between the first and second detection voltages vary from optical module to optical module. In other words, the difference between the first and second detection voltages is uncertain for different optical modules. For example, for the first optical module, the difference between the first and second detection voltages may be positive; for the second optical module, the difference between the first and second detection voltages may be negative and undetectable by the MCU; and for the third optical module, the difference between the first and second detection voltages may also be negative and undetectable by the MCU.

[0170] In some embodiments, when the difference between the first detection voltage and the second detection voltage is negative and cannot be detected by the MCU, the resistance of the first resistor 900c2 or the second resistor 900d2 can be replaced to adjust the resistance of the first resistor or the second resistor so that the difference between the first detection voltage and the second detection voltage is non-negative. However, replacing the resistors will inevitably increase production costs. In large production volumes, many optical modules may have a negative difference between the first detection voltage and the second detection voltage, which increases workload and reduces work efficiency.

[0171] In some embodiments, the first resistor 900c2 and the second resistor 900d2 remain unchanged, and a compensation voltage is provided to the comparison circuit 900e via the MCU. For example, the MCU output terminal is electrically connected to the second input terminal of the comparison circuit 900e to output the compensation voltage to the comparison circuit 900e. The compensation voltage can compensate for the voltage deviation caused by the patch, thereby ensuring that the comparison voltage is a non-negative voltage and can be monitored by the MCU. The second input terminal of the comparison circuit 900e simultaneously receives the first detection voltage and the compensation voltage, thereby increasing the input voltage of the positive input terminal of the comparison circuit 900e, making the input voltage of the positive input terminal greater than the input voltage of the negative input terminal, to ensure that the comparison voltage output by the comparison circuit 900e is a non-negative voltage.

[0172] In some embodiments, when the optical module is in a preset state, if the comparison voltage cannot be monitored, a first compensation voltage is input to the comparison circuit 900e, and the second input terminal of the comparison circuit 900e receives the first detection voltage and the first compensation voltage at the same time, thereby increasing the input voltage of the positive input terminal of the comparison circuit 900e, so that the input voltage of the positive input terminal is greater than the input voltage of the negative input terminal, to ensure that the comparison voltage output by the comparison circuit 900e is a non-negative voltage.

[0173] In some embodiments, when the optical module is in a preset state, if a comparison voltage is monitored, a second compensation voltage is input to the comparison circuit 900e. Exemplarily, the second compensation voltage is 0 V. That is, when the optical module is in a preset state, if a comparison voltage is monitored, no compensation voltage is input to the comparison circuit 900e.

[0174] For example, when the optical module is in a preset state, if the MCU monitors that the comparison voltage is 0V, it either means that the comparison voltage is not monitored, or that the comparison voltage output by the comparison circuit 900e is 0V. For the convenience of control, when the optical module is in a preset state, if the MCU monitors that the comparison voltage is 0V, the compensation voltage is uniformly input to the comparison circuit 900e, and the compensation voltage is gradually increased until the comparison voltage output by the comparison circuit 900e reaches the second preset voltage.

[0175] In some embodiments, if the bias voltage provided to the phase converter 900a5 is adjusted so that the difference between the first detection voltage and the second detection voltage is non-negative, however, if the bias voltage provided to the phase converter 900a5 is adjusted without limit, although the difference can be guaranteed to be non-negative, it is possible that the operating point of the optical modulator in the optical modulation chip is no longer at the optimal operating point.

[0176] For different optical modules, the second preset voltage corresponding to the comparison circuit 900e can be the same fixed value or different fixed values. For example, the second preset voltage corresponding to the comparison circuit 900e is the same fixed value, recorded as V 预设 For any optical module, when the optical module is in a preset state, if the MCU monitors that the comparison voltage is 0V, the compensation voltage is input to the comparison circuit 900e and gradually increases the compensation voltage until the comparison voltage output by the comparison circuit 900e reaches the second preset voltage V 预设 until.

[0177] For different optical modules, the compensation voltage input by the MCU to the comparison circuit 900e may be different values. For example, the second preset voltage of the first optical module is V 预设 , the compensation voltage is V Q1 ; The second preset voltage of the second optical module is V 预设 , the compensation voltage is V Q2 The second preset voltage of the third optical module is Vout, and the compensation voltage is V Q3 ; The second preset voltage of the fourth optical module is V 预设 , the compensation voltage is V Q4 ….

[0178] In some embodiments of the present disclosure, while keeping the hardware structure unchanged, a compensation voltage is provided to the comparison circuit through the MCU, thereby avoiding the need to replace the resistor. The comparison voltage is monitored by the MCU from the software perspective, and the compensation voltage is involved in locking the operating point. This can reduce production costs and improve production efficiency.

[0179] For an optical module, when it is in a preset state, if the MCU monitors that the comparison voltage is 0V, the compensation voltage is input to the comparison circuit 900e and the compensation voltage is gradually increased until the comparison voltage output by the comparison circuit 900e reaches the second preset voltage V 预设 Until. At this time, the compensation voltage is V Q In order to facilitate the locking of the operating point, the compensation voltage V Q Will maintain continuous and constant output; when the operating point drifts, the compensation voltage V QUnder the action, the MCU then adjusts the bias voltage provided to the phase converter 900a5 so that the difference between the first detection voltage and the second detection voltage reaches the preset difference. At this time, the comparison voltage reaches the second preset voltage V 预设 , the corresponding working point is the optimal working point.

[0180] In some embodiments, a third resistor R3 is provided between the output terminal of the second optical power detection component 900d and the first input terminal of the comparison circuit 900e. The third resistor R3 is a current limiting resistor. The third resistor R3 reduces the power consumption control voltage and provides safety protection.

[0181] In some embodiments, a fourth resistor R4 is provided between the output of the first optical power detection assembly 900c and the second input of the comparison circuit 900e. The fourth resistor R4 is a current-limiting resistor and is connected in parallel with the third resistor R3. The fourth resistor R4 reduces the power consumption control voltage and provides safety protection.

[0182] In some embodiments, a fifth resistor R5 is provided between the MCU output and the second input of the comparison circuit 900e. The fifth resistor R5 is a current-limiting resistor. The fifth resistor R5, the fourth resistor R4, and the third resistor R3 are connected in parallel. The fifth resistor R5 reduces the power consumption control voltage and provides safety protection.

[0183] In some embodiments, a sixth resistor R6 is provided between the first input terminal of the comparison circuit 900e and the output terminal of the comparison circuit 900e, and the sixth resistor R6 is connected in parallel with the third resistor R3. The sixth resistor R6 serves to amplify the output voltage.

[0184] In some embodiments, a seventh resistor R7 is provided in parallel with the fifth resistor R5 . One end of the seventh resistor R7 is electrically connected to the second input end of the comparison circuit 900 e , and the other end is grounded.

[0185] In some embodiments, the comparison circuit 900e obtains and outputs a comparison voltage according to the first detection voltage, the second detection voltage, and the compensation voltage.

[0186] For example, according to the first resistor, the second resistor, the third resistor R3, the fourth resistor R4, the fifth resistor R5, and the sixth resistor R6, Vout=[(R P *R3+R6*R P ) / (R3*R4)]*V MPD1 +[(R3*R P +R6*R P ) / (R3*R5)]*V Q -R6 / R3*V MPD2 ;

[0187] Wherein, Vout is the output voltage of the comparison circuit 900e; R P =R4 / / R5 / / R7; V MPD1 is the first detection voltage, V MPD1 The value is equal to the response current detected by the first MPD * the first resistor; V MPD2 is the second detection voltage, V MPD2 The value is equal to the response current detected by the second MPD * the second resistor; V Q It is the compensation voltage input by MCU to the comparison circuit 900e.

[0188] By adjusting the resistance, the following conditions are met between the resistors: R3 / / R6=R4 / / R5 / / R7, R3=R4=R5=R, then Vout=R6(V MPD1 / R+V Q / RV MPD2 / R); It can be seen that the comparison voltage Vout output by the comparison circuit 900e is equal to the first detection voltage V MPD1 , the second detection voltage V MPD2 , compensation voltage V Q Keep the output fixed compensation voltage V Q , the first detection voltage V MPD1 , the second detection voltage V MPD2 The difference between them is adjusted to a preset difference, and the comparison voltage Vout can reach the second preset voltage V 预设 , thereby adjusting the operating point of the optical modulator in the optical modulation chip to the optimal operating point. For example, the output fixed compensation voltage V Q , the first detection voltage V MPD1 , the second detection voltage V MPD2 When the difference between them is a preset difference, the comparison voltage Vout can reach a second preset voltage. At this time, the corresponding working state of the optical modulation chip is at the optimal working point.

[0189] In some embodiments, a constant compensation voltage is output. When the comparison voltage Vout output by the comparison circuit 900e is not the second preset voltage, it indicates that the working state of the optical modulator in the optical modulation chip is not the optimal working point. Then, the bias voltage provided to the phase converter 900a5 is adjusted to adjust the first detection voltage Vout. MPD1 , the second detection voltage V MPD2 The difference between the two is adjusted to a preset difference, thereby adjusting the comparison voltage to a second preset voltage, and adjusting the operating point of the optical modulator to an optimal operating point.

[0190] In some embodiments, the second preset voltage corresponding to the comparison voltage corresponding to each optical module is uniformly set to V 预设 .

[0191] In some embodiments, at room temperature, by adjusting the bias voltage provided to the phase converter 900a5, the output optical power is made half of the maximum optical power. At this time, the optical modulation chip operates at the optimal operating point. If the comparison voltage output by the comparison circuit 900e is monitored to be 0V, the compensation voltage is gradually input to the comparison circuit 900e, and the compensation voltage is gradually increased until the comparison voltage output by the comparison circuit 900e reaches the second preset voltage V 预设 Until now; record the compensation voltage V Q Then the compensation voltage V is output continuously and constantly. Q Since the working state of the optical modulation chip is the optimal working point at this time, the corresponding output compensation voltage V Q , to ensure that the comparison voltage Vout reaches the second preset voltage V 预设 , so the compensation voltage V should be output continuously and constantly Q , it can be ensured that when the comparison voltage Vout reaches the second preset voltage V 预设 At this time, the working state of the optical modulation chip is at the optimal working point. At high or low temperatures, the output compensation voltage V Q , when the comparison voltage Vout output by the comparison circuit 900e is not the second preset voltage V 预设 When , it means that the working state of the optical modulation chip is not the optimal working point, then the bias voltage provided to the phase converter 900a5 is adjusted to change the first detection voltage V MPD1 , the second detection voltage V MPD2 The difference between them is adjusted to a preset difference, and then the comparison voltage is adjusted to a second preset voltage V 预设 , adjust the operating point of the optical modulator to the optimal operating point.

[0192] In some embodiments of the present application, for the same optical module, the compensation voltage V is continuously and constantly output in all temperature zones. Q Then, when the comparison voltage output by the comparison circuit 900e is not the second preset voltage, it means that the working state of the optical modulation chip is not the optimal working point. Then, the first detection voltage V is adjusted by adjusting the bias voltage provided to the phase converter 900a5. MPD1 , the second detection voltage V MPD2 The difference between them is adjusted to a preset difference, and then the comparison voltage is adjusted to a second preset voltage V 预设 , adjust the working point of the optical modulator to the optimal working point, thereby achieving continuous feedback control. For example, for the same optical module, the compensation voltage V Q Is a fixed value.

[0193] In some embodiments of the present application, for different optical modules, the compensation voltage V Q are different voltage values, and the second preset voltage V is the same voltage value.

[0194] In the present application, due to the inherent properties of the thin-film lithium niobate chip, the first MPD 900c1 and the second MPD 900d1 are externally placed on the thin-film lithium niobate chip, and the patch positions are random within a certain range. Therefore, the magnitude relationship between the first detection voltage and the second detection voltage cannot be guaranteed. The difference between the first detection voltage and the second detection voltage of the optical module may be positive or negative. On the premise of keeping the hardware structure unchanged, the compensation voltage is provided to the comparison circuit through the MCU, and the comparison voltage is monitored by the MCU from the software perspective, thereby saving production costs and improving production efficiency.

[0195] In this application, for the same optical module, the compensation voltage is maintained continuously and constantly output in different temperature zones, and the first detection voltage V is adjusted by adjusting the bias voltage provided to the phase converter. MPD1 , the second detection voltage V MPD2 The difference between them is adjusted to a preset difference, and then the comparison voltage is adjusted to a second preset voltage, and the operating point of the optical modulator is adjusted to an optimal operating point, thereby achieving continuous feedback control.

[0196] When an optical module is operating normally, the transmit optical power needs to be turned on and off. However, in a coherent optical module, for example, the light emitted by the laser is not only used to modulate the output transmit optical signal but also to balance detection with the received optical signal. Turning off the laser will affect the optical signal at the receiving end.

[0197] To solve the above problems, the embodiments of the present disclosure further provide an optical module and a method for turning on and off the transmitted optical power of the optical module.

[0198] FIG20 is a structural block diagram 1 of a circuit board in another optical module provided according to some embodiments of the present disclosure. As shown in FIG20 , the coherent optical component includes a coherent optical chip and an electrical chip. The coherent optical chip, the electrical chip and the circuit board are packaged to achieve signal transmission between the circuit board, the electrical chip and the coherent optical chip. The coherent optical chip has a local oscillator fiber coupling port, a receiving fiber coupling port and a transmitting fiber coupling port. The local oscillator fiber coupling port corresponds to the local oscillator optical component 401. The light generated by the light source is injected into the coherent optical chip through the local oscillator fiber coupling port. The coherent optical chip modulates the light inside to generate an optical signal. The optical signal is transmitted to the transmitting fiber coupler via the transmitting fiber coupling port. The transmitting fiber coupler couples the optical signal output by the coherent optical chip to the transmitting fiber, and then couples it to the optical fiber adapter via the transmitting fiber to achieve light emission.

[0199] The optical fiber adapter is connected to the receiving optical fiber coupler via the internal optical fiber, and the receiving optical fiber coupler is connected to the optical fiber inlet. In this way, the external optical signal transmitted by the optical fiber adapter is injected into the coherent optical chip via the receiving optical fiber, the receiving optical fiber coupler, and the receiving optical fiber coupling port. The coherent optical chip converts the optical signal into an electrical signal, which is then transmitted to the circuit board after passing through the amplifier device. The electrical signal is then transmitted to the host computer via the gold finger on the circuit board 300 to realize light reception.

[0200] In order to realize the control of the laser and coherent optical components, an MCU is also provided to control the laser, coherent optical components and DSP chip.

[0201] Figure 21 is a second structural block diagram on a circuit board in another optical module provided according to an embodiment of the present disclosure. Figure 22 is a third structural block diagram on a circuit board in another optical module provided according to an embodiment of the present disclosure. As shown in Figures 21 and 22, the coherent optical component also includes: an optical splitter, a coherent receiver, an optical modulator (also referred to as a coherent modulator) and an optical attenuator. The optical splitter divides the local oscillator light emitted by the laser into two beams, one of which enters the coherent modulator, which modulates the light to generate a modulated optical signal. The modulated optical signal is attenuated by the optical attenuator to generate a transmitted optical signal. The other beam of local oscillator light enters the coherent receiver, which also receives a received optical signal from the receiving optical fiber coupler, and performs balanced detection on the received optical signal and the local oscillator light to generate an electrical signal. The DSP is electrically connected to the coherent receiver to convert the electrical signal into a data signal.

[0202] The circuit board also houses an MCU, which includes multiple enable pins. The first enable pin is connected to the optical attenuator to switch power to the optical attenuator on and off. The second enable pin is connected to the coherent modulator to switch the coherent modulator's drive circuit on and off. The coherent drive circuit is connected to the coherent modulator to power the coherent modulator and provide a drive signal for the coherent modulator. The third enable pin is connected to the DSP chip to control the DSP chip's switching of the coherent modulator's modulation signal.

[0203] In coherent optical modules, when the transmit optical power is turned off, the receiving port must function normally and meet the timing requirements for turning the transmit optical power on and off. Typically, the timing requirements for turning the transmit optical power on and off are: the transmit optical power must drop below -30dBm in less than 100ms, and the transmit optical power must recover above -10dBm in less than 10ms.

[0204] To solve the above problems, the present application provides an optical module in which the MCU receives an instruction to turn off the transmitted optical power, the third enable pin outputs a first enable signal, controls the DSP chip to not send a modulation signal to the coherent modulator, and at the same time, the first enable pin outputs a first control signal to the optical attenuator, so that the attenuation value of the optical attenuator is maximized, and the optical power of the attenuated transmitted optical signal is lower than -30dbm. The MCU receives an instruction to turn on the transmitted optical power, the third enable pin outputs a second enable signal, controls the DSP chip to send a modulation signal to the coherent modulator, and at the same time, the first enable pin outputs a second control signal to the optical attenuator, so that the attenuation value of the optical attenuator is minimized. In this process, the MCU controls the driving signal of the coherent driving circuit so that the driving voltage of the coherent modulator is always at the optimal operating point.

[0205] In an embodiment of the present application, the MCU controls the drive signal of the coherent drive circuit so that the drive voltage of the coherent modulator is always at the optimal operating point. According to the operating principle of the coherent modulator, the optical power of the modulated optical signal is approximately -20dBm. After the MCU receives the instruction to shut down the transmitted optical power, it analyzes the instruction to shut down the transmitted optical power. The third enable pin outputs a first enable signal, controlling the DSP chip to not send the modulated signal to the coherent modulator. At the same time, the first enable pin outputs a first control signal to the optical attenuator, maximizing the attenuation value of the optical attenuator. In this application, the maximum attenuation value of the optical attenuator is 10dBm. Therefore, the optical power of the attenuated transmitted optical signal is less than -30dBm.

[0206] The MCU receives and interprets the command to turn on the transmitted optical power. The third enable pin outputs a second enable signal, controlling the DSP chip to send a modulation signal to the coherent modulator. Simultaneously, the first enable pin outputs a second control signal to the optical attenuator, minimizing the attenuation of the optical attenuator. This application uses the MCU to control the output of the DSP modulation signal and the attenuation of the optical attenuator to turn the transmitted optical power on and off. The entire control process, executed through the MCU's internal algorithm, takes less than 10ms, meeting system requirements.

[0207] The optical splitter splits the local oscillator light emitted by the laser into two beams. One beam enters the coherent modulator, which modulates the light to generate a modulated optical signal. The modulated optical signal is attenuated by the optical attenuator to generate the transmitted optical signal. The other local oscillator light beam enters the coherent receiver, which also receives the received optical signal from the receiving fiber coupler and performs balanced detection on the received optical signal and the local oscillator light to generate an electrical signal. The DSP is electrically connected to the coherent receiver and converts this electrical signal into a data signal.

[0208] The DSP is connected to the coherent modulator and sends a modulation signal to the coherent modulator. The coherent modulator receives the modulation signal and modulates the local oscillator light to generate a modulated optical signal. The modulated optical signal is then attenuated by the optical attenuator to generate a transmitted optical signal.

[0209] When the MCU receives a command to turn off the transmitted optical power, the third enable pin outputs a first enable signal, controlling the DSP chip to not send a modulated signal to the coherent modulator. Simultaneously, the first enable pin outputs a first control signal to the optical attenuator, maximizing the attenuation of the optical attenuator and reducing the optical power of the attenuated transmitted optical signal to less than -30 dBm. When the MCU receives a command to turn on the transmitted optical power, the third enable pin outputs a second enable signal, controlling the DSP chip to send a modulated signal to the coherent modulator. Simultaneously, the first enable pin outputs a second control signal to the optical attenuator, minimizing the attenuation of the optical attenuator.

[0210] In order to realize real-time modulation of the working voltage of the coherent modulator, Figure 23 is a fourth structural block diagram on the circuit board in another optical module provided according to an embodiment of the present disclosure. As shown in Figure 23, the coherent optical component provided by the present application also includes: a modulated optical power monitor and a transmitted optical power monitor, wherein the modulated optical power monitor is arranged between the coherent modulator and the optical attenuator, and is used to monitor the optical power of the modulated optical signal emitted by the coherent modulator. The transmitted optical power monitor is arranged at the optical outlet of the optical attenuator, and is used to monitor the optical power of the transmitted optical signal after attenuation by the optical attenuator. The MCU is provided with a first data pin and a second data pin, which are respectively connected to the modulated optical power monitor and the transmitted optical power monitor to receive the optical power of the modulated optical signal and the transmitted optical signal.

[0211] The MCU controls the voltage output from the second enable pin to the coherent drive circuit according to the optical power of the received modulated optical signal, and is used to control the output voltage of the coherent drive circuit to the coherent modulator, so that the operating voltage of the coherent modulator is always at the optimal operating point.

[0212] The MCU receives the optical power of the transmitted optical signal and controls the magnitude of the second control signal output by the first enable pin according to the optical power value of the transmitted optical signal, so as to control the optical attenuation value of the optical attenuator so that the optical power of the transmitted optical signal meets the communication requirements.

[0213] Specifically, a first analog-to-digital converter is provided between the first data pin and the modulated optical power monitor. The modulated optical power monitor converts the optical power of the modulated optical signal into an electrical signal. The analog-to-digital converter is used to convert the electrical signal into a data signal and transmit it to the MCU. The MCU stores the data signal and adjusts the output voltage of the second enable pin based on the data signal to control the output voltage of the coherent drive circuit, thereby optimizing the operating point of the coherent modulator.

[0214] A second analog-to-digital converter is provided between the second data pin and the transmitted optical power monitor. The modulated optical power monitor converts the optical power of the transmitted optical signal into an electrical signal. The second analog-to-digital converter converts the electrical signal into a data signal and transmits it to the MCU. The MCU stores the data signal and adjusts the output voltage of the first enable pin based on the data signal to control the attenuation value of the optical attenuator and the optical power of the transmitted optical signal.

[0215] In an embodiment of the present application, the MCU controls the drive signal of the coherent drive circuit so that the drive voltage of the coherent modulator is always at the optimal operating point. According to the operating principle of the coherent modulator, the optical power of the modulated optical signal is approximately -20dBm. After the MCU receives the instruction to shut down the transmitted optical power, it analyzes the instruction to shut down the transmitted optical power. The third enable pin outputs a first enable signal, controlling the DSP chip to not send the modulated signal to the coherent modulator. At the same time, the first enable pin outputs a first control signal to the optical attenuator, maximizing the attenuation value of the optical attenuator. In this application, the maximum attenuation value of the optical attenuator is 10dBm. The optical power of the attenuated transmitted optical signal is lower than -30dBm, achieving the purpose of shutting down the optical transmit optical power.

[0216] The present application also provides a method for turning on and off the transmitted optical power of an optical module, which is applicable to the MCU of a coherent optical module. The method receives an instruction to turn on the transmitted optical power, parses the instruction to turn on the transmitted optical power, controls the DSP chip not to output a modulation signal to the coherent optical modulator, and controls the optical attenuation value of the optical attenuator to be maximum. The method also receives an instruction to turn off the transmitted optical power, parses the instruction to transmit the optical ratio transmitted optical power, controls the DSP chip to output a modulation signal to the coherent optical modulator, and controls the optical attenuation value of the optical attenuator to be minimum.

[0217] In an embodiment of the present application, the optical module is a coherent optical module, which includes a local oscillator light source, a spectrometer, a coherent receiver, a coherent modulator and an optical attenuator. The spectrometer divides the local oscillator light emitted by the laser into two beams, one of which enters the coherent modulator, which modulates the light to generate a modulated optical signal. The modulated optical signal is attenuated by the optical attenuator to generate a transmitted optical signal. The other beam of local oscillator light enters the coherent receiver, which also receives the received optical signal from the receiving optical fiber coupler, and performs balanced detection on the received optical signal and the local oscillator light to generate an electrical signal. The DSP is electrically connected to the coherent receiver to convert the electrical signal into a data signal. An MCU is also provided on the circuit board, and the MCU includes multiple enable pins, wherein the first enable pin is connected to the optical attenuator for realizing the switch of power supply to the optical attenuator; the second enable pin is connected to the coherent modulator for realizing the switch of the driving circuit of the coherent modulator. The coherent driving circuit is connected to the coherent modulation to realize power supply to the coherent modulator and provide a driving signal for the coherent modulator; the third enable pin is connected to the DSP chip to control the switching of the modulation signal of the coherent modulator by the DSP chip.

[0218] When the MCU receives a command to turn off the transmitted optical power, the third enable pin outputs a first enable signal, controlling the DSP chip to not send a modulated signal to the coherent modulator. Simultaneously, the first enable pin outputs a first control signal to the optical attenuator, maximizing the attenuation of the optical attenuator and ensuring the optical power of the attenuated transmitted optical signal is below -30dBm. When the MCU receives a command to turn on the transmitted optical power, the third enable pin outputs a second enable signal, controlling the DSP chip to send a modulated signal to the coherent modulator. Simultaneously, the first enable pin outputs a second control signal to the optical attenuator, minimizing the attenuation of the optical attenuator. During this process, the MCU controls the drive signal of the coherent drive circuit, ensuring that the drive voltage of the coherent modulator remains at its optimal operating point.

[0219] In an embodiment of the present application, the MCU controls the drive signal of the coherent drive circuit so that the drive voltage of the coherent modulator is always at the optimal operating point. According to the operating principle of the coherent modulator, the optical power of the modulated optical signal is approximately -20dBm. After the MCU receives the instruction to shut down the transmitted optical power, it analyzes the instruction to shut down the transmitted optical power. The third enable pin outputs a first enable signal, controlling the DSP chip to not send the modulated signal to the coherent modulator. At the same time, the first enable pin outputs a first control signal to the optical attenuator, maximizing the attenuation value of the optical attenuator. In this application, the maximum attenuation value of the optical attenuator is 10dBm. Therefore, the optical power of the attenuated transmitted optical signal is less than -30dBm.

[0220] The MCU receives and interprets the command to turn on the transmitted optical power. The third enable pin outputs a second enable signal, controlling the DSP chip to send a modulation signal to the coherent modulator. Simultaneously, the first enable pin outputs a second control signal to the optical attenuator, minimizing the attenuation of the optical attenuator. This application uses the MCU to control the output of the DSP modulation signal and the attenuation of the optical attenuator to turn the transmitted optical power on and off. The entire control process, executed through the MCU's internal algorithm, takes less than 10ms, meeting system requirements.

[0221] The optical splitter splits the local oscillator light emitted by the laser into two beams. One beam enters the coherent modulator, which modulates the light to generate a modulated optical signal. The modulated optical signal is attenuated by the optical attenuator to generate the transmitted optical signal. The other local oscillator light beam enters the coherent receiver, which also receives the received optical signal from the receiving fiber coupler and performs balanced detection on the received optical signal and the local oscillator light to generate an electrical signal. The DSP is electrically connected to the coherent receiver and converts this electrical signal into a data signal.

[0222] The modulated optical power monitor is located between the coherent modulator and the optical attenuator to monitor the optical power of the modulated optical signal emitted by the coherent modulator. The transmitted optical power monitor is located at the optical output port of the optical attenuator to monitor the optical power of the transmitted optical signal after attenuation by the optical attenuator. The MCU has a first data pin and a second data pin connected to the modulated optical power monitor and the transmitted optical power monitor, respectively, to receive the optical power of the modulated optical signal and the transmitted optical signal.

[0223] The MCU controls the voltage output from the second enable pin to the coherent drive circuit according to the optical power of the received modulated optical signal, and is used to control the output voltage of the coherent drive circuit to the coherent modulator, so that the operating voltage of the coherent modulator is always at the optimal operating point.

[0224] The MCU receives the optical power of the transmitted optical signal and controls the magnitude of the second control signal output by the first enable pin according to the optical power value of the transmitted optical signal, so as to control the optical attenuation value of the optical attenuator so that the optical power of the transmitted optical signal meets the communication requirements.

[0225] Specifically, a first analog-to-digital converter is provided between the first data pin and the modulated optical power monitor. The modulated optical power monitor converts the optical power of the modulated optical signal into an electrical signal. The analog-to-digital converter is used to convert the electrical signal into a data signal and transmit it to the MCU. The MCU stores the data signal and adjusts the output voltage of the second enable pin based on the data signal to control the output voltage of the coherent drive circuit, thereby optimizing the operating point of the coherent modulator.

[0226] A second analog-to-digital converter is provided between the second data pin and the transmitted optical power monitor. The modulated optical power monitor converts the optical power of the transmitted optical signal into an electrical signal. The second analog-to-digital converter converts the electrical signal into a data signal and transmits it to the MCU. The MCU stores the data signal and adjusts the output voltage of the first enable pin based on the data signal to control the attenuation value of the optical attenuator and the optical power of the transmitted optical signal.

[0227] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: circuit boards; a light source electrically connected to the circuit board, the light source being configured to emit direct current light that does not carry data; an optical modulation chip electrically connected to the circuit board, the optical modulation chip comprising an optical modulator configured to modulate the direct current light not carrying data into an optical signal; the optical modulator comprising two interference arms; An optical power detection component is provided at least on the light-emitting side of the two interferometer arms and obtains a detection voltage; an MCU electrically connected to the circuit board, wherein the MCU is configured to adjust the detection voltage to a preset voltage; The method of adjusting the detection voltage to the preset voltage includes: a heater is provided on the two interference arms, and the heater is configured to change the refractive index of the interference arm; the MCU outputs a driving voltage to the heater, and the MCU is configured to receive the detection voltage and output a driving voltage to the heater when the detection voltage is not equal to a first preset voltage, and the preset voltage is equal to the first preset voltage; or, The method of adjusting the detection voltage to the preset voltage includes: the optical modulator includes a phase converter; the MCU is configured to receive a test voltage corresponding to the detection voltage, and when the test voltage is not equal to a second preset voltage, adjust the bias voltage provided to the phase converter, and the preset voltage corresponds to the second preset voltage.

2. The optical module according to claim 1, wherein: A phase shifter is provided on at least one of the interference arms, and the phase shifter and the heater are configured to change the refractive index of the interference arm; the MCU outputs a driving voltage to the phase shifter, and the MCU is configured to receive the detection voltage, and when the detection voltage is not equal to a first preset voltage, coarsely adjust the driving voltage output to the phase shifter, and finely adjust the driving voltage output to the heater.

3. The optical module according to claim 2, wherein: The power detection component includes: a first optical power detection component, disposed on one side of the interferometer arm, the first optical power detection component being configured to obtain a first sampling voltage according to the optical signal output by the interferometer arm; a second optical power detection component, disposed on one side of the other interferometer arm, the second optical power detection component being configured to obtain a second sampling voltage according to the optical signal output by the interferometer arm; The MCU is configured to receive the first sampling voltage and the second sampling voltage, and when the first sampling voltage and the second sampling voltage are not equal to a first preset voltage, adjust the driving voltage output to the phase shifter to coarsely adjust the first sampling voltage and / or the second sampling voltage; adjust the driving voltage output to the heater, wherein the adjustment voltage of the heater is less than the adjustment voltage of the phase shifter, to finely adjust the first sampling voltage and the second sampling voltage to adjust the first sampling voltage and the second sampling voltage to the first preset voltage; the detection voltage includes the first sampling voltage and the second sampling voltage.

4. The optical module according to claim 3, wherein: The light modulator further comprises: a first optical splitter configured to split the direct current light emitted by the light source and not carrying a signal into a first split light and a second split light in equal proportions; a first interferometer arm connected to the first beam splitter, wherein a first modulation electrode, a first phase shifter, and a first heater are provided on the first interferometer arm, wherein the first modulation electrode is configured to modulate the first beam splitting to obtain a first modulated beam splitting; the first phase shifter is electrically connected to the first heater and the MCU, and the first phase shifter and the first heater are configured to change the refractive index of the first interferometer arm; The second interferometer arm is connected to the first spectrometer, and a second modulation electrode and a second heater are provided on the second interferometer arm. The second modulation electrode is configured to modulate the second spectrometer to obtain a second modulated spectrometer; the second heater is electrically connected to the MCU, and the second heater is configured to heat or cool the second interferometer arm to change the refractive index of the second interferometer arm.

5. The optical module according to claim 3, wherein: The light modulator further comprises: a first optical splitter configured to split the direct current light emitted by the light source and not carrying a signal into a first split light and a second split light in equal proportions; a first interferometer arm connected to the first spectrometer, wherein a first modulation electrode and a first heater are provided on the first interferometer arm, wherein the first modulation electrode is configured to modulate the first spectroscopic light to obtain a first modulated spectroscopic light; and the first heater is electrically connected to the MCU, wherein the first heater is configured to heat or cool the first interferometer arm to change the refractive index of the first interferometer arm. The second interferometer arm is connected to the first spectrometer, and a second modulation electrode, a second phase shifter and a second heater are provided on the second interferometer arm. The second modulation electrode is configured to modulate the second spectrometer to obtain a second modulated spectrometer; the second phase shifter is electrically connected to the second heater and the MCU, and the second phase shifter and the second heater are configured to change the refractive index of the second interferometer arm.

6. The optical module according to claim 3, wherein: The light modulator further comprises: a first optical splitter configured to split the direct current light emitted by the light source and not carrying a signal into a first split light and a second split light in equal proportions; a first interferometer arm connected to the first beam splitter, wherein a first modulation electrode, a first phase shifter, and a first heater are provided on the first interferometer arm, wherein the first modulation electrode is configured to modulate the first beam splitting to obtain a first modulated beam splitting; the first phase shifter is electrically connected to the first heater and the MCU, and the first phase shifter and the first heater are configured to change the refractive index of the first interferometer arm; The second interferometer arm is connected to the first spectrometer, and a second modulation electrode, a second phase shifter and a second heater are provided on the second interferometer arm. The second modulation electrode is configured to modulate the second spectrometer to obtain a second modulated spectrometer; the second phase shifter is electrically connected to the second heater and the MCU, and the second phase shifter and the second heater are configured to change the refractive index of the second interferometer arm.

7. The optical module according to any one of claims 4 to 5, wherein: The light modulator further comprises: a second optical splitter connected to the first interferometer arm, the second optical splitter being configured to split the first modulated light into a first modulated light and a first monitoring light in different proportions, wherein an optical port outputting the first monitoring light is connected to the first optical power detection component; A third optical splitter is connected to the second interference arm, and the third optical splitter is configured to split the second modulated light into second modulated light and a second monitoring light, wherein an optical port outputting the second monitoring light is connected to the second optical power detection component; The combiner is configured to combine the first modulated light and the second modulated light, and couple the combined light into emission light.

8. The optical module according to claim 3, wherein: The MCU is further configured to generate a power response curve based on the first sampling voltage, the second sampling voltage, the driving voltage output to the phase shifter, and the driving voltage output to the heater; and when the power response curve is inconsistent with a preset power response curve, adjust the driving voltage output to the phase shifter to coarsely adjust the power response curve; and adjust the driving voltage output to the heater to fine-tune the power response curve.

9. The optical module according to claim 6, wherein: The MCU is further configured to, when the first sampling voltage is equal to the second sampling voltage and is not equal to the first preset voltage, output equal driving voltages to the first phase shifter and the second phase shifter, and output equal heating current signals to the first heater and the second heater, so that the adjusted first sampling voltage and the second sampling voltage are both equal to the first preset voltage.

10. The optical module according to claim 6, wherein: The MCU is further configured to, when the first sampling voltage is unequal to the second sampling voltage and is unequal to the first preset voltage, output unequal driving voltages to the first phase shifter and the second phase shifter, and output unequal heating current signals to the first heater and the second heater, so that the adjusted first sampling voltage and the second sampling voltage are both equal to the first preset voltage.

11. The optical module according to claim 1, wherein: The light modulation chip is a thin film lithium niobate chip, and the phase shifter is a piezoelectric crystal.

12. The optical module according to claim 3, wherein: When the MCU adjusts the first sampling voltage and the second sampling voltage to the first preset voltage, the optical modulator is at an optimal operating point.

13. The optical module according to claim 1, wherein the optical power detection component comprises: a first optical power detection component, which is provided outside the optical modulation chip and on the light input side of the optical modulator, wherein the detection voltage of the first optical power detection component is a first detection voltage; a second optical power detection component, disposed outside the optical modulation chip and on the light output side of the optical modulator, wherein the detection voltage of the second optical power detection component is a second detection voltage; wherein when the difference between the first detection voltage and the second detection voltage is a preset difference, the optical module is in a preset state, and the positive and negative values ​​of the difference corresponding to different optical modules are different; The optical module further includes: A comparison circuit, wherein a first input terminal receives the second detection voltage, and a second input terminal receives the first detection voltage and a compensation voltage output by the MCU; the comparison circuit is configured to output a comparison voltage based on the first detection voltage, the second detection voltage, and the compensation voltage; when the comparison voltage is a second preset voltage, the optical module is in a preset state; when the comparison voltage is a negative voltage, it cannot be monitored; The MCU is configured to input the compensation voltage into the comparison circuit when the optical module is in a preset state so that the comparison voltage is a non-negative voltage, while maintaining the output of the compensation voltage; and when monitoring that the comparison voltage is not equal to the second preset voltage, adjust the bias voltage provided to the phase converter so that the difference between the first detection voltage and the second detection voltage is a preset difference, thereby adjusting the comparison voltage to the second preset voltage, and the test voltage is equal to the comparison voltage.

14. The optical module according to claim 13, wherein: The MCU is configured as: When the optical module is in a preset state, if the comparison voltage cannot be monitored, a first compensation voltage is input to the comparison circuit to make the comparison voltage a non-negative voltage.

15. The optical module according to claim 13, wherein: The MCU is configured as: When the optical module is in a preset state, if the comparison voltage is monitored, a second compensation voltage is input to the comparison circuit.

16. The optical module according to claim 13, wherein: The optical modulation chip further includes: a first optical splitter configured to split the direct current light not carrying data emitted by the light source into modulated light and first monitoring light in different proportions, wherein an optical port outputting the first monitoring light is connected to the first optical power detection component; a second optical splitter, connected to the first optical splitter, and configured to split the modulated light into a first split light and a second split light of equal proportions; a first interferometer arm connected to the second beam splitter and configured to transmit the first split light; a second interferometer arm connected to the second beam splitter and configured to transmit the second beam split; The combiner is configured to combine the first split light and the second split light and couple them into transmitted light and second monitoring light, wherein the optical port outputting the second monitoring light is connected to the second optical power detection component.

17. The optical module according to claim 13, wherein: The first optical power detection component includes a first optical power detector and a first resistor; one end of the first optical power detector is electrically connected to a reference voltage, the other end is electrically connected to one end of the first resistor, and the other end of the first resistor is grounded; The second optical power detection component includes a second optical power detector and a second resistor; one end of the first optical power detector is electrically connected to a reference voltage, and the other end is electrically connected to one end of the second resistor, and the other end of the second resistor is grounded.

18. The optical module according to claim 13, wherein: A third resistor is provided between the output end of the second optical power detection component and the first input end of the comparison circuit, and the third resistor is a current limiting resistor.

19. The optical module according to claim 18, wherein: A fourth resistor is provided between the output end of the first optical power detection component and the second input end of the comparison circuit. The fourth resistor is a current limiting resistor. The fourth resistor is connected in parallel with the third resistor.

20. The optical module according to claim 19, wherein A fifth resistor is provided between the MCU output terminal and the second input terminal of the comparison circuit, and the fifth resistor is a current limiting resistor; the fifth resistor, the fourth resistor, and the third resistor are connected in parallel respectively.

21. The optical module according to claim 20, wherein: A sixth resistor is provided between the first input terminal of the comparison circuit and the output terminal of the comparison circuit; the sixth resistor is connected in parallel with the third resistor.

22. The optical module according to claim 13, wherein: When the optical module is in the preset state, the optical modulator is at an optimal working point.

23. The optical module according to claim 1, wherein The optical module further includes: an optical attenuator connected to the output end of the optical modulator, for attenuating the modulated optical signal to generate a transmitted optical signal; A DSP chip is connected to the optical modulator and outputs a modulated signal to the optical modulator; The MCU is connected to the DSP chip and the optical attenuator, and is configured to receive an instruction to turn off the transmitted optical power, output a first control signal to the optical attenuator, and simultaneously output a first enable signal to the DSP chip, wherein the first control signal controls the attenuation value of the optical attenuator to be maximum, and the first enable signal controls the DSP chip to not output a modulated signal to the optical modulator; The MCU receives an instruction to turn on the transmitted optical power, outputs a second control signal to the optical attenuator, and simultaneously outputs an enable signal to the DSP chip. The enable signal controls the DSP to output a modulated signal to the optical modulator, and the second control signal controls the attenuation value of the attenuator to be the minimum attenuation value.

24. The optical module according to claim 23, wherein: The optical module further includes: a modulated optical signal power monitor, disposed between the optical modulator and the optical attenuator, for monitoring the optical power of the modulated optical signal; a coherent driving circuit, connected to the optical modulator and configured to supply power to the optical modulator; The MCU is connected to the modulated optical signal power monitor and the coherent driving circuit, and adjusts the voltage to the coherent driving circuit according to the optical power of the modulated optical signal, so as to control the output voltage of the coherent driving circuit.

25. The optical module according to claim 24, wherein: The MCU is provided with a first enable pin connected to the optical attenuator; a second enable pin connected to the coherent drive circuit; The third enable pin is connected to the DSP.

26. The optical module according to claim 23, wherein The optical module further comprises: a transmitted optical signal power monitor, which is arranged at the output end of the optical attenuator and is used to monitor the optical power of the transmitted optical signal; The MCU is connected to the modulated optical signal power monitor and the coherent driving circuit, and adjusts the voltage to the coherent driving circuit according to the optical power of the modulated optical signal, so as to control the output voltage of the coherent driving circuit.

27. The optical module according to claim 24, wherein: The optical module further includes: a first analog-to-digital converter, which is arranged between the modulated optical signal power monitor and the MCU.

28. The optical module according to claim 26, wherein: The optical module further includes: a second analog-to-digital converter, which is arranged between the transmitted optical signal power monitor and the MCU.

29. The optical module according to claim 23, wherein The optical module further comprises: a receiving optical fiber adapter connected to an external optical fiber for receiving an optical signal; The coherent receiver is connected to the light source and the receiving optical fiber adapter, receives the received optical signal and the light emitted by the light source, and performs balanced detection to convert the optical signal into an electrical signal.

30. The optical module according to claim 29, wherein The DSP is connected to the coherent receiver and is used to convert the electrical signal of the coherent receiver into a data signal.

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