Chemical mechanical automatic polishing device for semiconductor

Abstract

The invention relates to the technical field of chemical mechanical polishing, in particular to a semiconductor chemical mechanical automatic polishing device which comprises a polishing table arranged in CMP equipment, the polishing table comprises a polishing belt, the polishing belt is arranged in a closed-loop equilateral triangle shape, the top end face of the polishing belt is horizontally arranged, and the polishing belt is arranged on the polishing table. And rollers I are sleeved in three corners of the grinding belt. According to the chemical mechanical grinding equipment, the grinding table with the equilateral triangle appearance is adopted, the equilateral triangle conveying belt structural layout of the grinding belt replaces a traditional flatly-arranged round grinding pad, the other two side faces of the grinding belt can be synchronously cleaned in the grinding process, the water consumption is greatly reduced, the cleaning time is greatly shortened, and the grinding efficiency is improved. According to the grinding pad, a clean grinding surface is provided for a grinding table in time, traditional washing waiting time is saved, residues on the surface of the wafer can be rapidly and safely removed, and high working efficiency which is not achieved by traditional horizontal laying of a single grinding pad is brought to grinding and cleaning of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a semiconductor chemical mechanical automatic polishing device. Background Art

[0002] The chemical mechanical rough grinding equipment for wafers is generally composed of the following parts: a robotic arm that picks up and drives the wafer to rotate and grind on the grinding pad, a platform that supports the grinding pad, a spray device that provides abrasives, and a cleaning device that cleans the grinding pad and wafer.

[0003] The wafer grinding process needs to be performed multiple times, gradually transitioning from coarse grinding to fine grinding. During the grinding process, the components ground off the wafer will become impurities and fill the gaps in the grinding pad, reducing the rough grinding efficiency. Therefore, the cleaning work between different grinding stages is very important. The cleaning method is generally to rinse or rinse while lightly grinding the wafer so as to remove the tiny impurity particles sticking to the wafer while cleaning the grinding pad. However, due to the thin and brittle wafers and the porous physical properties of the grinding pad, the rinsing effect of existing chemical mechanical polishing equipment is not ideal, and often requires a long rinsing time and consumes a lot of water resources. Therefore, in order to shorten the cleaning time in the wafer grinding process of existing chemical mechanical polishing equipment, improve production efficiency, and reduce water consumption, so as to make the equipment more energy-saving and environmentally friendly, a semiconductor chemical mechanical automatic polishing device is proposed. Summary of the invention

[0004] In view of the above-mentioned problems or the problems in the prior art of long flushing time and large water consumption of the existing chemical mechanical polishing equipment, the present invention is proposed.

[0005] Therefore, an object of the present invention is to provide a semiconductor chemical mechanical automatic polishing device.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a semiconductor chemical mechanical automatic polishing device, comprising a grinding table arranged in a CMP device, the grinding table comprising a grinding belt, the grinding belt is arranged in a closed-loop equilateral triangle, the top surface of the grinding belt is arranged horizontally, and a roller 1 is sleeved in the three corners of the grinding belt, and both sides of the grinding belt are matched with equilateral triangle frames, the rollers 1 are parallel to each other, and the two ends of the rollers 1 are rotatably connected to the corners of the frame; the bottom end of the grinding belt is provided with a roller 2, and the roller 2 is parallel to the adjacent roller 1 to clamp the grinding belt, and the two ends of the roller 2 are provided with brackets, and the top of the bracket is provided with a bracket. The ends are slidably connected to the bottom ends of the adjacent frames, and the sliding directions of the two brackets are arranged in opposite upward directions, and the two brackets are symmetrically arranged about roller 2; belts are arranged on the sides of the two frames at diagonal positions, and the belts are parallel to the sides of the frames where they are located, and the bottom ends of the two belts are respectively wrapped around the two ends of the rotating shaft of the lowest roller one, and the top ends of the two belts are wrapped around the rotating shaft of the high-position roller one corresponding to their positions, and a slide is slidably connected between the two frames, and the two slides are distributed on both sides of the frame, and the sliding path of the slide is parallel to the adjacent belts, the slide is fixedly connected to the belt, and the two slides are respectively clamped with a flushing nozzle and an air-drying nozzle.

[0007] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, a flat plate is fixedly connected to the top of the two frames, and the edge of the flat plate is embedded with the top of the frame, and the flat plate is horizontally attached to the inner side of the top surface of the grinding belt.

[0008] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: the roller one and its rotating shaft rotate freely, and the roller two and its rotating shaft are fixedly sleeved, and the rotating shaft and frame of the roller one, and the rotating shaft and the bracket of the roller two are connected through bearings, and pulleys are provided at both ends of the belt to connect with the rotating shaft of the roller one, and the pulleys are fixedly sleeved with the rotating shaft of the roller one.

[0009] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, the positions of the rotating shaft of roller one, the frame and the bearing therebetween are relatively fixed, the rotating shaft of roller two is slidably plugged into the corresponding bearing, a cover plate is provided on the side away from each other of the two brackets, and a nut is provided on the side away from the bracket, and the nut is threadedly fastened to the rotating shaft of roller two.

[0010] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, a slider is integrally provided at the top of the bracket, and a dovetail groove is provided at the bottom of the frame, and the slider is matched and slidably connected with the dovetail groove.

[0011] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: a mounting seat is fixedly connected to the bottom of the side of the frame away from the grinding belt, and the side shape of the mounting seat is F-shaped, and two motors are arranged on the side of the mounting seat away from the frame with a height difference, the output shaft of the motor at the high position is coaxially connected to the rotating shaft of the adjacent roller one, and the output shaft of the motor at the low position is connected to the rotating shaft of the adjacent roller two.

[0012] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, the rotating shaft of the roller one is connected to the motor output shaft through a rigid coupling, and the rotating shaft of the roller two is connected to the motor output shaft through a flexible coupling.

[0013] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: both ends of the slide are slidably connected with slide rails, the slide rails are fixedly connected to the edges of their adjacent frames, and two contact positions are arranged between the ends of the slide and the slide rails, when one of the two slides is at the upper dead point of the stroke, the other slide is at the lower dead point of the stroke.

[0014] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, an equilateral triangle inner frame is arranged inside the frame, and the triangles of the inner frame are respectively fixedly connected to the midpoints of the three sides of the frame, and a crossbeam is also fixedly connected between the two inner frames.

[0015] As a preferred solution of the semiconductor chemical mechanical automatic polishing device of the present invention, wherein: both ends of an inner wall of the inner frame are hinged with conduits, the two ends of the conduits are trumpet-shaped, and the two conduits are respectively connected to the connecting pipes of the rinsing nozzle and the air-drying nozzle, and the rinsing nozzle and the air-drying nozzle are both perpendicular to the belt wall of the adjacent grinding belt.

[0016] The beneficial effects of the semiconductor chemical mechanical automatic polishing device of the present invention are as follows: the chemical mechanical polishing equipment adopts a grinding table with an equilateral triangle appearance, and the equilateral triangle conveyor belt structure layout of the grinding belt replaces the traditional flat circular grinding pad. In addition to realizing conventional grinding operations, the other two sides of the grinding belt can be cleaned simultaneously during the grinding process, and the flexible nozzle arrangement and the back-reciprocating sweeping and flushing method not only greatly reduce the water consumption, but also greatly shorten the cleaning time, provide a clean grinding surface for the grinding table in time, and save the traditional flushing waiting time. The grinding belt continuously runs in the same direction and cooperates with the flushing operation, and can also quickly and safely remove the residue on the surface of the wafer, bringing powerful work efficiency to the grinding and cleaning of the wafer that is not available with the traditional horizontally laid single grinding pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor chemical mechanical automatic polishing device.

[0019] Figure 2 This is a schematic diagram of the grinding table structure of a semiconductor chemical mechanical automatic polishing device.

[0020] Figure 3 for Figure 2 Schematic diagram of the structure after cutting the grinding belt.

[0021] Figure 4 for Figure 3 Exploded view of the local structure after the grinding belt is removed.

[0022] Figure 5 for Figure 4 A magnified view of the structure at center.

[0023] Figure 6 for Figure 4 A magnified view of the structure at point B.

[0024] Figure 7 for Figure 3 Cross-sectional view of local structure.

[0025] Figure 8 for Figure 7 Enlarged view of the structure at C in the middle.

[0026] Fig. 9 for Figure 7 Enlarged view of the structure at D in the middle.

[0027] Fig.10 The present invention is a cross-sectional view of the assembly structure between the nozzle and the slide of a semiconductor chemical mechanical automatic polishing device.

[0028] Fig.11 for Figure 2 Enlarged view of the structure at E in the middle.

[0029] Fig.12 for Fig.11 Structural section of .

[0030] Fig.13 for Fig.11 Structural breakdown diagram.

[0031] Fig.14The present invention is a schematic diagram of the gap adjustment structure between roller 2 and roller 1 of a semiconductor chemical mechanical automatic polishing device.

[0032] In the figure: 100, CMP equipment; 200, grinding table; 201, grinding belt; 202, roller one; 203, frame; 204, roller two; 205, bracket; 206, belt; 207, pulley; 208, slide; 209, rinse nozzle; 210, air drying nozzle; 211, flat plate; 212, cover plate; 213, nut; 214, slide rail; 215, inner frame; 216, crossbeam; 217, guide tube; 203a, dovetail slide; 205a, slider; 300, motor; 301, mounting seat. DETAILED DESCRIPTION

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0034] Example, see Figure 1 to Figure 14 , which is the first embodiment of the present invention, provides a semiconductor chemical mechanical automatic polishing device, which can quickly provide clean grinding conditions for the next stage of chemical mechanical polishing by cyclic cleaning pretreatment of the grinding belt 201, and quickly and safely clean the wafer after the grinding is completed, such as Figure 1 As shown, it includes a grinding table 200 disposed in a CMP device 100, such as Figure 2 and Figure 3 As shown, the grinding table 200 includes a grinding belt 201, and the grinding belt 201 is arranged in a closed equilateral triangle. The top surface of the grinding belt 201 is arranged horizontally, and the three corners of the grinding belt 201 are sleeved with rollers 202. Both sides of the grinding belt 201 are matched with equilateral triangle frames 203. The rollers 202 are parallel to each other, and the two ends of the roller 202 are rotatably connected to the corners of the frame 203; Figure 2 and Fig.11 As shown, a second roller 204 is disposed at the bottom end of the grinding belt 201, and the second roller 204 and the adjacent first roller 202 are parallel to clamp the grinding belt 201, as shown in FIG. Fig.12 and Fig.13 As shown, brackets 205 are provided at both ends of the second roller 204, the top of the bracket 205 is slidably connected to the bottom of the adjacent frame 203, and the sliding directions of the two brackets 205 are arranged in opposite oblique directions, and the two brackets 205 are symmetrically arranged about the second roller 204; Figure 7 As shown, belts 206 are provided on the diagonally opposite sides of the two frames 203, and the belts 206 are parallel to the sides of the frames 203 where they are located. Figure 8 and Fig. 9As shown, the bottom ends of the two belts 206 are respectively connected to the two ends of the rotating shaft of the lowest roller 202, and the top ends of the two belts 206 are connected to the rotating shaft of the high roller 202 corresponding to their positions. A slide 208 is slidably connected between the two frames 203. The two slides 208 are distributed on both sides of the frame 203, and the sliding path of the slide 208 is parallel to the adjacent belt 206. The slide 208 is fixedly connected to the belt 206, as shown in FIG. Fig.10 As shown, the two slides 208 are respectively clamped with a rinsing nozzle 209 and an air-drying nozzle 210 , and the rinsing nozzle 209 and the air-drying nozzle 210 are both perpendicular to the belt wall of the adjacent grinding belt 201 .

[0035] Specifically, Figure 4 and Figure 5 As shown, the tops of the two frames 203 are fixedly connected with a flat plate 211, and the edge of the flat plate 211 is embedded with the top of the frame 203, as shown in FIG. Figure 3 As shown, the flat plate 211 is horizontally attached to the inner side of the top surface of the grinding belt 201, as shown in FIG. Fig.13 As shown, the rotating shaft of the first roller 202 and the frame 203, and the rotating shaft of the second roller 204 and the bracket 205 are connected by bearings. The top of the bracket 205 is integrally provided with a slider 205a, and the bottom of the frame 203 is provided with a dovetail groove 203a. The slider 205a is matched and slidably connected with the dovetail groove 203a. Fig.11 As shown, both ends of the belt 206 are provided with pulleys 207 connected to the rotating shaft of the roller 1 202, and the pulley 207 is fixedly sleeved with the rotating shaft of the roller 1 202, and the roller 1 202 and its rotating shaft are freely rotated, and the positions of the rotating shaft of the roller 1 202, the frame 203 and the bearing therebetween are relatively fixed, and the rotating shaft of the roller 204 is slidably plugged with its corresponding bearing, and the two brackets 205 are provided with a cover plate 212 on the side away from each other, and a nut 213 is provided on the side of the cover plate 212 away from the bracket 205, and the nut 213 is threadedly fastened to the rotating shaft of the roller 204.

[0036] like Fig.11 and Fig.13 As shown, a mounting base 301 is fixedly connected to the bottom of the side of the frame 203 away from the grinding belt 201, and the side shape of the mounting base 301 is F-shaped, and two motors 300 are arranged on the side of the mounting base 301 away from the frame 203 with a height difference, the output shaft of the motor 300 located at the high position is coaxially connected with the rotating shaft of the adjacent roller 1 202, and the output shaft of the motor 300 located at the low position is connected with the rotating shaft of the adjacent roller 2 204, the rotating shaft of the roller 1 202 and the output shaft of the motor 300 are connected by a rigid coupling, and the rotating shaft of the roller 2 204 and the output shaft of the motor 300 are connected by a flexible coupling.

[0037] like Figure 8 and Fig. 9 As shown, both ends of the slide 208 are slidably connected to the slide rails 214, and the slide rails 214 are fixedly connected to the edges of the adjacent frame 203, and two contact positions are set between the ends of the slide 208 and the slide rails 214. When one of the two slides 208 is at the upper dead point of the stroke, the other slide 208 is at the lower dead point of the stroke, as shown in FIG. Figure 3 As shown, an equilateral triangle inner frame 215 is provided in the frame 203, and the triangles of the inner frame 215 are fixedly connected to the midpoints of the three sides of the frame 203, and a crossbeam 216 is fixedly connected between the two inner frames 215. Figure 6 As shown, both ends of an inner wall of the inner frame 215 are hinged with conduits 217, both ends of the conduit 217 are trumpet-shaped, and the two conduits 217 are respectively connected to the connecting pipes of the flushing nozzle 209 and the air-drying nozzle 210.

[0038] The working principle and advantages of the device are further explained in combination with the prior art: the grinding tables 200 of the currently used chemical mechanical grinding equipment have a significant commonality, that is, the table tops of their grinding tables 200 are usually circular, and the circular grinding pads are laid flat on the grinding table 200 for use, and the grinding pads, especially the coarse grinding pads, have a large number of tiny pores, which determine the grinding accuracy of the grinding pads and can absorb and hold abrasives. The tiny pores after grinding are easily filled with impurity particles ground out, resulting in changes in the surface roughness of the grinding pads, resulting in reduced work efficiency of the re-grinding, and other problems. Moreover, since the working surface is vertically facing upward, the efficiency of cleaning the grinding pads by traditional rinsing methods is very low, thereby consuming a large amount of water.

[0039] The present invention provides a semiconductor chemical mechanical automatic polishing device, wherein a grinding table 200 is mainly provided. The grinding table 200 is similar to a conveyor belt structure, and adopts a grinding belt 201 instead of a conventional circular grinding pad. The running route of the grinding belt 201 is an equilateral triangle, and the top surface is arranged horizontally, so that the triangular top surface of the grinding belt 201 can be used for conventional grinding operations, and the other two side surfaces of the grinding belt 201 can be cleaned synchronously during the grinding process. Different from the conventional chemical mechanical polishing pad, which washes toward the grinding surface, the washing direction of the present invention is to wash the grinding belt 201. 1. The back side of the grinding surface is rinsed, which can remove impurities in the grinding belt 201 more quickly and thoroughly, so the cleaning time will be greatly shortened. A further benefit of shortening the cleaning time is that the grinding table 200 has prepared a clean grinding surface for use before the ongoing grinding operation is completed. In addition, for the residue on the surface of the wafer after grinding, the grinding belt 201 can be continuously moved in one direction, and the residue on the surface of the wafer can be wiped off with the clean side of the grinding belt 201. This brings powerful work efficiency to the grinding and cleaning of the wafer that is not available in the traditional horizontally laid single grinding pad.

[0040] To achieve the above-mentioned objective functions, the present invention also has the following technical details:

[0041] First, the driving method of the grinding belt 201 and the cleaning structure of the chemical mechanical grinding device is as follows: Fig.11 As shown, the roller 1 202 of the device can rotate freely relative to its rotating shaft, and the rotating shafts of the roller 1 202 and the roller 2 204 are connected by bearings and can rotate freely relative to the frame 203 or the bracket 205. Therefore, when the grinding table 200 drives the roller 2 204 to rotate through the motor 300, the roller 204 drives the grinding belt 201 to run by squeezing the roller 1 202 to clamp the grinding belt 201. At the same time, the belt 206 connected to the rotating shaft of the roller 1 202 and the slide 208 connected to the belt 206 and other cleaning function-related components are not affected by the operation of the grinding belt 201, and the two operate independently of each other.

[0042] When another motor 300 drives the shaft of the drum 1 202 to rotate, the shaft of the drum 1 202 drives the pulley 207 and the belt 206 to run. The two belts 206 are arranged in a V-shaped angle, such as Figure 7 As shown, the side where the two belts 206 are close to each other or the side where the two belts 206 are away from each other have opposite running directions. Therefore, when the side where the belts 206 are close to each other (or the side where they are away from each other) are connected to the carriage 208, one of the carriages 208 will rise and the other carriage 208 will fall. The advantages of such a movement layout are: first, the carriage 208 and the nozzle on the carriage 208 always run close to the inner wall of the grinding belt 201 with a stable spacing, bringing a stable washing or air-drying effect; second, the lifting directions of the two carriages 208 are opposite, which can offset the gravity effect, reduce the difficulty of transmission and driving, and manifest as lower energy consumption of the motor 300;

[0043] Secondly, the grinding table 200 of the chemical mechanical grinding equipment, wherein the gap between the second roller 204 and the first roller 202 is adjusted, and the gap adjustment between the second roller 204 and the first roller 202 is very important. The gap adjustment needs to achieve two purposes: one is to squeeze and roll, thereby driving the operation of the grinding belt 201; the other is to locally squeeze the grinding belt 201, so that the grinding belt 201 is squeezed to temporarily compact the internal pores, and the residual water of the rinse is squeezed out, thereby greatly reducing the difficulty of the subsequent air drying. When the surface attachment of the wafer is wiped off by the continuous operation of the grinding belt 201, the water flushing also plays a role in quickly squeezing out the dirt (suitable for use when the grinding belt 201 uses a low hardness and flexible grinding material). Fig.14As shown, the brackets 205 of the rotating shafts at both ends of the roller 204 are integrally provided with an inclined slider 205a, and the angle between the two sliders 205a is inverted V shape. When the nut 213 is tightened by the relative rotating shaft, the nut 213 will squeeze the bracket 205 toward the roller 204 through the cover plate 212 (because the nut 213 is small in size, in order to avoid the nut 213 directly squeezing the side of the bearing and causing damage), and the distance between the two brackets 205 will be reduced, which will cause the two sliders 205a to slide and rise along the dovetail groove 203a at the bottom of the frame 203, while driving the bracket 205 and the roller 204 to rise, and continuously reducing the distance between the two brackets 205, until the roller 204 rises and contacts the grinding belt 201, and is squeezed to a suitable pressure, and the adjusted position is fixed by the anti-loosening method of the double nut 213;

[0044] Since the sliding directions of the slider 205a and the dovetail groove 203a are determined, the sleeve connection direction of the bracket 205 and the roller shaft of the second roller 204 is unique. This makes it possible for the two sliders 205a to move synchronously to achieve the lifting and lowering adjustment of the rollers when the machining and assembly accuracy of the parts meet the requirements (parallelism of the first roller 202 and the second roller 204), thereby avoiding the non-parallelism of the first roller 202 and the second roller 204 caused by the adjustment position difference at both ends, and avoiding the uneven pressure of the second roller 204 and the first roller 202 on the grinding belt 201;

[0045] It should be noted that, since the position of the motor 300 is fixed relative to the frame 203, and the height of the second roller 204 is adjustable, a flexible connector should be used to connect the second roller 204 and its corresponding output shaft of the motor 300.

[0046] Thirdly, the grinding table 200 of the chemical mechanical grinding equipment has a frame structure composed of two equilateral triangle frames 203, a square plate 211 and a crossbeam 216, wherein a small equilateral triangle inner frame 215 is connected to the inside of the frame 203, and the inner frame 215 divides the area surrounded by the frame 203 into four equilateral triangles, so that the structural strength of the frame 203 is greatly increased, and the platform and the crossbeam 216 are responsible for the lateral connection between the two frames 203, and the side width of the platform is greater than the width of the crossbeam 216, so that the platform, the crossbeam 216, the frame 203 and the inner frame 215 construct a shape close to a trapezoid, so that the overall structure of the grinding table 200 has high rigidity and stability;

[0047] Fourth, Figure 7 Taking the air-drying nozzle 210 as an example, the clamping assembly structure between the air-drying nozzle 210 and the slide 208 is shown. The flushing nozzle 209 is assembled in the same way. Within the installation space allowed by the slide 208, the number of the air-drying nozzle 210 and the flushing nozzle 209 can be increased or decreased as needed, and the spacing between the nozzles can be flexibly adjusted by sliding;

[0048] Figure 6 The bell-mouthed conduit 217 is shown. The conduit 217 can be deflected in a small range and is used to pass through an air pipe or a water pipe when the nozzle moves with the slide 208, so as to achieve the purpose of converging and reducing scratches.

[0049] In summary, the chemical mechanical polishing equipment adopts a grinding table 200 with an equilateral triangle appearance, and its grinding belt 201 has an equilateral triangle conveyor belt structure layout instead of the traditional flat circular grinding pad. In addition to realizing conventional grinding operations, the other two sides of the grinding belt 201 can be cleaned simultaneously during the grinding process, and the flexible nozzle arrangement and the back-reciprocating sweeping and flushing method not only greatly reduce the water consumption, but also greatly shorten the cleaning time, and provide a clean grinding surface for the grinding table 200 in time, eliminating the traditional flushing waiting time, and the grinding belt 201 continuously runs in the direction and cooperates with the flushing operation, which can also quickly and safely remove the residue on the surface of the wafer, bringing powerful work efficiency to the grinding and cleaning of the wafer that the traditional horizontally laid single grinding pad does not have.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A semiconductor chemical mechanical automatic polishing device, characterized in that: The invention comprises a grinding table (200) arranged in a CMP device (100), wherein the grinding table (200) comprises a grinding belt (201), wherein the grinding belt (201) is arranged in a closed-loop equilateral triangle, wherein the top surface of the grinding belt (201) is arranged horizontally, and a roller (202) is sleeved in three corners of the grinding belt (201), and both sides of the grinding belt (201) are matched with a frame (203) in the form of an equilateral triangle, wherein the rollers (202) are parallel to each other, and the two ends of the roller (202) are rotatably connected to the corners of the frame (203); A second roller (204) is arranged at the bottom end of the grinding belt (201), and the second roller (204) and the adjacent first roller (202) are parallel to clamp the grinding belt (201), and brackets (205) are arranged at both ends of the second roller (204), and the top of the bracket (205) is slidably connected to the bottom of the adjacent frame (203), and the sliding directions of the two brackets (205) are arranged in opposite oblique upward directions, and the two brackets (205) are symmetrically arranged with respect to the second roller (204); Belts (206) are arranged on the diagonally opposite sides of the two frames (203); the belts (206) are parallel to the sides of the frames (203) where they are located; the bottom ends of the two belts (206) are respectively connected to the two ends of the rotating shaft of the lowest roller (202); the top ends of the two belts (206) are connected to the rotating shaft of the high roller (202) corresponding to their positions; a slide (208) is slidably connected between the two frames (203); the two slides (208) are distributed on both sides of the frames (203); and the sliding path of the slide (208) is parallel to the adjacent belt (206); the slide (208) is fixedly connected to the belt (206); and the two slides (208) are respectively connected to a flushing nozzle (209) and an air-drying nozzle (210).

2. The semiconductor chemical mechanical automatic polishing device according to claim 1, characterized in that: A flat plate (211) is fixedly connected to the top of the two frames (203), and the edge of the flat plate (211) is embedded with the top of the frame (203), and the flat plate (211) is horizontally attached to the inner side of the top surface of the grinding belt (201).

3. The semiconductor chemical mechanical automatic polishing device according to claim 2, characterized in that: The roller one (202) and its rotating shaft are freely rotatable, and the roller two (204) and its rotating shaft are fixedly sleeved, and the rotating shaft of the roller one (202) and the frame (203), and the rotating shaft of the roller two (204) and the bracket (205) are all connected via bearings, and pulleys (207) are provided at both ends of the belt (206) to be connected to the rotating shaft of the roller one (202), and the pulleys (207) are fixedly sleeved to the rotating shaft of the roller one (202).

4. The semiconductor chemical mechanical automatic polishing device according to claim 3, characterized in that: The positions of the rotating shaft of the first roller (202), the frame (203) and the bearing therebetween are relatively fixed; the rotating shaft of the second roller (204) is slidably plugged into the corresponding bearing; a cover plate (212) is provided on the side away from each other of the two brackets (205); and a nut (213) is provided on the side away from the bracket (205); the nut (213) is threadedly fastened to the rotating shaft of the second roller (204).

5. The semiconductor chemical mechanical automatic polishing device according to claim 4, characterized in that: The top end of the bracket (205) is integrally provided with a slider (205a), and the bottom end of the frame (203) is provided with a dovetail slide groove (203a), and the slider (205a) is matched and slidably connected with the dovetail slide groove (203a).

6. The semiconductor chemical mechanical automatic polishing device according to claim 5, characterized in that: A mounting seat (301) is fixedly connected to the bottom of a side of the frame (203) away from the grinding belt (201), and the side shape of the mounting seat (301) is F-shaped. Two motors (300) are arranged at a height difference on the side of the mounting seat (301) away from the frame (203), the output shaft of the motor (300) located at the higher position is coaxially connected to the rotating shaft of the adjacent roller one (202), and the output shaft of the motor (300) located at the lower position is connected to the rotating shaft of the adjacent roller two (204).

7. The semiconductor chemical mechanical automatic polishing device according to claim 6, characterized in that: The rotating shaft of the first roller (202) is connected to the output shaft of the motor (300) via a rigid coupling, and the rotating shaft of the second roller (204) is connected to the output shaft of the motor (300) via a flexible coupling.

8. The semiconductor chemical mechanical automatic polishing device according to claim 1, characterized in that: Both ends of the slide (208) are slidably connected to slide rails (214), the slide rails (214) are fixedly connected to the edges of the adjacent frames (203), and two contact positions are arranged between the ends of the slide (208) and the slide rails (214), and when one of the two slides (208) is at the upper dead point of the travel, the other slide (208) is at the lower dead point of the travel.

9. The semiconductor chemical mechanical automatic polishing device according to claim 8, characterized in that: An equilateral triangle inner frame (215) is arranged inside the frame (203), and the triangles of the inner frame (215) are respectively fixedly connected to the midpoints of the three sides of the frame (203), and a crossbeam (216) is also fixedly connected between the two inner frames (215).

10. The semiconductor chemical mechanical automatic polishing device according to claim 9, characterized in that: Both ends of an inner wall of the inner frame (215) are hinged with a conduit (217), the two ends of the conduit (217) are trumpet-shaped, and the two conduits (217) are respectively connected to the connecting pipes of the flushing nozzle (209) and the air-drying nozzle (210), and the flushing nozzle (209) and the air-drying nozzle (210) are both perpendicular to the belt wall of the adjacent grinding belt (201).

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