Wafer bearing structure and wafer processing device

Abstract

The invention relates to a wafer bearing structure and a wafer processing device, and the wafer bearing structure comprises a bearing disc which is provided with a bearing area and an edge area located at the periphery of the bearing area; the plurality of lifting thimbles are arranged in the bearing area in a lifting manner; the plurality of fixed thimbles are annularly distributed in the edge area, and a bearing area for bearing a wafer is limited by the plurality of fixed thimbles; in the radial direction of the fixed ejector pin, the fixed ejector pin comprises an inner-layer structure and an outer-layer structure which are arranged together in a sleeved mode, and the outer-layer structure is rotatably connected with the inner-layer structure through a rotary connecting piece. The fixed ejector pin comprises an inner layer structure and an outer layer structure which are arranged in a sleeving manner, and the outer layer structure is rotatably connected with the inner layer structure through the rotary connecting piece, so that when the wafer is unloaded, if the wafer deviates and is in contact with the fixed ejector pin, the outer layer structure is stressed to freely rotate, and the friction force between the outer layer structure and the wafer is reduced; unloading abnormity is avoided, damage to the wafer is avoided, and the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product manufacturing, and in particular to a wafer bearing structure and a wafer processing device. Background Art

[0002] In the field of silicon wafer edge polishing, FP equipment (final polishing machine) will occasionally experience unloading abnormalities when unloading wafers (wafers, also called silicon wafers). When the wafer is offset during unloading, there is a large friction between it and the fixed pin (ejector pin), which affects the free fall of the wafer, causing the wafer unloading failure and unloading jamming, resulting in abnormal wafer quality. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a wafer supporting structure and a wafer processing device to solve the problem of unloading failure caused by the friction between the wafer and the fixed ejector pins when the wafer is offset during unloading.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: a wafer supporting structure, comprising:

[0005] A carrying plate, comprising a carrying area and an edge area located at the periphery of the carrying area;

[0006] A plurality of lifting pins are arranged in the bearing area in a liftable manner;

[0007] A plurality of fixed ejector pins are distributed in the edge area in a ring shape, and the plurality of fixed ejector pins define a bearing area for bearing wafers;

[0008] Along the radial direction of the fixed ejector pin, the fixed ejector pin comprises an inner layer structure and an outer layer structure which are sleeved together, and the outer layer structure is rotatably connected to the inner layer structure through a rotating connecting piece.

[0009] Optionally, the rotating connection member is a ball disposed between the outer layer structure and the inner layer structure.

[0010] Optionally, a retaining frame is provided between the outer layer structure and the inner layer structure, the ball is arranged in the retaining frame, the inner side wall of the outer layer structure is fixedly connected to the outer side wall of the retaining frame, and the outer side wall of the inner layer structure is fixedly connected to the inner side wall of the retaining frame.

[0011] Optionally, the inner layer structure is a hollow annular structure, and a thread is provided on an inner side wall of the inner layer structure so as to be screwed and fixed together with a protruding column on the supporting plate.

[0012] Optionally, a radial area of ​​the lifting ejector pin is greater than a radial area of ​​the fixed ejector pin.

[0013] Optionally, in the circumferential direction of the carrying plate, the fixed ejector pins and the lifting ejector pins are arranged alternately.

[0014] Optionally, along the axial direction of the fixed ejector pin, the fixed ejector pin includes a first part and a second part, the first part is a cylindrical structure, one end of the cylindrical structure is fixed on the supporting plate, and the second part is a conical structure, and the radial cross-sectional area of ​​the conical structure gradually decreases in the direction away from the first part.

[0015] Optionally, along the axial direction of the fixed ejector, the lifting ejector includes a third part and a fourth part, the third part is a cylindrical structure, one end of the cylindrical structure is fixed on the supporting plate, and the fourth part is a conical structure, and the radial cross-sectional area of ​​the conical structure gradually decreases in the direction away from the third part.

[0016] Optionally, the wafer supporting structure further includes a lifting control structure for controlling a plurality of lifting pins to lift and lower simultaneously.

[0017] The lifting control structure comprises a lifting plate, a plurality of lifting pins are arranged on the lifting plate, and a lifting shaft is arranged on a side of the lifting plate away from the lifting pins.

[0018] An embodiment of the present invention further provides a wafer processing device, comprising the above-mentioned wafer supporting structure and a robotic arm for transporting wafers.

[0019] The beneficial effect of the present invention is that: the wafer supporting structure provided in the embodiment of the present invention includes a fixed ejector pin for defining a supporting area for supporting the wafer, the fixed ejector pin includes a sleeved inner layer structure and an outer layer structure, and the outer layer structure is rotatably connected to the inner layer structure through a rotating connecting piece, so that when the wafer is unloaded, if the wafer is offset and contacts the fixed ejector pin, the outer layer structure will be forced to rotate freely, thereby reducing the friction between the wafer and the wafer, avoiding unloading abnormalities, avoiding damage to the wafer, and improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram showing a wafer supporting structure in an embodiment of the present invention;

[0021] Figure 2 A schematic diagram showing a fixed ejector pin in an embodiment of the present invention;

[0022] Figure 3 A schematic diagram showing a wafer supporting structure in an embodiment of the present invention. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0024] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0026] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0027] refer to Figure 1-Figure 3 , this embodiment provides a wafer supporting structure, including:

[0028] A carrying plate 1 having a carrying area 11 and an edge area 12 located at the periphery of the carrying area 11;

[0029] A plurality of lifting pins 3 are arranged in the bearing area 11 (refer to Figure 1 The area indicated by the dotted circle in the figure);

[0030] A plurality of fixed ejector pins 2 are distributed in the edge area 12 in a ring shape, and the plurality of fixed ejector pins 2 define a carrying area 11 for carrying wafers;

[0031] Along the radial direction of the fixed ejector pin 2 , the fixed ejector pin 2 includes an inner layer structure 22 and an outer layer structure 21 which are sleeved together, and the outer layer structure 21 is rotatably connected to the inner layer structure 22 via a rotating connector.

[0032] In this embodiment, the fixed ejector pin 2 includes an inner layer structure 22 and an outer layer structure 21, and the outer layer structure 21 is rotatably connected to the inner layer structure 22 through a rotating connector. In this way, when unloading the wafer, if the wafer shifts and contacts the fixed ejector pin 2, the outer layer structure 21 will be subjected to force and will rotate freely, thereby reducing the friction between the wafer and the wafer, avoiding unloading abnormalities, avoiding damage to the wafer, and improving product quality.

[0033] In an exemplary embodiment, the rotary connection member is a ball 4 disposed between the outer layer structure 21 and the inner layer structure 22 .

[0034] A plurality of balls 4 are arranged between the outer layer structure 21 and the inner layer structure 22 , and the plurality of balls 4 are distributed around the circumferential direction of the inner layer structure 22 , so that the outer layer structure 21 can rotate around the inner layer structure 22 under the action of the balls 4 .

[0035] In an exemplary embodiment, an annular groove is provided on the inner side wall of the outer layer structure 21 or the inner side wall of the inner layer structure 22, and a plurality of the balls 4 are disposed in the annular groove.

[0036] In an exemplary embodiment, the inner side wall of the annular groove is a curved surface matching the rolling, so as to facilitate the rolling of the ball 4 .

[0037] In an exemplary embodiment, the annular groove is a hemispherical structure, which facilitates the rolling of the ball 4 during the period, while a portion of the ball 4 is exposed in the annular groove to contact the outer wall of the inner layer structure 22. That is, in the radial direction of the ball 4, the radial length of the portion of the ball 4 exposed in the annular groove is less than half the diameter of the ball 4.

[0038] The annular groove adopts a hemispherical structure, which plays a role in limiting the ball 4 and preventing the ball 4 from escaping from the annular groove.

[0039] In an exemplary embodiment, a plurality of partition walls are arranged in the annular groove along the circumferential direction of the outer wall, and an accommodating space for accommodating the ball 4 is formed between two adjacent partition walls. That is, the arrangement of the partition walls separates the plurality of balls 4 to avoid interference between adjacent balls 4.

[0040] In an exemplary embodiment, in the circumferential direction of the annular groove, the partition wall has two opposite side surfaces, each of which is a curved surface matching the ball 4, and one of the side surfaces is a curved surface concave inwardly toward the other side surface. Preferably, the curved surface is a part of a spherical surface.

[0041] In an exemplary embodiment, at least one circle of the balls 4 is arranged in the axial direction of the fixed ejector pin 2, and at least one annular groove is correspondingly arranged on the inner layer structure 22 or the outer layer structure 21 to accommodate the rolling.

[0042] In an exemplary embodiment, a first annular groove is provided on the outer wall of the inner layer structure 22 , and a second annular groove is provided on the inner wall of the outer layer structure 21 , and the first annular groove and the second annular groove together form an accommodating groove for accommodating the ball 4 .

[0043] In an exemplary embodiment, there is a gap between the first annular groove and the second annular groove to prevent the friction force generated by the contact between the first annular groove and the second annular groove from affecting the rotational movement of the outer layer structure 21 around the inner layer structure 22.

[0044] In an exemplary embodiment, a plurality of first partition walls are arranged in the first annular groove along the circumferential direction of the first annular groove, and a plurality of second partition walls are arranged in the second annular groove along the circumferential direction of the second annular groove. The positive projection of the first partition wall on the second annular groove coincides with the second partition wall, so that an accommodating space for accommodating the ball 4 is formed between two adjacent first partition walls and two adjacent second partition walls corresponding to the two adjacent first partition walls. The arrangement of the first partition wall and the second partition wall enables each ball 4 to have an independent rolling space, thereby avoiding mutual interference between adjacent balls 4.

[0045] In an exemplary embodiment, in the circumferential direction of the first annular groove, the first partition wall has two first side surfaces arranged opposite to each other, one of the first side surfaces is a curved surface structure concave inward in a direction approaching the other first side surface, and preferably, the curved surface structure is a spherical surface matching the shape of the outer peripheral surface of the ball 4.

[0046] In an exemplary embodiment, in the circumferential direction of the second annular groove, the second partition wall has two second side surfaces arranged opposite to each other, one of the second side surfaces is a curved surface structure concave inward in a direction approaching the other second side surface, and preferably, the curved surface structure is a spherical surface matching the shape of the outer peripheral surface of the ball 4.

[0047] In an exemplary embodiment, the orthographic projection of the first annular groove on the outer structure 21 coincides with the second annular groove.

[0048] In an exemplary embodiment, the first annular groove or the second annular groove is a hemispherical structure, which facilitates the rolling of the ball 4 during the rolling period, while partially exposing the ball 4 to the first annular groove to contact the second annular groove, or partially exposing the ball 4 to the second annular groove to contact the first annular groove, and the first annular groove or the second annular groove is a hemispherical structure, so that in the radial direction of the ball 4, the radial length of the part of the ball 4 exposed in the first annular groove or the second annular groove is less than half of the diameter of the ball 4, thereby limiting the ball 4 and preventing the ball 4 from escaping from the first annular groove or the second annular groove.

[0049] It should be noted that when the first annular groove or the second annular groove is a multi-hemispherical structure, the ball 4 is elastically connected to the first annular groove or the second annular groove. For example, a groove is provided on the inner layer structure 22, and a metal sheet is provided in the groove to form the first annular groove. Alternatively, a groove is provided on the inner side wall of the outer layer structure 21, and a metal sheet is provided in the groove to form the second annular groove.

[0050] In an exemplary embodiment, at least one of the first annular grooves is spaced apart in the axial direction of the inner layer structure 22, and at least one of the second annular grooves is spaced apart in the axial direction of the outer layer structure 21, and at least one of the first annular grooves and at least one of the second annular grooves are arranged in one-to-one correspondence.

[0051] In an exemplary embodiment, a retaining frame is provided between the outer layer structure 21 and the inner layer structure 22, the ball 4 is provided in the retaining frame, the inner wall of the outer layer structure 21 is fixedly connected to the outer wall of the retaining frame, and the outer wall of the inner layer structure 22 is fixedly connected to the inner wall of the retaining frame.

[0052] By adopting the above scheme, the outer layer structure 21, the inner layer structure 22, the ball 4 and the retaining frame constitute a structure similar to a ball 4 bearing, the retaining frame is an annular structure, the inner side wall of the outer layer structure 21 is connected to the outer side surface of the retaining frame, and the outer side wall of the inner layer structure 22 is connected to the inner side wall of the retaining frame.

[0053] In an exemplary embodiment, the inner layer structure 22 is a hollow annular structure, and the inner side wall of the inner layer structure 22 is provided with threads so as to be screwed and fixed together with the protruding columns on the carrier plate 1 .

[0054] The inner side wall of the inner layer structure 22 and the protruding column on the carrier plate 1 are screwed together to realize a detachable connection between the fixed ejector pin 2 and the carrier plate 1 , which is convenient for replacement and maintenance of the fixed ejector pin 2 .

[0055] In an exemplary embodiment, the outer layer structure 21 is in contact with the carrier plate 1 , so that the outer layer structure 21 can rotate around the inner layer structure 22 .

[0056] In an exemplary embodiment, the bottom surface of the inner layer structure 22 is fixed to the carrier plate 1 by bonding or welding.

[0057] In an exemplary embodiment, the radial area of ​​the lifting ejector pin 3 is greater than the radial area of ​​the fixed ejector pin 2 .

[0058] In an exemplary embodiment, in the circumferential direction of the carrier plate 1 , the fixed ejector pins 2 and the lifting ejector pins 3 are arranged alternately.

[0059] A circle of the lifting pins 3 is distributed on the edge of the carrying area 11, and a circle of the fixed pins 2 is arranged on the edge area 12 of the carrying plate 1. The area where the lifting pins 3 are distributed is set as the first annular area, and the area where the fixed pins 2 are distributed is set as the second annular area. The orthographic projection of the fixed pins 2 on the first annular area is located between two adjacent lifting pins 3.

[0060] In an exemplary embodiment, in the circumferential direction of the carrier plate 1 , the projection of the fixed ejector pin 2 on the lifting ejector pin 3 partially covers the corresponding lifting ejector pin 3 .

[0061] A circle of lifting pins 3 is distributed on the edge of the carrying area 11, and a circle of fixed pins 2 is arranged on the edge area 12 of the carrying plate 1. The area where the lifting pins 3 are distributed is set as the first annular area, and the area where the fixed pins 2 are distributed is set as the second annular area. The first annular area and the second annular area partially overlap.

[0062] By adopting the above technical solution, the area of ​​the carrier plate 1 can be reduced.

[0063] In an exemplary embodiment, along the axial direction of the fixed ejector pin 2, the fixed ejector pin 2 includes a first part and a second part, the first part is a cylindrical structure, one end of the cylindrical structure is fixed on the supporting plate 1, and the second part is a conical structure, and the radial cross-sectional area of ​​the conical structure gradually decreases in the direction away from the first part.

[0064] It should be noted that the second portion is formed by extending outward from one end of the outer layer structure 21 away from the supporting plate 1 .

[0065] When performing wafer placement operations, a robot arm needs to be inserted between the lifting pins 3 , and the setting of the conical structure provides a larger space for the robot arm.

[0066] In an exemplary embodiment, along the axial direction of the fixed ejector pin 2, the lifting ejector pin 3 includes a third part and a fourth part, the third part is a cylindrical structure, one end of the cylindrical structure is fixed on the supporting plate 1, and the fourth part is a conical structure, and the radial cross-sectional area of ​​the conical structure gradually decreases in the direction away from the third part.

[0067] It should be noted that the second portion is formed by extending outward from one end of the outer layer structure 21 away from the supporting plate 1 .

[0068] When performing wafer placement operations, a robot arm needs to be inserted between the lifting pins 3 , and the setting of the conical structure provides a larger space for the robot arm.

[0069] In an exemplary embodiment, when the wafer is being taken and placed, when the lifting pin 3 rises to a preset position, the height of the lifting pin 3 is greater than the height of the fixed pin 2, thereby increasing the space for the robot arm to clamp the wafer, which is beneficial for taking and placing the wafer.

[0070] In an exemplary embodiment, the wafer supporting structure further includes a lifting control structure for controlling the simultaneous lifting of the plurality of lifting pins 3 .

[0071] In an exemplary embodiment, the lifting control structure includes a lifting plate, a plurality of lifting pins 3 are arranged on the lifting plate, and a lifting shaft is arranged on a side of the lifting plate away from the lifting pins 3 .

[0072] The arrangement of the lifting plate enables the plurality of lifting pins 3 to rise and fall synchronously, so as to improve the stability of wafer support.

[0073] The lifting shaft is in driving connection with the lifting drive structure to realize the lifting control of the lifting plate, and further realize the lifting control of the plurality of lifting ejectors 3.

[0074] Exemplarily, the lifting drive structure may be a lifting drive motor.

[0075] An embodiment of the present invention further provides a wafer processing device, comprising the above-mentioned wafer supporting structure, detection structure, mechanical arm and control structure.

[0076] Specifically, the wafer carrying structure includes the carrying plate provided with an identification mark, the detection structure is used to detect the position information of the identification mark, the robotic arm is used to pick up the wafer from the carrying plate or place it on the carrying plate, and the control structure is used to control the robotic arm to pick up or place the wafer according to the position information.

[0077] That is to say, the wafer processing device is mainly composed of a wafer carrying structure, a detection structure, a robotic arm and a control structure, wherein the wafer carrying structure may include a carrying plate with an identification mark, and the carrying structure may include a carrying plate with multiple identification marks, such as three, and the identification mark may be a triangle, a quadrilateral, a cross, or other polygons. The detection structure can be used to detect the position information of the identification mark. When the wafer is placed on the carrying plate, the relative position relationship between the wafer and the carrying plate is determined, and the position relationship between the wafer and the identification mark is also determined. By obtaining the position information of the identification mark, the position of the carrying plate or the wafer can be obtained. The robotic arm can be used to pick up the wafer from the carrying plate, or place the wafer into the carrying plate. When the wafer needs to be transferred, the wafer on the carrying plate can be first picked up by the robotic arm, and then the wafer can be transferred to the designated position and then placed, so that the wafer is placed in the designated position. By obtaining the position information of the identification mark, the position of the carrier plate or wafer can be obtained. Therefore, when the carrier plate stops rotating, the control structure can be used to control the robot arm to pick up or place the wafer according to the position information of the identification mark, so that the robot arm can accurately pick up the wafer from the carrier plate, or transfer the wafer from the specified position to the carrier plate.

[0078] According to the wafer processing device of the embodiment of the present invention, the wafer carrying structure includes a carrying plate provided with an identification mark, the detection structure can detect the position information of the identification mark, and the control structure can control the robot arm to pick up or place the wafer according to the position information. The position of the carrying plate can be accurately identified through the identification mark, and then the position of the wafer or the carrying plate can be identified. Then, the control structure controls the robot arm to pick up or place the wafer according to the position information, thereby realizing the picking and placing of the wafer so that the wafer can be transferred, which can complete the loading of the wafer and the unloading of the wafer. During this process, no operator operation is required, which avoids the operator from bumping the edge of the silicon wafer, improves the yield of the silicon wafer, reduces the consumption of human resources, and improves the operation efficiency.

[0079] There are a few points to note:

[0080] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0081] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0082] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0083] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer supporting structure, characterized in that: include: A carrying plate, comprising a carrying area and an edge area located at the periphery of the carrying area; A plurality of lifting pins are arranged in the bearing area in a liftable manner; A plurality of fixed ejector pins are distributed in the edge area in a ring shape, and the plurality of fixed ejector pins define a bearing area for bearing wafers; Along the radial direction of the fixed ejector pin, the fixed ejector pin comprises an inner layer structure and an outer layer structure which are sleeved together, and the outer layer structure is rotatably connected to the inner layer structure through a rotating connecting piece.

2. The wafer supporting structure according to claim 1, characterized in that: The rotating connection member is a ball disposed between the outer layer structure and the inner layer structure.

3. The wafer supporting structure according to claim 2, characterized in that: A retaining frame is arranged between the outer layer structure and the inner layer structure, the balls are arranged in the retaining frame, the inner side wall of the outer layer structure is fixedly connected to the outer side wall of the retaining frame, and the outer side wall of the inner layer structure is fixedly connected to the inner side wall of the retaining frame.

4. The wafer supporting structure according to claim 3, characterized in that: The inner layer structure is a hollow annular structure, and the inner side wall of the inner layer structure is provided with threads so as to be screwed and fixed together with the protruding columns on the carrying plate.

5. The wafer supporting structure according to claim 1, characterized in that: The radial area of ​​the lifting ejector pin is greater than the radial area of ​​the fixed ejector pin.

6. The wafer supporting structure according to claim 1, characterized in that: In the circumferential direction of the carrying plate, the fixed ejector pins and the lifting ejector pins are arranged alternately.

7. The wafer supporting structure according to claim 1, characterized in that: Along the axial direction of the fixed ejector pin, the fixed ejector pin includes a first part and a second part, the first part is a cylindrical structure, one end of the cylindrical structure is fixed on the supporting plate, and the second part is a conical structure, and the radial cross-sectional area of ​​the conical structure gradually decreases in the direction away from the first part.

8. The wafer supporting structure according to claim 1, characterized in that: Along the axial direction of the fixed ejector pin, the lifting ejector pin includes a third part and a fourth part, the third part is a cylindrical structure, one end of the cylindrical structure is fixed on the supporting plate, and the fourth part is a conical structure, and the radial cross-sectional area of ​​the conical structure gradually decreases in the direction away from the third part.

9. The wafer supporting structure according to claim 1, characterized in that: It also includes a lifting control structure for controlling a plurality of lifting ejector pins to lift and lower simultaneously.

10. A wafer processing device, characterized in that: It comprises a robotic arm for transporting wafers and the wafer carrying structure according to any one of claims 1-9.

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