Method of processing substrate

Abstract

A method of processing a substrate is provided. In a method of processing a substrate, a test film having a first region and a second region adjacent to the first region is provided. A first ejection value is obtained from a first test pattern formed by ejecting a chemical solution through a plurality of nozzles onto a first region of a test film. A chemical solution is ejected onto the first substrate based on the first ejection value. A second ejection value is obtained from a second test pattern formed by ejecting the chemical solution through the plurality of nozzles onto a second region of the test film. A chemical solution is ejected onto the second substrate based on the second ejection value.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2023-0096534 filed on July 25, 2023 in the Korean Intellectual Property Office (KIPO), the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates to a substrate processing method, and more particularly to a method of processing a substrate to apply a chemical solution on the substrate. Background Art

[0004] In a display inkjet printer device, a plurality of nozzles may be used to spray a chemical solution onto a display substrate using an inkjet printing method. Depending on the spraying direction of the plurality of nozzles, a spraying error may occur. The spraying error of the plurality of nozzles may be corrected based on a test pattern formed on a test film. In the case where a single test pattern is formed on a single test film, the replacement cycle of the test film may increase, and the production cost of the test film may increase. Summary of the invention

[0005] An object of the present invention is to provide a substrate processing method capable of forming a plurality of test patterns on a single test film to maximize the efficiency of the test film.

[0006] A method for processing a substrate to achieve a purpose according to an aspect of an exemplary embodiment of the present invention includes: providing a test film, the test film including a first area and a second area adjacent to the first area; obtaining a first spraying value from a first test pattern formed by spraying a chemical solution through a plurality of nozzles onto the first area of ​​the test film; based on the first spraying value, spraying the chemical solution onto a first substrate; obtaining a second spraying value from a second test pattern formed by spraying the chemical solution through the plurality of nozzles onto the second area of ​​the test film; and spraying the chemical solution onto a second substrate based on the second spraying value.

[0007] In an exemplary embodiment, the plurality of nozzles include a first group of spray nozzles and a second group of spray nozzles arranged along first and second lines respectively parallel to each other.

[0008] In an exemplary embodiment, the first group of spray nozzles and the second group of spray nozzles spray the chemical solution in a line on each of the first area and the second area, respectively.

[0009] In an exemplary embodiment, each of the first injection value and the second injection value is obtained by an area camera or a line scan camera.

[0010] In an exemplary embodiment, the method also includes: providing a reference test film, the reference test film including a first reference area and a second reference area adjacent to the first reference area; obtaining a first reference injection value and a second reference injection value from a first reference test pattern and a second reference test pattern respectively formed by spraying the chemical solution through the multiple nozzles onto the first reference area and the second reference area of ​​the reference test film; and obtaining a first calibration value by calibrating the second reference injection value based on the first reference injection value.

[0011] In an exemplary embodiment, ejecting the chemical solution onto the second substrate includes ejecting the chemical solution onto the second substrate based on the second ejection value calibrated based on the first calibration value.

[0012] In an exemplary embodiment, the test film and the reference test film are the same single film substrate, and wherein the first and second regions and the first and second reference regions are coplanar with each other.

[0013] In an exemplary embodiment, the first reference area and the second reference area on the reference test film are respectively disposed in areas corresponding to the first area and the second area on the test film.

[0014] In an exemplary embodiment, each of the first reference region and the second reference region has a width in a range of 5 mm to 15 mm.

[0015] In an exemplary embodiment, spraying the chemical solution onto the first substrate includes: calibrating the spray direction of each of the multiple nozzles to spray the chemical solution using the first spray value calibrated based on the first reference spray value; and spraying the chemical solution onto the second substrate includes: calibrating the spray direction of each of the multiple nozzles to spray the chemical solution onto the second substrate using the second spray value calibrated based on the first calibration value.

[0016] In an exemplary embodiment, the reference test film further includes a third reference region adjacent to the second reference region, and the test film further includes a third region adjacent to the second region.

[0017] In an exemplary embodiment, the method further includes: obtaining a third reference injection value from a third reference test pattern formed by injecting the chemical solution through the plurality of nozzles onto the third reference area of ​​the reference test film; and obtaining a second calibration value by calibrating the third reference injection value based on the first reference injection value.

[0018] In an exemplary embodiment, the method further includes: obtaining a third ejection value from a third test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the third area of ​​the test film; and ejecting the chemical solution onto a third substrate using the third ejection value calibrated based on the second calibration value.

[0019] According to another aspect of an exemplary embodiment of the present invention, a method for processing a substrate to achieve a purpose includes: obtaining a first spraying value from a first test pattern formed by spraying a chemical solution through a plurality of nozzles onto a first area of ​​a test film; spraying the chemical solution onto a first substrate by calibrating the spraying directions of the plurality of nozzles based on the first spraying value; obtaining a second spraying value from a second test pattern formed by spraying the chemical solution through the plurality of nozzles onto a second area adjacent to the first area of ​​the test film; and spraying the chemical solution onto a second substrate by calibrating the spraying directions of the plurality of nozzles based on the second spraying value.

[0020] In an exemplary embodiment, the method further includes: obtaining a first reference injection value and a second reference injection value from a first reference test pattern and a second reference test pattern formed by injecting the chemical solution through the multiple nozzles onto a first reference area and a second reference area of ​​a reference test film, respectively; and obtaining a first offset value of the first reference injection value and the second reference injection value.

[0021] In an exemplary embodiment, ejecting the chemical solution onto the second substrate further includes calibrating the ejection directions of the plurality of nozzles based on the second ejection value calibrated based on the first offset value.

[0022] In an exemplary embodiment, the plurality of nozzles include a first group of spray nozzles and a second group of spray nozzles arranged along first and second lines respectively parallel to each other.

[0023] In an exemplary embodiment, the first group of spray nozzles and the second group of spray nozzles spray the chemical solution in a line on the first reference area and the second reference area and on the first area and the second area, respectively.

[0024] In an exemplary embodiment, each of the first region and the second region has a width in a range of 5 mm to 15 mm.

[0025] According to another aspect of an exemplary embodiment of the present invention, a method for processing a substrate to achieve a purpose includes: providing a first test film including a first reference area to a third reference area; obtaining a first reference ejection value, a second reference ejection value, and a third reference ejection value from a first reference test pattern to a third reference test pattern formed by ejecting a chemical solution onto the first reference area to the third reference area of ​​the first test film through a plurality of nozzles, respectively; calibrating the second reference ejection value and the third reference ejection value based on the first reference ejection value to obtain a first calibration value and a second calibration value, respectively; providing a second test film including a first area, a second area, and a third area; obtaining a first ejection value from a first test pattern formed by ejecting the chemical solution onto the first area of ​​the second test film through the plurality of nozzles; The chemical solution is sprayed onto a first substrate by calibrating a spray direction of each of the plurality of nozzles using the first spray value calibrated based on the first reference spray value; a second spray value is obtained from a second test pattern formed by spraying the chemical solution onto the second area of ​​the second test film through the plurality of nozzles; the chemical solution is sprayed onto a second substrate by calibrating a spray direction of each of the plurality of nozzles using the second spray value calibrated based on the first calibration value; a third spray value is obtained from a third test pattern formed by spraying the chemical solution onto the third area of ​​the second test film through the plurality of nozzles; and the chemical solution is sprayed onto a third substrate by calibrating a spray direction of each of the plurality of nozzles using the third spray value calibrated based on the second calibration value.

[0026] In a method for processing a substrate according to an exemplary embodiment, a test film having a first area and a second area adjacent to the first area may be provided. A first spray value may be obtained from a first test pattern formed by spraying a chemical solution through a plurality of nozzles onto the first area of ​​the test film. The first spray value may be used to spray the chemical solution onto the first substrate. A second spray value may be obtained from a second test pattern formed by spraying a chemical solution through a plurality of nozzles onto the second area of ​​the test film. And the second spray value may be used to spray the chemical solution onto the second substrate.

[0027] Therefore, the test film may have different first and second regions. Based on the first ejection value obtained from the chemical solution ejected onto the first region of the test film, the chemical solution may be ejected onto the first substrate. In addition, based on the second ejection value obtained from the chemical solution ejected onto the second region of the test film, the chemical solution may be ejected onto the second substrate. In the process of ejecting the chemical solution onto different first and second substrates, the first ejection value and the second ejection value may be obtained from the first and second regions of the test film, respectively.

[0028] Since the first ejection value and the second ejection value are obtained from the first region and the second region, respectively, the replacement cycle of the test film can be reduced, and the efficiency of the test film can be maximized to reduce the production cost.

[0029] In addition, since the test film is divided into the first area and the second area when used, errors may occur in the first ejection value and the second ejection value obtained from the first area and the second area, respectively. However, in order to minimize the error, the first reference ejection value and the second reference ejection value may be obtained from the first reference area and the second reference area of ​​the reference test film, respectively. By calibrating the second reference ejection value based on the first reference ejection value, the first calibration value may be obtained.

[0030] The amount of the chemical solution sprayed onto the first substrate can be determined based on the first spray value calibrated based on the first reference spray value. The amount of the chemical solution sprayed onto the second substrate can be determined based on the second spray value calibrated based on the first calibration value. Since both the first spray value and the first calibration value are calibrated based on the first reference spray value, errors in the first spray value and the second spray value obtained from different first and second regions, respectively, can be minimized.

[0031] The effects of the present invention are not limited to the above-described effects, and can be expanded in various ways without departing from the spirit and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a diagram illustrating a substrate processing apparatus according to an exemplary embodiment.

[0033] Figure 2 is a diagram showing a method of performing a Figure 1 A perspective view of a chemical solution spraying unit of a substrate processing apparatus is shown in FIG.

[0034] Figure 3 is a flowchart illustrating a method of processing a substrate according to an exemplary embodiment.

[0035] Figure 4 A process of calibrating the second reference injection value and the third reference injection value relative to the first reference injection value to obtain the first calibration value and the second calibration value, respectively, is shown.

[0036] Figure 5 A process is shown for calibrating a first injection value to a third injection value based on a first reference injection value and a first calibration value and a second calibration value.

[0037] Fig. 6A and Figure 6B is a diagram illustrating a process of forming a test pattern by ejecting a chemical solution using a plurality of nozzles. DETAILED DESCRIPTION

[0038] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0039] Regarding the embodiments of the present invention disclosed herein, certain structural and functional descriptions are exemplified only for the purpose of illustrating the embodiments of the present invention, and the embodiments of the present invention may be practiced in various forms and should not be construed as limiting the embodiments described herein.

[0040] The terms used in the present invention are only used to describe specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates otherwise, the singular form of the expression includes the plural form. In this application, the terms "including" or "having" etc. are intended to represent the presence of features, numbers, steps, actions, elements, parts or combinations thereof described herein, and should not be understood as excluding the possibility of the presence or addition of one or more other features, numbers, steps, actions, elements, parts or combinations thereof.

[0041] In each of the accompanying drawings of the present invention, for the sake of clarity of the present invention, the size of the structure is shown in proportion. In the present invention, terms such as first, second, etc. can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the purpose of one element from another element.

[0042] Figure 1 A substrate processing apparatus according to an exemplary embodiment is shown.

[0043] refer to Figure 1 , the substrate processing apparatus 10 may include a chemical solution spraying unit 20, a substrate transfer unit 30, a loading unit 40, an unloading unit 50, a chemical solution supply unit 60, and a main control unit 70. The chemical solution spraying unit 20 and the substrate transfer unit 30 may be disposed adjacent to each other. The chemical solution supply unit 60 and the main control unit 70 may be disposed adjacent to the chemical solution spraying unit 20. The loading unit 40 and the unloading unit 50 may be disposed adjacent to the substrate transfer unit 30.

[0044] The substrate processing apparatus 10 may be used to manufacture a flat panel display (FPD), etc. The substrate processing apparatus 10 may apply a chemical solution on a substrate using an inkjet method. For example, the substrate may include an array substrate of a liquid crystal display (LCD) device, a color filter substrate, etc.

[0045] The chemical solution may include an orienting solution, a liquid crystal, ink, etc. The ink may include a red (R), green (G) or blue (B) ink having pigment particles mixed in a solvent. The orienting solution may be applied to the front surface of the array substrate and the color filter substrate. The orienting solution may include polyimide (PI). The ink may be applied to the inner region of the black matrix (BM) in the grid arranged on the color filter substrate.

[0046] The substrate may be loaded into the loading unit 40. The substrate transfer unit 30 may transfer the substrate received from the loading unit 40 to the chemical solution spraying unit 20. The chemical solution spraying unit 20 may receive the chemical solution from the chemical solution supply unit 60, and may spray the chemical solution onto the substrate using an inkjet method. When the spraying of the chemical solution is completed, the substrate transfer unit 30 may transfer the substrate from the chemical solution spraying unit 20 to the unloading unit 50. The substrate may be unloaded from the unloading unit 50. The main control unit 70 may control the operation of the chemical solution spraying unit 20, the substrate transfer unit 30, the loading unit 40, the unloading unit 50, and the chemical solution supply unit 60. The main control unit 70 may include a processor and a storage device capable of executing a computer program of the relevant logic implementing the substrate processing method described herein.

[0047] Next, the chemical solution spraying unit 20 will be described.

[0048] Figure 2 is a diagram showing a method of performing a Figure 1 A perspective view of a chemical solution spraying unit of a substrate processing apparatus is shown.

[0049] Reference Figure 1 and Figure 2 , the chemical solution spraying unit 20 may include a base plate 100 , a substrate support 200 , a head assembly 300 , a nozzle cleaner 400 , and a scanner 500 .

[0050] The substrate support 200 may be disposed on a top surface of the base plate 100. The base plate 100 may have a hexahedral plate shape.

[0051] The substrate support 200 may include a substrate stage 210 on which a substrate S is placed. The substrate stage 210 may have a receiving surface for placing the substrate S. A stage rotator 220 may be provided at a lower portion of the substrate stage 210. The stage rotator 220 may include a rotary motor. The stage rotator 220 may rotate the substrate stage 210 around a vertical axis. When the substrate stage 210 is rotated by the stage rotator 220, the substrate S may rotate in the same direction as the substrate stage 210.

[0052] The substrate S may include a display substrate, a film substrate, or a test film. The test film may have the same shape as the actual substrate. The top surface of the test film may have the same material as the top surface of the real substrate. For example, the top surface of the test film may be chemically treated to have the same material as the actual substrate.

[0053] The substrate stage 210 and the stage rotator 220 may be moved in a first horizontal direction (X direction) by a stage actuator 230. The stage actuator 230 may include a slider 232 and a guide 234. The stage rotator 220 may be disposed on top of the slider 232. The guide 234 may extend in the first horizontal direction (X direction) along the top surface of the base plate 100. The slider 232 may include a linear motor and may be moved in the first horizontal direction (X direction) along the guide 234 via the linear motor.

[0054] In this document, the direction in which the guide member 234 extends will be referred to as the first horizontal direction (X direction), the horizontal direction orthogonal to the first horizontal direction will be referred to as the second horizontal direction (Y direction), and the direction orthogonal to the first horizontal direction and the second horizontal direction will be referred to as the vertical direction (Z direction).

[0055] The head assembly 300 may include at least one inkjet head 310 and a head driver for moving the inkjet head 310. The head driver may include a stage 320. The stage 320 may be arranged along a path along which the substrate stage 210 travels. The stage 320 may be spaced apart upward from the top surface of the base plate 100. The stage 320 may be configured to have a longitudinal direction parallel to the second horizontal direction (Y direction).

[0056] The head actuator may include a second horizontal actuator 340 and a vertical actuator 350. The inkjet head 310 may be mounted on the stage 320 by the second horizontal actuator 340 and the vertical actuator 350. The inkjet head 310 may be moved in a second horizontal direction (Y direction) which is a length direction of the stage 320 by the second horizontal actuator 340, and in a vertical direction (Z direction) by the vertical actuator 350.

[0057] The head actuator may further include a first horizontal actuator 330. The stage 320 may be moved in a first horizontal direction (X direction) by the first horizontal actuator 330. The inkjet head 310 may be moved in a first horizontal direction (X direction), a second horizontal direction (Y direction), and a vertical direction (Z direction) by the stage 320, the first horizontal actuator 330, the second horizontal actuator 340, and the vertical actuator 350.

[0058] The inkjet head 310 may include a plurality of nozzles 312 for spraying a chemical solution onto a substrate S. For example, the inkjet head 310 may have three inkjet heads. The three inkjet heads 310a, 310b, and 310c may be arranged in a row along a second horizontal direction (Y direction). Each of the inkjet heads 310a, 310b, and 310c may have a piezoelectric element. The piezoelectric element may independently adjust when to spray and how much to spray. The second horizontal actuator 340 and the vertical actuator 350 may be arranged to correspond to each of the inkjet heads 310a, 310b, and 310c. The second horizontal actuator 340 and the vertical actuator 350 may move each of the inkjet heads 310a, 310b, and 310c, respectively.

[0059] The nozzle cleaner 400 may clean the inkjet head 310. The nozzle cleaner 400 may provide negative pressure to the plurality of nozzles of the inkjet head 310 and may remove any residual chemical solution at the ejection ends of the plurality of nozzles. For example, the nozzle cleaner 400 may include a suction nozzle.

[0060] The scanner 500 may scan an impingement point of the chemical solution ejected from the inkjet head 310 onto the test film. The scanner 500 may include a camera 510 , a camera actuator 520 , and a controller 530 .

[0061] The controller 530 may control the head assembly 300 so that a test pattern is formed on the upper surface of the test film for performing a test of the impact point of the chemical solution. The test pattern may include points of the chemical solution. The controller 530 may include a processor and a memory device capable of executing a computer program to execute the control logic described herein.

[0062] The test pattern may be a pattern indicating chemical solution application characteristics of the head assembly 300. For example, the test pattern may be a pattern having dots arranged in a travel path of the inkjet head 310 during a process of applying a chemical solution onto a test film.

[0063] The camera 510 may capture an image having a test pattern formed on the test film by the head assembly 300. The camera 510 may include an area camera or a line scan camera. The camera 510 may be moved on the stage 320 along a second horizontal direction (Y direction) by a camera actuator 520.

[0064] The camera actuator 520 may include a first actuator for moving the camera 510 in the second horizontal direction (Y direction), and a second actuator for moving the camera 510 in the vertical direction (Z direction). The camera 510 may be configured to move in the second horizontal direction (Y direction) and in the vertical direction (Z direction) on the stage 320 by the first actuator and the second actuator. Alternatively, the camera actuator 520 may move the camera 510 independently of the inkjet head 310.

[0065] The controller 530 may obtain the position coordinates of the points including the test pattern from the image captured by the camera 510. The controller 530 may compare the position coordinates with the preset reference coordinates. The controller 530 may compensate the injection position of the chemical solution by comparing the position coordinates with the preset reference coordinates. That is, if the controller 530 compares the position coordinates with the preset reference coordinates and a difference occurs, the controller 530 may determine that the impact point of the chemical solution is abnormal, and may calculate the correction amount of the injection position of the chemical solution based on the difference.

[0066] Hereinafter, a substrate processing method using the substrate processing apparatus will be described.

[0067] Figure 3 is a flowchart illustrating a substrate processing method according to an exemplary embodiment. Figure 4 is a diagram illustrating a process of obtaining a first calibration value and a second calibration value by calibrating the second reference injection value and the third reference injection value, respectively, based on the first reference injection value.

[0068] The substrate processing method according to the exemplary embodiment may be implemented as a computer program reflecting the substrate processing logic described herein. The substrate processing method may be performed by a processor of the main control unit 70 executing the computer program.

[0069] Reference Figure 3 and Figure 4 , a first test film TS1 having a first reference area RA1, a second reference area RA2, and a third reference area RA3 may be provided (S110).

[0070] In an exemplary embodiment, the substrate processing method may be to use an inkjet printing device to spray a chemical solution onto a substrate. The inkjet printing device may spray a chemical solution onto a substrate through a plurality of nozzles. For example, the substrate may include a display substrate or a film substrate.

[0071] The first test film (reference test film) TS1 may be a substrate for testing the reliability of an inkjet printing device. The inkjet printing device may spray a chemical solution onto the first test film TS1 through a plurality of nozzles. The spray direction of each of the plurality of nozzles may be determined by the chemical solution sprayed onto the first test film TS1. During a repeated process, the spray direction of each of the plurality of nozzles may vary.

[0072] The first test film TS1 may have a plurality of separated reference areas. The first test film TS1 may have a first reference area RA1 and a second reference area RA2 adjacent to each other. The first test film TS1 may also have a third reference area RA3 adjacent to the second reference area RA2.

[0073] The substrate processing method may perform a plurality of tests by dividing the first test film TS1 into a plurality of reference areas. The substrate processing method may spray a chemical solution onto the first reference area RA1, the second reference area RA2, and the third reference area RA3 of the first test film TS1 to determine an impact point. The impact point may be used to calibrate the spray direction of each of the plurality of nozzles.

[0074] Since the substrate processing method performs a test by dividing the first test film TS1 into a plurality of reference areas, the efficiency of the first test film TS1 may be maximized, thereby reducing production costs. For example, the first test film TS1 may include a nozzle jet inspection film (NJI film).

[0075] Each of the first reference area RA1, the second reference area RA2, and the third reference area RA3 may have a first width W1. The first width W1 may be a minimum width at which the first test film TS1 may be divided into a plurality of reference areas to perform a test. The first width W1 of each of the first reference area RA1, the second reference area RA2, and the third reference area RA3 may be in the range of 5 mm to 15 mm.

[0076] Subsequently, a first reference ejection value (or reference discharge value) RDV1, a second reference ejection value RDV2, and a third reference ejection value RDV3 may be respectively obtained from a first reference test pattern RTP1, a second reference test pattern RTP2, and a third reference test pattern RTP3 formed by ejecting a chemical solution onto the first reference area RA1, the second reference area RA2, and the third reference area RA3 of the first test film TS1 through a plurality of nozzles (S120).

[0077] In an exemplary embodiment, the chemical solution may be sprayed onto the first reference area RA1, the second reference area RA2, and the third reference area RA3 of the first test film TS1 to respectively form the first reference test pattern RTP1, the second reference test pattern RTP2, and the third reference test pattern RTP3. The first reference test pattern RTP1, the second reference test pattern RTP2, and the third reference test pattern RTP3 may have impact points of the chemical solution sprayed through a plurality of nozzles.

[0078] The first reference test pattern RTP1 may be a test pattern referenced in order to keep the ejection direction of each of the plurality of nozzles constant during a repetitive process. As will be described later, the first reference test pattern RTP1 may be a reference for the first test pattern TP1, the second test pattern TP2, and the third test pattern TP3 for ejecting a chemical solution onto the second test film TS2 on the first substrate and the second substrate.

[0079] By calculating the coordinates from the impact point of each of the first reference test pattern RTP1, the second reference test pattern RTP2, and the third reference test pattern RTP3, the first reference ejection value RDV1, the second reference ejection value RDV2, and the third reference ejection value RDV3 may be obtained. The first reference ejection value RDV1, the second reference ejection value RDV2, and the third reference ejection value RDV3 may have errors caused by differences in the positions, environments, etc. of the first reference area RA1, the second reference area RA2, and the third reference area RA3. As will be described later, the first reference ejection value RDV1, the second reference ejection value RDV2, and the third reference ejection value RDV3 may be reference coordinate values ​​for compensating for the above-mentioned errors caused by the repeated printing process.

[0080] Each of the first reference test pattern RTP1, the second reference test pattern RTP2, and the third reference test pattern RTP3 may be scanned by an area camera or a line scan camera. The first reference test pattern RTP1, the second reference test pattern RTP2, and the third reference test pattern RTP3 may be acquired by scanning the first reference area RA1, the second reference area RA2, and the third reference area RA3 as a whole, respectively, via an area camera. The first reference test pattern RTP1, the second reference test pattern RTP2, and the third reference test pattern RTP3 may be acquired by a line scan camera that moves over the first reference area RA1, the second reference area RA2, and the third reference area RA3.

[0081] For example, between the processes of ejecting the chemical solution onto the first reference area RA1, the second reference area RA2, and the third reference area RA3 of the first test film TS1, the printing process for different plurality of display substrates may be performed.

[0082] Then, by calibrating the second reference injection value RDV2 and the third reference injection value RDV3 , respectively, based on the first reference injection value RDV1 , the first calibration value OV1 and the second calibration value OV2 may be obtained ( S130 ).

[0083] In an exemplary embodiment, by calibrating the second reference injection value RDV2 based on the first reference injection value RDV1, a first calibration value (first offset value) OV1 may be obtained. The first calibration value OV1 may be a difference between the first reference injection value RDV1 and the second reference injection value RDV2. The first calibration value OV1 may be an offset value between the first reference injection value RDV1 and the second reference injection value RDV2. The first calibration value OV1 may be an offset value that compensates for an error between the first reference injection value RDV1 obtained from the first reference area RA1 and the second reference injection value RDV2 obtained from the second reference area RA2.

[0084] By calibrating the third reference injection value RDV3 based on the first reference injection value RDV1, a second calibration value (second offset value) OV2 may be obtained. The second calibration value OV2 may be a difference between the first reference injection value RDV1 and the third reference injection value RDV3. The second calibration value OV2 may be an offset value between the first reference injection value RDV1 and the third reference injection value RDV3. The second calibration value OV2 may be an offset value that compensates for an error between the first reference injection value RDV1 obtained from the first reference area RA1 and the third reference injection value RDV3 obtained from the third reference area RA3.

[0085] Figure 5 is a diagram illustrating a process of calibrating a first injection value to a third injection value based on a first reference injection value and a first calibration value and a second calibration value.

[0086] Reference now Figures 3 to 5 , a second test film TS2 having a first area A1, a second area A2, and a third area A3 may be provided (S210).

[0087] In an exemplary embodiment, the spray direction of each of the plurality of nozzles may be verified by spraying a chemical solution onto the second test film TS2. The spray direction of each of the plurality of nozzles may be varied in a process of repeating the process.

[0088] The second test film TS2 may have a plurality of segmented regions. The second test film TS2 may have a first region A1 and a second region A2 adjacent to each other. The first test film TS1 may further have a third region A3 adjacent to the second region A2.

[0089] The first area A1, the second area A2, and the third area A3 of the second test film TS2 may be areas corresponding to the first reference area RA1, the second reference area RA2, and the third reference area RA3 of the first test film TS1, respectively. The first test film TS1 and the second test film TS2 may be the same type of substrate for testing the reliability of the inkjet printing device.

[0090] In contrast, the second test film TS2 may be a single film substrate identical to the first test film TS1. In this case, the first and second regions A1 and A2 of the second test film TS2 may be in the same plane as the first and second reference regions RA1 and RA2 of the first test film TS1.

[0091] The test film and the reference test film are the same single film substrate, and the first and second regions and the first and second reference regions RA1 and RA2 may be coplanar with each other.

[0092] The substrate processing method may include dividing the second test film TS2 into a plurality of regions to perform a plurality of tests. The substrate processing method may determine an impact point by spraying a chemical solution onto the first region A1, the second region A2, and the third region A3 of the second test film TS2. The impact point may be used to calibrate the spray direction of each of the plurality of nozzles.

[0093] Since the substrate processing method divides the second test film TS2 into a plurality of regions to perform a test, the efficiency of the second test film TS2 can be maximized, thereby reducing production costs. For example, the second test film TS2 may include a nozzle jet inspection film (NJI film).

[0094] Each of the first area A1, the second area A2, and the third area A3 may have a second width W2. The second width W2 may be a minimum width that allows the second test film TS2 to be divided into a plurality of areas to perform a test. The second width W2 of each of the first area A1, the second area A2, and the third area A3 may be in the range of 5 mm to 15 mm.

[0095] Subsequently, a first ejection value DV1 may be obtained from a first test pattern TP1 formed by ejecting a chemical solution onto the first area A1 of the second test film TS2 through a plurality of nozzles (S220), and the chemical solution may be ejected onto the first substrate by calibrating an ejection direction of each of the plurality of nozzles based on the first ejection value DV1 (S230).

[0096] In an exemplary embodiment, the first test pattern TP1 may be formed by spraying a chemical solution onto the first area A1 of the second test film TS2. The first test pattern TP1 may have impact points of the chemical solution sprayed through a plurality of nozzles.

[0097] The first test pattern TP1 may be scanned by an area camera or a line scan camera. By calculating coordinates from an impact point of the first test pattern TP1, a first ejection value DV1 may be obtained. The first test pattern TP1 may be a test pattern corresponding to the first reference test pattern RTP1.

[0098] In an exemplary embodiment, the first substrate may include a display substrate or a film substrate. Since the substrate processing method sprays the chemical solution onto the first substrate based on the first spray value DV1, the spray angles of the plurality of nozzles may be maintained constant.

[0099] The first injection value DV1 may be calibrated based on the first reference injection value RDV1. The first injection value DV1 may have a reference injection coordinate RDC calibrated based on the first reference injection value RDV1.

[0100] Alternatively, since the first reference area RA1 of the first test film TS1 and the first area A1 of the second test film TS2 correspond to each other, the first ejection value DV1 may have the same pattern as the first reference ejection value RDV1. Since the first ejection value DV1 has the same pattern as the first reference ejection value RDV1, the first ejection value DV1 may be used to eject the chemical solution onto the first substrate without calibration.

[0101] Next, a second ejection value DV2 may be obtained from the second test pattern TP2 formed by ejecting a chemical solution onto the second area A2 of the second test film TS2 through a plurality of nozzles ( S240 ).

[0102] In an exemplary embodiment, the second test pattern TP2 may be formed by spraying a chemical solution onto the second area A2 of the second test film TS2. The second test pattern TP2 may have impact points of the chemical solution sprayed through a plurality of nozzles.

[0103] The second test pattern TP2 may be scanned by an area camera or a line scan camera. By calculating coordinates from the impact point of the second test pattern TP2, the second ejection value DV2 may be obtained. The second test pattern TP2 may be a test pattern corresponding to the second reference test pattern RTP2.

[0104] In an exemplary embodiment, the second substrate may include a display substrate or a film substrate.The first substrate and the second substrate may include the same type of display substrate.

[0105] Subsequently, the chemical solution may be ejected onto the second substrate by calibrating the ejection direction of each of the plurality of nozzles using the second ejection value DV2 calibrated based on the first calibration value OV1 ( S250 ).

[0106] In an exemplary embodiment, the second injection value DV2 may be calibrated based on the first calibration value OV1. Since the second injection value DV2 is obtained from the second test pattern TP2 corresponding to the second reference test pattern RTP2 of the second reference injection value RDV2, the second injection value DV2 may correspond to the second reference injection value RDV2.

[0107] Since the first calibration value OV1 is obtained by calibrating the second reference injection value RDV2 based on the first reference injection value RDV1, the second injection value DV2 can be calibrated based on the first reference injection value RDV1. Therefore, the second injection value DV2 can have the same reference injection coordinate RDC as the first injection value DV1 because it is calibrated based on the first reference injection value RDV1.

[0108] Since the first ejection value DV1 and the second ejection value DV2 have the same reference ejection coordinate RDC, the error of the ejection angles of the plurality of nozzles between the first area A1 and the second area A2 of the second test film TS2 can be minimized. According to the substrate processing method, the chemical solution is ejected onto the second substrate based on the reference ejection coordinate RDC, so that the ejection angles of the plurality of nozzles can be kept constant.

[0109] Subsequently, a third ejection value DV3 (S260) can be obtained from a third test pattern TP3 formed by ejecting a chemical solution onto a third area A3 of a second test film TS2 through a plurality of nozzles, and the ejection direction of each of the plurality of nozzles can be calibrated using the third ejection value DV3 calibrated based on the second calibration value OV2 to eject the chemical solution onto a third substrate (S270).

[0110] In an exemplary embodiment, the third test pattern TP3 may be formed by spraying a chemical solution onto the third area A3 of the second test film TS2. The third test pattern TP3 may be scanned by an area camera or a line scan camera. By calculating coordinates from the impact point of the third test pattern TP3, a third spray value DV3 may be obtained.

[0111] In an exemplary embodiment, the third substrate may include a display substrate or a film substrate.The first to third substrates may include display substrates of the same type as each other.

[0112] In an exemplary embodiment, the third injection value DV3 may be calibrated based on the second calibration value OV2. Since the third injection value DV3 is obtained from the third test pattern TP3 of the third reference test pattern RTP3 corresponding to the third reference injection value RDV3, the third injection value DV3 may correspond to the third reference injection value RDV3.

[0113] Since the second calibration value OV2 is obtained by calibrating the third reference injection value RDV3 based on the first reference injection value RDV1, the third injection value DV3 can be calibrated based on the first reference injection value RDV1. Therefore, the third injection value DV3 can have the same reference injection coordinate RDC as the first injection value DV1 and the second injection value DV2 because the third injection value DV3 is calibrated based on the first reference injection value RDV1.

[0114] Since the first ejection value DV1, the second ejection value DV2, and the third ejection value DV3 have the same reference ejection coordinate RDC, errors in ejection angles of the plurality of nozzles between the first area A1, the second area A2, and the third area A3 of the second test film TS2 can be minimized. Therefore, in a process using the second test film TS2 divided into the first area A1, the second area A2, and the third area A3, the reference ejection coordinate RDC can be used to minimize errors in impact points of chemical solutions ejected from the plurality of nozzles.

[0115] Fig. 6A and Figure 6B A process of forming a test pattern by spraying a chemical solution using a plurality of nozzles is shown.

[0116] Reference Fig. 6A and Figure 6B , the plurality of nozzles may include first to fourth groups of spray nozzles arranged along first to fourth rows, respectively, parallel to each other.

[0117] In an exemplary embodiment, each of the first to fourth groups of injection nozzles may include a plurality of injection nozzles. Fig. 6A As shown, the first to fourth groups of spray nozzles may spray the chemical solution to form a first group of impact points P1 , a second group of impact points P2 , a third group of impact points P3 , and a fourth group of impact points P4 , respectively.

[0118] For example, the first group of impact points P1, the second group of impact points P2, the third group of impact points P3, and the fourth group of impact points P4 may be formed on four separate lines parallel to each other along the first horizontal direction (X direction). Each of the first group of impact points P1, the second group of impact points P2, the third group of impact points P3, and the fourth group of impact points P4 may be arranged to be staggered with each other in a second horizontal direction (Y direction) orthogonal to the first horizontal direction (X direction). Therefore, the first group of impact points P1, the second group of impact points P2, the third group of impact points P3, and the fourth group of impact points P4 may not be on the same line in the second horizontal direction (Y direction), that is, they may not overlap with each other in the second horizontal direction (Y direction).

[0119] like Figure 6BAs shown, the first to fourth groups of spray nozzles may spray the chemical solution onto the first and second reference areas RA1 and RA2 and the first and second areas A1 and A2, respectively.

[0120] For example, the first jet nozzle may form a first group of impact points P1 along the first line L1, and then the second jet nozzle may form a second group of impact points P2 along the first line L1. Since the first group of impact points P1 and the second group of impact points P2 are arranged alternately with each other in the second horizontal direction (Y direction), the first group of impact points P1 and the second group of impact points P2 may not overlap with each other on the first line L1.

[0121] Subsequently, the third jet nozzle may form a third group of impact points P3 on the second line L2, and then the fourth jet nozzle may form a fourth group of impact points P4 on the second line L2. Since the third group of impact points P3 and the fourth group of impact points P4 are arranged alternately with each other in the second horizontal direction (Y direction), the third group of impact points P3 and the fourth group of impact points P4 may not overlap with each other on the second line L2.

[0122] Since each of the first to fourth groups of jet nozzles forms an impact point along the same line, the first width W1 of each of the first reference area RA1 and the second reference area RA2 of the first test film TS1 can be reduced, and the second width W2 of each of the first area A1 and the second area A2 of the second test film TS2 can also be reduced. As the first width W1 and the second width W2 are reduced, the space utilization of the first test film TS1 and the second test film TS2 can be increased.

[0123] As described above, the second test film TS2 may have different first and second areas A1 and A2. The chemical solution may be sprayed onto the first substrate based on the first spray value DV1 obtained from the chemical solution sprayed onto the first area A1 of the second test film TS2. The chemical solution may be sprayed onto the second substrate based on the second spray value DV2 obtained from the chemical solution sprayed onto the second area A2 of the second test film TS2. In the process of spraying the chemical solution onto the different first and second substrates, the first spray value DV1 and the second spray value DV2 may be obtained from the first area A1 and the second area A2 of the second test film TS2, respectively.

[0124] Since the first ejection value DV1 and the second ejection value DV2 are obtained from the first area A1 and the second area A2, respectively, the replacement cycle of the second test film TS2 may be reduced, and the efficiency of the second test film TS2 may be maximized to reduce production costs.

[0125] In addition, since the second test film TS2 is divided into the first area A1 and the second area A2 when used, an error may occur in the first ejection value DV1 and the second ejection value DV2 respectively obtained from the first area A1 and the second area A2. The first reference ejection value RDV1 and the second reference ejection value RDV2 may be respectively obtained from the first reference area RA1 and the second reference area RA2 of the first test film TS1. By calibrating the second reference ejection value RDV2 based on the first reference ejection value RDV1, the first calibration value OV1 may be obtained.

[0126] The amount of the chemical solution ejected onto the first substrate may be determined based on the first ejection value DV1 calibrated based on the first reference ejection value RDV1. The amount of the chemical solution ejected onto the second substrate may be determined based on the second ejection value DV2 calibrated based on the first calibration value OV1. Since both the first ejection value DV1 and the first calibration value OV1 are calibrated based on the first reference ejection value RDV1, errors in the first ejection value DV1 and the second ejection value DV2 obtained from different first and second areas A1 and A2, respectively, may be minimized.

[0127] Although the above has been described with reference to embodiments of the present invention, it will be appreciated that various modifications and changes may be made to the present invention by those skilled in the art without departing from the spirit and scope of the present invention as set forth in the appended patent claims.

Claims

1. A method for processing a substrate, comprising: providing a test membrane comprising a first region and a second region adjacent to the first region; obtaining a first ejection value from a first test pattern formed by ejecting a chemical solution onto the first area of ​​the test film through a plurality of nozzles; Based on the first spraying value, spraying the chemical solution onto a first substrate; obtaining a second ejection value from a second test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the second area of ​​the test film; as well as The chemical solution is sprayed onto a second substrate based on the second spray value.

2. The method according to claim 1, wherein: The plurality of nozzles include a first group of spray nozzles and a second group of spray nozzles respectively arranged along first and second lines parallel to each other.

3. The method according to claim 2, wherein: The first group of spray nozzles and the second group of spray nozzles spray the chemical solution in a line on each of the first area and the second area, respectively.

4. The method according to claim 1, wherein: Each of the first injection value and the second injection value is obtained by an area camera or a line scan camera.

5. The method according to claim 1, further comprising: providing a reference test film, the reference test film comprising a first reference region and a second reference region adjacent to the first reference region; obtaining a first reference ejection value and a second reference ejection value from a first reference test pattern and a second reference test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the first reference area and the second reference area of ​​the reference test film, respectively; as well as By calibrating the second reference injection value based on the first reference injection value, a first calibration value is obtained.

6. The method according to claim 5, wherein: Spraying the chemical solution onto the second substrate includes spraying the chemical solution onto the second substrate based on the second spraying value calibrated based on the first calibration value.

7. The method according to claim 5, wherein: The test film and the reference test film are the same single film substrate, and wherein the first and second regions and the first and second reference regions are coplanar with each other.

8. The method according to claim 5, wherein: The first reference area and the second reference area on the reference test film are respectively disposed in areas corresponding to the first area and the second area on the test film.

9. The method according to claim 5, wherein: Each of the first reference region and the second reference region has a width in the range of 5 mm to 15 mm.

10. The method according to claim 5, wherein: Spraying the chemical solution onto the first substrate includes: calibrating the spray direction of each of the multiple nozzles to spray the chemical solution using the first spray value calibrated based on the first reference spray value; and spraying the chemical solution onto the second substrate includes: calibrating the spray direction of each of the multiple nozzles to spray the chemical solution onto the second substrate using the second spray value calibrated based on the first calibration value.

11. The method according to claim 5, wherein: The reference test film further includes a third reference region adjacent to the second reference region, and the test film further includes a third region adjacent to the second region.

12. The method according to claim 11, further comprising: obtaining a third reference ejection value from a third reference test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the third reference area of ​​the reference test film; as well as By calibrating the third reference injection value based on the first reference injection value, a second calibration value is obtained.

13. The method according to claim 12, further comprising: obtaining a third ejection value from a third test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the third area of ​​the test film; as well as The chemical solution is ejected onto a third substrate using the third ejection value calibrated based on the second calibration value.

14. A method for processing a substrate, comprising: obtaining a first ejection value from a first test pattern formed by ejecting a chemical solution through a plurality of nozzles onto a first area of ​​a test film; spraying the chemical solution onto a first substrate by calibrating spray directions of the plurality of nozzles based on the first spray value; obtaining a second ejection value from a second test pattern formed by ejecting the chemical solution through the plurality of nozzles onto a second area adjacent to the first area of ​​the test film; as well as The chemical solution is sprayed onto a second substrate by calibrating the spray directions of the plurality of nozzles based on the second spray value.

15. The method according to claim 14, further comprising: obtaining first reference ejection values ​​and second reference ejection values ​​from first reference test patterns and second reference test patterns formed by ejecting the chemical solution through the plurality of nozzles onto first reference regions and second reference regions of a reference test film, respectively; as well as A first offset value of the first reference injection value and the second reference injection value is obtained.

16. The method according to claim 15, wherein: Spraying the chemical solution onto the second substrate further includes calibrating the spraying directions of the plurality of nozzles based on the second spraying value calibrated based on the first offset value.

17. The method according to claim 15, wherein: The plurality of nozzles include a first group of spray nozzles and a second group of spray nozzles respectively arranged along first and second lines parallel to each other.

18. The method according to claim 17, wherein: The first group of spray nozzles and the second group of spray nozzles spray the chemical solution in lines on the first reference area and the second reference area and on the first area and the second area, respectively.

19. The method according to claim 14, wherein: Each of the first region and the second region has a width in the range of 5 mm to 15 mm.

20. A method for processing a substrate, comprising: providing a first test film including first to third reference regions; obtaining a first reference ejection value, a second reference ejection value, and a third reference ejection value from first to third reference test patterns formed by ejecting a chemical solution onto the first to third reference regions of the first test film through a plurality of nozzles, respectively; calibrating the second reference injection value and the third reference injection value based on the first reference injection value to obtain a first calibration value and a second calibration value, respectively; providing a second test membrane comprising a first region, a second region, and a third region; obtaining a first ejection value from a first test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the first area of ​​the second test film; ejecting the chemical solution onto a first substrate by calibrating an ejection direction of each of the plurality of nozzles using the first ejection value calibrated based on the first reference ejection value; obtaining a second ejection value from a second test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the second area of ​​the second test film; ejecting the chemical solution onto a second substrate by calibrating an ejection direction of each of the plurality of nozzles using the second ejection value calibrated based on the first calibration value; obtaining a third ejection value from a third test pattern formed by ejecting the chemical solution through the plurality of nozzles onto the third area of ​​the second test film; as well as The chemical solution is ejected onto a third substrate by calibrating an ejection direction of each of the plurality of nozzles using the third ejection value calibrated based on the second calibration value.

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